JP6319985B2 - 光モジュール及び光モジュール製造方法。 - Google Patents
光モジュール及び光モジュール製造方法。 Download PDFInfo
- Publication number
- JP6319985B2 JP6319985B2 JP2013213744A JP2013213744A JP6319985B2 JP 6319985 B2 JP6319985 B2 JP 6319985B2 JP 2013213744 A JP2013213744 A JP 2013213744A JP 2013213744 A JP2013213744 A JP 2013213744A JP 6319985 B2 JP6319985 B2 JP 6319985B2
- Authority
- JP
- Japan
- Prior art keywords
- grooves
- light
- filter
- dbr
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims description 142
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 description 17
- 230000001902 propagating effect Effects 0.000 description 16
- 239000013307 optical fiber Substances 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 4
- 230000008021 deposition Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
- H10F55/15—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12109—Filter
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12173—Masking
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Optical Filters (AREA)
Description
305 基板
310 光導波路
325 溝
330a−330d 光選択フィルター
335a−335d 発光及び受光素子対
Claims (6)
- 基板の表面に設けられた少なくとも1つの光導波路に、前記基板の表面に対して垂直な面及び傾斜した面から成る複数の溝を形成することと、
複数の異なる波長の光のうちの対応する波長の光をそれぞれが反射する複数の光選択フィルターを、前記複数の溝の前記傾斜した面に対応させて形成することと、
を含み、
前記複数の光選択フィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、複数のDBR(Distributed Bragg Reflector:分布ブラッグ反射)フィルターを前記複数の溝の前記傾斜した面に対応させて形成することであり、
前記複数のDBRフィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、前記複数の溝の各々の大きさに対応する開口が1つ形成されたマスクを用いて、順次、前記マスクの前記開口を前記複数の溝の各々に位置合わせし、前記複数の溝の前記傾斜した面に前記DBRフィルターを蒸着することを含む、光モジュール製造方法。 - 前記光導波路の前記複数の溝に位置合わせして、前記光導波路の上に前記複数の異なる波長の光にそれぞれ対応した複数の発光及び受光素子対を設けることをさらに含む、請求項1に記載の光モジュール製造方法。
- 前記複数の溝を形成することは、前記基板の表面に対して垂直な面及び45度に傾斜した面から成る複数の溝を形成することである、請求項1又は2に記載の光モジュール製造方法。
- 基板の表面に設けられた少なくとも1つの光導波路に、前記基板の表面に対して垂直な面及び傾斜した面から成る複数の溝を形成することと、
複数の異なる波長の光のうちの対応する波長の光をそれぞれが反射する複数の光選択フィルターを、前記複数の溝の前記傾斜した面に対応させて形成することと、
を含み、
前記複数の光選択フィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、複数のDBR(Distributed Bragg Reflector:分布ブラッグ反射)フィルターを前記複数の溝の前記傾斜した面に対応させて形成することであり、
前記複数のDBRフィルターを前記複数の溝の前記傾斜した面に対応させて形成することは、前記複数の溝の各々に対して位置合わせされ大きさが対応する複数の開口が形成された第1マスクと、全ての前記複数の溝をカバーする大きさの開口及びそれぞれ全ての前記複数の溝から溝を1つずつ少なくカバーして1つの溝をカバーするまでの異なる大きさの複数の開口が形成された第2マスクとを用いて、前記第1マスクは前記複数の開口をそれぞれ前記複数の溝に位置合わせして固定し、前記第2マスクは順次前記複数の開口の各々を移動させて前記第1マスクの前記複数の開口の各々に一回ずつ位置合わせし、前記複数の溝の前記傾斜した面に前記DBRフィルターを蒸着することを含む、光モジュール製造方法。 - 前記光導波路の前記複数の溝に位置合わせして、前記光導波路の上に前記複数の異なる波長の光にそれぞれ対応した複数の発光及び受光素子対を設けることをさらに含む、請求項4に記載の光モジュール製造方法。
- 前記複数の溝を形成することは、前記基板の表面に対して垂直な面及び45度に傾斜した面から成る複数の溝を形成することである、請求項4又は5に記載の光モジュール製造方法。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013213744A JP6319985B2 (ja) | 2013-10-11 | 2013-10-11 | 光モジュール及び光モジュール製造方法。 |
| US14/483,596 US9341797B2 (en) | 2013-10-11 | 2014-09-11 | Optical module and method for manufacturing optical module |
| US15/064,072 US9720190B2 (en) | 2013-10-11 | 2016-03-08 | Optical module and method for manufacturing optical module |
| US15/470,978 US9952392B2 (en) | 2013-10-11 | 2017-03-28 | Optical module and method for manufacturing optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013213744A JP6319985B2 (ja) | 2013-10-11 | 2013-10-11 | 光モジュール及び光モジュール製造方法。 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015075734A JP2015075734A (ja) | 2015-04-20 |
| JP6319985B2 true JP6319985B2 (ja) | 2018-05-09 |
Family
ID=52809740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013213744A Active JP6319985B2 (ja) | 2013-10-11 | 2013-10-11 | 光モジュール及び光モジュール製造方法。 |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US9341797B2 (ja) |
| JP (1) | JP6319985B2 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6319985B2 (ja) | 2013-10-11 | 2018-05-09 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 光モジュール及び光モジュール製造方法。 |
| JP5980193B2 (ja) | 2013-11-29 | 2016-08-31 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 光モジュール及び光モジュール製造方法。 |
| US9709746B2 (en) * | 2015-11-17 | 2017-07-18 | International Business Machines Corporation | Micro-filter structures for wavelength division multiplexing in polymer waveguides |
| US10591687B2 (en) | 2017-05-19 | 2020-03-17 | Adolite Inc. | Optical interconnect modules with 3D polymer waveguide |
| US10754070B2 (en) | 2018-12-05 | 2020-08-25 | International Business Machines Corporation | Microlens array assembling process |
| US10690867B1 (en) * | 2019-02-12 | 2020-06-23 | International Business Machines Corporation | Optical device with adhesive connection of recess or side protrusion |
| US11664902B2 (en) * | 2019-08-19 | 2023-05-30 | Nokia Solutions And Networks Oy | Planar assemblies for optical transceivers |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3257260B2 (ja) | 1994-07-26 | 2002-02-18 | 松下電器産業株式会社 | 波長多重発光装置および波長多重伝送システム |
| JPH10335693A (ja) | 1997-05-29 | 1998-12-18 | Matsushita Electric Ind Co Ltd | 波長選択受光素子 |
| JP3881429B2 (ja) | 1997-07-30 | 2007-02-14 | ローム株式会社 | 波長分離型受光素子およびそれを用いる光通信用モジュール |
| JPH11174253A (ja) | 1997-12-10 | 1999-07-02 | Oki Electric Ind Co Ltd | 波長ルータおよびその製造方法 |
| US6475557B1 (en) * | 1998-08-26 | 2002-11-05 | Nippon Telegraph And Telephone Corporation | Method for manufacturing optical filter |
| DE19947889C2 (de) * | 1999-10-05 | 2003-03-06 | Infineon Technologies Ag | Optoelektronisches, bidirektionales Sende- und Empfangsmodul in Leadframe-Technik |
| US6811853B1 (en) * | 2000-03-06 | 2004-11-02 | Shipley Company, L.L.C. | Single mask lithographic process for patterning multiple types of surface features |
| JP2002207181A (ja) * | 2001-01-09 | 2002-07-26 | Minolta Co Ltd | 光スイッチ |
| JP2002289904A (ja) | 2001-03-23 | 2002-10-04 | Sumitomo Electric Ind Ltd | 半導体受光素子とその製造方法 |
| US6939058B2 (en) * | 2002-02-12 | 2005-09-06 | Microalign Technologies, Inc. | Optical module for high-speed bidirectional transceiver |
| JP2004206057A (ja) | 2002-11-01 | 2004-07-22 | Omron Corp | 光合分波器及び光合分波器の製造方法 |
| WO2004051335A1 (de) * | 2002-12-05 | 2004-06-17 | Infineon Technologies Ag | Optische sende- und/oder empfangsanordnung mit einem planaren optischen schaltkreis |
| JP2004294996A (ja) | 2003-03-28 | 2004-10-21 | Japan Aviation Electronics Industry Ltd | 誘電体多層膜フィルタブロック、波長合分波器、及び誘電体多層膜ブロックの製造方法 |
| JP2004309838A (ja) * | 2003-04-08 | 2004-11-04 | Seiko Epson Corp | 波長多重光通信用分波器、波長多重光通信用分波器の製造方法及び電子機器 |
| US7161738B2 (en) * | 2003-08-07 | 2007-01-09 | Agra Vadeko Inc. | Secure document of value and method of manufacturing same |
| JP4831667B2 (ja) * | 2005-12-19 | 2011-12-07 | 独立行政法人産業技術総合研究所 | フィルタ内蔵型光導波路、wdmモジュールおよび光集積回路、並びにその作製方法 |
| KR100889976B1 (ko) | 2006-10-24 | 2009-03-24 | 이형종 | 광 모듈과 이를 이용한 광 센서 및 그 제조방법 |
| JP2008225339A (ja) * | 2007-03-15 | 2008-09-25 | Hitachi Cable Ltd | 光学系接続構造、光学部材及び光伝送モジュール |
| JP2009069360A (ja) * | 2007-09-12 | 2009-04-02 | Fuji Xerox Co Ltd | 光素子実装方法、及び、光素子実装装置 |
| DE112008003936T5 (de) * | 2008-07-14 | 2012-01-26 | Hewlett-Packard Development Co., L.P. | Hybrid-Geführte-Mode-Resonanz-Filter und Verfahren , das verteilte Bragg-Reflexion einsetzt |
| US8335411B2 (en) * | 2008-11-11 | 2012-12-18 | Ultra Communications, Inc. | Fiber optic bi-directional coupling lens |
| JP2010225824A (ja) | 2009-03-24 | 2010-10-07 | Hitachi Ltd | 光モジュール及び波長多重光モジュール |
| CN102483497B (zh) * | 2010-01-06 | 2014-06-04 | 惠普发展公司,有限责任合伙企业 | 光学互连件 |
| GB2478912A (en) * | 2010-03-22 | 2011-09-28 | Colorchip | Optical coupler with reflective surface and cover plate |
| JP5390474B2 (ja) | 2010-06-07 | 2014-01-15 | 日本電信電話株式会社 | 光受信器 |
| JP5694700B2 (ja) | 2010-07-22 | 2015-04-01 | 株式会社神鋼環境ソリューション | 流動層炉及び廃棄物処理方法 |
| US20120032875A1 (en) * | 2010-08-05 | 2012-02-09 | Microvision, Inc. | Scanned Image Projection System Employing Beam Folding Apparatus |
| JP5703922B2 (ja) * | 2011-04-14 | 2015-04-22 | 住友ベークライト株式会社 | 光導波路、光電気混載基板および電子機器 |
| JP6319985B2 (ja) | 2013-10-11 | 2018-05-09 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 光モジュール及び光モジュール製造方法。 |
-
2013
- 2013-10-11 JP JP2013213744A patent/JP6319985B2/ja active Active
-
2014
- 2014-09-11 US US14/483,596 patent/US9341797B2/en active Active
-
2016
- 2016-03-08 US US15/064,072 patent/US9720190B2/en not_active Expired - Fee Related
-
2017
- 2017-03-28 US US15/470,978 patent/US9952392B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015075734A (ja) | 2015-04-20 |
| US20160209608A1 (en) | 2016-07-21 |
| US9341797B2 (en) | 2016-05-17 |
| US20150104129A1 (en) | 2015-04-16 |
| US9952392B2 (en) | 2018-04-24 |
| US9720190B2 (en) | 2017-08-01 |
| US20170199343A1 (en) | 2017-07-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6319985B2 (ja) | 光モジュール及び光モジュール製造方法。 | |
| JP5980193B2 (ja) | 光モジュール及び光モジュール製造方法。 | |
| KR101520143B1 (ko) | 점대점 통신을 위한 광학 엔진 | |
| US9077450B2 (en) | Wavelength division multiplexing with multi-core fiber | |
| US20160187585A1 (en) | Optical fitler subassembly for compact wavelength demultiplexing device | |
| CN104115047B (zh) | 光板 | |
| JP2022500970A (ja) | 単芯双方向光送受信アセンブリ | |
| JP2017090766A (ja) | 波長合分波器及び光モジュール | |
| JP2010191231A (ja) | 光モジュール | |
| US7577328B2 (en) | Optical reflector, optical system and optical multiplexer/demultiplexer device | |
| JP2017116934A (ja) | 波長分割多重デバイス、波長分割多重システム、および波長分割多重デバイスを形成する方法 | |
| CN109212670A (zh) | 一种波分复用器件以及相应的光模块 | |
| JP5983479B2 (ja) | 光素子 | |
| US11474311B1 (en) | Parabolic lens device for use in optical subassembly modules | |
| US6760510B2 (en) | Wavelength multiplex optical communication module | |
| CN117425844A (zh) | 光子中介层,光子布置和制造光子中介层的方法 | |
| CN101309115A (zh) | 一种用于光纤到户的单片集成单纤多向收发器 | |
| CN110989079B (zh) | 一种空气包层su8阵列波导光栅 | |
| JP2005249966A (ja) | 光学部材とその製造方法,光モジュール | |
| WO2024166218A1 (ja) | 光送信モジュール | |
| CN114764166A (zh) | 一种稀疏波分复用、解复用器及收发一体的稀疏波分装置 | |
| JP2014123054A (ja) | 光モジュール | |
| Ura et al. | Cavity-resonator-integrated grating input/output couplers for WDM optical-interconnect system in package | |
| JP2013167845A (ja) | 合分波器及び合分波方法 | |
| JPH10133068A (ja) | 光モジュール |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161004 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170912 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170926 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171215 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180313 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180403 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6319985 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |