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JP6371615B2 - 粘着剤組成物、粘着シート、積層体、画像表示装置及び入出力装置 - Google Patents

粘着剤組成物、粘着シート、積層体、画像表示装置及び入出力装置 Download PDF

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Publication number
JP6371615B2
JP6371615B2 JP2014143540A JP2014143540A JP6371615B2 JP 6371615 B2 JP6371615 B2 JP 6371615B2 JP 2014143540 A JP2014143540 A JP 2014143540A JP 2014143540 A JP2014143540 A JP 2014143540A JP 6371615 B2 JP6371615 B2 JP 6371615B2
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
component
adhesive composition
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014143540A
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English (en)
Japanese (ja)
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JP2016020403A (ja
Inventor
洋平 金塚
洋平 金塚
貴美子 木口
貴美子 木口
政一 清水
政一 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soken Chemical and Engineering Co Ltd
Original Assignee
Soken Chemical and Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soken Chemical and Engineering Co Ltd filed Critical Soken Chemical and Engineering Co Ltd
Priority to JP2014143540A priority Critical patent/JP6371615B2/ja
Priority to PCT/JP2015/065248 priority patent/WO2016006353A1/fr
Priority to CN201580037908.2A priority patent/CN106536661B/zh
Priority to KR1020167033688A priority patent/KR102116598B1/ko
Priority to TW104120483A priority patent/TWI669364B/zh
Publication of JP2016020403A publication Critical patent/JP2016020403A/ja
Application granted granted Critical
Publication of JP6371615B2 publication Critical patent/JP6371615B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/06—Copolymers with styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Electroluminescent Light Sources (AREA)
JP2014143540A 2014-07-11 2014-07-11 粘着剤組成物、粘着シート、積層体、画像表示装置及び入出力装置 Active JP6371615B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014143540A JP6371615B2 (ja) 2014-07-11 2014-07-11 粘着剤組成物、粘着シート、積層体、画像表示装置及び入出力装置
PCT/JP2015/065248 WO2016006353A1 (fr) 2014-07-11 2015-05-27 Composition adhésive, feuille adhésive, corps empilé, dispositif d'affichage d'images et dispositif d'entrée/sortie
CN201580037908.2A CN106536661B (zh) 2014-07-11 2015-05-27 粘合剂组合物、粘合片、叠层体、图像显示装置及输出输入装置
KR1020167033688A KR102116598B1 (ko) 2014-07-11 2015-05-27 점착제 조성물, 점착 시트, 적층체, 화상 표시 장치 및 입출력 장치
TW104120483A TWI669364B (zh) 2014-07-11 2015-06-25 黏著劑組成物、黏著片、積層體、畫像顯示裝置及輸出輸入裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014143540A JP6371615B2 (ja) 2014-07-11 2014-07-11 粘着剤組成物、粘着シート、積層体、画像表示装置及び入出力装置

Publications (2)

Publication Number Publication Date
JP2016020403A JP2016020403A (ja) 2016-02-04
JP6371615B2 true JP6371615B2 (ja) 2018-08-08

Family

ID=55063995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014143540A Active JP6371615B2 (ja) 2014-07-11 2014-07-11 粘着剤組成物、粘着シート、積層体、画像表示装置及び入出力装置

Country Status (5)

Country Link
JP (1) JP6371615B2 (fr)
KR (1) KR102116598B1 (fr)
CN (1) CN106536661B (fr)
TW (1) TWI669364B (fr)
WO (1) WO2016006353A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX363710B (es) * 2013-05-23 2019-03-29 Bostik Inc Adhesivo termofusible basado en homopolimeros de polipropileno de bajo punto de fusion.
JP6722001B2 (ja) * 2016-03-03 2020-07-15 東京応化工業株式会社 接着剤組成物、積層体、及び、積層体の製造方法
WO2017195491A1 (fr) * 2016-05-10 2017-11-16 バンドー化学株式会社 Encre électroconductrice
JP7001000B2 (ja) * 2018-06-15 2022-01-19 王子ホールディングス株式会社 粘着剤層及び積層体
WO2020100870A1 (fr) * 2018-11-12 2020-05-22 日東電工株式会社 Dispositif d'affichage d'image
JP7644569B2 (ja) * 2019-03-26 2025-03-12 積水化学工業株式会社 離型フィルムで保護された粘着テープ
JP7295690B2 (ja) * 2019-04-05 2023-06-21 日東シンコー株式会社 防湿コート用組成物
JP2024025413A (ja) * 2022-08-12 2024-02-26 Dic株式会社 粘着テープ及び電子機器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5692978A (en) * 1979-12-26 1981-07-28 Asahi Chem Ind Co Ltd Hot-melt adhesive composition
JPS56145963A (en) * 1980-04-14 1981-11-13 Asahi Chem Ind Co Ltd Hot-melt adhesive composition
JPH0757868B2 (ja) * 1989-11-16 1995-06-21 カネボウ・エヌエスシー株式会社 ホツトメルト接着剤組成物
US5286781A (en) * 1991-04-18 1994-02-15 Sekisui Chemical Co., Ltd. Pressure sensitive adhesive composition and pressure sensitive adhesive tape or sheet making use of the same
JP3303467B2 (ja) * 1993-09-03 2002-07-22 ジェイエスアール株式会社 熱可塑性エラストマー組成物
JP2001055552A (ja) * 1999-08-20 2001-02-27 Daicel Chem Ind Ltd ポリオレフィン用接着剤組成物
BRPI0720155A2 (pt) * 2006-12-07 2014-02-04 3M Innovative Properties Co Blendas de copolímero de bloco e adevisos acrílicos.
WO2008073669A1 (fr) * 2006-12-07 2008-06-19 3M Innovative Properties Company Adhésifs à mélange de copolymères blocs à agents collants multiples
US20110021102A1 (en) * 2009-03-31 2011-01-27 Kentarou Inoue Hot Melt Adhesive
JP5540219B2 (ja) 2009-09-15 2014-07-02 綜研化学株式会社 粘着剤組成物
JP5469194B2 (ja) * 2011-05-02 2014-04-09 日東電工株式会社 粘着剤、粘着剤層、および粘着シート
KR102128239B1 (ko) * 2012-10-29 2020-06-30 린텍 가부시키가이샤 점착제 조성물 및 점착 시트
CN105051141B (zh) * 2013-02-28 2018-01-30 综研化学株式会社 光学用粘接剂组合物、光学用粘接片、图像显示装置和输入输出装置
CN103540280B (zh) * 2013-09-27 2016-01-20 沈阳建筑大学 一种导热、导电热熔胶及其制备方法

Also Published As

Publication number Publication date
CN106536661A (zh) 2017-03-22
KR20170031089A (ko) 2017-03-20
KR102116598B1 (ko) 2020-05-28
JP2016020403A (ja) 2016-02-04
WO2016006353A1 (fr) 2016-01-14
TW201606021A (zh) 2016-02-16
CN106536661B (zh) 2019-03-26
TWI669364B (zh) 2019-08-21

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