JP6277275B2 - 粘着剤組成物、粘着フィルム及びこれを利用した有機電子装置の製造方法 - Google Patents
粘着剤組成物、粘着フィルム及びこれを利用した有機電子装置の製造方法 Download PDFInfo
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- JP6277275B2 JP6277275B2 JP2016533239A JP2016533239A JP6277275B2 JP 6277275 B2 JP6277275 B2 JP 6277275B2 JP 2016533239 A JP2016533239 A JP 2016533239A JP 2016533239 A JP2016533239 A JP 2016533239A JP 6277275 B2 JP6277275 B2 JP 6277275B2
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Description
ゲル含量(重量%)=B/A×100
マイクロゲル含量(重量%)=C/A×100
封止樹脂としてブチルゴム90g(LANXESS、BUTYL 301)、粘着付与剤として水添DCPD系粘着付与樹脂10g(SU−90、Kolon)、活性エネルギー線重合性化合物としてトリシクロデカンジメタノールジアクリレート15g(M262、Miwon)及びラジカル開始剤として2、2−ジメトキシ−1、2−ジフェニルエタン−1−オン1g(Irgacure 651、Ciba)を投入し、トルエンで固形分が15重量%程度となるように希釈し、コーティング溶液を製造した。
封止樹脂としてブチルゴム60g(LANXESS、BUTYL301)及びポリイソブチレン30g(BASF、B80、25g及びB15、5gずつを含む)を使用したことを除いて、実施例1と同一に粘着フィルムを製造した。
ブチルゴム及び粘着付与樹脂100重量部に対して20重量部の水分吸着剤CaO(Aldrich)を添加したことを除いて、実施例1と同一に粘着フィルムを製造した。
封止樹脂としてポリイソブチレン80g(BASF、B80)を使用し、2−ヒドロキシエチルアクリレート(HEA、Aldrich)を投入し、イソホロンジイソシアネート(IPDI、Aldrich)を追加したことを除いて、実施例1と同一に粘着フィルムを製造した。
活性エネルギー線重合性化合物としてポリブタジエンジメタクリレート(CN301、sartomer)を使用したことを除いて、実施例1と同一に粘着フィルムを製造した。
活性エネルギー線重合性化合物の含量を3gに変更したことを除いて、実施例1と同一に粘着フィルムを製造した。
活性エネルギー線重合性化合物の含量を0gに変更したことを除いて、実施例1と同一に粘着フィルムを製造した。
n−ブチルアクリレート99重量部及び2−ヒドロキシエチルメタクリレート1重量部、分子量(Mw)が約180万のアクリル粘着剤に多官能性エポキシ化合物(trimethylolpropane triglycidylether)、光陽イオン開始剤(triarylsulfonium hexafluoroantimonate)及びガンマ−グリシドキシプロピルトリメトキシシランを配合し、適正濃度に希釈し、コーティング液(粘着剤組成物)を製造した。製造されたコーティング液を一面に離型処理されているPET(polyethyleneterephthalate)フィルムの離型処理された面に塗布及び乾燥し、紫外線を照射して架橋構造を具現させることによって、厚さが約50μmの粘着剤層を製造した。
封止樹脂としてブチルゴムの代わりにポリイソブチレン80g(BASF、B80)に変更し、ヒュームドシリカ(fumed silica)15g(R812、Evonik)を追加したことを除いて、実施例1と同一に粘着フィルムを製造した。
ゲル含量(重量%)=B/A×100
前記でAは、前記粘着剤組成物の質量を示し、Bは、前記粘着剤組成物を60℃でトルエンで24時間浸漬後、200メッシュ(pore size 200μm)の網で濾過させ、前記網を通過しない前記粘着剤組成物の不溶解分の乾燥質量を示す。比較例5の場合、トルエンの代わりに、エチルアセテートを使用する。
マイクロゲル含量(重量%)=C/A×100
前記でAは、前記粘着剤組成物の質量を示し、Cは、前記粘着剤組成物を60℃でトルエンで24時間浸漬後、1次で200メッシュ(pore size 200μm)の網で濾過させ、通過した溶液をさらに2次で1000メッシュ(pore size 5μm)の網で濾過させ、前記網を通過しない前記粘着剤組成物の乾燥質量を示す。比較例5の場合、トルエンの代わりに、エチルアセテートを使用する。
実施例または比較例で使用された樹脂を溶媒に溶解して樹脂組成物を製造した。前記樹脂組成物を厚さ38μmの基材フィルム(離型ポリエステルフィルム、RS−21G、SKC社製)に塗布した。引き続いて、110℃で10分間乾燥し、厚さが100μmのフィルム形状の層を製造した。その後、基材フィルムを剥離し、フィルム形状の層を100°F及び100%の相対湿度に位置させた状態で、前記フィルム形状の層の厚さ方向に対する透湿度を測定した。前記透湿度は、ASTM F1249での規定によって測定した。
(1)実施例及び比較例で製造したフィルムをバリアーフィルム(カバー基板の役目)にラミネーションした後、ガラス基板の間にラミネートし、オートクレーブを利用して50℃5気圧条件で加圧加熱圧着し、試験片を製造した。その後、試験片を85℃及び85%相対湿度の恒温恒湿チャンバで約500時間維持しながら、ガラス基板と粘着剤層の間の界面で浮き上がりや気泡またはヘイズが発生したかを観察した。目視で見たとき、ガラス基板と粘着剤層との界面で浮き上がりや気泡またはヘイズが1つでも発生した場合をX、発生しない場合をOで表示した。
前記で製造した粘着フィルムに対してUV−Vis Spectrometerを利用して550nmでの光透過度を測定し、ヘイズメーターを利用してJIS K7105標準試験方法によってヘイズを測定した。
11 粘着剤層
12 第1フィルム
21 第2フィルム
3 有機電子装置
31 基板
32 有機電子素子
33 粘着剤層または封止層
34 カバー基板
Claims (14)
- 100000〜2000000の重量平均分子量(Mw)を有する封止樹脂を含み、
多官能性の活性エネルギー線重合性化合物を含み、前記多官能性の活性エネルギー線重合性化合物は、前記封止樹脂100重量部に対して5〜30重量部で含まれ、
前記活性エネルギー線重合性化合物は、下記化学式1を満足し、
下記一般式1で表示されるゲル含量が50%以上で、下記一般式2で表示されるマイクロゲル含量が3%以下であり、透湿度が50g/m2・day以下であり、
前記透湿度はASTM F1249の規定により測定されたものである、粘着剤組成物:
[一般式1]
ゲル含量(重量%)=B/A×100
[一般式2]
マイクロゲル含量(重量%)=C/A×100
前記化学式1で、R 1 は、水素または炭素数1〜4のアルキル基であり、nは、2以上の整数であり、Xは、炭素数3〜30の直鎖、分岐鎖または環形アルキル基から誘導された残基を示し、
前記一般式1及び2でAは前記粘着剤組成物の質量を示し、
前記一般式1で、Bは、前記粘着剤組成物を60℃でトルエンで24時間浸漬後、200メッシュ(pore size 200μm)の網で濾過させ、前記網を通過しない粘着剤組成物の不溶解分の乾燥質量を示し、
前記一般式2でCは、前記粘着剤組成物を60℃でトルエンで24時間浸漬後、1次で200メッシュ(pore size 200μm)の網で濾過させ、通過した溶液をさらに2次で1000メッシュ(pore size 5μm)の網で濾過させ、前記網を通過しない粘着剤組成物の不溶解分の乾燥質量を示す。 - 前記一般式1で表示されるゲル含量が50%〜99%である、請求項1に記載の粘着剤組成物。
- フィルム形態に製造された状態で可視光線領域に対して85%以上の光透過度を示す、請求項1に記載の粘着剤組成物。
- フィルム形態に製造された状態で3%以下のヘイズを示す、請求項1に記載の粘着剤組成物。
- 封止樹脂は、ジエン及び1つの炭素−炭素二重結合を含むオレフィン系化合物の共重合体である、請求項1に記載の粘着剤組成物。
- 粘着剤組成物は、粘着付与剤をさらに含む、請求項1に記載の粘着剤組成物。
- 粘着剤組成物は、ラジカル開始剤をさらに含む、請求項1に記載の粘着剤組成物。
- 水分吸着剤を含む、請求項1に記載の粘着剤組成物。
- 請求項1に記載の粘着剤組成物またはその架橋物を含む粘着剤層を含む粘着フィルム。
- 粘着剤層は、請求項1に記載の粘着剤組成物またはその架橋物を含む第1層と、粘着性樹脂または接着性樹脂を含む第2層とを含む、請求項9に記載の粘着フィルム。
- 可視光線領域に対して85%以上の光透過度を示す、請求項9に記載の粘着フィルム。
- 3%以下のヘイズを示す、請求項9に記載の粘着フィルム。
- 基板と;基板上に形成された有機電子素子と;前記有機電子素子を封止する請求項9に記載の粘着フィルムとを含む有機電子装置封止製品。
- 上部に有機電子素子が形成された基板に請求項9に記載の粘着フィルムが前記有機電子素子をカバーするように適用する段階と;前記粘着フィルムを硬化する段階とを含む有機電子装置の製造方法。
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