JP6123555B2 - Two-phase flow cooling device and evaporator for two-phase flow cooling device - Google Patents

Description

  The present invention relates to a two-phase flow cooling device and an evaporator for a two-phase flow cooling device for cooling an electronic device equipped with a semiconductor integrated circuit device such as a server.

  When the semiconductor integrated circuit device mounted inside the electronic device is operated due to the operation of the electronic device such as a server, heat is generated from the semiconductor integrated circuit device. Therefore, the periphery of the semiconductor integrated circuit device is cooled using a cooling device, This prevents heat from being generated inside the semiconductor integrated circuit device.

  FIG. 11 is a schematic configuration diagram of an example of a cooling structure for a conventional electronic device, which includes an evaporator system 50, a cooling piping system 60, and an electronic device 70 to be cooled. The evaporator system 50 includes an evaporation casing 51 that evaporates the working fluid and cools it by heat of vaporization, pipe attachment portions 52 and 53, and a lid (LID: heat conductive lid member) 54. 54 is in thermal contact with the evaporator casing 51 via a TIM (Thermal Interface Material) 55.

  The cooling pipe system 60 includes a steam pipe 61 and a liquid pipe 62, one end of the steam pipe 61 and the liquid pipe 62 is attached to the pipe attachment parts 52 and 53, and the other end is connected to the radiator 65 via the pipe attachment parts 63 and 64. Connected to. A fan 66 is disposed in the vicinity of the radiator 65 to cool the radiator 65 with air. A pump 69 is attached to the middle of the liquid pipe 62 via pipe attachment portions 67 and 68.

  The electronic device 70 to be cooled includes a system board 71 and a circuit board 72 on which the semiconductor integrated circuit device 73 provided thereon is mounted. A stiffener 74 is provided so as to surround the periphery of the semiconductor integrated circuit device 73, and a TIM 75 is used. The lid 54 is brought into thermal contact.

  Heat generated from the semiconductor integrated circuit device 73 is transmitted to the evaporation casing 51 through the lid 54, and the working liquid 76 boils inside the evaporation casing 51, and the vaporization heat causes the heat from the semiconductor integrated circuit device 73. Remove the fever. The vapor of the working fluid 76 that has boiled inside the evaporation casing 51 is sent from the steam pipe 61 to the radiator 65, cooled by the fan, condensed, and returned to the working fluid 76. The hydraulic fluid 76 has a sequence of returning from the liquid pipe 62 to the inside of the evaporation casing 51 by the pump 69.

  As an example of such a two-phase flow cooling device, there has been proposed a device that cools the periphery of the MPU by providing a fin that discharges the heat of the steam on a pipe that discharges the steam from the working fluid (Patent Document). 1). As another example, a cooling device has been proposed in which fins are provided in the chamber inside the evaporation section and in the heat sink to change the gas-liquid two-phase refrigerant into a liquid refrigerant (see Patent Document 2). Both are devices for cooling the periphery of a semiconductor during operation of an electronic device by providing heat dissipation fins inside the evaporator or on the pipeline.

JP 2009-088125 A International publication pamphlet WO 2011/040129

  If any trouble occurs in the two-phase flow cooling device, the function of the device is not performed, and heat is generated inside the semiconductor. As specific examples of malfunctions, when the pump in the cooling device stops and the circulation of the hydraulic fluid stops, when the fan in the cooling device stops and air flow to the radiator stops, power failure occurs in the electronic equipment equipped with the cooling device There may be a case where the operation of the entire cooling device stops.

  In any case, the semiconductor integrated circuit device is set to stop with a delay of several seconds immediately after the occurrence of the malfunction, but the heat generation from the semiconductor integrated circuit device continues even after the stop. At this time, since the supply of the hydraulic fluid is stopped due to the occurrence of a malfunction, the evaporator becomes empty and the cooling function is stopped. As a result, the temperature of the semiconductor integrated circuit device that continues to generate heat rapidly rises to around 150 ° C. in a few seconds, and the semiconductor integrated circuit device may be damaged.

  Accordingly, an object of the two-phase flow cooling device and the two-phase flow cooling device evaporator is to prevent damage to the semiconductor integrated circuit device due to overheating when a failure occurs.

From one aspect to be disclosed, a thermally conductive lid member that is in thermal contact with a semiconductor device, an evaporation housing that is in thermal contact with the thermally conductive lid member, and a vapor that is connected to the evaporation housing A pipe, a liquid pipe, the steam pipe, a radiator connected to the liquid pipe, a fan for blowing air to the radiator, a pump connected to an intermediate portion of the liquid pipe, and the heat of the evaporation housing A heat-deformable heat dissipating fin that expands and contracts by heat provided on the surface opposite to the surface in contact with the conductive lid-like member, and the heat-deformable heat dissipating fin is compressed when it reaches a predetermined temperature or more. A two-phase flow cooling device is provided, which is a heat-deformable heat dissipating fin that changes from an extended state to an extended state.

  Further, from another viewpoint to be disclosed, the housing for evaporation, the tube mounting portion for attaching the steam pipe and the liquid tube to the housing for evaporation, and the heat provided on the top surface of the housing for evaporation are expanded and contracted. A heat-deformable heat dissipating fin, wherein the heat-deformable heat dissipating fin is a heat-deformable heat dissipating fin that changes from a compressed state to an extended state when a predetermined temperature or higher is reached. An evaporator for a flow cooling device is provided.

  According to the two-phase flow cooling device and the two-phase flow cooling device evaporator disclosed herein, it is possible to prevent damage to the semiconductor integrated circuit device due to overheating when a problem occurs.

It is a conceptual diagram which shows the cooling structure using the two-phase flow cooling device of embodiment of this invention. It is explanatory drawing of the shape change of the heat deformable radiation fin in embodiment of this invention. It is explanatory drawing of the operation | movement sequence of a two-phase flow cooling device when a pump stops. It is explanatory drawing of the operation | movement sequence of a two-phase flow cooling device when a fan stops. It is explanatory drawing of the operation | movement sequence of a two-phase flow cooling device when an electronic device stops. It is explanatory drawing of the evaporator used for the two-phase flow cooling device of Example 1 of this invention. It is explanatory drawing of the shape change of the heat deformable radiation fin in Example 1 of this invention. It is explanatory drawing of the two-phase flow cooling device of Example 2 of this invention. It is explanatory drawing of the two-phase flow cooling device of Example 3 of this invention. It is explanatory drawing of the two-phase flow cooling device of Example 4 of this invention. It is a schematic block diagram of an example of the cooling structure of the conventional electronic device.

  Here, with reference to FIG. 1 thru | or FIG. 5, the two-phase flow cooling device of embodiment of this invention is demonstrated. FIG. 1 is a conceptual diagram showing a cooling structure using a two-phase flow cooling device according to an embodiment of the present invention, and includes an evaporator system 10, a cooling piping system 20, and an electronic device 30 to be cooled. The evaporator system 10 includes an evaporation housing 11 that vaporizes the working fluid inside and cools it with the heat of vaporization, pipe attachment portions 12 and 13, and a lid 14 that is a thermally conductive lid member. Further, a heat-deformable radiating fin 40 that changes from a compressed state to an extended state when the temperature reaches a predetermined temperature or more is attached to the top of the evaporation casing 11. The evaporation housing 11 is in thermal contact with the lid 14 via the TIM 15. The evaporator includes an evaporation casing 11, tube attachment portions 12 and 13, and heat-deformable heat radiation fins 40.

  The heat-deformable heat dissipating fin 40 is typically composed of a laminated film of a shape memory alloy and a metal material that has better thermal conductivity than the shape memory alloy. As the shape memory alloy, a material whose shape changes at a temperature several degrees higher than that during normal operation is selected. For example, when the shape is changed at 75 ° C. or higher, TiNi is typically used. . Moreover, as a metal material, Cu, Ag, or a Cu-Ag alloy is typical. Thus, by using a shape memory alloy, the amount of thermal deformation can be increased as compared with the case of using a bimetal. In addition, although the heat-deformable heat radiation fin 40 may be formed only with a shape memory alloy, the heat radiation characteristic is deteriorated as compared with a laminated film with a metal material.

  By heat-molding this laminated film, the heat-deformable radiating fin 40 that changes from a compressed state to an expanded state when the temperature reaches a predetermined temperature or more is formed. The shape of the heat-deformable radiating fin 40 is typically a coil shape or a shape obtained by folding a leaf spring.

  Further, the tip of the heat-deformable heat radiating fin 40 may be fixed to a heat conductive plate-like support member, and when the heat-deformable heat radiating fin 40 is extended, the top plate of the rack that stores the entire cooling structure is used. The cooling effect can be further enhanced by the contact. In this case, it is desirable to provide a stretchable spacer around the heat-deformable heat radiation fin 40 so as not to be excessively compressed by the heat conductive plate-like support member.

  In addition, the pipe attachment portions 12 and 13 are desirably attached to the side surface of the evaporation housing 11, but may be attached to the end portion of the top surface of the evaporation housing 11.

  The cooling piping system 20 includes a steam pipe 21 and a liquid pipe 22 as in the conventional two-phase flow cooling device, and one end of the steam pipe 21 and the liquid pipe 22 is attached to the pipe attachment portions 12 and 13 and the other end is provided. It is connected to the radiator 25 via the pipe attachment portions 23 and 24. A fan 26 is disposed in the vicinity of the radiator 25 to cool the radiator 25 with air. Further, a pump 29 is attached to the middle of the liquid pipe 22 via pipe attachment portions 27 and 28.

  As an example, the electronic device 30 to be cooled includes a system board 31 and a circuit board 32 on which a semiconductor integrated circuit device 33 provided thereon is mounted. A stiffener 34 is provided so as to surround the periphery of the semiconductor integrated circuit device 33 and is brought into thermal contact with the lid 14 by the TIM 35.

  Also in the case of the two-phase flow cooling device of this embodiment, the heat generated from the semiconductor integrated circuit device 33 is transmitted to the evaporation casing 11 via the lid 14, and the working liquid 36 is transferred inside the evaporation casing 11. The heat from the semiconductor integrated circuit device 33 is removed by boiling and the heat of vaporization. The vapor of the working fluid 36 that has boiled inside the evaporation housing 11 is sent from the steam pipe 21 to the radiator 25, cooled by the fan, condensed, and returned to the working fluid 36. The hydraulic fluid 36 has a sequence of returning from the liquid pipe 22 to the inside of the evaporation casing 11 by the pump 29. As the hydraulic fluid 36, an aqueous system or an alcohol system is used.

  However, in the embodiment of the present invention, when the temperature of the evaporation casing 11 rises above a preset temperature, the heat-deformable heat dissipating fins 40 extend to increase heat dissipation efficiency. This will be described with reference to FIGS.

  FIG. 2 is an explanatory view of a shape change of the heat-deformable heat radiation fin 40 in the embodiment of the present invention, FIG. 2 (a) is a sectional view before deformation, and FIG. 2 (b) is a sectional view after deformation. FIG. As shown in FIG. 2A, in the case of a normal operating temperature, the heat-deformable heat radiation fin 40 is in a compressed state.

  However, when a malfunction occurs and the temperature of the evaporation casing 11 rises above the normal operating temperature, the heat-deformable radiating fin 40 extends as shown in FIG. When the heat-deformable heat dissipating fins 40 extend, the contact area with the air increases, and the heat contacts the air in a wider space and releases heat from the semiconductor integrated circuit device 33 to the space around the cooling device. As a result, it is possible to avoid an excessive increase in temperature until the operation of the semiconductor integrated circuit device 33 stops and heat generation stops.

  Next, the operation sequence of the two-phase flow cooling device when a problem occurs will be described. FIG. 3 is an explanatory diagram of an operation sequence of the two-phase flow cooling device when the pump is stopped. When the pump is stopped for some reason, the circulation of the working fluid is stopped, and the semiconductor integrated circuit device is delayed by several seconds. Also automatically stops. However, even if the operation is stopped, the semiconductor integrated circuit device continues to generate heat and rises to 150 ° C. in a few seconds.

  At this time, since the circulation of the working fluid has already stopped, the temperature of the evaporation casing rises from the normal operating temperature. When the temperature rises above the preset temperature, the heat-deformable radiating fin that has been in a compressed state where the material has been selected so that thermal deformation will occur at the preset temperature will detect a temperature above the preset temperature. Within 1 second, it undergoes thermal deformation and expands, starting to release heat to the surrounding space.

  FIG. 4 is an explanatory diagram of an operation sequence of the two-phase flow cooling device when the fan is stopped. When the fan stops for some reason, the temperature of the working fluid rises, and the semiconductor integrated circuit device is delayed by several seconds. Also automatically stops. However, even if the operation stops, the semiconductor integrated circuit device continues to generate heat.

  At this time, since the circulation of the working fluid has already stopped, the temperature of the evaporation casing rises from the normal operating temperature. When the rise in temperature rises above a preset temperature, the heat-deformable heat dissipating fin that has been in a compressed state until then undergoes heat deformation and expands, and starts heat radiation to the surrounding space.

  FIG. 5 is an explanatory diagram of an operation sequence of the two-phase flow cooling device when the electronic device is stopped. When an electronic device such as a server is stopped due to a power failure or the like, the entire cooling device is stopped simultaneously, the pump and the fan are automatically stopped, the circulation of the working fluid is stopped, and the temperature of the working fluid rises. The operation of the semiconductor integrated circuit device is automatically stopped with a delay of several seconds after the cooling device is stopped. However, even if the operation stops, the semiconductor integrated circuit device continues to generate heat.

  At this time, since the circulation of the working fluid has already stopped, the temperature of the evaporation casing rises from the normal operating temperature. When the rise in temperature rises above a preset temperature, the heat-deformable heat dissipating fin that has been in a compressed state until then undergoes heat deformation and expands, and starts heat radiation to the surrounding space.

  As described above, in the embodiment of the present invention, heat generated from the semiconductor integrated circuit device that is continuously generated even after a failure such as a stop of a pump or a fan or a power failure of an electronic device provided with a cooling device is thermally deformed. Heat can be radiated from the heat-radiating fins to the outside of the cooling device. As a result, it is possible to prevent damage such as the semiconductor integrated circuit device rising to a high temperature and being damaged.

  In the two-phase flow cooling system, as shown in the nucleate boiling region of the boiling curve, the highest cooling performance is maintained when the hydraulic fluid is in a boiling state. The gas-liquid two-phase flow cooling method of the embodiment of the present invention uses the heat of vaporization (latent heat) at the time of boiling of the hydraulic fluid, so the cooling capacity is several times higher than the single-phase flow water cooling method using sensible heat. Become.

  Furthermore, the gas-liquid two-phase flow cooling method has an advantage in that heat from a heating element such as a CPU is moved and concentrated heat is dissipated in the vicinity of the outlet in the apparatus in order to prevent temperature rise in the cooling apparatus. In the embodiment of the present invention, the heat-deformable heat dissipating fins on the evaporator serve as heat dissipating points, and the heat dissipating amount at the time of malfunction is larger than that during normal operation.

  In addition, if the heat transport amount of the gas-liquid two-phase flow cooling method is larger than the amount of heat generated from the semiconductor integrated circuit device, if the heat dissipating fins are extended during normal operation, the heat dissipating fins of the two-phase flow cooling method are returned. There is also a risk of reducing the cooling performance. Therefore, by keeping the heat-deformable radiating fins in a compressed state during normal operation, the heat-deformable radiating fins are expanded and contracted when the temperature suddenly rises due to the occurrence of a failure while suppressing the cooling performance of the two-phase flow cooling method. Thus, damage to the semiconductor integrated circuit device can be avoided.

  Next, the two-phase flow cooling apparatus according to the first embodiment of the present invention will be described with reference to FIGS. 6 and 7, but the entire configuration is the same as that of the embodiment shown in FIG. The structure will be mainly described. FIG. 6 is an explanatory diagram of an evaporator used in the two-phase flow cooling device according to the first embodiment of the present invention, FIG. 6 (a) is a schematic cross-sectional view of the evaporator, and FIG. 6 (b) is a radiating fin. It is explanatory drawing of the laminated film for forming.

  As shown in FIG. 6 (a), pipe attachment portions 12 and 13 for attaching a liquid pipe for circulating a working fluid and a steam pipe are provided on the side surface of the evaporation housing 11 made of Cu having a thickness of 40 mm □ × 7 mm. A heat-deformable radiating fin 40 is fixed to the surface. In this case, as shown in FIG. 6B, the heat-deformable radiating fin 40 is made of Ni: Ti = 49-50: 50-51 (atomic%), a shape memory alloy 42 and Cu, and a high thermal conductivity. A laminated film 41 having a thickness of 0.2 mm obtained by laminating the conductive metal 43 is used. The laminated film is cut into thin wires and then wound to form a coil-shaped heat-deformable heat radiation fin 40 having a diameter of 2 mm. The heat-deformable heat radiation fins 40 are arranged in a matrix at a pitch of 1.7 mm. To do. Incidentally, the measured temperature of the semiconductor integrated circuit device during normal operation is 95 ° C., and the measured temperature of the top surface of the evaporation housing 11 is 70 ° C. Therefore, the above composition is set so that thermal deformation occurs at 75 ° C. A ratio NiTi alloy was used.

  The height of the coiled heat-deformable heat dissipating fin 40 is set to be 24 mm in an extended state as will be described later. The heat-deformable radiating fin 40 is fixed to the top surface of the evaporation casing 11 using silver brazing after special heat-resistant Ni plating is applied to the fixing portion.

  FIG. 7 is an explanatory diagram of a change in shape of the heat-deformable heat dissipating fin in Example 1 of the present invention, FIG. 7A is a cross-sectional view before deformation, and FIG. 7B is a cross-sectional view after deformation. Here, an example in which the two-phase flow cooling device of the present application is applied to a rack mount server will be described. The height of the top plate 44 of the rack is 44 mm, the height of the evaporator is 7 mm, and the height of the electronic device including the semiconductor integrated circuit device and the lid is 3 mm. Since the value obtained by subtracting the height of the evaporator and the electronic device from the height of the top plate 44 is 34 mm, it is possible to secure a space when the heat-deformable heat radiating fin 40 is extended.

  As shown to Fig.7 (a), in the case of 70 degreeC of normal operating temperature, the heat deformable radiation fin 40 is in a compression state. However, when a malfunction occurs and the pump or fan stops, the operation of the semiconductor integrated circuit device stops, but the temperature rises to 150 ° C. in a few seconds, and the temperature of the evaporation housing 11 also rises to 75 ° C. or more. At this time, as shown in FIG. 7B, the heat-deformable heat radiating fin 40 extends within one second after sensing a temperature of 75 ° C. or higher.

  As described above, in the first embodiment of the present invention, the contact area with the air is increased, and the heat is emitted from the semiconductor integrated circuit device 33 to the space around the cooling device in contact with the air in a wider space. As a result, it is possible to avoid an excessive increase in temperature until the operation of the semiconductor integrated circuit device 33 stops and heat generation stops.

  Next, with reference to FIG. 8, the two-phase flow cooling device according to the second embodiment of the present invention will be described. Here, the configuration in the vicinity of the evaporator will be mainly described. FIG. 8 is an explanatory diagram of the two-phase flow cooling device according to the second embodiment of the present invention. FIG. 8 (a) is a cross-sectional view before deformation, and FIG. 8 (b) is a cross-sectional view after deformation.

  As shown in FIG. 8A, a heat conductive plate made of Cu is attached to the other end of the heat-deformable heat radiating fin 40 fixed to the evaporation casing 11 used in the two-phase flow cooling device according to the second embodiment of the present invention. The support body 45 is fixed, and a spacer 46 made of a laminated film of, for example, a shape memory alloy and a highly heat conductive metal is provided on the periphery thereof. Other configurations are the same as those of the first embodiment.

  As shown in FIG. 8B, when the temperature of the top surface of the evaporation casing 11 exceeds 75 ° C., the heat-deformable heat radiating fins 40 extend, and the heat conductive plate-like support 45 becomes the top plate of the rack. 44 abuts. As a result, the heat radiation efficiency is enhanced not only by heat radiation into the air by the heat-deformable heat radiation fin 40 but also by heat radiation to the top plate 44.

  As described above, in the second embodiment of the present invention, since the thermally conductive plate-like support body 45 is provided, the heat dissipation is further improved, and damage to the semiconductor integrated circuit device can be avoided more reliably. Become.

  Next, the two-phase flow cooling device according to the third embodiment of the present invention will be described with reference to FIG. 9, and the configuration in the vicinity of the evaporator will be mainly described here. FIG. 9 is an explanatory view of a two-phase flow cooling device according to a third embodiment of the present invention, FIG. 9 (a) is a cross-sectional view before deformation, and FIG. 9 (b) is a cross-sectional view after deformation.

  As shown in FIG. 9A, the heat-deformable heat radiation fins 47 fixed to the evaporation casing 11 used in the two-phase flow cooling device according to the third embodiment of the present invention are formed by folding the leaf springs. The material itself is the same as the material of the heat-deformable heat radiating fin 40 of the first embodiment. Other configurations are the same as those in the first embodiment. The heat-deformable heat dissipating fins are formed by cutting a laminated film of a shape memory alloy and a high thermal conductivity metal into a thin line, and then alternately folding the laminated film into a mountain fold and a valley fold.

  As shown in FIG. 9B, when the temperature of the top surface of the evaporation casing 11 exceeds 75 ° C., the heat-deformable heat radiating fins 47 extend to start heat radiation into the air.

  As described above, in the third embodiment of the present invention, the heat-deformable radiating fins 47 are formed by folding the leaf springs, so that the manufacture is facilitated and the fixing to the evaporation housing 11 is also facilitated. .

  Next, a two-phase flow cooling device according to a fourth embodiment of the present invention will be described with reference to FIG. 10. Here, the configuration in the vicinity of the evaporator will be mainly described. FIG. 10 is an explanatory diagram of a two-phase flow cooling device according to a fourth embodiment of the present invention, FIG. 10 (a) is a cross-sectional view before deformation, and FIG. 10 (b) is a cross-sectional view after deformation.

  As shown in FIG. 10 (a), the two-phase flow cooling device according to the fourth embodiment of the present invention is similar to the second embodiment described above at the other end of the heat-deformable heat dissipating fin having a shape in which a leaf spring is folded. A thermally conductive plate-like support 45 made of Cu is fixed, and a spacer 46 made of a laminated film of, for example, a shape memory alloy and a highly thermally conductive metal is provided on the periphery thereof. Other configurations are the same as those in the third embodiment.

  As shown in FIG. 10B, when the temperature of the top surface of the evaporation casing 11 exceeds 75 ° C., the heat-deformable radiating fins 47 extend and the heat conductive plate-like support 45 becomes the top plate of the rack. 44 abuts. As a result, the heat radiation efficiency is enhanced not only by heat radiation to the air by the heat deformable heat radiation fins 47 but also by heat radiation to the top plate 44.

  Thus, in Example 4 of this invention, since the heat-deformable heat radiating fin 47 has a shape in which the leaf spring is folded, the manufacture is facilitated and the fixing to the evaporation housing 11 is also facilitated. . In addition, since the thermally conductive plate-like support 45 is provided, the heat dissipation is further improved, and damage to the semiconductor integrated circuit device can be avoided more reliably.

Here, the following supplementary notes are attached to the embodiments of the present invention including Examples 1 to 4.
(Appendix 1) A thermally conductive lid member that is in thermal contact with the semiconductor device, an evaporation housing that is in thermal contact with the thermally conductive lid member, and a vapor pipe and a liquid that are connected to the evaporation housing A radiator connected to the pipe, the steam pipe, and the liquid pipe; a fan that blows air to the radiator; a pump connected to an intermediate portion of the liquid pipe; and the thermally conductive lid of the evaporation housing A heat-deformable heat dissipating fin that expands and contracts by heat provided on the surface opposite to the surface in contact with the shaped member, and the heat-deformable heat dissipating fin extends from a compressed state when reaching a predetermined temperature or more. A two-phase flow cooling device characterized by being a heat-deformable radiating fin that changes into a state.
(Appendix 2) The two-phase flow cooling according to appendix 1, wherein the heat-deformable heat dissipating fin comprises a laminated film of a shape memory alloy and a high thermal conductivity metal having a higher thermal conductivity than the shape memory alloy. apparatus.
(Appendix 3) The two-phase flow cooling device according to appendix 1 or appendix 2, wherein the high thermal conductivity metal is Cu, Ag, or a Cu-Ag alloy.
(Appendix 4) The two-phase flow cooling according to any one of appendices 1 to 3, wherein the heat-deformable radiating fin is a radiating fin having a shape obtained by folding a coiled radiating fin or a leaf spring. apparatus.
(Additional remark 5) The edge part on the opposite side to the edge part currently fixed to the said housing | casing for evaporation of the said heat-deformable radiation fin is being fixed to the heat conductive plate-shaped support member, The additional notes 1 thru | or characterized by the above-mentioned The two-phase flow cooling device according to any one of appendix 4.
(Supplementary note 6) The two-phase flow cooling device according to any one of supplementary notes 1 to 3, wherein the steam pipe and the liquid pipe are attached to a side surface of the evaporation casing.
(Appendix 7) Evaporation housing, tube mounting portion for attaching a steam pipe and a liquid tube to the evaporation housing, a heat-deformable heat dissipating fin that expands and contracts by heat provided on the top surface of the evaporation housing, And the heat-deformable heat dissipating fin is a heat-deformable heat dissipating fin that changes from a compressed state to an extended state when reaching a predetermined temperature or higher. .
(Appendix 8) The two-phase flow cooling according to appendix 7, wherein the heat-deformable heat dissipating fin comprises a laminated film of a shape memory alloy and a high thermal conductivity metal having higher thermal conductivity than the shape memory alloy. Equipment evaporator.
(Appendix 9) The evaporator for a two-phase flow cooling device according to appendix 7 or appendix 8, wherein the high thermal conductivity metal is any one of Cu, Ag, or a Cu-Ag alloy.
(Supplementary note 10) The two-phase flow cooling according to any one of Supplementary notes 7 to 9, wherein the heat-deformable heat radiation fin is a heat radiation fin having a shape obtained by folding a coil-shaped heat radiation fin or a leaf spring. Equipment evaporator.

10, 50 Evaporator system 11, 51 Evaporation housing 12, 13, 52, 53 Pipe attachment portion 14, 54 Lid 15, 55 TIM
20, 60 Cooling piping system 21, 61 Steam pipe 22, 62 Liquid pipe 23, 24, 63, 64 Pipe mounting part 25, 65 Radiator 26, 66 Fan 27, 28, 67, 68 Pipe mounting part 29, 69 Pump 30, 70 Cooled electronic devices 31, 71 System boards 32, 72 Circuit boards 33, 73 Semiconductor integrated circuit devices 34, 74 Stiffeners 35, 75 TIM
36, 76 Hydraulic fluid 40, 47 Thermally deformable heat radiation fin 41 Multilayer film 42 Shape memory alloy 43 High thermal conductive metal 44 Top plate 45 Thermal conductive plate-like support 46 Spacer

Claims (5)

A thermally conductive lid-like member in thermal contact with the semiconductor device;
An evaporation housing that is in thermal contact with the thermally conductive lid-like member;
A steam pipe and a liquid pipe connected to the evaporation casing; a radiator connected to the steam pipe and the liquid pipe;
A fan for blowing air to the radiator;
A pump connected to an intermediate portion of the liquid pipe;
A heat-deformable heat dissipating fin that expands and contracts by heat provided on the surface opposite to the surface in contact with the thermally conductive lid-like member of the evaporation housing;
The two-phase flow cooling device, wherein the heat-deformable heat dissipating fin is a heat-deformable heat dissipating fin that changes from a compressed state to an extended state when reaching a predetermined temperature or higher.   2. The two-phase flow cooling device according to claim 1, wherein the heat-deformable heat dissipating fin is formed of a laminated film of a shape memory alloy and a highly heat conductive metal having a higher thermal conductivity than the shape memory alloy.   The two-phase flow cooling device according to claim 1 or 2, wherein the heat-deformable heat dissipating fin is a heat dissipating fin in the shape of a coiled heat dissipating fin or a leaf spring.   4. An end of the heat-deformable radiating fin opposite to an end fixed to the evaporation housing is fixed to a thermally conductive plate-like support member. The two-phase flow cooling device according to any one of the above. An evaporation enclosure;
A pipe attachment portion for attaching a steam pipe and a liquid pipe to the evaporation housing;
A heat-deformable heat dissipating fin that expands and contracts by heat provided on the top surface of the evaporation housing;
The evaporator for a two-phase flow cooling device, wherein the heat-deformable heat dissipating fin is a heat-deformable heat dissipating fin that changes from a compressed state to an extended state when reaching a predetermined temperature or higher.

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