JP6120161B2 - Laser processing apparatus and optical display device production system - Google Patents

Description

  The present invention relates to a laser processing apparatus and an optical display device production system.

In Patent Document 1, a decomposition product (fume) generated from a laser irradiation portion at the time of laser processing of a product is sucked and removed by a suction device in which a suction port is disposed in the vicinity of the laser irradiation portion. Techniques for reducing adhesion are disclosed.
In Patent Document 2, in a method of cutting an optical film with a separator into a predetermined length and pasting it to a product panel, the laser optical axis is tilted from the front to the rear in the laser traveling direction and cut when the film is laser cut. An air nozzle that blows hot air toward the part and a smoke collection duct that removes gas generated from the cutting part conveyed by the hot air are integrated with the laser irradiation device, so that the fume on the film surface Techniques for reducing adhesion are disclosed.

JP 2008-284572 A Japanese Patent No. 4361103

In the former configuration, fume adherence to the product can be suppressed, but it is difficult to completely remove it, and foreign matter adhering to the product surface becomes a problem as product standards become strict. . In addition, there is a concern about a decrease in yield due to line contamination due to minute foreign substances adhering to the product surface.
In the latter configuration, fume adhesion to the optical film can be suppressed by tilting the laser irradiation direction, but the cut surface of the film tends to be tapered due to the tilt of the optical axis, which may affect the product processing accuracy. Is done. Moreover, it may become NG on a product specification.

  The present invention has been made in view of the above circumstances, and provides a laser processing apparatus and an optical display device production system capable of effectively suppressing fume adhesion to the product surface without affecting product processing accuracy. With the goal.

  As a means for solving the above problems, the present invention provides a laser processing apparatus for irradiating a processing position of a workpiece with a laser beam to open a suction port in the vicinity of the processing position over the entire length of the processing position. A device is provided.

  According to the above configuration, it is possible to suck the fumes generated by the laser processing without omission over the entire length of the processing position while ensuring the product processing accuracy by eliminating the inclination of the laser beam and the like. As a result, it is possible to prevent fume from adhering to the product surface and to prevent line contamination due to fume adhering to the product.

The present invention may be configured such that the processing position is provided endlessly on the outer periphery of the specific area of the workpiece, and the suction device is provided so as to surround the entire periphery of the specific area.
In this case, the fumes can be removed by suction without leakage over the entire circumference of the specific region.
Further, the present invention may be configured such that the suction device can move forward and backward with respect to the processing position.
In this case, laser processing of workpieces having different processing positions can be easily handled.

The present invention may be configured such that the suction device has a blowout port for blowing air toward a product surface between the processing position and the suction port.
In this case, fume adhesion to the product surface between the processing position and the suction port can be suppressed.
At this time, if the suction device is configured to blow warm air from the blowout port, it is possible to more effectively suppress fume deposition on the product surface between the cutting line and the suction port.

  In the production system of an optical display device formed by bonding an optical member to an optical display component, the present invention provides a bonding apparatus in which an optical member sheet larger than the display area is bonded to the optical display component to form a bonded body. A cutting device that separates a portion facing the display region of the optical member sheet in the bonded body and a surplus portion outside the optical member sheet, and forms the optical member having a size corresponding to the display region from the optical member sheet; A laser beam irradiation device that irradiates a laser beam for cutting toward a cutting portion between the facing portion and the surplus portion of the optical member sheet in the bonded body, and the cutting device And a suction device that opens a suction port over the entire length of the cutting part in the vicinity of the part.

According to the said structure, after bonding the optical member sheet | seat larger than the said display area to an optical display component, the optical member of the size corresponding to a display area is cut | disconnected of an optical display component by cutting off the excess part of this optical member sheet | seat. It can be formed with high accuracy on the surface, and the frame portion outside the display area can be narrowed to enlarge the display area and downsize the device.
In addition, cutting using laser light is more accurate than cutting using a cutting blade, and the frame portion around the display area can be narrower than when using a cutting blade.
In addition, the effective area of the optical member sheet (optical member) to be left on the optical display component without causing a taper angle (an angle with respect to the direction orthogonal to the bonding surface) due to the inclination of the laser beam at the cut end of the optical member sheet. Can contribute to further narrowing the frame of the device.
Further, the fumes generated by the laser processing can be sucked without leakage over the entire length of the processing position, so that the fume can be prevented from adhering to the product surface, and line contamination due to the fumes adhering to the product can be prevented.

In addition, the “part facing the display area” in the above configuration is an area that is not less than the size of the display area and not more than the size of the outer shape (contour shape in plan view) of the optical display component, and the electrical component mounting portion. The area where functional parts such as are avoided is shown. That is, the said structure includes the case where the surplus part is laser-cut along the outer periphery of an optical display component.
In addition, the “size corresponding to the display area” in the above configuration is a size not less than the size of the display area and not more than the size of the outer shape (contour shape in plan view) of the optical display component, and It refers to a size that avoids a functional part such as an electric part mounting part in an optical display part.

  In the bonding body, the present invention has a detecting means for detecting an outer peripheral edge of the bonding surface between the optical member sheet and the optical display component, and the cutting portion is set along the outer peripheral edge. There may be.

  The “bonding surface between the optical member sheet and the optical display component” in the above configuration refers to a surface facing the optical member sheet of the optical display component, and specifically, “the outer peripheral edge of the bonding surface” In the optical display component, the outer peripheral edge of the substrate on which the optical member sheet is bonded is indicated.

  According to the above-described configuration, it is possible to reliably set the cutting portion based on the shape of the optical display component, and to produce an optical display device that can effectively narrow the frame for various sizes of optical display components. It can be a system.

  ADVANTAGE OF THE INVENTION According to this invention, the production system of the laser processing apparatus and optical display device which can suppress effectively the adhesion | attachment of the fume to the product surface, without affecting product processing precision can be provided.

It is a schematic block diagram of the film bonding system of the optical display device in embodiment of this invention. It is a perspective view of the 2nd bonding apparatus periphery of the said film bonding system. It is sectional drawing of the 1st bonding sheet | seat in the said film bonding system. It is sectional drawing of the 2nd bonding sheet | seat in the 2nd cutting device periphery in the said film bonding system. It is a top view of the 3rd bonding sheet | seat in the 3rd cutting device periphery in the said film bonding system. It is AA sectional drawing of FIG. It is sectional drawing of the double-sided bonding panel which passed through the said film bonding system. It is a top view of a suction device with which the above-mentioned 2nd cutting device is provided. It is a B arrow view of FIG. It is a top view of the state which reduced the range which the above-mentioned suction device encloses. It is D arrow line view of FIG. It is sectional drawing of the dust collection duct and optical display component of the said suction device. It is a principal part enlarged view of FIG. It is a top view of the modification of the said suction device. It is a perspective view of the connection bracket of the said modification. It is a schematic diagram of the 1st detection means which detects the outer periphery of the bonding surface. It is a schematic diagram which shows the modification of the 1st detection means which detects the outer periphery of the bonding surface. It is a top view which shows the position which detects the outer periphery of the bonding surface. It is a schematic diagram of the 2nd detection means which detects the outer periphery of the bonding surface.

  Embodiments of the present invention will be described below with reference to the drawings. This embodiment demonstrates the film bonding system which comprises the one part as a production system of an optical display device. In each figure, an XYZ orthogonal coordinate system is set, the X direction indicates the width direction of the optical display component (liquid crystal panel), the Y direction indicates the conveyance direction of the optical display component, and the Z direction indicates the direction orthogonal to the X direction and the Y direction. .

  FIG. 1 shows a schematic configuration of a film bonding system (production system for an optical display device) 1 of the present embodiment. The film laminating system 1 is for laminating a film-shaped optical member such as a polarizing film, a retardation film, or a brightness enhancement film on a panel-shaped optical display component such as a liquid crystal panel or an organic EL panel. And the optical member bonding body containing the optical member is manufactured. In the film bonding system 1, a liquid crystal panel P is used as the optical display component. Each part of the film bonding system 1 is comprehensively controlled by a control device 20 as an electronic control device.

The film bonding system 1 sequentially performs a predetermined process on the liquid crystal panel P while transporting the liquid crystal panel P from the start position to the end position of the bonding process using, for example, a driving roller conveyor 5. The liquid crystal panel P is conveyed on the roller conveyor 5 with its front and back surfaces being horizontal.
In the drawing, the left side indicates the upstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport upstream side), and the right side in the diagram indicates the downstream side in the transport direction of the liquid crystal panel P (hereinafter referred to as the panel transport downstream side).

  5 and 7 together, the liquid crystal panel P has a rectangular shape in a plan view, and a display region P4 having an outer shape along the outer peripheral edge is formed inside the outer peripheral edge by a predetermined width. The liquid crystal panel P is transported in a direction in which the short side of the display area P4 is substantially along the transport direction on the upstream side of the panel transport with respect to the second alignment device 14 to be described later, and on the downstream side of the panel transport with respect to the second alignment device 14 Then, the display area P4 is transported in a direction substantially along the transport direction.

  First, second, and third optical members F11, F12, and F13 cut out from the long, strip-like first, second, and third optical member sheets F1, F2, and F3 with respect to the front and back surfaces of the liquid crystal panel P are provided. Bonded appropriately. In the present embodiment, the first optical member (optical member, specific region, facing portion) F11 and the third optical member (optical member, specific) as polarizing films are provided on both the backlight side and display surface side of the liquid crystal panel P. Area | region, the opposing part) F13 is each bonded, and the 2nd optical member (an optical member, a specific area | region, an opposing part) as a brightness enhancement film is piled up on the surface by the side of the backlight of liquid crystal panel P on the 1st optical member F11. ) F12 is further bonded.

  As shown in FIG. 1, the film bonding system 1 includes a first alignment device 11 that transports the liquid crystal panel P from the upstream process to the panel transport upstream side of the roller conveyor 5 and aligns the liquid crystal panel P. The 1st bonding apparatus (bonding apparatus) 12 provided in the panel conveyance downstream rather than the alignment apparatus 11, the 1st cutting apparatus 13 provided in proximity to the 1st bonding apparatus 12, and the 1st bonding apparatus 12 And a second alignment device 14 provided on the downstream side of the panel conveyance with respect to the first cutting device 13.

  Moreover, the film bonding system 1 is the 2nd bonding apparatus (bonding apparatus) 15 provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14, and the 2nd provided in proximity to the 2nd bonding apparatus 15. A cutting device (cutting device) 16, a third alignment device 17 provided on the downstream side of the panel transport relative to the second bonding device 15 and the second cutting device 16, and a downstream side of the panel transport relative to the third alignment device 17 The 3rd bonding apparatus (bonding apparatus) 18 and the 3rd cutting apparatus (cutting apparatus) 19 provided in proximity to the 3rd bonding apparatus 18 are provided.

  The first alignment device 11 holds the liquid crystal panel P and conveys it freely in the vertical and horizontal directions, and, for example, a camera (not shown) that images the upstream and downstream ends of the liquid crystal panel P. Have. The imaging data of this camera is sent to the control device 20. The control device 20 operates the first alignment device 11 based on the imaging data and the inspection data in the optical axis direction stored in advance. Note that second and third alignment devices 14 and 17 described later also have cameras, and use image data of the cameras for alignment.

  The first alignment device 11 is controlled by the control device 20 and aligns the liquid crystal panel P with respect to the first bonding device 12. At this time, the liquid crystal panel P is positioned in a horizontal direction (hereinafter referred to as a component width direction) orthogonal to the transport direction and in a rotation direction around the vertical axis (hereinafter simply referred to as a rotation direction). In this state, the liquid crystal panel P is introduced into the bonding position of the first bonding apparatus 12.

  The 1st bonding apparatus 12 is the upper surface of liquid crystal panel P conveyed below the lower surface of the elongate 1st optical member sheet | seat (to-be-processed object, optical member sheet | seat) F1 introduced into the bonding position ( (Backlight side) is bonded (see FIG. 3). The 1st bonding apparatus 12 conveys the 1st optical member sheet | seat F1 along the longitudinal direction, unwinding the 1st optical member sheet | seat F1 from the 1st original fabric roll R1 which wound the 1st optical member sheet | seat F1. The conveying device 12a to be carried, and the pressing roll 12b for bonding the upper surface of the liquid crystal panel P conveyed by the roller conveyor 5 to the lower surface of the first optical member sheet F1 conveyed by the conveying device 12a.

  The transport device 12a holds the first original roll R1 around which the first optical member sheet F1 is wound, and rolls the first optical member sheet F1 along the longitudinal direction thereof, and a first optical member. A protection film pf that overlaps the upper surface of the sheet F1 and is fed together with the first optical member sheet F1 is collected on the downstream side of the panel transfer of the first laminating device 12 and a pf collection unit 12d.

  The pinching roll 12b has a pair of laminating rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the inside of this gap is the bonding position of the first bonding apparatus 12. The liquid crystal panel P and the first optical member sheet F1 are overlapped and introduced into the gap. The liquid crystal panel P and the first optical member sheet F1 are sent out to the downstream side of the panel conveyance while being pressed between the bonding rollers. Thereby, the 1st bonding sheet | seat F21 by which the some liquid crystal panel P was continuously bonded on the lower surface of the elongate 1st optical member sheet | seat F1 at predetermined intervals is formed.

  The 1st cutting device 13 is located in a panel conveyance downstream rather than the pf collection | recovery part 12d, cut | disconnects the 1st optical member sheet | seat F1 of the 1st bonding sheet | seat F21, and is larger than the display area P4 (this embodiment liquid crystal panel) In order to obtain a sheet piece F1S (see FIG. 4) larger than P, a predetermined portion (between the liquid crystal panels P arranged in the transport direction) of the first optical member sheet F1 is cut over the entire width in the component width direction. It does not matter whether the first cutting device 13 uses a cutting blade or a laser cutter. By the said cutting | disconnection, the 1st single-sided bonding panel (optical display component, bonding body) P11 by which the said sheet piece F1S larger than the display area P4 was bonded on the upper surface of liquid crystal panel P is formed (refer FIG. 4).

  In the sheet piece F1S, the size of the portion that protrudes outside the liquid crystal panel P (the size of the surplus portion of the sheet piece F1S) is appropriately set according to the size of the liquid crystal panel P. For example, when the sheet piece F1S is applied to a medium-sized liquid crystal panel P of 5 to 10 inches, the distance between one side of the sheet piece F1S and one side of the liquid crystal panel P is 2 mm on each side of the sheet piece F1S. Set to a length in the range of ~ 5 mm.

  The second alignment device 14 changes the direction so that the first single-sided bonding panel P11 that has been transported substantially parallel to the short side of the display region P4 is transported substantially parallel to the long side of the display region P4. In addition, the said direction change is made | formed when the optical axis direction of the other optical member sheet | seat bonded to liquid crystal panel P is arrange | positioned at right angle with respect to the optical axis direction of the 1st optical member sheet | seat F1.

  The second alignment device 14 performs the same alignment as the first alignment device 11. That is, the second alignment device 14 is based on the inspection data in the optical axis direction stored in the control device 20 and the imaging data of the camera in the component width direction of the first single-sided bonding panel P11 with respect to the second bonding device 15. And positioning in the rotation direction. In this state, the first single-sided bonding panel P <b> 11 is introduced into the bonding position of the second bonding device 15.

  The 2nd bonding apparatus 15 is the 1st single-sided bonding conveyed below with respect to the lower surface of the elongate 2nd optical member sheet | seat (processed object, optical member sheet | seat) F2 introduced into the bonding position. The upper surface of the panel P11 (the backlight side of the liquid crystal panel P) is bonded (see FIG. 4). The 2nd bonding apparatus 15 conveys the 2nd optical member sheet | seat F2 along the longitudinal direction, unwinding the 2nd optical member sheet | seat F2 from the 2nd original fabric roll R2 which wound the 2nd optical member sheet | seat F2. The conveyance apparatus 15a to convey, and the pinching roll 15b which bonds the upper surface of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the lower surface of the 2nd optical member sheet | seat F2 which the conveyance apparatus 15a conveys are provided.

  The transport device 15a holds the second original roll R2 around which the second optical member sheet F2 is wound, and rolls the second optical member sheet F2 along the longitudinal direction thereof, and the pressure roll 15b. 2nd collection part 15d which is located in the panel conveyance downstream side and collects the surplus part of the 2nd optical member sheet F2 which passed through the 2nd cutting device 16.

  The pinching roll 15b has a pair of bonding rollers arranged with the axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the inside of this gap is the bonding position of the second bonding apparatus 15. The first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced into the gap. These 1st single-sided bonding panels P11 and the 2nd optical member sheet | seat F2 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 2nd bonding sheet | seat (bonding body) F22 by which the several 1st single-sided bonding panel P11 was continuously bonded by the lower surface of the elongate 2nd optical member sheet | seat F2 forming predetermined intervals formed. Is done.

  The 2nd cutting device 16 is located in the panel conveyance downstream rather than the pinching roll 15b, the sheet piece of the 1st optical member sheet | seat F1 of the 1st single-sided bonding panel P11 bonded to the 2nd optical member sheet | seat F2 and its lower surface. F1S (see FIG. 4) is cut simultaneously. The second cutting device 16 is, for example, a CO2 laser cutter, and ends the second optical member sheet F2 and the sheet piece F1S along the outer peripheral edge of the display region P4 (in the present embodiment, along the outer peripheral edge of the liquid crystal panel P). (See FIG. 5). By cutting the optical member sheets F1 and F2 together after being bonded to the liquid crystal panel P, the accuracy in the optical axis direction of the optical member sheets F1 and F2 is increased, and the opticalness between the optical member sheets F1 and F2 is increased. The axial displacement is eliminated, and the cutting with the first cutting device 13 is simplified.

  By the cutting | disconnection of the 2nd cutting device 16, the 2nd single-sided bonding panel (optical display component, bonding body) P12 in which the 1st and 2nd optical members F11 and F12 were accumulated and bonded on the upper surface of liquid crystal panel P was formed. (See FIG. 6). At this time, as shown in FIG. 2, each of the optical member sheets F1 and F2 that are left in a frame shape by cutting off the facing portions (respective optical members F11 and F12) between the second single-sided bonding panel P12 and the display region P4. The surplus portions Y and Y ′ are separated. A plurality of surplus portions Y ′ of the second optical member sheet F2 are connected in a ladder shape (see FIG. 2), and the surplus portions Y ′ are wound around the second collection portion 15d together with the surplus portion Y of the first optical member sheet F1. It is done.

Here, the “opposite part of the display area P4” is an area that is not less than the size of the display area P4 and not more than the size of the outer shape of the liquid crystal panel P, and avoids a functional part such as an electrical component mounting portion. Indicates the area. In the present embodiment, in the three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P, and in one side corresponding to the functional portion, the liquid crystal The surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge of the panel P.
In addition, in this embodiment, although the structure which cut | disconnects the 2nd optical member sheet | seat F2 and the sheet piece F1S of the 1st optical member sheet | seat F1 simultaneously is mentioned, it is not restricted to this, The sheet piece of the 1st optical member sheet | seat F1 There may be a configuration in which only F1S or only the second optical member sheet F2 is cut.

  Referring to FIG. 1, the third alignment device 17 reverses the second single-sided bonding panel P12 with the backlight side of the liquid crystal panel P as the upper surface so that the display surface side of the liquid crystal panel P is the upper surface. The same alignment as that of the first and second alignment devices 11 and 14 is performed. That is, the 3rd alignment apparatus 17 is based on the inspection data of the optical axis direction memorize | stored in the control apparatus 20, and the imaging data of the said camera in the component width direction of the 2nd single-sided bonding panel P12 with respect to the 3rd bonding apparatus 18. FIG. And positioning in the rotation direction. In this state, the second single-sided bonding panel P <b> 12 is introduced into the bonding position of the third bonding device 18.

  The 3rd bonding apparatus 18 is the 2nd single-sided bonding conveyed below with respect to the lower surface of the elongate 3rd optical member sheet | seat (processed object, optical member sheet | seat) F3 introduced into the bonding position. The upper surface of the panel P12 (the display surface side of the liquid crystal panel P) is bonded. The 3rd bonding apparatus 18 conveys the 3rd optical member sheet | seat F3 along the longitudinal direction, unwinding the 3rd optical member sheet | seat F3 from the 3rd original fabric roll R3 which wound the 3rd optical member sheet | seat F3. The conveyance apparatus 18a which conveys, and the pinching roll 18b which bonds the upper surface of the 2nd single-sided bonding panel P12 which the roller conveyor 5 conveys to the lower surface of the 3rd optical member sheet | seat F3 which the conveyance apparatus 18a conveys are provided.

  The conveying device 18a holds a third original roll R3 around which the third optical member sheet F3 is wound, a roll holding portion 18c that feeds the third optical member sheet F3 along its longitudinal direction, and a pressure roll 18b. And a third recovery part 18d that recovers the surplus portion of the third optical member sheet F3 that has passed through the third cutting device 19 and is located on the downstream side of the panel conveyance.

  The pinching roll 18b has a pair of pasting rollers arranged with their axial directions parallel to each other. A predetermined gap is formed between the pair of bonding rollers, and the gap is the bonding position of the third bonding device 18. In the gap, the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced. These 2nd single-sided bonding panels P12 and the 3rd optical member sheet | seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. Thereby, the 3rd bonding sheet | seat (bonding body) F23 by which the several 2nd single-sided bonding panel P12 was continuously bonded by the lower surface of the elongate 3rd optical member sheet | seat F3 forming predetermined intervals formed. Is done.

  The 3rd cutting device 19 is located in a panel conveyance downstream rather than the pinching roll 18b, and cut | disconnects the 3rd optical member sheet | seat F3. The third cutting device 19 is a laser processing machine similar to the second cutting device 16, and the third optical member sheet F3 is endless along the outer peripheral edge of the display region P4 (for example, along the outer peripheral edge of the liquid crystal panel P). Disconnect.

  By the cutting | disconnection of the 3rd cutting device 19, the double-sided bonding panel (optical display device) P13 by which the 3rd optical member F13 was bonded to the upper surface of the 2nd single-sided bonding panel P12 is formed (refer FIG. 7). Further, at this time, the double-sided bonding panel P13 and the surplus portion (not shown) of the third optical member sheet F3 remaining in a frame shape are separated from the facing portion (third optical member F13) of the display region P4. The A plurality of surplus portions of the third optical member sheet F3 are connected to form a ladder like the surplus portions Y 'of the second optical member sheet F2, and the surplus portions are wound around the third recovery portion 18d.

  After the double-sided bonding panel P13 is inspected for defects (such as poor bonding) through a defect inspection device (not shown), it is transported to the downstream process and subjected to other processes.

  Hereinafter, the optical member sheets F1, F2, and F3 are optical member sheets FX, the liquid crystal panels P that are bonded to the optical member sheets F1, F2, and F3, and the single-side bonded panels P11 and P12 are optical display components PX. The optical members F11, F12, and F13 may be collectively referred to as an optical member FS.

  The polarizer film constituting the optical member sheet FX is formed by, for example, uniaxially stretching a PVA film dyed with a dichroic dye, but unevenness in the thickness of the PVA film during the stretching or dyeing of the dichroic dye Due to unevenness or the like, there is a tendency that a difference in the optical axis direction occurs between the inner side in the width direction and the outer side in the width direction of the optical member sheet FX.

  Therefore, in the present embodiment, based on the inspection data of the in-plane distribution of the optical axis in each part of the optical member sheet FX stored in advance in the control device 20, the alignment of the optical display component PX to be bonded to these is performed. The optical display component PX is bonded to the optical member sheet FX. Note that the optical axis direction may be detected while the optical member sheet FX is unwound, and the optical display component PX may be aligned based on the detection data.

  As shown in FIG. 3, the liquid crystal panel P includes a rectangular first substrate P1 made of, for example, a TFT substrate, a second rectangular substrate P2 disposed opposite to the first substrate P1, and a first substrate. A liquid crystal layer P3 sealed between P1 and the second substrate P2 is included. For convenience of illustration, hatching of each layer is omitted.

  Referring to FIGS. 5 and 6, the first substrate P1 has three sides of the outer periphery along the corresponding three sides of the second substrate P2, and the remaining one side of the outer periphery corresponds to the second substrate P2. Project outside of one side. Thereby, the electrical component attachment part P5 which protrudes outside the 2nd board | substrate P2 is provided in the said one side of the 1st board | substrate P1.

  4 and 6, the second cutting device 16 detects the outer peripheral edge of the display area P4 with a detection means such as a camera 16a, and the first and second optical elements along the outer peripheral edge of the display area P4. The member sheets F1 and F2 are cut. In addition, the third cutting device 19 similarly cuts the third optical member sheet F3 along the outer peripheral edge and the like of the display area P4 while detecting the outer peripheral edge of the display area P4 by a detection unit such as a camera 19a. Outside the display area P4, a frame portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates P1 and P2 is provided, and the cutting devices 16 and 19 within the width of the frame portion G are provided. Laser cutting is done.

  When the resin optical member sheet FX is laser-cut alone, the cut end may be swollen or wavy due to thermal deformation. For this reason, when the optical member sheet FX after laser cutting is bonded to the optical display component PX, poor bonding such as air mixing and distortion is likely to occur in the optical member sheet FX.

  On the other hand, in this embodiment in which the optical member sheet FX is laser-cut after the optical member sheet FX is bonded to the liquid crystal panel P, the cut end of the optical member sheet FX is backed up on the glass surface of the liquid crystal panel P, and the optical member sheet FX It is difficult for the cut ends to bulge, corrugate, or the like, and after the bonding to the liquid crystal panel P, the bonding failure is also unlikely to occur.

  The deflection width (tolerance) of the cutting line of the laser processing machine is smaller than that of a cutting blade such as a cutter. Therefore, in this embodiment, the frame portion is compared with the case of cutting the optical member sheet FX using the cutting blade. The width of G can be reduced, and the liquid crystal panel P can be reduced in size and / or the display area P4 can be increased in size. This is effective for application to high-function mobile devices that require expansion of the display screen while the size of the housing is limited, such as smartphones and tablet terminals in recent years.

  In addition, when the optical member sheet FX is cut into a sheet piece aligned with the display region P4 of the liquid crystal panel P and then bonded to the liquid crystal panel P, the dimensional tolerances of the sheet piece and the liquid crystal panel P, and their relative bonding Since the positional dimensional tolerances overlap, it is difficult to reduce the width of the frame portion G of the liquid crystal panel P (it is difficult to enlarge the display area).

  On the other hand, when the optical member sheet FX is bonded to the liquid crystal panel P and then cut in accordance with the display region P4, only the runout tolerance of the cutting line needs to be considered, and the width tolerance of the frame portion G can be reduced. (± 0.1 mm or less). Also in this respect, the width of the frame part G of the liquid crystal panel P can be reduced (the display area can be enlarged).

  Further, by cutting the optical member sheet FX with a laser instead of a blade, the cutting force is not input to the liquid crystal panel P, and it becomes difficult for cracks and chips to occur at the edge of the substrate of the liquid crystal panel P, such as a heat cycle. The durability against is improved. Similarly, since there is no contact with the liquid crystal panel P, there is little damage to the electrical component mounting portion P5.

  As shown in FIG. 5, when laser cutting the optical member sheet FX (third optical member sheet F3 in FIG. 5), for example, a laser cut start point pt1 is set on the extension of one long side of the display area P4. First, the cutting of the one long side is started from the starting point pt1. The end point pt2 of the laser cut is set at a position where the laser goes around the display area P4 and reaches the extension of the short side on the start point side of the display area P4. The start point pt1 and the end point pt2 are set so as to be able to withstand the tension when the optical member sheet FX is wound, leaving a predetermined connection allowance in the surplus portion of the optical member sheet FX.

  FIG. 8 is a plan view showing the suction device 30 provided in the second cutting device 16. In addition to the suction device 30, the second cutting device 16 irradiates the optical member sheet FX with laser light L from the upper side in the orthogonal direction, as shown in FIGS. An irradiation device 21 is provided. The third cutting device 19 has the same configuration.

  Referring to FIG. 8, the suction device 30 is located outside the outer peripheral four sides of the opposed portion (corresponding to the optical member FS, hereinafter referred to as a cutting region (specific region) K) having a rectangular shape in plan view in the optical member sheet FX to be cut. First to fourth dust collection boxes 31a to 31d arranged respectively, and first to fourth connection brackets for connecting the dust collection boxes 31a to 31d to the side surfaces of those adjacent in the clockwise direction in the plan view of FIG. 32a to 32d.

  Hereinafter, the outer peripheral four sides corresponding to the respective dust collection boxes 31a to 31d in the cutting region K are referred to as first to fourth cutting lines (processing positions, cutting portions) S1 to S4, respectively. Further, the dust collection boxes 31a to 31d, the connecting brackets 32a to 32d, and the cutting lines S1 to S4 may be collectively referred to as reference numerals 31, 32, and SX, respectively. The first and third dust collection boxes 31a, 31c are arranged outside the long side portion of the outer periphery of the cutting region K, and the second and fourth dust collection boxes 31b, 31d are outside the short side portion of the outer periphery of the cutting region K. Placed in. Reference numeral CN in the figure denotes a duct connection pipe projecting from the rear or side of each dust collection box 31.

  12 and 13 together, each dust collection box 31 has a hollow rectangular parallelepiped shape, and corresponds to a cutting line (processing position, cutting portion) SX side (hereinafter referred to as the front side of the dust collection box 31) in plan view. The front wall 33 located at the right side is disposed along the cutting line SX. Each dust collection box 31 inclines the lower part of the front wall 33 obliquely forward and downward, and forms an extension part 35 having a triangular shape in cross section in the front edge part of the lower wall 34. By the lower part of the front wall 33 and the extending part 35 of the lower wall 34, a suction nozzle 36 having a channel 36 a inclined rearwardly upward is formed at the front lower edge part of each dust collection box 31.

  The suction nozzle 36 opens a suction port 37 over the entire width of the dust collection box 31 in the length direction of the corresponding cutting line SX (scanning direction of the laser light L). The suction port 37 is disposed close to the corresponding cutting line SX from the outside of the cutting region K. The front wall 33 is fixed to the upper wall 38 so that the vertical position can be adjusted, and the vertical width of the suction port 37 can be adjusted by the vertical movement of the front wall 33. The inclination angle (the inclination angle of the inclined surface of the extending portion 35, which is the lower surface of the flow path 36a in FIG. 13) θ1 in a cross-sectional view of the flow path 36a, is about 45 ° with respect to the upper surface of the optical member sheet FX. . The downstream opening angle (opening angle of the upper and lower surfaces of the flow path 36a) θ2 in the cross-sectional view of the flow path 36a is set to about 15 °.

  Each dust collection box 31 is arranged outside the cutting area K with respect to the corresponding cutting line SX in plan view with a distance d that does not interfere with the laser light L. In this embodiment, the suction device 30 does not move at the time of laser cutting, and the distance d is smaller than when the suction device 30 moves at the time of laser cutting, which contributes to miniaturization of the suction device 30.

  A support air flow path 41 is formed in the lower wall 34 of each dust collection box 31. The flow path 41 feeds support air introduced from, for example, an introduction port 42 that opens to the lower end portion of the rear wall 39 to the outlet port 43 that opens to the lower surface of the extension portion 35. A thin guide plate 44 is fixed to the lower surface of the front portion of the lower wall 34, and a blowing nozzle 51 that opens in front of the lower wall 34 is formed between the guide plate 44 and the lower wall 34. The blowout nozzle 51 forms a blowout port 52 that extends across the entire width of the dust collection box 31 just like the suction port 37 just below the suction port 37 of the dust collection box 31.

  For example, before the optical display component PX is transported to the cutting position by the second cutting device 16, the suction device 30 raises each dust collection box 31 to retract from the cutting position, and the optical display component PX is transported to the cutting position. Then, each dust collection box 31 is lowered. When the dust collection box 31 is lowered, the lower surface of the guide plate 44 is brought into contact with the upper surface of the optical display component PX (the uppermost surface of the optical member sheet FX to be cut), and the suction port is located outside and in the vicinity of the corresponding cutting line SX. 37 and the outlet 52 are arranged. Thereby, at the time of laser cutting of the optical member sheet FX, smoke-like decomposition products (fumes) generated by melting and decomposition reactions can be collected in each dust collection box 31.

  In each dust collection box 31, the wind pressure at the tip of the suction nozzle 36 is set to 0.1 kPa or more at static pressure, and the wind speed is set to 7 m / s or more. On the other hand, the wind pressure and wind speed at the tip of the blowing nozzle 51 are set to be smaller than that of the suction nozzle 36. Therefore, the support air blown out by the blow-out nozzle 51 flows shortly to the suction port 37 side immediately above the blow-out port 52 and is sucked by the suction nozzle 36. By this air flow, fume attachment to the upper surface of the optical member sheet FX is effectively suppressed in the range of the distance d between the suction port 37 and the cutting line SX. The support air blown out by the blow-out nozzle 51 is warm air, and gives heat energy to the fumes that are sublimated materials, making it more difficult to adhere to the optical member sheet FX.

  The plurality of cutting lines SX and the plurality of dust collection boxes 31 surround the entire circumference of the rectangular cutting region K in plan view. That is, in the cutting process by the second cutting device 16, the laser beam L scans and cuts the outer periphery of the cutting region K of the optical member sheet FX in an endless manner. Note that the cut in the cutting step is not limited to a rectangular shape, and may be an arbitrary shape. When the shape includes a curve, it is preferable that the suction port 37 and the blowout port 52 are similarly curved. Moreover, it is not limited to an endless cut, but may be a cut of three sides, two sides, and one side. In this case, the dust collection box 31 may be provided corresponding to only the cutting position.

  Referring to FIGS. 8 and 10, each connection bracket 32 is connected to a side plate 46 fixed to the side surface in the clockwise direction of the corresponding dust collection box 31 and a connection fixed to the side surface of the adjacent dust collection box 31. It has a plate 47 and is formed in an L shape in plan view.

  9 and 11 together, the connecting plate 47 is formed with a plurality of elongated holes 48 extending in the horizontal direction (the direction along the upper surface of the optical member sheet FX). Bolts 49 inserted into the respective long holes 48 are screwed into the side surfaces of the adjacent dust collection boxes 31 and tightened. Thereby, adjacent dust collection boxes 31 are connected to each other at a right angle. Further, the bolts 49 are loosened so that adjacent dust collection boxes 31 can slide along the long holes 48.

  Each dust collection box 31 moves in a direction along the corresponding cutting line SX by movement along the long hole 48. By this movement, the amount of overlap of the suction port 37 of each dust collection box 31 with respect to the side surface of the adjacent dust collection box 31 is increased or decreased, and thus the length of the suction port 37 facing the cutting region K is increased or decreased.

  The suction device 30 is formed in a rectangular shape surrounded by the plurality of suction ports 37 by increasing or decreasing the length of the suction ports 37 facing the cutting region K as described above while keeping the plurality of dust collection boxes 31 connected at right angles. Enlarge or reduce the area. Thereby, when performing laser cutting on the optical display component PX having a different size in the cutting region K of the optical member sheet FX, the suction port 37 of each dust collection box 31 is appropriately connected to the cutting line SX of the optical member sheet FX. It becomes possible to make it close to a distance.

  It can be said that each dust collection box 31 moves back and forth in a direction perpendicular to the cutting line SX with respect to the corresponding cutting line SX, but in the configuration described above, compared to the case of simply moving in the direction intersecting the cutting line SX. Fume near the seam between the cutting lines SX (corner of the cutting region K) can also be collected without leakage.

  That is, in the above configuration, a plurality of dust collection boxes 31 are moved by increasing / decreasing the amount of overlap of the suction port 37 with respect to the adjacent dust collection boxes 31 while moving each dust collection box 31 in the direction along the corresponding cutting line SX. Since the box 31 is simultaneously advanced and retracted with respect to the corresponding cutting line SX, the suction port 37 is always opened to the corner of the rectangular area, and the fumes can be collected without leakage.

  FIG. 14 and FIG. 15 show a modification of the configuration for moving each dust collection box 31 forward and backward. Each of the dust collection boxes 31a to 31d is provided with first to fourth connection brackets 32a ′ to 32d ′ (hereinafter, may be collectively referred to as reference numeral 32 ′) on the side surfaces of the dust collection boxes 31a to 31d that are adjacent in the clockwise direction in the plan view. Connected. Each connection bracket 32 ′ has, for example, a pair of connection plates 47 ′ fixed to the side surface of the corresponding dust collection box 31 in the clockwise direction and the side surface of the adjacent dust collection box 31 in an L shape in plan view. Combining.

A plurality of the long holes 48 are formed in each connecting plate 47 ′, and a bolt 49 inserted through the long hole 48 is screwed into a side surface of the corresponding dust collection box 31 to be tightened. They are linked together. Further, the dust collection box 31 can be moved forward and backward by sliding the dust collection box 31 with the bolts 49 loosened along the long holes 48.
As a result, as described above, the plurality of dust collection boxes 31 are advanced and retracted while simultaneously moving in the direction along the corresponding cutting line SX, and the dust collection boxes 31 are advanced and retracted only in the short side direction or the long side direction of the cutting region K. It is also possible.

  In the present embodiment, the plurality of dust collection boxes 31 are manually moved. However, these may be automatically moved by a separate driving device.

  As described above, the laser processing apparatus in the embodiment includes the suction device 30 that opens the suction port 37 over the entire length of the cutting line SX in the vicinity of the cutting line SX of the optical member sheet FX in the optical display component PX. As a result, it is possible to suck the fumes generated by the laser processing over the entire length of the cutting line SX without any leakage, while ensuring the product processing accuracy by eliminating the inclination of the laser beam L and the like. As a result, it is possible to prevent fume from adhering to the product surface and to prevent line contamination due to fume adhering to the product.

In the laser processing apparatus, the cutting line SX is provided endlessly on the outer periphery of the cutting region K of the optical member sheet FX, and the suction device 30 is provided so as to surround the entire periphery of the cutting region K. Fume can be sucked and removed without leakage over the entire circumference of the cutting region K.
Further, since the suction device 30 can be moved forward and backward with respect to the cutting line SX, it is possible to easily cope with laser processing of workpieces having different processing positions.

Further, the laser processing apparatus includes the blowout port 52 that blows out air toward the product surface between the cutting line SX and the suction port 37, so that the suction device 30 is located between the cutting line SX and the suction port 37. Can prevent fume from adhering to the product surface.
Further, the suction device 30 blows warm air from the blowout port, so that fume can be more effectively suppressed from adhering to the product surface between the cutting line SX and the suction port 37.

And according to the production system of the optical display device in the said embodiment, after bonding optical member sheet FX larger than the display area P4 of liquid crystal panel P to liquid crystal panel P, the excess part of this optical member sheet FX is cut off. Thus, the optical member FS having a size corresponding to the display area P4 can be accurately formed on the surface of the liquid crystal panel P, and the frame area G outside the display area P4 is narrowed to enlarge the display area and reduce the size of the device. Can be achieved.
Moreover, the cutting | disconnection using the laser beam L has a higher precision than the cutting | disconnection using a cutting blade, and can narrow the frame part G around display area P4 compared with the case where a cutting blade is used.
Further, the optical member sheet FX (optical member) that remains on the optical display component PX without causing a taper angle (an angle with respect to the direction orthogonal to the bonding surface) due to the inclination of the laser light L to the cut end of the optical member sheet FX. The effective area of FS) can be expanded, contributing to further narrowing of the frame.
Further, the fumes generated by the laser processing can be sucked without leakage over the entire length of the cutting line SX, and the fume can be prevented from adhering to the product surface, and line contamination due to the fumes adhering to the product can be prevented.

  In addition, this invention is not restricted to the said embodiment, For example, in this embodiment, the structure which cut | disconnects an optical member sheet | seat in frame shape was mentioned as an example which irradiates and processes a laser beam to a to-be-processed object. However, the present invention is not limited to this, for example, a configuration in which the optical member sheet is divided into at least two parts, a cut is made through the optical member sheet, or a groove (cut) having a predetermined depth is formed in the optical member sheet. It may be. Specifically, for example, there are cutting (cutting off), half-cutting, marking processing and the like of the end of the optical member sheet.

  Moreover, in the said embodiment, the 2nd cutting device 16 detects the outer periphery of the display area P4 with detection means, such as a camera 16a, and the 1st and 2nd optical member along the outer periphery of the display area P4, etc. The third cutting device 19 cuts the sheets F1 and F2, and the third cutting device 19 detects the outer peripheral edge of the display area P4 with a detecting means such as a camera 19a, and the third optical member sheet along the outer peripheral edge of the display area P4. Although F3 was cut | disconnected, the structure of a detection means is not restricted to this.

  Specifically, the film bonding system 1 has detection means for detecting the outer peripheral edge of the bonding surface between the first and second optical member sheets F1, F2 and the liquid crystal panel P in the second bonding sheet F22. And it is good also as cut | disconnecting the cutting line SX set along the outer periphery of the bonding surface. Moreover, in the 3rd bonding sheet | seat F23, the film bonding system 1 has a detection means to detect the outer periphery of the bonding surface of the 3rd optical member sheet | seat F3 and liquid crystal panel P, and the outer periphery of a bonding surface The cutting line SX set along the line may be cut.

  The detection of the outer peripheral edge of the bonding surface and the cutting by the cutting device are performed in detail as follows. Hereinafter, the modification of the film bonding system 1 is demonstrated using FIGS.

  FIG. 16 is a schematic diagram of the first detection means 61 that detects the outer peripheral edge of the bonding surface. The 1st detection means 61 with which the film bonding system 1 of this embodiment is provided is the bonding surface (henceforth 1st bonding surface SA1) of liquid crystal panel P and the sheet piece F1S in the 2nd bonding sheet | seat F22. Imaging device 63 that captures an image of outer peripheral edge ED, illumination light source 64 that illuminates outer peripheral edge ED, storage of an image captured by imaging device 63, and detection of outer peripheral edge ED based on the image. And a control unit 65 that performs an operation for the purpose.

  Such first detection means 61 is provided on the upstream side of the panel conveyance of the second cutting device 16 in FIG. 1 and is provided between the pinching roll 15 b and the second cutting device 16.

  The imaging device 63 is fixed and arranged inside the first bonding surface SA1 with respect to the outer peripheral edge ED, and the normal line of the first bonding surface SA1 and the normal line of the imaging surface 63a of the imaging device 63 are arranged. The posture is inclined so as to form an angle θ (hereinafter referred to as an inclination angle θ of the imaging device 63). The imaging device 63 directs the imaging surface 63a to the outer peripheral edge ED, and captures an image of the outer peripheral edge ED from the side where the sheet piece F1S is bonded in the second bonding sheet F22.

  The inclination angle θ of the imaging device 63 is preferably set so that the outer peripheral edge of the first substrate P1 that forms the first bonding surface SA1 can be reliably imaged. For example, when the liquid crystal panel P is formed by so-called multiple chamfering, in which the mother panel is divided into a plurality of liquid crystal panels, the liquid crystal panel P is shifted to the outer peripheral edge of the first substrate P1 and the second substrate P2 constituting the liquid crystal panel P. May occur, and the end surface of the second substrate P2 may be displaced outward from the end surface of the first substrate P1. In such a case, it is preferable to set the inclination angle θ of the imaging device 63 so that the outer peripheral edge of the second substrate P2 does not enter the imaging field of the imaging device 63.

  In such a case, the inclination angle θ of the imaging device 63 is a distance H between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as the height H of the imaging device 63). It is preferable to set so that it may fit. For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, the inclination angle θ of the imaging device 63 is preferably set to an angle in the range of 5 ° or more and 20 ° or less. However, when the deviation amount is empirically known, the height H of the imaging device 63 and the inclination angle θ of the imaging device 63 can be obtained based on the deviation amount. In the present embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle θ of the imaging device 63 is set to 10 °.

  The inclination angle θ of the imaging device 63 may be 0 °. FIG. 17 is a schematic diagram showing a modification of the first detection means 61, and is an example in the case where the inclination angle θ of the imaging device 63 is 0 °. In this case, each of the imaging device 63 and the illumination light source 64 may be disposed at a position overlapping the outer peripheral edge ED along the normal direction of the first bonding surface SA1.

  A distance H1 between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter referred to as a height H1 of the imaging device 63) detects the outer peripheral edge ED of the first bonding surface SA1. It is preferable to set the position at an easy position. For example, the height H1 of the imaging device 63 is preferably set in a range of 50 mm or more and 150 mm or less.

  The illumination light source 64 is fixed and arranged on the opposite side to the side where the sheet piece F1S in the second bonding sheet F22 is bonded. The illumination light source 64 is arrange | positioned rather than the outer periphery ED on the outer side of 1st bonding surface SA1. In the present embodiment, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 are parallel.

  In addition, the illumination light source 64 may be arrange | positioned at the side (namely, the same side as the imaging device 63) by which the sheet piece F1S in the 2nd bonding sheet | seat F22 was bonded.

  If the outer peripheral edge ED imaged by the imaging device 63 is illuminated by the illumination light emitted from the illumination light source 64, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 intersect. It may be.

  FIG. 18 is a plan view showing a position for detecting the outer peripheral edge of the bonding surface. An inspection area CA is set on the conveyance path of the second bonding sheet F22 shown in the drawing. Inspection area | region CA is set in the position corresponding to the outer periphery ED of 1st bonding surface SA1 in liquid crystal panel P conveyed. In the figure, the inspection area CA is set at four locations corresponding to the four corners of the first bonding surface SA1 that is rectangular in plan view, and the corners of the first bonding surface SA1 are detected as the outer peripheral edge ED. It has a configuration. In the figure, among the outer peripheral edges of the first bonding surface SA1, the hook-shaped part corresponding to the corner is shown as the outer peripheral edge ED.

  The first detection means 61 in FIG. 16 detects the outer peripheral edge ED in the four inspection areas CA. Specifically, the imaging device 63 and the illumination light source 64 are arranged in each inspection area CA, and the first detection means 61 is provided at each corner of the first bonding surface SA1 for each liquid crystal panel P to be transported. And the outer peripheral edge ED is detected based on the imaging data. Data of the detected outer peripheral edge ED is stored in the control unit 65 shown in FIG.

  In addition, if the outer periphery of 1st bonding surface SA1 is detectable, the setting position of test | inspection area | region CA is not restricted to this. For example, each inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each edge | side of 1st bonding surface SA1. In this case, each side (four sides) of the first bonding surface SA1 is detected as an outer peripheral edge.

  Moreover, the imaging device 63 and the illumination light source 64 are not limited to the configuration arranged in each inspection area CA, but are configured to be able to move along a movement path that is set along the outer peripheral edge ED of the first bonding surface SA1. It may be. In this case, the imaging device 63 and the illumination light source 64 are configured to detect the outer peripheral edge ED when the imaging device 63 and the illumination light source 64 are positioned in each inspection area CA, so that one imaging device 63 and one illumination light source 64 are provided. In this case, the outer periphery ED can be detected.

  The cutting line about the sheet piece F1S and the second optical member sheet F2 by the second cutting device 16 is set based on the detection result of the outer peripheral edge ED of the first bonding surface SA1.

  For example, based on the memorized data of the outer peripheral edge ED of the first bonding surface SA1, the control unit 65 of the first detection means 61 determines that the first optical member F11 is outside the liquid crystal panel P (first bonding surface SA1. The cutting line of the sheet piece F1S and the second optical member sheet F2 can be set so as not to protrude outside. In addition, the setting of the cutting line is not necessarily performed by the control unit 65 of the first detection unit 61, and the data of the outer peripheral edge ED detected by the first detection unit 61 is used, and the calculation of the bonding surface is performed separately. A cutting line may be set along the outer peripheral edge.

  The 2nd cutting device 16 cut | disconnects the sheet piece F1S and the 2nd optical member sheet | seat F2 in the cutting line set along the outer periphery ED of the bonding surface.

  Returning to FIG. 1, the second cutting device 16 is provided on the downstream side of the panel conveyance with respect to the first detection means 61. The 2nd cutting device 16 detects the opposing part with the display area P4 (refer FIG. 4) among the sheet piece F1S and the 2nd optical member sheet | seat F2 which were bonded by liquid crystal panel P, and the excess part of the outer side. The first optical member F11 and the second optical member F12 (see FIG. 7) having a size corresponding to the display area P4 are cut out along a cutting line set based on the outer peripheral edge ED. Thereby, the 2nd single-sided bonding panel P12 by which the 1st and 2nd optical members F11 and F12 were piled up and bonded on the upper surface of liquid crystal panel P is formed.

  In the present embodiment, the surplus portion is laser-cut along the outer peripheral edge of the liquid crystal panel P at three sides excluding the functional portion in the liquid crystal panel P having a rectangular shape in plan view, and the liquid crystal panel P at one side corresponding to the functional portion. It is possible to adopt a configuration in which the surplus portion is laser-cut at a position that appropriately enters the display region P4 side from the outer peripheral edge. For example, when the first substrate P1 is a TFT substrate, it is possible to adopt a configuration in which a cut is made at a position shifted from the outer peripheral edge of the liquid crystal panel P to the display region P4 side by a predetermined amount so as to exclude the functional portion on one side corresponding to the functional portion.

  FIG. 19 is a schematic diagram of the second detection means 62 for detecting the outer peripheral edge of the bonding surface. The 2nd detection means 62 with which the film bonding system 1 of this embodiment is provided is the bonding surface (henceforth, 2nd bonding surface SA2) of liquid crystal panel P and the 3rd optical member sheet | seat F3 in the 3rd bonding sheet | seat F23. The imaging device 63 that captures an image of the outer peripheral edge ED, the illumination light source 64 that illuminates the outer peripheral edge ED, and the image captured by the imaging device 63 are stored, and the outer peripheral edge ED is based on the image. And a control unit 65 that performs a calculation for detecting. The second detection means 62 has the same configuration as the first detection means 61 described above.

  Such second detection means 62 is provided on the upstream side of the panel conveyance of the third cutting device 19 in FIG. 1 and is provided between the pinching roll 18 b and the third cutting device 19. The 2nd detection means 62 detects outer periphery ED of 2nd bonding surface SA2 similarly to the above-mentioned 1st detection means 61 in the test | inspection area | region set on the conveyance path | route of the 3rd bonding sheet | seat F23.

  The cutting line about the 3rd optical member sheet | seat F3 by the 3rd cutting device 19 is set based on the detection result of the outer periphery ED of 2nd bonding surface SA2.

  For example, based on the stored data of the outer peripheral edge ED of the second bonding surface SA2, the control unit 65 of the second detection means 62 causes the third optical member F13 to be outside the liquid crystal panel P (second bonding surface SA2). The cutting line of the third optical member sheet F3 can be set so that the size does not protrude outside. In addition, the setting of the cutting line is not necessarily performed by the control unit 65 of the second detection unit 62, and the data of the outer peripheral edge ED detected by the second detection unit 62 is used, and the bonding surface is separately calculated using a calculation unit. A cutting line may be set along the outer peripheral edge.

  The 3rd cutting device 19 cut | disconnects the 3rd optical member sheet | seat F3 in the cutting line set along the outer periphery ED of the bonding surface.

The third cutting device 19 detects the outer peripheral edge of the third optical member sheet F3 bonded to the liquid crystal panel P, the portion facing the display region P4 (see FIG. 6), and the excess portion outside thereof. The third optical member F13 (see FIG. 7) having a size corresponding to the display area P4 is cut out along the cutting line set based on the ED. Thereby, the double-sided bonding panel P13 by which the 3rd optical member F13 was bonded by the upper surface of the 2nd single-sided bonding panel P12 is formed.
Also in the film bonding system according to the above modification, fume adhesion to the product surface can be effectively suppressed without affecting the product processing accuracy, which can contribute to narrowing the frame.

  In the film bonding system of the said embodiment, the outer periphery of the bonding surface was detected for every some liquid crystal panel P using a detection means, and it bonded for every liquid crystal panel P based on the detected outer periphery. The cutting positions of the sheet piece F1S, the second optical member sheet F2, and the third optical member sheet 3 are set. As a result, an optical member having a desired size can be separated regardless of individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S, so that quality variation due to individual differences in the sizes of the liquid crystal panel P and the sheet piece F1S can be achieved. In addition, the frame portion around the display area can be reduced to enlarge the display area and downsize the device.

  The configurations in the above-described embodiments and modifications are examples of the present invention, and various modifications can be made without departing from the spirit of the invention.

1 Film bonding system (Optical display device production system)
12 First bonding device (bonding device)
15 Second bonding device (bonding device)
18 Third bonding device (bonding device)
16 Second cutting device (cutting device)
19 Third cutting device (cutting device)
21 Laser beam irradiation device 30 Suction device 37 Suction port 52 Outlet 61 First detection means (detection means)
62 Second detection means (detection means)
P Liquid crystal panel (optical display component)
P4 display area F1 first optical member sheet (workpiece, optical member sheet)
F2 Second optical member sheet (workpiece, optical member sheet)
F3 Third optical member sheet (workpiece, optical member sheet)
F11 first optical member (optical member, specific region, facing portion)
F12 second optical member (optical member, specific region, facing portion)
F13 Third optical member (optical member, specific region, facing portion)
P11 1st single-sided bonding panel (optical display component, bonded body)
P12 2nd single-sided bonding panel (optical display component, bonded body)
P13 Double sided panel (optical display device)
ED outer peripheral edge PX optical display component FS optical member FX optical member sheet SA1 first bonding surface (bonding surface)
SA2 Second bonding surface (bonding surface)
SX cutting line (processing position, cutting part)
Y, Y 'Surplus part L Laser light K Cutting area (specific area)

Claims (6)

In a laser processing device that processes a workpiece by irradiating it with laser light,
A suction device that opens a suction port over the entire length of the processing position in the vicinity of the processing position ;
The laser processing device , wherein the suction device is movable forward and backward with respect to the processing position .   2. The laser according to claim 1, wherein the processing position is provided endlessly on an outer periphery of a specific area of the workpiece, and the suction device is provided so as to surround the entire periphery of the specific area. Processing equipment. The suction device, a laser machining apparatus according to claim 1 or 2, characterized in that it has a outlet discharging air toward the product surface between said processing position and said suction port. The laser processing apparatus according to claim 3 , wherein the suction device blows warm air from the outlet. In the production system of an optical display device formed by bonding an optical member to an optical display component,
A laminating apparatus for laminating an optical member sheet that is larger than the display area to the optical display component,
A cutting device that separates the facing portion of the optical member sheet in the bonded body from the display region and an excess portion outside thereof, and forms the optical member having a size corresponding to the display region from the optical member sheet. Prepared,
In the vicinity of the cutting unit, the cutting unit is configured to irradiate a laser beam for cutting processing toward the cutting part between the facing part and the surplus part of the optical member sheet in the bonded body, and in have a suction device for opening the suction ports over the entire length of the cutting portion,
The production system for an optical display device, wherein the suction device is movable forward and backward with respect to the processing position . In the pasting body, it has a detecting means for detecting an outer periphery of a pasting surface of the optical member sheet and the optical display component,
6. The optical display device production system according to claim 5 , wherein the cutting portion is set along the outer peripheral edge.

Images