JP6084274B2 - MEMS package structure and manufacturing method thereof - Google Patents

Description

  The present invention relates to a package structure and a manufacturing method thereof, and more particularly, to a microelectromechanical system (MEMS) package structure and a manufacturing method thereof.

  A MEMS is a microelectromechanical device manufactured in a micro-package structure, and its manufacturing technology is very similar to that of integrated circuit (IC). However, interactions such as mechanics, optics or magnetism between the MEMS device and the surrounding environment are larger than the interaction of conventional ICs.

  A MEMS device can include micro-sized electromechanical components (eg, switches, mirrors, capacitors, accelerometers, sensors, capacitance sensors or actuators, etc.) and integrate the MEMS device into an IC in a single block fashion. Thus, the insertion loss and the electrical separation effect of the entire solid-state element can be significantly corrected. However, in the macro world of the entire package structure, MEMS devices are very fragile and can be impacted and fail at any time by slight static electricity or surface tension. Therefore, in order to protect the MEMS device from contamination and damage, the MEMS device integrated into the IC by a single block method is currently sealed with a glue in the space between the base and the cover. However, adhesives are prone to cracking and outgassing in high-temperature and high-humidity environments, so when used for a long time in high-temperature and high-humidity environments, moisture easily penetrates into the space between the base and the cover. Affects the normal operation of the MEMS device.

  Accordingly, the present invention provides a MEMS package structure having better moisture resistance characteristics.

  Accordingly, the present invention provides a method for manufacturing the MEMS package structure described above.

  The present invention provides a MEMS package structure that includes a base, a MEMS device, a first cover, a second cover, and a glass frit. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covers the MEMS device. The second cover is disposed on the base and covers the recess. The glass frit is disposed between the base and the second cover and seals the recess.

  In one embodiment of the invention, the coefficients of thermal expansion of the base, glass frit and second cover are substantially similar.

  The present invention provides a MEMS package structure including a base, a MEMS device, a first cover, a second cover, a first metal frame, and a first sealing medium. The base includes a recess. The MEMS device is disposed in the recess. The first cover is disposed in the recess and covers the MEMS device. The first metal frame is disposed around the second cover, and the second cover and the first metal frame are disposed on the base together to cover the recess. The first sealing material is disposed between the first metal frame and the base.

  In one embodiment of the invention, the first metal frame is fixed directly to the second cover.

  In one embodiment of the present invention, the first metal frame is fixed to the second cover via a glass frit.

  In one embodiment of the invention, the thermal expansion coefficients of the first metal frame, the glass frit and the second cover are substantially similar.

  In one embodiment of the present invention, the MEMS package structure further includes a second metal frame and a second encapsulant. The second metal frame is disposed between the first metal frame and the first sealing material. The second sealing material is disposed between the first metal frame and the second metal frame.

  The present invention provides a base including a recess, disposing a MEMS device covered with a first cover in the recess, disposing a glass frit on the second cover or base, A MEMS cover structure including disposing a second cover covering the recess and disposing the glass frit between the base and the second cover and melting the glass frit to seal the recess. Provide a method.

  In one embodiment of the invention, prior to the melting step, the manufacturing method further includes heating the glass frit to an intermediate temperature that is lower than the melting temperature of the glass frit.

  In one embodiment of the invention, the coefficients of thermal expansion of the base, glass frit and second cover are substantially similar.

  The present invention provides a base including a recess, disposing a MEMS device covered with a first cover in the recess, a second cover, and a first metal frame around the second cover. Arranging the first sealing material on the base or the first metal frame, and arranging the second cover and the first metal frame covering the recess on the base together to form the first metal A method for manufacturing a MEMS package structure is provided that includes disposing a first encapsulant between a frame and a base and heating the first encapsulant to seal the first metal frame and the base.

  In one embodiment of the present invention, in the step of disposing the first metal frame around the second cover, the manufacturing method further heats the second cover to the softening temperature of the second cover, and the second cover is then heated to the first metal frame. And fixing the second cover.

  In one embodiment of the invention, prior to the step of heating to the softening temperature of the second cover, the manufacturing method further comprises performing a high temperature oxidation process of the first metal frame.

  In one embodiment of the present invention, in the step of disposing the first metal frame around the second cover, the manufacturing method further includes disposing a glass frit between the first metal frame and the second cover; Melting the glass frit to secure the first metal frame to the second cover.

  In one embodiment of the invention, the thermal expansion coefficients of the first metal frame, the glass frit and the second cover are substantially similar.

  In one embodiment of the present invention, the manufacturing method further includes disposing a second metal frame on the first sealing material, and disposing the second sealing material on the second metal frame, Disposing a second sealing material between the first metal frame and the second metal frame and heating the second sealing material to seal the first metal frame and the second metal frame.

  As described above, the MEMS package structure of the present invention applies the first cover that covers the MEMS device, protects the MEMS device from contamination, and provides the first moisture-proof protection for the MEMS device. In addition, the MEMS device and the first cover are disposed in the recess of the base, and the second cover is sealed to the base via the glass frit, or the first around the second cover via the first sealing material. By fixing the metal frame to the base, the second cover, the combination of the base and the glass frit, or the combination of the second cover, the base, the first metal frame, and the first sealing material, the second to the MEMS device. Provide moisture protection. Conventionally, since the second cover is bonded to the base with an adhesive, there is a possibility that the moisture permeation problem and the gas release problem of the adhesive may occur in a high temperature environment. In the MEMS package structure of the present invention, the adhesive is replaced with the glass frit, the first metal frame and the first sealing material around the second cover, thereby improving the sealing performance of the recess and preventing the gas emission problem. it can. Therefore, the MEMS package structure of the present invention provides better moisture resistance characteristics. Moreover, the manufacturing method of the MEMS package structure mentioned above is further provided.

  In order to make the above and other objects, features and advantages of the present invention more comprehensible, several embodiments accompanied with figures are described below.

1 is a schematic view of a method for manufacturing a MEMS package structure according to one embodiment of the present invention. 1 is a schematic view of a method for manufacturing a MEMS package structure according to one embodiment of the present invention. 1 is a schematic view of a method for manufacturing a MEMS package structure according to one embodiment of the present invention. 1 is a schematic view of a method for manufacturing a MEMS package structure according to one embodiment of the present invention. It is the schematic of the manufacturing method of the MEMS package structure concerning another embodiment of this invention. It is the schematic of the manufacturing method of the MEMS package structure concerning another embodiment of this invention. It is the schematic of the manufacturing method of the MEMS package structure concerning another embodiment of this invention. It is the schematic of the manufacturing method of the MEMS package structure concerning another embodiment of this invention. It is the schematic of the manufacturing method of the MEMS package structure concerning another embodiment of this invention. FIG. 2 d ′ is a schematic view of a method for manufacturing a MEMS package structure according to another embodiment of the present invention. FIG. 2e 'is a schematic view of a method of manufacturing a MEMS package structure according to another embodiment of the present invention. FIG. 2d ″ is a schematic view of a method for manufacturing a MEMS package structure according to another embodiment of the present invention. FIG. 2e '' is a schematic view of a method for manufacturing a MEMS package structure according to another embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings and the related description, the same reference numerals are used for the same or similar components.

  FIG. 1A to FIG. 1D are schematic views of a method for manufacturing a MEMS package structure according to one embodiment of the present invention. The manufacturing method of the MEMS package structure includes the following steps. Referring to FIG. 1 (a), a base 110 including a recess 112 is provided. In the present embodiment, the material of the base 110 is ceramic, but the material of the base 110 is not limited to this.

  Referring to FIG. 1B, at least one MEMS device 120 covered with the first cover 130 is disposed in the recess 112 of the base 110. The first cover 130 covering the top of the MEMS device 120 can protect the MEMS device 120 from contamination (for example, particles). More specifically, in the present embodiment, the MEMS device 120 is disposed on the active surface 117 of the chip 115. The chip 115 is an optical sensor chip such as a charge couple device (CCD) or a complementary metal oxide semiconductor (CMOS), and the active surface 117 is, for example, a photosensitive region. However, the types of the chip 115 and the active surface 117 are not limited to this. In the present embodiment, the MEMS device 120 is a mirror, but the MEMS device 120 may be a switch, a capacitor, an accelerometer, a sensor, or an actuator, and the type of the MEMS device 120 is not limited thereto.

  Since the first cover 130 is transparent, external light rays (not shown) can pass through the first cover 130 to the MEMS device 120 and the active surface 117 of the chip 115. The first cover 130 is a glass cover, but the material of the first cover 130 is not limited to this. As shown in FIG. 1B, the first cover 130 covers the chip 115 and includes a cavity 130, and the MEMS device 120 is in the cavity 130. The cavity 132 has an upper surface 132 a on the opposite side of the active surface 117. In this embodiment, the distance D between the upper surface 132a and the active surface 117 is larger than the mirror tilt height, for example, 10 μm, and the height H of the peripheral gap between the chip 115 and the first cover 130 is About 1 μm to 10 μm. That is, the height H of the peripheral gap between the chip 115 and the first cover 130 is smaller than the distance D between the upper surface 132a and the active surface 117.

  A sealant 134 is disposed in a peripheral gap between the chip 115 and the first cover 130 to seal the cavity 132. As shown in FIG. 1B, the thickness of the sealing material 134 is smaller than the height of the MEMS device 120. The thickness of the sealing material 134 is limited by the height H of the peripheral gap between the chip 115 and the first cover 130. Therefore, the thickness of the sealing material 134 varies between about 1 μm and 10 μm depending on the height H of the peripheral gap between the chip 115 and the first cover 130.

  It should be mentioned that the sealing material 134 is an organic polymer compound such as an epoxy resin. The molecular structure of organic polymer compounds has many hydrophilic groups, so it has the ability to block external contamination and moisture, but the molecular structure completely prevents the reaction between the hydrophilic groups and moisture. I can't. Therefore, in the present embodiment, the moisture barrier 136 is coated around the chip 115, the seal material 134, and the first cover 130, thereby effectively preventing the reaction between the hydrophilic group of the seal material 134 and the moisture. Furthermore, the impermeability of the cavity 132 is improved. In this way, the MEMS device 120 can operate normally in the MEMS package structure 100.

  In the present embodiment, the moisture barrier 136 can be formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD) technology, but the method of forming the moisture barrier 136 is not limited to this. . In addition, the material of the moisture barrier 136 is an inorganic heat insulating material having higher compression, such as silica, silicon nitride, silicon oxynitride, or other nitrogen, oxygen and oxynitride which do not contain a hydrophilic group. The water resistance of the barrier 136 is stronger than the water resistance of the sealing material 134. That is, since the inorganic heat insulating material does not have a hydrophilic group and does not react with moisture, the moisture can be effectively blocked. As such, the moisture barrier 136 can provide double protection and reduce the moisture penetration potential.

  It should be noted that the configuration of the MEMS device 120 and the first cover 130 in FIG. 1B is one of the embodiments, and therefore the configuration of the MEMS device 120 and the first cover 130 is limited to this. Not.

  Then, referring to FIG. 1C, the glass frit 150 is disposed on the second cover 140. The second cover 140 is a glass cover, and the glass frit 150 is applied to the bottom surface of the second cover 140. In the present embodiment, the glass frit 150 has a ring shape, but the shape of the glass frit 150 is not limited to this. The glass frit 150 is used for fixing the second cover 140 and the base 110 and sealing the recess 112. Due to the material properties of the glass frit 150, the glass frit 150 can provide a better moisture barrier effect. In this embodiment, in order to reduce the possibility of cracking of the glass frit 150 in a high temperature environment, the gas organic additive in the glass frit 150 must be removed. In this embodiment, the gas organic additive in the glass frit 150 is removed by performing a gas release procedure by two-stage heating. First, the glass frit 150 is heated to an intermediate temperature lower than the melting temperature of the glass frit 150. In this step, the glass frit 150 is not yet completely melted at this point. Thereafter, the glass frit 150 is heated to the melting temperature and completely melted to form the glass frit 150 containing no gas. In another embodiment, the glass frit 150 may be disposed on the base 110.

  Referring to FIG. 1D, the second cover 140 that covers the recess 112 is disposed on the base 110, and the glass frit 150 is disposed between the base 110 and the second cover 140. Then, the glass frit 150 is heated to the melting temperature, the recess is sealed, and the MEMS package structure 100 is formed. In the present embodiment, the glass frit 150 is melted by a laser, but the heating method of the glass frit 150 is not limited to this. It should be noted that the coefficients of thermal expansion of the base 110, the glass frit 150, and the second cover 140 are substantially similar. In this manner, even if the MEMS package structure 100 is slightly deformed in a high temperature environment, the glass frit 150 is not easily cracked, so that the outside gas and vapor can be blocked by the glass frit 150.

  As shown in FIG. 1D, the MEMS package structure 100 includes a base 110, a MEMS device 120, a first cover 130, a second cover 140, and a glass frit 150. The base 112 includes a recess 112. The MEMS device 120 is disposed in the recess 112. The first cover 130 is disposed in the recess 112 and covers the MEMS device 120. The second cover 140 is disposed on the base 110 and covers the recess 112. The glass frit 150 is disposed between the base 110 and the second cover 140 and seals the recess 112.

  The MEMS package structure 100 applies a first cover 130 covering the MEMS device 120 to protect the MEMS device 120 from contamination and provide first moisture protection for the MEMS device 120. Further, since the MEMS device 120 and the first cover 130 are disposed in the recess 112 of the base 110 and the second cover 140 is sealed to the base 110 via the glass frit 150, the second cover 140, the glass frit The configuration of 150 and base 110 can provide second moisture protection for the MEMS package structure 100.

  2A to 2E are schematic views of a method for manufacturing a MEMS package structure according to another embodiment of the present invention. Another method of manufacturing a MEMS package structure is further provided. The manufacturing method includes the following steps.

  In FIG. 2 (a), a base 210 including a recess 212 is provided. In the present embodiment, the material of the base 210 is ceramic, but the material of the base 210 is not limited to this. 2B, the first sealing material 280 is disposed on the base 210, and the second metal frame 290 is disposed on the first sealing material 280. Then, the first sealing material 280 is heated to fix the second metal frame 290 and the base 210. In the present embodiment, the first sealing material 280 may be an inorganic material such as metal, metal alloy, metal compound (for example, metal or metalloid oxide), or glass frit. More specifically, the material of the first sealing material 280 may be AgCu, AuSn, BiSn, InAg, or glass frit. Although the melting point of the first sealing material 280 varies depending on the material, the melting point of the first sealing material 280 is generally about 160 ° C. to about 400 ° C. In the present embodiment, the material of the second metal frame 290 is, for example, a Kovar alloy. Kovar alloys are made of nickel, copper, cobalt, iron and manganese. Of course, the material of the second metal frame 290 is not limited to this.

  Referring to FIG. 2C, at least one MEMS device 220 covered with the first cover 230 is disposed in the recess 212. Since the types and configurations of the MEMS device 220 and the first cover 230 of the present embodiment are similar to the types and configurations of the MEMS device 120 and the first cover 130 of the above-described embodiment, the MEMS device 220 and the first cover are here. 230 will not be described in detail. Of course, in another embodiment, the types and configurations of the MEMS device 220 and the first cover 230 may be different from the types and configurations of the MEMS device 120 and the first cover 130 of FIG.

  Referring to FIG. 2D, the second cover 240 is provided, and the first metal frame 270 is disposed around the second cover 240. In the present embodiment, the material of the first metal frame 270 is, for example, a Kovar alloy. Kovar alloys are made of nickel, copper, cobalt, iron and manganese. Of course, the material of the first metal frame 270 is not limited to this. In the present embodiment, the first metal frame 270 is directly fixed around the second cover 240 by high temperature melting. Prior to fixing the first metal frame 270 to the second cover 240, the first metal frame 270 may first be subjected to a high temperature oxidation process. In the high temperature oxidation process, the first metal frame 270 is heated to about 600 ° C. Since the high temperature oxidation process of the first metal frame 270 improves the subsequent melting of the first metal frame 270 and the second cover 240, the first metal frame 270 and the second cover 240 can be sealed and fixed. .

  After the high temperature oxidation process, the first metal frame 270 and the second cover 240 are heated to the softening temperature of the second cover 240 to fix the second cover 240 to the first metal frame 270. In this embodiment, the first metal frame 270 and the second cover 240 are heated to about 900 ° C., and the second cover 240 is melted and welded to the first metal frame 270. Of course, the temperature of the softening temperature of the second cover 240 is not limited to this.

  After the fixing step, the transmittance of the second cover 240 may decrease due to the molecular arrangement of the second cover 240 changing in a high temperature environment. Therefore, the upper surface and the bottom surface of the second cover 240 may be polished to increase the transmittance. Thereafter, the upper surface and the bottom surface of the second cover 240 may be coated with a black pattern (optical Cr pattern, AR, etc., not shown) to shield the light.

  Then, referring to FIG. 2 (e), by disposing the second sealing material 285 on the second metal frame 290 and disposing the first metal frame 270 on the second sealing material 285, The second cover 240 and the first metal frame 270 may be combined and fixed to the base 210 to cover the recess 212. Specifically, in the present embodiment, since the thickness of the first metal frame 270 is smaller than the thickness of the second cover 240, the first metal frame 270 is disposed directly on the first sealing material 280. In this case, the lower part of the second cover 240 is located in the recess 212 and hits the first cover 230. Therefore, in the present embodiment, the second metal frame 290 is disposed on the first sealing material 280, the second sealing material 285 is disposed on the first sealing material 290, and the first metal frame 270 is disposed. It arrange | positions on the 2nd sealing material 285. FIG. Since the second metal frame 290 can be regarded as an extension of the first metal frame 270, a space is generated between the first cover 230 and the second cover 240. Thereafter, the second sealing material 285 is heated, and the first metal frame 270 and the second metal frame 290 are sealed to seal the recess 212, and then the MEMS package structure 200 is formed.

  It should be noted that the order of the steps of placing the first encapsulant 280 and the second metal frame 290 on the base 210 is before the step of fixing the first metal frame 270 to the base 210, in particular. It is not limited. In another embodiment, the second sealing material 285, the second metal frame 290, and the first sealing material 280 may be sequentially disposed on the bottom surface of the first metal frame 270, and then the second cover 240. The first metal frame 270, the second sealing material 285, the second metal frame 290, and the first sealing material 280 are disposed on the base 210 as a whole.

  It should also be noted that the thermal expansion coefficients of the base 210, the first sealing material 280, and the second metal frame 290 are substantially similar to maintain the sealing performance of the recess 212, and the first metal frame 270 The thermal expansion coefficients of the second sealing material 285 and the second metal frame 290 are substantially similar.

  As shown in FIG. 2E, the MEMS package structure 200 includes a base 210, a MEMS device 220, a first cover 230, a second cover 240, a first metal frame 270, and a first sealing material 280. And a second metal frame 290 and a second sealing material 285. The base 210 includes a recess 212. The MEMS device 220 is disposed in the recess 212. The first cover 230 is disposed in the recess 212 and covers the MEMS device 220. The first metal frame 270 is disposed around the second cover 240, and the first metal frame 270 is directly fixed to the second cover 240. The first sealing material 280 is disposed on the base 210. The second metal frame 290 is disposed on the first sealing material 280. The second sealing material 285 is disposed on the second metal frame 290. The second cover 240 and the first metal frame 270 are collectively disposed on the second sealing material 285 and cover the recess 212.

  The MEMS package structure 200 applies a first cover 230 that covers the MEMS device 220 to protect the MEMS device 220 from contamination and provide first moisture protection to the MEMS device 220. Further, the MEMS device 220 and the first cover 230 are disposed in the recess 212 of the base 210, and the first metal frame 270 around the second cover 240 includes the first sealing material 280, the second metal frame 290, and It is sealed to the base 210 via the second sealing material 285. In the present embodiment, the second cover 240, the base 210, the first metal frame 270, the first sealing material 280, the second metal frame 290, and the second sealing material 285 are configured to be second with respect to the MEMS device 220. Provide moisture protection.

  Of course, the type of the first metal frame 270 disposed around the second cover 240 is not limited thereto. 2 (d ') to 2 (e') are schematic views of a method for manufacturing a MEMS package structure according to another embodiment of the present invention. In the present embodiment, the same numbers are used for elements similar to the above-described embodiments. Referring to FIGS. 2 (d ′) and 2 (e ′), the main differences between the MEMS package structure 200a of FIG. 2 (e ′) and the MEMS package structure 200 of FIG. In the form, the first metal frame 270 is not in direct contact with the second cover 240. More specifically, the glass frit 250 is disposed between the first metal frame 270 and the second cover 240. That is, the first metal frame 270 is fixed to the second cover 240 by the glass frit 250. In the present embodiment, the glass frit 250 has a ring shape. In the fixing step of the first metal frame 270 and the second cover 240, the glass frit 250 is disposed between the first metal frame 270 and the second cover 240, and then the glass frit 250 is heated and melted. The metal frame 270 is fixed to the second cover 240. The heating temperature of the glass frit 250 is about 350 ° C. to 550 ° C. Further, since the thermal expansion coefficients of the first metal frame 270, the glass frit 250, and the second cover 240 are substantially similar, the possibility of cracking of the glass frit 250 at a high temperature can be reduced.

  FIG. 2 (d ″) to FIG. 2 (e ″) are schematic views of a method for manufacturing a MEMS package structure according to another embodiment of the present invention. In the present embodiment, the same numbers are used for elements similar to the above-described embodiments. Referring to FIG. 2 (d ″) and FIG. 2 (e ″), the main difference between the MEMS package structure 200b of FIG. 2 (e ″) and the MEMS package structure 200 of FIG. That is, the metal frame 270b is fixed to the base 210 only by the first sealing material 280. In the present embodiment, the thickness of at least a part of the first metal frame 270b is smaller than the thickness of the second cover 240. Therefore, when the first metal frame 270b is disposed directly on the first sealing material 280, the second cover 240 does not contact the first cover 230. Therefore, the MEMS package structure 200b includes the second metal frame and the second metal frame 270b. 2 Since the space between the first cover 230 and the second cover 240 can be increased without the need for a sealing material, the MEMS package structure 200b is described above. It can be omitted second metal frame and the second sealing member mentioned in facilities form.

  As described above, the MEMS package structure of the present invention applies the first cover that covers the MEMS device, protects the MEMS device from contamination, and provides the first moisture-proof protection for the MEMS device. In addition, the MEMS device and the first cover are disposed in the recess of the base, and the second cover is sealed to the base via the glass frit, or the first around the second cover via the first sealing material. By fixing the metal frame to the base, the second cover, the combination of the base and the glass frit, or the combination of the second cover, the base, the first metal frame, and the first sealing material, the second to the MEMS device. Provide moisture protection. Conventionally, since the second cover is bonded to the base with an adhesive, there is a possibility that the moisture permeation problem and the gas release problem of the adhesive may occur in a high temperature environment. In the MEMS package structure of the present invention, the adhesive is replaced with the glass frit, the first metal frame and the first sealing material around the second cover, thereby improving the sealing performance of the recess and preventing the gas emission problem. it can. Therefore, the MEMS package structure of the present invention provides better moisture resistance characteristics. Moreover, the manufacturing method of the MEMS package structure mentioned above is further provided.

  As described above, the present invention has been disclosed by the embodiments. However, the present invention is not intended to limit the present invention, and is within the scope of the technical idea of the present invention so that those skilled in the art can easily understand. Therefore, the scope of patent protection should be defined based on the scope of claims and the equivalent area.

  The present invention provides a MEMS package structure and a manufacturing method thereof. The MEMS package structure provides better moisture resistance properties.

D Distance H Height 100, 200, 200a, 200b MEMS package structure 110, 210 Base 112, 212 Recess 115 Chip 117 Active surface 120, 220 MEMS device 130, 230 First cover 132 Cavity 132a Top surface 134 Sealing material 136 Moisture barrier 140 , 240 Second cover 150 Glass frit 270, 270b First metal frame 280 First sealing material 285 Second sealing material 290 Second metal frame

Claims (9)

A base including a recess,
A MEMS device disposed in the recess;
A first cover disposed in the recess and covering the MEMS device;
A second cover;
A first metal frame disposed around the second cover, disposed on the base together with the second cover, and covering the recess;
A first encapsulant disposed between the first metal frame and the base;
A second metal frame disposed between the first metal frame and the first sealing material;
A MEMS package structure comprising: a second encapsulant disposed between the first metal frame and the second metal frame . The MEMS package structure according to claim 1 , wherein the first metal frame is directly fixed to the second cover. The MEMS package structure according to claim 1 or 2 , wherein the first metal frame is fixed to the second cover through a glass frit. The MEMS package structure according to claim 3 , wherein coefficients of thermal expansion of the first metal frame, the glass frit, and the second cover are substantially similar. Providing a base including a recess;
Disposing a MEMS device covered with a first cover in the recess;
Providing a second cover, and disposing a first metal frame around the second cover;
Disposing a first encapsulant on the base or the first metal frame;
Arranging the second cover and the first metal frame covering the recess on the base together, and arranging the first sealing material between the first metal frame and the base;
Heating the first sealing material to seal the first metal frame and the base;
Disposing a second metal frame on the first sealing material;
Disposing a second sealing material on the second metal frame and disposing the second sealing material between the first metal frame and the second metal frame;
Heating the second sealing material to seal the first metal frame and the second metal frame;
A method for manufacturing a MEMS package structure including: In the step of disposing the first metal frame around the second cover,
Heating to the softening temperature of the second cover to fix the second cover to the first metal frame;
Polishing the second cover;
The method for manufacturing a MEMS package structure according to claim 5 , further comprising: Before the step of heating to the softening temperature of the second cover,
The method of claim 6 , further comprising performing a high temperature oxidation process of the first metal frame. In the step of disposing the first metal frame around the second cover,
Disposing a glass frit between the first metal frame and the second cover;
Melting the glass frit and fixing the first metal frame to the second cover;
Method for manufacturing a MEMS package structure according to claim 5, 6 or 7, further comprising a. 9. The method of manufacturing a MEMS package structure according to claim 8 , wherein coefficients of thermal expansion of the first metal frame, the glass frit, and the second cover are substantially similar.

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