JP6054030B2 - 金属錯体量子結晶の作成方法 - Google Patents
金属錯体量子結晶の作成方法 Download PDFInfo
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- JP6054030B2 JP6054030B2 JP2011282474A JP2011282474A JP6054030B2 JP 6054030 B2 JP6054030 B2 JP 6054030B2 JP 2011282474 A JP2011282474 A JP 2011282474A JP 2011282474 A JP2011282474 A JP 2011282474A JP 6054030 B2 JP6054030 B2 JP 6054030B2
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Description
(log βi)が8以下の場合、15以上の場合は電極反応速度が早すぎたり、遅すぎたりするので、基板側の電極電位等の調整により電極反応速度を制御するのがよい。
定度定数から電極反応の標準電極電位が得られる。
(ここで E゜は標準電極電位、Rは気体定数、Tは絶対温度、Zはイオン価、Fはファラデー定数を表す。)
従って、電極電位を考慮して担体金属を選択し、両者の電極電位が調和するように制御することにより、金属錯体水溶液中での電極反応を制御してナノ金属クラスタと金属錯体の量子結晶を担体金属上に析出させることができる。
図中、o-TSA、EAは其々オルトチオサルチル酸、エタノールアミンを示す。
Claims (6)
- 金、銀、銅又は白金から選ばれる金属錯塩として安定度定数(logβi)が8以上の錯塩を選択し、金属錯体濃度500〜2000ppmの希薄金属錯体水溶液を調製する一方、担体金属の電極電位を金属錯体より卑なる電位となし、希薄金属錯体水溶液に担体金属を接触させ、両者の電極電位差により、該希薄金属錯体水溶液より少なくとも金属錯体を担体金属上に量子結晶として析出させ、その後前記水溶液と担体金属との接触を解いて金属錯体の量子結晶の析出を停止させることを特徴とする表面プラズモン増強効果を有する金属錯体量子結晶の作成方法。
- 銀錯体量子結晶を作成する方法であって、500〜2000ppmの希薄銀錯体水溶液を用いる請求項1記載の方法。
- 銀錯塩として安定度定数(logβi)が8以上を選択し、希薄水溶液を調製する請求項2記載の方法。
- 銀錯体水溶液がハロゲン化銀と銀錯化剤との反応により形成される請求項2記載の方法。
- 銀錯化剤が、チオ硫酸塩、チオシアン酸塩、亜硫酸塩、チオ尿素、ヨウ化カリ、チオサリチル酸塩、チオシアヌル酸塩からなる群から選ばれる請求項4記載の方法。
- 担体金属が銅合金である請求項2記載の方法。
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011282474A JP6054030B2 (ja) | 2011-12-23 | 2011-12-23 | 金属錯体量子結晶の作成方法 |
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| JP2011282474A JP6054030B2 (ja) | 2011-12-23 | 2011-12-23 | 金属錯体量子結晶の作成方法 |
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| JP2013133475A JP2013133475A (ja) | 2013-07-08 |
| JP6054030B2 true JP6054030B2 (ja) | 2016-12-27 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6294614B2 (ja) * | 2013-05-08 | 2018-03-14 | 有限会社マイテック | 癌関連物質の定量方法 |
| SMT202200128T1 (it) | 2014-05-08 | 2022-05-12 | Mytech Co Ltd | Chip plasmonico, e procedimenti di diagnosi di malattie cancerose utilizzanti rispettivamente immagini di fluorescenza e spettroscopia raman |
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| JPS5415431A (en) * | 1977-07-06 | 1979-02-05 | Hitachi Ltd | Method of forming highly adehsive thin silver film |
| JPH06240463A (ja) * | 1993-02-22 | 1994-08-30 | Mitsubishi Paper Mills Ltd | 金属微粉末の無電解銀鍍金方法 |
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