JP6049076B2 - 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 - Google Patents
感光性樹脂組成物、レジスト積層体及びそれらの硬化物 Download PDFInfo
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- JP6049076B2 JP6049076B2 JP2013089586A JP2013089586A JP6049076B2 JP 6049076 B2 JP6049076 B2 JP 6049076B2 JP 2013089586 A JP2013089586 A JP 2013089586A JP 2013089586 A JP2013089586 A JP 2013089586A JP 6049076 B2 JP6049076 B2 JP 6049076B2
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- epoxy
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013089586A JP6049076B2 (ja) | 2012-11-22 | 2013-04-22 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
| TW102142474A TWI595044B (zh) | 2012-11-22 | 2013-11-21 | 感光性樹脂組成物、阻劑層合體及彼等之硬化物 |
| PCT/JP2013/081379 WO2014080977A1 (fr) | 2012-11-22 | 2013-11-21 | Composition de résine photosensible, stratifié de résine photosensible et articles obtenus par durcissement de ceux-ci (10) |
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| JP2012256124 | 2012-11-22 | ||
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| JP2013089586A JP6049076B2 (ja) | 2012-11-22 | 2013-04-22 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
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| JP2014123096A JP2014123096A (ja) | 2014-07-03 |
| JP6049076B2 true JP6049076B2 (ja) | 2016-12-21 |
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| JP (1) | JP6049076B2 (fr) |
| TW (1) | TWI595044B (fr) |
| WO (1) | WO2014080977A1 (fr) |
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| JP5901070B2 (ja) | 2012-10-26 | 2016-04-06 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
| JP5967824B2 (ja) * | 2012-10-26 | 2016-08-10 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
| JP6066413B2 (ja) | 2012-11-22 | 2017-01-25 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
| JP5939964B2 (ja) | 2012-11-22 | 2016-06-29 | 日本化薬株式会社 | 感光性樹脂組成物、レジスト積層体及びそれらの硬化物 |
| KR102357446B1 (ko) * | 2014-06-13 | 2022-01-28 | 닛뽄 가야쿠 가부시키가이샤 | 감광성 수지 조성물, 레지스트 적층체 및 이들의 경화물 （１１） |
| US9862668B2 (en) * | 2014-11-24 | 2018-01-09 | Samsung Sdi Co., Ltd. | Monomer, polymer, organic layer composition, organic layer, and method of forming patterns |
| JP6902826B2 (ja) * | 2016-01-15 | 2021-07-14 | 旭化成株式会社 | 感光性フィルム |
| TW201936688A (zh) * | 2018-02-08 | 2019-09-16 | 日商日本化藥股份有限公司 | 感光性樹脂組成物及其硬化物 |
| JP2019158949A (ja) * | 2018-03-08 | 2019-09-19 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| KR102087092B1 (ko) * | 2018-04-23 | 2020-03-11 | 주식회사 케이씨씨 | 도료 조성물 |
| JP7259317B2 (ja) * | 2018-12-21 | 2023-04-18 | 住友ベークライト株式会社 | ネガ型感光性樹脂組成物、それを用いた半導体装置および電子機器 |
| JP7247667B2 (ja) * | 2019-03-11 | 2023-03-29 | Ｕｂｅ株式会社 | フォトレジスト用フェノール樹脂組成物及びフォトレジスト組成物 |
| CN118435120A (zh) * | 2021-12-20 | 2024-08-02 | 东京应化工业株式会社 | 光固性组合物及图案形成方法 |
Family Cites Families (8)
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| JP3976158B2 (ja) * | 1998-10-20 | 2007-09-12 | 日本化薬株式会社 | カチオン硬化性レジストインキ組成物及びその硬化物 |
| JP2008026667A (ja) * | 2006-07-21 | 2008-02-07 | Nippon Kayaku Co Ltd | 永久レジスト組成物、及びレジスト積層体 |
| JP5072101B2 (ja) * | 2008-04-25 | 2012-11-14 | 日本化薬株式会社 | Ｍｅｍｓ用感光性樹脂組成物及びその硬化物 |
| JP2010271401A (ja) * | 2009-05-19 | 2010-12-02 | Nippon Kayaku Co Ltd | レジスト組成物 |
| JP2011093966A (ja) * | 2009-10-27 | 2011-05-12 | Panasonic Electric Works Co Ltd | 透明フィルム |
| WO2011115159A1 (fr) * | 2010-03-19 | 2011-09-22 | 積水化学工業株式会社 | Composition polymérisable, film adhésif pour la découpe de puces semi-conductrices, structure de connexion et méthode de production de bandes semiconductrices avec couche cohésive/adhésive |
| WO2012008472A1 (fr) * | 2010-07-14 | 2012-01-19 | 日本化薬株式会社 | Composition de résine photosensible et produit durci correspondant |
| US9005740B2 (en) * | 2011-03-31 | 2015-04-14 | Panasonic Intellectual Property Management Co., Ltd. | Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same |
-
2013
- 2013-04-22 JP JP2013089586A patent/JP6049076B2/ja not_active Expired - Fee Related
- 2013-11-21 WO PCT/JP2013/081379 patent/WO2014080977A1/fr not_active Ceased
- 2013-11-21 TW TW102142474A patent/TWI595044B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201425452A (zh) | 2014-07-01 |
| JP2014123096A (ja) | 2014-07-03 |
| WO2014080977A1 (fr) | 2014-05-30 |
| TWI595044B (zh) | 2017-08-11 |
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