JP5818441B2 - Manufacturing method of organic EL element for illumination - Google Patents

Description

  The present invention relates to a large-area organic EL element suitable for illumination and a manufacturing method thereof, and more particularly, to an organic EL element in which an insulating film is formed by patterning and a manufacturing method for simply patterning.

  The organic light emitting device emits light from an organic light emitting layer sandwiched between a first electrode and a second electrode by applying a voltage between the first electrode and the second electrode. As an organic light emitting element, an organic EL (electroluminescence) element has already been used for a flat panel display represented by a liquid crystal display. Since a flat panel display has a large number of pixels, one pixel is fine. Similarly, a display using an organic EL element has fine pixels, and the organic EL element is patterned using a fine vapor deposition mask. In recent years, organic EL elements are being used for solid-state lighting.

Solid-state lighting is a product that requires higher brightness than a display. For example, the luminance required for the display is about 1,000 cd / m ² , whereas the solid-state lighting requires a luminance of about 3,000 to 5,000 cd / m ² . Therefore, it is necessary to flow a large current value per unit area to each electrode.
In a display using an organic EL element, the size of one light emitting element is less than 1 mm square. On the other hand, solid state illumination using organic EL elements requires a larger luminous flux than the display, and therefore one light emitting element is required to have a size of 100 mm square or more.

FIG. 7 shows a plan view of one light emitting element of a general organic EL element. In the final product, a sealing member is necessary to protect the organic EL element from the environment, but it is omitted in FIG.
One light emitting element of the organic EL element is formed by laminating a first electrode 2, an organic light emitting layer 3, and a second electrode 4 on a substrate 1. The first electrode (anode) 2 is patterned on the substrate 1 by photolithography. The organic light emitting layer 3 is laminated so as to intersect the first electrode 2. The second electrode 4 is stacked so as to intersect the organic light emitting layer 3 and the first electrode 2, and by applying a voltage between the first electrode 2 and the second electrode 4, the organic in the portion where the electrode intersects Only the light emitting layer 3 emits light.

  In the organic EL element, a transparent conductive film is required for either the first electrode 2 or the second electrode 4 in order to extract light. In general, the first electrode 2 is a transparent conductive film. As a material for the transparent conductive film, indium tin oxide (ITO) or the like is used. ITO has the smallest volume resistivity among the materials of the transparent conductive film, but the volume resistivity of ITO is significantly higher than that of metal.

  The organic light emitting layer 3 is an organic multilayer film made of an organic light emitting material. The organic light emitting layer 3 is usually formed by continuously depositing a vapor deposition mask having an opening on the substrate on which the first electrode 2 is formed, and then continuously depositing in a vacuum vapor deposition apparatus.

  The second electrode 4 is a metal film or the like, and is formed using a vacuum evaporation apparatus or a sputtering apparatus. The second electrode 4 is usually formed on the organic light emitting layer 3 after disposing a vapor deposition mask having an opening different from the vapor deposition mask used in the organic light emitting layer 3.

When an organic EL element having the above configuration is formed in a single large area and a large current is passed, it becomes dark due to a voltage drop. In the case of an organic EL element having a large current density and a large area, a phenomenon (brightness unevenness) occurs in which the peripheral part of the element becomes bright and the central part becomes dark. This is because the resistance value of the transparent conductive film is high and a voltage drop occurs due to a large current.
In order to reduce the voltage drop and improve the brightness uniformly, it is preferable to increase the film thickness of the transparent conductive film to about 100 to 500 nm to reduce the sheet resistance value. By doing so, luminance unevenness can be suppressed.

  However, when a thick transparent conductive film (first electrode) is formed by photolithography, the edge of the first electrode 2 has a steep cross section. FIG. 8 is a sectional view taken along line (a) of FIG. When the organic light emitting layer 3 (film thickness: about 100 to 300 nm) is stacked on the first electrode 2 having a sharp cross section, the organic light emitting layer 3 in a portion overlapping the edge of the first electrode 2 is thinned, pinholes, and Defects such as cracks are likely to occur. As a result, a leak current or a short circuit is likely to occur between the first electrode 2 and the second electrode 4, which causes a decrease in the quality and yield of the organic EL element.

In order to solve the above problems, organic EL elements such as Patent Document 1 and Patent Document 2 have been proposed.
In Patent Document 1, in order to obtain a light emitting region with high accuracy, an insulating layer is provided using a photolithography technique, and a pattern is formed with high accuracy. FIG. 9 shows an insulating layer patterning process. First, the substrate on which the transparent conductive film as the first electrode is patterned is washed and dried. Next, a photosensitive agent (photoresist) is applied onto the entire surface of the substrate by spin coating. The resist is semi-dried by prebaking, then patterned using an exposure mask, and exposed to ultraviolet rays by an exposure device to be exposed. Thereafter, development (etching and cleaning) is performed, and a high-precision insulating layer is patterned through post-baking.
Patent Document 2 discloses a method of forming an insulating layer by a roll printing method.

JP-A-3-250583 (Claim 1) JP 2005-310404 A (paragraphs [0013] and [0014])

  The patterning processing method described in Patent Document 1 is a high-precision processing technique generally used in semiconductors and flat panel displays, but requires a large-scale and expensive manufacturing facility. Further, in the method described in Patent Document 1, a photoresist is once applied to the entire surface and then patterned, so that a large amount of unnecessary resist material is consumed. The resist material and the exposure device are expensive, and the disposal of the developer is costly and troublesome. Therefore, there exists a problem that manufacturing cost becomes high. The above cost increase is acceptable for high value-added products such as displays, but is a very big problem for lighting products.

  In lighting products, even if the substrate size is the same, the dimensions of the element panel are various, and a manufacturing method suitable for a wide variety of products is required. In the method using the photolithography technique, it is necessary to replace and adjust the exposure mask. The roll printing method requires replacement and adjustment of the roll plate. For this reason, there is a problem in that it takes time to set up the product types with different element sizes and the productivity is lowered.

  FIG. 10 is a sectional view taken along line (b) of FIG. As shown in FIG. 10, the organic light emitting layer 3 is laminated on the flat portion of the first electrode 2 in the cross section of the line (b). In the organic EL element, since the second electrode 4 is formed only on a necessary portion, the second electrode deposition mask 8 is used on the organic light emitting layer 3 at the time of film formation. When the second electrode deposition mask 8 is covered, if the end portion is slightly deformed or twisted, the organic light emitting layer 3 is damaged and a defect is generated. Therefore, even when the organic light emitting layer 3 is laminated on the flat portion of the first electrode 4, a leakage current or a short circuit is likely to occur between the first electrode 2 and the second electrode 4, and the organic EL This causes a decrease in device quality and yield.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing an organic EL element for illumination at a low cost, which does not require expensive manufacturing equipment and can be applied to a wide variety of products. .

In order to solve the above-described problems, the present invention provides a first electrode, an organic light-emitting layer, and a second electrode that are sequentially stacked on a substrate, and the second electrode is the first electrode and the organic light-emitting when viewed in plan. A method of manufacturing an organic EL element arranged to intersect with a layer , wherein a plane of the first electrode and an edge of the second electrode are formed on a substrate on which the first electrode is formed in a plan view. An insulating film forming step for forming an insulating film by applying an insulating material to a predetermined portion corresponding to the overlapping region Y without patterning in a non-contact manner, and an evaporation mask having an opening after the insulating film forming step Is formed so as to include the first electrode and the region Y corresponding to the portion where the opening overlaps the second electrode, and an organic light emitting layer is formed on the first electrode by vacuum deposition After the step and the organic light emitting layer forming step, Using another deposition mask having different opening a mask, to provide a method of manufacturing a lighting an organic EL element and a second electrode forming step of forming a second electrode on the organic emission layer.

According to the above invention, the insulating film can be formed only in a necessary portion. Accordingly, it is not necessary to apply an extra insulating material, so that the material cost can be suppressed. In addition, since there is no process for removing the excessively applied insulating material such as pre-bake, exposure and development, which has been conventionally performed in photolithography, there is no need for an expensive exposure mask according to the cleaning agent, waste liquid treatment and pattern. Become. Further, since there is no step of removing the insulating material, the insulating film can be formed by performing only the step of curing the insulating material after applying the insulating material .
If the predetermined portion is a portion corresponding to the region Y where the surface of the first electrode and the edge of the second electrode overlap (intersect), the end of the vapor deposition mask used when forming the second electrode overlaps the non-light emitting element portion. The organic light emitting layer in the light emitting element portion can be prevented from being damaged. This makes it difficult for leakage currents or short circuits between the electrodes to occur, so that deterioration in quality and yield are suppressed.

1 aspect of the said invention WHEREIN: The said insulating film formation process arrange | positions a single nozzle at intervals with respect to the said 1st electrode, The said predetermined part of the board | substrate with which the said 1st electrode was formed from the said single nozzle wherein the step of intermittently ejecting an insulating material, by relatively moving the substrate or the single nozzle, and forming a continuous insulating layer on the predetermined portion, the including towards.

  According to one embodiment of the present invention, an insulating film can be formed only at a predetermined position without requiring expensive manufacturing equipment. Even if the element size is changed, the setup can be changed instantaneously by selecting and changing only the application position control program.

In the insulating film forming step, a predetermined portion corresponding to a region X where the edge of the first electrode and the surface of the second electrode overlap when viewed in plan on the substrate on which the first electrode is formed in, that to form a coated insulating film without patterning the insulating material in a non-contact manner.

If the predetermined portion is a portion corresponding to the region X where the edge of the first electrode and the surface of the second electrode overlap ( intersect ) , the organic light-emitting layer formed on the edge of the first electrode is thinned and pinholes are formed. Defects such as cracks and cracks can be suppressed. This makes it difficult for leakage currents and short circuits between the electrodes to occur, and further suppresses quality deterioration and yield reduction .

In addition, the present invention includes a light emitting element in which a first electrode, an organic light emitting layer, and a second electrode are sequentially laminated on a substrate, and when viewed in plan, the second electrode is the first electrode and the organic light emitting layer. Corresponding to a region Y where the surface of the first electrode and the edge of the second electrode overlap when viewed in plan on the substrate on which the first electrode is formed. Provided is an organic EL device for illumination comprising an organic insulating film formed by applying a predetermined portion of an organic insulating material without patterning to a predetermined portion.

According to the said invention, since an insulating film is formed only in a required part by a non-contact method, the patterning process and equipment become unnecessary, and the manufacturing cost can be suppressed .
When the predetermined portion is a portion corresponding to the region Y where the surface of the first electrode and the edge of the second electrode overlap (intersect), the end portion of the vapor deposition mask used when forming the second electrode overlaps the non-light emitting element portion. Therefore, it can be set as an organic light emitting layer with little damage in a light emitting element part. Thereby, the organic EL element for illumination is less likely to cause a leak current or a short circuit between the electrodes.

1 aspect of the said invention WHEREIN: The said organic insulating film is the area | region X which the edge part of the said 1st electrode and the surface of the said 2nd electrode overlap when it planarly views on the board | substrate with which the said 1st electrode was formed corresponding that are also formed in a predetermined portion.

When the predetermined portion is a portion corresponding to the region X where the edge of the first electrode and the surface of the second electrode overlap ( intersect ), it is possible to obtain an organic light emitting layer with a reduced thickness and fewer defects such as pinholes and cracks. . As a result, an organic EL element in which a leak current or a short circuit between the electrodes hardly occurs .

According to the present invention, by providing an insulating film at a predetermined portion, it is possible to prevent an organic light emitting layer from being damaged in the manufacturing process and to provide an organic EL device for illumination having an organic light emitting layer with few defects.
According to the present invention, since the insulating film is formed in a non-contact manner, the material cost of the insulating film can be suppressed. In addition, the cleaning agent and the waste liquid treatment are unnecessary, and the change of the element size can be instantaneously changed. Moreover, it is not necessary to use expensive manufacturing equipment. This makes it possible to manufacture an organic EL element for illumination that is cheaper and has fewer defects.

It is a schematic plan view which shows an example of one light emitting element of the organic EL element which concerns on 1st Embodiment. It is a figure explaining the manufacturing method of the organic EL element concerning a 1st embodiment. It is process drawing which shows an example of insulating film formation. It is a schematic diagram which shows an example of insulating film formation. It is a schematic plan view which shows an example of one light emitting element of the organic EL element which concerns on 2nd Embodiment. It is sectional drawing in the (b) line of FIG. It is a schematic plan view of one light emitting element of a general organic EL element. It is sectional drawing in the (a) line of FIG. It is process drawing of the conventional patterning process. It is sectional drawing in the (b) line of FIG.

  Hereinafter, an embodiment of an organic EL element for illumination and a method for producing the same according to the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 shows a schematic plan view of an example of one light emitting element of the organic EL element according to the present embodiment.
The organic EL device according to this embodiment includes a light emitting device in which a first electrode 2, an organic light emitting layer 3, and a second electrode 4 are sequentially stacked on a substrate 1. When the organic EL element is viewed in plan, the outer periphery of the surface of the first electrode 2 and the outer periphery of the surface of the second electrode 4 do not completely overlap, and the second electrode 4 and the first electrode 2 intersect. Arranged. An insulating film 5 is provided at a predetermined portion between the first electrode 2 and the organic light emitting layer 3 or between the substrate 1 and the organic light emitting layer 3. The predetermined portion is a portion corresponding to a region where the first electrode 2 and the second electrode 4 intersect. The intersecting region is a region where the edge of the first electrode 2 and the surface of the second electrode 4 intersect when the organic EL element is viewed in plan, or the surface of the first electrode 2 and the edge of the second electrode 4. May be the region where In the present embodiment, the predetermined portion is a portion corresponding to a region where the edge of the first electrode 2 and the surface of the second electrode 4 intersect. That is, the insulating film 5 is provided only on the patterning step portion of the first electrode 2 on which the organic light emitting layer 3 / second electrode 4 is laminated. Therefore, there are very few regions that require an insulating film, and the insulating film can be formed simply.

A portion laminated in the order of the first electrode 2 / organic light emitting layer 3 / second electrode 4 on the substrate 1 functions as a light emitting element. That is, by applying a voltage between the first electrode 2 and the second electrode 4, the organic light emitting layer 3 of the light emitting element emits light, and light is emitted to the outside through the substrate 1. In the present embodiment, the light emitting element has a size of 50 mm square to 300 mm square.
The portion laminated on the substrate 1 in the order of the first electrode 2 / insulating film 5 / organic light emitting layer 3 / second electrode 4 or insulating film 5 / organic light emitting layer 3 / second electrode 4 is a non-light emitting element portion. Is done.

The substrate 1 is a translucent substrate.
The first electrode 2 is a transparent film having conductivity. For example, a metal oxide film such as indium tin oxide (ITO), tin oxide (SnO ₂ ), or zinc oxide (ZnO) can be used. The thickness of the first electrode 2 is about 100 nm to 500 nm. The first electrode 2 may have a sharp cross section at the edge.
The organic light emitting layer 3 is an organic multilayer film made of an organic light emitting material. For example, the structure of the organic multilayer film is a hole injection layer / a hole transport layer / a light emitting layer / an electron transport layer / an electron injection layer. The total thickness of the organic light emitting layer 3 is about 100 nm to 300 nm.
The second electrode 4 is a conductive film. For example, the second electrode 4 is made of a metal film or metal oxide film of aluminum (Al) or silver (Ag).

  The insulating film 5 is an electrically insulating film. For example, a positive resist, a negative resist, or other curable resin can be used. The thickness of the insulating film 5 is sufficient if it has a withstand voltage against the applied voltage between the first electrode 2 and the second electrode 4, but the thickness of the first electrode 2 or more is desirable, and the range of 100 nm to 10 μm is desirable. good. The width of the insulating film 5 is required to be very narrow in the case of a display, but is not required to be narrow in organic EL lighting of 100 mm square size or more, and accuracy is not required. preferable.

Next, a method for manufacturing the organic EL element according to this embodiment will be described. The manufacturing method of the organic EL according to this embodiment includes an insulating film forming step, an organic light emitting layer forming step, and a second electrode forming step.
FIG. 2 is a view for explaining an example of a method for manufacturing an organic EL element according to this embodiment. FIG. 2A to FIG. 2D are views of a cross section taken along line (a) of FIG.

(1) FIG. 2 (a)
The first electrode 2 is patterned on the substrate 1.

(2) FIG. 2B: Insulating Film Forming Step In the insulating film forming step, first, the surface of the substrate 1 on which the first electrode 2 is formed is cleaned. Thereafter, an insulating material is applied to a predetermined portion on the substrate 1 on which the first electrode 2 is formed and cured. The curing method is appropriately selected according to the insulating material to be used. FIG. 3 illustrates a process diagram for forming an insulating film when a positive resist is used as an insulating material. According to FIG. 3, the insulating film 5 can be formed by the steps of cleaning, resist drawing (coating), and post-baking. After the positive resist is applied, it is cured only by heating (post-bake) to form the insulating film 5. Since the insulating material is applied only to a predetermined portion, the pre-baking, exposure, and development steps necessary for forming an insulating film by conventional photolithography are not required.

  The insulating material is applied in a non-contact manner. As a method for applying the insulating film 5 in a non-contact manner, a dot discharge type dispenser is optimal. As the dot discharge type dispenser, for example, JET MASTER (registered trademark) 2 manufactured by Asymtec Corporation can be used. The insulating material is applied by using a single nozzle 6 for one light emitting element. The size of the discharge port of the nozzle 6 is appropriately set according to the type of insulating material to be used and the size of the target light emitting element.

  The insulating material is preferably an organic material that can be cured at a low temperature, and a head with a plurality of nozzles, such as inkjet, looks more efficient for discharging the insulating material (resist). However, since the inkjet is for discharging low-viscosity ink, a highly viscous liquid (resist liquid) used as the insulating material of this embodiment cannot be printed using the inkjet. Ink jets are not suitable for forming a film having a thickness of about 1 μm because the discharge amount per nozzle is very small. Furthermore, it is suitable to pattern the ink jet on the entire surface of the substrate, but it is not suitable for applying to a small number of vertical and horizontal lines.

When a dot discharge type dispenser is used, first, the tip of the single nozzle 6 is directed toward the substrate 1 on which the first electrode 2 is formed, and the single nozzle 6 is spaced so that the tip does not contact the first electrode 2. Place. For example, the single nozzle 6 may be arranged at an interval of 0.1 to 1.0 mm from the surface of the first electrode 2 with respect to the edge portion (patterning step portion) of the first electrode 2.
Next, the insulating material is intermittently discharged from the single nozzle 6 toward a predetermined portion on the substrate 1 on which the first electrode 2 is formed. Further, the linear insulating film 5 continuous to a predetermined portion is formed by relatively moving the substrate 1 or the single nozzle 6 while discharging the insulating material. The discharge amount of the insulating material and the moving speed of the substrate 1 or the single nozzle 6 are determined so that the insulating film 5 has a desired thickness and width in consideration of the wettability of the surface to be coated, the type and viscosity of the insulating material. Set as appropriate.

  FIG. 4 shows a schematic diagram of an example of forming an insulating film. FIG. 4A shows ejected particles of the insulating material ejected from the nozzle. The discharge amount corresponds to 5 nL and the discharge particle diameter corresponds to 0.2 mm. Under the conditions where the discharge repetition rate is 200 dots / sec and the moving speed is 100 mm / sec, the discharged particles are applied on the substrate at intervals of 0.5 mm. 4B and 4C show the state of the insulating material after landing on the substrate. After the landing, the discharged insulating material spreads as shown in FIG. 4B, and finally is connected in a linear shape as shown in FIG. 4C, and the insulating film 5 having a thickness of 5 μm and a width of 2.0 mm Become. This width is sufficiently acceptable for an organic EL element for illumination of 100 mm square or more, but it is easy to change the width by changing the discharge amount and the interval.

(3) FIG.2 (c): Organic light emitting layer formation process The board | substrate 1 which passed through the insulating film formation process is carried in in a vacuum evaporation system. An organic vapor deposition mask 7 is put on the substrate 1, and an organic material is laminated and deposited to form the organic light emitting layer 3. The organic vapor deposition mask 7 has, for example, an opening that is equal to or larger than the surface of the first electrode 2 in the direction of the line (a) in FIG. When the organic vapor deposition mask 7 is applied, the opening is applied to the first electrode 2. The vapor deposition conditions for other organic materials are arbitrary.

(4) FIG.2 (d): 2nd electrode formation process The board | substrate 1 which passed the organic light emitting layer formation process is carried in another vacuum evaporation system. A second electrode deposition mask 8 is placed on the substrate 1, and a conductive material is stacked and deposited to form the second electrode 4. The second electrode deposition mask 8 has, for example, an opening larger than the first electrode 2 in the direction of the line (a) in FIG. 1 and smaller than the first electrode 2 in the direction of the line (b) in FIG. Use things. The deposition conditions for other conductive materials are arbitrary. After the second electrode forming step, a sealing member is appropriately formed (not shown).

  In addition, in this embodiment, although the 2nd electrode was formed into a film by vacuum evaporation, it is not limited to this, You may form into a film by sputtering method.

Second Embodiment
The organic EL element according to this embodiment has the same configuration as that of the first embodiment except that a predetermined portion formed by the insulating film is different.
FIG. 5 shows a schematic plan view of an example of one light emitting element of the organic EL element according to this embodiment. The insulating film 5 of the present embodiment includes a region where the edge of the first electrode 2 and the surface of the second electrode 4 intersect when the organic EL element is viewed in plan, and the surface of the first electrode 2 and the second electrode 4. Provided in the region where the edges of the crossing. That is, in addition to the patterning step portion of the first electrode 2 on which the organic light emitting layer 3 / second electrode 4 is laminated, there is a possibility that the second electrode deposition mask 8 contacts the organic light emitting layer 3 when the second electrode 4 is formed. An insulating film 5 is formed in a portion corresponding to the certain portion.

  FIG. 6 is a sectional view taken along line (b) of FIG. In FIG. 6, the insulating film 5 is provided on a flat portion on the first electrode 2. The second electrode vapor deposition mask 8 is configured such that the end of the opening covers the insulating film 5. By doing so, the portion where the second electrode vapor deposition mask 8 is in contact with the organic light emitting layer 3 becomes a non-light emitting element portion, so that it is not necessary to damage the organic light emitting layer 3 in the light emitting element.

  In the present embodiment, the insulating film 5 is continuously formed vertically and horizontally. If the coating conditions of the insulating film 5 are as shown in FIG. 4, in the case of a 100 mm square light emitting element, the insulating film 5 can be drawn in 4 seconds, and even a 15-sided master substrate can be drawn in 1 minute. It is.

  When a larger substrate is used, a plurality of single nozzles 6 are arranged on the substrate 1 so that a single nozzle 6 is arranged for one light emitting element, so that the insulating film 5 is simultaneously formed on the plurality of light emitting elements. May be drawn. As a result, the processing speed can be further improved easily.

  According to the first embodiment and the second embodiment, the insulating film 5 can be formed only by directly coating and drawing only on the portion where the photoresist is desired to be formed and baking, without using photolithography. . Therefore, the amount of the insulating material used can be reduced as compared with the conventional photolithography technique, and only a conventional baking furnace is used and no new equipment is required.

  In addition, by moving the program with the nozzle on one axis and the substrate on one axis, it is possible to instantly respond to various element size changes.

  Further, since there is no need to directly contact and transfer the substrate as in roll printing, manufacturing can be performed without any influence on the cause of defects such as unevenness, waviness and distortion of the substrate.

DESCRIPTION OF SYMBOLS 1 Substrate 2 1st electrode 3 Organic light emitting layer 4 2nd electrode 5 Insulating film 6 Single nozzle 7 Organic vapor deposition mask 8 Second electrode vapor deposition mask

Claims (1)

An organic EL element in which a first electrode, an organic light emitting layer, and a second electrode are sequentially laminated on a substrate, and the second electrode is arranged so as to intersect the first electrode and the organic light emitting layer when viewed in plan. A method of manufacturing comprising:
On the substrate on which the first electrode is formed, a predetermined portion corresponding to a region Y where the surface of the first electrode and the edge of the second electrode overlap when viewed in plan and the first electrode when viewed in plan An insulating film forming step of forming an insulating film by applying an insulating material to a predetermined portion corresponding to the region X where the edge portion and the surface of the second electrode overlap with each other without patterning;
After the insulating film forming step, an evaporation mask having an opening is disposed so as to include the first electrode and the region Y corresponding to a portion where the opening overlaps the second electrode, and the first electrode is disposed on the first electrode. An organic light emitting layer forming step of forming an organic light emitting layer by vacuum deposition;
After the organic light emitting layer forming step, a second electrode forming step of forming a second electrode on the organic light emitting layer using another vapor deposition mask having an opening different from the vapor deposition mask;
Equipped with a,
The insulating film forming step includes
Disposing a single nozzle at an interval from the first electrode, and intermittently discharging the insulating material from the single nozzle toward the predetermined portion of the substrate on which the first electrode is formed; ,
Relatively moving the substrate or the single nozzle to form a continuous insulating film on the predetermined portion;
The manufacturing method of the organic EL element for illumination containing this .

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