JP5711025B2 - Contact pin and IC socket - Google Patents

Description

The present invention relates to a contact pin used for an electrical test such as a burn-in test of a package and an IC socket including the contact pin.

FIG. 4 shows a conventional contact pin 100. 4A is a front view of the contact pin 100, and FIG. 4B is a cross-sectional view of the contact pin 100 cut along the line A6-A6 of FIG. 4A.

A contact pin 100 shown in FIG. 4 includes a bottomed cylindrical plunger bottom 101 made of a conductive metal, a conductive metal coil spring 102 partially accommodated in the plunger bottom 101, and a plunger. And a plunger top 103 that is slidably fitted to the opening end side of the bottom 101 and accommodates the other part of the coil spring 102. The plunger top 103 of the contact pin 100 shown in FIG. 4 is caulked on the opening end 104 side (with a reduced diameter deformation) in a state where the coil spring 102 is slightly compressed, and the caulking opening end is crimped. 104 side is pressed against the upper outer peripheral projection 105 of the plunger bottom 101 by the spring force of the coil spring 102 to be caught, and is prevented from coming off from the plunger bottom 101, and elastically received by the coil spring 102 seated on the bottom 106 of the plunger bottom 101. It is supported. A configuration similar to that of the contact pin 100 shown in FIG.

Such a contact pin 100 is accommodated in a housing 107 made of an insulating resin, and I
A C socket is configured, and the lower end of the plunger bottom 101 is pressed onto a substrate (not shown), and the terminal 111 of the package 110 is pressed against the crown-shaped terminal contact portion 108 of the plunger top 103, thereby electrically connecting the package 110 and the substrate. Thus, an electrical test such as a burn-in test of the package 110 can be performed.

Japanese Patent Laid-Open No. 2004-247170 (refer to FIG. 1 in particular)

The contact pin 100 shown in FIG. 4 is configured such that the opening end 104 side of the plunger top 103 is caulked to the upper outer peripheral projection 105 of the plunger bottom 101, so that the outer diameter dimension is increased by the amount of caulking allowance. Therefore, the contact pin 100 having such a structure has a problem that it is difficult to use for the electrical test of the package 110 in which the distance between the terminals 111 (terminal pitch) is narrow.

Therefore, the present invention eliminates the caulking of the plunger top and plunger bottom, reduces the outer diameter, and makes it easy to use a contact pin for an electrical test of a package with a short distance between terminals and an IC socket including the contact pin. The purpose is to provide.

As shown in FIG. 3, the contact pin 2 according to the first aspect of the present invention includes (1) a bottomed cylindrical plunger bottom 7 formed of a conductive metal material, and (2) a spring housing of the plunger bottom 7. A conductive coil spring 22 partially accommodated in the hole 25; and (3) a plunger bottom receiving hole 32 slidably fitted to the outer peripheral side of the opening of the plunger bottom 7, and the plunger A bottom portion of the coil spring 22 protruding from the bottom 7 is accommodated in the plunger bottom accommodation hole 32, and a plunger top 15 made of a conductive metal material having a bottomed cylindrical shape is provided. One end of the coil spring 22 is seated on the spring receiving portion 26 in the spring accommodating hole 25 of the plunger bottom 7, and the other end of the coil spring 22 is seated on the spring receiving portion 33 in the plunger bottom accommodating hole 32. It is supposed to be. In the plunger bottom 7, a pair of plunger bottom side bent pieces 28 extending in a cantilever shape along the circumferential direction are formed at equal intervals in the circumferential direction, and the plunger bottom side bent pieces 28 are pushed into the spring accommodating holes 25. The plunger bottom side bent piece is held so as to sandwich a part of one end side of the coil spring 22 between the plunger bottom side bent piece and the spring receiving portion in the spring accommodating hole . The plunger top 15 is formed with a pair of plunger top side bent pieces 35 extending in a cantilever shape along the circumferential direction at equal intervals in the circumferential direction, and the plunger top side bent pieces 35 are formed in the plunger bottom receiving hole 32. The plunger top side bent piece is held so as to sandwich a part of the other end side of the coil spring between it and the spring receiving portion in the plunger bottom receiving hole . .

As shown in FIGS. 1 to 3, an IC socket 1 according to a second aspect of the invention comprises a plurality of contact pins 2 according to the first aspect of the present invention accommodated in a housing 3 made of an insulating resin material, Place the plunger bottom 7 of the contact pin 2 on the substrate 10, place the terminal 6 of the package 5 on the plunger top 15 of the contact pin 2, and press the terminal 6 of the package 5 toward the substrate 10. Thus, the coil spring 22 of the contact pin 2 is pressed and contracted to push down the plunger top 15 so that the terminal 6 of the package 5 and the substrate 10 can be electrically connected via the contact pin 2. Yes.

According to the present invention, one end side of the coil spring can be held by the plunger bottom side bent piece of the plunger bottom, and the other end side of the coil spring can be held by the plunger top side bent piece of the plunger top. Without crushing
Since the plunger bottom, the coil spring, and the plunger top can be assembled together, the outer diameter can be reduced by the amount that it is not necessary to provide a caulking allowance. As a result, the contact pin according to the present invention can be easily used for an electrical test of a package having a small distance between terminals. Moreover, the IC socket provided with the contact pin according to the present invention can be used for an electrical test of a package having a short distance between terminals.

It is a figure which shows the IC socket which concerns on embodiment of this invention. 1A is a plan view of the IC socket, and FIG. 1B is a cross-sectional view of the IC socket shown by cutting along the line A1-A1 of FIG. 1A. FIG. 2 is a cross-sectional view of an IC socket cut along the line A2-A2 of FIG. It is sectional drawing which expands and shows a part of IC socket which concerns on embodiment of this invention. It is a figure which shows the detail of the contact pin which concerns on this invention. 3 (a) is a front view of the contact pin, FIG. 3 (b) is a plan view of the contact pin, and FIG. 3 (c) is cut along the line A3-A3 in FIG. 3 (a). 3 (d) is a cross-sectional view of the contact pin shown by cutting along the line A4-A4 in FIG. 3 (a), and FIG. 3 (e) is a cross-sectional view of the contact pin shown in FIG. 3A is a cross-sectional view of the contact pin cut along the line A5-A5, and FIG. 3F is a view showing an example in which a part of the contact pin is deformed. 1 shows a conventional contact pin. 4A is a front view of the contact pin, and FIG. 4B is a cross-sectional view of the contact pin cut along the line A6-A6 of FIG. 4A.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(IC socket)
FIG. 1 is a diagram showing an IC socket 1 according to an embodiment of the present invention. Here, FIG.
1 is a plan view of the IC socket 1, FIG. 1B is a cross-sectional view of the IC socket 1 cut along the line A1-A1 of FIG. 1A, and FIG. It is sectional drawing of the IC socket 1 cut | disconnected and shown along the A2-A2 line of (a). In FIG. 1B and FIG. 1C, the contact pin 2 is shown without a cross section.

As shown in FIG. 1, the IC socket 1 is made of an insulating resin material (for example, PBT, PC, PP
The housing 3 formed in S) and the plurality of contact pins 2 respectively mounted in the plurality of contact pin receiving holes 4 of the housing 3 are provided. The contact pin accommodation holes 4 and the contact pins 2 attached to the contact pin accommodation holes 4 are arranged so as to correspond one-to-one with the terminals 6 of the package 5 to be measured. Adjacent contact pins 2 and 2 are electrically isolated from each other.

FIG. 2A is an enlarged view of a portion B in FIG. 1B, and shows a state where the lower end surface 8 of the contact pin 2 mounted on the housing 3 (the lower end surface 8 of the plunger bottom 7) is placed on the substrate 10. FIG. As shown in FIG. 2A, the housing 3 includes a lower first housing portion 11 and
And a second housing part 12 fixed on the first housing part 11 in a state of being overlaid on the first housing part 11 (fixed so as to be detachable with a fastener, a screw or the like).

As shown in FIG. 2A, the first housing portion 11 includes a first guide hole 13 that fits on the outer peripheral side of the plunger bottom 7 of the contact pin 2 with a slight gap, and the first guide hole 1.
3 and an escape hole 14 formed in a substantially tapered shape so as to expand upward from the upper end of 3. The first guide hole 13 of the first housing part 11 positions the plunger bottom 7 of the contact pin 2 in the XY plane and guides the vertical movement (sliding movement) of the plunger bottom 7 of the contact pin 2. It has become. Also, escape hole 1
4, as shown in FIG. 2 (c), the plunger top 15 can sufficiently move downward.
A space for moving the plunger top 15 is secured, and the contact pin 2 can be prevented from coming off the housing 3 by coming into contact with the outer peripheral edge 16 of the lower end of the plunger top 15 of the contact pin 2. Further, as shown in FIG. 2 (d), the escape hole 14 of the first housing portion 11 is formed so that the lower peripheral edge 16 of the contact pin 2 is not in contact with the contact pin 2 in a state where the contact pin 2 is not placed on the substrate 10. When seated under its own weight, the plunger top 15 of the contact pin 2 is formed to a depth that does not come out of the second guide hole 18 of the second housing portion 12.

As shown in FIG. 2A, the second housing portion 12 is open to the upper surface side, and the second guide hole 18 that guides the vertical movement of the plunger top 18 of the contact pin 2 and the second guide hole. 18 and a relief hole 14 of the first housing portion 11 to communicate with each other and a third guide hole 20 that allows the retaining projection 17 of the plunger top 15 to move up and down. The second guide hole 18 positions the plunger top 15 of the contact pin 2 in the XY plane. The third guide hole 20 has a larger diameter than the second guide hole 18 and is concentric with the second guide hole 18 and the first guide hole 13. A ceiling surface 21 is formed. The ceiling surface 21 of the third guide hole 20 abuts against the retaining protrusion 17 of the plunger top 15 to prevent the plunger top 15 from slipping out of the upper surface side of the second housing portion 12, and the plunger top 15 is 2 The dimension which protrudes from the upper surface of the housing part 12 is controlled. The second guide hole 18 and the third guide hole 20 in the second housing part 12 together with the first guide hole 13 and the escape hole 14 in the first housing part 11 constitute a contact pin accommodating hole 4.

2B, the housing 3 of the IC socket 1 is fixed in close contact with the substrate 10, and the lower end surface 8 of the plunger bottom 7 of the contact pin 2 is energized on the substrate 10 (not shown).
It shows the state which was made to stick to. In FIG. 2B, the contact pin 2 is pushed into the contact pin receiving hole 4 of the housing 3 by the plunger bottom 7 pushing and contracting the coil spring 22, and the retaining protrusion 17 of the plunger top 15 is inserted into the third guide hole. 20 is pressed against the ceiling surface 21 by the spring force of the coil spring 22 (see FIG. 3C).

FIG. 2C shows a state in which the terminal 6 of the package 5 is pressed against the contact pin 2 of the IC socket 1 where the housing 3 is fixed on the substrate 10. In FIG. 2C, the contact pin 2 is such that the plunger top 15 is pushed down by pressing the coil spring 22, and a part of the plunger top 15 protruding above the housing 3 is a contact of the housing 3. It is pushed into the pin accommodating hole 4 (see FIG. 3C). As a result, the coil spring 22 comes into contact with the plunger bottom 7 and the plunger top 15 with an appropriate spring force, and the plunger top 15 and the plunger bottom 7 come into contact with the coil spring 2.
The terminal 6 of the package 5 and the energization pattern on the substrate 10 are electrically connected via the contact pin 2. As a result, an electrical test such as a burn-in test of the package 5 is stably and reliably performed.

(Contact pin)
FIG. 3 is a diagram showing details of the contact pin 2. 3A is a front view of the contact pin 2, FIG. 3B is a plan view of the contact pin 2, and FIG. 3C is FIG.
It is sectional drawing of the contact pin 2 cut | disconnected and shown along the A3-A3 line | wire of a), FIG.3 (d)
FIG. 3 is a cross-sectional view of the contact pin 2 cut along the line A4-A4 in FIG. 3A, and FIG. 3E shows the cut along the line A5-A5 in FIG. 2 is a cross-sectional view of a contact pin 2. FIG.

As shown in FIG. 3, the contact pin 2 includes a plunger bottom 7 and a coil spring 22.
And the plunger top 15 is comprised combining.

The plunger bottom 7 has a bottomed cylindrical shape that opens upward (in the + Z-axis direction), and is formed of a conductive metal material (beryllium copper, brass, phosphor bronze, or the like). The plunger bottom 7 is configured to block one end side (lower end side) of the cylindrical portion 23 with the bottom portion 24, and a space defined by the cylindrical portion 23 and the bottom portion 24 is a spring accommodating hole 25. A part (approximately half of the free height) of the coil spring 22 is accommodated in the spring accommodation hole 25 of the plunger bottom 7 so that it can expand and contract. And the hole bottom (spring receiving part) 2 of the spring accommodation hole 25
6, the lower end (one end) of the coil spring 22 is seated.

Further, the cylindrical portion 23 of the plunger bottom 7 is positioned slightly above the hole bottom 26 of the spring accommodating hole 25 (above a dimension slightly larger than the wire diameter d of the coil spring 22) and in the circumferential direction. Are formed with slits (cuts) 27 that appear to be substantially U-shaped when the contact pins 22 are viewed from the front side. And the cylindrical part 23 of this plunger bottom 7 forms the bending piece (plunger bottom side bending piece) 28 extended in the shape of a cantilever along the circumferential direction in the part enclosed by the slit 27 which looks like a substantially U shape. Has been. The pair of bent pieces 28 of the plunger bottom 7 are bent so as to be pushed into the spring accommodating hole 25, so that a part on the lower end side of the coil spring 22 is sandwiched between the hole bottom 26 and held. It has become.

The coil spring 22 is a compression coil spring formed of a conductive metal material (for example, SWP), and the surface thereof is plated with gold so that a good conductive function and spring function can be exhibited.

The plunger top 15 has a bottomed cylindrical shape that opens downward (−Z-axis direction), and is formed of the same conductive metal material (beryllium copper, brass, phosphor bronze, etc.) as the plunger bottom 7. ing. The plunger top 15 is configured to close one end side of the cylindrical portion 30 with the top portion 31. In addition, the plunger top 15 is a plunger bottom receiving hole 32 in which a space defined by the cylindrical portion 30 and the top portion 31 is slidably fitted to the outer peripheral side of the opening of the plunger bottom 7. And in this plunger bottom accommodation hole 32, the other part of coil spring 22 which protrudes from plunger bottom 7 (substantially half of free height)
Is accommodated so that it can expand and contract. The upper end (the other end) of the coil spring 22 is seated on the bottom (spring receiving portion) 33 of the plunger bottom receiving hole 32.

The plunger top 15 is positioned slightly below the hole bottom 33 of the plunger bottom receiving hole 32 (a slightly smaller dimension than the wire diameter d of the coil spring 22) and the circumference of the cylindrical portion 30 is Slits (cuts) 34 that are substantially U-shaped when the contact pins 2 are viewed from the front side are formed at positions that are equally spaced (180 ° intervals) along the direction. The plunger top 15 is formed with a bent piece (plunger top side bent piece) 35 extending in a cantilever shape along the circumferential direction in a portion surrounded by a slit 34 that appears to be substantially U-shaped. . The pair of bent pieces 35, 35 formed in the cylindrical portion 30 of the plunger top 15 are bent so as to be pushed into the plunger bottom receiving hole 32, thereby being between the hole bottom 33 and the upper end side of the coil spring 22. It is designed to hold it so as to sandwich a part of it.

Further, the plunger top 15 is integrally formed with a ring-shaped retaining protrusion 36 on the outer peripheral side near the opening of the cylindrical portion 30. The ring-shaped retaining protrusion 36 can move up and down along the third guide hole 20 of the second housing portion 12 (FIG. 2B).
To (c)). Further, the retaining projection 36 is provided in the third guide hole 20 of the second housing part 12.
The contact pin 2 is prevented from coming out above the housing 3 (see FIG. 2B). Further, as shown in FIG. 2B, the retainer protrusion 36 is attached to the plunger top 15 in the Z-axis direction (upward) by the coil spring 22 in a state where the IC socket 1 is fixed on the substrate 10. Therefore, the coil spring 22 is pressed against the ceiling surface 21 of the third guide hole 20 by the spring force to position the top surface 37 of the plunger top 15 in the Z-axis direction. As a result, the plurality of contact pins 2 mounted on the housing 3 are aligned with the height position of the top surface 37 of the plunger top 15 (the height position from the upper surface of the substrate 10) with high accuracy.

As shown in FIG. 3C, the contact pin 2 has, for example, an outer diameter D of 0.7 mm,
The height H is 2 mm and the wall thickness t is about 0.1 mm.

(Effect of this embodiment)
The contact pin 2 according to the present embodiment configured as described above can hold one end side of the coil spring 22 with the bent pieces 28 and 28 of the plunger bottom 7, and the plunger top 1
The other end side of the coil spring 22 can be held by the bent pieces 35, 35, and the plunger bottom 7, the coil spring 22, and the plunger top 15 can be assembled together without caulking the plunger bottom 7 and the plunger top 15. Therefore, the dimension of the outer diameter D can be reduced by an amount that does not require the caulking allowance. As a result, the contact pin 2 according to this embodiment can be easily used for an electrical test of the package 5 in which the distance between the terminals 6 is narrow. Further, the IC socket 1 including the contact pin 2 according to the present embodiment can be used for an electrical test of the package 5 in which the distance between the terminals 6 is narrow.

Further, when the contact pin 2 according to the present embodiment has the same outer diameter as that of the conventional example in which the plunger bottom 7 and the plunger top 15 are caulked, the average of the coil springs 22 is not provided. The diameter can be increased, the wire diameter d can be increased, and the spring force of the coil spring 22 can be increased. As a result, the contact pin 2 according to the present embodiment can increase the contact pressure between the terminal 6 of the package 5 and the plunger top 15, and further stabilize the contact between the terminal 6 of the package 5 and the plunger top 15. be able to.

(Modification)
In addition, the contact pin 2 according to the above embodiment includes the bent pieces 28 and 35 as viewed from the front side.
Is substantially rectangular (see FIG. 3 (a)), but as shown in FIG. 3 (f), the tip shapes of the bent pieces 28 and 35 may be cut away so as to become narrower toward the tip. Good. If it does in this way, it will become easy to engage the bending pieces 28 and 35 with the clearance gap between the coil springs 22 (refer FIG.3 (c)).

Further, in the contact pin 2 according to the above embodiment, the top surface 37 of the plunger top 15 is a flat surface, but the top of the plunger top 15 is appropriately changed according to the shape of the terminal 6 of the package 5 (for example, FIG. It may be modified into a crown shape as shown in the conventional example.

In the contact pin 2 according to the above embodiment, the lower end surface 8 of the plunger bottom 7 is a flat surface, but the lower end surface 8 of the plunger bottom 7 may be a conical surface similar to the conventional example shown in FIG.

The contact pin 2 according to the above embodiment is not limited to the BGA type package, and can be widely applied to an electrical test of a package in which a terminal is formed on the lower surface side.

1 ... IC socket, 2 ... Contact pin, 3 ... Housing, 5 ... Package,
6: Terminal, 7: Plunger bottom, 10 ... Substrate, 15 ... Plunger top, 22
…… Coil spring, 25 …… Spring receiving hole, 26, 33 …… Bottom bottom (spring receiving part), 28
…… Folded piece (plunger bottom side bent piece), 32 …… Plunger bottom receiving hole,
35 …… Folded piece (plunger top side bent piece)

Claims (2)

A bottomed cylindrical plunger bottom formed of a conductive metal material;
A conductive coil spring partially accommodated in the spring accommodating hole of the plunger bottom;
The plunger bottom receiving hole is slidably fitted to the outer peripheral side of the opening of the plunger bottom, and the other part of the coil spring protruding from the plunger bottom is received in the plunger bottom receiving hole. A plunger top made of a conductive metal material having a bottomed cylindrical shape;
A contact pin in which one end of the coil spring is seated in a spring receiving portion in a spring receiving hole of the plunger bottom, and the other end of the coil spring is seated in a spring receiving portion in the plunger bottom receiving hole In
The plunger bottom is formed such that a pair of plunger bottom side bent pieces extending in a cantilever shape along the circumferential direction is formed at equal intervals in the circumferential direction, and the plunger bottom side bent pieces are bent so as to be pushed into the spring accommodating hole. The plunger bottom side bent piece is held so as to sandwich a part of one end side of the coil spring between the spring receiving portion in the spring accommodating hole ,
The plunger top is bent so that a pair of plunger top side bent pieces extending in a cantilever shape along the circumferential direction are formed at equal intervals in the circumferential direction, and the plunger top side bent pieces are pushed into the plunger bottom receiving hole. The plunger top side bent piece is held so as to sandwich a part of the other end side of the coil spring between the plunger receiving side and the spring receiving portion in the plunger bottom receiving hole .
A contact pin characterized by that. A plurality of contact pins according to claim 1 are accommodated in a housing made of an insulating resin material, the plunger bottom of the contact pins is placed on a substrate, and a package terminal is placed on the plunger top of the contact pins. By pressing the terminal of the package toward the substrate, the coil spring of the contact pin is pressed and contracted to push down the plunger top, and the terminal and the substrate of the package are electrically connected via the contact pin. Can be connected automatically,
IC socket characterized by that.

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