JP5666395B2 - Temperature control device and method of manufacturing temperature control device - Google Patents

Description

  The present invention relates to a temperature adjusting device that adjusts the temperature of a substrate in a manufacturing process of a semiconductor, a liquid crystal display device, an optical disc, and the like, and a method of manufacturing the temperature adjusting device.

  In various substrate processes in the manufacture of semiconductors, liquid crystal display devices, optical disks, etc., temperature adjusting devices (cold plates, hot plates, etc.) for adjusting the temperature of the substrate are used. These temperature control devices generally have a structure in which a flow path for circulating a heat medium or gas is provided inside a metal plate such as aluminum or aluminum alloy (see, for example, Patent Documents 1 and 2). .

  Conventionally, such a temperature control device forms a flow path in a metal plate body by cutting or the like, and another metal plate (for example, a holding plate) for sealing the flow path is provided on the flow path side of the metal plate body. It has been manufactured by joining or adhering both by overlapping, welding, brazing, or adhesive.

Japanese Utility Model Publication No. 62-172777 JP 2006-329439 A

  However, such a conventional manufacturing method has a problem that it takes a lot of time to set a brazing material, brazing time, or set a filler for welding.

  Further, when used as a semiconductor temperature control device, the material of the metal plate is limited to aluminum, aluminum alloy, or the like in order to prevent metal contamination of the semiconductor. With a metal plate using only aluminum or an aluminum alloy, the uniformity of the plate temperature could not be kept sufficiently.

  In order to improve the above-described non-uniformity of the temperature distribution of the metal plate, it has also been proposed to manufacture a metal plate by joining different materials by brazing or the like, but by joining different materials by brazing or the like. However, since the bonding temperature is high, there has been a problem that strain due to a difference in thermal expansion between different materials accumulates.

  The present invention has been made in view of the above, and while reducing the time required for manufacturing a metal plate, it is possible to reduce the time required for the metal plate while suppressing strain, separation between interfaces, and cracks when joining different materials. It is an object of the present invention to provide a temperature control device and a method for manufacturing the temperature control device that can improve the uniformity of the temperature distribution.

  In order to solve the above-mentioned problems and achieve the object, a temperature control device according to the present invention is a temperature control device having a plate in which a flow path for circulating a heat medium is formed, wherein the plate is made of aluminum or aluminum. It is formed by accelerating together with gas a base plate made of an alloy and a metal or alloy powder different from aluminum or aluminum alloy, and spraying and depositing it in the solid state toward the base plate, and the flow path is formed inside It has a main body plate, and a skin plate on which an object to be temperature-controlled is placed, is formed of the same material as the base plate, and covers the main body plate.

  The temperature control device according to the present invention is characterized in that, in the above invention, the temperature control device has a pipe embedded in the main body plate to form the flow path.

  In the temperature control device according to the present invention as set forth in the invention described above, the flow path is formed by a groove formed in the main body plate and a lid portion covering the groove.

  In the temperature control device according to the present invention as set forth in the invention described above, the body plate is made of a metal or alloy having higher thermal conductivity than aluminum or aluminum alloy forming the base plate and the skin plate.

  In the temperature control device according to the present invention, in the above invention, the main body plate has a disk shape, a first main body plate having a columnar shape at the center of the disk, and an outer peripheral portion of the first main body plate. A second main body plate having a hollow cylindrical shape, wherein the first main body plate is formed of the same material as the base plate and the outer skin plate, and the second main body plate forms the first main body plate. It is characterized by comprising a metal or an alloy having a higher thermal conductivity than the material.

  Further, in the temperature control device according to the present invention, in the above invention, a first flow path through which the first heat medium is circulated is formed in the first main body plate, and the second main body plate has the first flow path. A second flow path for flowing a second heat medium having a temperature higher than that of the first heat medium is formed.

  In the temperature control device according to the present invention, in the above invention, the main body plate has a disk shape, a first main body plate having a columnar shape at the center of the disk, and an outer peripheral portion of the first main body plate. The second body plate is formed of the same material as the base plate and the outer skin plate, and the first body plate forms the second body plate. It is characterized by comprising a metal or an alloy having a higher thermal conductivity than the material.

  Further, in the temperature control device according to the present invention, in the above invention, a first flow path through which the first heat medium is circulated is formed in the first main body plate, and the second main body plate has the first flow path. A second flow path for flowing the second heat medium having a temperature lower than that of the first heat medium is formed.

  The temperature control device according to the present invention is characterized in that in the above invention, a vacuum groove is provided between the first main body plate and the second main body plate.

  In the temperature control apparatus according to the present invention, the temperature adjustment target is a semiconductor.

  In addition, a method for manufacturing a temperature control device according to the present invention is the method for manufacturing a temperature control device having a plate in which a flow path for circulating a heat medium is formed. The base plate made of aluminum or an aluminum alloy is provided with aluminum or aluminum. A metal plate or alloy powder different from the alloy is accelerated together with the gas and sprayed in the solid state to form the lower part of the main body plate, and the lower part of the main body plate formed in the lower part of the main body plate A flow path forming step for forming a groove to be the flow path, a lid placement step for placing a lid portion covering the groove on the upper portion of the groove, and a lower part of the main body plate on which the lid portion is placed, Upper body plate shape that accelerates alloy powder with gas and sprays it in the solid state to form the upper body plate And a shell for accelerating a powder of the same metal or alloy as that of the base plate together with a gas on the upper part of the main body plate and spraying the same in a solid state to cover the main body plate and placing an object to be temperature controlled And a covering step for forming a plate.

  In addition, a method for manufacturing a temperature control device according to the present invention is the method for manufacturing a temperature control device having a plate in which a flow path for circulating a heat medium is formed. The base plate made of aluminum or an aluminum alloy is provided with aluminum or aluminum. A metal plate or alloy powder different from the alloy is accelerated together with the gas and sprayed in the solid state to form the lower part of the main body plate, and the lower part of the main body plate formed in the lower part of the main body plate , A pipe placement step for placing the pipe that becomes the flow path, and further accelerating the powder of the metal or alloy together with the gas to the lower part of the main body plate on which the pipe is placed, and spraying it in the solid phase state to the upper part of the main body plate Forming a main body plate upper portion, and forming the base plate on the upper portion of the main body plate. Covering the body plate by accelerating the same metal or alloy powder as the gas together with the gas, spraying in the solid state, and forming a skin plate on which the object to be temperature-controlled is placed. It is characterized by that.

  In the temperature control device manufacturing method according to the present invention, in the above invention, the main body plate is formed of a metal or an alloy having a higher thermal conductivity than aluminum or an aluminum alloy forming the base plate and the skin plate. It is characterized by.

  In addition, a method for manufacturing a temperature control device according to the present invention is the method for manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed, on a base plate made of aluminum or an aluminum alloy. And a first body plate forming step of forming a first body plate made of the same material as the base plate, having a first flow path for circulating the first heat medium, forming a cylindrical shape at the center of the disk, From the material which has the 2nd channel which distributes the 2nd heat carrier on the base plate, and is provided in the perimeter part of the 1st body plate, makes a hollow cylinder shape, and forms the 1st body plate A second body plate forming step of forming a second body plate made of a metal or alloy having high thermal conductivity, and the same metal or alloy as the base plate on the body plate Coating the body plate by accelerating the powder together with the gas and spraying it in a solid phase state, and forming a skin plate on which the object to be temperature-controlled is placed, and the second body plate forming step A second body plate lower part forming step of forming a lower part of the second body plate by accelerating a metal or alloy powder together with a gas on the base plate and spraying the powder in a solid state, and the second body plate A flow path forming step of forming the second flow path by forming a groove and covering with a lid portion in the lower portion of the second body plate formed in the lower formation process, or forming the second flow path by arranging a pipe. Then, the metal or alloy powder is further accelerated together with the gas to the lower part of the second main body plate where the second flow path is formed, and sprayed in a solid state to form the upper part of the second main body plate. Characterized in that it comprises a, a secondary body plate upper forming step.

  In addition, a method for manufacturing a temperature control device according to the present invention is the method for manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed, on a base plate made of aluminum or an aluminum alloy. The first main body plate is made of a metal or alloy having a first flow path for circulating the first heat medium, having a cylindrical shape at the center of the disk, and having a higher thermal conductivity than the material forming the base plate. A first main body plate forming step, on the base plate, having a second flow path through which the second heat medium is circulated, provided on the outer peripheral portion of the first main body plate to form a hollow cylindrical shape, A second main body plate forming step of forming a second main body plate made of the same material as the base plate, and the main body plate made of the same metal or alloy as the base plate. Covering the body plate by accelerating the body together with the gas, spraying in the solid state, and forming a skin plate on which the object to be temperature-controlled is placed, and the first body plate forming step includes A first body plate lower portion forming step of forming a lower portion of the first body plate by accelerating the powder of the metal or alloy together with the gas on the base plate and spraying it in a solid phase state; A flow path forming step for forming the first flow path by forming a groove and covering with a lid on the lower portion of the first main body plate formed in the forming process, or forming the first flow path by arranging a pipe; and A metal or alloy powder is further accelerated together with a gas to the lower part of the first main body plate in which the first flow path is formed, and sprayed in a solid state to form an upper part of the first main body plate. Characterized in that it comprises a body plate upper forming step.

  In addition, a method for manufacturing a temperature control device according to the present invention is the method for manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed, on a base plate made of aluminum or an aluminum alloy. And a first body plate forming step of forming a first body plate made of the same material as the base plate, having a first flow path for circulating the first heat medium, forming a cylindrical shape at the center of the disk, From the material which has the 2nd channel which distributes the 2nd heat carrier on the base plate, and is provided in the perimeter part of the 1st body plate, makes a hollow cylinder shape, and forms the 1st body plate A second body plate forming step of forming a second body plate made of a metal or alloy having high thermal conductivity, and the same metal or alloy as the base plate on the body plate Coating the body plate by accelerating the powder together with the gas and spraying it in a solid phase state, and forming a skin plate on which the object to be temperature-controlled is placed, and the second body plate forming step A second body plate lower part forming step of forming a lower part of the second body plate by accelerating a metal or alloy powder together with a gas on the base plate and spraying the powder in a solid state, and the second body plate A pipe placement step of placing a pipe serving as the second flow path in the lower portion of the second body plate formed in the lower portion formation step; and a metal or alloy powder further in the lower portion of the second body plate in which the pipe is placed. And a second main body plate upper portion forming step of accelerating with the gas and spraying in the solid state to form the second main body plate upper portion.

  In addition, a method for manufacturing a temperature control device according to the present invention is the method for manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed, on a base plate made of aluminum or an aluminum alloy. The first main body plate is made of a metal or alloy having a first flow path for circulating the first heat medium, having a cylindrical shape at the center of the disk, and having a higher thermal conductivity than the material forming the base plate. A first main body plate forming step, on the base plate, having a second flow path through which the second heat medium is circulated, provided on the outer peripheral portion of the first main body plate to form a hollow cylindrical shape, A second main body plate forming step of forming a second main body plate made of the same material as the base plate, and the main body plate made of the same metal or alloy as the base plate. Covering the body plate by accelerating the body together with the gas, spraying in the solid state, and forming a skin plate on which the object to be temperature-controlled is placed, and the first body plate forming step includes A first body plate lower portion forming step of forming a lower portion of the first body plate by accelerating the powder of the metal or alloy together with the gas on the base plate and spraying it in a solid phase state; A pipe placement step of placing a pipe serving as the first flow path in the lower portion of the first body plate formed in the forming step, and a metal or alloy powder together with a gas in the lower portion of the first body plate in which the pipe is placed And a main body plate upper portion forming step of forming a first main body plate upper portion by accelerating and spraying in a solid phase state.

  According to the present invention, a metal or alloy powder different from aluminum or aluminum alloy is accelerated together with gas on a base plate made of aluminum or aluminum alloy, and sprayed and deposited in a solid state toward the outer skin plate. By forming the main body plate, it is possible to effectively improve the temperature distribution of the metal plate while suppressing strain, separation between interfaces, and cracks when joining different materials.

FIG. 1 is a cross-sectional view showing the structure of the temperature adjustment device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of the temperature adjusting device shown in FIG. FIG. 3 is a schematic diagram showing the configuration of the cold spray apparatus. FIG. 4A is a partially enlarged cross-sectional view illustrating the manufacturing process of the temperature control device according to Embodiment 1 of the present invention. FIG. 4B is a partially enlarged cross-sectional view illustrating the manufacturing process of the temperature control device according to Embodiment 1 of the present invention. FIG. 4C is a partially enlarged cross-sectional view illustrating the manufacturing process of the temperature control device according to Embodiment 1 of the present invention. FIG. 4D is a partially enlarged cross-sectional view illustrating the manufacturing process of the temperature control device according to Embodiment 1 of the present invention. FIG. 4E is a partially enlarged cross-sectional view illustrating the manufacturing process of the temperature control device according to Embodiment 1 of the present invention. FIG. 5 is a cross-sectional view of a temperature control device according to a modification of the first embodiment of the present invention. FIG. 6 is a cross-sectional view showing the structure of the temperature adjustment device according to Embodiment 2 of the present invention. FIG. 7 is a cross-sectional view taken along the line BB of the temperature adjusting device shown in FIG. FIG. 8A is a diagram for explaining a manufacturing process for the temperature adjustment device according to the second embodiment of the present invention. FIG. 8B is a diagram for explaining a manufacturing process for the temperature adjustment device according to the second embodiment of the present invention. FIG. 8C is a diagram illustrating a manufacturing process of the temperature control device according to the second embodiment of the present invention. FIG. 8D is a diagram for explaining a manufacturing process for the temperature control device according to the second embodiment of the present invention. FIG. 8E is a diagram for explaining a manufacturing process for the temperature control device according to the second embodiment of the present invention. FIG. 8F is a diagram for explaining a manufacturing process for the temperature control device according to the second embodiment of the present invention. FIG. 8G is a diagram for explaining a manufacturing process for the temperature adjustment device according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view showing the structure of the temperature adjustment device according to the third embodiment of the present invention. 10 is a cross-sectional view taken along the line CC of the temperature adjusting device shown in FIG. FIG. 11 is a flowchart for explaining a manufacturing process of the temperature control device according to the third embodiment of the present invention.

  Hereinafter, a temperature control device and a method of manufacturing the temperature control device according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to these embodiments. In the description of the drawings, the same parts are denoted by the same reference numerals. The drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Also in the drawings, there are included portions having different dimensional relationships and ratios. Furthermore, it should be noted that terms indicating directions such as “up” and “down” in the following description correspond to the descriptions in the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view showing the structure of a temperature adjustment device 100 according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view of the temperature adjusting device 100 shown in FIG. The temperature control apparatus 100 according to the first embodiment includes a metal plate 1 provided with a flow path 5 through which a heat medium (gas or liquid) flows, and a shaft 2 that supports the metal plate 1. 1 and 2, the disk-shaped metal plate 1 is described as an example. However, the metal plate 1 is not limited to the disk shape, and has a rectangular shape or the like according to the shape of the object to be temperature-controlled. May be.

  The metal plate 1 is made of aluminum or an aluminum alloy, and includes a base plate 41 joined to the shaft 2, a main body plate 3 provided with a flow path 5 for circulating a heat medium therein, and a target whose temperature is controlled by covering the main body plate 3. And a skin plate 42 formed of the same material as the base plate. As shown in FIG. 2, the flow path 5 is formed in a spiral shape in the main body plate 2. A heat medium is introduced into the flow path 5 from the inlet 7, the heat medium flows through the flow path 5 to adjust the temperature of the object, and the heat medium is led out from the outlet 8. The main body plate 3 is preferably formed of a material having a higher thermal conductivity than aluminum or an aluminum alloy, which is a material of the base plate 41 and the outer skin plate 42, for example, copper or a copper alloy.

  Next, with reference to FIG. 3 and FIGS. 4A to 4E, a method for manufacturing the temperature control device 100 according to Embodiment 1 will be described. FIG. 3 is an explanatory diagram showing an outline of the cold spray device 50 used for manufacturing the temperature control device 100 according to Embodiment 1 of the present invention. 4A to 4E are partially enlarged cross-sectional views for explaining the manufacturing process of the temperature control device 100 according to Embodiment 1 of the present invention.

As shown in FIG. 3, the cold spray device 50 includes a gas introduction pipe 51 for introducing an inert gas such as helium (He) or nitrogen (N ₂ ) or a gas such as air (working gas) from a gas supply source; A powder supply unit 52 for supplying the material powder PM as a raw material, a heater 53 for heating the gas introduced from the gas introduction pipe 51 to a desired temperature, and a chamber 54 for mixing and injecting the material powder PM and the gas; And a nozzle 55 for injecting the material powder PM. Here, the material powder PM is a powder of a material constituting the main body plate 3.

  A fine material powder PM (for example, a particle size of about 10 μm to 100 μm) is accommodated in the powder supply unit 52. The material powder PM is supplied into the chamber 54 through the powder supply pipe 52a together with the gas by operating a valve 51a provided in the gas introduction pipe 51 to introduce a gas having a desired flow rate into the powder supply section 52. Is done.

  The heater 53 heats the introduced gas to, for example, about 50 ° C. to 700 ° C. The upper limit of the heating temperature is less than the melting point of the material because the material powder PM is sprayed onto the base plate 41 in a solid state. More preferably, the upper limit temperature is kept below about 60% of the melting point in degrees Celsius. This is because the higher the heating temperature, the higher the possibility that the material powder PM will be oxidized.

  The gas heated in the heater 53 is introduced into the chamber 54 through the gas pipe 53a. Note that the flow rate of the gas introduced into the chamber 54 is adjusted by a valve 51 b provided in the gas introduction pipe 51. The heated compressed gas is made into a supersonic flow (about 340 m / s or more) by the nozzle 55 having a tapered tapered shape, and the material powder PM supplied to the chamber 54 is accelerated by charging the gas into the supersonic flow. In the solid state, the base material 41 in the first embodiment collides with the base plate 41 at a high speed to form a film.

  As shown in FIG. 3, the main body plate 3 is formed on the base plate 41 by depositing the material powder while moving the nozzle 55 in the direction of the arrow X and the direction of the arrow Y in the drawing. Note that any device that can form a film by colliding a material powder with a base material in a solid phase can be used for manufacturing the temperature control device 100 according to the first embodiment, and the cold spray device 50 of FIG. It is not limited to.

  First, as shown in FIG. 4A, the temperature control apparatus 100 according to the first embodiment uses a cold spray device 50 to spray and deposit a metal or alloy material powder PM forming the body plate 3 on the base plate 41. The main body plate lower part 31 is formed. The base plate 41 may be formed in a predetermined shape by cutting or the like.

  After smoothing the upper surface of the laminated main body plate lower portion 31, as shown in FIG. 4B, a groove 9 that forms the flow path 5 is formed by cutting or the like, and the opening edge portion of the groove 9 is notched. Part 10 is formed. The width of the support portion 10 only needs to be sufficient to support the lid portion 6. Moreover, the depth of the support part 10 should just be the same grade as the cover part 6. FIG. In addition, the cross-sectional shape of the flow path 6 is not limited to a rectangle, You may form in arbitrary shapes (For example, a rectangle with a rounded corner, a trapezoid, a triangle, a semicircle, a semi-ellipse etc.).

  Subsequently, as shown in FIG. 4C, the lid portion 6 is placed on the support portion 10 to form the flow path 5.

  After that, as shown in FIG. 4D, the metal spray material powder PM forming the main body plate 3 is sprayed and deposited on the lower part 31 of the main body plate where the lid 6 is placed on the support 10 by the cold spray device 50. Thereby, the main body plate upper part 32 is formed.

  After smoothing the upper surface of the laminated main body plate upper part 32, as shown in FIG. 4E, a metal or alloy material powder PM forming the outer skin plate 42 is sprayed and deposited on the main body plate upper part 32 by a cold spray device 50. Thus, the metal plate 1 is manufactured by forming the skin plate 42 to cover the main body plate 3, smoothing the skin plate 42, and forming the inflow port 7 and the outflow port 8 by cutting. The temperature control device 100 is manufactured by joining the shaft 2 to the metal plate 1 manufactured as described above.

  In the temperature control device 100 manufactured in this way, the material powder PM collides with the surface of the lower layer at a high speed and bites, and deforms itself and adheres to the lower layer. Become a body. The temperature control apparatus 100 according to the first embodiment has a phenomenon in which a metal film bites in at the interface between the base plate 41 and the main body plate lower portion 31 and between the main body plate upper portion 32 and the outer skin plate 42 (an anchor effect and an interface between different materials). The temperature control device 100 is not densely formed between the base plate 41 and the main body plate lower portion 31, and between the main body plate upper portion 32 and the outer skin plate 42 formed of different metals. It is joined to.

  The temperature control apparatus 100 according to the first embodiment can occur when the main body plate 3 formed of a material (a material having a high thermal conductivity) different from the materials of the base plate 41 and the outer skin plate 42 is joined by brazing, for example. It is possible to suppress the occurrence of peeling and cracks between the interfaces. In the temperature control apparatus 100 according to the first embodiment, the main body plate 3 is formed of a material having high thermal conductivity, for example, copper or a copper alloy, and the outer periphery thereof is a base plate 41 and a skin plate made of aluminum or an aluminum alloy. Since it is covered with 42, it becomes possible to improve the temperature distribution of the metal plate 1 while preventing the object of temperature adjustment, for example, copper contamination to the semiconductor.

  Although an example of the manufacturing method of the temperature control apparatus 100 concerning this Embodiment 1 was demonstrated, using the cold spray apparatus 50 grade | etc., Different materials can be joined closely and the temperature distribution of the metal plate 1 can be improved. If possible, the gist of the present invention is satisfied. Therefore, for example, the main body plate lower portion 31 is formed from a bulk material by cutting or the like in advance, and after the groove 9 and the support portion 10 are formed, the lid portion 6 is placed and the cold spray device 50 uses the cold spray device 50 to place the main body plate upper portion 32. Further, the base plate 41 and the skin plate 42 may be formed by the cold spray device 50.

  Furthermore, as a temperature adjustment device according to the modification of the first embodiment, a temperature adjustment device 100A shown in FIG. 5 is exemplified. 100 A of temperature control apparatuses differ from the temperature control apparatus 100 of Embodiment 1 by the point by which the flow path 5 is formed of the pipe 11. FIG. The temperature control device 100A is formed by forming the main body plate lower portion 31 on the base plate 41 with the cold spray device 50 and then placing the pipe 11 and depositing the main body plate upper portion 32 with the cold spray device 50 from the upper portion of the pipe 11. To do. As shown in FIG. 5, the pipe 11 may be a rectangle or the like in addition to a circular cross section. By using the pipe 11 as the flow path 5, it is possible to select the material of the pipe 11 according to the heat medium to be used while improving the temperature distribution of the main body plate 1.

(Embodiment 2)
There is known a temperature adjusting device that adjusts the temperature of each part of an object to be adjusted to a different temperature. Usually, two flow paths are formed in a metal plate, and two different flow paths are adjusted in the flow path (adjusted to the temperature). The temperature of each part of the object is adjusted to a different temperature by causing each of the heat media to flow. In such a temperature control device, two flow paths are formed in one plate, and in order to suppress heat conduction between the plate portions in which the respective flow paths are formed, vacuum grooves are provided so as to separate the respective flow paths. Etc. are formed to adjust the temperature of each part to a desired temperature. However, not only the time required for manufacturing for forming the vacuum groove is increased, but the temperature control may be insufficient only by forming the vacuum groove. In the temperature control device according to the second embodiment, the body plate is formed by using a different metal material by a cold spray device, thereby reducing the time required for manufacturing the metal plate and the temperature of each part of the metal plate. Adjustment can be performed easily.

  Hereinafter, the temperature control apparatus 200 according to the second embodiment will be described with reference to the drawings. FIG. 6 is a cross-sectional view showing the structure of temperature adjustment device 200 according to Embodiment 2 of the present invention. FIG. 7 is a cross-sectional view of the temperature adjusting device 200 shown in FIG.

  The metal plate 201 of the temperature control apparatus 200 according to the second embodiment includes a base plate 41 formed of aluminum or an aluminum alloy, and a main body plate 202 formed on the base plate 41 from a material different from the base plate 41 and having a disk shape. In addition, an object to be temperature-adjusted is placed, and a skin plate 42 formed of the same material as the base plate 41 is provided. The main body plate 202 includes a first main body plate 203 having a cylindrical shape at the center of a disc of the main body plate 202, and a second main body plate 204 provided on the outer peripheral portion of the first main body plate 203 and having a hollow cylindrical shape. Become. The first body plate 203 is made of the same material as the base plate 41 and the skin plate 42, and the second body plate 204 is made of a material having a higher thermal conductivity than the first body plate 203. The temperature adjusting device 200 can adjust the temperature of each plate by causing the heat medium adjusted to different temperatures to flow through the flow paths in each plate, and adjust each part of the object to different temperatures. In the temperature adjusting device 200, the first main body plate 203 is made of aluminum or an aluminum alloy which is the same material as the base plate 41 and the outer skin plate 42, and the second main body plate 204 is made of a material forming the first main body plate 203. It is preferably formed from a metal or alloy having a high thermal conductivity, such as copper or a copper alloy.

  As shown in FIGS. 6 and 7, a first flow path 210 is formed inside the first main body plate 203, and the first heat medium is introduced into the first flow path 210 from the inlet 206, and the first heat medium is The temperature of the object is adjusted by flowing through the first flow path 210, and the first heat medium is led out from the outlet 207.

  A second flow path 211 is formed inside the second body plate 204, a second heat medium is introduced into the second flow path 211 from the inlet 208, and the second heat medium flows through the second flow path 211. Then, the temperature of the object is adjusted, and the second heat medium is led out from the outlet 209 to the outside.

  The temperature adjusting device 200 in which the second main body plate 204 is formed of a metal or alloy having a higher thermal conductivity than the first main body plate 203 usually sets the temperature of the second main body plate 204 (the temperature of the second heat medium) to the first. The temperature is adjusted to be higher than the temperature of the main body plate 203 (temperature of the first heat medium).

  Next, with reference to FIG. 8A-FIG. 8G, the manufacturing method of the temperature control apparatus 200 which concerns on Embodiment 2 is demonstrated. 8A to 8G are cross-sectional views for explaining a manufacturing process of the temperature control device 200 according to Embodiment 2 of the present invention.

  As shown in FIG. 8A, first, the temperature control apparatus 200 according to the second embodiment forms the base plate 41 and the first main body plate lower portion 203b integrally by cutting or the like, and then on the first main body plate lower portion 203b. Then, a groove to be the first flow path 210 is formed by cutting or the like. Alternatively, the groove that becomes the first flow path 210 may be integrally formed by casting or the like.

  Subsequently, as shown in FIG. 8B, the first main body plate upper portion 203a is joined to the first main body plate lower portion 203b by brazing or the like. Alternatively, in the previous step, together with the groove to be the first flow path 210, a support portion is formed by cutting out the opening edge of the groove, and the first flow path 210 is formed by covering with the lid portion. The first main body plate upper portion 203a may be formed by spraying and depositing the metal or alloy material powder PM forming the first main body plate 203 by the cold spray device 50 on the lower main body plate 203b.

  After the first main body plate 203 is formed, as shown in FIG. 8C, a metal or alloy material powder PM forming the second main body plate 204 is sprayed and deposited on the base plate 41 to form the second main body plate lower portion 204b. .

  After smoothing the upper surface of the laminated second body plate lower portion 204b, as shown in FIG. 8D, a groove 213 to be the second flow path 211 is formed by cutting or the like, and the opening edge of the groove 213 is cut. The support part 214 is formed by lacking, and as shown in FIG. 8E, the lid part 212 is placed on the support part 214 to form the second flow path 211.

  Thereafter, as shown in FIG. 8F, the cold spray device 50 applies the metal or alloy material powder PM forming the second main body plate 204 to the second main body plate lower portion 204b where the lid portion 212 is placed on the support portion 214. The second body plate upper part 204a is formed by spraying and depositing.

  After smoothing the upper surface of the laminated second main body plate upper portion 204a, as shown in FIG. 8G, the skin spray plate 42 is formed on the first main body plate upper portion 203a and the second main body plate upper portion 204a by the cold spray device 50. The body powder 202 is formed by spraying and depositing a metal or alloy material powder PM to cover the main body plate 202. Thereafter, the outer skin plate 42 is smoothed, and the inlets 206 and 208 and the outlets 207 and 209 are formed by cutting to manufacture the metal plate 201. The temperature control device 200 is manufactured by joining the shaft 2 to the metal plate 201 manufactured as described above.

  In the temperature control apparatus 200 according to the second embodiment, the main body plate 202 is formed into a first main body plate 203 formed in a cylindrical shape at the center of the disc, and a hollow cylindrical shape is formed in the outer peripheral portion of the first main body plate 203. And a second body plate 204 made of a metal or an alloy having a higher thermal conductivity than the material forming the first body plate 203, and a heat medium adjusted to different temperatures in the flow paths formed in each plate. The temperature distribution of each plate can be improved by adjusting the temperature of each plate by distributing each of the plates.

  Moreover, since the temperature control apparatus 200 according to the second embodiment is manufactured by using the cold spray device 50 to manufacture the second main body plate 204 that constitutes the main body plate 202 and the outer skin plate 42 that covers the main body plate 202, Even when the alloy is joined, it is possible to join closely without generating a gap, and to suppress strain, peeling between interfaces, and cracks that occur during brazing.

  The temperature control apparatus 200 according to the second embodiment can effectively control the temperature of each plate by adopting the configuration as described above. However, a vacuum groove is formed on the joint surface of each plate. Also good. By forming a vacuum groove between the first main body plate 203 and the second main body plate 204 of the temperature adjusting device 200 according to the second embodiment, the temperature distribution of the first main body plate 203 and the second main body plate 204 is changed. The uniformity can be further improved.

(Embodiment 3)
Hereinafter, the temperature control apparatus 300 according to the third embodiment will be described with reference to the drawings. FIG. 9 is a cross-sectional view showing the structure of temperature adjustment device 300 according to Embodiment 3 of the present invention. 10 is a cross-sectional view taken along the line C-C of the temperature adjusting device 300 shown in FIG. 9.

  Similar to the temperature control device 200 according to the second embodiment, the metal plate 301 of the temperature control device 300 according to the third embodiment includes a base plate 41 made of aluminum or an aluminum alloy and a disk-shaped main body plate 302. And a skin plate 42 that covers the main body plate 302 and places an object to be temperature-controlled. The main body plate 302 includes a first main body plate 303 having a cylindrical shape at the center of the disc of the main body plate 302 and a second main body plate 304 having a hollow cylindrical shape at the outer peripheral portion of the first main body plate 303. The main body plate 302 of the temperature control device 300 includes a second main body plate 304 formed of the same material as the base plate 41 and the outer skin plate 42, and a first main body plate 303 formed of a material having higher thermal conductivity than the second main body plate 304. It consists of. By circulating the heat medium adjusted to different temperatures through the first main body plate 303 and the second main body plate 304, the temperature of each plate can be adjusted, and each part of the object can be adjusted to different temperatures. The second body plate 304 of the temperature adjusting device 300 is formed of aluminum or an aluminum alloy of the same material as the base plate 41 and the outer skin plate 42, and the first body plate 303 has a higher thermal conductivity than the material forming the second body plate 304. Preferably, it is formed from a high metal or alloy, such as copper or a copper alloy.

  As shown in FIGS. 9 and 10, a first flow path 310 is formed inside the first main body plate 303, and the first heat medium is introduced into the first flow path 310 from the inlet 306, The temperature of the object is adjusted by flowing through the first flow path 310, and the first heat medium is led out from the outlet 307.

  A second flow path 312 is formed inside the second body plate 304, and the second heat medium is introduced into the second flow path 312 from the inlet 308, and the second heat medium flows through the second flow path 312. Then, the temperature of the object is adjusted, and the second heat medium is led out from the outlet 309 to the outside.

  In the temperature adjusting device 300 in which the first main body plate 303 is formed of a metal or an alloy having a higher thermal conductivity than the second main body plate 304, the temperature of the first main body plate 303 (the temperature of the first heat medium) is normally set to the second. The temperature is adjusted to be higher than the temperature of the main body plate 304 (the temperature of the second heat medium).

  Next, with reference to FIG. 11, the manufacturing process of the temperature control apparatus 300 which concerns on Embodiment 3 is demonstrated. FIG. 11 is a flowchart for explaining a manufacturing process of the temperature adjustment device 300 according to the third embodiment of the present invention.

  In the temperature adjusting device 300 according to the third embodiment, first, the base plate 41 and the second main body plate lower portion 304b are integrally formed by cutting or the like, and then the second main body plate lower portion 304b is secondly cut by cutting or the like. A groove to be the flow channel 312 is formed (step S101). Alternatively, the groove that becomes the second flow path 312 may also be integrally formed by casting or the like.

  Subsequently, the second main body plate upper portion 304a is joined to the second main body plate lower portion 304b by brazing or the like (step S102). Alternatively, in the previous step, together with the groove to be the second flow channel 312, the support portion is formed by cutting out the opening edge of the groove, and the second flow channel 312 is formed by covering with the lid portion, The second main body plate upper portion 304a may be formed by spraying and depositing the metal or alloy material powder PM forming the second main body plate 304 by the cold spray device 50 on the second main body plate lower portion 304b.

  After the formation of the second body plate 304, the first body plate lower portion 303b is formed by spraying and depositing the metal or alloy material powder PM forming the first body plate 303 on the base plate 41 (step S103).

  After smoothing the upper surface of the laminated first main body plate lower portion 303b, a groove to be the first flow path 310 is formed by cutting or the like, and a support portion is formed by cutting out the opening edge of the groove (step) S104), the lid portion 311 is placed on the support portion to form the first flow path 310 (step S105).

  Thereafter, the cold spray device 50 sprays and deposits the metal or alloy material powder PM forming the first main body plate 303 on the first main body plate lower portion 303b on which the lid portion 311 is placed on the support portion, thereby allowing the first main body plate 303 to be deposited. One main body plate upper part 303a is formed (step S106).

  After smoothing the upper surface of the laminated first main body plate upper portion 303a, the material powder PM of the outer skin plate 42 is sprayed and deposited on the first main body plate upper portion 303a and the second main body plate upper portion 304a by the cold spray device 50. Thus, the outer skin plate 42 is formed to cover the main body plate 302 (step S107). Thereafter, the outer skin plate 42 is smoothed and the inlets 306 and 308 and the outlets 307 and 309 are formed by cutting to manufacture the metal plate 301. The temperature adjusting device 300 is manufactured by joining the shaft 2 to the metal plate 301 manufactured as described above.

  In the temperature adjustment device 300 according to the third embodiment, the main body plate 302 is formed in a columnar shape at the center of the disk, and is formed of a material having higher thermal conductivity than the material forming the base plate 41 and the outer skin plate 42. Each of the first main body plate 303 and the second main body plate 304 formed of the same material as the base plate 41 and the outer skin plate 42 on the outer periphery of the first main body plate 303. The uniformity of the temperature distribution of each plate can be improved by adjusting the temperature of each plate by flowing a heat medium adjusted to a different temperature through each of the formed channels.

  Moreover, since the temperature control apparatus 300 concerning this Embodiment 3 manufactures the 1st main body plate 303 which comprises the main body plate 302, and the outer skin | plate 42 which coat | covers the main body plate 302 with the cold spray apparatus 50, it is different metal or Even when the alloy is joined, it is possible to join closely without generating a gap, and to suppress strain, peeling between interfaces, and cracks that occur during brazing.

  The temperature adjustment device 300 according to the third embodiment can effectively adjust the temperature of each plate by adopting the above-described configuration. However, a vacuum groove is formed on the bonding surface of each plate. Also good. By forming a vacuum groove between the first main body plate 303 and the second main body plate 304 of the temperature adjusting device 300 according to the third embodiment, the temperature distribution of the first main body plate 303 and the second main body plate 304 is changed. The uniformity can be further improved.

  INDUSTRIAL APPLICABILITY The present invention can be used in a temperature control apparatus and a manufacturing method thereof, and more specifically, in a manufacturing process of a semiconductor or the like, a cold plate used for temperature control of a substrate or the like, particularly each part to be temperature controlled. This is effective when controlling to different temperatures.

1, 201, 301 Metal plate 2 Shaft 3, 202, 302 Body plate 5 Flow path 6 Lid 7, 206, 208, 306, 308 Inlet 8, 207, 209, 307, 309 Outlet 11 Pipe 41 Base plate 42 Skin Plate 50 Cold spray device 51 Gas introduction pipe 51a, 51b Valve 52 Powder supply part 53 Heater 54 Chamber 55 Nozzle 203, 303 First main body plate 204, 304 Second main body plate 210, 310 First flow path 211, 312 Second flow Road

Claims (15)

In the temperature control apparatus having a plate in which a flow path for circulating the heat medium is formed,
The plate is
A base plate made of aluminum or an aluminum alloy;
A body formed by accelerating a powder of a metal or alloy having a higher thermal conductivity than aluminum or an aluminum alloy together with a gas and spraying and depositing the powder in a solid state toward the base plate, and having the flow path therein Plates,
A skin plate on which an object to be temperature-controlled is placed, formed from the same material as the base plate, and covers the body plate;
A temperature control device comprising:   The temperature control apparatus according to claim 1, further comprising a pipe embedded in the main body plate to form the flow path.   The temperature control device according to claim 1, wherein the flow path is formed by a groove formed in the main body plate and a lid portion covering the groove.   The main body plate has a disc shape, and includes a first main body plate having a columnar shape at the center of the disc, and a second main body plate having a hollow cylindrical shape provided on the outer peripheral portion of the first main body plate. The first body plate is made of the same material as the base plate and the outer skin plate, and the second body plate is made of a metal or alloy having a higher thermal conductivity than the material forming the first body plate. The temperature control device according to any one of claims 1 to 3. A first flow path through which the first heat medium flows is formed inside the first main body plate, and a second heat medium having a temperature higher than the first heat medium flows through the second main body plate. The temperature control apparatus according to claim 4 , wherein two flow paths are formed.   The main body plate has a disc shape, and includes a first main body plate having a columnar shape at the center of the disc, and a second main body plate having a hollow cylindrical shape provided on the outer peripheral portion of the first main body plate. The second body plate is made of the same material as the base plate and the skin plate, and the first body plate is made of a metal or alloy having a higher thermal conductivity than the material forming the second body plate. The temperature control device according to any one of claims 1 to 3. A first flow path through which the first heat medium flows is formed in the first body plate, and a second heat medium having a temperature lower than that of the first heat medium flows in the second body plate. The temperature control device according to claim 6 , wherein two flow paths are formed. The temperature control device according to any one of claims 4 to 7 , further comprising a vacuum groove between the first main body plate and the second main body plate. Temperature regulating device according to any one of claims 1-8, wherein the target temperature control is a semiconductor. In the manufacturing method of the temperature control device having a plate in which a flow path for circulating the heat medium is formed,
Forming the lower part of the main body plate by accelerating a metal or alloy powder having a higher thermal conductivity than aluminum or an aluminum alloy together with the gas and spraying the base plate made of aluminum or aluminum alloy in a solid state to form the lower part of the main body plate Process,
A flow path forming step of forming a groove to be the flow path in the lower portion of the main body plate formed in the lower portion of the main body plate; and
A lid placement step of placing a lid portion covering the groove on top of the groove;
Forming the upper part of the main body plate by accelerating the same metal or alloy powder as the lower part of the main body plate together with the gas and spraying it in the solid state in the lower part of the main body plate where the lid is arranged Process,
The same metal or alloy powder as the base plate is accelerated together with the gas on the upper part of the main body plate and sprayed in the solid state to cover the main body plate to form a skin plate on which the object to be temperature-controlled is placed. A coating process to
The manufacturing method of the temperature control apparatus characterized by including. In the manufacturing method of the temperature control device having a plate in which a flow path for circulating the heat medium is formed,
Forming the lower part of the main body plate by accelerating a metal or alloy powder having a higher thermal conductivity than aluminum or an aluminum alloy together with the gas and spraying the base plate made of aluminum or aluminum alloy in a solid state to form the lower part of the main body plate Process,
A pipe placement step of placing a pipe serving as the flow path at the bottom of the body plate formed in the body plate lower portion formation step;
A main body plate upper part forming step of accelerating the same metal or alloy powder as the lower part of the main body plate together with the gas and spraying it in the solid state in the lower part of the main body plate where the pipe is arranged When,
The same metal or alloy powder as the base plate is accelerated together with the gas on the upper part of the main body plate, and sprayed in a solid state to cover the main body plate, thereby forming an outer skin plate on which an object to be temperature-controlled is placed. A coating process;
The manufacturing method of the temperature control apparatus characterized by including. In the method of manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed,
A base plate made of aluminum or an aluminum alloy has a first flow path through which the first heat medium is circulated, and a first main body plate made of the same material as the base plate is formed at the center of the disk. A first body plate forming step;
From the material which has the 2nd channel which distributes the 2nd heat carrier on the base plate, and is provided in the perimeter part of the 1st body plate, makes a hollow cylinder shape, and forms the 1st body plate A second body plate forming step of forming a second body plate made of a metal or alloy having a high thermal conductivity;
The first body plate and the second body plate are accelerated together with gas with the same metal or alloy powder as the base plate, and sprayed in a solid state to cover the first body plate and the second body plate , A coating step for forming a skin plate on which a target to be temperature-controlled is placed;
Including
The second body plate forming step includes
A second body plate lower part forming step of accelerating a metal or alloy powder together with a gas on the base plate and spraying it in a solid state to form a lower part of the second body plate;
Forming the second flow path by forming a groove and covering with a lid on the lower part of the second main body plate formed in the second main body plate lower forming step, or forming the second flow path by arranging a pipe A flow path forming step,
The second main body plate upper portion that further accelerates the metal or alloy powder together with the gas to the lower portion of the second main body plate that forms the second flow path, and sprays it in the solid state to form the second main body plate upper portion. Forming process;
The manufacturing method of the temperature control apparatus characterized by including. In the method of manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed,
A metal or alloy having a first flow path for flowing the first heat medium on a base plate made of aluminum or an aluminum alloy, having a cylindrical shape in the center of the disk, and a higher thermal conductivity than the material forming the base plate A first body plate forming step for forming a first body plate comprising:
A second channel on the base plate, having a second flow path through which the second heat medium is circulated, provided on the outer peripheral portion of the first main body plate, forming a hollow cylindrical shape, and made of the same material as the base plate. A second body plate forming step for forming a body plate;
The first body plate and the second body plate are accelerated together with gas with the same metal or alloy powder as the base plate, and sprayed in a solid state to cover the first body plate and the second body plate , A coating step for forming a skin plate on which a target to be temperature-controlled is placed;
Including
The first body plate forming step includes
A first body plate lower part forming step of accelerating a metal or alloy powder together with a gas on the base plate and spraying it in a solid state to form a lower part of the first body plate;
A flow that forms the first flow path by forming a groove and covering it with a lid in the lower part of the first main body plate formed in the first lower part of the main body plate, or forming a first flow path by arranging a pipe. A road formation process;
A first body plate upper portion forming the first body plate upper portion by further accelerating the powder of the metal or alloy together with the gas and spraying it in the solid phase state on the lower portion of the first body plate forming the first flow path. Process,
The manufacturing method of the temperature control apparatus characterized by including. In the method of manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed,
A base plate made of aluminum or an aluminum alloy has a first flow path through which the first heat medium is circulated, and a first main body plate made of the same material as the base plate is formed at the center of the disk. A first body plate forming step;
From the material which has the 2nd channel which distributes the 2nd heat carrier on the base plate, and is provided in the perimeter part of the 1st body plate, makes a hollow cylinder shape, and forms the 1st body plate A second body plate forming step of forming a second body plate made of a metal or alloy having a high thermal conductivity;
The first body plate and the second body plate are accelerated together with gas with the same metal or alloy powder as the base plate, and sprayed in a solid state to cover the first body plate and the second body plate , A coating step for forming a skin plate on which a target to be temperature-controlled is placed;
Including
The second body plate forming step includes
A second body plate lower part forming step of accelerating a metal or alloy powder together with a gas on the base plate and spraying it in a solid state to form a lower part of the second body plate;
A pipe disposing step of disposing a pipe serving as the second flow path in the second main body plate lower portion formed in the second main body plate lower portion forming step;
A second body plate upper part forming step of accelerating a metal or alloy powder together with a gas to the lower part of the second body plate in which the pipe is disposed and spraying it in a solid state to form an upper part of the second body plate; ,
The manufacturing method of the temperature control apparatus characterized by including. In the method of manufacturing a temperature control device having a disk-like plate in which a flow path for circulating a heat medium is formed,
A metal or alloy having a first flow path for flowing the first heat medium on a base plate made of aluminum or an aluminum alloy, having a cylindrical shape in the center of the disk, and a higher thermal conductivity than the material forming the base plate A first body plate forming step for forming a first body plate comprising:
A second channel on the base plate, having a second flow path through which the second heat medium is circulated, provided on the outer peripheral portion of the first main body plate, forming a hollow cylindrical shape, and made of the same material as the base plate. A second body plate forming step for forming a body plate;
The first body plate and the second body plate are accelerated together with gas with the same metal or alloy powder as the base plate, and sprayed in a solid state to cover the first body plate and the second body plate , A coating step for forming a skin plate on which a target to be temperature-controlled is placed;
Including
The first body plate forming step includes
A first body plate lower part forming step of accelerating a metal or alloy powder together with a gas on the base plate and spraying it in a solid state to form a lower part of the first body plate;
A pipe disposing step of disposing a pipe serving as the first flow path on the first main body plate lower portion formed in the first main body plate lower portion forming step;
A body plate upper part forming step for further accelerating a metal or alloy powder together with a gas to the lower part of the first body plate in which the pipe is arranged, and spraying it in a solid state to form an upper part of the first body plate;
The manufacturing method of the temperature control apparatus characterized by including.

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