JP5534601B2 - Cutting fluid supply device - Google Patents

Description

  The present invention relates to a cutting fluid supply apparatus.

  A cutting fluid is supplied to a processing machine that cuts a workpiece such as a metal material or a substrate for the purpose of lubrication, cooling, and cleaning. This cutting fluid is normally stored in a tank, circulated between the tank and the processing machine by a circulation pump, and used repeatedly.

  For this reason, organic materials such as chips and abrasive grains are often mixed in the cutting fluid, which causes a reduction in processing performance and cleaning performance. Then, the removal technique which removes the contaminant mixed in the cutting fluid is proposed (for example, refer to patent documents 1).

JP 2005-96053 A

  However, in the above-mentioned removal technology, the removal of the contaminants mixed in the cutting fluid suppresses the deterioration of the processing performance and the cleaning performance, but the cleaning performance itself is not improved, so the improvement of the cleaning performance is desired. Yes.

  The present invention has been made in view of the above, and an object of the present invention is to reduce cutting performance and cleaning performance of a processing machine using a cutting fluid, and to further improve the cleaning performance. It is to provide a feeding device.

According to an embodiment of the present invention, in the cutting fluid supply apparatus, a tank that stores cutting fluid, an inert gas supply unit that supplies an inert gas, and the inert gas supply unit that is provided in the tank. A first bubble generator that generates microbubbles in the cutting fluid in the tank using the inert gas supplied by the tank, and the tank and a processing machine that uses the cutting fluid. A liquid supply passage for supplying the cutting fluid in the processing machine, a drain passage for connecting the processing machine and the tank, and returning the cutting fluid from the processing machine to the tank; Provided in the middle of the liquid supply flow path, and supplied by a pump for flowing the cutting fluid in the tank to the liquid supply flow path, an oxidizing gas supply section for supplying an oxidizing gas, and the oxidizing gas supply section. Using the oxidizing gas, the liquid supply And a second bubble generator for generating microbubbles in the cutting fluid flowing in the flow path, before Symbol inert gas supply unit, the supply amount of the inert gas to the first bubble generator More than the supply amount of the oxidizing gas to the second bubble generator .

  ADVANTAGE OF THE INVENTION According to this invention, the fall of the processing performance and washing | cleaning performance of the processing machine using a cutting fluid can be suppressed, and the washing | cleaning performance can be improved further.

It is a mimetic diagram showing a schematic structure of a cutting fluid supply device concerning a 1st embodiment of the present invention. It is sectional drawing which shows schematic structure of the liquid supply head with which the cutting fluid supply apparatus which concerns on the 2nd Embodiment of this invention is provided.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 1, a cutting fluid supply apparatus 1 according to a first embodiment of the present invention includes a tank 2 that stores cutting fluid, an inert gas supply unit 3 that supplies an inert gas, and an inertness thereof. A first bubble generator 4 for generating microbubbles in the cutting fluid in the tank 2 using gas, a circulation channel 5 extending from the tank 2 to the processing machine 11 and extending from the processing machine 11 to the tank 2; A circulation pump 6 that circulates the cutting fluid in the tank 2 through the circulation channel 5, an oxidizing gas supply unit 7 that supplies oxidizing gas, and the cutting fluid that circulates the circulation channel 5 using the oxidizing gas. And a second bubble generator 8 for generating microbubbles.

The inert gas supply unit 3 is connected to the first bubble generator 4 in the tank 2 by an inert gas supply channel 3a through which the inert gas flows, and the inert gas is supplied to the first bubble generator 4. An inert gas is supplied through the supply flow path 3a. The inert gas supply unit 3 includes an on-off valve, a pressure regulator, and the like, and is set to supply an inert gas at a predetermined pressure and flow rate. This setting is performed in advance so that, for example, a desired amount of microbubbles is generated satisfactorily. As the inert gas, e.g., nitrogen (N ₂₎ or the like is used.

  The first bubble generator 4 is provided near the bottom in the tank 2, and microbubbles such as micro-bubbles are formed in the cutting fluid in the tank 2 using the inert gas supplied by the inert gas supply unit 3. Generate a bubble. As the first bubble generator 4, for example, a filter-type bubble generator is used. The filter-type bubble generator includes a first porous filter having a cylindrical shape and a second porous filter having a cylindrical shape provided in contact with the outer peripheral surface thereof. When an inert gas is supplied to the hollow portion inside the filter, microbubbles are generated from the outer peripheral surface of the second porous filter.

  The circulation flow path 5 connects the tank 2 and the processing machine 11 and connects the processing machine 11 and the tank 2 with the liquid supply flow path 5 a for supplying the cutting fluid from the tank 2 to the processing machine 11. And a drainage flow path 5 b for returning the cutting fluid to the tank 2. As these liquid supply channel 5a and drainage channel 5b, for example, a tube, a pipe, or the like is used. One end of the liquid supply flow path 5a on the tank 2 side is positioned substantially at the center (center layer) of the depth of the tank 2, and one end of the drainage flow path 5b on the tank 2 side is below the side wall of the tank 2. It penetrates the part and is positioned in the lower layer part below the above-mentioned center part.

  Here, the processing machine 11 is directed to a cutting member 11a such as a dicing blade or a drill for cutting the workpiece T1 such as a metal material or a substrate, and a cutting portion where the cutting member 11a and the workpiece T1 come into contact. And a liquid supply head 11b for supplying a cutting fluid. The liquid supply head 11b has a plurality of nozzles 11b1 and 11b2, and discharges cutting fluid from the nozzles 11b1 and 11b2, respectively. The other end of the liquid supply flow path 5a is connected to the liquid supply head 11b, and the other end of the drainage flow path 5b is connected to the bottom surface of the processing machine 11. The processing machine 11 cuts the workpiece T1 with the cutting member 11a while supplying the cutting fluid to the cutting location with the liquid supply head 11b.

  The circulation pump 6 is provided in the middle of the liquid supply passage 5a, and is a drive source for flowing the cutting fluid in the tank 2 from the tank 2 to the processing machine 11 through the liquid supply passage 5a. The circulation pump 6 sucks up the cutting fluid in the tank 2 to its own position via the liquid supply passage 5a, pressurizes the sucked cutting fluid from its own position, and supplies it to the liquid supply head 11b of the processing machine 11. . Accordingly, a downstream side of the circulation pump 6 in the liquid supply flow path 5a is a pressurization line. For example, a liquid pump is used as the circulation pump 6.

The oxidizing gas supply unit 7 is connected to the second bubble generator 8 by an oxidizing gas supply flow path 7a through which the oxidizing gas flows, and the oxidizing gas supply flow path 7a is connected to the second bubble generator 8. The oxidizing gas is supplied through The oxidizing gas supply unit 7 includes an on-off valve, a pressure regulator, and the like, and is set to supply the oxidizing gas at a predetermined pressure and flow rate. This setting is performed in advance so that the desired amount of micro / nano bubbles is generated. The oxidizing gas contains oxygen and has an oxidizing power. As this oxidizing gas, for example, oxygen (O ₂ ), ozone (O ₃ ) or the like is used.

  The 2nd bubble generator 8 is provided in the middle of the liquid supply flow path 5a, and uses the oxidizing gas supplied by the oxidizing gas supply part 7 in the cutting fluid which flows through the liquid supply flow path 5a. Microbubbles, such as micronano bubbles, are generated. The second bubble generator 8 includes a first orifice member 8a through which the oxidizing gas passes, a gas dissolving member 8b that dissolves the oxidizing gas in the cutting fluid that passes through the liquid supply passage 5a, and an oxidation thereof. And a second orifice member 8c through which the cutting fluid in which the property gas is dissolved passes.

  The first orifice member 8a has a plurality of through holes 8a1 and is provided in the middle of the oxidizing gas supply flow path 7a. For example, each through hole 8a1 is formed so as to penetrate in parallel to each other. This first orifice member 8a increases the gas flow of the oxidizing gas that passes through the oxidizing gas supply flow path 7a to a plurality of through holes 8a1 and improves the dissolving efficiency of the oxidizing gas with respect to the cutting fluid.

  The gas dissolving member 8b is positioned and provided upstream of the circulation pump 6 in the middle of the liquid supply flow path 5a. An oxidizing gas supply flow path 7a is connected to the gas dissolving member 8b. The gas dissolving member 8b dissolves (mixes) the oxidizing gas supplied from the oxidizing gas supply unit 7 through the oxidizing gas supply flow path 7a into the cutting fluid passing through the gas dissolving member 8b. For example, a T-shaped tube or an aspirator is used as the gas dissolving member 8b. When this aspirator is used, the amount of oxidizing gas dissolved in the cutting fluid increases due to the venturi effect.

  The second orifice member 8c has a plurality of through holes 8c1, and is positioned and provided downstream of the circulation pump 6 in the middle of the liquid supply flow path 5a. For example, the through holes 8c1 are formed so as to penetrate each other in parallel. The second orifice member 8c decompresses and releases the dissolved gas in the cutting fluid that passes through each through-hole 8c1, and generates microbubbles, for example, micro-nano bubbles, in the cutting fluid. A venturi tube may be used as the bubble generating member instead of the second orifice member 8c.

  Here, since the downstream side of the circulation pump 6 in the liquid supply flow path 5 a is a pressurization line, a gas dissolving member 8 b is provided on the upstream side of the circulation pump 6, and the second orifice member is provided on the downstream side of the circulation pump 6. 8c is provided. This is because the oxidizing gas is more easily dissolved in the cutting fluid when the oxidizing gas is supplied to the cutting fluid before pressurization. Although the amount of oxidizing gas dissolved in the cutting fluid decreases, the order of the gas dissolving member 8b and the circulation pump 6 may be reversed.

  In the cutting fluid supply apparatus 1 having such a configuration, after the apparatus is activated, the inert gas is supplied from the inert gas supply unit 3 to the first gas in the tank 2 via the inert gas supply flow path 3a at a predetermined pressure and flow rate. It is supplied to the bubble generator 4. As a result, micro bubbles such as micro bubbles are generated from the first bubble generator 4 in the cutting fluid in the tank 2.

  The circulation pump 6 is also driven, and the cutting fluid in the tank 2 circulates in the circulation channel 5. At this time, the oxidizing gas is supplied from the oxidizing gas supply unit 7 to the gas melting member 8b through the oxidizing gas supply channel 7a at a predetermined pressure and flow rate. The gas flow of the oxidizing gas passing through the oxidizing gas supply channel 7a is increased to a plurality by the first orifice member 8a on the way and flows into the gas dissolving member 8b. The inflowing oxidizing gas is dissolved in the cutting fluid passing through the inside by the gas dissolving member 8b.

  Thereafter, the dissolved gas in the cutting fluid flowing through the fluid supply channel 5a is decompressed and released by the second orifice member 8c, and microbubbles such as micro-nano bubbles are generated in the cutting fluid. The cutting fluid containing microbubbles is supplied to the processing machine 11 via the liquid supply flow path 5a, and the liquid supply head 11b of the processing machine 11 is directed to a cutting location where the cutting member 11a and the workpiece T1 come into contact. Discharged.

  Thereafter, the drainage of the cutting fluid is returned into the tank 2 via a drainage flow path 5b connected to the bottom surface of the processing machine 11 due to a difference in height between the processing machine 11 and the tank 2, for example. In the schematic diagram of FIG. 1, the other end of the drainage flow path 5 b is lower than the liquid level in the tank 2, but the cutting fluid is put into the tank 2 using the height difference. When returning, the other end of the drainage flow path 5b is set to a higher position.

  Here, micro bubbles such as microbubbles are generated in the cutting fluid in the tank 2, and the micro bubbles float toward the liquid surface. The micro bubbles adhere to the organic matter in the cutting fluid in the tank 2 and float the organic matter on the liquid surface. Thereby, since the organic substance existing in the cutting fluid in the tank 2 moves to the liquid level, the organic substance in the cutting fluid in the tank 2 is prevented from reaching the processing machine 11 via the liquid supply channel 5a. As a result, the deterioration of the processing performance and cleaning performance of the processing machine 11 can be suppressed.

  Further, in the second bubble generator 8, since the oxidizing gas is dissolved in the cutting fluid by the gas dissolving member 8b, the dissolved oxygen amount (DO value) of the cutting fluid is increased, and the cutting member 11a and the workpiece T1 are cut. Improves the oxidative degradation rate of organic substances adhering to the surface. Therefore, the cleaning performance of the processing machine 11 that uses the cutting fluid is improved. Further, the dissolved gas is decompressed and released by the second orifice member 8c, and micro bubbles such as micro-nano bubbles are generated in the cutting fluid. Since the cutting fluid containing these microbubbles is supplied to the processing machine 11, the removal capability of removing organic substances adhering to the cutting member 11a and the workpiece T1 is improved. Therefore, the cleaning performance of the processing machine 11 that uses the cutting fluid is improved.

  As described above, in order to improve the removal of organic matter, the amount of dissolved oxygen in the cutting fluid is increased to remove organic matter during cleaning due to the oxidation effect. However, if the amount of dissolved oxygen in the cutting fluid is increased, the cutting fluid Since it becomes easy to oxidize, the corrosion progress of the cutting fluid is accelerated and the life of the cutting fluid is shortened. Therefore, it is difficult to achieve both the improvement of organic matter removal and the extension of the cutting fluid life.

  Therefore, the supply amount of the inert gas to the first bubble generator 4 by the inert gas supply unit 3 is larger than the supply amount of the oxidizing gas to the second bubble generator 8 by the oxidizing gas supply unit 7. Is set to Thereby, oxygen in the cutting fluid in the tank 2 is surely expelled from the cutting fluid by the inert gas, and the cutting fluid in the tank 2 is prevented from being oxidized, so that the life of the cutting fluid is extended. As described above, since the supply amount of the inert gas is larger than the supply amount of the oxidizing gas, even if the dissolved oxygen amount of the cutting fluid in the tank 2 is increased, the reduction in the life of the cutting fluid is suppressed. It is possible to achieve both improvement of organic matter removal and extension of the cutting fluid life.

  As described above, according to the first embodiment of the present invention, the tank is provided by providing the first bubble generator 4 for generating microbubbles in the cutting fluid in the tank 2 using an inert gas. Microbubbles such as microbubbles are generated in the cutting fluid in 2, and the microbubbles adhere to the organic matter in the cutting fluid in the tank 2 to float the organic matter on the liquid surface. Thereby, the organic matter existing in the cutting fluid in the tank 2 moves to the liquid surface, and the organic matter in the cutting fluid in the tank 2 is prevented from reaching the processing machine 11 via the liquid supply channel 5a. Therefore, it is possible to suppress a decrease in the processing performance of the processing machine 11 and the cleaning performance of the cutting fluid.

  Further, by providing the second bubble generator 8 for generating microbubbles in the cutting fluid flowing through the liquid supply flow path 5a using the oxidizing gas, the oxidizing gas is dissolved in the cutting fluid and the cutting fluid is dissolved. Since the amount of oxygen is increased and the oxidative decomposition rate with respect to the organic matter is improved, the cleaning performance of the processing machine 11 using the cutting fluid can be improved. In addition, the dissolved gas in the cutting fluid is decompressed and released, and microbubbles such as micro-nano bubbles are generated in the cutting fluid. Since the cutting fluid containing these microbubbles is supplied to the processing machine 11, the removal performance for removing the organic matter adhering to the cutting member 11a and the workpiece T1 is improved, so that the cleaning performance of the processing machine 11 using the cutting fluid is improved. Can be improved.

  Further, the inert gas supply unit 3 makes the supply amount of the inert gas to the first bubble generator 4 larger than the supply amount of the oxidizing gas to the second bubble generator 8. Thereby, oxygen in the cutting fluid in the tank 2 is reliably driven out of the cutting fluid by the inert gas, and oxidation of the cutting fluid in the tank 2 is suppressed, so that the life of the cutting fluid can be extended. .

  The second bubble generator 8 includes a first orifice member 8a having a plurality of through holes 8a1 through which an oxidizing gas passes. Since each of the through holes 8a1 of the first orifice member 8a increases the gas flow of the oxidizing gas passing through the oxidizing gas supply flow path 7a, the efficiency of dissolving the oxidizing gas with respect to the cutting fluid is improved. Can do.

  The second bubble generator 8 includes a gas dissolving member 8b for dissolving the oxidizing gas in the cutting fluid flowing in the liquid supply flow path 5a, and a plurality of through holes 8c1 through which the cutting fluid in which the oxidizing gas is dissolved passes. And a second orifice member 8c. Thereby, the micro bubble which contains oxidizing gas in a cutting fluid reliably with a simple structure can be produced | generated.

  The gas dissolving member 8b is provided upstream of the circulation pump 6 in the liquid supply flow path 5a, and the second orifice member 8c is provided downstream of the circulation pump 6 in the liquid supply flow path 5a. Yes. Thereby, since oxidizing gas is supplied with respect to the cutting fluid before pressurization, the oxidizing gas is easy to melt | dissolve in cutting fluid, and can increase the amount of dissolution of oxidizing gas with respect to cutting fluid. Therefore, in addition to the increase in the dissolved amount of the oxidizing gas, a large amount of microbubbles can be generated reliably by pressurizing the second orifice member 8c.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIG.

  The second embodiment of the present invention is basically the same as the first embodiment. In the second embodiment, differences from the first embodiment will be described, the same parts as those described in the first embodiment will be denoted by the same reference numerals, and the description thereof will also be omitted.

  As shown in FIG. 2, in the cutting fluid supply apparatus according to the second embodiment of the present invention, the second orifice member 8c is provided separately for the nozzle 11b1 and the nozzle 11b2 provided in the fluid supply head 11b of the processing machine 11. It has been.

  The second orifice member 8c is provided near the tip of the nozzles 11b1 and 11b2, and one end of the second orifice member 8c is in contact with the cutting fluid, and the other end is open to the atmosphere. is there. The second orifice member 8c depressurizes the dissolved gas in the cutting fluid that passes through each through-hole 8c1 and releases it to the atmosphere to generate microbubbles such as micro-nano bubbles in the cutting fluid. At the same time, the microbubbles Is discharged from each through hole 8c1.

  As described above, according to the second embodiment of the present invention, the same effect as that of the first embodiment can be obtained. Further, by providing the second orifice member 8c in the nozzles 11b1 and 11b2 of the liquid supply head 11b, minute bubbles are generated not in the middle of the liquid supply flow path 5a but in the nozzles 11b1 and 11b2 portions. A large amount of microbubbles is not generated in 5a. As a result, pressure loss due to the presence of a large amount of microbubbles in the liquid supply channel 5a is prevented, so that the cutting fluid can be discharged at a desired pressure, and the cleaning performance of the processing machine 11 is reduced. Can be suppressed.

  Here, in the first and second embodiments described above, the microbubbles are microbubbles including concepts such as microbubbles (MB), micronanobubbles (MNB), and nanobubbles (NB). For example, microbubbles are bubbles having a diameter of 10 μm to several tens of μm, micronano bubbles are bubbles having a diameter of several hundred nm to 10 μm, and nanobubbles are bubbles having a diameter of several hundred nm or less.

  In addition, the above-mentioned embodiment which concerns on this invention is an illustration, and the scope of the invention is not limited to them. The above-described embodiment can be variously modified. For example, some components may be deleted from all the components shown in the above-described embodiment, and further, components according to different embodiments may be appropriately combined. Also good.

  For example, the oxidizing gas supply unit 7 is controlled by a control unit (not shown) of the cutting fluid supply apparatus 1, and the supply amount of the oxidizing gas is increased or decreased according to the type (for example, hardness) of the workpiece T1. You may do it. Further, in this case, the inert gas supply unit 3 may be controlled by the control unit in accordance with the increase in the supply amount of the oxidizing gas, and the supply amount of the inert gas may be increased. Conversely, when the supply amount of the oxidizing gas is reduced, the supply amount of the inert gas is also reduced accordingly. The supply amount of the inert gas is maintained by the control of the control unit so as to be larger than the supply amount of the oxidizing gas. In this way, it is possible to obtain a cleaning performance corresponding to the type of workpiece T1, and in addition, it is possible to reliably suppress oxidation of the cutting fluid in the tank 2 due to an increase in the supply amount of oxidizing gas. .

  Further, a measuring instrument (not shown) for measuring the amount of oxygen in the cutting fluid is provided in the tank 2, and when the amount of oxygen exceeds a predetermined amount, the inert gas supply unit 3 is controlled by the control unit. It may be controlled to increase the supply amount of the inert gas. As a result, when the amount of oxygen in the cutting fluid in the tank 2 exceeds a predetermined amount, the minute bubbles in the tank 2 due to the inert gas increase, so that the oxygen in the cutting fluid in the tank 2 is reliably contained in the cutting fluid. Thus, the cutting fluid in the tank 2 can be prevented from being oxidized and the life of the cutting fluid can be reliably extended.

DESCRIPTION OF SYMBOLS 1 Cutting fluid supply apparatus 2 Tank 3 Inert gas supply part 4 1st bubble generator 5 Circulation flow path 6 Circulation pump (pump)
7 Oxidizing gas supply section 8 Second bubble generator 8a First orifice member 8a1 Through hole 8b Gas dissolving member 8c Second orifice member 8c1 Through hole 11 Processing machine 11b1 Nozzle 11b2 Nozzle

Claims (5)

A tank for storing cutting fluid;
An inert gas supply section for supplying an inert gas;
A first bubble generator that is provided in the tank and generates microbubbles in the cutting fluid in the tank using the inert gas supplied by the inert gas supply unit;
A liquid supply channel for connecting the tank and a processing machine using the cutting fluid, and supplying the cutting fluid in the tank to the processing machine;
A drainage flow path for connecting the processing machine and the tank and returning the cutting fluid from the processing machine to the tank;
A pump provided in the middle of the liquid supply flow path, and a flow of cutting fluid in the tank to the liquid supply flow path;
An oxidizing gas supply section for supplying an oxidizing gas;
Using the oxidizing gas supplied by the oxidizing gas supply unit, and a second bubble generator for generating microbubbles in a cutting fluid flowing through said fluid supply passage,
The inert gas supply unit makes the supply amount of the inert gas to the first bubble generator larger than the supply amount of the oxidizing gas to the second bubble generator. apparatus. It said second bubble generator, cutting fluid supply device according to claim 1, wherein the oxidizing gas is provided with a first orifice member having a plurality of through-holes passing through. The second bubble generator is
A gas dissolving member for dissolving the oxidizing gas in the cutting fluid flowing through the liquid supply channel;
A second orifice member having a plurality of through holes through which the cutting fluid in which the oxidizing gas is dissolved passes;
The cutting fluid supply device according to claim 1 , wherein the cutting fluid supply device is provided. The cutting fluid supply device according to claim 3, wherein the second orifice member is provided in a nozzle through which the processing machine discharges the cutting fluid. The gas dissolving member is provided upstream of the pump in the liquid supply channel,
The cutting fluid supply device according to claim 3 or 4, wherein the second orifice member is provided on the downstream side of the pump in the fluid supply channel.

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