JP5229107B2 - IC card manufacturing method and IC card manufacturing system - Google Patents

Description

  The present invention relates to an IC card manufacturing method and an IC card manufacturing system, and more particularly to an IC card manufacturing method and an IC card manufacturing system having a good appearance.

  An IC card is used for personal identification such as a driver's license or an employee ID card. For example, such an IC card incorporates an electronic component (IC module) called an inlet having an IC chip, a reinforcing plate and an antenna. Some have a writing layer that has a face image and description information on the front surface and can be filled in with a writing tool on the back surface, and is printed according to the card.

  As a method for producing such an IC card, there are a heat bonding method, an adhesive bonding method, and an injection molding method. For example, in the adhesive bonding method, a long web or sheet in which an adhesive layer is formed in advance. An IC chip, a reinforcing plate, and an inlet having an antenna are placed and bonded between a pair of base materials in the form of a leaf sheet. After that, heat and pressure are applied to embed the inlet through an adhesive, and then the bonding is performed. An integrated card is punched into a desired card shape to form an IC card.

  The adhesive used in the adhesive laminating method generally has low fluidity, and is difficult to spread except for the applied part. When performing an adhesive bonding method using such an adhesive, if the adhesive is uniformly applied to one base material, an inlet is placed on the base material, and then bonded to the other base material, it adheres to the base material. Since the agent is uniformly applied, the adhesive remains in the region where the inlet between the substrates is present. On the other hand, the adhesive is insufficient in the region where there is no inlet between the substrates, and air may remain in the region where the adhesive is insufficient, resulting in bubbles. If the bubbles are located at the end of the card when the card is punched out, there is a problem that the appearance of the card deteriorates.

  In Patent Document 1, an inlet arranged in a vertical and horizontal two-dimensional array on a second sheet material is transported, and a coating head having a sliding gap larger than a non-existing region in the region where the inlet is present is used. For example, the application amount of the adhesive is changed in the region 40 where the inlet 20 in the direction parallel to the conveyance direction 30 of the substrate 10 as shown in FIG. 1 does not exist and the region 50 where the inlet exists, as shown in FIG. Thus, a method is disclosed in which the region 80 having a large amount of adhesive applied and the region 90 having a small amount of adhesive applied are separately applied in stripes.

  However, in the method of Patent Document 1, the column in which the inlets in FIG. 1 are arranged (region 50 in FIG. 1), between the columns and the columns (region 40 in FIG. 1), and the outermost side in relation to the transport direction. In the end side of the base material (region 41 in FIG. 1) with respect to the column, it can be applied by changing the amount of adhesive applied, but in the horizontal direction in FIG. 1, the region 60 where no inlet is present and the region 70 where an inlet is present. It was not possible to paint differently by changing the amount of adhesive applied. For this reason, in the region 60 where there is no lateral inlet, there is a problem that the adhesive may be insufficient and bubbles may be generated when the substrates are bonded together, resulting in a deterioration in the appearance of the card.

  Further, when punching out the card, a portion corresponding to the vicinity of the end of the card is pushed to punch out the card. In the state where bubbles are located at the end part of the card, when the part corresponding to the vicinity of the end is pressed, the force is not applied more accurately than in the normal state where there is no bubble, so the card punching is disturbed and the cut surface May become rough. When the cut surface becomes rough, burrs (base material and adhesive scraps) are likely to be generated from the end of the card, resulting in quality deterioration due to adhesion to the card, or an increase in the number of cleaning steps.

  For this reason, there has been a demand for a method for producing an IC card having a good appearance while suppressing the generation of bubbles.

JP 2006-178666 A

  The present invention has been made to solve the above problems, and an object of the present invention is to provide an IC card manufacturing method and manufacturing system that suppresses the generation of bubbles and has a good appearance.

  As a result of intensive studies by the present inventors, the discharge amount of the adhesive from the coating nozzle that is close to the surface to be coated increases in correlation with the distance (distance) between the coating nozzle and the surface to be coated. Then, paying attention to the fact that the discharge amount of the adhesive increases, and that the discharge amount of the adhesive decreases when the interval is reduced, the application nozzles are applied to the application surface in the vertical direction of the vertical and horizontal two-dimensional array of the inlets on the application surface. The amount of adhesive applied between the rows of the inlets arranged between the rows of the inlets arranged on the coated surface by moving the relative height of the coating nozzle up and down relative to the coated surface By adjusting the above, it was found that the generation of bubbles due to insufficient adhesive during the bonding of the base materials can be suppressed, and an IC card with a good appearance can be produced, and the present invention has been completed.

That is, an IC card manufacturing method according to the present invention is a method for manufacturing an IC card in which an inlet including an IC chip, a reinforcing plate, and an antenna is laminated and bonded between a pair of base materials via an adhesive,
(1) A step of applying an adhesive to one surface of the first substrate,
(2) A step of forming an intermediate laminate by arranging a plurality of inlets in a two-dimensionally aligned state in a row and a row on the surface of the first base material coated with the adhesive;
(3) An adhesive is applied to one surface of the second substrate, and the final laminated body is formed by stacking the adhesive-coated surface facing the inlet arrangement surface of the intermediate product including the intermediate laminated body. The process of
(4) Using a roller, pressurizing from the first base material and / or second base material side of the final laminate, and making the film thickness of the final laminate uniform, and
(5) A step of punching the final laminate into the shape of an IC card after pressing with a roller,
In the step of applying an adhesive to the first substrate, the step of applying an adhesive to the second substrate, or the step of optionally applying an adhesive to the intermediate product,
While the application nozzle is moved closer to the application surface of the application object and moved relatively horizontally in a direction parallel to the column of the two-dimensional array of inlets set on the application surface, the application nozzle is applied to the application surface. Apply the adhesive by moving the relative height position up and down,
In the application by the application nozzle, the distance between the application nozzle and the application surface in the region between the rows of the two-dimensional array of inlets set on the application surface is set to the application nozzle and the application in the row region. It is characterized in that it is larger than the interval between the surfaces, and the amount of adhesive applied in the region between the rows is relatively increased than the amount of application in the region of the rows.

  By adjusting the distance between the coating nozzle and the surface to be coated as described above, it becomes possible to relatively adjust the amount of the adhesive applied to the surface to be coated, and 2 inlets set on the surface to be coated. Appropriate amount of adhesive is applied to the region of the row in the dimension array and the region between the row and the row, respectively, in the region between the row and the row when the first substrate and the second substrate are bonded. Generation of bubbles due to insufficient adhesive can be suppressed, and an IC card with a good appearance can be obtained.

In the present invention, “a row of a two-dimensional array of inlets set on the surface to be coated” means a row where the inlets on the surface to be coated are set to be arranged, for example, the region 70 in FIG. This is a concept that includes not only the rows after the inlets are actually arranged on the surface to be coated, but also the rows before the inlets are arranged on the surface to be coated, as in the region 71 shown in FIG. .
Similarly, “a column of a two-dimensional array of inlets set on the surface to be coated” means a column in which the inlets on the surface to be coated are set to be arranged. It is a concept that includes not only the column after the actual arrangement but also the column before the inlet is arranged on the coated surface.
In the present invention, the “intermediate laminate” means that a plurality of inlets are arranged two-dimensionally in a column and a row on the surface of the first base material applied with the adhesive in the step (2). The term “intermediate product” means a laminate in a state prior to being overlaid with a second adhesive having an adhesive applied on one side, including the intermediate laminate. The intermediate product includes, for example, a product obtained by arbitrarily applying an adhesive to the intermediate laminate and a product obtained by optionally pressing the inlet arrangement surface with a roller.

In the IC card manufacturing method according to the present invention, the inlet is set on the surface to be coated such that the distance between the coating nozzle and the surface to be coated is larger than the distance between the coating nozzle and the surface to be coated in the row region. In addition to the area between the rows of the two-dimensional array, the first substrate and the second substrate may be performed in the region in front of the front row and in the region in rear of the last row. It is preferable from the viewpoint that it is possible to further suppress the generation of bubbles due to insufficient adhesive during bonding and to obtain an IC card with a good appearance.
The front row in the row means a row on the surface to be coated that first overlaps with the horizontally moving application nozzle, and the region on the front side of the front row in the row until the horizontally moving application nozzle overlaps. For example, when the moving direction of the application nozzle is an arrow 31 in FIG.
The last row in the row means the row on the coated surface that overlaps with the horizontally moving coating nozzle, and the region behind the last row in the row means that the horizontally moving coating nozzle passes through the last row. Then, it means a region on the surface to be coated until it passes through the surface to be coated. For example, when the moving direction of the coating nozzle is an arrow 31 in FIG.

  In the IC card manufacturing method according to the present invention, when applying by the application nozzle, the application nozzle and the application surface in the portion corresponding to the thin portion of the inlet in the region where the inlet in the row should be present Is larger than the distance between the coating nozzle and the coated surface in the portion corresponding to the thick portion of the inlet in the region, and the adhesive is applied in the portion corresponding to the thin portion of the inlet. It is preferable to relatively increase the amount from the viewpoint that it is possible to further suppress the generation of bubbles due to insufficient adhesive during the bonding of the first base material and the second base material, and to obtain an IC card with a good appearance. .

  In the IC card manufacturing method according to the present invention, at the time of application by the application nozzle, as the application nozzle, a region between columns of the two-dimensional array of inlets set on the application surface is applied. Application of adhesive in the region between the columns of the two-dimensional array of inlets set on the surface to be coated using a coating nozzle in which the head gap of the portion is larger than the head gap of the portion where the column region is applied The amount of the adhesive may be increased relative to the amount of adhesive applied in the column region due to the lack of adhesive in the region between the column and the column when the first substrate and the second substrate are bonded. It is preferable from the point that generation | occurrence | production of a bubble can be suppressed and an IC card with a favorable external appearance can be obtained.

  In the IC card manufacturing method according to the present invention, it is preferable to perform the coating using the coating nozzle in the coating process on the first base material because the coating process can be simplified.

  In the IC card manufacturing method according to the present invention, when applying by the application nozzle, the vertical and horizontal rows of the two-dimensional array of the inlets set on the application surface of the application object are defined as the application object. By aligning the conveying direction and the width direction of the conveying path in the production line with each other, bringing the application nozzle close to the application surface and conveying the application object on the production line, the application nozzle with respect to the application surface. A relatively horizontal movement is preferable from the viewpoint of production efficiency.

  In a preferred embodiment of the IC card manufacturing method according to the present invention, the inlet is a resin base inlet provided with at least the IC chip, the reinforcing plate, and the antenna on one side or both sides of the resin base. However, it is possible to suppress the generation of bubbles due to insufficient adhesive in the region between the rows and obtain an IC card having an excellent appearance.

  In a preferred embodiment of the IC card manufacturing method according to the present invention, the inlet is a non-woven inlet having at least the IC chip, the reinforcing plate, and the antenna between two non-woven fabrics. It is possible to obtain an IC card with excellent appearance by suppressing the generation of bubbles due to insufficient adhesive in the area between them.

  In the IC card manufacturing method according to the present invention, the resin substrate of the resin substrate inlet faces the surface of the first substrate facing the surface of the first substrate on which the adhesive is applied. A groove having a width of 0.02 to 20 μm and a depth of 0.02 to 20 μm is provided from one side to the other side of the two sides, and the resin base material inlet is disposed on the first base material, and After the intermediate laminate is formed, before the second base material is stacked on the intermediate product, the inlet placement surface of the intermediate product is set in a direction parallel to the groove direction of the resin base material using a roller. It is preferable that the step of pressurizing is included from the viewpoint that generation of bubbles when the first base material and the second base material are bonded together can be further suppressed, and an IC card having a good appearance can be obtained.

  In the IC card manufacturing method according to the present invention, the resin base material inlet is aligned with the two-dimensional array of columns and rows in the transport direction and width direction of the transport path in the first base material manufacturing line. On the first base material, and on the surface of the resin base material inlet that is in contact with the adhesive coating film formed on the first base material of the resin base material inlet, the resin base material The groove is provided from one side of the two sides orthogonal to the conveyance direction of the conveyance path to the other side, and the inlet placement surface of the intermediate product is conveyed by the production line while being pressed by the roller, thereby the conveyance direction and It is preferable to apply pressure in the opposite direction from the viewpoint that the pressure applied by the roller can be simplified.

An IC card manufacturing system according to the present invention is a system for manufacturing an IC card in which an inlet including an IC chip, a reinforcing plate, and an antenna is laminated and bonded between a pair of base materials via an adhesive.
(1) A transport path for transporting IC card members or intermediate products,
(2) means for supplying the first substrate onto the conveyance path;
(3) means for applying an adhesive to one surface of the first substrate;
(4) A plurality of the inlets are applied to the surface of the first base material that is transported on the transport path, and the two-dimensional columns and rows of the inlet are transported in the transport direction and width of the transport path. Means for forming an intermediate laminate, arranged in alignment with each direction,
(5) Means for supplying the second base material onto the conveyance path,
(6) Means for applying an adhesive to one surface of the second substrate,
(7) In a state where the adhesive application surface of the second base material is opposed to the inlet placement surface of the intermediate product including the intermediate laminate that is transported on the transport path, the second base material is Means for forming the final laminate on the intermediate product,
(8) Means for applying pressure from the first base material and / or the second base material side of the final laminate using the roller to make the film thickness of the final laminate uniform.
(9) Provided with means for punching the final laminate into the shape of an IC card after pressing with a roller,
Means for applying an adhesive to the first base material, means for applying an adhesive to the second base material, or means for optionally applying an adhesive to the intermediate product are transported on the transport path. The application nozzle is brought close to the application surface of the object to be applied, and the application nozzle is relative to the application surface while horizontally moving in a direction parallel to the column of the two-dimensional array of inlets set on the application surface. It has a mechanism to apply adhesive by moving the height position up and down,
The application nozzle is characterized in that the head gap of the portion that applies the region between the columns of the two-dimensional array of inlets set on the surface to be applied is larger than the head gap of the portion that applies the columns. And

  By providing a mechanism for applying the adhesive by moving the application nozzle up and down as described above, it is possible to relatively adjust the application amount of the adhesive in the row described in the above manufacturing method and the region between the row and the row. . Further, since the application nozzle has the head gap, an appropriate amount of adhesive can be applied to each of the vertical regions and the regions between the vertical columns. Thus, by the system which can apply | coat an adhesive agent with the application pattern which has a vertical and horizontal two-dimensional arrangement | sequence, the area | region between the horizontal line at the time of bonding of a 1st base material and a 2nd base material, and a vertical line and a vertical column It is possible to suppress the generation of air bubbles due to insufficient adhesive in the area between the two and obtain an IC card having a good appearance.

  In the IC card manufacturing system according to the present invention, it is preferable that the means for applying the adhesive to the first substrate includes an application mechanism including the application nozzle, from the viewpoint that the application means can be simplified.

  In the IC card manufacturing system according to the present invention, the IC card manufacturing system further includes means for pressing an inlet arrangement surface of the intermediate product conveyed on the conveyance path with a roller, and the first substrate and the second substrate are bonded. It is preferable because the generation of bubbles when combined can be further suppressed and an IC card having a good appearance can be obtained.

  The application nozzle is moved up and down relative to the application surface while moving the application nozzle relatively horizontally in a direction parallel to the column of the two-dimensional array of inlets set on the application surface. In the region between the rows, the distance between the coated surfaces is made larger than that in the rows, so that a relatively larger amount of adhesive is applied to the region between the rows than in the rows. This makes it possible to apply an appropriate amount of adhesive to the row region and the region between the row and the row, respectively, and when the first substrate and the second substrate are bonded, Generation of bubbles due to insufficient adhesive in the region can be suppressed, and an IC card excellent in appearance can be obtained.

FIG. 1 is a diagram schematically showing an example of a two-dimensional array of inlets in a base material. FIG. 2 is a diagram schematically showing an example of an application pattern by a conventional adhesive application method. FIG. 3 is a diagram schematically showing an example of a two-dimensional array of inlets set on the coated surface in the present invention. FIG. 4 is a view schematically showing a resin base material inlet having a groove according to the present invention and a state of air extrusion using the resin base material inlet. FIG. 5 is a diagram schematically showing another example of the two-dimensional array of inlets set on the coated surface in the present invention. FIG. 6 is a diagram schematically showing another example of the two-dimensional array of inlets set on the coated surface in the present invention. FIG. 7 is a diagram schematically showing step (3) of the IC card manufacturing method according to the present invention. FIG. 8 is a schematic view of an example of application of a row region by a coating apparatus and a region between the row and the row as seen from the lateral direction of the side surface. FIG. 9 is a schematic view showing an example of an inlet having an IC chip and a reinforcing plate in a base sheet shape. FIG. 10 is a front view schematically showing an example of a coating nozzle that coats a column region and a region between the columns. FIG. 11 is a perspective view schematically showing the steps of the IC card manufacturing method according to the present invention.

  Hereinafter, an IC card manufacturing method according to the present invention will be described first, and then an IC card manufacturing system will be described.

In the present invention, “a row of a two-dimensional array of inlets set on the surface to be coated” means a row where the inlets on the surface to be coated are set to be arranged, for example, the region 70 in FIG. This is a concept that includes not only the rows after the inlets are actually arranged on the surface to be coated, but also the rows before the inlets are arranged on the surface to be coated, as in the region 71 shown in FIG. .
Similarly, “a column of a two-dimensional array of inlets set on the surface to be coated” means a column in which the inlets on the surface to be coated are set to be arranged. It is a concept that includes not only the column after the actual arrangement but also the column before the inlet is arranged on the coated surface.
In the present invention, the “intermediate laminate” means that a plurality of inlets are arranged two-dimensionally in a column and a row on the surface of the first base material applied with the adhesive in the step (2). The term “intermediate product” means a laminate in a state prior to being overlaid with a second adhesive having an adhesive applied on one side, including the intermediate laminate. The intermediate product includes, for example, a product obtained by arbitrarily applying an adhesive to the intermediate laminate and a product obtained by optionally pressing the inlet arrangement surface with a roller.

  In the definition of film and sheet in JIS-K6900, a sheet is a thin and generally flat product whose thickness is small relative to the length and width. A film has a thickness compared to the length and width. A thin, flat product that is extremely small and has an arbitrarily limited maximum thickness, usually supplied in the form of a roll. Accordingly, it can be said that a sheet having a particularly thin thickness is a film, but the boundary between the sheet and the film is not clear and is difficult to distinguish clearly. Therefore, in the present invention, both a thick sheet and a thin sheet are used. Including meaning, it is defined as “sheet”.

(IC card manufacturing method)
An IC card manufacturing method according to the present invention is a method of manufacturing an IC card in which an inlet including an IC chip, a reinforcing plate, and an antenna is laminated and bonded between a pair of base materials via an adhesive,
(1) A step of applying an adhesive to one surface of the first substrate,
(2) A step of forming an intermediate laminate by arranging a plurality of inlets in a two-dimensionally aligned state in a row and a row on the surface of the first base material coated with the adhesive;
(3) An adhesive is applied to one surface of the second substrate, and the final laminated body is formed by stacking the adhesive-coated surface facing the inlet arrangement surface of the intermediate product including the intermediate laminated body. The process of
(4) Using a roller, pressurizing from the first base material and / or second base material side of the final laminate, and making the film thickness of the final laminate uniform, and
(5) A step of punching the final laminate into the shape of an IC card after pressing with a roller,
In the step of applying an adhesive to the first substrate, the step of applying an adhesive to the second substrate, or the step of optionally applying an adhesive to the intermediate product,
While the application nozzle is moved closer to the application surface of the application object and moved relatively horizontally in a direction parallel to the column of the two-dimensional array of inlets set on the application surface, the application nozzle is applied to the application surface. Apply the adhesive by moving the relative height position up and down,
In the application by the application nozzle, the distance between the application nozzle and the application surface in the region between the rows of the two-dimensional array of inlets set on the application surface is set to the application nozzle and the application in the row region. It is characterized in that it is larger than the interval between the surfaces, and the amount of adhesive applied in the region between the rows is relatively increased than the amount of application in the region of the rows.

Conventionally, a method of suppressing the generation of bubbles when performing application while horizontally moving an application nozzle in a direction parallel to a column of inlets having a vertical and horizontal two-dimensional arrangement is disclosed in Patent Document 1. This was due to the adjustment of the application amount of the adhesive only in the column direction, such as using a coating nozzle in which the slit gap in the portion where the region is applied is larger than the slit gap in the portion where the column is applied. However, in this method, the region between the rows (corresponding to the region 60 in FIG. 1) or the region on the end side of the substrate with respect to the outermost row (corresponding to the region 61 in FIG. 1), that is, between the rows and the rows The amount of adhesive applied between the region and the row could not be adjusted, and the adhesive was applied in a uniform amount including the row and the region between the row and the row. In the region, there was a case where bubbles were generated when the adhesive was insufficient and the substrate was bonded.
On the other hand, by relatively moving the coating nozzle up and down as described above and changing the distance between the surface to be coated and the coating nozzle, the resistance at the time of discharging the adhesive is adjusted, and the adhesive to the surface to be coated is adjusted. It becomes possible to relatively adjust the coating amount. As a result, an appropriate amount of adhesive is applied to each of the rows of the two-dimensional array of inlets set on the surface to be coated, and the region between the rows and the rows, and the first substrate and the second substrate are bonded. Generation of bubbles due to insufficient adhesive in the region between the rows at the time of alignment can be suppressed, and an IC card having a good appearance can be obtained.

  Hereinafter, each process of (1)-(5) of the manufacturing method of the IC card concerning the present invention is explained.

In the step (1), an adhesive is applied to one surface of the first substrate.
As the first substrate, a conventionally known IC card substrate such as polyethylene terephthalate can be used, and the thickness of the first substrate can also be the thickness of a conventionally known IC card substrate. The first substrate may be either a sheet-like sheet or a web-like roll.
As the adhesive to be used, a conventionally known IC card adhesive can be used, such as an ethylene / vinyl acetate copolymer (EVA) hot melt adhesive or a reactive hot melt adhesive such as urethane resin having an isocyanate terminal. An adhesive that is used to fix an inlet in a conventionally known IC card can be used.
The format may be printed on the surface of the first substrate opposite to the surface to which the adhesive is applied. The format means description information common to other IC cards such as ruled lines of the IC card, an issuer, an affiliated company, and notes. When the format is printed on the first base material, it is preferable to use a sheet-like sheet as the first base material in order to align with the arrangement position of the inlet.

(2) In the step, an intermediate laminate is formed by arranging a plurality of inlets in a two-dimensionally aligned state in rows and columns on the adhesive applied to the first substrate.
The inlet used in the present invention is an electronic component including at least an IC chip, a reinforcing plate, and an antenna, and an conventionally known inlet including an IC chip for IC cards, a reinforcing plate, and an antenna can be used. Since the inlet has a two-dimensional array of columns and rows, it is preferable to use a substantially rectangular shape.

  The IC chip electrically stores information on the user of the IC card, and may have only a memory or a microcomputer in addition to the memory.

  The reinforcing plate is a metal plate provided to protect the IC chip from a load or an impact applied to the IC chip. As the said metal, a conventionally well-known metal for reinforcement plates can be used, for example, stainless steel is mentioned.

  The antenna is a coiled antenna connected to the IC chip. The antenna may be formed using any method such as conductive paste printing, copper foil etching, or winding welding.

  For joining the IC chip and the antenna, a conventionally known joining method may be used, and examples thereof include a method using a conductive adhesive such as a silver paste or a copper paste.

  When the inlet used in the present invention is provided between the first base material and the second base material via an adhesive, the joint may come off due to the shearing force due to the flow of the adhesive before being cured or solidified. In order to prevent the arrangement position between the first base material and the second base material from moving due to the flow or curing of the adhesive, the IC chip, the antenna, and the reinforcing plate are made of polyethylene terephthalate, etc. It is preferable to use a resin base material inlet arranged and fixed on one side or both sides of the resin base material.

In the IC card manufacturing method according to the present invention, when a resin base material inlet is used, the resin base material faces the surface of the first base material facing the surface to which the adhesive is applied. A groove having a width of 0.02 to 20 μm and a depth of 0.02 to 20 μm is provided from one side to the other side of the two sides, and the resin base material inlet is disposed on the first base material, and After the intermediate laminate is formed, before the second substrate is stacked on the intermediate product, the inlet placement surface of the intermediate product is applied in a direction parallel to the groove direction of the resin substrate using a roller. It is preferable to include a pressing step.
FIG. 4 is a view schematically showing a resin base material inlet having a groove.
4A is a view of the resin base material inlet as viewed from the resin base material side, and FIG. 4B is a side view of the resin base material inlet. FIG. 4C is a view as seen from a direction perpendicular to the groove schematically showing the air extrusion by the roller.
As shown in FIG. 4A, the resin substrate inlet 22 is formed from one side to the other side of the two sides 120 of the resin substrate facing the surface 110 facing the surface to which the adhesive of the first substrate is applied. A groove having a width and a depth is provided. The groove may be provided so as to have the above width and depth from one side to the other side of the two opposite sides, and may be provided perpendicular to the one side like the groove 100, or Thus, it may be provided obliquely with respect to one side.
When the resin base material inlet is disposed on the surface of the first base material coated with the adhesive, even if the air 210 is sandwiched between the resin base material 130 and the adhesive 180, the intermediate laminate is formed, Before the second base material is overlaid, the inlet arrangement surface of the intermediate product is pressed using a roller 190 in a direction parallel to the groove as shown in FIG. Since the air 210 is released, it is possible to suppress the bubbles from being located at the end portion of the card when pressed by a roller in the step (4) described later, thereby obtaining an IC card having a good appearance.

  The width and depth of the groove provided on the resin base are 0.02 to 20 μm, respectively. If the width or depth of the groove is smaller than 0.02 μm, there is a possibility that the effect of removing sufficient bubbles may not be obtained. If the width or depth of the groove is larger than 20 μm, the groove is too large and the adhesive is used. As a result, the groove is not filled and air remains. At this time, if a reactive hot melt adhesive is used as the adhesive, the moisture remaining in the air remaining between the resin substrate and the reactive hot melt adhesive also increases, and the moisture and reactive hot The amount of carbon dioxide gas generated by the reaction of the melt adhesive also increases, and the carbon dioxide gas may be pushed up to the first base material and spread to cause the base material to swell.

  The method of providing the groove on the resin base material is not particularly limited, and for example, it can be performed by hairline processing at the time of film formation of the resin base material or surface fine polishing using a wrapping tape after the resin base material is formed.

  In addition to the resin base material inlet, a nonwoven fabric inlet in which the IC chip, the antenna, and the reinforcing plate are arranged and fixed between two nonwoven fabrics can also be preferably used.

The two-dimensional array of inlets has a column and a row, and may be arranged with an appropriate interval between adjacent inlets. The longitudinal direction of the inlet may be parallel to the vertical direction or may be parallel to the horizontal direction. The distance between adjacent inlets is preferably 5 to 20 mm.
In addition, the number of inlets arranged in one column and one row is not particularly limited, and may be appropriately adjusted according to the dimensions of the first base material or the second base material.

An intermediate laminated body is formed by arranging a plurality of inlets in a two-dimensionally aligned manner in columns and rows on the surface of the first substrate to which the adhesive is applied.
A plurality of inlets may be arranged simultaneously, or one or two or more inlets may be arranged sequentially.
In addition, in the two-dimensional array of inlets, the same number of inlets may be arranged in all the rows as shown in FIG. 5, or there is a region 220 where no inlet is arranged as shown in FIG. The number of inlets arranged may be different.

  As will be described later, the intermediate laminated body in which the inlet is disposed may be further subjected to a treatment such as applying an adhesive to a region between the rows or pressing the inlet placement surface with a roller.

In the step (3), as illustrated in FIG. 7, the adhesive 180 is applied to one surface of the second base material 230, and the surface on which the adhesive is applied is the inlet placement surface of the intermediate product 240 including the intermediate laminate. The final laminated body 250 is formed by being overlapped with each other.
The second substrate may be the same substrate as the first substrate. The materials of the first base material and the second base material may be the same or different. Further, both the first base material and the second base material may be a sheet-like sheet or a web-like roll, or one may be a sheet and the other may be a roll.
The same adhesive as that mentioned in the above step can also be used.

(4) In the step, a roller is used to apply pressure from the first base material and / or second base material side of the final laminate to make the film thickness of the final laminate uniform.
Since the final laminate formed in the step (3) may have irregularities due to the flow of the adhesive, the adhesive is flowed by pressing with a roller from the first substrate and / or the second substrate side. The film thickness of the laminate is made uniform.
The roller to be used is not particularly limited, and a roller such as SUS (stainless steel) can be used. When pressurizing, it is preferable to use a roll having a roll gap set at the target thickness interval.

(5) In the step, the final laminated body pressed by the roller is punched into a desired IC card shape.
The card punching is not particularly limited, and can be performed by a conventionally known method such as a punch die method.

  In the IC card manufacturing method according to the present invention, the step of applying an adhesive to the first substrate, the step of applying the adhesive to the second substrate, or optionally applying the adhesive to an intermediate product In the process of moving the application nozzle close to the application surface of the object to be applied and moving it relatively horizontally in a direction parallel to the column of the two-dimensional array of inlets set on the application surface. The distance between the coating nozzle and the coating surface in the region between the rows of the two-dimensional array of inlets set to be larger than the spacing between the coating nozzle and the coating surface in the row region, that is, the coating surface The adhesive is applied by moving the relative height position of the coating nozzle up and down. By moving the coating nozzle relatively up and down in this way and changing the distance between the coated surface and the coated nozzle, the resistance during adhesive discharge is adjusted and the amount of adhesive applied to the coated surface is relatively adjusted. It becomes possible to do. As a result, an appropriate amount of adhesive is applied to each of the rows of the two-dimensional array of inlets set on the surface to be coated, and the region between the rows and the rows, and the first substrate and the second substrate are bonded. Generation of bubbles due to insufficient adhesive in the region between the rows at the time of alignment can be suppressed, and an IC card having a good appearance can be obtained.

Adjustment of the amount of adhesive applied by moving the coating nozzle relatively up and down and changing the distance between the surface to be coated and the coating nozzle applies the adhesive to one surface of the first substrate in the step (1). May be performed when the adhesive is applied to one surface of the second base material in the step (3), and after the intermediate laminate is formed, the adhesive is applied to the intermediate product. An optional application step may be provided and performed in this step. This coating method may be performed in any one of these three steps. For example, when the coating is performed in the step (1), in the step (3), only the adhesive is uniformly coated on the second substrate, and the intermediate product is obtained. The step of optionally applying an adhesive to the substrate may not be performed. In the steps (1) and (3), the first and second substrates are each uniformly coated with an adhesive, and the adhesive is optionally applied to the intermediate product. The amount of adhesive applied may be adjusted by moving it up and down.
In the case of uniformly applying the adhesive, the method is not particularly limited, and a coating method performed using a conventionally known roll coater, bar coater, or the like can be used.

As a method for moving the coating nozzle relatively up and down, for example, a cam lever mechanism and a ball screw mechanism are driven and controlled by a servo motor to control the head vertical position, and the coating position with respect to the flat part (base material) is positioned by a stopper. A method of driving and controlling the head ascending position with a servo motor can be mentioned.
Alternatively, the distance between the coating nozzle and the coated surface may be adjusted by fixing the height of the coating nozzle and moving the coated surface side up and down.

  The difference in the application of the adhesive in the row region due to the relative vertical movement of the coating nozzle and the region between the row and the row may be appropriately adjusted depending on the presence or absence of the inlet, as shown in FIG. In the case of such normal arrangement, it is preferable that the thickness is close to the thickness of the inlet resin base material. Generally, since the thickness of the inlet is about 20 to 100 μm, for example, when the application using the application nozzle is performed before the inlet is arranged on the first substrate, the application thickness of the row region is 30 to 30 μm. It is preferable that it is 50 micrometers, and it is preferable that the difference of the coating thickness of the area | region between a row and a row is 20-100 micrometers.

In the IC card manufacturing method according to the present invention, the inlet is set on the surface to be coated such that the distance between the coating nozzle and the surface to be coated is larger than the distance between the coating nozzle and the surface to be coated in the row region. In addition to the area between the rows of the two-dimensional array, the first substrate and the second substrate may be performed in the region in front of the front row and in the region in rear of the last row. It is preferable from the viewpoint that it is possible to further suppress the generation of bubbles due to insufficient adhesive during bonding and to obtain an IC card with a good appearance.
At this time, if the adhesive is applied to the edge of the surface to be coated, the adhesive protrudes from the surface to be coated and soils the periphery of the surface to be coated. It is preferable not to apply an adhesive to an area of 5 to 35 mm.

FIG. 8 is a schematic view of an example of the application of the rows and the regions between the rows by the coating device as seen from the lateral direction of the side (the drive system of the nozzle up / down mechanism is not shown, but is driven by a servo motor).
A sheet-fed sheet-like first base material 170 is transported in the transport direction 30 on the back roll 260, and a coating apparatus 300 including a head gap setting stopper 270, a coating nozzle up / down eccentric cam 280, and a coating nozzle 290 is provided. The adhesive 180 is applied while maintaining the coating nozzle 290 at a predetermined distance from the first base material in the row of the two-dimensional array of inlets, and the coating nozzle 290 is arranged in the row between the rows. It is larger than the distance between the application nozzle and the first substrate in the region, and the application amount of the adhesive is increased (part of the adhesive 181).

In the IC card manufacturing method according to the present invention, the application nozzle and the surface to be applied in the portion corresponding to the thin portion of the inlet in the region where the inlet is to be present in the row when applying by the application nozzle. Is larger than the distance between the coating nozzle and the coated surface in the portion corresponding to the thick portion of the inlet in the region, and the adhesive is applied in the portion corresponding to the thin portion of the inlet. It is preferable to increase the amount relatively.
FIG. 9 is a diagram schematically showing an example of an inlet having an IC chip and a reinforcing plate.
FIG. 9A is a view of the inlet as viewed from the side, and FIG. 9B is a plan view of the inlet. Note that the antenna is not shown in FIG. 9 for simplicity of explanation.
Among the inlets, as shown in the schematic diagram of FIG. 9, there is an inlet 23 having an IC chip 150 and a reinforcing plate 160 on a part of the base sheet 310 of the inlet and having different thicknesses depending on places. In the case of such an inlet, the portion 320 where the IC chip 150 and the reinforcing plate 160 are present is thicker than the other portion (the portion where there is no IC chip and inlet) 330.
Therefore, the interval between the coating nozzle and the surface to be coated in the portion corresponding to the portion where the inlet is thin in the region where the inlet in the row should exist (the portion 330 of the inlet 23 to be set) is set in the region. Adhesion at a portion corresponding to the portion 330 where the thickness of the inlet 23 is smaller than the interval between the coating nozzle and the surface to be coated in the portion corresponding to the portion where the inlet is thick (the portion 320 of the set inlet 23). By relatively increasing the coating amount of the agent, it is possible to further suppress the generation of bubbles due to insufficient adhesive and to obtain an IC card with a good appearance.

In the IC card manufacturing method according to the present invention, at the time of application by the application nozzle, as the application nozzle, a region between columns of the two-dimensional array of inlets set on the application surface is applied. Using a coating nozzle in which the head gap of the part is larger than the head gap of the part that coats the column region,
It is preferable that the amount of adhesive applied in the region between the columns of the two-dimensional array of inlets set on the surface to be coated is relatively larger than the amount of adhesive applied in the column region.
FIG. 10 is a schematic diagram illustrating an example of the application nozzle 290 viewed from the front in the vertical direction.
In the coating nozzle 290, the head gap (interval between the coating nozzle and the surface to be coated) 350, which coats the region 40 between the columns of the inlets set in the coated surface 340, coats the vertical region 50. It is larger than the head gap 360 of the part to be. By applying using this application nozzle, the resistance when discharging the adhesive in the portion with a large head gap is smaller than the resistance when discharging the adhesive in the portion with a small head gap. The amount of adhesive applied in the region between the two is relatively greater than the amount of adhesive applied in the column region, and between the column and the column when the first substrate and the second substrate are bonded together Generation of bubbles due to insufficient adhesive in the region can be suppressed, and an IC card having a good appearance can be obtained.

  The application using the application nozzle, that is, the application method exemplified with reference to FIGS. 8 to 10 is preferably performed in the application process to the first substrate because the application process can be simplified. For example, the application of the adhesive to the first base material is performed by the method illustrated in FIG. 10, the application of the adhesive to the intermediate product in which the inlet is disposed is performed by the coating method illustrated in FIG. When the adhesive is applied to the material by the application method illustrated in FIG. 8, three adhesive supply facilities are required. On the other hand, when applying the adhesive to the first substrate, if the application method illustrated in FIGS. 8 to 10 is performed, it is not necessary to apply the adhesive to the intermediate product in which the inlet is disposed. The process can be simplified and the management of the facility becomes easy.

In the IC card manufacturing method according to the present invention, when applying by the application nozzle, the vertical and horizontal rows of the two-dimensional array of the inlets set on the application surface of the application object are defined as the application object. By aligning the conveying direction and the width direction of the conveying path in the production line with each other, bringing the application nozzle close to the application surface and conveying the application object on the production line, the application nozzle with respect to the application surface. A relatively horizontal movement is preferable from the viewpoint of production efficiency.
The application using the application nozzle described above is performed by fixing the base material and applying the application nozzle to the application surface while horizontally moving the application nozzle in a direction parallel to a column of a two-dimensional array of inlets set on the application surface. The adhesive may be applied by moving the height up and down, but as shown in FIG. 11, the vertical and horizontal rows of a two-dimensional array of inlets set on the surface to be coated are used to manufacture the coating object. The application direction is aligned with the conveyance direction and width direction of the conveyance path in the line, the application nozzle is brought close to the application surface, the application object is conveyed on the production line, and the application nozzle is relatively horizontal to the application surface. By moving, it is preferable because the manufacturing process can be simplified, and the adhesive can be applied to the object to be applied with high production efficiency to manufacture the IC card.

In the conventional adhesive application method, as shown in FIG. 11, it was not possible to selectively apply a large amount of adhesive in the region between the rows while the base material was being conveyed. Further, in the manufacturing process by the manufacturing line, for example, when the format is printed in advance on the surface opposite to the side to which the adhesive of the first base material in FIG. May occur. At this time, if an inlet is arranged in the defective printing portion, the inlet is consumed even if it is not a product, and costs increase. Therefore, the defective printing portion of such a format is usually shown in FIG. So do not place the inlet. At this time, the region 220 where no inlet is arranged in FIG. 6 is thinned by the amount of no inlet. When the inlet is placed, the area where the inlet is placed is thicker than the area where the inlet is not placed, and the inlet is placed when the first and second substrates are bonded together The surplus adhesive in the region that has been applied flows into the region 60 between the rows and the region 61 and the region 62 in FIG. 1 to supplement the adhesive in the region 60. However, as shown in FIG. If there is a region that is not arranged, the conventional adhesive application method is insufficient in the region 60 and is one of the causes of bubbles.
On the other hand, in the IC card manufacturing method according to the present invention, since the coating amount in the row and the region between the row and the row can be adjusted by the relative vertical movement of the coating nozzle, the inlet is arranged as described above. Even if there is an unoccupied region, applying a large amount of adhesive to the region 60 between the rows in FIG. 6 makes it possible to compensate for the shortage of adhesive and suppress the generation of bubbles. Further, in addition to the region between the rows, in the region in front of the front row (region 61 in FIG. 1) and the region in rear of the last row (region 62 in FIG. 1), By performing the application in which the distance between the coating nozzle and the surface to be coated is larger than the distance between the coating nozzle and the surface to be coated in the region, it is possible to further enhance the effect of suppressing the generation of bubbles due to insufficient adhesive in these regions.

  When the first substrate or the second substrate is web-shaped, it may be cut into a single sheet as shown in FIG. 11 after punching into a card after forming the final laminate.

When the resin base material inlet provided with the groove as illustrated in FIG. 4 is used in the production line as shown in FIG. 11, the groove is formed from one side of the two sides orthogonal to the transport direction of the transport path of the resin base material to the other side. In other words, it is preferable to arrange the side 120 in FIG. 4A so as to be orthogonal to the conveying direction and pressurize the inlet arrangement surface of the intermediate product in the direction opposite to the conveying direction.
As a result, the intermediate product conveyed just by adjusting the height so that the roller is in contact with the inlet placement surface is in contact with the roller and the air sandwiched between the resin base material and the adhesive is pushed out. Can be simplified.

(IC card manufacturing system)
An IC card manufacturing system according to the present invention is a system for manufacturing an IC card in which an inlet including an IC chip, a reinforcing plate, and an antenna is laminated and bonded between a pair of base materials via an adhesive.
(1) A transport path for transporting IC card members or intermediate products,
(2) means for supplying the first substrate onto the conveyance path;
(3) means for applying an adhesive to one surface of the first substrate;
(4) A plurality of the inlets are applied to the surface of the first base material that is transported on the transport path, and the two-dimensional columns and rows of the inlet are transported in the transport direction and width of the transport path. Means for forming an intermediate laminate, arranged in alignment with each direction,
(5) Means for supplying the second base material onto the conveyance path,
(6) Means for applying an adhesive to one surface of the second substrate,
(7) In a state where the adhesive application surface of the second base material is opposed to the inlet placement surface of the intermediate product including the intermediate laminate that is transported on the transport path, the second base material is Means for forming the final laminate on the intermediate product,
(8) Means for applying pressure from the first base material and / or the second base material side of the final laminate using the roller to make the film thickness of the final laminate uniform.
(9) Provided with means for punching the final laminate into the shape of an IC card after pressing with a roller,
Means for applying an adhesive to the first base material, means for applying an adhesive to the second base material, or means for optionally applying an adhesive to the intermediate product are transported on the transport path. The application nozzle is brought close to the application surface of the object to be applied, and the application nozzle is relative to the application surface while horizontally moving in a direction parallel to the column of the two-dimensional array of inlets set on the application surface. It has a mechanism to apply adhesive by moving the height position up and down,
The application nozzle is characterized in that the head gap of the portion that applies the region between the columns of the two-dimensional array of inlets set on the surface to be applied is larger than the head gap of the portion that applies the columns. And

  By providing a mechanism for applying the adhesive by moving the application nozzle up and down as described above, it is possible to relatively adjust the application amount of the adhesive in the row described in the above manufacturing method and the region between the row and the row. . In addition, since the application nozzle has the head gap, an appropriate amount of adhesive can be applied to the columns and the regions between the columns. In this way, by the system capable of applying the adhesive with the application pattern having the vertical and horizontal two-dimensional arrangement, the region between the row and the row, the column and the column when the first base material and the second base material are bonded together It is possible to suppress the generation of air bubbles due to insufficient adhesive in the intervening region and to obtain an IC card having a good appearance.

Each configuration of the IC card manufacturing system will be described.
The conveyance path for conveying the IC card member or the intermediate product conveys the first base material, the second base material, or the intermediate product, and a conventionally known belt conveyor can be used.
The means for supplying the first base material on the conveyance path may be one that continuously supplies from a roll or one that intermittently supplies a sheet-like sheet.
As described in the IC card manufacturing method, the means for applying the adhesive to one surface of the first substrate may be a coating device having a nozzle up-and-down moving mechanism, or uniformly bonding without having a nozzle up-and-down mechanism. An agent may be applied and may be appropriately selected and used.
The means for forming the intermediate laminate is not particularly limited as long as the two-dimensional array of inlets and rows can be aligned and aligned with the transport direction and the width direction of the transport path.
The means for supplying the second base material onto the transport path may be the same as or different from the means for supplying the first base material.
As described in the IC card manufacturing method, the means for applying the adhesive to one surface of the second substrate may be a coating device having a nozzle vertical movement mechanism, or a uniform adhesive without a nozzle vertical mechanism. May be applied and may be appropriately selected and used. The means for applying the adhesive to the first substrate and the means for applying the adhesive to the second substrate may be the same or different.
The means for forming the final laminate is not particularly limited, and may be bonded by adjusting the interval between the substrates as shown in FIG. At that time, as shown in FIG.
The means for making the film thickness of the final laminate uniform with a roller is not particularly limited, and for example, the roller 370 of FIG. 11 can be used.
As a means for punching the final laminated body into the shape of an IC card after pressing with a roller, a conventionally known punch die or the like can be used.

In the IC card manufacturing system according to the present invention, means for applying an adhesive to the first substrate, means for applying the adhesive to the second substrate, or optionally applying an adhesive to the intermediate product Means for moving the application nozzle closer to the application surface of the application object to be conveyed on the conveyance path and horizontally moving it in a direction parallel to the column of the two-dimensional array of inlets set on the application surface. A mechanism is provided for applying the adhesive by vertically moving the position of the application nozzle relative to the surface to be applied. With this mechanism, it is possible to adjust the amount of adhesive applied to the surface to be applied by adjusting the resistance when discharging the adhesive. Therefore, an appropriate amount of adhesive can be applied to the rows of the two-dimensional array of inlets set on the surface to be coated, and the region between the rows and the rows.
Further, in the coating nozzle, the head gap of the portion that coats the region between the columns of the two-dimensional array of inlets set on the coated surface is larger than the head gap of the portion that coats the columns.
Therefore, according to the vertical and horizontal rows of the two-dimensional array of inlets set on the surface to be coated, appropriate amounts are respectively given to the vertical region, the region between the vertical column, the horizontal region, and the horizontal region. It is possible to apply an adhesive, suppress the generation of bubbles due to insufficient adhesive in the area between the rows when the first base material and the second base material are bonded, and an IC card with a good appearance Can be obtained.

  In the IC card manufacturing system according to the present invention, it is preferable that the means for applying the adhesive to the first substrate includes an application mechanism including the application nozzle. As described in the above IC card manufacturing method, in the application of the adhesive to the first base material, the adhesive mechanism by the relative vertical movement of the coating nozzle, or the region between the columns rather than the columns By using an application nozzle having a large head gap, the adhesive supply equipment can be simplified, and the management of the equipment becomes easy.

  In the IC card manufacturing system according to the present invention, it is preferable that the IC card manufacturing system further includes means for pressing the inlet arrangement surface of the intermediate product conveyed on the conveying path with a roller. As a result, when the inlet used in the present system is a resin base inlet having a groove as described in the IC card manufacturing method, even if air is sandwiched between the resin base and the adhesive, the intermediate laminate can be After forming, before stacking the second base material on the intermediate product, the air is released along the groove by pressurizing the inlet placement surface of the intermediate product with a roller, so that it becomes the end of the IC card It is possible to obtain an IC card having a good appearance by suppressing the presence of bubbles.

  Hereinafter, the present invention will be described more specifically with reference to examples. These descriptions do not limit the present invention. Unless otherwise specified, parts represent parts by weight.

As a first substrate, a sheet-like U2L98W low heat yield grade (thickness: 188 μm) manufactured by Teijin DuPont Films Ltd. was used.
As the second base material, a long web-shaped U2L98W low heat yield grade (thickness: 188 μm) manufactured by Teijin DuPont Films Ltd. was used.
Reactive hot melt adhesive Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd. was used as the adhesive.
The two-dimensional arrangement of the inlets on the first base material is such that 50 inlets are arranged in a row (rows parallel to the transport direction of the transport path) in five rows and rows for one sheet-shaped first base material. (Rows in the width direction of the conveyance path) A state in which 10 rows are arranged is a normal state (two-dimensional array pattern (1)). The interval between the rows was set to 15 mm, and the interval between the columns was set to 10 mm.
For the two-dimensional array pattern (2) of the inlet, do not place the inlet in all the first, third, fifth, seventh, and ninth rows from the leading end in the transport direction from the normal state, but only a total of 25 inlets. It was in a state to do.

(Production of inlet (1))
An aluminum foil having a thickness of 10 μm was vapor-deposited on an S series tetron film manufactured by Teijin DuPont Films Co., Ltd., and then etched like an antenna wire. An IC chip and a reinforcing plate are stacked on the base sheet having a thickness of 25 μm thus obtained, and an IC card inlet (1) having an IC chip portion (including a reinforcing plate and a base sheet) of 300 μm and dimensions of 48 mm × 80 mm is provided. Produced.

(Production of inlet (2))
An IC card inlet (2) was prepared in the same manner as the inlet (1) except that the inlet (1) base material was replaced with a polyethylene terephthalate base material having dimensions of 48 mm x 80 mm and a thickness of 38 µm.

(Production of inlet (3))
The inlet (2) except that the PET substrate of the inlet (2) was replaced with a PET substrate having a groove having a width of 2 μm and a depth of 20 μm on the surface facing the adhesive applied on the first substrate. The IC card inlet (3) was produced in the same manner as in the production of).

(Production of inlet (4))
Other than replacing the PET substrate of the inlet (2) with a PET substrate provided with a groove having a width of 0.01 μm and a depth of 0.01 μm on the surface facing the adhesive applied on the first substrate. Produced the IC card inlet (4) in the same manner as the inlet (2).

(Production of inlet (5))
The inlet (2) except that the PET substrate of the inlet (2) was replaced with a PET substrate provided with a groove having a width of 25 μm and a depth of 25 μm on the surface facing the adhesive applied on the first substrate. The IC card inlet (5) was produced in the same manner as in the production of ().

Example 1
A coating nozzle having a head gap of 30 μm at a portion to which a portion corresponding to a vertical region in a two-dimensional arrangement of the set inlet is applied, and a head gap of a portion at which a portion corresponding to a region between the columns is applied to 60 μm In the production line as shown in FIG. 11, the coating nozzle is moved up and down while moving the coating nozzle up and down in the production line as shown in FIG. The adhesive was applied with a coating thickness of 90 μm between the vertical and horizontal rows, a coating thickness of 40 μm in the vertical column, and an application thickness of 80 μm between the vertical and vertical columns. On the adhesive, the produced inlet (1) was arranged according to the set two-dimensional array pattern (1) to obtain an intermediate laminate.
The adhesive was applied to one side of the second substrate with a uniform coating thickness of 340 μm.
The final laminated body is formed into a film by a SUS bearer roller by overlapping the inlet arrangement surface of the intermediate laminated body and the surface of the second base material coated with the adhesive so as to face each other. After making the thickness uniform, punching was performed to a size of 54 mm × 85.6 mm by a punch die method to obtain 100 IC cards with a film thickness of 800 μm.

(Example 2)
In Example 1, after replacing the inlet (1) with the inlet (2) and arranging the inlet on the adhesive, the inlet is arranged on the inlet before placing the final laminate on the second base material coated with the adhesive. 100 IC cards were produced in the same manner as in Example 1 except that the film was pressed with a roller having a rubber hardness of 30 ° and a pressing force of 20 N in the direction opposite to the conveying direction.

(Example 3)
In Example 2, 100 IC cards were produced in the same manner as in Example 2 except that the inlet (2) was replaced with the inlet (3).

(Examples 4 to 6)
In the first to third embodiments, the two-dimensional array pattern (1) of the inlet is replaced with the two-dimensional array pattern (2), respectively, and the IC card including the inlet is obtained except for the card that does not include the inlet. Therefore, 100 IC cards of Examples 4 to 6 were produced in the same manner except that the number of final laminates was increased to 4. In addition, the card | curd which does not contain the inlet of Examples 4-6 and Comparative Examples 4-6 mentioned later was excluded from the evaluation object of the bubble mentioned later and swelling.

(Comparative Example 1)
In Example 1, 100 IC cards were produced in the same manner as in Example 1 except that the adhesive was applied uniformly to the first base material in a direction parallel to the transport direction with a thickness of 50 μm.

(Comparative Example 2)
In Example 2, 100 IC cards were produced in the same manner as in Example 2 except that the adhesive was applied uniformly to the first base material in a direction parallel to the transport direction with a thickness of 50 μm.

(Comparative Example 3)
In Example 3, 100 IC cards were produced in the same manner as in Example 3 except that the adhesive was applied to the first base material uniformly in a thickness of 50 μm in the direction parallel to the transport direction.

(Comparative Examples 4-6)
In Examples 4 to 6, 100 sheets of Comparative Examples 4 to 6 were applied in the same manner except that the adhesive was applied uniformly to the first base material in a direction parallel to the transport direction with a thickness of 50 μm. An IC card was prepared.

(Comparative Example 7)
In Comparative Example 2, 100 IC cards were produced in the same manner as Comparative Example 2 except that the inlet (2) was replaced with the inlet (4).

(Comparative Example 8)
In Comparative Example 2, 100 IC cards were produced in the same manner as in Comparative Example 2 except that the inlet (2) was replaced with the inlet (5).

  The IC cards obtained in Examples 1 to 6 and Comparative Examples 1 to 8 were visually evaluated for the presence of bubbles and swelling. Table 1 shows a summary of the number of bubbles generated and the number of bubbles generated for 100 IC cards of each example and comparative example.

(Summary of results)
From Table 1, bubbles and blisters were not generated in the IC cards obtained in Examples 1 to 6. In particular, good results were also obtained in Examples 4 to 6 in which evaluation was performed with a two-dimensional array pattern (2) with a small number of inlets.
In Comparative Examples 1 and 2, the amount of adhesive applied between the rows was smaller than that in the example, and air remained, so bubbles were generated at the end of the IC card.
In Comparative Example 3, a groove was provided in the resin base material of the inlet, and the air between the resin base material and the adhesive was applied by applying pressure with a roller after being placed on the first base material coated with the adhesive. As a result, the number of IC cards having bubbles at the end decreased as compared with Comparative Example 2.
In Comparative Examples 4 to 6 where the evaluation was performed with the same inlet arrangement pattern as in Examples 4 to 6, the number of IC cards in which bubbles were generated increased. This is because the amount of adhesive applied to the first substrate is uniform and the amount of adhesive between the rows is small, and in addition, the odd rows of the first, third, fifth, seventh and ninth rows The inlet is not arranged, and the adhesive does not flow from the row portion to the region between the rows as in the case where there is an inlet. The leading end side in the transport direction of the even-numbered inlets positioned next to the odd-numbered lines by the pressure applied by the rollers when the first base material and the second base material are bonded together or when the film thickness of the final laminate is made uniform It is thought that a lot of air remained in Examples 4-6.
In Comparative Example 7, the groove is provided in the resin base material of the inlet, but the width and depth are not sufficient, so that the effect of extracting air between the resin base material and the adhesive cannot be sufficiently obtained. As with 2, bubble was generated in the IC card.
In Comparative Example 8, since the width and depth of the groove provided in the resin base material of the inlet are too large, the groove is not sufficiently filled with the adhesive, and a lot of air remains, and the moisture in the air and the adhesive A large amount of carbon dioxide gas was generated by the reaction as compared with Comparative Example 3 in which the width and depth of the groove were appropriate, and the first base material of the IC card was swollen.

DESCRIPTION OF SYMBOLS 1 IC card 10 Base material 11 Coated surface 20, 22, 23 Inlet 21 Area | region 30 in which an inlet is arrange | positioned The conveyance direction 31 The horizontal movement direction 40 of an application | coating nozzle 50 Area | regions between columns and columns 50 Columns 60 Between rows and rows Area 61 Front side area of the front row in the row 62 Areas 70 and 71 in the rear side of the last row in the row Row 80 Area with a large amount of adhesive applied 90 Areas with a small amount of adhesive applied 100, 101 Groove 110 Resin Surface of the substrate facing the surface of the first substrate on which the adhesive is applied 120 Side 130 Resin substrate 140 Antenna 150 IC chip 160 Reinforcing plate 170 First substrate 180, 181 Adhesive 190 Roller 200 Roller Movement direction 210 Air 220 Area where no inlet is disposed 230 Second base material 240 Intermediate product 250 Final laminate 260 Back roll 270 Deposition setting stopper 280 Coating nozzle up / down eccentric cam 290 Coating nozzle 300 Coating device 310 Base sheet 320 Portion of inlet IC chip and reinforcing plate 330 Portion of inlet IC chip and reinforcing plate 340 Surface to be coated 350, 360 Head Gap 370 Roller 380 Punching means

Claims (13)

A method of manufacturing an IC card in which an inlet including an IC chip, a reinforcing plate and an antenna is laminated and bonded between a pair of base materials via an adhesive,
(1) A step of applying an adhesive to one surface of the first substrate,
(2) A step of forming an intermediate laminate by arranging a plurality of inlets in a two-dimensionally aligned state in a row and a row on the surface of the first base material coated with the adhesive;
(3) An adhesive is applied to one surface of the second substrate, and the final laminated body is formed by stacking the adhesive-coated surface facing the inlet arrangement surface of the intermediate product including the intermediate laminated body. The process of
(4) Using a roller, pressurizing from the first base material and / or second base material side of the final laminate, and making the film thickness of the final laminate uniform, and
(5) A step of punching the final laminate into the shape of an IC card after pressing with a roller,
In the step of applying an adhesive to the first substrate, the step of applying an adhesive to the second substrate, or the step of optionally applying an adhesive to the intermediate product,
While the application nozzle is moved closer to the application surface of the application object and moved relatively horizontally in a direction parallel to the column of the two-dimensional array of inlets set on the application surface, the application nozzle is applied to the application surface. Apply the adhesive by moving the relative height position up and down,
In the application by the application nozzle, the distance between the application nozzle and the application surface in the region between the rows of the two-dimensional array of inlets set on the application surface is set to the application nozzle and the application in the row region. A method for manufacturing an IC card, characterized in that the amount of adhesive applied in a region between the rows is relatively larger than the amount of coating in the region of the row, with an interval greater than the interval between the surfaces.   An area between a row and a row of a two-dimensional array of inlets set on the surface to be coated is applied so that the distance between the coating nozzle and the surface to be coated is larger than the distance between the coating nozzle and the surface to be coated in the row region. The IC card manufacturing method according to claim 1, wherein the method is performed in a region in front of the front row in the row and a region in rear of the last row.   When coating by the coating nozzle, the distance between the coating nozzle and the surface to be coated in the portion corresponding to the thin portion of the inlet in the region where the inlet in the row should be present is the thickness of the inlet in the region. It is larger than the interval between the coating nozzle and the coated surface in the portion corresponding to the thick portion, and the amount of the adhesive applied in the portion corresponding to the thin portion of the inlet is relatively increased, The manufacturing method of the IC card according to claim 1 or 2. At the time of application by the application nozzle, as the application nozzle, the head gap of the part that applies the region between the columns of the two-dimensional array of inlets set on the surface to be coated applies the regions in the column. Use a coating nozzle larger than the head gap of the part,
It is characterized in that the amount of adhesive applied in a region between columns of the two-dimensional array of inlets set on the surface to be coated is relatively increased as compared with the amount of adhesive applied in the region of the column. The manufacturing method of the IC card as described in any one of Claims 1 thru | or 3.   5. The IC card manufacturing method according to claim 1, wherein application using the application nozzle is performed in the application process to the first substrate. 6.   In the application by the application nozzle, the vertical and horizontal rows of the two-dimensional array of inlets set on the application surface of the application object are defined as the conveyance direction and the width direction of the conveyance path in the production line of the application object. Each direction is aligned, the application nozzle is moved closer to the application surface, and the application object is transported on a production line, whereby the application nozzle is moved horizontally relative to the application surface. The manufacturing method of the IC card as described in any one of Claims 1 thru | or 5.   7. The resin inlet according to claim 1, wherein the inlet is a resin substrate inlet provided with at least the IC chip, the reinforcing plate, and the antenna on one side or both sides of the resin substrate. The manufacturing method of IC card of description.   The IC card according to any one of claims 1 to 6, wherein the inlet is a nonwoven fabric inlet having at least the IC chip, a reinforcing plate, and an antenna between two nonwoven fabrics. Method. The resin substrate of the resin substrate inlet has a width of 0.02 from one side of the two opposite sides of the resin substrate to the other side of the surface opposite to the surface of the first substrate applied with the adhesive. A groove having a depth of ˜20 μm and a depth of 0.02 to 20 μm, and
After the resin base material inlet is arranged on the first base material to form the intermediate laminate, before the second base material is stacked on the intermediate product, the inlet placement surface of the intermediate product is arranged. The method of manufacturing an IC card according to claim 7, further comprising a step of applying pressure in a direction parallel to the direction of the groove of the resin base material using a roller. The resin base material inlet is arranged on the first base material by aligning the two-dimensional array of columns and rows in the transport direction and the width direction of the transport path in the production line of the first base material,
One side of the resin base material inlet that is perpendicular to the transport direction of the transport path of the resin base material on the surface of the resin base material in contact with the adhesive coating film formed on the first base material of the resin base material The groove is provided from to the other side,
10. The method of manufacturing an IC card according to claim 9, wherein the inlet arrangement surface of the intermediate product is conveyed by a production line while being pressurized by the roller, whereby pressure is applied in a direction opposite to the conveying direction. A system for manufacturing an IC card in which an inlet including an IC chip, a reinforcing plate and an antenna is laminated and bonded between a pair of base materials via an adhesive,
(1) A transport path for transporting IC card members or intermediate products,
(2) means for supplying the first substrate onto the conveyance path;
(3) means for applying an adhesive to one surface of the first substrate;
(4) A plurality of the inlets are applied to the surface of the first base material that is transported on the transport path, and the two-dimensional columns and rows of the inlet are transported in the transport direction and width of the transport path. Means for forming an intermediate laminate, arranged in alignment with each direction,
(5) Means for supplying the second base material onto the conveyance path,
(6) Means for applying an adhesive to one surface of the second substrate,
(7) In a state where the adhesive application surface of the second base material is opposed to the inlet placement surface of the intermediate product including the intermediate laminate that is transported on the transport path, the second base material is Means for forming the final laminate on the intermediate product,
(8) Means for applying pressure from the first base material and / or the second base material side of the final laminate using the roller to make the film thickness of the final laminate uniform.
(9) Provided with means for punching the final laminate into the shape of an IC card after pressing with a roller,
Means for applying an adhesive to the first base material, means for applying an adhesive to the second base material, or means for optionally applying an adhesive to the intermediate product are transported on the transport path. The application nozzle is brought close to the application surface of the object to be applied, and the application nozzle is relative to the application surface while horizontally moving in a direction parallel to the column of the two-dimensional array of inlets set on the application surface. It has a mechanism to apply adhesive by moving the height position up and down,
The application nozzle is characterized in that the head gap of the portion that applies the region between the columns of the two-dimensional array of inlets set on the surface to be applied is larger than the head gap of the portion that applies the columns. An IC card manufacturing system.   The IC card manufacturing system according to claim 11, wherein the means for applying the adhesive to the first substrate includes an application mechanism including the application nozzle.   13. The IC card manufacturing system according to claim 11, further comprising means for pressing an inlet arrangement surface of the intermediate product conveyed on the conveyance path with a roller.