JP5260271B2 - Circuit device using chip parts - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive circuit device without increasing the number of components and an installation space as short circuit components by utilizing electrodes of chip components for executing as short circuit patterns. <P>SOLUTION: The circuit device uses the chip components, which is characterized by selecting a normal pattern and a short circuit patterns. In the normal pattern, a pair of electrodes 13a, 13b of a chip resistor 13, namely a chip component, is connected to one- and the other-side pads 7, 8 of a circuit block 4, respectively. In the short circuit pattern, the electrodes 13a, 13b of the chip resistor 13 short-circuit a portion between first one- and the other-side pads 9a, 9b forming a short circuit for short-circuiting the circuit block 4 and a portion between second one- and the other-side pads 10a, 10b. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a circuit device using a chip component.

Conventionally, in a circuit device, there are cases where a specification using an arbitrary circuit block and a specification not using it are selected. In this case, since it is uneconomical to produce two types of circuit board having a circuit block and a circuit board having no circuit block, a circuit board having a circuit block and a short circuit for short-circuiting the circuit block is produced. Whether or not the circuit block is short-circuited by a short circuit is selected (see Patent Document 1).
JP-A-5-216960

  In order to form a short circuit of a circuit block, it is necessary to connect the one side pad and the other side pad of the short circuit with a short circuit component. In this case, as the short-circuit component, for example, a chip resistor of zero ohm (0Ω) resistance that is mass-produced and inexpensive is used. However, even though the chip resistor, which is a chip component, actually has a resistance value of several mΩ to several tens of mΩ even though it is a zero ohm resistance, power loss occurs, and therefore a large amount of current flows. In this case, a plurality of chip resistors must be used in parallel, which increases the number of components and mounting space.

  In order to solve such a problem, a short bar made of a copper plate capable of flowing a large current may be used as the short circuit part. However, such a short bar has a high material cost and is a custom-made product. Therefore, there is a problem that becomes expensive.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to perform as a short-circuit pattern using an electrode of a chip component, so that the number of components and mounting space as a short-circuit component do not increase, and an inexpensive chip. A circuit device using a component may be provided.

In the circuit device using the chip component of the present invention, one side pad and the other side pad are provided in an electrical circuit so as to divide the circuit, and the chip component is provided on the one side pad and the other side pad. there of the normal pattern in which a pair of electrodes are respectively connected to the structure the other hand and the side pad and the other side pads as the short-circuit pattern is short-circuited by the electrode of the chip component is selected, in the short pattern The one-side pad and the other-side pad include first and second one-side pads and first and second other-side pads connected in parallel, and the chip component has one of the short-circuit patterns. and wherein the electrode is connected to the first one-side pad and the first other said other electrode with being connected to the side pad second one side pads and the second other-side pad That.

  According to the circuit device using the chip component of the present invention, in the case of the normal pattern in which the pair of electrodes of the chip component is connected to the one side pad and the other side pad, the chip component is used as the original functional component. In the case of a short-circuit pattern in which the one side pad and the other side pad are short-circuited by the electrode of the chip component, the chip component is used as the short-circuit component, so that the number of components and mounting space as the short-circuit component do not increase and are inexpensive. The effect that it is.

Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
An inverter 1 as a circuit device is configured on a circuit board, and includes a circuit block 4 between a power supply side wiring 2 and a load side wiring 3. The circuit block 4 includes wiring patterns 5 and 6 forming a divided circuit, one side pad 7 connected to the wiring pattern 5, and the other side pad 8 connected to the wiring pattern 6.

  The inverter 1 includes a first one-side pad 9a and a first other-side pad 9b, and a second one-side pad 10a and a second other-side pad 10b, which are located outside the circuit block 4. Yes. The first one-side pad 9a and the second one-side pad 10a are connected to the power-side wiring 2 via the power-side wiring 11 forming a divided circuit, and the first other-side pad 9b and the second one-side pad 9a are connected. The other pad 10b of 2 is connected to the load side wiring 3 via the load side wiring 12 that forms a divided circuit.

The chip resistor 13 which is a chip component is a surface-mounted resistor in which a resistor is formed between a pair of electrodes 13a and 13b. In this embodiment, the normal pattern shown in FIG. ) Is used with the short-circuit pattern shown in FIG.
1A, the chip resistor 13 is mounted such that one electrode 13a is connected to the one side pad 7 and the other electrode 13b is connected to the other side pad 8. The In the circuit block 4, although not shown, the wiring patterns 5 and 6 are connected and mounted with electronic components such as a capacitor and an inductor, so that the first-stage noise filter 14 is configured. Therefore, in this case, the chip resistor 13 is connected between the wiring patterns 5 and 6 and functions as a resistor as an original functional component.

  In the inverter 1 shown in FIG. 1, a second-stage noise filter (not shown) having the same configuration as that of the noise filter 14 is configured after the circuit block 4. Thereby, in the use state of the normal pattern shown in FIG. 1A, a noise filter with high accuracy specifications is configured by the first-stage noise filter 14 and the second-stage noise filter.

  In the use state of the short-circuit pattern shown in FIG. 1B, the chip resistor 13 has one electrode 13a connected to the first one-side pad 9a and the first other-side pad 9b, and the other electrode 13b connected to the first electrode 13b. It is mounted so as to be connected to the two one-side pads 10a and the second other-side pads 10b. In the circuit block 4, the chip resistor 13 is not connected and mounted on the one side pad 7 and the other side pad 8, and electronic components such as capacitors and inductors are not connected and mounted on the wiring patterns 5 and 6.

  Thus, in the use state of the short-circuit pattern shown in FIG. 1B, the noise filter 14 is not configured in the circuit block 4, and the circuit block 4 has a short-circuit circuit due to the electrodes 13a and 13b of the chip resistor 13. It is formed. Therefore, in this case, the chip resistor 13 functions as a short-circuit component that short-circuits the circuit block 4. In the use state of the short-circuit pattern shown in FIG. 1B, only the second-stage noise filter is used, resulting in a noise filter with normal accuracy specifications.

  Here, FIG. 2 is a diagram illustrating a specific numerical example of each pad when a 3216 size chip resistor is used as the chip resistor 13 in this embodiment. In the normal pattern, as shown in FIG. 2A, the horizontal dimension C and the vertical dimension D of the one side pad 7 and the other side pad 8 are C = 1.4 (mm) and D = 0.9 (mm). And the spacing dimension A between the pads 7 and 8 is set to A = 2.2 (mm), and therefore the overall vertical dimension B between the pads 7 and 8 is B = 4.0 (mm). The manufacturer recommends that it be set to.

  Under the preconditions as described above, in the short-circuit pattern of the present embodiment, as shown in FIG. 2B, the pads 9a and 9b and the pads 10a and 10b divide the pads 7 and 8 into left and right parts. In the embodiment, each lateral dimension C1 is set to C1 = 0.5 (mm), and the spacing dimension C2 between the pads 9a and 9b and between the pads 10a and 10b is set to C2 = 0.4 (mm). The interval dimension A and the vertical dimensions B and D are the same as those in the normal pattern of FIG. That is, in order to prevent the pads 9a and 9b and the pads 10a and 10b from being short-circuited (bridged) by solder during soldering when using the circuit block 4 as the normal pattern shown in FIG. Further, a gap dimension C2 (for example, 0.4 (mm)) is provided between the pads 9a and 9b and between the pads 10a and 10b. The distance C2 is determined by the shapes and dimensions of the pads 9a, 9b, 10a, and 10b. In this embodiment, the distance C2 is usually set to 0.4 (mm) or more.

  In this case, as in the modification shown in FIG. 3, the corners on the opposite sides of the pads 9a and 9b and the corners on the opposite sides of the pads 10a and 10b are cut out to form notches 9c and 10c. If it is set as a structure, formation of the short circuit (bridge | bridging) by the solder between pad 9a, 9b and pad 10a, 10b can be prevented further.

  As shown in FIG. 3, when the notches 9c and 10c are formed in the pads 9a and 9b and the pads 10a and 10b, the distance C2 between the pads 9a and 9b and between the pads 10a and 10b. Can sufficiently prevent the formation of a short circuit (bridge) due to solder even when the dimension is set to C2 = 0.4 (mm) or less, for example, C2 = 0.2 (mm) or more.

  In the present embodiment, the point is that when the normal pattern is selected, between the pads 9a and 9b and the pads 9a and 9b and the other side pads 9b and 10b so that a solder bridge is not generated as much as possible. What is necessary is just to set the space | interval dimension between pad 10a, 10b or the shape of pad 9a, 9b and pad 10a, 10b.

  Thus, according to the present embodiment, when the circuit block 4 is used, the chip resistor 13 is mounted on the circuit block 4 and used as an original resistor, and when the circuit block 4 is not used, Since the chip resistor 13 is used as a short-circuit component for short-circuiting the circuit block 4, it is necessary to cope with one type of circuit board equipped with a high-precision noise filter and one with a normal-precision noise filter. Can be economical.

  When the chip resistor 13 is used as a short-circuit component, the circuit block 4 is short-circuited by the pair of electrodes 13a and 13b having a very small resistance value, so that one chip resistor is used. As compared with the prior art, a large current can be passed without using power loss, and the number of parts and the mounting space are not increased as compared with the conventional case. In particular, in this embodiment, the circuit block 4 is short-circuited by connecting the pair of electrodes 13a and 13b of the chip resistor 13 in parallel, so that a large current can be passed without further power loss.

  FIG. 4 shows a second embodiment of the present invention. In FIG. 4, the power supply side wiring 15 and the load side wiring 16 form a divided first circuit, and the power supply side wiring 17 and the load side wiring 18 form a divided second circuit. It has become. The power supply side wiring 15 and the load side wiring 16 are connected to the one side pad 19a and the other side pad 19b, and the power supply side wiring 17 and the load side wiring 18 are connected to the one side pad 20a and the other side pad 20b.

  The one side pad 19a and the other side pad 19b are connected by one electrode 21a of the chip resistor 21 which is a chip component, and the one side pad 20a and the other side pad 20b are connected by the other electrode 21b of the chip resistor 21. It is connected. Thereby, the power supply side wiring 15, the electrode 21a, and the load side wiring 16 form a first circuit that short-circuits a first circuit block (not shown), and the power supply side wiring 17, the electrode 21b, and the load side wiring 18 are illustrated. A second circuit that short-circuits the second circuit block that is not to be formed is formed. In this case, the circuit is designed so that there is no influence of current exchange between the first circuit and the second circuit. For example, the resistance value of the chip resistor 21 is set to be extremely large.

In the second embodiment, when a chip resistor of 3216 size is used as the chip resistor 21, specific numerical values or shapes of the pads 19a, 19b and 20a, 20b are shown in FIG. ) Or as shown in FIG.
According to the second embodiment as described above, since the first and second circuits (short circuit) can be configured by one chip resistor 21, a rational circuit configuration can be obtained.

The present invention is not limited to the embodiments described above and shown in the drawings, and the following modifications and expansions are possible.
In the said Example, although the inverter was illustrated as a circuit device, it is applicable not only to this but a circuit device in general.
In the above embodiment, the noise filter is configured in the circuit block, but other circuits may be used.

In the above embodiment, the chip resistor mounted on the circuit block and the chip resistor mounted on the short circuit are the same, but they may be different.
In the above embodiment, the chip resistor has been described. However, the present invention is not limited to this, and the same effect can be obtained if the chip components have the same shape such as a chip capacitor.

1 is a circuit diagram showing a first embodiment of the present invention. Figure showing specific numerical examples of pads The figure which shows the modification of a pad Circuit diagram showing a second embodiment of the present invention

Explanation of symbols

  In the drawings, 1 is an inverter (circuit device), 4 is a circuit block, 5 and 6 are wiring patterns, 7 is one side pad, 8 is the other side pad, 9a and 9b are first one side and other side pads, 10a. And 10b are second pads on one side and the other side, 13 is a chip resistor (chip component), 13a and 13b are electrodes, 19a and 19b are pads on one side and the other side, and 20a and 20b are pads on the one side and the other side. , 21 is a chip resistor (chip component), and 21a and 21b are electrodes.

Claims (5)

In the electrical circuit, one side pad and the other side pad are provided so as to divide the circuit,
A normal pattern in which a pair of electrodes of the chip component is connected to the one side pad and the other side pad, and a short-circuit pattern in which the one side pad and the other side pad are short-circuited by the electrode of the chip component are selected. In the configuration like that,
The one side pad and the other side pad in the short-circuit pattern include first and second one side pads and first and second other side pads connected in parallel,
In the short circuit pattern, the chip component has one electrode connected to the first one side pad and the first other side pad and the other electrode connected to the second one side pad and the second other side. A circuit device using a chip component, wherein the circuit device is connected to a side pad . 2. The circuit device using a chip part according to claim 1 , wherein the short-circuit pattern is configured to short-circuit the circuit block when an arbitrary circuit block is not used . 3. The circuit device using a chip component according to claim 2 , wherein the chip component is configured to be mounted on the circuit block when the circuit block is used . The circuit device using the chip component according to any one of claims 1 to 3, wherein a chip resistor is used as the chip component. Circuit device using the chip component according to one of claims 1 to 3, wherein Rukoto using a chip capacitor as a chip component.

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