JP5260249B2

JP5260249B2 - Semiconductor equipment heatsink

Info

Publication number: JP5260249B2
Application number: JP2008312080A
Authority: JP
Inventors: 治山本
Original assignee: 東芝シュネデール・インバータ株式会社
Priority date: 2008-12-08
Filing date: 2008-12-08
Publication date: 2013-08-14
Anticipated expiration: 2028-12-08
Also published as: JP2010135673A

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiator of a semiconductor device which can prevent clog of a radiation fin, reduce noise caused by an increase in blowing capacity even when a blower fan is used, and can cool a semiconductor element effectively. <P>SOLUTION: The radiator 8 includes a radiating element 14 structured by projecting many radiation fins 16 on a radiation substrate 15 on which heat of the semiconductor element of the semiconductor device is conducted, and a frame 9 having mounting piece parts 12, 12 which support the radiating element 14 and are mounted on an installation board 18 as a mounting section of the semiconductor device. The frame 9 is structured of material having good heat conductivity. The heat from the radiating element 14 is conducted to the frame 9, and is conducted to the installation board 18 through the mounting piece parts 12, 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、半導体機器の半導体素子が発生する熱を放散させる半導体機器の放熱器に関する。 The present invention relates to a radiator for a semiconductor device that dissipates heat generated by a semiconductor element of the semiconductor device.

インバータ装置などの半導体素子を用いる半導体機器においては、半導体素子が発生する熱を放散させるための放熱器が設けられている。この放熱器は、放熱基板における半導体素子が設置される設置面とは反対側の面に多数の放熱フィンを突設して、その放熱フィンに送風ファンからの冷却風を吹き当てるようにした構成で、半導体素子からの熱を放熱基板に伝達し、更に、多数の放熱フィンに伝達して、放熱フィンから放熱させ、以って、半導体素子を冷却するようになっている（例えば特許文献１参照）。
特開２００４−３４９５４８号公報 In a semiconductor device using a semiconductor element such as an inverter device, a heat radiator for dissipating heat generated by the semiconductor element is provided. This radiator has a structure in which a large number of heat dissipating fins are provided on the surface of the heat dissipating board opposite to the surface on which the semiconductor elements are installed, and cooling air from the blower fan is blown to the heat dissipating fins. Therefore, the heat from the semiconductor element is transmitted to the heat radiating substrate, and further, is transmitted to a large number of heat radiating fins to dissipate heat from the heat radiating fins, thereby cooling the semiconductor element (for example, Patent Document 1). reference).
JP 2004-349548 A

放熱器による放熱（冷却）効果をよくするためには、放熱フィンの数を増大させることが行なわれるが、このようにすると、限られた設置スペースでは放熱フィン相互の間隔が極めて小になって、埃などによる目詰りの原因となる。また、放熱器による放熱（冷却）効果をよくするためには、送風ファンの送風能力を増大させることも行なわれるが、これとても、送風ファンによる騒音の発生の問題がある。 In order to improve the heat dissipation (cooling) effect by the heatsink, the number of heatsink fins is increased, but in this way, the space between the heatsink fins becomes extremely small in a limited installation space. , cause of clogging due to dust. Further, in order to improve the heat dissipation (cooling) effect by the radiator, the blowing capacity of the blower fan is also increased. However, there is a problem of noise generation by the blower fan.

本発明は、上記事情に鑑みてなされたもので、その目的は、放熱フィンが目詰りを生ずることがなく、また、送風ファンを用いる場合でもその送風能力の増大による騒音の発生も少なくなし得て、半導体素子を効果的に冷却することができる半導体機器の放熱器を提供することにある。 The present invention has been made in view of the above circumstances, and the object thereof is that the radiating fins do not become clogged, and even when a blower fan is used, the generation of noise due to the increase in the blower capacity can be reduced. An object of the present invention is to provide a radiator of a semiconductor device capable of effectively cooling a semiconductor element.

本発明の半導体機器の放熱器は、熱伝導性の良い材料で構成された器枠と、前記器枠内に配置された放熱体と、を備える。前記器枠は、平坦面をなす背面板と、前記背面板の二辺部に突設された側面板と、前記背面板の残りの二辺部に延設されて取付部位に取り付けられる取付部と、前記側面板の先端部にあって内方に向けて突設されたフランジ部と、を有している。前記放熱体は、前記半導体機器の半導体素子の熱が伝導されるとともに前記フランジ部に接して固定された放熱基板と、前記放熱基板に突設された多数の放熱フィンと、を有している。 A radiator of a semiconductor device according to the present invention includes an instrument frame made of a material having good thermal conductivity, and a radiator disposed in the instrument frame. The instrument frame has a flat back plate, a side plate projecting from two sides of the back plate, and a mounting portion that extends to the remaining two sides of the back plate and is attached to a mounting site. And a flange portion projecting inwardly at the front end portion of the side plate. The heat dissipating member includes a heat dissipating substrate that is conducted in contact with the flange portion and that is fixed to the flange portion, and a plurality of heat dissipating fins protruding from the heat dissipating substrate. .

本発明の半導体機器の放熱器によれば、半導体素子からの熱は、放熱体から放熱フィンに伝達されて放散されるが、更に放熱体から熱伝導性の良い器枠にも伝達されて放散され、且つ、器枠の取付部から取付部位にも伝達されて放散されるようになり、放熱フィンの数を増大しなくても、また、送風ファンを用いる場合にその送能力を増大しなくても、半導体を素子を効果的に冷却することができる。 According to the radiator of the semiconductor device of the present invention, the heat from the semiconductor element is transmitted from the radiator to the radiation fin and dissipated, but is further transmitted from the radiator to the frame having good thermal conductivity and dissipated. In addition, it is transmitted from the mounting part of the frame to the mounting part and is dissipated, and even if the number of heat dissipating fins is not increased, and when the blower fan is used, its feeding capacity is not increased. However, the element can be effectively cooled by the semiconductor.

以下、本発明を半導体機器たるインバータ装置に適用した各実施例につき、図面を参照しながら説明する。なお、各実施例においては、同一部分には同一符号を付して示す。
（第１の実施例）
図１乃至図５は、本発明の第１の実施例を示す。 Hereinafter, each embodiment in which the present invention is applied to an inverter device as a semiconductor device will be described with reference to the drawings. In each embodiment, the same portions are denoted by the same reference numerals.
(First embodiment)
1 to 5 show a first embodiment of the present invention.

先ず、図２に従ってインバータ装置１の構成について説明する。
インバータ装置１は、筐体２を備えており、この筐体２の本体部３には、図示はしないが、電気回路が、例えば、直流電源回路部分、インバータ回路部分及び制御回路部分の三部分に分割されて収容されている。その本体部３の周壁には、多数の放熱孔３ａが形成されている。 First, the configuration of the inverter device 1 will be described with reference to FIG.
The inverter device 1 includes a housing 2, and the main body 3 of the housing 2 has an electric circuit, for example, a DC power circuit portion, an inverter circuit portion, and a control circuit portion (not shown). It is divided and accommodated. A large number of heat radiation holes 3 a are formed in the peripheral wall of the main body 3.

本体部３の前面部（図２において上面部）には、操作部４及び表示部５を有する操作パネル部６が配設されている。この場合、操作部４は、前記図示しない制御回路に接続されていて、運転を開始するためのランキー、運転を停止するためのストップキー、運転周波数などの各種パラメータを設定するためのボリューム、数値変更のためのアップキー及びダウンキーなどを備えている。表示部５は、ＬＥＤや液晶表示パネルから構成されており、現在の運転状態、運転周波数指令値、電圧、電流、入出力端子状態、トリップ履歴などを表示可能となっている。 An operation panel unit 6 having an operation unit 4 and a display unit 5 is disposed on the front surface (upper surface in FIG. 2) of the main body 3. In this case, the operation unit 4 is connected to the control circuit (not shown), and includes a run key for starting operation, a stop key for stopping operation, a volume for setting various parameters such as operation frequency, and numerical values. It has an up key and a down key for changing. The display unit 5 includes an LED or a liquid crystal display panel, and can display the current operation state, operation frequency command value, voltage, current, input / output terminal state, trip history, and the like.

更に、本体部３の背面部（図２においては下面部）には、収納部７が設けられている。収納部７は、多数の放熱孔７ａを有し、左右両側面及び背面が開放されている。この収納部７には、放熱器８が収納固定されている。以下、この放熱器８について、図１、図３乃至図５を参照して説明する。 Further, a storage portion 7 is provided on the back surface portion (the lower surface portion in FIG. 2) of the main body portion 3. The storage unit 7 has a large number of heat radiation holes 7a, and the left and right side surfaces and the back surface are open. A radiator 8 is housed and fixed in the housing portion 7. Hereinafter, the radiator 8 will be described with reference to FIGS. 1 and 3 to 5.

図５に示すように、放熱器８の器枠９は、平坦面をなす背面板１０と、この背面板１０の対応する二辺部にこれと直交するように突設された側面板１１、１１と、背面板１０の残りの対応する二辺部にこれと平坦面をなすように延設された取付部たる取付片部１２、１２と、側面板１１、１１の先端部に内方に向け突設されたフランジ部１３、１３とから構成されている。この場合、器枠９は、熱伝導性の良い材料例えば鋼鈑にて構成されている。 As shown in FIG. 5, the housing 9 of the radiator 8 includes a back plate 10 that forms a flat surface, and side plates 11 that are provided so as to project perpendicularly to two corresponding sides of the back plate 10, 11, the remaining two corresponding side portions of the back plate 10, attachment pieces 12, 12 as attachment portions extending so as to form a flat surface therewith, and inward ends of the side plates 11, 11. It is comprised from the flange parts 13 and 13 projected toward the direction. In this case, the container frame 9 is made of a material having good thermal conductivity, such as a steel plate.

同図５に示すように、放熱器８の放熱体１４は、矩形状の放熱基板１５と、この放熱基板１５の設置面（図５においては上面）１５ａとは反対側の面に後方に突出し且つ互いに平行となるように設けられた多数の放熱フィン１６とから構成されている。この場合、放熱体１４は、熱伝導性の良い材料例えばアルミニウムにて構成され、多数の放熱フィン１６は、放熱基板１５にろう付け或いはかしめにて固定されている。 As shown in FIG. 5, the heat radiating body 14 of the radiator 8 protrudes rearward on a surface opposite to the rectangular heat radiating substrate 15 and the installation surface (upper surface in FIG. 5) 15a of the heat radiating substrate 15. And it is comprised from many radiation fins 16 provided so that it might become mutually parallel. In this case, the heat radiating body 14 is made of a material having good thermal conductivity, for example, aluminum, and a large number of heat radiating fins 16 are fixed to the heat radiating board 15 by brazing or caulking.

そして、放熱体１４は、器枠９内に配置されて、その放熱基板１５の設置面１５ａがフランジ部１３、１３に複数のねじ１７により取付け固定され、以って、放熱体１４が器枠９に支持されて、図１に示すように、放熱器８が構成される。この場合、図３に示すように、多数の放熱フィン１６の先端部は、器枠９の背面板１０に所定の間隔を存して対向するようになっている。この放熱器８は、前述したように筐体２の収納部７に収納固定され、その放熱体１４における放熱基板１５の設置面１５ａに前記図示しないインバータ回路を構成するパワー半導体素子たるＩＧＢＴが設置される。 The radiator 14 is disposed in the housing 9, and the installation surface 15 a of the radiation board 15 is attached and fixed to the flange portions 13 and 13 by a plurality of screws 17. As shown in FIG. 1, a heat radiator 8 is configured. In this case, as shown in FIG. 3, the front ends of the numerous radiating fins 16 are opposed to the back plate 10 of the device frame 9 with a predetermined interval. As described above, the radiator 8 is housed and fixed in the housing portion 7 of the housing 2, and an IGBT as a power semiconductor element constituting the inverter circuit (not shown) is installed on the installation surface 15 a of the heat radiating board 15 in the radiator 14. Is done.

このように構成されたインバータ装置１は、客先の取付部位たる平坦面状の設置盤１８（図３及び図４参照）に取付けられる。なお、この設置盤１８は、放熱性の良い材料例えば鋼鈑にて製作されている。そして、具体的には、筐体２の収納部７に収納固定された放熱器８の背面板１０及び取付片部１２、１２が設置盤１８に当接され、取付片部１２、１２が複数のねじ１９により設置盤１８に取付け固定される。従って、放熱器８の背面板１０及び取付片部１２、１２は、設置盤１８に面接触状態になる。なお、図示はしないが、筐体２内には、放熱器８の放熱フィン１６に冷却風を吹き当てるべく、前記図示しない制御回路により制御される送風ファンが設けられている。 The inverter device 1 configured in this way is attached to a flat surface-like installation board 18 (see FIGS. 3 and 4) which is a customer attachment site. The installation board 18 is made of a material having good heat dissipation, such as a steel plate. Specifically, the back plate 10 and the mounting pieces 12, 12 of the radiator 8 housed and fixed in the housing portion 7 of the housing 2 are brought into contact with the installation panel 18, and a plurality of mounting pieces 12, 12 are provided. It is attached and fixed to the installation board 18 with the screw 19. Therefore, the back plate 10 and the mounting pieces 12 and 12 of the radiator 8 are in surface contact with the installation panel 18. Although not shown, a blower fan controlled by the control circuit (not shown) is provided in the housing 2 so as to blow cooling air to the heat radiating fins 16 of the radiator 8.

而して、インバータ回路の運転中は、そのスイッチング動作を行なうＩＧＢＴが発熱するようになり、そして、送風ファンが動作されて放熱フィン１６に冷却風を吹き当てるようになる。これにより、ＩＧＢＴからの熱は、放熱体１４の放熱基板１５に伝導され、更に、多数の放熱フィン１６に伝導されて、これらの放熱フィン１６に吹き当てられる冷却風により強制放散される。 Thus, during the operation of the inverter circuit, the IGBT that performs the switching operation generates heat, and the blower fan is operated so that the cooling air is blown against the radiating fins 16. Thereby, the heat from the IGBT is conducted to the heat radiating board 15 of the heat radiating body 14, further conducted to the many heat radiating fins 16, and forcibly dissipated by the cooling air blown to these heat radiating fins 16.

また、ＩＧＢＴから放熱体１４に伝導された熱、特に放熱基板１５に伝導された熱の一部は、熱伝導性の良い器枠９に伝導されて放散され、更に、器枠９に伝導された熱の一部は、背面板１０及び取付片部１２、１２を介して客先の取付部位たる設置盤１８に伝導されて放散される。 Further, a part of the heat conducted from the IGBT to the radiator 14, in particular, the heat conducted to the radiator board 15, is conducted and dissipated to the instrument frame 9 having good thermal conductivity, and further conducted to the instrument frame 9. A part of the heat is conducted and dissipated through the back plate 10 and the mounting pieces 12 and 12 to the installation board 18 which is a customer installation site.

このように本実施例によれば、放熱器８の放熱体１４を支持する器枠９を熱伝導性の良い鋼鈑で構成したので、半導体素子たるＩＧＢＴから放熱体１４に伝導された熱は、放熱フィン１６に伝導されて冷却風とともに放散されるとともに、放熱体１４に伝導された熱の一部は、器枠９に伝導されて放散されるようになる。また、客先の取付部位を平坦面の設置盤１８とし、器枠９の設置盤１８に対応する背面板１０及び取付片部１２、１２をその設置盤１８と面接触する平坦面にしたので、器枠９に伝導された熱の一部は、背面板１０及び取付片部１２、１２を介して設置盤１８に伝導されて放散される。これにより、放熱フィン１６の数を増大しなくても、また、放熱フィン１６に冷却風を吹き当てる送風ファンの送能力を増大しなくても、半導体素子たるＩＧＢＴを効果的に冷却することができ、放熱フィン１６が目詰りを生ずることがなく、また、送風ファンによる騒音の発生も少なくなし得る。 As described above, according to the present embodiment, since the casing 9 that supports the radiator 14 of the radiator 8 is made of a steel plate having good thermal conductivity, the heat conducted from the IGBT as the semiconductor element to the radiator 14 is In addition to being conducted to the heat radiation fins 16 and dissipated along with the cooling air, part of the heat conducted to the heat radiator 14 is conducted to the instrument frame 9 and dissipated. In addition, since the customer installation site is a flat installation board 18, the back plate 10 and the attachment pieces 12, 12 corresponding to the installation board 18 of the container frame 9 are made into a flat surface in surface contact with the installation board 18. Part of the heat conducted to the container frame 9 is conducted to the installation board 18 through the back plate 10 and the mounting pieces 12 and 12 and is dissipated. Thereby, the IGBT as the semiconductor element can be effectively cooled without increasing the number of the radiating fins 16 and without increasing the feeding capacity of the blower fan that blows the cooling air to the radiating fins 16. The radiating fins 16 are not clogged, and noise generated by the blower fan can be reduced.

（第２の実施例）
図６は、本発明の第２の実施例を示す。
この第２の実施例において、上記第１の実施例と異なるところは、放熱フィン１６の先端部にジグザク状のばね部１６ａが形成され、このばね部１６ａが背面板１０に弾性的に接触即ち圧接されている構成にある。
この第２の実施例によれば、多数の放熱フィン１６に伝導された熱の一部は、ばね部１６ａを介して器枠９の背面板１０に伝達され、更に設置盤１８に伝達されて放散されるので、一層ＩＧＢＴの冷却効果が良くなる。 (Second embodiment)
FIG. 6 shows a second embodiment of the present invention.
The second embodiment differs from the first embodiment in that a zigzag spring portion 16a is formed at the tip of the radiating fin 16, and the spring portion 16a elastically contacts the back plate 10. It is in a configuration where it is pressed.
According to the second embodiment, a part of the heat conducted to the large number of heat dissipating fins 16 is transmitted to the back plate 10 of the device frame 9 via the spring portion 16a, and further transmitted to the installation panel 18. Since it is diffused, the cooling effect of the IGBT is further improved.

（第３の実施例）
図７は、本発明の第３の実施例を示す。
この第３の実施例において、前記第１の実施例と異なるところは、放熱体１４における放熱フィン１６の先端部と器枠９における背面板１０との間に熱伝導性の良い材料例えばグラファイト製の伝熱部材２０が配設されている構成にある。
この第３の実施例によれば、多数の放熱フィン１６に伝導された熱の一部は、伝熱部材２０を介して器枠９の背面板１０に伝達され、更に設置盤１８に伝達されて放散されるので、第２の実施例同様に、一層ＩＧＢＴの冷却効果が良くなる。 (Third embodiment)
FIG. 7 shows a third embodiment of the present invention.
The third embodiment differs from the first embodiment in that a material having good thermal conductivity, for example, made of graphite, is provided between the front end portion of the radiation fin 16 in the radiator 14 and the back plate 10 in the casing 9. The heat transfer member 20 is arranged.
According to the third embodiment, a part of the heat conducted to the large number of radiating fins 16 is transmitted to the back plate 10 of the housing 9 through the heat transfer member 20 and further transmitted to the installation panel 18. Therefore, as in the second embodiment, the IGBT cooling effect is further improved.

（第４の実施例）
図８は、本発明の第４の実施例を示す。
この第４の実施例において、前記第１の実施例と異なるところは、器枠９の背面板１０に、熱伝導性の良い材料例えばエバアルミニウム製の突片２１が放熱フィン１６相互間に位置するようにしてねじ２２により取付け固定されている構成にある。
この第４の実施例によれば、放熱フィン１６に吹き当てられる送風ファンからの冷却風は、突片２１により乱流とされて放熱フィン１６の放熱効果を促進させ、更に、器枠９の背面板１０に伝導された熱の一部は、突片２１に伝達させて放散されるので、より一層ＩＧＢＴの冷却効果が良くなる。 (Fourth embodiment)
FIG. 8 shows a fourth embodiment of the present invention.
In the fourth embodiment, the difference from the first embodiment is that a protrusion 21 made of a material having good thermal conductivity, such as EVA aluminum, is located between the radiating fins 16 on the back plate 10 of the casing 9. In this way, the screw 22 is attached and fixed.
According to the fourth embodiment, the cooling air from the blower fan blown against the heat radiating fins 16 is turbulent by the projecting pieces 21 to promote the heat radiating effect of the heat radiating fins 16. Since a part of the heat conducted to the back plate 10 is transmitted to the projecting piece 21 and dissipated, the cooling effect of the IGBT is further improved.

（第５の実施例）
図９は、本発明の第５の実施例を示す。
この第５の実施例において、上記第４の実施例と異なるところは、突片２１の代わりに、背面板１０に、一体に例えば切り起こしにより突片２３が形成されている構成にある。これらの突片２３は、第４の実施例と同様に放熱フィン１６の相互間に位置し、背面板１０と同材料の鋼鈑製である。
従って、この第５の実施例によれば、上記第４の実施例と同様の効果を得ることができ、特に、突片２３を切り起こしにより設けるようにしたので、製作が容易である。 (Fifth embodiment)
FIG. 9 shows a fifth embodiment of the present invention.
The fifth embodiment is different from the fourth embodiment in that the projecting piece 23 is integrally formed on the back plate 10 by, for example, cutting and raising instead of the projecting piece 21. These projecting pieces 23 are located between the radiating fins 16 as in the fourth embodiment, and are made of the same material as the back plate 10.
Therefore, according to the fifth embodiment, the same effect as in the fourth embodiment can be obtained, and in particular, since the protruding piece 23 is provided by cutting and raising, the manufacture is easy.

（第６の実施例）
図１０及び図１１は、本発明の第６の実施例を示す。
この第６の実施例において、前記第１の実施例と異なるところは、器枠９に、取付片部１２、１２の代わりに、後方に突出して略Ｌ字型の取付部たる取付脚部２４、２４が設けられ手いる構成にある。そして、取付脚部２４、２４は、図１１に示すように、複数のねじ１９により設置盤１８に取付け固定される。この場合、器枠９背面板１０と設置盤１８との間には、所定の空間が形成される。
この第６の実施例によれば、器枠９に伝導された熱の一部は、取付脚部２４、２４を介して設置盤１８に伝達されて放散されるようになり、従って、この実地例６によっても第１の実施例と略同様の効果を奏する。 (Sixth embodiment)
10 and 11 show a sixth embodiment of the present invention.
The sixth embodiment is different from the first embodiment in that the mounting leg portion 24 protrudes rearward from the casing 9 instead of the mounting piece portions 12 and 12 and serves as a substantially L-shaped mounting portion. , 24 is provided. Then, as shown in FIG. 11, the mounting legs 24 and 24 are fixedly attached to the installation panel 18 by a plurality of screws 19. In this case, a predetermined space is formed between the housing frame 9 back plate 10 and the installation board 18.
According to the sixth embodiment, a part of the heat conducted to the casing 9 is transmitted to the installation board 18 via the mounting legs 24, 24 to be dissipated. Example 6 also has substantially the same effect as the first example.

（第７の実施例）
図１２は、本発明の第７の実施例を示す。
この第７の実施例において、上記第６の実施例と異なるところは、器枠９の背面板１０と設置盤１８との間にこれらの間の空間を埋めるように熱伝導性の良い材料例えばグラファイト製の伝熱部材２５が配設されている構成にある。
この第７の実施例によれば、器枠９の背面板１０に伝導された熱の一部は、伝熱部材２５を介して設置盤１８に伝達されて放散されるようになり、従って、第６の実施例に比し、ＩＧＢＴの冷却効果が良くなる。 (Seventh embodiment)
FIG. 12 shows a seventh embodiment of the present invention.
In the seventh embodiment, the difference from the sixth embodiment is a material having good thermal conductivity so as to fill a space between the back plate 10 of the casing 9 and the installation board 18. The heat transfer member 25 made of graphite is arranged.
According to the seventh embodiment, a part of the heat conducted to the back plate 10 of the casing 9 is transferred to the installation panel 18 via the heat transfer member 25 and is dissipated. Compared to the sixth embodiment, the IGBT cooling effect is improved.

なお、本発明は、上記し且つ図面に示す実施例に限定されるものではなく、次のような変形、拡張が可能である。
第２乃至第５の実施例のいずれかを第６または第７の実施例に適用してもよい。
放熱器の放熱フィンの数は、限られた設置スペースに応じて設定すればよい。
送風ファンは必要に応じて設ければよい。
インバータ装置に限らず、半導体素子の熱を放散させる必要のある半導体機器全般に適用できる。 The present invention is not limited to the embodiments described above and shown in the drawings, and the following modifications and expansions are possible.
Any of the second to fifth embodiments may be applied to the sixth or seventh embodiment.
What is necessary is just to set the number of the radiation fins of a radiator according to the limited installation space.
A blower fan may be provided as necessary.
The present invention is not limited to inverter devices, and can be applied to all semiconductor devices that need to dissipate heat from semiconductor elements.

本発明の第１の実施例を示す放熱器の斜視図The perspective view of the heat radiator which shows 1st Example of this invention インバータ装置の斜視図Perspective view of inverter device 放熱器の上面図Top view of radiator 放熱器の側面図Side view of radiator 放熱器の分解斜視図Disassembled perspective view of radiator 本発明の第２の実施例を示す図３相当図FIG. 3 equivalent view showing a second embodiment of the present invention. 本発明の第３の実施例を示す図３相当図FIG. 3 equivalent view showing a third embodiment of the present invention. 本発明の第４の実施例を示す図３相当図FIG. 3 equivalent view showing a fourth embodiment of the present invention. 本発明の第５の実施例を示す第３相当図3rd equivalent figure which shows the 5th Example of this invention 本発明の第６の実施例を示す図１相当図FIG. 1 equivalent view showing a sixth embodiment of the present invention. 図４相当図4 equivalent figure 本発明の第７の実施例を示す図１１相当図FIG. 11 equivalent view showing the seventh embodiment of the present invention

Explanation of symbols

図面中、１はインバータ装置（半導体機器）、８は放熱器、９は器枠、１０は背面板、１１は側面板、１２は取付片部（取付部）、１３はフランジ部、１４は放熱体、１５は放熱基板、１５ａは設置面、１６は放熱フィン、１６ａはばね部、１８は設置盤（取付部位）、２０は伝熱部材、２１及び２３は突片、２４は取付脚部（取付部）、２５は伝熱部材を示す。
In the drawings, 1 is an inverter device (semiconductor device), 8 is a radiator, 9 is a frame, 10 is a back plate, 11 is a side plate, 12 is a mounting piece (mounting portion), 13 is a flange portion, and 14 is heat dissipation. Body, 15 is a heat dissipation substrate, 15a is an installation surface, 16 is a heat dissipation fin, 16a is a spring part, 18 is an installation panel (attachment part), 20 is a heat transfer member, 21 and 23 are projecting pieces, 24 is an attachment leg ( Reference numerals 25 and 25 denote heat transfer members.

Claims

A container frame made of a material with good thermal conductivity;
A radiator disposed in the housing,
The instrument frame has a flat back plate, a side plate projecting from two sides of the back plate, and a mounting portion that extends to the remaining two sides of the back plate and is attached to a mounting site. And a flange portion projecting inward at the distal end portion of the side plate,
The heat dissipating member includes a heat dissipating substrate that is conducted in contact with the flange portion and that is fixed to the flange portion, and a plurality of heat dissipating fins protruding from the heat dissipating substrate. Semiconductor equipment heatsink.

2. The heat radiation of a semiconductor device according to claim 1, wherein the mounting portion is formed on a flat surface, and the surface corresponding to the mounting portion of the housing and the mounting portion are formed on a flat surface in surface contact with the mounting portion. vessel.

3. The semiconductor device according to claim 1, wherein a tip portion of the heat dissipating fin of the heat dissipating member is formed in a spring portion, and the spring portion is brought into contact with a surface corresponding to a mounting portion of the device frame. Radiator.

3. The heat dissipation of a semiconductor device according to claim 1, wherein a heat transfer member having a good thermal conductivity is disposed between a tip of the heat dissipating fin of the heat dissipating member and a surface corresponding to the mounting portion of the casing. vessel.

3. A radiator for a semiconductor device according to claim 1, wherein a projecting piece is disposed between the radiation fins of the radiator.

6. The radiator of a semiconductor device according to claim 5, wherein the projecting piece is integrally formed on a surface corresponding to a mounting portion of the device frame.

2. A radiator of a semiconductor device according to claim 1, wherein a heat transfer member having good thermal conductivity is disposed between a surface corresponding to the mounting portion of the device frame and the mounting portion.