JP5045391B2 - Resin adhesion device - Google Patents

Description

  The present invention relates to a technique of a resin adhesion apparatus in filament winding molding in which resin is adhered to a fiber bundle by spraying the resin toward the surface of the fiber bundle.

  FRP (FIBER REINFORCED PLASTICS) is well known as a material manufactured by impregnating a reinforcing fiber such as carbon fiber with a liquid thermosetting resin and then curing the resin. Conventionally, FRP has been widely used as pipes, bars, and the like.

  Filament winding molding is known as an FRP molding method. Filament winding molding is suitable for producing a pipe-shaped or cylindrical molded body. Filament winding molding is a method in which a tension is applied to a reinforcing material such as carbon roving impregnated with a liquid thermosetting resin, and the reinforcing material is wound around a mold (mandrel) without slack and then the resin is cured. It is.

  In filament winding molding, as a device for attaching (impregnating) resin to a fiber bundle, a resin attaching device is known. For example, Patent Document 1 discloses a roller type resin adhesion device. The roller system is a resin adhesion apparatus of a system in which a fiber bundle is run on an upper part of a roller whose lower part is immersed in a resin tank and resin is adhered to the fiber bundle.

  The resin adhesion apparatus is required to be processed at high speed from the viewpoint of improving productivity in filament winding molding. However, in the roller system, if the processing speed is increased, resin adhesion unevenness may occur, and thus the processing speed is limited.

Thus, the inventors have developed a droplet jetting resin deposition apparatus as a resin deposition apparatus that replaces the roller system. The droplet ejection type resin adhesion device includes a droplet ejection device having a number of resin ejection nozzles, and a traveling device that travels a fiber bundle at a predetermined facing distance from the nozzles. It is a resin adhering device that injects resin toward the surface of the bundle by a droplet ejecting device.
JP 2007-185827 A

Here, the carbon fiber or glass fiber used for filament winding molding is in a fiber bundle state in which several μm filaments are bundled from several thousand to several tens of thousands. In some cases, such a fiber bundle travels in a state where “fiber breakage” occurs in the droplet ejecting apparatus. Here, “fiber break” refers to a state in which a gap is generated along the traveling direction of the fiber bundle. When the fiber bundle travels at the droplet ejection target position in a state where fiber breakage occurs, the droplet passes through the fiber bundle without hitting the fiber bundle. For this reason, a predetermined amount of droplets do not adhere to the fiber bundle, and a defective product is generated due to insufficient droplet adhesion amount.
Therefore, the problem to be solved by the present invention is to prevent the occurrence of defective products by attaching a resin that could not be focused on the fiber bundle due to fiber cracking to the fiber bundle in the resin attaching apparatus in filament winding molding. It is.

  The problem to be solved by the present invention is as described above. Next, means for solving the problem will be described.

That is, according to claim 1, a droplet ejecting apparatus having a plurality of resin ejecting nozzles, and a traveling apparatus that travels the fiber bundle at a predetermined facing distance from the nozzle, the fiber bundle traveling A resin adhering apparatus in filament winding molding in which resin is adhered to the fiber bundle by injecting resin toward the surface by the droplet ejecting apparatus, and is opposed to the resin injecting nozzle with the fiber bundle interposed therebetween. A resin receiving portion close to the back surface of the fiber bundle at a position, and the resin receiving portion includes at least one groove across the width direction of the fiber bundle on a surface facing the back surface of the fiber bundle; Is.

According to a second aspect of the present invention, at least one of the grooves is inclined with respect to the traveling direction of the fiber bundle.

In Claim 3, the said resin receiving part comprises the side plate facing the side part of the said fiber bundle.

According to a fourth aspect of the present invention, a charging device for charging the resin ejected by the droplet ejecting device is provided, and the resin receiving portion is grounded.

  As effects of the present invention, the following effects can be obtained.

According to the first aspect of the present invention, the resin that has passed through the portion where the fiber breakage has occurred and adheres to the resin receiving portion is caused to flow in the resin receiving portion, and is attached to the fiber bundle that travels in close proximity to the resin receiving portion. Is possible. Thereby, it becomes possible to prevent generation | occurrence | production of the inferior goods by the amount of resin adhering to a fiber bundle being insufficient.
Moreover, it becomes possible to flow the resin adhering to the resin receiving portion in the width direction of the fiber bundle along the groove. Thereby, it becomes possible to make resin flow to the position where it is easy to adhere to a fiber bundle. Therefore, it is possible to prevent the occurrence of defective products due to the insufficient amount of resin adhering to the fiber bundle.

Since it comprised like Claim 2, it becomes possible to make resin adhering to a resin receiving part flow in the width direction of a fiber bundle along a groove | channel. Further, the flow of the resin can be promoted by the traveling of the fiber bundle. Thereby, it becomes possible to make resin flow to the position where it is easy to adhere to a fiber bundle. Therefore, it is possible to prevent the occurrence of defective products due to the insufficient amount of resin adhering to the fiber bundle.

According to the third aspect, it is possible to prevent the resin flowing in the resin receiving portion from flowing out in the width direction of the traveling fiber bundle. Thereby, it becomes possible to adhere to a fiber bundle without missing a predetermined amount of resin. Therefore, it is possible to prevent the occurrence of defective products due to the insufficient amount of resin adhering to the fiber bundle.

According to the fourth aspect of the present invention, it is possible to reliably draw the charged resin toward the grounded resin receiving portion by electrostatic attraction. As a result, it is possible to prevent the resin from deviating in the width direction of the traveling fiber bundle and insufficiently adhering the resin.

Next, an embodiment according to the present invention will be described.
In the following, the arrow F direction in FIGS. 3 to 6 is defined as the forward direction, the arrow U direction in FIGS. 3 and 4 is defined as the upward direction, and the arrow L direction in FIGS. 4 to 6 is defined as the left direction. An explanation will be given based on this.

  FIG. 1 shows an embodiment in which a resin adhesion apparatus 5 according to an embodiment of the present invention is applied to a filament winding molding apparatus 1 for winding a fiber bundle around a mandrel 7.

As shown in FIG. 1, the filament winding molding apparatus 1 includes a unwinding apparatus 3 for unwinding a bundle of carbon fibers (hereinafter simply referred to as “fiber bundle”) 100 from a bobbin 2, and a fiber bundle 100. A tension device 4 for applying a predetermined tension, a resin adhesion device 5 for adhering the resin 8 to the fiber bundle 100, a traverse device 6 for traversing the fiber bundle 100, and the like are provided. The fiber bundle 100 to which the resin 8 is adhered by the resin adhesion device 5 is wound around the mandrel 7 while being traversed by the traverse device 6.
The fiber bundle 100 has a tape shape with flat surfaces on the top and bottom. As shown in FIGS. 2 and 3, the resin 8 is attached to the surface (upper surface) of the fiber bundle 100 by the resin attaching device 5.

  As shown in FIGS. 1 to 4, the resin adhesion device 5 mainly includes a traveling device 10, a droplet ejecting device 11, resin receiving portions 40 a and 40 b and the like.

The travel device 10 travels the fiber bundle 100. The traveling device 10 mainly includes rollers 10a and 10b. The rollers 10a and 10b are arranged so as to sandwich the droplet ejecting device 11, respectively. The rollers 10a and 10b are rotatably supported by a rotation shaft (not shown). The fiber bundle 100 travels as the mandrel 7 rotates. The traveling fiber bundle 100 travels with predetermined intervals between nozzles 29a and 29b provided in a first head 20 and a second head 21, which will be described later, via rollers 10a and 10b, respectively.
However, it is also possible to employ a configuration in which the fiber bundle 100 is caused to travel by rotating the rollers 10a and 10b by driving means (motor or the like) and rotating the rollers 10a and 10b.

  The droplet ejecting device 11 ejects the resin 8 toward the surface of the fiber bundle 100 traveling by the droplet ejecting method. As shown in FIG. 2, the droplet ejecting apparatus 11 mainly includes a first path 14, a second path 17, a first head 20, a second head 21, and the like.

The first path 14 supplies the main agent 12 from the main agent tank 13 filled with the main agent 12 to the first head 20. The first path 14 includes a supply flow path 22 extending from the main agent tank 13 and a branch flow path 23 branched from the supply flow path 22 to reach the first head 20.
The second path 17 supplies the curing agent 15 from the curing agent tank 16 filled with the curing agent 15 to the second head 21. The second path 17 includes a supply flow path 24 extending from the curing agent tank 16 and a branch flow path 25 branched from the supply flow path 24 to reach the second head 21.
These flow paths (feeding flow path 22, branching flow path 23, feeding flow path 24, and branching flow path 25) are made of a metal or resin tube, a hose, or the like. The first path 14 and the second path 17 can be provided with a solenoid valve or a pump for controlling the flow rate.

  The first head 20 sprays and adheres the main agent 12 to the traveling fiber bundle 100. As shown in FIGS. 3 and 4, the first head 20 is arranged above the traveling fiber bundle 100 with a predetermined facing distance from the fiber bundle 100. The first head 20 includes a connection chamber 26 that receives the main agent 12 fed from the branch flow path 23, a storage chamber 27 that is connected to the connection chamber 26 and stores the main agent 12, and a storage chamber 27. A branched pressure chamber 28 is provided.

In the pressure chamber 28, a plurality of nozzles 29a, 29a,... The first head 20 uses a piezo element 30 that expands and contracts by voltage as a pressure generation source for the pressure chamber 28. A diaphragm 31 that is vibrated by the piezoelectric element 30 is installed on the partition wall (upper wall) of the pressure chamber 28. When the diaphragm 31 is displaced in a convex shape that expands downward as shown by a two-dot chain line in FIG. 3 in response to expansion and contraction of the piezo element 30, the volume in the pressure chamber 28 decreases. In this way, the main agent 12 composed of a predetermined amount of liquid droplets in the picoliter order is ejected from the nozzles 29a, 29a,. When the diaphragm 31 is returned to the flat state as shown by the solid line in FIG. 3, the volume in the pressure chamber 28 increases. As a result, the main agent 12 is supplied from the storage chamber 27 to the pressure chamber 28.
In the present embodiment, the nozzles 29a, 29a,... Are arranged side by side in the left-right direction, but the arrangement pattern of the nozzles 29a, 29a,.

  The connection chamber 26 is provided with a hot wire (constant temperature means) 33 for heating the main agent 12 and maintaining it at a predetermined temperature, and a temperature sensor (not shown) for detecting the temperature in the connection chamber 26. Is done. The detection result by the temperature sensor is compared with a preset threshold value, and the hot wire 33 is controlled to be turned on / off based on the comparison result, whereby the temperature of the main agent 12 is maintained at a predetermined temperature.

  The second head 21 sprays and adheres the curing agent 15 to the traveling fiber bundle 100. The configuration of the second head 21 is also substantially the same as that of the first head 20, and in FIG. 3, the same members are denoted by the same reference numerals, and description thereof is omitted. The nozzle 29b is a nozzle for discharging the curing agent.

  Below, the structure of resin receiving part 40a * 40b which is 1st embodiment of the resin receiving part which concerns on this invention is demonstrated. The resin receiving portion 40a and the resin receiving portion 40b have substantially the same configuration. Therefore, only the configuration of the resin receiving portion 40a will be described below. In addition, about the structure of the resin receiving part 40b, the same member number is attached | subjected to the member of the structure substantially the same as the resin receiving part 40a in FIG. 4, and description is abbreviate | omitted.

  As shown in FIGS. 4 and 5, the resin receiving portion 40a includes a bottom plate 41 and a pair of side plates 42a and 42b. The resin receiving portion 40a can be formed from a raw material such as a resin such as polyacetal or acrylic, or ceramic, but is not particularly limited.

  The bottom plate 41 is a rectangular member. The side plates 42a and 42b are members having substantially the same shape. The side plates 42a and 42b are projected upward at the left end and the right end of the upper surface of the bottom plate 41, respectively. Further, the side plates 42a and 42b are arranged so as to be parallel to each other with an interval substantially the same as the width of the traveling fiber bundle 100. That is, the cross section perpendicular to the front-rear direction of the resin receiving portion 40a is substantially U-shaped.

  A plurality of grooves 41 a, 41 a,... Are provided on the upper surface of the bottom plate 41. The groove 41a has a substantially rectangular shape in plan view, and is provided so that its longitudinal direction extends between the side plates 42a and 42b. The grooves 41a, 41a,... Are provided at regular intervals in the front-rear direction.

  In the present embodiment, a plurality of grooves 41a are provided. However, a single groove extending between the side plates 42a and 42b may be provided.

Below, the position where resin receiving part 40a * 40b is arrange | positioned is demonstrated using FIG.2 and FIG.4.
The resin receiving portion 40a is disposed at a position facing the droplet ejecting device 11 with the fiber bundle 100 interposed therebetween. More specifically, the resin receiving portion 40a is disposed at a position facing the first head 20 of the droplet ejecting apparatus 11 with the fiber bundle 100 interposed therebetween.
The resin receiving portion 40a is arranged in parallel with the fiber bundle 100 on which the side plates 42a and 42b travel, and is disposed so that the fiber bundle 100 travels between the side plates 42a and 42b.
The resin receiving portion 40 a is disposed so that the upper surface of the bottom plate 41 faces the back surface of the fiber bundle 100. Further, the resin receiving portion 40a is disposed so as to be “close to” the fiber bundle 100 on which the upper surface of the bottom plate 41 travels. Here, “adjacent” means that the bottom plate 41 and the fiber bundle 100 are sufficiently close to each other or in contact with each other so that the resin 8 flowing on the upper surface of the bottom plate 41 can adhere to the fiber bundle 100 as described later. It is in the state.

The resin receiving portion 40b is disposed at a position facing the droplet ejection device 11 with the fiber bundle 100 interposed therebetween. More specifically, the resin receiving portion 40a is disposed at a position facing the second head 21 of the droplet ejecting apparatus 11 with the fiber bundle 100 interposed therebetween.
The resin receiving portion 40b is parallel to the fiber bundle 100 on which the side plates 42a and 42b travel, and is arranged so that the fiber bundle 100 travels between the side plates 42a and 42b.
The resin receiving portion 40 b is disposed so that the upper surface of the bottom plate 41 faces the back surface of the fiber bundle 100. Further, the resin receiving portion 40b is disposed so as to be “close to” the fiber bundle 100 on which the upper surface of the bottom plate 41 travels.

  Hereinafter, the manner in which the main agent 12 adheres to the fiber bundle 100 when the main agent 12 is ejected from the nozzle 29a to the fiber bundle 100 in which the fiber is broken will be described with reference to FIG.

  Usually, the fiber bundle 100 travels in a state of being uniformly dispersed in a width substantially the same as the distance between the pair of side plates 42a and 42b. However, when a fiber break occurs, a portion (hereinafter simply referred to as “fiber break portion”) S in which no fiber exists within the width of the fiber bundle 100 is generated as shown in FIG.

When the main agent 12 is sprayed from the nozzles 29 a, 29 a... To the fiber bundle 100 when the fiber cracking portion S is generated, the main agent 12 hitting the traveling fiber bundle 100 becomes the fiber bundle 100. Adhere to. However, the main agent 12 sprayed from the nozzle 29 a toward the fiber split portion S passes through the fiber split portion S without hitting the fiber bundle 100. However, since there is the resin receiving portion 40a, the main agent 12 adheres to the resin receiving portion 40a.
The main agent 12 adhered to the bottom plate 41 flows so as to spread on the upper surface of the bottom plate 41. As described above, the bottom plate 41 and the fiber bundle 100 are configured to be “close”. As a result, the fiber bundle 100 traveling on the main agent 12 flowing on the upper surface of the bottom plate 41 can be touched, and the main agent 12 can be attached to the fiber bundle 100.

  In addition, the main agent 12 that has flowed into the grooves 41a, 41a,... From the upper surface of the bottom plate 41 without adhering to the fiber bundle 100, and the main agent 12 that directly hits the grooves 41a, 41a,. Flow in the direction. That is, by providing the grooves 41a, 41a, etc., the main agent 12 can surely flow in the left-right direction. Thereby, the main agent 12 that has passed through the fiber cracking part S and adhered to the resin receiving part 40a can be brought into contact with and adhered to the fiber bundle 100 that travels outside the fiber cracking part S.

  Even when the curing agent 15 is sprayed on the fiber bundle 100 in which the fiber is broken, the curing agent 15 can be attached to the fiber bundle 100 in substantially the same manner as when the main agent 12 is sprayed. It is. That is, the upper surface of the bottom plate 41 and the grooves 41a, 41a,. . As a result, it is possible to cause the flowing curing agent 15 to touch the traveling fiber bundle 100 and attach it to the fiber bundle 100.

  The interval between the side plates 42a and 42b is not limited to the interval substantially the same as the width of the fiber bundle 100 as described above. Further, the arrangement of the side plates 42a and 42b is not limited to an arrangement that is parallel to each other as described above. That is, the side plates 42a and 42b may be configured to prevent the resin 8 flowing through the resin receiving portions 40a and 40b from flowing out in the left-right direction.

As described above, the resin adhesion device 5 of the present embodiment is
A droplet ejection device 11 having a plurality of resin ejection nozzles 29a and 29b;
A traveling device 10 that travels the fiber bundle 100 at a predetermined distance from the nozzles 29a and 29b;
Comprising
By the resin adhesion device 5 in filament winding molding in which the resin 8 (the main agent 12 and the curing agent 15) is ejected by the droplet ejecting device 11 toward the surface of the traveling fiber bundle 100 to adhere the resin 8 to the fiber bundle 100. There,
The resin receiving part 40a and the resin receiving part 40b which are arrange | positioned so that the back surface of the fiber bundle 100 may be adjoined in the position which opposes the nozzle 29a and the nozzle 29b on both sides of the fiber bundle 100 are comprised.
By comprising in this way, the fiber bundle which passes through the fiber crack part S and made the resin 8 which hit the resin receiving part 40a * 40b flow on the surface of the resin receiving part 40a * 40b, and travels in the vicinity of the said surface It becomes possible to make it adhere to 100. Thereby, it becomes possible to prevent generation | occurrence | production of the inferior goods by the quantity of the resin 8 adhering to the fiber bundle 100 being insufficient.

In addition, the resin receiving portions 40a and 40b of the resin adhering apparatus 5 of the present embodiment are
Side plates 42 a and 42 b facing the side portions of the fiber bundle 100 are provided.
With this configuration, it is possible to prevent the resin 8 flowing on the surfaces of the resin receiving portions 40a and 40b from flowing out in the width direction of the traveling fiber bundle 100. Thereby, it becomes possible to make the predetermined amount of the resin 8 adhere to the fiber bundle 100 without missing. In addition, it is possible to prevent generation of defective products due to a shortage of the amount of the resin 8 adhering to the fiber bundle 100.

In addition, the resin receiving portions 40a and 40b of the resin adhering apparatus 5 of the present embodiment are
At least one groove 41 a extending in the width direction of the fiber bundle 100 is provided on the surface facing the back surface of the fiber bundle 100.
By comprising in this way, it becomes possible to make the resin 8 which hit the resin receiving part 40a * 40b flow in the width direction of the fiber bundle 100 along the groove | channel 41a. As a result, the resin 8 can be flowed to a position where it can easily adhere to the fiber bundle 100. In addition, it is possible to prevent generation of defective products due to a shortage of the amount of the resin 8 adhering to the fiber bundle 100.

  In addition, it is also possible to adjust the temperature of resin receiving part 40a * 40b by providing heating means, such as a heat ray, and a temperature sensor etc. inside resin receiving part 40a * 40b. By comprising in this way, the temperature of the resin 8 which hit the resin receiving part 40a * 40b can be adjusted. Thereby, it becomes possible to keep the viscosity of the resin 8 at a value suitable for flowing.

  In addition, the resin receiving portion 40a and the resin receiving portion 40b in the present embodiment can be integrally configured in the traveling direction of the fiber bundle 100. However, in that case, the main agent 12 and the curing agent 15 may be mixed and cured on the resin receiving portions 40a and 40b integrally formed. Therefore, it is desirable to provide the resin receiving portions 40a and 40b separately for each type of material to be injected as in this embodiment.

  In addition, the direction which arrange | positions resin receiving part 40a * 40b is not limited to this embodiment. That is, the arrangement direction of the resin receiving portions 40a and 40b can be changed according to the arrangement direction of the droplet ejecting device 11 and the like, and is not limited to the arrangement in the horizontal plane as in this embodiment.

  Below, the structure of the resin receiving part 50 which is 2nd embodiment of the resin receiving part which concerns on this invention is demonstrated using FIG.

The resin receiving portion 50 includes a bottom plate 51 and a pair of side plates 52a and 52b. The configurations of the bottom plate 51 and the side plates 52a and 52b and the arrangement in the resin adhesion device 5 are substantially the same as the bottom plate 41 and the side plates 42a and 42b of the resin receiving portions 40a and 40b.
The difference between the resin receiving portion 50 and the resin receiving portions 40a and 40b is that grooves 51a, 51b, 51c, 51d, and 51e having different patterns from the grooves 41a are provided on the bottom plate 51.

On the upper surface of the bottom plate 51, a plurality of grooves 51a, 51b, 51c, 51d, and 51e are provided.
The groove 51a extends between the side plates 52a and 52b so as to incline forward from the left and right end portions to the center portion.
The groove 51c is disposed in front of the groove 51a, and is formed so as to incline forward from the center portion to the left and right end portions between the side plates 52a and 52b.
The groove 51b is formed so as to communicate the central portion of the groove 51a with the central portion of the groove 51c.
The groove 51e is disposed in front of the groove 51c, and is formed so as to incline forward from the left and right end portions to the center portion between the side plates 52a and 52b.
The grooves 51d and 51d are formed so as to communicate the left and right ends of the groove 51c and the left and right ends of the groove 51e, respectively.

Next, the flow mode of the resin 8 when the resin 8 hits the resin receiving portion 50 configured as described above will be described.
When the fiber bundle 100 adjacent to the bottom plate 51 travels from the rear to the front, the resin 8 in contact with the fiber bundle 100 is urged to flow from the rear to the front. Thereby, a flow from the rear to the front is generated in the entire resin 8 on the upper surface of the bottom plate 51. With this flow, the resin 8 in the groove 51a flows in the groove 51a from the left and right ends toward the center. The resin 8 that has reached the center of the groove 51a flows forward in the groove 51b and flows into the center of the groove 51c. The resin 8 that has flowed into the central portion of the groove 51c flows in the groove 51c from the central portion toward the left and right ends. The resin 8 reaching the left and right ends of the groove 51c flows forward in the grooves 51d and 51d and flows into the left and right ends of the groove 51e. The resin 8 that has flowed into the left and right ends of the groove 51e flows in the groove 51e from the left and right ends to the center.

As described above, the resin receiving portion 50 of the resin adhering apparatus 5 of the present embodiment is
At least one of the grooves 51a, 51b, 51c, 51d, and 51e is inclined with respect to the traveling direction of the fiber bundle 100.
By comprising in this way, it becomes possible to make the resin 8 which hit the resin receiving part 40a * 40b flow in the width direction of the fiber bundle 100 along the groove | channel 41a. Further, the flow of the resin 8 can be promoted by the traveling of the fiber bundle 100. As a result, the resin 8 can be flowed to a position where it can easily adhere to the fiber bundle 100. In addition, it is possible to prevent generation of defective products due to a shortage of the amount of the resin 8 adhering to the fiber bundle 100.

  As described above, by providing the grooves 51a, 51c, 51e provided in the bottom plate 51 with an inclination in the front-rear direction, it is possible to promote the flow of the resin 8 in the left-right direction. In addition, by communicating the grooves 51a, 51c, and 51e with the grooves 51b and 51d, it is possible to increase the distance that the resin 8 can flow. Thereby, it becomes possible to increase the possibility that the resin 8 will adhere to the traveling fiber bundle 100. As a result, it is possible to prevent the occurrence of defective products due to the insufficient amount of the resin 8 attached.

  In addition, in the resin adhesion apparatus 5 mentioned above, it is also possible to make it the structure which makes the traveling apparatus 10 incline below from the upstream of the traveling direction of the fiber bundle 100 to the downstream. Accordingly, the resin receiving part 50 is also arranged in an inclined state. By comprising in this way, it becomes possible to accelerate | stimulate the flow to the front of the resin 8 which flows on the resin receiving part 50 by gravity. Thereby, the flow of the resin 8 in the left-right direction can also be promoted, and the possibility that the resin 8 adheres to the fiber bundle 100 traveling can be increased. As a result, it is possible to prevent the occurrence of defective products due to the insufficient amount of the resin 8 attached.

The resin receiving part according to the present invention is not limited to the resin receiving parts 40a and 40b and the resin receiving part 50 described above. For example, it is good also as a structure which gives a blast process, a knurling process, etc. to the surface (surface where resin flows) facing the fiber bundle of the resin receiving part which concerns on this invention.
By subjecting the surface of the resin receiving portion facing the fiber bundle to blasting or knurling, a large number of minute irregularities are provided on the surface. Accordingly, it is possible to prevent the traveling fiber bundle from adhering to the resin receiving portion and becoming resistance to traveling. Further, since the unevenness is minute, it does not hinder the flow of the resin 8.

As another embodiment of the resin adhesion apparatus according to the present invention, the resin 8 can be adhered to the fiber bundle 100 using a potential difference.
Specifically, as shown in FIG. 7, a high-voltage electrostatic generator 60 that is a charging device according to the present invention is arranged in the ejection direction of the nozzles 29 a of the first head 20. The high-voltage electrostatic generator 60 is formed in a ring shape having a hole 60a penetrating vertically. The high-voltage electrostatic generator 60 ionizes the air inside the hole 60a. The droplet of the main agent 12 ejected from the nozzle 29a of the first head 20 is charged with negative static electricity by passing through the inside of the hole 60a.
On the other hand, by grounding the rollers 10a and 10b, the fiber bundle 100 is caused to travel in a grounded state.
By configuring as described above, it becomes possible to make the droplet of the main agent 12 having negative static electricity adhere to the fiber bundle 100 that is securely grounded by electrostatic attraction.
Similar to the above-described configuration, the curing agent 15 can be attached to the fiber bundle 100 by disposing the high-voltage electrostatic generator 60 in the ejection direction of the nozzle 29 b of the second head 21. Thereby, even when a fiber crack occurs in the fiber bundle 100, it is possible to prevent the occurrence of defective products due to the insufficient amount of the resin 8 attached.

As described above, the resin adhesion device 5 of the present embodiment is
A droplet ejection device 11 having a plurality of resin ejection nozzles 29a and 29b;
A traveling device 10 that travels the fiber bundle 100 at a predetermined distance from the nozzles 29a and 29b;
Comprising
By the resin adhesion device 5 in filament winding molding in which the resin 8 (the main agent 12 and the curing agent 15) is ejected by the droplet ejecting device 11 toward the surface of the traveling fiber bundle 100 to adhere the resin 8 to the fiber bundle 100. There,
A high-voltage electrostatic generator 60 which is a charging device for charging the resin 8 ejected by the droplet ejecting device 11;
The fiber bundle 100 is run while being grounded.
By configuring in this way, it becomes possible to adhere the droplet of the resin 8 having negative static electricity to the fiber bundle 100 that is securely grounded by electrostatic attraction. Thereby, even when a fiber crack occurs in the fiber bundle 100, it is possible to prevent the occurrence of defective products due to the insufficient amount of the resin 8 attached.

The present invention is not limited to the configuration as described above, and the charging device according to the present invention may be used to charge the resin 8 in advance before jetting.
Further, in the configuration in which the resin 8 is adhered to the fiber bundle 100 using the potential difference as described above, the resin receiving portion in the present invention can be grounded instead of grounding the fiber bundle 100. By comprising in this way, it becomes possible to draw a droplet reliably toward the said resin receiving part by electrostatic attraction. As a result, it is possible to prevent the droplets from deviating in the width direction of the traveling fiber bundle 100 and the amount of the resin 8 adhering from being insufficient.

The perspective view which shows each apparatus in the filament winding shaping | molding which concerns on embodiment of this invention. The side view which similarly shows the resin adhesion apparatus. The side view which similarly shows a droplet ejecting apparatus. The perspective view which similarly shows the mode of injection of resin in a resin adhesion apparatus. The figure which similarly shows the 1st form of a resin receiving part. (A) Top view, (b) Sectional drawing which shows the AA cross section in (a), (c) Front view. The figure which similarly shows the 2nd form of a resin receiving part. (A) Top view, (b) Sectional drawing which shows the BB cross section in (a), (c) Front view. The side view which similarly shows other embodiment of the resin adhesion apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 Resin adhesion apparatus 10 Traveling apparatus 11 Droplet injection apparatus 40a Resin receiving part 40b Resin receiving part 41 Bottom plate 42a Side plate 42b Side plate 60 High voltage electrostatic generator (charging device)
100 fiber bundle

Claims (4)

A droplet ejection device having a plurality of resin ejection nozzles;
A traveling device that travels the fiber bundle at a predetermined facing distance from the nozzle;
Comprising
A resin adhesion device in filament winding molding in which resin is adhered to the fiber bundle by injecting resin toward the surface of the traveling fiber bundle by the droplet ejection device,
Comprising a resin receiving portion close to the back surface of the fiber bundle at a position facing the nozzle for resin injection across the fiber bundle;
The resin receiving device, wherein the resin receiving portion includes at least one groove extending in a width direction of the fiber bundle on a surface facing the back surface of the fiber bundle . The resin adhering apparatus according to claim 1, wherein at least one of the grooves is inclined with respect to a traveling direction of the fiber bundle . The resin adhering device according to claim 1, wherein the resin receiving portion includes a side plate facing a side portion of the fiber bundle . Comprising a charging device for charging the resin ejected by the droplet ejecting device;
The resin adhering apparatus according to claim 1, wherein the resin receiving portion is grounded .

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