JP4701567B2 - Component mounting method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting apparatus capable of positioning an electronic circuit board at a component mounting position while obtaining a planar accuracy of a component mounting surface of the electronic circuit board during component mounting.
[0002]
[Prior art]
First, a conventional board positioning apparatus in a component mounting apparatus will be described.
[0003]
5 is a perspective view of a component mounting unit of a general component mounting apparatus, FIG. 6 is a partial side view of the component mounting unit shown in FIG. 5, and FIG. 7 is a main part of a substrate positioning device in a conventional component mounting apparatus. FIG. A is a side view showing a supporting state of the electronic circuit board before mounting the component, and FIG. B is a side view showing a positioning state of the electronic circuit board when mounting the component. 8 schematically shows the main part of another substrate positioning device in the conventional component mounting apparatus. FIG. 8A is a side view showing the supporting state of the electronic circuit board before the component mounting, and FIG. FIG. 9 is a side view showing a positioning state of the electronic circuit board at the time of mounting the component, and FIG. 9 is a functional explanatory view when correcting the planar accuracy of the component mounting surface of the electronic circuit board warped using the prior art board positioning device; And FIG. 10 shows an upside-down using a conventional substrate positioning apparatus. It was a diagram for describing a case in which the electronic circuit can not correct the flatness of the component mounting surface of the substrate.
[0004]
5 and 6, reference numeral 1 indicates a component mounting apparatus as a whole. The component mounting apparatus 1 is configured to convey the component above the electronic circuit board B held in a horizontal state while adsorbing and holding the component by a vacuum pressure that is a negative pressure, and destroying the vacuum pressure to absorb the component. Is a device that automatically attaches to a predetermined position of the electronic circuit board B. The component mounting apparatus 1 includes a suction nozzle 10 as a component suction portion, a moving device 20 that moves the suction nozzle 10, a vacuum source (not shown), a control device, and the like.
[0005]
The suction nozzle 10 is a hollow nozzle, and the tip portion 11 at the lower end thereof is a component that can hold the electronic component P by vacuum suction as shown in FIG. The suction nozzle 10 is connected to a vacuum generation source such as a vacuum pump via a vacuum / vacuum break switching electromagnetic valve (not shown). When the vacuum generation source is activated and the vacuum / vacuum break switching electromagnetic valve is switched to the vacuum generation source side, the tip 11 of the suction nozzle 10 can suck and hold the electronic component P.
[0006]
The moving device 20 is disposed above the base 21 in a state of being supported at a predetermined interval by a plurality of support members 22. The moving device 20 is a three-axis control type of the X axis, the Y axis, and the H axis, and moves the suction nozzle 10 along the X axis, the Y axis, and the H axis that are orthogonal to each other. The guide 23, the movement guide 24, the movement head 25 attached to the movement guide 24, and the like.
[0007]
The pair of guides 23 are directly fixed on the plurality of support members 22 in a state of extending in a direction orthogonal to a conveyance direction (arrow X axis direction) of the electronic circuit board B described later, and the electronic circuit board Are arranged in parallel to each other at a predetermined interval in the transport direction (arrow X-axis direction).
[0008]
The moving guide 24 is stretched so as to be orthogonal to the pair of guides 23, and is supported so as to be able to move on the guides 23 in the Y-axis direction. That is, a feed screw 26 is provided on each guide 23, and nuts 27 attached to both ends of the moving guide 24 mesh with each feed screw 26. A motor 28 is attached to one end of each feed screw 26. By operating these motors 28 in synchronism with each other, each feed screw 26 rotates in synchronism with each other, and the movement guide 24 moves in the Y-axis direction. And can be stopped at a predetermined position in the Y-axis direction. That is, positioning in the Y-axis direction can be performed.
[0009]
The moving head 25 is disposed on the moving guide 24 and is configured to move in the X-axis direction thereon. That is, a feed screw 29 is disposed in the longitudinal direction on the moving guide 24, and a nut 30 provided on the moving head 25 is engaged, and motors attached to both ends of the feed screw 29. By driving 31, the moving head 25 can be moved in the X-axis direction. That is, the moving head 25 can be positioned in the X-axis direction.
[0010]
Further, the moving head 25 moves the suction nozzle head 11 in the arrow H-axis direction and performs positioning in the height direction. That is, a feed screw 32 is disposed in the height direction on the moving head 25, and a nut (not shown) provided in the suction nozzle head 11 is engaged with one end of the feed screw 32. The suction nozzle head 11 can be moved in the H-axis direction along the guide rail 34 by driving the motor 33 attached to. That is, the moving head 25 can be positioned in the H-axis direction (height direction).
[0011]
A conveyor 35 is disposed on the base 21. The conveyor 35 is composed of two linear belt guides 36 and two endless conveyor belts 37 arranged in parallel with each other at a predetermined interval in the Y-axis direction. The electronic circuit board B is transferred in the direction of arrow R by the actuator as described above, and the electronic circuit board B is positioned at the mounting position JP of the electronic component P.
[0012]
The electronic circuit board B is placed on the conveyor belt 37 and conveyed to the mounting position JP, and various electronic components P are mounted at predetermined positions on the electronic circuit board B by the action of the suction nozzle head 11. The component supply cassette 100 shown in FIG. 5 is a storage member in which various electronic components are stored and arranged in separate cassettes C1, C2,... Cn for each type, and is on the side of the mounting position JP. It is arranged in the vicinity.
[0013]
The suction nozzle 10 picks up a desired electronic component P from the component supply cassette 100, carries it to a predetermined XY position of the mounting position JP by the moving device 20, and descends in the H-axis direction in consideration of the thickness of the electronic component P. Then, the electronic component P is mounted at a predetermined position on the electronic circuit board B.
[0014]
What is important here is that the height on the electronic circuit board B when the electronic part P is lowered onto the electronic circuit board B is always constant, and the electronic circuit board B is mounted while the plurality of electronic parts are mounted. The position in the XY (horizontal) direction does not move, and the component mounting surface of the electronic circuit board B is held in a flat state.
[0015]
For this reason, various substrate positioning devices have been developed. FIG. 7 shows one substrate positioning apparatus 50A. The substrate positioning device 50A is composed of a conveyor 35A, a hood 51 formed on the upper end portion thereof, a cylinder 52, a backup pin 54, a stopper 58, and the like.
[0016]
The conveyor 35A is formed with a stepped portion 38 having an L-shaped cross section, a horizontal surface of the stepped portion 38 is finished to be a flat surface, and two belt guides 36 disposed so that the stepped portions 38 face each other. The eaves 51 are fixed to the upper end portions of the belt guides 36 so as to cover the stepped portion 38, and the conveyor belt 37 is guided and moved by the horizontal surface of the stepped portion 38.
[0017]
The eaves 51 are horizontally formed above the conveyor 35A so as to cover the upper side of the conveyor belt 37 so that the upper surface of the electronic circuit board B can be pressed.
[0018]
A plurality of backup pins 54 are erected on the upper surface of the backup plate 53 at a predetermined interval. An engagement piece 55 is formed horizontally at the lower side of the backup plate 53 toward the outside.
[0019]
The stopper 56 is erected on the base 21 and protrudes horizontally at a predetermined height position above the engagement piece 55.
[0020]
As shown in FIG. 7B, the positioning operation of the board positioning device 50A is performed by operating the cylinder 52 and raising the plurality of backup pins 54 to elongate the electronic circuit board B to the eaves 51. The height is regulated and positioned by the engagement piece 55 coming into contact with the stopper 56.
[0021]
In this way, the height of the electronic circuit board B and the position in the XY (horizontal) direction are regulated, and the electronic circuit board B is fixed and positioned.
[0022]
The substrate positioning device 50A having the above-described configuration needs to change the height of the stopper 56 or the length of the backup pin 54 depending on the thickness of the electronic circuit board B.
[0023]
Further, this mechanism does not provide a sufficient holding force in the horizontal direction of the electronic circuit board B, and it is necessary to prepare a separate holding mechanism.
[0024]
The other prior art substrate positioning device 50B shown in FIG. 8 is an improved device for saving the height adjustment work of the substrate positioning device 50A, and the conveyor 35B has an upper surface of the electronic circuit board B. A belt guide 36 is composed of a fixed guide portion 36A and a movable guide portion 36B that can move in the vertical direction inside the fixed guide portion 36A. The conveyor belt 37 is guided along the plane of the upper end portion of the movable guide portion 36B. Further, the length of the movable guide portion 36B is such that the maximum rising position of the tip end portion of the backup pin 54 can be regulated with a gap corresponding to the thickness of the electronic circuit board B to be inserted and the thickness of the conveyor belt 37. The fixed guide portion 36A is a member having an inverted L-shaped cross section, and an upper end portion of the fixed guide portion 36A is an eave portion 361 corresponding to the eave portion 51 of the substrate positioning device. It is formed in a horizontal state so as to cover.
[0025]
In the substrate positioning device 50B, the movable guide portion 36B of the belt guide 36 moves in the vertical direction, and the electronic circuit board B is sandwiched and fixed between the eaves 361 and the conveyor belt 37. As shown in FIG. 8B, the movable guide portion 36B is pushed up by the backup plate 53 that is moved up and down by the operation of the cylinder 52, and the movable guide portion 36B serves as a rising end stopper of the cylinder 52. Since the distance from the circuit board B is constant without being influenced by the thickness of the electronic circuit board B, it is not necessary to adjust the height of the backup pin 54 seen in the board positioning device 50A of FIG. Further, the position in the horizontal direction can be fixed by the frictional force generated by sandwiching the electronic circuit board B.
[0026]
[Problems to be solved by the invention]
However, the component mounting surface of the electronic circuit board B is not always held in a flat state. Some of the electronic circuit boards B are warped (warped down) on the insulating substrate surface Bb side, while others are warped (upward warped) on the component mounting surface Ba side.
[0027]
The correction of the planar accuracy of the electronic circuit board B that is warped downward can be performed by the substrate positioning device 50B. This will be described with reference to FIG. 9. When the curved circuit board B (FIG. 9A) that has been conveyed to the board positioning position by the conveyor 35 </ b> B operates the cylinder 52 and the backup plate 53 and the backup pin 54 rise. The lower warped portion is pushed up by the tip of the backup pin 54, and the component mounting surface Ba can be flattened (FIG. 9B).
[0028]
However, as shown in FIG. 10A, when the electronic circuit board B that has been conveyed to the board positioning position by the conveyor 35B is warped, even if the backup pin 54 is raised by operating the cylinder 52, Since there is no warp correction mechanism, the warp cannot be corrected. Therefore, the component mounting accuracy of the component mounting apparatus is lowered.
[0029]
The present invention is intended to solve these problems, and provides a component mounting method and apparatus capable of mounting a component by improving the planar accuracy of a component mounting surface of an electronic circuit board during component mounting. For the purpose.
[0030]
[Means for Solving the Problems]
Therefore, in the component mounting method according to one aspect of the present invention, the component mounting surface holds the electronic circuit board upward, and the component mounting method mounts the component sucked by the vacuum suction nozzle at a predetermined position on the electronic circuit board. In mounting the component on the component mounting surface of the electronic circuit board, the electronic circuit board is pressed from the opposite surface of the component mounting surface while forcibly applying an external force to warp the electronic circuit board. The above problem is solved by adopting a method of mounting the component on the component mounting surface of the electronic circuit board after obtaining the planar accuracy of the mounting surface. The downward warp is preferably applied by applying an external force to the opposite side edges of the electronic circuit board.
[0031]
According to another aspect of the present invention, there is provided a component mounting apparatus including a circuit board positioning unit for holding and positioning an electronic circuit board with a component mounting surface facing upward, and the component sucked by a vacuum suction nozzle is placed on the electronic circuit board. In a component mounting apparatus for mounting at a predetermined position on a component mounting surface of a circuit board, the board positioning means is to be warped by a board lower warping means for forcibly lowering the electronic circuit board and the board lower warping means. Or a board pressing means for pressing the non-component mounting surface of the electronic circuit board that is warped from the non-component mounting surface side to restrict the component mounting surface of the electronic circuit board to a flat state. It comprises and comprises and solves the above-mentioned subject.
[0032]
The substrate downward warping means includes substrate clamping means for clamping both sides on the inner side from both side edges of the electronic circuit board, and the electronic circuit board is warped downward on both side edges of the electronic circuit board. It is desirable to comprise and comprise the external force provision means which applies external force.
[0033]
Further, the substrate clamping means comprises a pair of symmetrically disposed conveyor rails and a pair of first belt guides disposed on the inner side of the conveyor rails, and the two conveyor rails have upper portions thereof. Each of the first belt guides is provided with a stopper that also serves as a second clamper formed at the upper end of the vertical portion and a lower horizontal portion. A spring engaging portion,
The external force applying means is symmetrically disposed at each intermediate portion of the conveyor rail and the first belt guide, and each is pushed up by a spring engaged with the spring engaging portion, and the A pair of push-up positions that are regulated by each stopper, each upper end having a guide surface of a conveyor belt, and also a pressing member that presses both side edges of the electronic circuit board to the component mounting surface side via the conveyor belt It is desirable that the second convex guide is used.
[0034]
Therefore, according to the component mounting method of the present invention, it is possible to correct the warpage of the electronic circuit board regardless of whether the warp of the electronic circuit board is warped or to warp, and to obtain the planar accuracy of the component mounting surface.
[0035]
According to the component mounting apparatus of the present invention, even if the height and thickness of the electronic circuit board change, the planar accuracy of the component mounting surface can be obtained while maintaining the positioning accuracy.
[0036]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the component mounting apparatus of the present invention will be described with reference to the drawings.
[0037]
FIG. 1 is a front sectional view schematically showing a main part of a board positioning device in a component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a positioning apparatus of the present invention showing a mechanism for correcting the warping of an electronic circuit board. FIG. 3 is a front sectional view showing a state in which the electronic circuit board is warped to correct the warpage of the component mounting surface, and FIG. It is front sectional drawing which showed the state which takes out the plane accuracy of a surface.
[0038]
In the configuration of the substrate positioning apparatus of the present invention, the same components as those of the conventional substrate positioning apparatus are denoted by the same reference numerals.
[0039]
In FIG. 1, reference numeral 60 denotes a substrate positioning apparatus according to an embodiment of the present invention. The substrate positioning device 60 is composed of a pair of substrate clamping means, a pair of external force applying means, and a substrate pressing means at the positioning portion of the electronic circuit board B of the conveyor 61.
[0040]
The pair of substrate clamping means is a member for clamping both side portions Bp on the inner side of the both side edge portions Be of the electronic circuit board B, and the substrate clamping means includes the pair of conveyor rails 62 and the pair of first rails. A belt guide 63 is included. The pair of conveyor rails 62 is a plate-like member that is symmetrically opposed and formed in an inverted L shape, and the pair of first belt guides 63 is symmetrically opposed and formed in an L shape. It is a plate-shaped member. One hook-shaped clamper 621 is formed at the tip of the upper horizontal portion of both conveyor rails 62, and a guide hole 632 is opened in the vertical plate portion of both L-shaped first belt guides 63, Stoppers 631 whose upper ends are also the other clampers 633 are formed. Spring engaging portions 634 are respectively formed on the horizontal plate portions below the L-shaped first belt guides 63.
[0041]
The pair of external force applying means are symmetrically disposed in the intermediate portions of the conveyor rail 61 and the first belt guide 63, and are composed of a plate-shaped second belt guide 64 and a spring 65. Yes.
[0042]
Each of the second belt guides 64 is a belt guide member having an upper end surface serving as a guide surface of the conveyor belt 37, and an engagement protrusion 641 that is inserted into the guide hole 632 of the first belt guide 63 is formed on the side of the lower end portion. And is pushed upward by the spring 65 engaged with the spring engaging portion 634 of the first belt guide 63, and the engaging protrusion 641 contacts the stopper 631 so that the upper position of the first belt guide is Be regulated. For this reason, a clearance space S is formed between the conveyor belt 37 sliding on the upper surface of the second belt guide 64 and the upper horizontal portion of the conveyor rail 61.
[0043]
Then, the second belt guide 64 presses both side edge portions Be of the non-component mounting surface Bb of the electronic circuit board B to the component mounting surface Ba side via the conveyor belt 37 and applies an external force to bend to the component mounting surface Ba side. It is also a pressing member to be added.
[0044]
The board pressing means tries to bend (bend down) the non-component mounting surface Bb side from the non-component mounting surface Bb side by the cooperation of the board clamping means and the external force applying means. A member that presses the non-component mounting surface Bb and regulates the component mounting surface Ba of the electronic circuit board B in a horizontal state, which includes an air cylinder 52, a backup plate 53, and a plurality of backups in a conventional component mounting apparatus. It consists of pins 54.
[0045]
Next, the operation of the substrate positioning device 60 of the present invention will be described with reference to FIGS.
[0046]
First, as shown in FIG. 2, it is assumed that all the backup pins 54 of the substrate pressing means are not present, and an electronic circuit board B that originally has warped upward (upward warpage) has been carried in. When the electronic circuit board B that has warped is conveyed to the board positioning device 60 by the conveyor 61, the air cylinder 52 is actuated to raise the backup plate 53 and the electronic circuit board B is positioned. The plate 53 pushes up the lower end portion of the first belt guide 63, and the electronic circuit board B has both side portions Bp inside the side edge portions Be between the clamper 621 of the conveyor rail 62 and the clamper 633 of the first belt guide 63. Further, the pressing force by the spring 65 is applied to both side edge portions Be of the electronic circuit board B through the second belt guide 64, and the both side edge parts Be of the electronic circuit board B are moved upward by applying this pressing force. Is pushed up into the escape space S. Since the electronic circuit board B is clamped at both side parts Bp and both side edge parts Be outside the both side parts Bp are pushed up, the electronic circuit board B is forcibly bent downward as shown in FIG. 2B. Therefore, so-called downward warping occurs. Note that the second belt guide 64 has its engaging protrusion 641 in contact with the stopper 631, and its rise is restricted.
[0047]
As described above, according to the substrate positioning device 60 of the present invention, if the electronic circuit board B is warped, it is forced to hold it with a pressing force that causes warping. Of course, even if the electronic circuit board B is originally warped, a forced pressing force is applied to cause the electronic circuit board B to be warped by the mechanism described above, and the electronic circuit board B is held downward.
[0048]
Therefore, according to the substrate positioning apparatus 60 of the present invention, since the backup plate 53 includes a plurality of backup pins 54 having a predetermined length, the above mechanism works as shown in FIG. 3A. A force for causing the electronic circuit board B to be warped to be warped downward is applied. On the other hand, as shown in FIG. B, the air cylinder 52 is operated, and the spring force of the spring 65 of the second belt guide 64 is increased. When the backup plate 53 and the backup pin 54 are raised by generating a pressing force that can be sufficiently won in the air cylinder 52, the backup pin 54 pushes up the non-component mounting surface Bb of the electronic circuit board B, so that Even if the electronic circuit board B is applied with a force to be warped downward, the downward warping can be corrected, and the component mounting surface Ba can be It is possible to modify the surface.
[0049]
In addition, as shown in FIG. 4, even when the electronic circuit board B that is originally warped is transported to the board positioning device 60, the above-described mechanism works to forcibly lower the electronic circuit board B. A force to warp works, the air cylinder 52 operates in the same manner as described above, and the downward warp is corrected by the pressing force of the backup pin 54, and even the electronic circuit board B originally warped has its component mounting surface Ba Can be modified to a plane.
[0050]
【The invention's effect】
As is apparent from the above description, according to the present invention, it is possible to improve the flatness of the component mounting surface by correcting the warping of the electronic circuit board that could not be corrected by the conventional component mounting apparatus. Therefore, it is possible to accurately control the pushing amount of the suction nozzle at the time of component mounting, and it is possible to obtain a number of excellent effects such as improvement of component mounting accuracy.
[Brief description of the drawings]
FIG. 1 is a front sectional view schematically showing a main part of a board positioning device in a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a front cross-sectional view of the positioning device of the present invention showing a mechanism for correcting the warp of the electronic circuit board.
FIG. 3 is a front cross-sectional view illustrating a state in which the upper accuracy of the component mounting surface is obtained by correcting the warp of the electronic circuit board.
FIG. 4 is a front cross-sectional view illustrating a state in which the flatness of the component mounting surface is obtained by correcting the downward warping of the electronic circuit board.
FIG. 5 is a perspective view of a component mounting unit of a general component mounting apparatus.
6 is a partial side view of the component mounting portion shown in FIG. 5;
FIG. 7 schematically shows a main part of a board positioning device in a conventional component mounting apparatus. FIG. 7A is a side view showing a supporting state of an electronic circuit board before mounting the parts, and FIG. It is a side view which shows the positioning state of the electronic circuit board at the time of the component mounting.
FIG. 8 schematically shows a main part of another board positioning device in a conventional component mounting apparatus, and FIG. 8A is a side view showing a supporting state of an electronic circuit board before the component mounting. B is a side view showing a positioning state of the electronic circuit board when the component is mounted.
FIG. 9 is a functional explanatory diagram in the case of correcting the planar accuracy of the component mounting surface of the electronic circuit board warped using the prior art board positioning device;
FIG. 10 is an explanatory diagram in a case where the planar accuracy of the component mounting surface of the electronic circuit board warped using the conventional board positioning device cannot be corrected.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus, 10 ... Adsorption nozzle (component adsorption part), Adsorption nozzle head 11, 20 ... Moving apparatus, 21 ... Base, 37 ... Conveyor belt, 52 ... Air cylinder, 53 ... Backup plate, 54 ... Backup pin, 60: Substrate positioning device according to one embodiment of the component mounting apparatus of the present invention 61: Conveyor 62: Conveyor rail 621: Clamper 63: First belt guide 631: Stopper 632: Guide hole 633: Clamper 634 ... Spring engaging portion, 64 ... Second belt guide, 641 ... Engaging protrusion, 100 ... Component supply force set, CL, C2, Cn ... Cassette, B ... Electronic circuit board, Ba ... Electronic circuit board B component Mounting surface, Bb: Non-component mounting surface of electronic circuit board B, Be: Side edge Be of electronic circuit board B, Bp: Side edge of electronic circuit board B, ... escape space

Claims (3)

Board clamping means for clamping both side portions inward from both side edges of the electronic circuit board with the component mounting surface facing upward, from the vertical direction of the electronic circuit board;
An external force applying means for applying an external force to warp the electronic circuit board downward from both sides to the upper edge of the electronic circuit board;
Board pressing means for pressing the inner part of the electronic circuit board from both sides of the electronic circuit board upward from the opposite surface of the component mounting surface;
A component mounting apparatus comprising: The component mounting apparatus according to claim 1,
The substrate clamping means comprises a pair of symmetrically disposed conveyor rails and a pair of first belt guides disposed inside the conveyor rail,
The both conveyor rails include a first clamper formed at each tip of the upper horizontal portion thereof,
Each of the first belt guides has a second clamper formed at an upper end of a vertical portion thereof and a vertical direction between the first belt guide and the external force applying means until at least the electronic circuit board receives a vertical pressing force. With a stopper arranged so that the relative position does not change,
The external force applying means is disposed symmetrically between the conveyor rail and the first belt guide, and includes a guide surface of the conveyor belt, and both side edges of the electronic circuit board are connected to the conveyor. When the electronic circuit board is clamped by the first clamper and the second clamper, the second belt guide disposed so as to be pressed by the pressing force to the component mounting surface side through the belt, An elastic member disposed between the first belt guide and the second belt guide so as to press both side edges of the electronic circuit board with the pressing force by the second belt guide via the conveyor belt; With
Component mounting device . The board clamping means clamps both sides of the electronic circuit board inward from both side edges of the electronic circuit board with the component mounting surface facing upward, and both sides of the electronic circuit board are clamped by the external force applying means. An external force is applied to the part from the bottom to the top to cause the electronic circuit board to warp downward, and the board pressing means causes the inner side of the side parts of the electronic circuit board to be opposite to the component mounting surface. After the plane accuracy of the electronic circuit board is obtained by pressing upward from the surface, the component is mounted on the component mounting surface of the electronic circuit board.
Component mounting method .

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