JP4427565B2 - 半田付け可能な弾性電気接触端子 - Google Patents
半田付け可能な弾性電気接触端子 Download PDFInfo
- Publication number
- JP4427565B2 JP4427565B2 JP2007171385A JP2007171385A JP4427565B2 JP 4427565 B2 JP4427565 B2 JP 4427565B2 JP 2007171385 A JP2007171385 A JP 2007171385A JP 2007171385 A JP2007171385 A JP 2007171385A JP 4427565 B2 JP4427565 B2 JP 4427565B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- coating layer
- foamed rubber
- electrical contact
- contact terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011247 coating layer Substances 0.000 claims description 49
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 238000010073 coating (rubber) Methods 0.000 claims description 42
- 239000010410 layer Substances 0.000 claims description 40
- 229920006254 polymer film Polymers 0.000 claims description 34
- 229920001971 elastomer Polymers 0.000 claims description 28
- 229920002379 silicone rubber Polymers 0.000 claims description 24
- 229920001821 foam rubber Polymers 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 2
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
Claims (9)
- 一定の体積を有する絶縁発泡ゴムと、
前記絶縁発泡ゴムを囲んで接着される絶縁非発泡ゴムコーティング層と、
一側面は前記絶縁非発泡ゴムコーティング層を囲むように前記絶縁非発泡ゴムコーティング層に接着され、他側面は金属層が一体に形成された耐熱ポリマーフィルムを含むことを特徴とする半田付け可能な弾性電気接触端子。 - 前記絶縁発泡ゴムは、シリコンゴムであることを特徴とする請求項1に記載の半田付け可能な弾性電気接触端子。
- 前記絶縁非発泡ゴムコーティング層は、液状のシリコンゴムが前記絶縁発泡ゴムと前記耐熱ポリマーフィルムとの間に介在された状態で硬化されて形成されることを特徴とする請求項1に記載の半田付け可能な弾性電気接触端子。
- 前記他側面に金属層が形成された耐熱ポリマーフィルムは、軟性銅箔積層フィルム(FCCL)であることを特徴とする請求項1に記載の半田付け可能な弾性電気接触端子。
- 前記耐熱ポリマーフィルムの材質は、ポリイミドであることを特徴とする請求項1または4に記載の半田付け可能な弾性電気接触端子。
- 前記金属層に表面実装によるリフロー半田付けが可能なことを特徴とする請求項1に記載の半田付け可能な弾性電気接触端子。
- 一定の体積を有する絶縁発泡ゴムと、
前記絶縁発泡ゴムを囲んで接着される絶縁非発泡ゴムコーティング層と、
一側面は前記絶縁非発泡ゴムコーティング層を囲むように前記絶縁非発泡ゴムコーティング層に接着され、他側面は金属層が一体に形成された耐熱ポリマーフィルムを含み、
前記絶縁非発泡ゴムコーティング層と耐熱ポリマーフィルムは、前記絶縁発泡ゴムの周りを囲むが、境界をなす端部には、一定間隔の不連続部分が形成され、前記不連続部分とこれに隣接する前記金属層上に電気伝導性非発泡ゴムコーティング層が形成されることを特徴とする半田付け可能な弾性電気接触端子。 - 前記電気伝導性非発泡ゴムコーティング層は、半田付けされる部分を除き、前記絶縁発泡ゴムの全周に形成されることを特徴とする請求項7に記載の半田付け可能な弾性電気接触端子。
- 一定の体積を有する絶縁発泡ゴムと、
前記絶縁発泡ゴムを囲んで接着される絶縁非発泡ゴムコーティング層と、
一側面は前記絶縁非発泡ゴムコーティング層を囲むように前記絶縁非発泡ゴムコーティング層に接着され、他側面は金属層が一体に形成された耐熱ポリマーフィルムを含み、
前記絶縁非発泡ゴムコーティング層と耐熱ポリマーフィルムは、前記絶縁発泡ゴムの周りを囲むが、境界をなす端部が位置する面の反対面に電気伝導性非発泡ゴムコーティング層が形成され、前記端部が位置する面は、半田付けされることを特徴とする半田付け可能な弾性電気接触端子。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020060017982U KR200428000Y1 (ko) | 2006-07-03 | 2006-07-03 | 솔더링 가능한 탄성 전기 접촉단자 |
| KR2020070004534U KR200442294Y1 (ko) | 2007-03-20 | 2007-03-20 | 솔더링 가능한 탄성 전기접촉단자 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008014942A JP2008014942A (ja) | 2008-01-24 |
| JP4427565B2 true JP4427565B2 (ja) | 2010-03-10 |
Family
ID=39072073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007171385A Expired - Fee Related JP4427565B2 (ja) | 2006-07-03 | 2007-06-29 | 半田付け可能な弾性電気接触端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4427565B2 (ja) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY147054A (en) * | 2008-03-07 | 2012-10-15 | Joinset Co Ltd | Solderable elastic electric contact terminal |
| KR101001354B1 (ko) | 2008-07-01 | 2010-12-14 | 조인셋 주식회사 | 리플로우 솔더링이 가능한 탄성 전기접촉단자 |
| KR101047057B1 (ko) * | 2008-04-11 | 2011-07-06 | 두성산업 주식회사 | 도전 기재층을 구비하는 도전성 접촉 단자 및 그 제조 방법 |
| KR101046765B1 (ko) * | 2009-01-09 | 2011-07-06 | 조인셋 주식회사 | 솔더링 가능한 탄성 전기접촉단자 |
| KR100993253B1 (ko) * | 2010-04-28 | 2010-11-10 | 김선기 | 탄성 전기접촉단자 |
| KR101466589B1 (ko) * | 2014-01-24 | 2014-12-01 | 조인셋 주식회사 | 전도성 탄성부재 |
| KR101711016B1 (ko) * | 2015-03-23 | 2017-02-28 | 조인셋 주식회사 | 내 환경성이 향상된 탄성 전기접촉단자 및 그 제조 방법 |
| KR101711013B1 (ko) * | 2015-05-15 | 2017-03-13 | 조인셋 주식회사 | 작은 사이즈에 적합한 탄성 전기접촉단자 |
| JP7132602B2 (ja) * | 2018-07-30 | 2022-09-07 | 日本圧着端子製造株式会社 | シールド電線と端子金具との接続構造 |
| CN111200195B (zh) * | 2018-11-20 | 2021-06-18 | 卓英社有限公司 | 弹性电接触端子 |
| CN114976683B (zh) * | 2021-02-26 | 2023-10-20 | 华为技术有限公司 | 电连接件及设备 |
| CN115882256A (zh) * | 2021-09-29 | 2023-03-31 | 华为技术有限公司 | 电连接件及电子设备 |
| KR102900009B1 (ko) * | 2025-02-24 | 2025-12-15 | (주) 메가테크 | 솔더링이 가능한 표면 실장용 전기 접촉 단자 |
-
2007
- 2007-06-29 JP JP2007171385A patent/JP4427565B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008014942A (ja) | 2008-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4427565B2 (ja) | 半田付け可能な弾性電気接触端子 | |
| US7771213B2 (en) | Solderable electric contact terminal | |
| CN102237582B (zh) | 弹性电接触端子 | |
| JP4733752B2 (ja) | 半田付け可能な弾性電気接触端子 | |
| KR100783588B1 (ko) | 솔더링 가능한 탄성 전기접촉단자 | |
| KR100892720B1 (ko) | 솔더링이 가능한 탄성 전기접촉단자 | |
| CN101719418B (zh) | 陶瓷芯片组件及其制造方法 | |
| KR101001354B1 (ko) | 리플로우 솔더링이 가능한 탄성 전기접촉단자 | |
| KR200442294Y1 (ko) | 솔더링 가능한 탄성 전기접촉단자 | |
| KR101025792B1 (ko) | 솔더링이 가능한 탄성 전기접촉단자 | |
| KR101562938B1 (ko) | 전기접촉단자 | |
| KR101018735B1 (ko) | 솔더링이 가능한 탄성 전기접촉단자 | |
| KR101046765B1 (ko) | 솔더링 가능한 탄성 전기접촉단자 | |
| KR101001355B1 (ko) | 표면 실장용 탄성 전기접촉단자 | |
| KR100920469B1 (ko) | 도전성 탄성블럭 | |
| KR101400029B1 (ko) | 탄성 부재 및 탄성고무 개스킷 | |
| KR101314555B1 (ko) | 표면실장이 가능한 탄성 접촉단자 및 그 제조방법 | |
| KR101318945B1 (ko) | 솔더링이 가능한 탄성 전기접촉단자 | |
| KR101804882B1 (ko) | 솔더링이 가능한 탄성 전기접촉단자 | |
| KR100907523B1 (ko) | 솔더링이 가능한 전기적 접속부재 | |
| KR101867338B1 (ko) | 탄성 전기접촉단자 | |
| JPS5926614Y2 (ja) | 印刷配線板 | |
| JPH0935902A (ja) | 絶縁基板用端子及びその接続方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20071003 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20071203 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20071203 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20071217 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20071203 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090903 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090908 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091022 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091110 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091116 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091208 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091214 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4427565 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121218 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121218 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151218 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |