JP4338335B2 - Vacuum deposition equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vacuum evaporation apparatus used for forming a thin film.
[0002]
[Prior art]
Thin film laminated devices such as transistors formed by laminating thin films of metal, semiconductor, or insulator are used in many electrical products. Various thin film forming methods such as a vacuum evaporation method and a sputtering method are used for forming a thin film constituting these thin film stacked devices. The thin film to be formed is set in a shape necessary for a device or circuit wiring by patterning such as a mask method or a photolithography method.
[0003]
Among thin-film stacked devices, organic electroluminescence elements (hereinafter referred to as organic EL elements) using organic electroluminescence are self-luminous elements, and display devices using them are highly visible. Because of its low power consumption, it is expected as a next-generation display device. An organic EL element has a positive electrode layer, a light emitting layer containing an organic light emitting material (hereinafter referred to as an organic light emitting layer), and a functional layer including a negative electrode layer formed on a substrate. The order of forming the thin film of each layer may be reverse to the above order. Then, holes are injected from the positive electrode layer, electrons are injected from the negative electrode layer, and the organic light emitting layer is recombined to generate excitons (excitons). The device emits light by emitting light (fluorescence, phosphorescence) when the exciton is deactivated. If necessary, a hole transport layer is provided between the light emitting layer and the positive electrode layer, and an electron transport layer is provided between the light emitting layer and the negative electrode layer, or both.
In such a thin film laminated device containing an organic substance, a vacuum deposition method is often used for forming a thin film, and a mask method is often used for setting the shape of the thin film.
[0004]
The vacuum evaporation method is a method of forming a thin film by evaporating an evaporation source (metal, semiconductor, insulator, etc.) at a high temperature and attaching it to the surface of a substrate. In manufacturing a semiconductor device, a sputtering method is often used for forming a thin film. However, when a thin film containing an organic substance is formed by a sputtering method, high-energy molecules collide with the thin film that is being formed, so that the film is damaged. Therefore, a thin film (organic light emitting layer, hole transport layer, electron transport layer) containing an organic substance constituting the organic EL element is generally formed by a vacuum deposition method or a spin coating method. Among these, the vacuum deposition method is a preferable method for forming a thin film because impurities are hardly mixed in the thin film.
[0005]
In the mask method, a mask made of a thin metal plate or the like provided with openings in the shape of a required thin film is used. In patterning by a mask method, a mask is brought into close contact with a substrate, and a thin film is formed thereon. The mask defines a deposition area on the substrate surface. Next, by removing the mask, the film formed on the mask is removed, and the shape of the thin film (evaporation pattern) is set. A thin film containing an organic substance is weak against chemicals such as an organic solvent, an acid, and an alkali, and is difficult to be patterned by a photolithography method widely used in manufacturing a semiconductor device. Accordingly, the shape of the thin film constituting the organic EL element is generally set by a mask method. In this mask method, if the mask and the substrate are not sufficiently adhered at the time of film formation, molecules of the vapor deposition material (evaporation source) enter between the mask and the substrate, making it difficult to set the fine shape of the thin film. . In particular, when an organic EL element is applied to a light emitting display device, it is necessary to reduce the pixel size (the size of the organic EL element) in order to obtain excellent display quality. It becomes important.
[0006]
An apparatus for forming a thin film by a vacuum deposition method is called a vacuum deposition apparatus. FIG. 1 is a layout diagram schematically showing a configuration of an example of a general vacuum deposition apparatus. The vacuum evaporation apparatus is configured by arranging an evaporation source container 2 and a substrate holder 3 inside a vacuum container 1 connected to a vacuum system. The evaporation source 4 is accommodated in the evaporation source container 2. The substrate holder 3 is attached with a substrate 5 on which a thin film is formed and a mask 6 that defines a vapor deposition region. A vacuum system including a vacuum pump 7 and an exhaust valve 8 used for decompressing the inside of the vacuum container is connected to the vacuum container 1. A heating power source 9 is connected to the evaporation source container 2.
[0007]
As shown in FIG. 1, in a general vacuum deposition apparatus, the evaporation source container 2 is disposed below (in the direction of gravity) inside the vacuum container, and the substrate holder 3 is disposed above inside the vacuum container. This is because when the evaporation source container is placed on the upper side and the substrate holder is placed on the lower side, the vapor deposition material (solid) before evaporation or the vaporized material that has been heated and dropped from the evaporation source container falls onto the substrate surface. This is because it becomes difficult to form a uniform thin film.
[0008]
In forming the thin film and setting the shape of the thin film, first, the evaporation source 4 is accommodated in the evaporation source container 2, and the substrate 5 to which the thin film is attached is fixed to the substrate folder 3. Further, in order to set the shape of the thin film by the mask method, the mask 6 provided with the opening in the shape of the necessary thin film is adhered and fixed on the substrate 5. Then, after the inside of the vacuum vessel 1 is depressurized by the vacuum pump 7 to be in a vacuum state, the evaporation source 4 accommodated in the evaporation source vessel 2 is heated. The molecules evaporated by heating fly inside the vacuum vessel 1 in the direction of the substrate 5 (from the bottom to the top in the general vacuum deposition apparatus shown in FIG. 1), and adhere to the surface of the substrate 5 (deposition). ) To form a thin film. Conventionally, an organic EL element has also been produced by a vacuum deposition apparatus having such a configuration.
[0009]
[Problems to be solved by the invention]
As described above, in forming each layer of the organic EL element, it is common to use a vacuum deposition method for forming a thin film and a mask method for setting the shape of the thin film. However, as schematically shown in FIG. 1, when the substrate 5 and the mask 6 are attached to the substrate folder 3 of the conventional vacuum evaporation apparatus, a slight gap is formed between the substrate 5 and the mask 6 due to the weight of the mask 6. May occur. If a thin film is formed in this state, molecules of the vapor deposition material enter the gap between the substrate 5 and the mask 6, and the thin film is formed slightly larger than the required shape. Also, if a flexible substrate such as a large-sized substrate or a plastic film is used, the substrate will also bend due to the weight of the substrate, and further, due to the deflection due to the weight of the mask, the adhesion between the substrate and the mask will further deteriorate. It is in.
[0010]
In the manufacture of organic EL elements so far, the adhesion between the substrate and the mask has not been a problem. However, in recent years, as represented by a display device used in a mobile phone, it is desired that the display device has high image quality and low price. In order to obtain a high quality display device, it is necessary to reduce the pixel size, that is, the size of the organic EL element. In order to reduce the size of the organic EL element, it is necessary to set the shape of the thin film of each layer of the organic EL element with higher accuracy than before, and the adhesion between the substrate and the mask becomes a problem. In order to reduce the cost of the display device, it is necessary to produce a plurality of display devices on the same large substrate to increase production efficiency. When a large substrate is used, the amount of deflection of the substrate and the mask increases, and the adhesion between the substrate and the mask becomes a problem. Even when the screen size of the display device is increased, since it is necessary to use a large substrate and a mask, the adhesion between the substrate and the mask also becomes a problem. Moreover, it is preferable that the thickness of the mask used for vapor deposition is thin. This is because if the mask is thick, molecules of the vapor deposition material evaporated from the evaporation source container are less likely to adhere to the substrate surface that is shaded at the edge of the opening of the mask. A thin mask has a small rigidity and thus is likely to bend. Similarly, the adhesion between the substrate and the mask becomes a problem.
An object of the present invention is to provide a vacuum vapor deposition apparatus capable of obtaining excellent adhesion between a substrate and a mask and accurately setting the shape of a thin film.
[0011]
[Means for Solving the Problems]
The inventor has found that a vacuum deposition apparatus having excellent adhesion between the substrate and the mask can be provided by devising the arrangement of the evaporation source container and the substrate holder disposed inside the vacuum container of the vacuum deposition apparatus.
According to the present invention, an evaporation source container and a substrate holder face each other along a horizontal direction inside a vacuum container connected to a vacuum system, and the surface of the substrate holder facing the evaporation source container faces upward. In a vacuum deposition apparatus for manufacturing an organic electroluminescence element, a positive electrode layer, a light emitting layer containing an organic light emitting material, and a functional layer containing a negative electrode layer are formed on a substrate .
The preferable aspect of the vacuum evaporation system of this invention is described below .
( 1 ) Means for holding a mask for defining a vapor deposition region is provided on the surface of the substrate holder facing the evaporation source container.
( 2 ) The mask is a mask having a plurality of openings of the same shape on its surface.
( 3 ) The evaporation source container has an opening on the side surface of the container.
[0012]
The present invention is also a composite formed by connecting a plurality of the above-described vacuum deposition apparatuses of the present invention via a transfer chamber, and a substrate moving means for inserting and then removing the substrate into a desired vacuum deposition apparatus includes the transfer. There is also a composite vacuum evaporation system attached indoors .
[0013]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 2 is a layout diagram schematically showing the configuration of an example of the vacuum vapor deposition apparatus of the present invention. In the vacuum evaporation apparatus of the present invention, the evaporation source container 22 and the substrate holder 23 are opposed to each other along the horizontal direction inside the vacuum container 21 connected to a vacuum system, and the evaporation source container 22 of the substrate holder 23 is used. The surface on the side facing to is arranged so as to be inclined upward. The vacuum system includes a vacuum pump 27 for depressurizing the inside of the vacuum vessel 21 to a vacuum state, an exhaust valve 28 disposed between the vacuum pump 27 and the vacuum vessel 21, and the like. In order to heat the evaporation source container 22, a heating power source 29 is connected to the evaporation source container. The surface of the substrate holder 23 on the side facing the evaporation source container 22 is inclined upward (inclination angle θ is entered in FIG. 2) with respect to the gravitational direction g. The surface of the substrate holder 23 facing the evaporation source container 22 is preferably inclined at an angle of 30 degrees or less so that the surface faces upward with respect to the direction of gravity g. More preferably, it is inclined at an angle of.
[0014]
When forming a thin film and setting the shape of the thin film by the vacuum vapor deposition apparatus of the present invention, the evaporation source 24 accommodates the evaporation source 24. A substrate 25 to which a thin film is attached is disposed in the substrate folder 23, and a mask 26 that defines a vapor deposition region is disposed on the substrate 25. As described above, the surface of the substrate holder 23 on the side facing the evaporation source container 22 is inclined upward with respect to the gravitational direction g. For this reason, the force due to the weight of the mask 26 (or the substrate) acts in the direction in which the substrate 25 and the mask 26 are brought into close contact (the normal direction of the surface of the substrate holder) and the direction along the surface of the substrate holder 23. Thus, the force in any direction does not work in the direction in which the substrate and the mask are bent, but works to improve the adhesion between them. Therefore, even when a large substrate or mask is used, or when a flexible substrate is used, excellent adhesion between the substrate and the mask can be obtained. Accordingly, the vacuum vessel 21 is evacuated by the vacuum pump 27 to be in a vacuum state, the evaporation source 24 is heated to form a thin film from the top of the mask 26, and then the mask 26 is removed, whereby the film formed on the mask. Is removed, and a vapor deposition pattern having excellent dimensional accuracy corresponding to the mask can be formed.
[0015]
By improving the adhesion between the substrate and the mask in this way, when a large number of organic EL elements are arranged on a large substrate or when a large number of organic EL light emitting display devices in which organic EL elements are integrated are arranged, The uniform characteristics of the organic EL element can be obtained regardless of the manufacturing position. In order to simultaneously produce a large number of organic EL elements on such a large substrate, it is preferable to use a mask having a plurality of openings of the same shape on the surface. By using such a mask, a large number of organic EL elements having uniform characteristics can be simultaneously formed on the substrate.
Hereinafter, the components of the vacuum deposition apparatus of the present invention will be briefly described.
[0016]
There is no particular limitation on the structure of the evaporation source container and the material constituting the evaporation source container, and a known evaporation source can be used. Examples of the evaporation source include a resistance heating evaporation source, an external heating type crucible evaporation source, a radiation heating evaporation source, a high frequency induction heating evaporation source, an electron impact and an electron beam evaporation source, and the like. In order to evaporate the vapor deposition material containing organic matter, it is preferable to use a resistance heating evaporation source and an external heating crucible evaporation source as the evaporation source container. Resistance heating evaporation sources include filament type, multi-loop type, wire basket type, and boat type evaporation sources. As the boat-type evaporation source, it is preferable to use an evaporation source container in which a boat-type evaporation source is provided with a lid. Generally, molybdenum, tantalum, tungsten, or the like is used as a boat material. The crucible (evaporation source container) of the external heat type crucible evaporation source is generally formed of ceramics.
[0017]
Examples of preferred configurations of the evaporation source container are shown in the sectional views of FIGS. The evaporation source container shown in FIG. 3 is a boat with a lid in which a boat 41 is provided with a lid 41. A heating power source 42 is connected to the evaporation source container. An evaporation source 43 is accommodated inside the evaporation source container. The evaporation source container is not limited to the shape of the evaporation source container shown in FIG. 3, and may be in a desired shape depending on the size of the vapor deposition material, workability at the time of accommodation, and the like. The evaporation source container shown in FIG. 4 is another example of a resistance heating evaporation source. The evaporation source container shown in FIG. 5 is an example of an externally heated crucible evaporation source.
[0018]
In the vacuum vapor deposition apparatus of the present invention, vapor deposition is performed in a direction in which the evaporation source container and the substrate holder face each other. Therefore, the evaporation source container preferably has an opening on the side surface of the container. In general, the relative position of the evaporation source container with respect to the substrate holder is often finely adjusted in consideration of the film thickness distribution of the thin film actually formed on the substrate. Accordingly, FIG. 2 shows a preferred arrangement of the evaporation source containers, but the position can be further finely adjusted.
[0019]
There is no restriction | limiting in particular in the structure of a substrate holder, and the material which comprises a substrate holder, A well-known substrate holder can be used. The substrate holder is disposed such that the surface of the substrate holder facing the evaporation source container is inclined upward with respect to the direction of gravity. The substrate holder can also be rotated with the normal direction of the surface of the substrate holder as the central axis so that the film thickness distribution of the thin film to be formed is uniform. In this case, it is also preferable to shift the position where the evaporation source container is disposed from the central axis of rotation. The substrate holder is provided with means for holding the substrate and the mask. The holding means may be a known method, and simple means for holding the substrate or mask on the substrate holder using screws or double-sided adhesive tape may be used, or the clamp for holding the substrate or mask is driven automatically. You may use the means hold | maintained. Further, the substrate or mask may be attached to a frame-shaped fixture in advance, and the substrate or mask may be held by fixing the fixture and the substrate holder.
[0020]
The manufacturing process of the organic EL element will be described below by taking as an example the case of using the vacuum vapor deposition apparatus of the present invention shown in FIG. For the sake of explanation, the case where two organic EL elements each consisting of three layers (a positive electrode layer, an organic light emitting layer, and a negative electrode layer) are formed on the same substrate will be described. The material and film thickness of each layer of the organic EL element are well known and described in many documents.
(Positive electrode layer)
Although the positive electrode layer can be formed on the substrate using the vacuum vapor deposition apparatus of the present invention, a substrate with an electrode layer (hereinafter referred to as an electrode substrate) provided with the positive electrode layer in advance is often used. . FIG. 6 is a plan view schematically showing the configuration of an example of the electrode substrate. In the electrode substrate shown in FIG. 6, two positive electrode layers 50 and 51 are provided on a substrate 52. The positive electrode layer is formed by a sputtering method and a photolithography method in the same manner as a normal semiconductor device. Examples of the substrate include a glass plate and a plastic plate. As a material for the positive electrode layer, a metal such as gold or an electrically conductive transparent material such as CuI, ITO (indium tin oxide), SnO ₂ , ZnO or the like is generally used. Although the thickness of the positive electrode layer depends on the material, it is usually in the range of 10 nm to 1 μm, preferably 50 to 200 nm.
[0021]
(Formation of organic light emitting layer)
The electrode substrate is fixed to a frame-shaped fixture 30 called a susceptor, and the mask provided with an opening in the shape of a light emitting layer is fixed to a frame-shaped fixture 31 called a mask holder. FIG. 7 shows a plan view of a mask (organic light emitting layer mask) 47 to be used. Further, the mask shown in FIG. 7 is provided with two openings 48 and 49 having the same shape (the shape of the organic light emitting layer). Then, the susceptor 30 to which the substrate is fixed is fixed to the substrate holder 23 of the vacuum evaporation apparatus with screws. Further, a mask holder 31 having a mask 47 fixed thereon is arranged on the substrate, and the mask holder 31 is similarly fixed to the substrate holder 23 with screws. Next, the organic light emitting material (evaporation source) 24 is accommodated in the evaporation source container 22. Then, the inside of the vacuum vessel is evacuated by the vacuum pump 27, the evaporation source 24 accommodated in the evaporation source vessel 22 is evaporated by the heating power source 29, and an organic light emitting layer is formed on the mask. At this time, the mask attached to the substrate holder 23 is sufficiently in close contact with the substrate because the surface of the substrate holder is inclined with respect to the direction of gravity. And the vapor deposition pattern of the organic light emitting layer corresponding to a mask is formed by removing a mask from a board | substrate. FIG. 8 shows a plan view of the electrode substrate on which the organic light emitting layer is formed. In FIG. 8, organic light emitting layers 53 and 54 are formed as vapor deposition patterns corresponding to the mask 47.
[0022]
Examples of organic light-emitting materials include electron-transporting light-emitting materials (Table III.2.32) described in “Photoelectronic Functional Organic Material Handbook (second printing), published by Asakura Shoten”, pages 396-398, 398- The hole-transporting light-emitting material described in page 399 (Table III 2.33), the light-emitting material in the three-layer structure element described in pages 399-400, and the pages 403-404 A light emitting material (Table III.2.36) of a single layer type element can be used. In addition, a fluorescent dye can be doped into the organic material in order to adjust the emission color. In order to obtain practical luminous efficiency, the thickness of the organic light emitting layer is preferably in the range of 10 to 200 nm.
[0023]
(Formation of negative electrode layer)
On the electrode substrate on which the organic light emitting layers 53 and 54 are formed, the negative electrode layer is formed in the same manner as the formation of the organic light emitting layer except that a mask having an opening in the shape of the negative electrode layer is used. . As the material of the negative electrode layer, Na, K, Mg, Li, In, rare earth metal, Na · K alloy, Mg · Ag alloy, Mg · Cu alloy, Al·Li alloy, Al / Al ₂ O ₃ mixture are generally used. Used. Although the thickness of the negative electrode layer depends on the material, it is usually in the range of 10 nm to 1 μm, preferably 50 to 200 nm.
FIG. 9 shows a plan view of the organic EL light-emitting device manufactured as described above. In FIG. 9, the organic EL element 56 applies a voltage between the positive electrode layer 50 and the negative electrode layer 55, and the organic EL element applies a voltage between the positive electrode layer 51 and the negative electrode layer 55. The element 57 emits light. In order to produce an organic EL light emitting display device, a large number of organic EL elements may be produced on a substrate in the same manner. The negative electrode layer is preferably formed using the vacuum vapor deposition apparatus of the present invention so as not to damage the organic light emitting layer during the formation of the negative electrode layer.
[0024]
Next, a description will be given of a composite vacuum deposition apparatus that can efficiently manufacture an organic EL element to which the vacuum deposition apparatus of the present invention is applied. FIG. 10 is a plan view schematically showing the configuration of an example of the composite vacuum deposition apparatus of the present invention. The composite vacuum deposition apparatus is a composite body in which a plurality of the vacuum deposition apparatuses of the present invention are connected via a transfer chamber, and a substrate moving means for inserting and then removing the substrate into the desired vacuum deposition apparatus is provided in the transfer chamber. Is attached. In the composite vacuum vapor deposition apparatus shown in FIG. 10, five vacuum vapor deposition apparatuses (vacuum vapor deposition apparatuses 61 to 65) of the present invention are connected via the transfer chamber 58.
[0025]
The transfer chamber 58 is provided with transfer means 59 for inserting a substrate (or mask) for producing an organic EL element into a desired vacuum deposition apparatus and taking out the substrate (or mask) after the thin film is formed. In addition, a preparation chamber 66 for inserting and removing the substrate from the composite vacuum deposition apparatus is connected to the transfer chamber 58. The respective vacuum deposition apparatuses 61 to 65, the preparation chamber 66, and the transfer chamber 58 can independently adjust the degree of vacuum (by the gate valves 71 to 76). Therefore, each vacuum vapor deposition apparatus can independently perform vapor deposition by adjusting the degree of vacuum, and another substrate or mask can be prepared in the preparation chamber 66 during vapor deposition. The substrate holders 81 to 85 and the evaporation source containers 91 to 95 are arranged inside the vacuum container of the vacuum deposition apparatus, respectively. Each of the substrate holders 81 to 85 is disposed in a state where the surface on the side facing the evaporation source container is inclined upward. A dedicated vacuum system may be connected to each deposition chamber, transfer chamber, and preparation chamber, or one vacuum system may be connected to each deposition chamber via an exhaust valve.
[0026]
The production of the organic EL element by the composite vacuum vapor deposition apparatus may be performed in the same manner as the production of the organic EL element by the vacuum vapor deposition apparatus of the present invention. For example, in the vacuum evaporation apparatus 61, an electrode substrate provided with a positive electrode layer is attached to the substrate holder 81, and a mask for an organic light emitting layer is disposed on the electrode substrate. Then, the organic light emitting material (evaporation source) accommodated in the evaporation source container 91 is evaporated to form a vapor deposition pattern (organic light emitting layer). The mask and the substrate are removed from the substrate holder 81 by the transport means 59. The substrate provided with the light emitting layer is inserted into the vacuum vapor deposition apparatus 62 by the transport means 59 and placed on the substrate holder 82, and a mask for the negative electrode layer is placed thereon, and the vapor deposition pattern (negative electrode layer) is similarly formed. By forming, an organic EL element can be produced. The mask removed by the transport means 59 may be inserted into the preparation chamber 66 and stored.
[0027]
An organic EL element is formed by forming a positive electrode layer, an organic light emitting layer, and a functional layer including a negative electrode layer on a substrate. Since the thin film (vapor deposition pattern) constituting each layer of the organic EL element can be formed with high dimensional accuracy by using the vacuum vapor deposition apparatus of the present invention, even when a plurality of layers of the organic EL element are sequentially formed and laminated. The entire organic EL element can be manufactured with high dimensional accuracy. In addition, by using the composite vacuum deposition apparatus of the present invention, the entire organic EL element (from the positive electrode layer to the negative electrode layer) can be produced while maintaining a vacuum state, so that moisture, impurities, etc. in the atmosphere are adsorbed. An organic EL element can be manufactured without doing so.
[0028]
【The invention's effect】
By using the vacuum deposition apparatus of the present invention, the adhesion between the substrate and the mask during patterning by the mask method is improved, and the shape of the thin film can be set with high accuracy. Vacuum vapor deposition apparatus of the present invention is used for the production of organic EL elements. By using the vacuum vapor deposition apparatus of the present invention, excellent adhesion between the substrate and the mask can be obtained even when a large-sized substrate and mask are used, and the thin film can be set in an accurate shape.
[Brief description of the drawings]
FIG. 1 is a layout diagram schematically showing the configuration of an example of a conventional vacuum vapor deposition apparatus.
FIG. 2 is a layout view schematically showing the configuration of an example of a vacuum vapor deposition apparatus of the present invention.
FIG. 3 is a diagram showing a configuration of an example of an evaporation source container.
FIG. 4 is a view showing another example of an evaporation source container.
FIG. 5 is a view showing still another example of the evaporation source container.
FIG. 6 is a plan view schematically showing a configuration of an electrode substrate.
FIG. 7 is a plan view schematically showing a mask for an organic light emitting layer.
FIG. 8 is a plan view schematically showing a configuration of an electrode substrate on which an organic light emitting layer is formed.
FIG. 9 is a plan view showing a configuration of an example of an organic EL element.
FIG. 10 is a plan view schematically showing the configuration of the composite vacuum deposition apparatus of the present invention.
[Explanation of symbols]
1, 21 Vacuum container 2, 22 Evaporation source container 3, 23 Substrate folder 4, 24 Evaporation source 5, 25 Substrate 6, 26 Mask 7, 27 Vacuum pump 8, 28 Exhaust valve 9, 29 Heating power supply 10, 30 Susceptor 11, 31 Mask holder 40 Boat 41 Lid 42 Heating power source 43 Evaporation source 44 Heater 47 Mask 48, 49 Opening 50, 51 Positive electrode layer 52 Substrate 53, 54 Organic light emitting layer 55 Negative electrode layer 56, 57 Organic EL element 58 Transport chamber 59 Conveying means 61-65 Vacuum deposition apparatus 66 of the present invention Preparation chambers 71-76 Gate valves 81-85 Substrate holders 91-95 Evaporation source container g Gravity direction θ Inclination angle of substrate holder surface

Claims (5)

A state in which the evaporation source container and the substrate holder face each other along the horizontal direction inside the vacuum container connected to the vacuum system, and the surface of the substrate holder facing the evaporation source container is inclined upward A vacuum deposition apparatus for producing an organic electroluminescence device, wherein a positive electrode layer, a light emitting layer containing an organic light emitting material, and a functional layer containing a negative electrode layer are formed on a substrate . The vacuum deposition apparatus according to claim 1, wherein means for holding a mask for defining a deposition region is provided on a surface of the substrate holder facing the evaporation source container. The vacuum evaporation apparatus according to claim 2, wherein the mask is a mask having a plurality of openings having the same shape on the surface. The vacuum evaporation apparatus according to any one of claims 1 to 3, wherein the evaporation source container has an opening on a side surface of the container. A composite body comprising a plurality of vacuum deposition apparatuses according to claim 1 connected via a transfer chamber, wherein a substrate moving means for inserting and then removing the substrate into a desired vacuum deposition apparatus is provided in the transfer chamber. Combined vacuum deposition equipment.

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