JP4386693B2 - Ledランプおよびランプユニット - Google Patents
Ledランプおよびランプユニット Download PDFInfo
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- JP4386693B2 JP4386693B2 JP2003316714A JP2003316714A JP4386693B2 JP 4386693 B2 JP4386693 B2 JP 4386693B2 JP 2003316714 A JP2003316714 A JP 2003316714A JP 2003316714 A JP2003316714 A JP 2003316714A JP 4386693 B2 JP4386693 B2 JP 4386693B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
図1は、本実施形態にかかるLEDランプ100の構成を模式的に示している。LEDランプ100は、青色発光LED素子11と、赤色発光LED素子12と、青色発光LED素子11によって励起され発光する蛍光体13とを備えている。 青色発光LED素子11は、例えば、GaN系青色LEDチップであり、そして赤色発光LED素子12は、例えば、AlInGaP系、GaAsP系、または、GaAlAs系の赤色LEDチップである。本実施形態におけるGaN系青色LEDチップは、GaN系材料の発光層を有する青色発光LEDベアチップであり、赤色LEDチップは、AlInGaP系、GaAsP系、または、GaAlAs系材料の発光層を有する赤色発光LEDベアチップである。そのような材料からなる発光層が、LEDの発光部位となる。
YAG=(Y1-a,Gda)3(Al1-b,Gab)5O12:Ce
本実施形態では、青色LEDチップ11と、赤色LEDチップ12と、蛍光体13との好適な組み合わせについて説明する。上記実施形態1のLEDランプ100によれば、上述したように、赤色LEDチップ12により、従来のLED素子による白色発光において不足していた赤色発光スペクトルを導入できるため、色再現性の良いLEDランプを提供することができる。このLEDランプの色再現性を評価する上で問題となるのは、色再現性の評価方法である。以下、この問題を説明する。
図14から図18を参照しながら、本発明による実施形態3にかかるLEDランプの説明をする。上記実施形態1では、一つの青色LEDベアチップ11および一つの赤色LEDベアチップ12、合計2つのLEDベアチップから、LEDランプ100を構成したが、本実施形態では、青色LEDの発光部位と、赤色LEDの発光部位との両方を含む一つのLEDベアチップから、LEDランプを構成している。この点が、上記実施形態1のLEDランプ100と異なる。他の点においては、上記実施形態1と同様であるので、説明の簡略化のため実施形態1と同様の点の説明は省略または簡略化する。なお、LEDランプ100の最適化を図った上記実施形態2の構成は、本実施形態のLEDランプにも適用可能できることは言うまでもない。
図19を参照しながら、本発明による実施形態4にかかるLEDランプ500を説明する。図19は、LEDランプ500の構成を模式的に示している。上記実施形態1のLEDランプ100では一体素子構成されていたのに対して、本実施形態のLEDランプ500では、一体素子構成ではなくクラスタ構成されている点が異なる。以下においては説明を簡明にするため、実施形態1と異なる点を主に説明し、実施形態1と同様の点の説明は省略または簡略化する。
上記実施形態におけるLEDランプは、LEDランプに電力を供給する電力供給器と組み合わせてランプユニットにすることができる。図21は、本実施形態におけるランプユニット1000の構成を模式的に示している。
る。
11a 発光強度調節手段(可変抵抗)
12 赤色発光LED素子(赤色LEDランプ)
12a 発光強度調節手段(可変抵抗)
13 蛍光体(黄色発光蛍光体、緑色発光蛍光体)
14 リードフレーム
15 ボンディングワイヤ
16 透明樹脂部
17 台座
21 青色発光LED素子の発光スペクトル
22 黄色発光蛍光体の発光スペクトル
23 赤色発光LED素子の発光スペクトル
30 黒体放射軌跡
41 青色LEDチップの色度
42 黄色発光蛍光体の色度
43 青色LEDチップと黄色発光蛍光体とによる白色発光の色度
44 赤色LEDチップの色度
52、62 白色発光LED素子
54、64 赤色発光LED素子
100 LEDランプ
110 反射板
120 電力供給器
122 光色可変ダイヤル
124 明るさ可変ダイヤル
130 口金
500 LEDランプ
600 LEDランプ
1000 ランプユニット
Claims (9)
- 青色発光LED素子と、
赤色発光LED素子とのみを発光LED素子として備え、
さらに、前記青色発光LED素子によって励起される黄色発光蛍光体であって、前記青色発光LED素子が発光する青色の狭帯域の波長帯域と前記赤色発光LED素子が発光する赤色の狭帯域の波長帯域との間の波長帯域の発光強度をブロードに補う発光スペクトルを発光する黄色発光蛍光体と、
前記青色発光LED素子と前記赤色発光LED素子と前記黄色発光蛍光体とを一体として封止する樹脂部と
を備えるLEDランプであって、
前記青色発光LED素子の発光と前記赤色発光LED素子の発光と前記黄色発光蛍光体の発光によって相関色温度が5000Kまたは6700Kである前記LEDランプにおいて、前記青色発光LED素子のピーク波長は、460nmであり、前記赤色発光LED素子のピーク波長は、640nmであり、かつ、前記黄色発光蛍光体の発光ピーク波長は、545nmであるLEDランプ。 - 青色発光LED素子と、
赤色発光LED素子とのみを発光LED素子として備え、
さらに、前記青色発光LED素子によって励起される黄色発光蛍光体であって、前記青色発光LED素子が発光する青色の狭帯域の波長帯域と前記赤色発光LED素子が発光する赤色の狭帯域の波長帯域との間の波長帯域の発光強度をブロードに補う発光スペクトルを発光する黄色発光蛍光体と、
前記青色発光LED素子と前記赤色発光LED素子と前記黄色発光蛍光体とを一体として封止する樹脂部と
を備えるLEDランプであって、
前記青色発光LED素子の発光と前記赤色発光LED素子の発光と前記黄色発光蛍光体の発光によって相関色温度が3000Kである前記LEDランプにおいて、前記青色発光LED素子のピーク波長は460nmであり、前記赤色発光LED素子のピーク波長は、625nmであり、かつ、前記黄色発光蛍光体の発光ピーク波長は、545nmである、LEDランプ。 - 前記黄色発光蛍光体は、YAG蛍光体、またはMn発光中心を有する蛍光体である、請求項1または2に記載のLEDランプ。
- 前記赤色発光LED素子のピーク波長は、610nmから630nmの範囲内であって、
平均演色評価数であるR1からR8までで構成される色域面積比Gaよりも、特殊演色評価数であるR9からR12までで構成される色域面積比Ga4が高い、請求項3に記載のLEDランプ。 - 前記赤色発光LED素子の発光強度を調節する発光強度調節手段をさらに備えた請求項1から4の何れか一つに記載のLEDランプ。
- 前記発光強度調節手段は可変抵抗器である、請求項5に記載のLEDランプ。
- 前記青色発光LED素子の発光部位と、前記赤色発光LED素子の発光部位とが、一つのチップ内に設けられている、請求項1から6までのいずれか一つに記載のLEDランプ。
- 請求項1から7の何れか一つに記載のLEDランプと、前記LEDランプに電力を供給する電力供給器とを備えたランプユニット。
- 前記LEDランプから発する光を反射する反射板をさらに備えた請求項8に記載のランプユニット。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003316714A JP4386693B2 (ja) | 2000-05-31 | 2003-09-09 | Ledランプおよびランプユニット |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000161771 | 2000-05-31 | ||
| JP2003316714A JP4386693B2 (ja) | 2000-05-31 | 2003-09-09 | Ledランプおよびランプユニット |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001152783A Division JP2002057376A (ja) | 2000-05-31 | 2001-05-22 | Ledランプ |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007140253A Division JP2007214603A (ja) | 2000-05-31 | 2007-05-28 | Ledランプおよびランプユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004080046A JP2004080046A (ja) | 2004-03-11 |
| JP4386693B2 true JP4386693B2 (ja) | 2009-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003316714A Expired - Lifetime JP4386693B2 (ja) | 2000-05-31 | 2003-09-09 | Ledランプおよびランプユニット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4386693B2 (ja) |
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