JP4028225B2 - Method for decomposing halogenated organic compounds in solids - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention belongs to the field of methods for the decomposition of hazardous compounds in solid waste, in particular chemical decomposition of halogenated organic compounds.
[0002]
[Prior art]
A wide range of halogenated organic compounds have been identified as potentially dangerous to human health or the environment. The safe decomposition of those compounds in some wastes is made particularly difficult by the nature of the wastes, which can hinder the handling of hazardous compounds for processing purposes. The present invention relates to the treatment of various hazardous halogenated compounds in waste made of asphalt, a potting compound contaminated with polychlorinated biphenyl (PCB).
[0003]
PCBs are a group of highly stable halogenated organic compounds in which there are over 200 individual compounds (sometimes known as congeners identified by IUPAC numbers 1-209). PCB is a product of chlorination of a biphenyl structure, in which one or more of 10 hydrogen atoms of biphenyl are replaced with chlorine atoms.
[0004]
PCBs were often manufactured as a blended product, such as Aroclars ™ sold by Monsanto Chemical Company. PCBs are often used as an insulating fluid for electrical installations, for example, as a mixture with other halogenated organic compounds such as trichlorobenzene or tetrachlorobenzene (such mixtures are referred to by the trade name Ascarrels) . In various aspects, the present invention relates to a method for the degradation of such compounds and mixtures.
[0005]
PCBs are not easily degraded by natural processes. Its use has been banned for environmental reasons because of the potential danger to the environment and residents. PCBs do not biodegrade easily and will not disappear or corrode at all by some natural processes. Once it is produced, it can only be broken down by special and generally expensive procedures.
[0006]
PCBs have been used extensively as dielectric materials in electrical components such as transformers and capacitors because they are stable, conduct heat well, and are fire proof but good electrical insulators. Although further use of PCBs for such purposes is generally prohibited by regulations in most jurisdictions, large quantities of those chemicals are present in existing equipment or industrial waste, particularly in the electrical industry. Exists. In some jurisdictions, there is a tremendous amount of waste in a pile waiting for disposal that has been identified as being contaminated with PCBs.
[0007]
The time-consuming nature of organic halide disposal issues has led to a significant number of innovative methods such as PCBs and other as discussed in the following US patents, which are incorporated herein by reference: Reflected by the fact that it has been disclosed for many years for the treatment of organic halides. These patents include US Pat. No. 4,284,516 issued to Parker et al. On August 18, 1981, US Pat. No. 4,340,471 issued to Jordan on July 20, 1982, Brown In addition, US Pat. No. 4,377,471 issued on March 22, 1983, US Pat. No. 4,379,752 issued on April 12, 1983 to Norman, and April 1983 on Norman. U.S. Pat. No. 4,379,746 issued on 12th, U.S. Pat. No. 4,465,590 issued on Aug. 14, 1984 to Adams, issued on Jun. 3, 1986 to Rayman et al. U.S. Pat. No. 5,592,844, U.S. Pat. No. 4,636,309 issued to La Lancet et al. On Jan. 27, 1987, and Plancket issued on Jul. 14, 1998. And a U.S. Patent No. 5,779,813.
[0008]
Although PCBs can be decomposed by incineration, high temperature and controlled conditions are commonly used to avoid the generation of PCB pyrolysis by-products that can be significantly more toxic than PCBs such as polychlorinated dioxins and furans. As required. PCBs have also been treated by landfill, but the stability of these compounds creates problems with dealing with waste that does not decompose the compounds themselves.
[0009]
Capacitors containing PCBs were used in electrical installations such as fluorescent ballasts until it was prohibited by regulation. Many of these capacitors leak PCBs to the ballast during malfunction, thus contaminating ballast internal components such as potting materials. The potting material is typically a mixture of asphalt and sand (silica) that surrounds the electrical components in the ballast. The potting material can also include other ingredients such as waxes that improve properties such as the melting range of the potting material and the adhesive properties of the asphalt. Asphalt is primarily used to provide adhesion to sand that functions as an insulator and heat conductor. Some potting materials can be made of, for example, up to 35-50% silica, 50-65% asphalt and 0-10% wax for proper heat transfer.
[0010]
Disposal of used PCB-containing electrical components, such as capacitors and fluorescent ballast assemblies, is a relatively recent rule that stipulates the legal liability for their disposal, especially in the context of the waste products so disposed In the past few years, it has raised problems against commercial and other systems in terms of safety. Enabling decontamination of materials (metals, wires and windings, plastics, etc.), recycling and reuse, maintenance of parts and materials in used ballasts by refurbishing or recycling, or recovery of waste The accompanying problems have been largely ignored in terms of environmental issues.
[0011]
[Problems to be solved by the invention]
There is a long-standing need for another approach to decontamination of PCBs, particularly wastes containing halogenated organic compounds such as those that would be difficult to process. This is because it is composed of a complex cementitious mixture containing dangerous compounds. In such waste, the interaction of the hazardous compound with other compounds in the waste matrix may hinder the potential handling of the hazardous compound for processing.
[0012]
[Means for Solving the Problems]
In accordance with one aspect of the present invention, relatively mild conditions involving dissolving the compound in a solvent are used to substantially contaminate halogenated organic compounds such as PCBs in asphalt waste. It was discovered that it can be removed. In some embodiments, such methods can be made even more efficient by recycling the hydrocarbon solvent used in the methods of the invention. The processing conditions can be selected, for example, to avoid high temperatures that would otherwise lead to the generation of toxic thermal PCB degradation products or PCB evaporative dispersions. Accordingly, in one aspect, the present invention provides a method for the degradation of PCBs in asphalt waste, where the method can include the following steps A, B and C.
[0013]
A) Mixing an asphalt waste such as potting material containing a halogenated organic compound such as PCB with a solvent such as a hydrocarbon solvent to make a waste-solvent mixture. Waste, such as potting material, can encapsulate electrical components, for example, and electrical components can be treated with the waste in the method of the present invention. In some embodiments, for example, the potting material and the electrical component encased by the potting material are first separated, and the potting material and the electrical component can each be processed separately.
[0014]
B) Heating the waste-solvent mixture to the dissolution temperature over the dissolution time so that the asphaltic waste dissolves in the solvent and thus the halogenated organic compound such as PCB is liberated from the asphaltic waste Making a treated waste-solvent mixture. In some embodiments, a hydrocarbon solvent that facilitates dissolving asphaltic waste at a relatively mild temperature may be selected.
[0015]
C) To the heated waste-solvent mixture is added a destructive reactant such as an alkali metal (such as sodium) at the reaction temperature over the reaction time to form a treated waste-solvent mixture. Process. Halogenated organic compounds such as PCBs can react substantially all with alkali metal reactants to decompose PCBs in the treated waste-solvent mixture. For example, the alkali metal can be present in an alkali metal dispersion in an alkali metal solvent. In another embodiment, the method is (eg, US Pat. No. 5,185,488 to Hawari, European Patent EP0225849 to Bari et al., And Canadian Electrical Association Report 153D253, “Chemicals for Degrading Polychlorinated Biphenyls” Scale-up reaction ", as disclosed in Dominelli, N, and Pouf, DR, May 17, 1983), but not limited to hydrogen donors such as water, alcohols or acids or Addition of accelerators may be included. In another embodiment, a hydrolyzing reactant such as water is added to the treated waste-solvent mixture to hydrolyze excess alkali metal remaining in the treated waste-solvent mixture. Can be added.
[0016]
In some embodiments, the asphalt waste can be a solid asphalt waste having a specific melting temperature. Solid asphalt waste containing PCB, for example, at a grinding temperature below the melting temperature of solid asphalt waste, e.g., far below the melting temperature, making the asphalt material brittle and facilitating the destruction of the asphalt material Can be ground at temperature. In such embodiments, the ground waste can be converted to particulate waste having a relatively large surface area to enhance dissolution in the solvent.
[0017]
In some embodiments, the melting temperature, reaction temperature, and melting temperature can be adjusted, for example, below the boiling point of the halogenated organic compound, so that, for example, during the process of the present invention. Can help avoid evaporation loss of dangerous compounds such as PCBs.
[0018]
In one aspect, the treated waste-solvent mixture can be distilled to separate a solvent, such as a hydrocarbon solvent, from an asphaltic waste, for example, to create a recyclable hydrocarbon solvent. The distillation conditions can be adjusted, for example, such that there is substantially no asphalt in the recyclable solvent. The recyclable solvent can now be reused as a solvent in the process of mixing with asphalt waste to make a waste-solvent mixture.
[0019]
In various embodiments of the present invention, the asphalt waste is a waste in which the asphalt constitutes a substantial part, and for the purposes of the method of the present invention, the halogenated organic compound is an asphalt cementitious material. It may be included depending on the nature. According to a general understanding in the art, asphalt generally includes bitumen derived from residues in refining from natural sources such as petroleum, shale oil, coal tar and pitch. Asphalt is typically a mixture of hydrocarbons of natural and / or thermogenic origin, with its derivatives, often prepared by distillation of crude oil. As such, asphalt is a mixture of paraffinic and aromatic hydrocarbons and heterocyclic compounds containing sulfur, nitrogen and oxygen. Asphalt is a cementitious material having a solid or semi-solid consistency.
[0020]
Halogenated organic compounds that can be treated according to another aspect of the present invention include aromatic and non-aromatic halides (bromides, chlorides, fluorides and iodides). Representative halogenated organic compounds include PCBs and dioxins. In some embodiments, the present invention is limited to PCB degradation.
[0021]
In one aspect of the present invention, the step of crushing electrical components to form crushed pieces, the step of adding a solvent to the crushed pieces to form a mixture, and sufficient to dissolve the asphaltic material. Heating the mixture to a reaction temperature thereby releasing the hazardous compound from the material, and a compound such as an alkali metal dispersion for a time sufficient to reduce the amount of hazardous material in the waste mixture; A method is provided for decontamination of electrical components encased in an asphalt composition comprising reacting the mixture.
[0022]
In accordance with some aspects of the present invention, there is provided a method for decontamination of hazardous compounds such as halogenated organic compounds (including PCBs) found in lightning ballasts, where the light ballasts are It is composed of asphalt potting material and electrical parts. Such a method of the present invention is sufficient to dissolve, for example, a step of grinding a light stabilizer to form a crushed piece, a step of adding a solvent to the crushed piece to form a mixture, and a potting material. Heating the mixture to a reaction temperature that is, reacting the mixture with a reactant, such as an alkali metal dispersion, for a time sufficient to reduce the amount of dangerous compounds in the mixture.
[0023]
In another aspect, the present invention provides:
a) means for mixing a solvent and an asphaltic waste containing an organic halide to form a waste-solvent mixture;
b) heating the waste-solvent mixture to the dissolution temperature over the dissolution time, so that the asphalt waste dissolves in the solvent, and thus the organic waste is liberated from the asphalt waste, the heated waste-solvent Means to make a mixture,
c) To the heated waste-solvent mixture, the decomposition reactant was added at the reaction temperature over the reaction time, and the organic halide was reacted with substantially all of the decomposition reactant to decompose the organic halide. Means for making waste-solvent mixtures
An apparatus having means for carrying out the steps of the method of the present invention is provided.
[0024]
The apparatus of the present invention may include an automatic control mechanism that is compatible with standard material handling equipment to implement the method of the present invention in an automated fashion. Such a control mechanism may be adapted, for example, to a mixer having a heating element and a timer for mixing the solvent and waste at the dissolution time dissolution temperature. The control mechanism can also be adapted to a mixer or reaction vessel for reacting the waste-solvent mixture heated at the reaction time reaction temperature to make a treated waste-solvent mixture.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
In one aspect, the present invention provides a relatively gentle method for decontamination of electrical components using organic solvents. Surprisingly, disclosed is a method of the present invention that has been found to be capable of dissolving asphalt waste to the extent that it is easier to decompose and treat hazardous compounds such as PCBs. . The electrical component can be, for example, a condenser winding encased in an asphalt potting material, which can be found in a fluorescent ballast. A method for treating asphalt waste may include heating the waste in a solvent to react the dissolved material with a reactant such as an alkali metal in an organic solvent dispersion. In some embodiments, surprisingly, when dissolved in a selected solvent, even a complex mixture of asphaltic waste derived from the potting material is substantially (in preferred embodiments at temperatures below the boiling point of the PCB). It has been discovered that it can be treated to degrade all PCB contaminants.
[0026]
In this context, “substantially degrading” a hazardous compound such as PCB means that the concentration of the dangerous compound is reduced to a level at which the compound is not dangerous or toxic. In some aspects, for example, there are statutory limits on the concentration of PCBs in the waste, and therefore the method of the present invention reduces the concentration of PCBs in the waste to a level below the statutory limits. Can be used for In some embodiments, the concentration of a hazardous compound such as PCB is, for example, about 100 ppm, 90 ppm, 80 ppm, 70 ppm, 60 ppm, 50 ppm, 40 ppm, 30 ppm, 20 ppm, 10 ppm, 5 ppm, 2 ppm, 1 ppm, or 0.5 ppm. Can be reduced in waste that has been treated to below levels. In another embodiment, the waste to be treated can be, for example, initially with the following values: about 100 ppm, 200 ppm, 300 ppm, 400 ppm, 500 ppm, 1000 ppm, 2000 ppm, 3000 ppm, 4000 ppm, 5000 ppm, 6000 ppm, 7000 ppm, 8000 ppm, 9000 ppm, May contain dangerous compounds such as PCBs at concentrations in excess of 1,000,000, 100,000 or 200,000 ppm (or any value between 100 ppm and 200,000 ppm). Another aspect of the invention may relate to, for example, treating waste having a concentration of hazardous compounds that exceeds any one of the aforementioned initial values, so that the treated waste is Hazardous compound concentration below any one of the above treated waste values. Such treatment can be characterized as decomposing a certain percentage of dangerous compounds such as 80%, 90%, 95%, 99%, 99.9% or 99.99%.
[0027]
In some embodiments of the present invention, the fluorescent ballast may be separated into potting material (mainly composed of asphalt and sand) and a condenser roll. The potting material and the electrical component, such as a capacitor roll, can be handled separately by the method of the present invention, or the potting material and the electrical component can be processed together. Separation of the waste stream can increase the useful options for product disposal by the method of the present invention, including the possibility of recycling.
[0028]
Separation of potting material from electrical components in a fluorescent ballast can be performed, for example, by manual or automatic processing. For example, asphalt potting material can be subjected to impact forces that promote cracking of the potting material and thus separation of the potting material from internal electrical components. For example, cryogenic freezing of potting material to the extent that it is brittle enough to allow the frozen potting material to be crushed into small pieces that can be separated relatively cleanly from internal electrical components. A method for doing this is disclosed in US Pat. No. 5,230,140, which is incorporated herein by reference.
[0029]
Waste to be treated such as potting material can be crushed. In some embodiments, the ground waste is preferably a preferred particle size, such as an average particle size of less than approximately 2 inches (5 cm), 1 inch (2.5 cm) or 1/2 inch (1.25 cm) in size. Can be included. The method of separating the potting material from the electrical component can be adapted to produce potting material fragments within the aforementioned particle size range, or an additional step of grinding the potting material can be performed. Reducing the particle size of the waste can be achieved, for example, by processing the waste through a suitable grinder for size reduction. The crushing or grinding process can be selected such that it breaks up the waste without melting the waste. In certain embodiments, a rotary shaft grinder design with a horizontal ram feed is preferred, in which case the grinder minimizes cutting friction and heat generation. Waste such as ground potting material can be filled into a reaction vessel such as a mixer / evaporator to which a solvent is added. In certain embodiments, a vertical horizontal mixer can be used. This is because it disperses the material more efficiently than a ribbon or blade type mixer.
[0030]
The solvent for dissolving the asphaltic waste can be chosen such that its boiling point is higher than the reaction temperature, such as by approximately 5-10 ° C. above the reaction temperature. In some embodiments, the reaction temperature is, for example, in some embodiments, such that the solvent is selected at a boiling point of at least about 105 ° C. to at least about 180 ° C. (or any value in the range) (as described above). A) to 100 ° C to 170 ° C. Using a solvent with the appropriate boiling point can reduce solvent evaporation during the reaction with the waste and, if desired, can facilitate more efficient recovery of the solvent by distillation at the end of the process. . In addition, the solvent is preferably selected to be of a type that does not react with the reactants, such as a solvent that does not react with the alkali metal under the reaction conditions.
[0031]
In various embodiments, suitable solvents for the methods of the present invention can include mineral spirits, aliphatic hydrocarbons, paraffin oil, insulating oil or trans oil. Examples of suitable hydrocarbon solvents in some embodiments include VARSOL® or ISOPAR K® solvent (manufactured by Exxon Mobil Corporation). Preferred solvents are low polarity liquids such as hydrocarbon solvents, and preferred hydrocarbon solvents are oils. As used herein, the term solvent is any liquid that is soluble at the dissolution and reaction temperatures, is capable of dissolving asphaltic waste, and serves as a medium in which organohalogen compounds can be decomposed. Including substances.
[0032]
In some embodiments, the waste-solvent mixture is about 100 until, for example, asphaltic waste (such as potting material) dissolves, thereby releasing dangerous compounds (such as PCBs) into solution. It can be heated in a mixer to a temperature of from 0C to about 170C. The temperature can be maintained at the selected reaction temperature for the entire time of the reaction or can be adjusted during the time. During the process, the oxygen content in the reaction vessel can be maintained below the flammability limit of the solvent to increase process safety. An inert gas atmosphere can be applied to increase safety. In some embodiments, the oxygen content of the atmosphere in the reaction vessel is always below about 10%, 9%, 8%, 7%, or preferably 6% during the step of dissolving the waste, and the sodium dispersion When such alkali metal reactants are present, they can be maintained at about 5%, 4%, less than 3%, or preferably less than 2.5%.
[0033]
In some embodiments, an alkali metal, such as a dispersion of sodium in a solvent, can be added to the reaction mixture and allowed to react with the halogenated organic compound, for example for a period of 30-60 minutes. In some cases, more or less time may be required depending on the amount of organic halide present in the starting material. Sodium dispersions are generally commercially available. Moreover, there are a number of methods for the preparation of suitable sodium dispersions that are known. The solvent used in the alkali metal dispersion will preferably have the same boiling point as the solvent used to dissolve the asphalt waste, and in some embodiments dissolve the asphalt waste. Can be the same boiling point as the solvent used. The alkali metal solvent may be selected, for example, from the following non-exclusive list, mineral oil, paraffin oil, insulating oil or trans oil. In another aspect, the particle size of the alkali metal dispersion can be less than about 100 microns, 50 microns, 40 microns, 30 microns, 20 microns, 10 microns, or 5 microns.
[0034]
(For example, U.S. Pat. No. 4,477,354 to Fesler, U.S. Pat. No. 5,064,526 to Rogers et al., U.S. Pat. No. 4,460,797 to Pitlevsky et al., Or U.S. Pat. Other PCB decomposition methods such as base catalyzed decomposition methods or alkali metal hydroxide decomposition methods (as disclosed in US Pat. No. 4,471,143) may be used. In some embodiments, another alkali metal such as potassium can be used.
[0035]
After the reaction has been allowed to proceed for a period of time, excess alkali metal in the reaction mixture can be hydrolyzed and neutralized, for example, by injection of water and carbon dioxide into a mixer. The hydrogen formed during this stage of the process can be captured for later use or can be exhausted to the environment after passing through a suitable exhaust filter, the purpose of the filter being with the gas stream It is to capture any liquids and solids that can be carried away.
[0036]
The solvent can be recovered for reuse, for example, by distillation. The distillation can first be carried out at atmospheric pressure or reduced pressure. In some embodiments, the distillation pressure can be lowered during distillation to facilitate near complete recovery of the solvent. The decontaminated asphalt waste product can be kept molten by maintaining the potting material at a temperature above the melting point of the material, such as, for example, 120-170 ° C. The treated asphalt waste can be discharged from the reaction vessel into a collection bin.
[0037]
In some embodiments, electrical components such as capacitor windings obtained from fluorescent ballasts can be treated in a manner similar to that described above for asphalt waste. For example, this can be advantageous when the part has asphalt material that is still attached to the part. In such embodiments, the reaction temperature will be in the approximate range of, for example, 150 ° C to 170 ° C. The decontaminated electrical component can be discharged from the reaction vessel as a solid.
[0038]
【Example】
The following examples illustrate aspects of the invention, but are not exclusive and do not limit the scope of the invention.
[0039]
Example 1
All PCB analyzes in the examples were performed on a HP5890 gas chromatograph equipped with a DB3 wide bore capillary column 0.53 mm wide by 15 m long and an electron capture detector. The ASTM D4059 method with a detection limit of 2 mg / kg PCB was used. Other test methods such as the American Materials Testing Association (ASTM), the US Environmental Protection Agency (EPA), or other methods sometimes published by other governmental or industrial organizations may also be used.
[0040]
The potting material from the fluorescent stabilizer contaminated with PCB was separated from the other parts and crushed as described above until the average particle size of the potting material was less than ½ ″ in size. The potting material was placed in a 750 mL glass reaction vessel equipped with a water-cooled condenser, an inlet for nitrogen gas and an inlet for a dropping funnel 200 g of solvent ISOPAR K® was placed in the reaction vessel and the mixture The mixture in the reaction vessel was heated under a nitrogen atmosphere to a reaction temperature of approximately 120 ° C. A sample of the mixture was removed and the concentration of PCB in the sample was 290 mg / kg. (Equivalent to 490 mg / kg in the feed) 20 g sodium dispersion (20 wt% sodium in insulating oil) is added to the mixture and the temperature of the mixture is adjusted to 1 Reacted with the mixture while maintaining near 20 ° C. After 30 minutes and / or 80 minutes after addition of the sodium dispersion, another sample of the mixture was removed and the PCB concentration in each case was below the detection limit. The mixture was then cooled and 11 g of water was added to the mixture to hydrolyze residual sodium below 100 ° C.
[0041]
Example 2
Capacitor windings derived from fluorescent ballasts contaminated with PCB were separated from other parts and ground as described above until the average particle size of the capacitor windings was less than ½ ″ in size. Of pulverized condenser roll and 550 g of solvent ISOPAR K® into a 750 mL glass reaction vessel equipped with a water-cooled condenser, an inlet for nitrogen gas and an inlet for a dropping funnel, and The mixture in the reaction vessel was heated under a nitrogen atmosphere to a reaction temperature of approximately 170 ° C. A sample of the mixture was removed and the PCB concentration in the sample was 9,660 mg / kg. (Equal to 17.9% PCB in the feed) 30 g sodium dispersion (20 wt% sodium in insulating oil) was added to the mixture, The mixture was allowed to react with the mixture while maintaining the temperature close to 170 ° C. Another sample of the mixture was removed approximately 30 minutes after the addition of the sodium dispersion and also 90 minutes after which the concentration of PCB in each case was detected. The mixture was then cooled and less than 100 ° C., 11 g of water was added to the mixture.
[0042]
In some embodiments of the present invention, the potting material and the internal electrical components from the fluorescent ballast can be simultaneously ground and processed together to a preferred particle size. The ground potting material and electronic components are then filled into a reaction vessel to which a solvent is added and the same general steps as described above can be performed.
[0043]
Example 3
80 g of crushed potting material having an average particle size of less than 1/2 ″ in size and 20 g of pulverized condenser roll for cooling condenser, inlet for nitrogen gas and dropping funnel Placed in a 750 mL glass reaction vessel with an inlet, 390 g of solvent VARSOL® was placed in the reaction vessel and the mixture was stirred using a variable speed mechanical stirrer. The atmosphere was raised to a reaction temperature of approximately 170 ° C. A sample of the mixture was removed and measured to have a PCB concentration of 14,400 mg / kg (to 6.5% of the PCB in the feed). 10 g sodium dispersion (40% sodium in insulating oil) in 10 g VARSOL® solvent is added to the mixture and the temperature of the mixture is adjusted. The mixture was reacted with the mixture while maintaining near 70 ° C. A sample of the mixture was removed approximately 5 minutes after the addition of the sodium dispersion and the concentration of PCB in the sample was measured to be 1,910 mg / kg. Another sample was removed approximately 15 minutes after the addition of the sodium dispersion and the concentration of PCB in the sample was determined to be 78 mg / kg Another sample of the mixture was removed approximately 90 minutes after the addition of the sodium dispersion. The concentration of PCB in the sample was measured to be below the detection limit, then the mixture was cooled and 3 g of water was added to the mixture at less than 100 ° C.
[0044]
Example 4
80 g of crushed potting material having an average particle size of less than 1/2 "in size and 20 g of pulverized condenser roll for a water-cooled condenser, inlet for nitrogen gas and dropping funnel Placed in a 500 mL glass reaction vessel with an inlet, 390 g of solvent ISOPAR K® was placed in the reaction vessel and the mixture was stirred using a variable speed mechanical stirrer. To a reaction temperature of approximately 160 ° C. A sample of the mixture was removed and the concentration of PCB in the sample was measured to be approximately 14,400 mg / kg (equal to 6.5% of PCB in the feed). 10 g of sodium dispersion (40% sodium in insulating oil) in 10 g VARSOL® solvent is added to the mixture and the temperature of the mixture is increased to 1 Slightly raised to 70 ° C. and allowed to react with the mixture while maintaining that level, another sample of the mixture was removed approximately 30 minutes and also 60 minutes after the addition of the sodium dispersion and in each case the concentration of PCB Was measured below the detection limit, the mixture was then cooled and 3 g of water was added to the mixture at less than 100 ° C.
[0045]
Example 5
80 g of crushed potting material having an average particle size of less than 1/2 "in size and 20 g of pulverized condenser roll for a water-cooled condenser, inlet for nitrogen gas and dropping funnel Placed in a 750 mL glass reaction vessel with an inlet, 390 g of solvent ISOPAR K® was placed in the reaction vessel, and the mixture was stirred using a variable speed mechanical stirrer. The reaction temperature was raised to 0 ° C. A sample of the mixture was removed and it was determined that the concentration of PCB in the sample was approximately 14,300 mg / kg (equal to 6.5% of PCB in the feed). 10 grams of sodium dispersion (40% sodium in insulating oil) in ISOPAR K® solvent was added to the mixture while maintaining the temperature of the mixture at the reaction temperature. Approximately 30 minutes after addition of the sodium dispersion and also after 60 minutes, another sample of the mixture was removed and measured in each case that the concentration of PCB was below the detection limit. The mixture was allowed to cool and at less than 100 ° C., 3 g of water was added to the mixture.
[0046]
Although various aspects of the invention have been disclosed herein, many adaptations and modifications can be made within the scope of the invention with common general knowledge of those skilled in the art. Such modifications also include known equivalent substitutions for any aspect of the invention to achieve the same result in substantially the same manner. Numeric ranges include numbers that define the range. In the description, the word “comprising” is used as an open-ended term and says “including but not limited to”. Substantially equal to a phrase, the word “comprise” has a corresponding meaning. Citation of a reference herein is not to be construed as an admission that the reference is prior art to the present invention. All publications cited in this specification, including but not limited to patents and patent applications, are shown to be incorporated by reference herein, with each individual publication specifically and individually. As if, and as if fully set forth herein, is incorporated herein by reference. The invention includes all aspects and variations substantially as hereinbefore described with reference to the examples.

Claims (20)

Crushing solid asphalt waste containing organic halide at a grinding temperature below its melting temperature to provide an asphalt waste for processing containing organic halide;
Mixing the asphalt waste for treatment with a solvent to form a waste-solvent mixture ;
Before SL waste - the solvent mixture was heated to the dissolution temperature for dissolution time, waste asphaltic waste dissolved in the solvent, thus the organic halide is heated liberated from asphaltic waste - solvent and to make a mixture,
Before SL heated waste - in a solvent mixture, pressurizing give a decomposition reactants at the reaction temperature for a reaction time, the organic halide is decomposed decomposition reactant and substantially all reacted with an organic halide, was treated Making a waste-solvent mixture ;
Distilling the treated waste-solvent mixture and separating the solvent from the asphalt waste to produce a recyclable solvent substantially free of asphalt;
Reusing the recyclable solvent in the mixing of the asphalt waste and the solvent to produce the waste-solvent mixture to decompose organic halides in the asphalt waste how to.   The method of claim 1 wherein the organic halide is PCB.   The process of claim 1 wherein the solvent is a hydrocarbon solvent.   The method of claim 2 wherein the solvent is a hydrocarbon solvent.   The method of claim 1 wherein the reactant is an alkali metal.   The method of claim 2 wherein the reactant is an alkali metal.   The method of claim 3 wherein the reactant is an alkali metal.   The method of claim 4 wherein the reactant is an alkali metal. The method of claim 8, wherein the alkali metal is sodium. The method of claim 1, wherein the asphalt waste is a potting material. The process according to claim 1, wherein the organic halide has an organic halide boiling point, and the dissolution temperature and reaction temperature are below the organic halide boiling point. The method of claim 9, further comprising adding a hydrolysis reactant to the treated waste-solvent mixture to hydrolyze excess alkali metal remaining in the treated waste-solvent mixture. The method of claim 12, wherein the hydrolysis reactant is water. The method of claim 8, wherein the alkali metal is an alkali metal dispersion in an alkali metal solvent. 11. The method of claim 10, wherein the potting material encloses an electrical component, and the electrical component is treated with the potting material by the method of the present invention. The method of claim 15, wherein the electrical component is a capacitor.   Crushing solid asphalt potting material waste containing PCB at a crushing temperature below its melting temperature to provide a processing asphalt pouring material waste containing the organic compound;
  Mixing the asphalt potting material waste for treatment with a hydrocarbon solvent to make a waste-solvent mixture;
  The waste-solvent mixture is heated to the dissolution temperature over the dissolution time, the asphalt potting material waste is dissolved in the hydrocarbon solvent, and the PCB is then released from the asphalt potting material waste. Making a waste-solvent mixture,
  A treated waste in which a sodium metal decomposition reactant is added to the heated waste-solvent mixture at reaction temperature over the reaction time, and the PCB has substantially all reacted with the sodium metal decomposition reactant to decompose PCB -Making a solvent mixture;
  Distilling the treated waste-solvent mixture and separating the solvent from the asphalt potting material waste to produce a recyclable solvent substantially free of asphalt;
Reusing the recyclable solvent in mixing the asphaltic waste and the solvent to make the waste-solvent mixture;
A method for decomposing PCB in waste asphalt potting material.   Means for grinding solid asphalt waste containing an organic halide at a grinding temperature below its melting temperature to provide asphalt waste for processing containing the organic halide;
  Means for mixing the processing asfast waste and solvent to make a waste-solvent mixture;
  The waste-solvent mixture is heated to a dissolution temperature for a dissolution time so that the heated waste-solvent mixture is dissolved in the solvent so that the organic halide is liberated from the asphalt waste. Means to make,
  A treated waste, wherein a decomposition reactant is added to the heated waste-solvent mixture at a reaction temperature over a reaction time, and the organic halide reacts with the decomposition reactant substantially to decompose the organic halide. -Means for making a solvent mixture;
Means for distilling the treated waste-solvent mixture and separating the solvent from the asphalt waste to produce a recyclable solvent substantially free of asphalt;
Means for reusing the recyclable solvent to recycle the asphaltic waste in mixing with the solvent to make the waste solvent mixture;
An apparatus for carrying out a method for decomposing an organic halide in an asphalt waste. 15. The method of claim 5, further comprising the step of adding a hydrogen donor or promoter to the heated waste-solvent mixture when the cracking reactant is added to the heated waste-solvent mixture. And the method according to any one of 17 above. 20. A method according to claim 19, wherein the hydrogen donor or promoter is selected from the group consisting of water, alcohol and acid.