JP3913868B2 - Laser processing method for ultra-thin plate material and laser processing apparatus used for the method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing method for an ultrathin plate material and a laser processing apparatus used in the method.
[0002]
[Prior art]
For example, when a thin metal plate (thin plate material) having a thickness of less than 0.1 mm is cut or drilled with a laser, as shown in FIG. 3, the processed ultrathin plate 51 is not bent. A processing jig 50 for mounting and fixing is used. The jig 50 has a hole 52 having a size substantially equal to the product to be processed, and an ultra-thin plate material 51 is stuck on the hole and fixed appropriately, and the jig is attached to an ordinary laser processing machine. It is installed and processed.
[0003]
[Problems to be solved by the invention]
In the case of the above-described prior art, the ultra-thin plate material does not have a waist, so it cannot be used as it is, and it is necessary to cut to an appropriate work size. Although depending on the plate thickness, there is a problem that when the workpiece size is increased, the workpiece bends even if it is fixed to a jig, so that a large product cannot be processed.
[0004]
The present invention has been made to solve the above-described problems, and an object of the present invention is to use a laser processing method for an ultrathin plate material without a waist without using a fixing jig, and the same method. It is to provide a laser processing apparatus.
[0005]
[Means for Solving the Problems]
As a means for solving the above-mentioned problem, the laser processing method for an ultrathin plate material according to claim 1 is provided with a work shooter device provided on a work table so as to be freely opened and closed, and a gap through which the laser beam can pass is provided in the work shooter device. A pair of work support rollers extending in the Y-axis direction is provided, a laser processing head movable in the Y-axis direction along the gap is provided above the gap, and the laser processing head of the laser processing head is provided on the work table. In the laser processing apparatus provided with the workpiece moving device movable in the X-axis direction orthogonal to the moving direction, an ultrathin plate material is provided on the set of workpiece supporting rollers so as to be movable in the rotation direction of the workpiece supporting rollers, The ultrathin plate material from the work support surface of a clamp arm provided by extending the work support surface of the work support roller in the Y-axis direction on the work moving device Provided slightly higher position to the extent that swells slightly out what is summarized in that the laser processing while applying a tension to the moving direction of the electrode sheet of material clamped to the workpiece clamping of the clamp arm.
[0006]
Therefore, according to the laser processing method of the first aspect, it is possible to perform high-precision laser processing without using a fixing jig even with an extremely thin plate material having no waist.
[0007]
The laser processing apparatus according to claim 2 is provided with a work shooter device provided on a work table so as to be freely opened and closed, and the work shooter device extends in the Y-axis direction with a gap through which a laser beam can pass. A support roller is provided, a laser processing head movable in the Y-axis direction along the gap is provided above the gap of the pair of work support rollers, and the work table is orthogonal to the moving direction of the laser processing head. in the laser processing device having a movable workpiece moving device in the X-axis direction, the workpiece moving device to provide a clamp arm pole for supporting and fixing the moving direction end portions of the workpiece sheet material Rutotomoni appropriate of the clamp arm A plurality of workpiece clamps capable of clamping both ends of the workpiece in the X-axis direction are provided at various positions, and the workpiece support surfaces of the set of workpiece support rollers are Provided from the workpiece support surface of the lamp arms slightly higher position to the extent that the electrode sheet material swells slightly out what is summarized in that the laser processing while applying a tension to the moving direction of the electrode sheet material.
[0008]
Therefore, according to the laser processing apparatus of the second aspect, the processing portion of the workpiece such as an ultra-thin plate material is movably supported on the workpiece support roller, and both ends in the movement direction of the workpiece are clamp arms of the workpiece moving device. Since the laser processing is performed by clamping to the workpiece and fixing it so that there is no slack , tension is applied to the workpiece by the dead weights at both ends of the workpiece, and high-precision laser processing can be performed.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a laser processing apparatus according to the present invention.
[0012]
Referring to FIG. 1, the laser processing apparatus 1 includes a C-shaped frame 3, and an upper frame 3 </ b> U of the frame 3 is movable in the Y-axis direction by a known drive motor and a ball screw (not shown). A laser processing head 5 is provided.
[0013]
At the lower end of the laser processing head 5, a nozzle 7 is provided, a bend mirror 9 for bending the laser beam LB, and a condenser lens 11 for condensing the laser beam LB. A bend mirror 13 that reflects a laser beam LB from a laser oscillator (not shown) to the bend mirror 9 is provided at the rear of the upper frame 3U.
[0014]
With the above configuration, the laser beam LB from the laser oscillator (not shown) is guided to the condenser lens 11 of the laser processing head 5, and the laser beam LB condensed by the condenser lens is transferred from the nozzle 7 to the workpiece W. Will be irradiated.
[0015]
A work table 17 is provided on the lower frame 3 </ b> L of the frame 3, and a rectangular groove 19 is formed at the center of the work table 17.
[0016]
The groove portion 19 is provided with an openable / closable work shooter device 21 for dropping a cutting member cut from the work W to the lower side of the work table 17.
[0017]
The work shoe device 21 is provided with a rectangular frame 22 that can be opened and closed with a longitudinal side of the rectangular groove 19 as a fulcrum. The frame 22 is irradiated from the laser processing head 5. A pair of work support rollers 23 and 25 having a gap S through which the laser beam LB can pass and whose shaft ends are rotatably supported are extended in the Y-axis direction.
[0018]
The frame body 22 is provided so as to be freely opened and closed by an actuator (not shown) such as a pneumatic or hydraulic cylinder provided in the lower frame.
[0019]
Accordingly, the cutting members positioned on the work support rollers 23 and 25 of the work shooter device 21 can be appropriately dropped into a product box (not shown) below the table by opening the frame body 22 at an angle. .
[0020]
A work moving device 27 extending in the X-axis direction orthogonal to the Y-axis direction is provided on the guide rail 29 at the end of the work table 17 positioned on the gap throat side of the frame 3. . Clamp arms 30 that are integrally fixed to the workpiece moving device 27 and extended in the Y-axis direction are provided at both ends of the workpiece moving device 27 in the X-axis direction. A plurality of work clamps 31 capable of clamping both ends of the work W in the X-axis direction are provided at appropriate positions on the respective clamp arms 30.
[0021]
The workpiece moving device 27 is provided so that it can be moved to an arbitrary position in the X-axis direction by a ball screw (not shown) that is rotationally driven by an X-axis drive servomotor (not shown).
[0022]
The pair of work support rollers (23, 25) is rotationally driven by a synchronous rotation drive device (not shown), and the peripheral speed of the work support rollers (23, 25) and the movement speed of the work movement device 27 are set. Are controlled to be the same.
[0023]
Further, as shown in FIG. 2, the work support surfaces on the upper surfaces of the work support rollers 23 and 25 are provided so as to be positioned slightly above the work support surface of the clamp arm 30. Therefore, the shape of the workpiece W clamped on the clamp arm 30 is a shape in which the portion of the workpiece support roller is slightly raised.
[0024]
In the above configuration, in order to perform laser processing on an ultra-thin plate material, both ends in the X-axis direction of the ultra-thin plate material are placed on the clamp arm 30, and tension is applied in the moving direction of the ultra-thin plate material (X-axis direction). Fix so that there is no slack while giving.
[0025]
If the ultra-thin plate material is fixed as described above and the laser processing apparatus is operated, the ultra-thin plate material is controlled by a control device (not shown) that controls the laser processing apparatus 1 in an integrated manner. The laser processing head 5 is moved in the Y-axis direction at the same time as the laser beam is moved in the Y-axis direction, and the laser beam is focused and irradiated on a desired position of the ultra-thin plate material. Can be implemented with high accuracy.
[0026]
During the laser processing described above, the ultrathin plate material is supported by the work support roller 23 and the support roller 25 arranged at a narrow interval, and at the same time, the ultrathin plate material gives tension in the moving direction (X-axis direction). Since the workpiece is fixed on the clamp arm 30, the workpiece of the ultra-thin plate material positioned on the workpiece support rollers (23, 25) is always held horizontally.
[0027]
Further, since the distance between the axes of the work support rollers (23, 25) is sufficiently smaller than the work size of the ultrathin plate material, the influence of the bending during this time on the processing accuracy can be ignored. Further, since the work support surface of the work support rollers (23, 25) is provided slightly above the work support surface of the clamp arm 30, the work support roller portion of the work support roller portion is also affected by the weight of both ends of the work. Since tension is applied to the workpiece, the level of this portion is stably maintained.
[0028]
Therefore, as described above, high-precision laser processing can be performed regardless of the ultra-thin plate workpiece.
[0029]
In addition, according to the method and apparatus of the present invention, high-precision laser processing can be performed even on an ultrathin plate material of, for example, a regular material 3 ′ × 6 ′ (914 mm × 1,829 mm) without being limited by the workpiece size. can do.
[0030]
In the description of the embodiment of the present invention, an example of a laser processing apparatus having a C frame structure is shown, but it is easily understood that the present invention is not limited to a laser processing apparatus having a C frame structure. By the way.
[0031]
【The invention's effect】
According to the first and second aspects of the invention, high-precision laser processing can be performed without using a fixing jig even with an ultra-thin plate material having no waist. Further, without being limited to the work size, for example, an ultra-thin plate material having a size such as a regular material 3 ′ × 6 ′ (941 mm × 1,829 mm) can be similarly processed.
[Brief description of the drawings]
FIG. 1 is a perspective view of a laser processing apparatus according to the present invention.
FIG. 2 is a view taken in the direction of arrow A in FIG.
FIG. 3 is an explanatory view of a conventional ultrathin plate processing method. 3A is a perspective view, and FIG. 3B is a cross-sectional view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 3 Frame 5 Laser processing head 7 Nozzle 9, 13 Bend mirror 11 Condensing lens 17 Work table 19 Rectangular groove part 21 Work shoe apparatus 23, 25 Work support roller 27 Work moving apparatus 29 Guide rail 30 Clamp arm 31 Work piece Clamp LB Laser beam S Gap W Workpiece

Claims (2)

A work shooter device provided on the work table so as to be openable and closable is provided. The work shooter device is provided with a pair of work support rollers extending in the Y-axis direction with a gap through which a laser beam can pass. A laser processing apparatus provided with a laser processing head movable in the Y-axis direction along a gap, and provided with a work movement device movable in the X-axis direction orthogonal to the movement direction of the laser processing head on the work table . An ultra-thin plate material is provided on the set of work support rollers so as to be movable in the rotation direction of the work support roller, and the work support surface of the work support roller is provided to extend in the Y-axis direction on the work moving device. The clamp arm is placed at a slightly higher position than the workpiece support surface of the clamp arm, Laser processing method poles sheet material, characterized in that the laser processing while applying a tension to the moving direction of the electrode sheet of material clamped on. A work shooter device provided on the work table so as to be freely opened and closed is provided, and the work shooter device is provided with a pair of work support rollers extending in the Y-axis direction with a gap through which a laser beam can pass. A laser machining head that is movable in the Y-axis direction along the gap above the gap of the roller is provided, and a workpiece moving device that is movable in the X-axis direction orthogonal to the movement direction of the laser machining head on the work table in the laser processing apparatus provided with the moving direction end portions of the poles of the thin plate work to the work moving device provided with a clamp arm that supports fixed Rutotomoni, both end portions of the X-axis direction of the workpiece to an appropriate position of the clamp arm A plurality of work clamps that can clamp the work support surface of the pair of work support rollers in front of the work support surface of the clamp arm. The laser processing apparatus electrode thin plate is provided at a slightly higher position to the extent that swells slightly, characterized in that laser processing while applying a tension to the moving direction of the electrode sheet material.

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