JP3999969B2 - Method of manufacturing container body for surface mount oscillator and crystal oscillator using the same - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method of a container body for a surface mount oscillator and a crystal oscillator based thereon, and more particularly to a manufacturing method of a container body suitable for miniaturization while maintaining the shock resistance of the crystal oscillator.
[0002]
[Prior art]
BACKGROUND OF THE INVENTION Crystal oscillators are used in many electronic devices as frequency and time reference sources, and are especially built into portable devices because they are small and light for surface mounting. One such thing, (the temperature compensated oscillator) temperature-compensated in the crystal oscillator used in a large dynamic environment of temperature change is.
[0003]
(An example of the prior art) FIG. 3 is a diagram of a temperature compensated oscillator for surface mounting, explaining an example of the prior art. FIG. 3 (a) is a sectional view, and FIG. 3 (b) is a cover and a second frame wall. FIG. In the temperature compensated oscillator, an IC chip 1 in which a temperature compensation function and an oscillation circuit are integrated is fixed to a bottom surface of a concave container body 2, a crystal piece 3 is held on a stepped portion, and a cover 4 is covered. Then, temperature compensation data for compensating the frequency temperature characteristic of the crystal oscillator is written into the temperature compensation function in the IC chip 1 from the end face electrode 5 provided on the side surface of the container body 2.
[0004]
The container body 2 includes a bottom wall 7 having a mounting electrode 6 and first and second frame walls 8 (ab) forming a stepped portion, and an end surface electrode 5 is provided on a side surface of the first frame wall 8a as an intermediate. In normal, with a through hole 10 in the connecting portion of the first frame wall sheet 8A provided with a plurality of windows 9 as shown in 4 (a), first frame wall sheet 8A to the bottom wall sheet (not shown) And a 2nd frame wall sheet (not shown) is laminated | stacked, and a container main body sheet | seat is formed. FIG. 4B is a partially enlarged view indicated by a dotted line frame (A) in FIG.
[0005]
A conductive paste as a base circuit pattern (not shown) is applied to the bottom wall sheet and the first and second frame wall sheets including the inner surface of the through hole 10 by printing. Then, the coupling portion surface of the container body sheet Switching Operation grooves 11 of vertical and horizontal was a split is provided, after firing the container body sheet integrally, divided along the Switching Operation groove 11, the end surface electrode on the side surface A plurality of container bodies 2 having 5 are obtained. Usually, Au plating is applied to the underlying circuit pattern including the through-hole 10 after firing.
[0006]
[Problems to be solved by the invention]
(Problem of the prior art) However, in the temperature compensated oscillator having the above-described configuration, the end face electrode 5 is formed by a through hole on the side surface of the container body 2 (first frame wall 8a). Become smaller. For this reason, when the width of the frame wall is reduced due to the rapid downsizing in recent years, there is a problem that the strength of the first frame wall 8a is impaired and the impact resistance of the temperature compensated oscillator is deteriorated.
[0007]
(Object of the invention) An object of the present invention is to provide a method of manufacturing a container body for a surface mount oscillator having good impact resistance and a crystal oscillator using the same.
[0008]
[Means for Solving the Problems]
In the present invention, a second frame wall sheet forming a step portion is laminated on a first frame wall sheet having a plurality of windows and having a through hole in a connecting portion , and the first frame wall sheet is further used as a bottom wall sheet. to form the container body sheets are laminated and fired to provide a kerf in the connecting portion, then divided along the switching Operation groove provided in the connecting portion bottom wall and first frame wall and the second In the manufacturing method of a container main body for a surface mount oscillator, wherein a plurality of container main bodies each including a frame wall are formed, and an end surface electrode is formed on the outer wall surface of the container main body by the through holes. buried and by firing by providing a switching Operation grooves reaching said conductive material from the surface of the second frame wall and the container body sheet is divided along the switching Operation grooves to form a plurality of container body configuration And
[0009]
[Action]
In the present invention, since the conductive material is embedded in the through hole and divided, the thickness of the end face electrode portion becomes substantially the same as the width of the frame wall, and the strength can be increased. Moreover, since the cut groove reaching the conductive material from the surface of the second frame wall sheet is provided, the container main body sheet can be easily divided. Hereinafter, an embodiment of the present invention will be described using a temperature compensated oscillator as an example.
[0010]
【Example】
FIG. 1 is a plan view excluding a cover of a temperature compensated oscillator and a second frame wall for explaining an embodiment of the present invention. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.
As described above, in the temperature compensated oscillator, the IC chip 1 is fixed to the bottom surface of the container body 2 including the bottom wall 7 and the first and second frame walls 8 (ab), and the crystal piece 3 is held on the stepped portion. The cover 4 is covered, and temperature compensation data for compensating the frequency temperature characteristic is written in the temperature compensation function in the IC chip 1 from the end face electrode 5 provided on the side surface. Here, the end surface electrode 5 of the container body 2 is formed on substantially the same surface as the side surface with the conductive material 12 embedded therein.
[0011]
Specifically, the container main body 2 is formed by laminating the bottom wall sheet and the first and second frame wall sheets to form a container main body sheet as described above, and individually dividing after firing. Here, first, after forming and laminating a base circuit pattern on the first frame wall sheet 8A and the second frame wall sheet having the bottom wall sheet and the through hole 10, as shown in FIG. 2 (a), The conductive material 12 is embedded in the through hole. FIG. 2B is a partially enlarged view shown in FIG. The conductive material 12 is, for example, W (tungsten) for forming a base circuit pattern.
[0012]
Next, the Switching Operation groove 11 reaching the conductive material 12 from the second frame wall laminated sheet provided, firing the container body sheet integrally. Finally, as shown in FIG. 2 (c), subjected to Au plating (not shown) to the underlying circuit pattern is divided into individual container body 2 along the Switching Operation groove 11.
[0013]
With such a configuration, the end surface electrode 5 formed on the side surface of the container body 2 is embedded in the conductive material 12 so as to be flush with the side surface, so that the strength at that portion is compensated for and the first frame wall 8a Keep the thickness constant to prevent local strength loss. Therefore, size reduction is promoted and impact resistance is improved.
[0014]
Further, the through hole 10 of the first frame wall sheet 8A by burying a conductive material 12, providing the Switching Operation groove 11 reaching the conductive material 12. Accordingly, when dividing the container body sheet can effortlessly divided along a Switching Operation groove 11. When there is no Switching Operation groove 11 to the conductive material 12 is peeled off from the inner wall of the through hole 10 at the time of division, not divided.
[0015]
[Other matters]
In the above embodiment, the container body 2 is provided with a concave portion only on one main surface side of the bottom wall 7 and accommodates the IC chip 1 and the crystal piece 3 together. Even when the IC chip 1 and the crystal piece are separately accommodated, the present invention can be applied. In addition to the IC chip, other electronic components such as a capacitor may be accommodated as necessary. The end face electrode is a writing terminal of the temperature compensated oscillator. However, for example, it may be a crystal terminal for characteristic evaluation connected to a crystal piece of a crystal oscillator, and can be applied when an end face electrode is required.
[0016]
【The invention's effect】
The present invention is provided with a groove-away by burying a conductive material in a through hole provided in the connecting portion of the frame wall sheet, after firing, is divided along the container body sheet in Switching Operation groove, buried in the conductive material Since a plurality of container main bodies having end face electrodes in the through holes are formed, it is possible to provide a method for manufacturing a container main body for surface mounting that maintains good impact resistance and a crystal oscillator using the same.
[Brief description of the drawings]
FIG. 1 is a plan view excluding a cover and a second frame wall of a temperature compensated oscillator for explaining an embodiment of the present invention.
2A and 2B are diagrams for explaining an embodiment of the manufacturing method of the present invention, in which FIG. 2A is a plan view of the first frame wall sheet, and FIG. 2B is FIG. A partially enlarged view of the portion shown in the figure is a plan view after division.
FIG. 3 is a diagram of a temperature-compensated oscillator for explaining a conventional example. FIG. 3A is a partially broken cross-sectional view, and FIG. 3B is a plan view excluding a cover and a second frame wall.
4A and 4B are views for explaining a conventional manufacturing method, in which FIG. 4A is a plan view of a first frame wall sheet, and FIG. 4B is one of the portions indicated by (A) in FIG. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC chip, 2 container main body, 3 crystal piece, 4 cover, 5 end surface electrode, 6 mounting electrode, 7 bottom wall, 8a 1st frame wall, 8b 2nd frame wall, 8A 1st frame wall sheet, 9 window, 10 through hole, 11 switching Operation groove, 12 a conductive material.

Claims (2)

Laminating a second frame wall sheet forming a stepped portion on a first frame wall sheet having a plurality of windows and having a through hole in a connecting portion, and further laminating the first frame wall sheet on a bottom wall sheet to form the container body sheet was fired by providing a cut groove in the connecting portion, from the then bottom wall and is divided along the switching Operation groove provided in the connecting portion between the first frame wall and the second frame wall Forming a plurality of container bodies, and in a method for manufacturing a container body for a surface mount oscillator having an end surface electrode by the through holes on the outer wall surface of the container body , a conductive material is embedded in the through holes. surface, wherein the second kerf and fired provided extending from the frame wall on the surface to the conductive material, and wherein the forming a plurality of container body of the container body sheet is divided along the switching Operation groove A method for manufacturing a container body for a mounting oscillator. 2. The crystal oscillator for surface mounting according to claim 1, wherein a crystal piece and an IC chip are accommodated in the container body.

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