JP3994567B2

JP3994567B2 - Method and apparatus for removing components from circuit boards

Info

Publication number: JP3994567B2
Application number: JP02823699A
Authority: JP
Inventors: 幹夫四元; 裕松田; 薫志水
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 1999-02-05
Filing date: 1999-02-05
Publication date: 2007-10-24
Anticipated expiration: 2019-02-05
Also published as: JP2000228578A

Description

【０００３】
【発明の属する技術分野】
本発明は回路用基板（プリント配線基板）に取り付けた各種回路用部品の取り外し（離脱）方法とその装置に関する。
【０００４】
【従来の技術】
回路用基板や回路用部品のリサイクル処理を目的とし、回路用基板に実装した各種回路用部品を取り外す（離脱）方法としては、はんだ溶融温度以上に前記回路用基板を加熱、溶融し、該状態で前記回路用基板または前記回路用部品の内、少なくとも一方を加振して回路用部品を取り外す方法が提案されている。
【０００５】
また、外部接続用端子（リード線）を備えた回路用部品が回路用基板にはんだ付け実装されている場合、前記回路用基板の一方の主面から突出した外部接続用端子（リード線）および前記回路用基板の一方の主面側に折り曲げた（クリンチした）外部接続用端子をまず切断し、その後、はんだを溶融して回路用部品を取り外すのが一般的である。
【０００６】
なお、各種回路用部品としては抵抗、コンデンサ、トランジスタ、ＩＣ，ＬＳＩ（集積回路）、フライバックトランス、シールドケース付きチューナー、放熱板、コネクタ、ジャンパー線、スルーホール用ハトメ等任意の回路構成部材としてよい。また、リード線付き部品（アキシャルリード部品、ラジアルリード部品）、チップ部品等の種類についても任意としてよい。
【０００７】
前記外部接続用端子（リード線）を切断する場合、ニッパによる切断、または円盤形メタルソーや円盤型薄形砥石などのツールを１，８００ｒｐｍ〜３，０００ｒｐｍ回転させる切断方法が用いられている。
【０００８】
【発明が解決しようとする課題】
前記リード線をメタルソー等の切削ツールを用いて切削する原理は、前記ツールの切れ刃部を被切削物（ワーク）に強く押し付け、被切削物に連続したせん断破壊を起こすことにより切削加工するものである。
切れ刃部を被切削物に強く押しつけた場合、切削部位の摩擦熱は大きく、熱による刃先の脆化と軟弱化により刃先の摩耗を増大する。切れ刃部の摩耗により切削速度は大幅に低下し制限される。
また、切れ刃部を被切削物に食い込ませるため、ツールの保持と被切削物の保持とに大きな剛性を要し、大掛かりな保持機構と高い設備コストを要する。
【０００９】
円盤形砥石を用いた切削加工は、砥粒の持つ切れ刃により連続した小さな剪断によって行われる。砥粒の角部（切れ刃）はさほど鋭利ではないこと、およびグラインダーの周速度が比較的大きいことにより切削部位の摩擦熱は大きい。
前記各ツールの寿命を確保するには切削部位の温度を適切に抑制する必要があり切削速度は制限される。
【００１０】
回路用基板の主面または前記回路用基板に取り付けた各種回路用部品の少なくとも一方を切削加工する行程、前記回路用基板を加熱する行程、前記回路用基板または回路用部品の少なくとも一方を加振する行程、前記回路用基板から離脱した前記回路用部品を搬送する行程とを備えた回路用基板から部品を取り外す装置の提案が望まれている。
【００１１】
【課題を解決するための手段】
本発明は上記課題を解決するために、回路用基板を搬送する基板搬送手段と、前記回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工する切削加工手段と、前記回路用基板を加熱する加熱手段と、前記回路用基板または前記部品の少なくとも一方を加振する加振手段と、前記回路用基板から離脱した前記回路用部品を搬送する部品搬送手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度（約５０ｍ／秒（１８０ｋｍ／時））以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させる構成とした。
【００１２】
また、回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工した後、前記回路用基板を加熱してはんだを溶融し前記回路用基板または前記部品の少なくとも一方を加振して前記回路用基板に取り付けた部品を離脱させる方法であって、前記切削加工手段は、第１の回転体の主面に立設した支軸に第１の打撃体を回動可能に取り付け、前記第１の回転体を高速回転させ前記第１の打撃体を臨界衝撃速度（約５０ｍ／秒（１８０ｋｍ／時））以上の速度で前記回路用基板の主面に衝突させるようにし、前記加振手段は、第２の回転体の主面に立設した支軸に第２の打撃体を回動可能に取り付け、前記第２の回転体を３０〜３００ｒｐｍ（回転／分）で回転させ，前記第２の打撃体を回路用基板または回路用部品の少なくとも一方に衝突させるようにした。
【００１３】
さらに、回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工することと，前記回路用基板を加熱してはんだを溶融することとを並行して実施することにより前記回路用基板に取り付けた部品を離脱させる方法であって、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度（約５０ｍ／秒（１８０ｋｍ／時））以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにした。
【００１４】
さらに、被切削物（ワーク）の切削原理は、臨界衝撃速度（ｃｒｉｔｉｃａｌｉｎｐａｃｔｖｅｌｏｃｉｔｙ）以上の高速引っ張り力を加えると塑性波が発生し，着力端で直ちに破断がおきる塑性波理論、または高速圧縮力を加えると塑性波が発生し非常に大きな応力が瞬間発生し，着力端は小さな歪で破壊する（脆くなることと類似の現象）という理論を用いた。詳しくは、従来の切れ刃を備えたツールに代え、金属などの硬質固体からなる打撃体を被切削物（ワーク／回路用基板）に超高速、高頻度で衝突させ、該衝突エネルギーにより塑性波を発生させ、瞬時に衝突部位を破壊し除去する原理に基ずく。
即ち、高速円運動（約５０ｍ／ｓｅｃ（１８０Ｋｍ／ｈ）以上の速度）する打撃体がワークに衝突し，反射（反発）する時、衝撃を伴って発生する高速圧縮、または摩擦による高速引っ張り、高速せん断等により打撃体とワークの衝突部位及びその近傍のごく限られた範囲でワーク表面を微粒子状または微細片に瞬時に破砕（破壊）する原理に基づく切削方法とした。
【００１５】
塑性波を発生させるため打撃体がワークに衝突する速度を約５０ｍ／ｓｅｃ（１８０Ｋｍ／ｈ）〜３００ｍ／ｓｅｃ（１，０８０Ｋｍ／ｈ）の範囲とした。
円板の周速に換算すると、直径１００ｍｍの円板が回転数１０，０００ｒｐｍ〜６０，０００ｒｐｍで回転するのに相当する。
樹脂成型品やプリント配線基板等の切削の場合、打撃体（硬質固体）を前記約５０ｍ／秒（１８０ｋｍ／時）以上の速度で，かつ約１５０回／秒の頻度以上でワークに衝突させワークの表面を破砕する構成とした。
また、機械構造用炭素鋼や冷間圧延鋼板などの金属、ガラス等の切削の場合、打撃体を約１５０ｍ／秒（５４０ｋｍ／時）以上の速度で，かつ約１，８００回／秒の頻度以上でワークに衝突させワーク表面を破砕する構成とした。
【００１６】
前記打撃体を支承する支軸と，前記打撃体の貫通穴との嵌合隙間を２ｍｍ以上、好適には嵌合隙間を５〜１０ｍｍ程度とした。前記嵌合隙間は打撃体の衝突速度の増大に対応して大きく設定する必要がある。なお、本発明における嵌合隙間は、一般的に軸と軸受との嵌合状態を規定するＪＩＳ規格のスキマ数値よりはるかに大きく２桁〜３桁上回るものである。
【００１７】
このように本発明の切削原理は従来の切削原理とは異なる。従来の切削原理は切削工具（ツール）の切れ刃部を低速（最大約１０ｍ／ｓｅｃ程度以下）でワークに衝突させ、ワークが弾性変形を経て塑性変形から破壊へと順次変形し、ワーク表面の比較的広い範囲が破壊するものである。
また、本発明における打撃体は従来の切削工具（ツール）のような鋭利な切れ刃部を備えるものでない。
【００１８】
本発明における切削原理の特徴は、
（１）打撃体とワークとの衝突時の臨界衝撃速度以上の高速圧縮及び高速引っ張りによる破砕（切削）原理により、ワークにおける切削部位の摩擦熱の発生が極めて少ない。また、打撃体は高速運動により急速に自然空冷され打撃体自体の温度上昇も極めて小さい。
（２）回転、往復運動、または直線運動する切削工具（ツール）は、摩耗が激しい。しかし、本発明の打撃体は、ワークとの衝突により打撃体が加工硬化を受け、使用につれて硬化し耐摩耗性が増大する。
（３）本発明の切削原理は切削抵抗と摩擦抵抗が小さい。その結果、切削時にワークを強固に保持、固定する必要がない。また、前記打撃体を支承する支軸、高速回転する回転体や主軸の剛性、回転体主軸軸受の剛性等を強固に構築する必要がない。
（４）また、異なる複数の部材（例えば、金属、樹脂成形品、ガラス、フェライト等）で構成されたワークであっても、同一の切削装置で連続して切削できる。
【００１９】
以上のように本発明は、回路用基板から回路用部品を効率よく取り外し、回路用基板と回路用部品のリサイクル率が向上する。
また、切削手段は構造が簡単で長寿命化と信頼性の大幅な向上が図れる。さらに、切削過程でワークの異材質混在、例えば、フェノール樹脂基板、ガラスエポキシ基板、セラミックス基板、金属基板等を考慮する必要性がない。
【００２０】
【発明の実施の形態】
本発明における第１の発明は、回路用基板を搬送する基板搬送手段と，前記回路用基板の主面または前記回路用基板に取り付けた部品の内、少なくとも一方を切削加工する切削加工手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記回路用部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す装置としたもので、遠心力を利用した衝撃切削により切刃部の摩耗を減少させ、切削装置の長寿命化と信頼性の向上を図れる。また、回路用基板の種類を選ばずリード線やチップ部品等の高速切削を可能にする。
【００２１】
さらに、第２の発明は、回路用基板を搬送する基板搬送手段と、前記回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工する切削加工手段と、前記回路用基板を加熱する加熱手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す装置としたもので、遠心力を利用した衝撃切削によりリード線を高速切削し、回路用部品を効率よく取り外せる。
【００２２】
さらに、第３の発明は、回路用基板を搬送する基板搬送手段と、前記回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工する切削加工手段と、前記回路用基板を加熱する加熱手段と、前記回路用基板から離脱した回路用部品を搬送する部品搬送手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す装置としたもので、取り外した回路用部品を効率よく回収できる。
【００２３】
さらに、第４の発明は、回路用基板を搬送する基板搬送手段と、前記回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工する切削加工手段と、前記回路用基板を加熱する加熱手段と、前記回路用基板または前記部品の少なくとも一方を加振する加振手段と、前記回路用基板から離脱した前記回路用部品を搬送する離脱部品搬送手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す装置としたもので、回路用部品を効率よく取り外し、回路用基板と回路用部品のリサイクル率が向上する。
【００２４】
さらに、第５の発明は、回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工した後、前記回路用基板を加熱してはんだを溶融することにより前記回路用基板に取り付けた部品を離脱させる方法であって、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す方法としたもので、回路用基板からの部品取り外しと回収を効率よく実施できる。
【００２５】
さらに、第６の発明は、回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工した後、前記回路用基板を加熱してはんだを溶融し前記回路用基板または前記部品の少なくとも一方を加振して前記回路用基板に取り付けた部品を離脱させる方法であって、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す方法としたもので、回路用基板からの回路用部品取り外し回収を効率よく実施でき、回路用基板と回路用部品のリサイクル率を向上させる。
【００２６】
さらに、第７の発明は、加熱領域で回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工することと，前記回路用基板を加熱してはんだを溶融することとを並行して実施することにより前記回路用基板に取り付けた部品を離脱させる方法であって、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする回路用基板から部品を取り外す方法としたもので、回路用基板からの回路用部品取り外し回収を効率よく実施でき、回路用基板と回路用部品のリサイクル率を向上させる。
【００２７】
さらに、第８の発明は、回路用基板を搬送する基板搬送手段と、前記回路用基板の主面または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工する切削加工手段と、前記回路用基板を加熱する加熱手段と、前記回路用基板から離脱した前記回路用部品を搬送する離脱部品搬送手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにするとともに、前記切削加工手段を加熱領域に配置したことを特徴とする回路用基板から部品を取り外す装置としたもので、装置全長を短縮できる。また、回路用部品を効率よく取り外し、回路用基板と回路用部品のリサイクル率が向上する。
【００２８】
【実施例】
以下、本発明の一実施例における回路用基板から部品を取り外す装置を図１〜図１３に基づいて説明する。
【００２９】
（実施例）
図１は本発明の一実施例における回路用基板から部品を取り外す装置を構成する切削ユニットの断面図、図２は図１を切断線Ｓ１ーＳ１から見た断面図、図３は図１の切削ユニットを用いて回路用基板の一方の主面または部品の内、少なくとも一方を切削している状態の断面図、図４は図１の切削ユニットを構成する打撃体の正面図、図５は図４を切断線Ｓ３ーＳ３で切断した断面図、図６、図７は図１を構成するもう一つの打撃体の正面図、図８は本発明の一実施例における回路用基板から部品を取り外す装置を構成する切削装置の断面図、図９は本発明の一実施例における回路用基板から部品を取り外す装置の概念の要部平面図、図１０は本発明の一実施例における回路用基板から部品を取り外す装置の概念の要部断面図、図１１は本発明の説明に用いる回路用基板（プリント配線基板）の断面図、図１２はプリント配線基板の一方の主面を切削加工した状態の要部断面図、図１３は本発明の一実施例における回路用基板から部品を取り外す装置を構成する枠型プレートの平面図を示す。
【００３０】
図９、図１０において、回路用基板から部品を取り外す装置２００は、回路用基板（プリント配線基板）３００を搬送するコンベア２０１（回路用基板搬送手段）と、回路用基板３００をコンベア２０１から持ち上げ、回路用基板３００の周縁部を挟持、固定する手段と、前記回路用基板３００の主面または前記回路用基板３００にとりつけた各種回路用部品の少なくとも一方を切削加工する切削装置６００（切削加工手段）と、前記回路用基板３００をはんだ溶融温度以上に加熱する加熱炉２０３（加熱手段）と、前記回路用基板３００または前記部品の少なくとも一方を加振する打撃装置４００（加振手段）と、前記回路用基板３００から離脱した前記回路用部品を搬送するコンベア２０２（離脱部品搬送手段）とからなる。
【００３１】
なお、図９、図１０において符号２０４は加熱炉２０３を構成するヒータ、２５０は枠型プレート、２５１は固定プレート、２０５は切削装置６００の駆動モータ、２０６は駆動ネジを示す。
【００３２】
前記切削装置６００は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板の主面または前記部品の少なくとも一方に衝突させるようにしたことを特徴とする。
また、本発明装置は上記切削装置６００を２箇所以上の複数箇所配置し、それぞれの切削装置がプリント配線基板の異なる主面位置、または異なる主面位置に搭載した部品を切削するよう構成した。
さらに、図９に示すように、パルスモータ等の駆動モータ２０５とボールネジ等の駆動ネジ２０６とにより切削装置６００を矢印Ｙ方向に前後駆動し、切削位置を任意に変更可能とした。また、矢印Ｘ方向に左右駆動する構成とすることにより、切削装置６００は水平面内の任意の場所へ移動できる。
【００３３】
なお、削装置６００を１箇所のみとしてよい。その場合、プリント配線基板３００のほぼ全域を切削可能とするため、削装置６００を順次、プリント配線基板３００の幅方向に移動させることが必要である。即ち、プリント配線基板３００がコンベア２０１によって搬送される方向と直角な方向（矢印Ｙ方向）に順次、ピッチ送りすればよい。
【００３４】
次に、切削装置６００と、該切削装置６００を構成する切削ユニット１００について説明する。
本発明における切削ユニット１００は、図１〜図３に示すように、主面が対向した一対の円板（回転体）１０１，１０１間に支軸１０３を架設し，該支軸１０３に打撃体１を回動可能に取り付け、前記一対の円板（回転体）１０１、１０１を高速回転させ、前記打撃体１（硬質固体）を約５０ｍ／秒（１８０ｋｍ／時）以上の速度で，かつ約１６７回/秒（毎秒１０，０００/６０回）以上の打撃頻度でプリント配線基板３００の主面または部品の内、少なくとも一方に衝突させる構成とした。なお、回転数は電源電圧の変動、その他の理由等で±１０％程度のバラツキを許容する。
【００３５】
打撃体１の被切削物（ワーク／本発明における回路用基板または回路用部品）に対する衝突速度は当然のことながら、前記一対の円板（回転体）の回転数に対応する。本実施例では一対の円板（回転体）の回転数を１０，０００〜６０，０００ｒｐｍ（周速１８０〜１０８０ｋｍ／ｈ）という高速回転領域を用いた。該回転数領域により、打撃体１は衝撃力の向上と空冷効果と加工硬化を得られ、打撃体１の寿命向上等が図れる。
【００３６】
図１に示す切削ユニット１００では、円筒面に４箇所の四角形突起を備えた十字型の打撃体１を円板１０１の主面に等間隔に４カ所配置した。前記四角形突起が従来工具の切刃部３に相当し、ワークを打撃する。図１からも明らかなように打撃体１の外周の一部（切刃部３）を前記円板１０１の外周より外方に位置させている。
打撃体１を円板１０１の主面に等間隔に４箇所配置しているので、ワークの打撃頻度は（１万回転／分）×４箇所＝４万回／分以上となる。
【００３７】
図１において、支軸１０４と打撃体１との嵌合隙間１０４を７ｍｍ程度とした。該嵌合隙間１０４を設けることにより、回転体１０１が高速回転しているにもかかわらず、打撃体１の切刃部３、支軸１０３に与える衝撃を和らげ、支軸など切削ユニット１００の破損を防止する。
【００３８】
なお、前記打撃体の外形は前記十字型の他に任意に設定してよい。例えば、複数の角部を備えた多角形（正三角形、正四角形、長方形、正五角形、正六角形等）、または円盤形などとしてよい。図６と図７に円盤形と正六角形の打撃体の例を示す。
さらに、前記回転体の形状についても円板型の他に、正多角形など任意の形状としてよい。しかし、当然のことながら回転体の回転バランスが取れていることが必要である。
【００３９】
次に、回転体と打撃体の各部寸法と材質の一実施例を記す。図１に示す切削ユニットの場合、円板１０１の直径は１００ｍｍ，板厚５ｍｍ，材質は機械構造用炭素鋼、支軸１０３は直径１０ｍｍ，材質は機械構造用炭素鋼または炭素工具鋼（ＪＩＳ規格記号／ＳＫ２）、打撃体１の切刃部頂部間距離Ｌは約４０ｍｍ，貫通穴２の直径は１７ｍｍ，切刃部の幅寸法ｗは約１５ｍｍ，切刃部の厚さ寸法ｔは約５ｍｍ，材質は機械構造用炭素鋼（Ｓ４５Ｃ）、または炭素工具鋼（ＳＫ２）、高速度工具鋼（ＳＫＨ２）、ＮｉーＣｒ鋼（ＳＮＣ６３１）、ＮｉーＣｒーＭｏ鋼（ＳＮＣＭ４２０）、ＣｒーＭｏ鋼（ＳＣＭ４３０）、クロム鋼（ＳＣｒ４３０）、機械構造用マンガン鋼（ＳＭｎ４３３）等の内、いずれか一つとした。
【００４０】
図３に示す切削実施例では、円板１０１を３０，０００ｒｐｍで矢印１０７方向に回転させ、打撃体１がワーク（０．８ｍｍ厚さの金属基板）１０５の主面に衝突する衝突速度を１５７ｍ／秒（５６５ｋｍ／時）程度、切削移動速度を５０ｍｍ／秒、切削方向１０８とした。なお、この場合の打撃頻度は（３万回転／分）×４箇所＝１２万回／分となる。
主軸１０２が３０，０００ｒｐｍで高速回転するので打撃体１に大きな遠心力が働く。該遠心力が打撃体１の切刃部３とワーク１０５の衝突面及びその近傍の限られた範囲で衝撃を伴って高速圧縮力が発生し、ワーク１０５は瞬時に，かつ高速で破砕される。切削屑は微小粒状となる。鋭利な切刃部がなくても切削できることを実験により確認している。
【００４１】
なお、ガラス基板、セラミックス基板についても上記加工条件で切削加工できた。また、回路用樹脂配線基板、樹脂成型品等のプラスチックを、円板１０１の回転数１０，０００ｒｐｍ、打撃体の打撃回数１万回／分（回転体に取り付けた打撃体の数は１つ）、切削移動速度を５０ｍｍ／Ｓで加工できることも実験確認した。
【００４２】
上記実施例において、打撃体の打撃速度が約５０ｍ／秒（１８０ｋｍ／時）以上で，打撃回数が約１６７回/秒（毎秒１０，０００/６０回）以上の頻度であれば、ワークに対応して任意に設定してよいことは言うまでもない。
また、打撃体の材質は硬質の固体であれば金属部材以外にも任意に設定してよいことも同様である。
さらに、打撃体の数は２以上の複数であってもよいし、１つのみであってもよい。
さらに、回転体は主面が対向した一対に代え片側のみであってもよい。前記回転体の駆動は一般的なスピンドルモータ等を用いて高速回転させればよい。
【００４３】
本発明装置を構成する打撃体１は従来の切削ツールのように鋭利な切れ刃部を備えるものでない。本発明における切削原理は従来の常識を超えるもので、打撃体１に従来の切削ツールよりはるかに大きな速度を与えることにより、鋭利な切刃部が無くても金属、樹脂、ガラス、セラミックスなど脆性部材まで切削を可能にする。
【００４４】
図８は本発明装置を構成する切削装置６００の断面図を示す。切削装置６００は前記切削ユニット１００を一つの軸上に多数取り付けたものである。従って、切削原理や切削加工条件等は図３の切削例と同様とした。
図８において、符号６００は切削装置、６０１は円板（回転体）、６０２は主軸、６０３は支軸、６０４は嵌合隙間、６０５と６０６はスペーサ、１００は切削ユニットを示す。
【００４５】
図８の切削装置６００は、主面が対向した一対の回転体６０１，６０１間に支軸６０３を架設し，該支軸６０３に打撃体１を回動可能に取り付けてなる切削ユニット１００を複数用意し、前記切削ユニット１００を同一主軸６０２に所定間隔毎に取り付け、前記主軸６０２を高速回転させ前記各打撃体１を約５０ｍ／秒（１８０ｋｍ／時）以上の速度で被切削物（ワーク）に衝突させるようにしたことを特徴とする。
【００４６】
配列する切削ユニット１００の数や配設ピッチ、回転体６０１に配設する打撃体１の数、打撃体１の打撃速度などは加工対象物に対応して任意に設定すればよい。
なお、主軸６０２の支持軸受け構造は片持ち支持、両端支持など任意に設定すればよい。
【００４７】
図１０に示す本発明装置において、加熱炉２０３はプリント配線基板のはんだを溶融させるのに十分な温度範囲、例えば、摂氏２５０度〜３００度に制御した。
加熱炉２０３の内部にはプリント配線基板３００の切削加工面側を打撃して加振する打撃装置４００と、加振によりプリント配線基板３００から離脱、落下した各種回路用部品を加熱炉２０３外へ搬出（搬送）するコンベア２０２とを配設してなる。
【００４８】
前記打撃装置４００は図１に示した切削ユニット１００と概略同様の構成で、寸法を比例縮小させた。ただし、打撃装置４００はプリント配線基板３００等の切削が目的でなく、加振が目的なので、打撃体を備えた回転体の回転数は３０〜３００ｒｐｍ程度の低速回転とした。また、打撃装置４００の構成各部材は当然のことながら、はんだ溶融温度に耐える部材とした。
なお、前記打撃装置４００はもう一方の主面側（大型部品搭載面側）に配置したり、プリント配線基板３００の両側にそれぞれ配置するようにしてもよい。
【００４９】
コンベア２０１、コンベア２０２は金属アタッチメントまたは金属パレット等を付属したチェーンコンベア、金属製メッシュベルトコンベア、耐熱ベルトコンベアなど任意の耐熱搬送手段としてよいことは言うまでもない。（いずれも図示せず。）
プリント配線基板３００を搬送するコンベア２０１は矢印一定方向に間欠駆動される。落下した部品を搬出するコンヘア２０２は矢印方向に連続駆動される。
【００５０】
プリント配線基板３００の一例の要部断面を図１１に示す。図１１ではプリント配線基板３００の一方の主面に回路用部品のリード線付部品（アキシャルリード部品）３０１とリード線付部品（ラジアルリード部品）３０２を、もう一方の主面にチップ部品３０３を取り付けた例を示す。
なお、部品はこの他、抵抗、コンデンサ、トランジスタ、ＩＣ，ＬＳＩ（集積回路）、フライバックトランス、シールドケース付きチューナー、放熱板、コネクタ、ジャンパー線、スルーホール用ハトメ等任意の回路構成部材としてよい。
切削装置６００はプリント配線基板の一方の主面、主面側に突出したリード線、折り曲げた（クノンチした）リード線、チップ部品などを切削加工し、はんだ付け部のはんだが加熱炉２０３で溶融した際、自然にプリント配線基板から離脱（落下）するよう構成している。図１２にプリント配線基板３００の一方の主面側を切削加工した状態の要部断面図を示す。
【００５１】
本発明装置は、切削装置６００の下部に枠状の固定プレート２５１を配置し、上昇，下降する枠型プレート２５０との間でプリント配線基板３００を挟持する。該構成によりプリント配線基板３００は周縁部を挟持、固定され、切削過程で大きく撓んだり、切削残しを生じない。
【００５２】
枠型プレート２５０の一例の平面図を図１３に示す。枠型プレート２５０は図示しないモータ駆動、または流体を用いたシリンダ駆動などによりコンベア２０１によって搬送されてきたプリント配線基板３００を所定位置まで持ち上げる。
【００５３】
次に、回路用基板から部品を取り外す動作について簡単に説明する。まず、コンベア２０１によってプリント配線基板３００が切削装置６００の下部に搬送され停止する。
次に、枠型プレート２５０がプリント配線基板３００を持ち上げ、上昇し、固定プレート２５１との間に挟持する。
続いて、第１の切削装置６００が所定に回転しながらプリント配線基板３００の長手方向に切削移動し（図１０において、左から右方向へ移動、または右から左方向へ移動（図９の矢印Ｘ方向））、プリント配線基板３００の一方の主面または取り付けた部品の内、少なくとも一方の第１の部位を切削する。
その後、プリント配線基板３００は下降し、所定ピッチだけ搬送され第２の切削装置位置の下部に搬送される。以下、前記と同様の動作でプリント配線基板３００の第２の部位が切削加工される。なお、必要に応じ、プリント配線基板３００の未切削部位に第３、第４の切削加工が施される。（図示せず。）
プリント配線基板３００のほぼ全域にわたって切削加工を終えた後、プリント配線基板３００は再びコンベア２０１によって加熱炉２０３内に搬送される。
加熱炉２０３内に搬送されたプリント配線基板３００は半田が加熱、溶融され、部品がコンベア２０２上に自然落下（離脱）する。デュアルインライン型や、クワッド型のようにリード線を多数有する部品は自然落下しにくい。これらを打撃装置４００によってプリント配線基板３００に加振し強制落下させる。
その後、プリント配線基板３００は加熱炉２０３外へ搬出される。コンベア２０２上に落下した部品も同様に加熱炉２０３外へ搬出される。コンベア２０１、コンベア２０２の右端終端部近傍にはプリント配線基板受け箱と部品受け箱とがそれぞれ配置されており、その中に落下、回収される。（図示せず。）
なお、上記実施例において、加熱炉の長さや加熱方式、加熱方向など任意に設定してよいことは言うまでもない。例えば、断面形状が環状のトンネル型加熱炉、またはプリント配線基板を一方向から加熱する等としてよい。
【００５４】
また、前記枠体プレートと固定プレートについても任意の枠形状としてよい。さらに、枠体プレートと固定プレートとを、それぞれ流体シリンダによって駆動する四つの可動辺で構成し、プリント配線基板に応じて枠形状の変更が可能な枠体としてもよい。（図示せず。）
テレビジョン受信機などにおいて、プリント配線基板はシャーシーレールと呼ばれる枠状部材上に搭載、固定されている。前記シャーシーレールは樹脂成型品または金属部材等で形成される。このようなプリント配線基板のリサイクル処理は枠状部材を付属したままで処理すればよい。前記切削装置６００は枠状部材ごとプリント配線基板の主面または部品の少なくとも一方を切削処理する。
【００５５】
さらに、切削装置６００を加熱領域内に配置し、回路用基板を搬送する基板搬送手段と、前記回路用基板または前記回路用基板にとりつけた部品の内、少なくとも一方を切削加工する切削加工手段と、前記回路用基板を加熱する加熱手段と、前記回路用基板から離脱した前記回路用部品を搬送する部品搬送手段とからなり、前記切削加工手段は、回転体の主面に立設した支軸に打撃体を回動可能に取り付け、前記回転体を高速回転させ前記打撃体を臨界衝撃速度以上の速度で前記回路用基板または前記部品の少なくとも一方に衝突させるようにしてもよい。
この場合、加熱領域内に配置していた打撃装置４００は併設してもよいし、省略して切削装置６００で代替するようにしてもよい。
【００５６】
【発明の効果】
以上のように本発明は、廃棄する回路用基板から回路用部品を効率よく自動的に取り外し、回路用基板と回路用部品のリサイクル率を向上させる。
また、回路用基板の種類たとえば樹脂基板、ガラスエポキシ樹脂基板、セラミックス基板、金属基板等に応じて都度、切削工具の種類や加工条件、切削装置の変更を不要にする。
また、切削装置の寿命と信頼性の向上に寄与し、環境保全、資源の有効活用に貢献する。
【図面の簡単な説明】
【図１】本発明の一実施例における回路用基板から部品を取り外す装置を構成する切削ユニットの断面図
【図２】図１を切断線Ｓ１ーＳ１から見た断面図
【図３】図１の切削ユニットを用いて回路用基板または部品の内、少なくとも一方を切削している状態の断面図
【図４】図１の切削ユニットを構成する打撃体の正面図
【図５】図４を切断線Ｓ３ーＳ３で切断した断面図
【図６】図１を構成するもう一つの打撃体の正面図
【図７】図１を構成するもう一つの打撃体の正面図
【図８】本発明の一実施例における回路用基板から部品を取り外す装置を構成する切削装置の断面図
【図９】本発明の一実施例における回路用基板から部品を取り外す装置の概念の要部平面図
【図１０】本発明の一実施例における回路用基板から部品を取り外す装置の概念の要部断面図
【図１１】本発明の説明に用いる回路用基板（プリント配線基板）の要部断面図
【図１２】図１１の回路用基板（プリント配線基板）の一方の主面側を切削加工した状態の要部断面図
【図１３】本発明の一実施例における回路用基板から部品を取り外す装置を構成する枠型プレートの平面図
【符号の説明】
１、１Ａ、１Ｂ打撃体
２、２Ａ、２Ｂ穴（貫通穴）
３、３Ａ、３Ｂ切刃部
１００切削ユニット
１０１、６０１円板（回転体）
１０２貫通穴
１０３、６０３支軸
１０４、６０４隙間
１０７回転方向
１０８切削方向（移動方向）
２００回路用基板から部品を取り外す装置
２０１コンベア（回路用基板搬送手段）
２０２コンベア（離脱部品搬送手段）
２０３加熱炉
２０４ヒーター
２０５駆動モーター
２０６駆動ネジ
２５０枠型プレート
２５１固定プレート
３００回路用基板（プリント配線基板）
３０１リード線付部品（アキシャルリード部品）
３０２リード線付部品（ラジアルリード部品）
３０３チップ部品
３０４はんだ（半田）
４００打撃装置
６００切削装置
６０２主軸
６０５、６０６スペーサ[0003]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for removing (detaching) various circuit components attached to a circuit board (printed wiring board).
[0004]
[Prior art]
The purpose of recycling circuit boards and circuit components is to remove (remove) various circuit components mounted on the circuit board by heating and melting the circuit board above the solder melting temperature. A method has been proposed in which at least one of the circuit board and the circuit component is vibrated to remove the circuit component.
[0005]
Further, when a circuit component having an external connection terminal (lead wire) is soldered and mounted on a circuit board, the external connection terminal (lead wire) protruding from one main surface of the circuit board and Generally, the external connection terminal bent (clinched) on one main surface side of the circuit board is first cut, and then the solder is melted to remove the circuit component.
[0006]
Various circuit components include resistors, capacitors, transistors, ICs, LSIs (integrated circuits), flyback transformers, tuners with shield cases, heat sinks, connectors, jumper wires, eyelets for through holes, etc. Good. The types of components with lead wires (axial lead components, radial lead components), chip components, etc. may be arbitrary.
[0007]
When cutting the external connection terminal (lead wire), a cutting method is used in which a tool such as a nipper or a disk-shaped metal saw or a disk-shaped thin grindstone is rotated by 1,800 rpm to 3,000 rpm.
[0008]
[Problems to be solved by the invention]
The principle of cutting the lead wire using a cutting tool such as a metal saw is that the cutting edge portion of the tool is pressed strongly against the workpiece (work), and cutting is performed by causing a continuous shear fracture to the workpiece. It is.
When the cutting edge portion is strongly pressed against the workpiece, the frictional heat at the cutting site is large, and wear of the cutting edge increases due to embrittlement and softening of the cutting edge due to heat. Cutting speed is greatly reduced and limited by wear of the cutting edge.
In addition, since the cutting edge portion bites into the workpiece, a large rigidity is required for holding the tool and holding the workpiece, and a large holding mechanism and a high equipment cost are required.
[0009]
Cutting using a disk-shaped grindstone is performed by a small small continuous shearing with a cutting edge of abrasive grains. The frictional heat at the cutting site is large because the corners (cutting edges) of the abrasive grains are not so sharp and the peripheral speed of the grinder is relatively large.
In order to ensure the life of each tool, it is necessary to appropriately suppress the temperature of the cutting site, and the cutting speed is limited.
[0010]
A process of cutting at least one of the main surface of the circuit board or various circuit components attached to the circuit board, a process of heating the circuit board, and exciting at least one of the circuit board or the circuit parts It is desired to propose an apparatus for removing a component from a circuit board, which includes a process for performing the process and a process for transporting the circuit component separated from the circuit board.
[0011]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention provides a substrate transfer means for transferring a circuit board and a cutting means for cutting at least one of the main surface of the circuit board or a component attached to the circuit board. Heating means for heating the circuit board, vibration means for exciting at least one of the circuit board or the component, and component conveying means for conveying the circuit component detached from the circuit board The cutting means comprises a striking body rotatably attached to a support shaft standing on the main surface of the rotating body, and the rotating body is rotated at a high speed to cause the striking body to move to a critical impact speed (about 50 m / second ( 180 km / hr))) It is configured to collide with at least one of the main surface of the circuit board and the component at a speed of at least.
[0012]
In addition, after cutting at least one of the main surface of the circuit board or the component attached to the circuit board, the circuit board is heated to melt the solder, thereby at least one of the circuit board or the component. In which the component attached to the circuit board is detached, and the cutting means rotates the first impacting body on a support shaft erected on the main surface of the first rotating body. The first rotating body is rotated at a high speed so that the first impacting body collides with the main surface of the circuit board at a speed higher than a critical impact speed (about 50 m / sec (180 km / hr)). In addition, the vibration means attaches the second impacting body to a support shaft erected on the main surface of the second rotating body so as to be able to rotate, and the second rotating body is rotated at 30 to 300 rpm (rotation / min). And rotating the second striking body with a circuit board or circuit part. And so as to collide with at least one of.
[0013]
Furthermore, cutting at least one of the main surface of the circuit board or the components attached to the circuit board and melting the solder by heating the circuit board are performed in parallel. In this method, the component attached to the circuit board is detached, and the cutting means rotatably attaches the impacting body to a support shaft standing on the main surface of the rotating body, and rotates the rotating body at high speed. The impacting body is made to collide with at least one of the main surface of the circuit board and the component at a speed higher than the critical impact speed (about 50 m / sec (180 km / hr)).
[0014]
Furthermore, the cutting principle of a workpiece (workpiece) is based on the theory of plastic wave that generates a plastic wave when a high-speed tensile force exceeding the critical impact velocity (critical impact velocity) is applied and breaks immediately at the applied force, or a high-speed compression force. When applied, the theory is that a plastic wave is generated, a very large stress is generated instantaneously, and the applied edge breaks with a small strain (a phenomenon similar to brittleness). Specifically, instead of a conventional tool having a cutting edge, an impacting body made of a hard solid such as metal is made to collide with a workpiece (workpiece / circuit board) at a high speed and with a high frequency, and the impact energy causes a plastic wave. Based on the principle of instantly destroying and removing the collision site.
That is, when an impacting body that performs high-speed circular motion (a speed of about 50 m / sec (180 Km / h) or more) collides with a workpiece and reflects (repels), high-speed compression generated with an impact, or high-speed tension caused by friction, The cutting method was based on the principle of instantaneously crushing (breaking) the workpiece surface into fine particles or fine pieces within a very limited range in the vicinity of and near the impacted part and the workpiece by high-speed shearing.
[0015]
In order to generate a plastic wave, the speed at which the impacting body collides with the workpiece was set in a range of about 50 m / sec (180 Km / h) to 300 m / sec (1,080 Km / h).
In terms of the peripheral speed of the disc, this corresponds to the rotation of a disc having a diameter of 100 mm at a rotational speed of 10,000 rpm to 60,000 rpm.
When cutting resin molded products, printed wiring boards, etc., the impacting body (hard solid) is made to collide with the workpiece at a speed of about 50 m / sec (180 km / hr) or more and at a frequency of about 150 times / sec or more. The surface was crushed.
In the case of cutting of metal such as carbon steel for machine structure and cold rolled steel sheet, glass, etc., the striking body has a speed of about 150 m / sec (540 km / hr) or more and a frequency of about 1,800 times / sec. Thus, the workpiece surface is crushed by colliding with the workpiece.
[0016]
The fitting gap between the support shaft for supporting the striking body and the through hole of the striking body was 2 mm or more, preferably the fitting gap was about 5 to 10 mm. The fitting gap needs to be set large in response to an increase in impact speed of the impacting body. The fitting gap in the present invention is generally much larger than the JIS standard clearance value that defines the fitting state between the shaft and the bearing, and is two to three digits higher.
[0017]
Thus, the cutting principle of the present invention is different from the conventional cutting principle. The conventional cutting principle is that the cutting edge of a cutting tool (tool) is made to collide with the workpiece at a low speed (maximum of about 10 m / sec or less), and the workpiece undergoes elastic deformation and then deforms sequentially from plastic deformation to fracture. A relatively wide area is destroyed.
Moreover, the impacting body in the present invention does not have a sharp cutting edge portion like a conventional cutting tool (tool).
[0018]
The features of the cutting principle in the present invention are:
(1) Due to the principle of crushing (cutting) by high-speed compression and high-speed tension exceeding the critical impact speed at the time of collision between the impacting body and the work, generation of frictional heat at the cutting site in the work is extremely small. Further, the impacting body is rapidly naturally cooled by high-speed motion, and the temperature rise of the impacting body itself is extremely small.
(2) A cutting tool (tool) that rotates, reciprocates, or linearly moves is highly worn. However, in the impacting body of the present invention, the impacting body undergoes work hardening due to the collision with the workpiece, and the impacting body is hardened with use and the wear resistance is increased.
(3) The cutting principle of the present invention has low cutting resistance and frictional resistance. As a result, it is not necessary to firmly hold and fix the workpiece during cutting. Further, it is not necessary to firmly construct the support shaft for supporting the impacting body, the rigidity of the rotating body and the main shaft rotating at high speed, the rigidity of the rotating body main shaft bearing, and the like.
(4) Moreover, even if it is the workpiece | work comprised by the different member (for example, a metal, a resin molded product, glass, a ferrite, etc.), it can cut continuously with the same cutting device.
[0019]
As described above, the present invention efficiently removes circuit components from the circuit board and improves the recycling rate of the circuit board and circuit components.
In addition, the cutting means has a simple structure, which can extend the life and greatly improve the reliability. Furthermore, there is no need to consider a mixture of different materials of the workpiece, for example, a phenol resin substrate, a glass epoxy substrate, a ceramic substrate, a metal substrate, etc. in the cutting process.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a substrate transfer means for transferring a circuit board and a cutting means for cutting at least one of a main surface of the circuit board or a component attached to the circuit board. The cutting means attaches the impacting body to a support shaft standing on the main surface of the rotating body so that the impacting body can rotate, and rotates the rotating body at a high speed so that the impacting body is at a speed higher than the critical impact speed. A device for removing a component from a circuit board characterized in that the component is made to collide with at least one of the main surface of the substrate or the circuit component, and wear of the cutting edge portion is caused by impact cutting using centrifugal force. This can reduce the life of the cutting device and improve the reliability. Moreover, it enables high-speed cutting of lead wires, chip parts, etc. regardless of the type of circuit board.
[0021]
Further, the second invention is a substrate conveying means for conveying a circuit board, a cutting means for cutting at least one of a main surface of the circuit board or a component attached to the circuit board, Heating means for heating the circuit board, wherein the cutting means is attached to the support shaft erected on the main surface of the rotating body so as to be able to rotate, and the rotating body is rotated at a high speed so that the impacting body is rotated. A device that removes a component from a circuit board characterized by causing it to collide with at least one of the main surface of the circuit board or the component at a speed equal to or higher than a critical impact velocity. Cutting lead wires at high speed, and circuit components can be removed efficiently.
[0022]
Further, the third aspect of the present invention is a substrate transfer means for transferring a circuit board; a cutting means for cutting at least one of a main surface of the circuit board or a component attached to the circuit board; The heating means for heating the circuit board and the component conveying means for conveying the circuit component separated from the circuit board, and the cutting means is a striking body on a spindle erected on the main surface of the rotating body. And the rotating body is rotated at a high speed so that the impacting body collides with at least one of the main surface of the circuit board and the component at a speed equal to or higher than a critical impact speed. It is a device that removes components from the circuit board, and the removed circuit components can be efficiently collected.
[0023]
Furthermore, the fourth invention is a substrate conveying means for conveying a circuit board, a cutting means for cutting at least one of a main surface of the circuit board or a component attached to the circuit board, The heating means for heating the circuit board, the vibration means for vibrating at least one of the circuit board or the component, and the detachable component conveying means for conveying the circuit component detached from the circuit board. The cutting means attaches a striking body to a support shaft erected on the main surface of the rotating body, and rotates the rotating body at a high speed to rotate the striking body at a speed equal to or higher than a critical impact speed. A device for removing a component from a circuit board, wherein the component is made to collide with at least one of the main surface of the circuit and the component, and the circuit component and the circuit component are efficiently removed. Recycling rate can be improved.
[0024]
Furthermore, the fifth invention is directed to the circuit by heating at least one of a main surface of the circuit board or a component attached to the circuit board and then melting the solder by heating the circuit board. The cutting means is configured to rotatably attach an impacting body to a support shaft provided upright on a main surface of a rotating body, and rotate the rotating body at a high speed to perform the impacting. A method of removing a component from a circuit board, wherein the body is caused to collide with at least one of the main surface of the circuit board or the component at a speed equal to or higher than a critical impact speed. The parts can be removed and collected efficiently.
[0025]
Further, according to a sixth aspect of the present invention, after cutting at least one of the main surface of the circuit board or the components attached to the circuit board, the circuit board is heated to melt the solder and the circuit board. Alternatively, it is a method of detaching a component attached to the circuit board by exciting at least one of the components, wherein the cutting means rotates the impacting body on a support shaft erected on the main surface of the rotating body. From the circuit board, wherein the circuit board is mounted so that the rotating body can be rotated at a high speed so that the impacting body collides with the main surface of the circuit board or at least one of the components at a speed higher than a critical impact speed. This is a method of removing components, and circuit component removal and recovery from a circuit board can be performed efficiently, and the recycling rate of circuit boards and circuit components is improved.
[0026]
Further, according to a seventh aspect of the present invention, at least one of a main surface of the circuit board or a part attached to the circuit board is cut in the heating region, and the solder is melted by heating the circuit board. In parallel with this, the component attached to the circuit board is detached, and the cutting means can rotate the striking body on a spindle erected on the main surface of the rotating body. A component from a circuit board, wherein the rotating body is rotated at a high speed so that the impacting body collides with at least one of the main surface of the circuit board and the component at a speed equal to or higher than a critical impact speed. The circuit component can be removed and collected from the circuit board efficiently, and the recycling rate of the circuit board and the circuit component can be improved.
[0027]
Further, the eighth aspect of the present invention is a substrate transfer means for transferring a circuit board, a cutting means for cutting at least one of a main surface of the circuit board or a component attached to the circuit board, The heating means for heating the circuit board and the detachable part conveying means for conveying the circuit component separated from the circuit board, and the cutting means is provided on a spindle erected on the main surface of the rotating body. A striking body is rotatably mounted, the rotating body is rotated at a high speed so that the striking body collides with at least one of the main surface of the circuit board and the component at a speed equal to or higher than a critical impact speed, and the cutting This is an apparatus for removing components from a circuit board characterized in that the processing means is arranged in the heating region, and the overall length of the apparatus can be shortened. In addition, the circuit components are efficiently removed, and the recycling rate of the circuit board and the circuit components is improved.
[0028]
【Example】
Hereinafter, an apparatus for removing components from a circuit board according to an embodiment of the present invention will be described with reference to FIGS.
[0029]
(Example)
1 is a cross-sectional view of a cutting unit constituting an apparatus for removing a component from a circuit board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of FIG. 1 viewed from the cutting line S1-S1, and FIG. FIG. 4 is a cross-sectional view of a state in which at least one of the main surface or parts of the circuit board is being cut using the cutting unit, FIG. 4 is a front view of an impacting body constituting the cutting unit of FIG. 4 is a cross-sectional view taken along cutting line S3-S3, FIGS. 6 and 7 are front views of another striking body constituting FIG. 1, and FIG. 8 is a diagram showing components from a circuit board according to an embodiment of the present invention. 9 is a cross-sectional view of a cutting device constituting the device to be removed, FIG. 9 is a plan view of the main part of the concept of a device for removing components from a circuit board in one embodiment of the present invention, and FIG. 10 is a circuit board in one embodiment of the present invention. Fig. 11 is a cross-sectional view of the main part of the concept of a device for removing parts from the machine. 12 is a cross-sectional view of a circuit board (printed wiring board) used for the description of FIG. 12, FIG. 12 is a cross-sectional view of a principal part in a state where one main surface of the printed wiring board is cut, and FIG. The top view of the frame type | mold plate which comprises the apparatus which removes components from a board | substrate is shown.
[0030]
9 and 10, an apparatus 200 for removing components from a circuit board includes a conveyor 201 (circuit board transfer means) for transferring a circuit board (printed wiring board) 300 and a circuit board 300 being lifted from the conveyor 201. , A cutting device 600 (cutting process) for cutting at least one of the means for holding and fixing the peripheral edge of the circuit board 300 and the main surface of the circuit board 300 or various circuit components attached to the circuit board 300 Means), a heating furnace 203 (heating means) for heating the circuit board 300 to a solder melting temperature or higher, and an impact device 400 (vibration means) for exciting at least one of the circuit board 300 or the components. , And a conveyor 202 (detached component conveying means) for conveying the circuit component separated from the circuit board 300.
[0031]
9 and 10, reference numeral 204 denotes a heater constituting the heating furnace 203, 250 denotes a frame plate, 251 denotes a fixed plate, 205 denotes a driving motor of the cutting apparatus 600, and 206 denotes a driving screw.
[0032]
The cutting device 600 rotatably attaches an impacting body to a spindle erected on the main surface of the rotating body, rotates the rotating body at a high speed, and rotates the impacting body at a speed higher than the critical impact speed. It is made to collide with at least one of the main surface or the said components.
Further, the device of the present invention is configured such that the cutting device 600 is arranged at a plurality of two or more locations, and each cutting device cuts parts mounted on different main surface positions or different main surface positions of the printed wiring board.
Furthermore, as shown in FIG. 9, the cutting device 600 is driven back and forth in the direction of the arrow Y by a drive motor 205 such as a pulse motor and a drive screw 206 such as a ball screw so that the cutting position can be arbitrarily changed. Moreover, the cutting device 600 can move to an arbitrary place in a horizontal plane by adopting a configuration in which left and right driving is performed in the arrow X direction.
[0033]
Note that the cutting device 600 may be provided at only one place. In that case, in order to be able to cut almost the entire area of the printed wiring board 300, it is necessary to sequentially move the cutting device 600 in the width direction of the printed wiring board 300. That is, the printed wiring board 300 may be sequentially pitched in a direction (arrow Y direction) perpendicular to the direction in which the printed wiring board 300 is conveyed by the conveyor 201.
[0034]
Next, the cutting device 600 and the cutting unit 100 constituting the cutting device 600 will be described.
As shown in FIGS. 1 to 3, the cutting unit 100 according to the present invention has a support shaft 103 installed between a pair of discs (rotating bodies) 101 and 101 whose main surfaces are opposed to each other. 1 is rotatably attached, the pair of discs (rotating bodies) 101, 101 are rotated at a high speed, and the impacting body 1 (hard solid) is moved at a speed of about 50 m / sec (180 km / hr) or more and about It is configured to collide with at least one of the main surface or components of the printed wiring board 300 at an impact frequency of 167 times / second (10,000 / 60 times per second) or more. Note that the rotational speed allows a variation of about ± 10% due to fluctuations in the power supply voltage and other reasons.
[0035]
The impact speed of the impacting body 1 against the workpiece (workpiece / circuit board or circuit component in the present invention) naturally corresponds to the rotational speed of the pair of disks (rotating bodies). In the present embodiment, a high-speed rotation region of 10,000 to 60,000 rpm (peripheral speed of 180 to 1080 km / h) was used for a pair of disks (rotating bodies). Due to the rotation speed region, the impacting body 1 can obtain an improvement in impact force, an air cooling effect and work hardening, and an improvement in the life of the impacting body 1 can be achieved.
[0036]
In the cutting unit 100 shown in FIG. 1, four cross-shaped impacting bodies 1 having four rectangular protrusions on a cylindrical surface are arranged at equal intervals on the main surface of the disc 101. The quadrangular protrusion corresponds to the cutting edge 3 of a conventional tool and strikes the workpiece. As is clear from FIG. 1, a part of the outer periphery of the impacting body 1 (the cutting blade portion 3) is positioned outward from the outer periphery of the disc 101.
Since the impacting body 1 is arranged at four locations on the main surface of the disc 101 at equal intervals, the impact frequency of the workpiece is (10,000 rotations / minute) × 4 locations = 40,000 times / minute or more.
[0037]
In FIG. 1, the fitting gap 104 between the support shaft 104 and the impacting body 1 is about 7 mm. By providing the fitting gap 104, the impact applied to the cutting blade portion 3 and the support shaft 103 of the impacting body 1 is reduced despite the rotating body 101 rotating at a high speed, and the cutting unit 100 such as the support shaft is damaged. To prevent.
[0038]
The outer shape of the impacting body may be arbitrarily set in addition to the cross shape. For example, it may be a polygon having a plurality of corners (regular triangle, regular square, rectangle, regular pentagon, regular hexagon, etc.), disk shape, or the like. FIG. 6 and FIG. 7 show examples of disc-shaped and regular hexagonal impact bodies.
Further, the shape of the rotating body may be an arbitrary shape such as a regular polygon in addition to the disk shape. However, as a matter of course, it is necessary that the rotating body be balanced in rotation.
[0039]
Next, an example of the dimensions and materials of each part of the rotating body and the impacting body will be described. In the case of the cutting unit shown in FIG. 1, the diameter of the disc 101 is 100 mm, the plate thickness is 5 mm, the material is carbon steel for machine structure, the support shaft 103 is 10 mm in diameter, and the material is carbon steel for machine structure or carbon tool steel (JIS standard). Symbol / SK2), the distance L between the tops of the cutting blades of the impacting body 1 is about 40 mm, the diameter of the through hole 2 is 17 mm, the width dimension w of the cutting edge is about 15 mm, and the thickness dimension t of the cutting edge is about 5 mm. , Material is carbon steel for machine structure (S45C), carbon tool steel (SK2), high speed tool steel (SKH2), Ni-Cr steel (SNC631), Ni-Cr-Mo steel (SNCM420), Cr-Mo steel Any one of (SCM430), chromium steel (SCr430), manganese steel for mechanical structure (SMn433), etc. was used.
[0040]
In the cutting embodiment shown in FIG. 3, the disc 101 is rotated at 30,000 rpm in the direction of the arrow 107, and the impact speed at which the impacting body 1 collides with the main surface of the workpiece (0.8 mm thick metal substrate) 105 is 157 m. Per second (565 km / hour), the cutting movement speed was 50 mm / second, and the cutting direction was 108. In this case, the hit frequency is (30,000 revolutions / minute) × 4 places = 120,000 times / minute.
Since the main shaft 102 rotates at a high speed of 30,000 rpm, a large centrifugal force acts on the impacting body 1. The centrifugal force generates a high-speed compressive force with a shock within a limited range of the collision surface between the cutting edge portion 3 of the impacting body 1 and the workpiece 105 and the vicinity thereof, and the workpiece 105 is instantaneously and rapidly crushed. . The cutting waste becomes finely granular. Experiments have confirmed that cutting is possible without a sharp cutting edge.
[0041]
In addition, the glass substrate and the ceramic substrate could be cut under the above processing conditions. Also, plastic such as a resin wiring board for a circuit, a resin molded product, and the like, the rotation speed of the disc 101 is 10,000 rpm, and the number of impacts of the impacting body is 10,000 times / minute (the number of impacting bodies attached to the rotating body is 1). The experiment confirmed that the cutting movement speed can be processed at 50 mm / S.
[0042]
In the above embodiment, if the impact speed of the impacting body is about 50 m / second (180 km / hour) or more and the number of impacts is about 167 times / second (10,000 / 60 times per second), it corresponds to the workpiece. Needless to say, it may be set arbitrarily.
Similarly, if the material of the impacting body is a hard solid, it may be set arbitrarily other than the metal member.
Furthermore, the number of impact bodies may be two or more, or may be only one.
Further, the rotating body may be only one side instead of a pair of opposed main surfaces. The rotating body may be driven at a high speed using a general spindle motor or the like.
[0043]
The impacting body 1 constituting the device of the present invention does not include a sharp cutting edge portion as in a conventional cutting tool. The cutting principle in the present invention is beyond conventional common sense. By giving the impacting body 1 a much higher speed than the conventional cutting tool, brittleness such as metal, resin, glass, ceramics, etc. even without a sharp cutting edge. Allows cutting to part.
[0044]
FIG. 8 shows a cross-sectional view of a cutting device 600 constituting the device of the present invention. The cutting device 600 is one in which a large number of the cutting units 100 are mounted on one shaft. Therefore, the cutting principle, cutting process conditions, and the like are the same as those in the cutting example of FIG.
In FIG. 8, reference numeral 600 denotes a cutting device, 601 denotes a disc (rotary body), 602 denotes a main shaft, 603 denotes a support shaft, 604 denotes a fitting gap, 605 and 606 denote spacers, and 100 denotes a cutting unit.
[0045]
8 includes a plurality of cutting units 100 in which a support shaft 603 is installed between a pair of rotating bodies 601 and 601 whose main surfaces face each other, and the impacting body 1 is rotatably attached to the support shaft 603. The cutting unit 100 is prepared and attached to the same main shaft 602 at predetermined intervals, the main shaft 602 is rotated at a high speed, and each impacting body 1 is cut at a speed of about 50 m / sec (180 km / hr) or more. It is characterized by being made to collide with.
[0046]
The number and arrangement pitch of the cutting units 100 to be arranged, the number of striking bodies 1 disposed on the rotating body 601, the striking speed of the striking body 1 and the like may be arbitrarily set according to the workpiece.
Note that the support bearing structure of the main shaft 602 may be arbitrarily set such as cantilever support or both-end support.
[0047]
In the apparatus of the present invention shown in FIG. 10, the heating furnace 203 is controlled to a temperature range sufficient to melt the solder of the printed wiring board, for example, 250 degrees Celsius to 300 degrees Celsius.
Inside the heating furnace 203, a striking device 400 that strikes and vibrates the cut surface side of the printed wiring board 300, and various circuit components that are detached from the printed wiring board 300 by vibration and fall out of the heating furnace 203. A conveyor 202 for carrying out (conveying) is disposed.
[0048]
The striking device 400 has substantially the same configuration as the cutting unit 100 shown in FIG. However, since the striking device 400 is not intended to cut the printed wiring board 300 or the like and is intended to vibrate, the rotational speed of the rotating body provided with the striking body was set to a low speed of about 30 to 300 rpm. In addition, as a matter of course, each member constituting the striking device 400 is a member that can withstand the solder melting temperature.
The striking device 400 may be disposed on the other main surface side (large component mounting surface side) or on both sides of the printed wiring board 300.
[0049]
Needless to say, the conveyor 201 and the conveyor 202 may be any heat resistant conveying means such as a chain conveyor with a metal attachment or a metal pallet, a metal mesh belt conveyor or a heat resistant belt conveyor. (Neither shown)
The conveyor 201 that conveys the printed wiring board 300 is intermittently driven in a constant arrow direction. The hair 202 for carrying out the dropped parts is continuously driven in the direction of the arrow.
[0050]
FIG. 11 shows a cross-section of the main part of an example of the printed wiring board 300. In FIG. 11, a lead wire component (axial lead component) 301 and a lead wire component (radial lead component) 302 of a circuit component are provided on one main surface of a printed wiring board 300, and a chip component 303 is provided on the other main surface. An example of installation is shown.
In addition, the components may be any circuit components such as resistors, capacitors, transistors, ICs, LSIs (integrated circuits), flyback transformers, tuners with shield cases, heat sinks, connectors, jumper wires, and through holes. .
The cutting device 600 cuts one main surface of the printed circuit board, a lead wire protruding toward the main surface, a bent lead wire, a chip component, etc., and the solder in the soldering portion is melted in the heating furnace 203. When it is done, it is configured to be released (dropped) from the printed wiring board. FIG. 12 is a cross-sectional view of a main part in a state where one main surface side of the printed wiring board 300 is cut.
[0051]
In the apparatus of the present invention, a frame-shaped fixing plate 251 is disposed below the cutting device 600, and the printed wiring board 300 is sandwiched between the frame-type plate 250 that moves up and down. With this configuration, the printed circuit board 300 is sandwiched and fixed at the peripheral edge, and does not bend greatly during the cutting process or leave no cutting.
[0052]
A plan view of an example of the frame plate 250 is shown in FIG. The frame plate 250 lifts the printed wiring board 300 conveyed by the conveyor 201 to a predetermined position by a motor drive (not shown) or a cylinder drive using a fluid.
[0053]
Next, the operation of removing the component from the circuit board will be briefly described. First, the printed wiring board 300 is conveyed to the lower part of the cutting device 600 by the conveyor 201 and stopped.
Next, the frame-type plate 250 lifts the printed wiring board 300, rises, and sandwiches it with the fixed plate 251.
Subsequently, the first cutting device 600 moves in the longitudinal direction of the printed wiring board 300 while rotating at a predetermined position (in FIG. 10, the left-to-right movement or the right-to-left movement (the arrow in FIG. 9). X direction)), cutting at least one first portion of one main surface of the printed wiring board 300 or an attached component.
Thereafter, the printed wiring board 300 is lowered, conveyed by a predetermined pitch, and conveyed to the lower part of the second cutting apparatus position. Thereafter, the second portion of the printed wiring board 300 is cut by the same operation as described above. In addition, the 3rd, 4th cutting process is given to the uncut part of the printed wiring board 300 as needed. (Not shown)
After finishing the cutting over almost the entire area of the printed wiring board 300, the printed wiring board 300 is again conveyed into the heating furnace 203 by the conveyor 201.
The printed wiring board 300 conveyed into the heating furnace 203 is heated and melted by the solder, and the components naturally fall (separate) on the conveyor 202. Parts with a large number of lead wires, such as the dual in-line type and quad type, are unlikely to fall naturally. These are vibrated and forcedly dropped onto the printed wiring board 300 by the striking device 400.
Thereafter, the printed wiring board 300 is carried out of the heating furnace 203. Similarly, parts dropped on the conveyor 202 are also carried out of the heating furnace 203. A printed wiring board receiving box and a component receiving box are respectively arranged in the vicinity of the right end terminal portion of the conveyor 201 and the conveyor 202, and dropped and collected therein. (Not shown)
In the above embodiment, it goes without saying that the length of the heating furnace, the heating method, the heating direction and the like may be arbitrarily set. For example, a tunnel-type heating furnace having an annular cross section or a printed wiring board may be heated from one direction.
[0054]
Further, the frame plate and the fixed plate may have any frame shape. Furthermore, the frame body plate and the fixed plate may be configured by four movable sides that are each driven by a fluid cylinder, and the frame shape may be changed according to the printed wiring board. (Not shown)
In a television receiver or the like, a printed wiring board is mounted and fixed on a frame-like member called a chassis rail. The chassis rail is formed of a resin molded product or a metal member. Such a printed wiring board recycling process may be performed with the frame-like member attached. The cutting device 600 cuts at least one of the main surface and parts of the printed wiring board together with the frame-shaped member.
[0055]
Furthermore, the cutting device 600 is disposed in the heating region, and the substrate transporting means for transporting the circuit board, and the cutting means for cutting at least one of the circuit board or the components attached to the circuit board, The heating means for heating the circuit board and the component conveying means for conveying the circuit component separated from the circuit board, wherein the cutting means is a support shaft erected on the main surface of the rotating body. The impacting body may be rotatably attached to the rotating body, and the rotating body may be rotated at a high speed to cause the impacting body to collide with at least one of the circuit board and the component at a speed equal to or higher than a critical impact speed.
In this case, the striking device 400 arranged in the heating region may be provided side by side or may be omitted and replaced with the cutting device 600.
[0056]
【The invention's effect】
As described above, the present invention efficiently and automatically removes circuit components from the circuit substrate to be discarded, and improves the recycling rate of the circuit substrate and circuit components.
Further, it is not necessary to change the type of cutting tool, the processing conditions, and the cutting device each time depending on the type of circuit board, such as a resin substrate, a glass epoxy resin substrate, a ceramic substrate, or a metal substrate.
In addition, it contributes to the improvement of the life and reliability of cutting equipment, and contributes to environmental conservation and effective use of resources.
[Brief description of the drawings]
FIG. 1 is a sectional view of a cutting unit constituting an apparatus for removing a component from a circuit board according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of FIG. 1 as viewed from section line S1-S1.
3 is a cross-sectional view showing a state in which at least one of a circuit board or components is being cut using the cutting unit of FIG.
4 is a front view of an impacting body constituting the cutting unit of FIG. 1. FIG.
FIG. 5 is a cross-sectional view of FIG. 4 taken along section line S3-S3.
6 is a front view of another striking body constituting FIG. 1. FIG.
7 is a front view of another striking body constituting FIG. 1. FIG.
FIG. 8 is a cross-sectional view of a cutting device constituting an apparatus for removing a component from a circuit board in an embodiment of the present invention.
FIG. 9 is a plan view of a main part of a concept of an apparatus for removing a component from a circuit board in one embodiment of the present invention.
FIG. 10 is a cross-sectional view of an essential part of a concept of an apparatus for removing a component from a circuit board in one embodiment of the present invention.
FIG. 11 is a cross-sectional view of a principal part of a circuit board (printed wiring board) used for explaining the present invention.
12 is a cross-sectional view of a main part in a state where one main surface side of the circuit board (printed wiring board) of FIG. 11 is cut.
FIG. 13 is a plan view of a frame-type plate constituting an apparatus for removing components from a circuit board according to an embodiment of the present invention.
[Explanation of symbols]
1, 1A, 1B
2, 2A, 2B holes (through holes)
3, 3A, 3B Cutting edge
100 cutting unit
101,601 disc (rotary body)
102 Through hole
103, 603
104, 604 gap
107 direction of rotation
108 Cutting direction (moving direction)
200 Device for removing components from circuit boards
201 Conveyor (circuit board conveying means for circuit)
202 Conveyor (Means for conveying detached parts)
203 Heating furnace
204 Heater
205 Drive motor
206 Drive screw
250 Frame type plate
251 fixed plate
300 Circuit board (printed wiring board)
301 Lead wire parts (Axial lead parts)
302 Lead wire parts (radial lead parts)
303 Chip parts
304 Solder
400 striking device
600 cutting equipment
602 spindle
605, 606 Spacer

Claims

A circuit board transporting means for transporting the circuit board; and a circuit cutting means for cutting at least one of the circuit board or the components attached to the circuit board. A striking body is rotatably attached to a support shaft erected on the surface, and the rotating body is rotated at a high speed so that the striking body collides with at least one of the circuit board and the component at a speed higher than a critical impact speed. A device for removing a component from a circuit board.

2. The apparatus for removing a component from a circuit board according to claim 1, wherein the critical impact velocity is about 50 m / sec (180 km / hr) or more.

3. A device for removing components from a circuit board according to claim 2, wherein the fitting gap between the support shaft and the impacting body is about 5 to 10 mm.

4. The apparatus for removing a component from a circuit board according to claim 3, wherein the cutting means is movable in an arbitrary direction within a horizontal plane.

5. A device for removing components from a circuit board according to claim 4, wherein a plurality of impacting bodies are arranged at equal intervals on the main surface of the rotating body.

6. A pair of frames for sandwiching a circuit board is provided below the cutting means, and one of the pair of frames lifts the circuit board from the board transfer means. For removing components from circuit boards in Japan.

The outer shape of the impacting body is any one of a polygon having a plurality of corners, a cross shape having a plurality of corners, and a disk shape. A device that removes components from circuit boards.

A circuit board transporting means for transporting the circuit board; a cutting means for cutting at least one of the circuit board or a part attached to the circuit board; and a heating means for heating the circuit board. The cutting means attaches a striking body to a support shaft erected on the main surface of the rotating body, and rotates the rotating body at a high speed to rotate the striking body at a speed equal to or higher than a critical impact speed. An apparatus for removing a component from a circuit board, wherein the component is made to collide with at least one of the components.

9. The apparatus for removing a component from a circuit board according to claim 8, wherein the critical impact velocity is about 50 m / second (180 km / hour) or more.

9. The apparatus for removing components from a circuit board according to claim 8, wherein the circuit board is heated to a temperature higher than a temperature at which the solder melts.

Board transport means for transporting the circuit board, cutting means for cutting at least one of the circuit board or components attached to the circuit board, heating means for heating the circuit board, The cutting means includes a striking body rotatably attached to a spindle that is erected on the main surface of the rotating body, and the rotating body is attached to the rotating body. An apparatus for removing a component from a circuit board, wherein the apparatus is rotated at a high speed to cause the impacting body to collide with at least one of the circuit board and the component at a speed equal to or higher than a critical impact speed.

12. The apparatus for removing a component from a circuit board according to claim 11, wherein the critical impact velocity is about 50 m / second (180 km / hour) or more.

12. The apparatus for removing a component from a circuit board according to claim 11, wherein the circuit board is heated to a temperature equal to or higher than a temperature at which the solder melts.

Board transporting means for transporting the circuit board, cutting means for cutting at least one of the circuit board or components attached to the circuit board, heating means for heating the circuit board, and the circuit A vibration means for exciting at least one of the circuit board and the component, and a component transport means for transporting the circuit component separated from the circuit board, wherein the cutting means is a first rotating body. A first striking body is rotatably attached to a support shaft erected on the main surface, the first rotating body is rotated at a high speed, and the first striking body is rotated at a speed equal to or higher than a critical impact speed. An apparatus for removing a component from a circuit board, wherein the device is made to collide with at least one of the components.

15. The apparatus for removing a component from a circuit board according to claim 14, wherein the critical impact velocity is about 50 m / second (180 km / hour) or more.

16. The apparatus for removing components from a circuit board according to claim 15, wherein a plurality of cutting means are disposed.

17. The apparatus for removing a part from a circuit board according to claim 16, wherein the plurality of cutting means respectively cut at least one of different parts of the circuit board or different parts.

18. The apparatus for removing a component from a circuit board according to claim 17, wherein the circuit board is heated to a temperature higher than a temperature at which the solder melts.

The second hitting body is rotatably attached to a support shaft erected on the main surface of the second rotating body, the second rotating body is rotated by 30 to 300 rpm, and the second striking means is provided. 19. The apparatus for removing a component from a circuit board according to claim 18, wherein the body is caused to collide with at least one of the circuit board and the component.

After cutting at least one of the main surface of the circuit board or the parts attached to the circuit board, the parts attached to the circuit board are removed by heating the circuit board and melting the solder. The cutting means includes a striking body rotatably attached to a spindle erected on a main surface of the rotating body, the rotating body is rotated at a high speed, and the striking body has a speed equal to or higher than a critical impact speed. A method of removing a component from a circuit board, wherein the component is made to collide with at least one of a main surface of the circuit board and the component.

21. The impact body is made to collide with a circuit board at a critical impact speed of about 50 m / second (180 km / hour) or more and at a frequency of about 150 times / second or more. A method of removing components from a circuit board.

After cutting at least one of the main surface of the circuit board or the component attached to the circuit board, the circuit board is heated to melt the solder and add at least one of the circuit board or the component. This is a method of detaching a component attached to the circuit board by shaking, wherein the cutting means is capable of rotating the first striking body on a spindle erected on the main surface of the first rotating body. Attaching and rotating the first rotating body at a high speed to cause the first impacting body to collide with at least one of the main surface of the circuit board and the component at a speed equal to or higher than a critical impact speed. A method of removing components from a circuit board.

The first impact body is made to collide with a circuit board at a critical impact speed of about 50 m / second (180 km / hour) or more and at a frequency of about 150 times / second or more. A method of removing a component from the circuit board according to 22.

The vibration means attaches the second impacting body to a support shaft erected on the main surface of the second rotating body so that the second impacting body can rotate, rotates the second rotating body by 30 to 300 rpm, and 24. The method of removing a component from a circuit board according to claim 23, wherein the body is vibrated so as to collide with at least one of the circuit board and the component.

Cutting at least one of the main surface of the circuit board or the parts attached to the circuit board in the heating region and heating the circuit board to melt the solder are performed in parallel. In this method, the parts attached to the circuit board are detached, and the cutting means attaches the impacting body to a support shaft erected on the main surface of the rotating body so as to rotate the rotating body at a high speed. A method of removing a component from a circuit board, comprising: rotating the impact body so as to collide with at least one of a main surface of the circuit board and the component at a speed equal to or higher than a critical impact speed.

26. The impact body is made to collide with a circuit board at a critical impact speed of about 50 m / second (180 km / hour) or more and at a frequency of about 150 times / second or more. A method of removing components from a circuit board.

Board transport means for transporting the circuit board, cutting means for cutting at least one of the circuit board or components attached to the circuit board, heating means for heating the circuit board, Comprising a component conveying means for conveying the circuit component separated from the circuit board, wherein the cutting means places the impacting body on a spindle erected on the main surface of the rotating body. The rotating body is rotatably mounted, the rotating body is rotated at a high speed so that the impacting body collides with at least one of the circuit board or the component at a speed equal to or higher than a critical impact speed, and the cutting means is placed in the heating region. An apparatus for removing a component from a circuit board characterized by being arranged.

28. The apparatus for removing a component from a circuit board according to claim 27, wherein the critical impact velocity is about 50 m / sec (180 km / hr) or more.