JP3976063B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device, and more particularly to a reflective light emitting device that reflects light emitted from a light emitting surface of a light source and emits the light toward the back side of the light source.

  This application is based on Japanese patent application numbers (2003-373274, 2004-251021), and the entire contents of this Japanese application are referred to and introduced in this application.

  Conventionally, a reflection type light emitting device in which an LED (Light-Emitting Diode) element and a reflecting mirror are arranged to face each other and the light emitted from the LED element is reflected and emitted in a desired direction is disclosed in Japanese Patent Laid-Open No. 5-291627. Proposed in the gazette.

  Reflective light emitting devices have the disadvantage that some of the light is blocked because the LED element and the power supply lead are located in the optical path of the reflected light, but the light emitted from the LED element is collected with high efficiency. Therefore, it is excellent in light emission efficiency.

  In recent years, with the expansion of LED applications, high-power LEDs have been developed, and a high-power type of several watts has already been commercialized. The LED is characterized by low heat generation. However, in order to achieve high output, it is necessary to supply a large current to the LED element, and as a result, a non-negligible level of heat generation occurs.

In the light emitting device described in Japanese Patent Laid-Open No. 5-291627, an LED element is mounted on a lead, and the LED element electrode and the lead bonded with a wire are sealed with a first light transmissive material, The second light-transmitting material is formed by sealing the first light-transmitting material and the lead, and the second light-transmitting material has a concave reflection on the side facing the light emitting surface of the LED element. A surface is formed, and a flat radiation surface is formed on the back side of the LED element. The light radiated from the LED element is reflected by the concave reflecting surface and radiated to the outside from the radiating surface.
JP-A-5-291627

  However, according to the conventional reflection type light emitting device, the heat generated when the LED element is lit is transferred to the outside through the lead to dissipate the heat. If it is made large, the reflected light is blocked and the light radiation efficiency is lowered, so that there is a problem in that the improvement in heat dissipation is restricted.

Accordingly, an object of the present invention is to provide a reflective light-emitting device that has excellent heat dissipation and can minimize the reduction in the radiation efficiency of reflected light.
Another object of the present invention is to provide a reflective light-emitting device with a reduced number of parts.

The present invention for achieving the above object, and supplies the light-shielding heat dissipating plate made of a metal material, a light source unit including a solid-state light-emitting element is mounted on the end face of the heat radiating plate, the power to the light source unit, wherein A power feeding part that is insulated from the heat sink and formed integrally with the heat sink; and a reflection part that reflects light emitted from the light source part in a direction parallel to the heat sink and in the direction of the heat sink There is provided a light emitting device characterized by comprising:

The feeding unit may be made of metal thin film.

The power feeding unit may be sandwiched between a plurality of heat radiating plates via an insulator.

  The light source unit may be a package formed by sealing the solid light emitting element with a light transmissive material.

  The light source unit includes the solid-state light emitting element that is flip-chip mounted, and is mounted on an inorganic material substrate on which a conductive pattern that receives and supplies power to the solid-state light emitting element is formed. May be sealed with an inorganic sealing material having the same thermal expansion coefficient.

  The inorganic sealing material may be glass.

  The solid state light emitting device is preferably sealed with an inorganic sealing material having a refractive index of 1.55 or more.

  The solid-state light emitting element or a light emitting spectrum light having a plurality of wavelengths from the periphery of the solid-state light emitting element may be used.

  The phosphor may be arranged around the solid-state light emitting device.

Further, accommodating the pre-Symbol reflective portion and the heat radiating plate may be possess a case for external heat the heat heat is transferred from the heat radiating plate.

The heat radiating plate may be formed of the same member as the case.

The case may include a first opening in which the reflecting portion is disposed and a second opening from which light reflected by the reflecting portion is extracted.

Wherein the case, it is desirable to have a front surface you reflect light.

The outer peripheral surface of the case, in order to enlarge the heat area release, uneven portions may be formed.

The outer peripheral surface of the case, in order to enlarge the heat release area, may be roughened.

The heat sink, it is desirable to adopt a configuration that have a front surface you reflect light.

The heat radiating plate may have a shape protruding toward the reflecting portion .

  The reflection part may be formed of a resin material.

  The light source unit may include a plurality of solid state light emitting elements.

It said light source unit comprises a plurality of a plurality of reflective portions corresponding to the plurality of light source sections radiator plate and may have a.

The plurality of light source units may include light source units of red ( R ) , green ( G ) , and blue ( B ) emission colors.

  Hereinafter, a light emitting device according to the present invention will be described in detail with reference to the drawings.

  1A and 1B show a reflective light emitting device according to a first embodiment of the present invention, in which FIG. 1A is a perspective view, FIG. 1B is a cross-sectional view taken along a line BB in FIG. (A) The longitudinal cross-sectional view in CC section of (a), (d) is the elements on larger scale of the modification of a LED element mounting part.

  The light emitting device 1 includes a case 10 made of a metal material and excellent in heat dissipation, a reflecting mirror portion 11 formed so as to be fitted to a lower portion of the case 10, and a transparent transparent plate that covers the upper surface of the case 10. 12, heat sinks 13 and 14 formed of a metal material having excellent heat conductivity and inserted into the case 10, the LED element 2 mounted on the heat sink 13, and the heat sink 13 via an insulating layer 15a. Lead portions 15A and 15B, which are power supply members that are fixed and fed to the LED element 2, and spacers 16 formed of an insulating material that insulates the lead portions 15A and 15B from the case 10. In the following description, the light emitting surface of the LED element 2 is the origin, the central axis is the Z direction, the lead-out direction of the lead portions 15A and 15B orthogonal to the X direction is the X direction, and the direction orthogonal to these is the Y direction. To do.

  The LED element 2 is made of a GaN-based semiconductor material and has a chip size of 1 mm × 1 mm. It is also possible to use a standard size LED element 2 of 0.3 mm × 0.3 mm. The LED element 2 has a power supply electrode (not shown) on the upper surface, and is electrically connected to the lead portions 15A and 15B via this electrode and the wire 3. The LED element 2 is sealed by a mold part 2A made of silicon resin. The lower surface of the LED element 2 is bonded to the heat sink 13 with an adhesive such as silver paste.

  The case 10 is formed into a cylindrical shape with aluminum having excellent heat dissipation and workability, and the inner wall surface is processed into a mirror surface to enhance flatness. That is, the inner wall surface has a high linear reflectance. A slit 10A for fitting the heat sink 14 is formed on the side surface.

  The reflecting mirror portion 11 is made of a metal material such as copper having excellent heat dissipation. When the light emitting device is assembled on the portion irradiated with the light emitted from the LED element 2, the coordinate origin of FIG. A reflecting mirror surface 11A with a diameter of 10 mm is formed which is a focal point and is recessed in a circular arc shape having a paraboloid shape whose center axis coincides with the Z axis. The reflecting mirror surface 11A is mirror-finished by silver plating. Moreover, the reflecting mirror part 11 is formed so as to be able to fit into the case 10.

  The transparent plate 12 is formed of a light-transmitting resin in a flat plate shape and has a light transmission property that allows the light reflected by the reflecting mirror surface 11A to pass therethrough and covers the upper surface of the case 10 to prevent intrusion of foreign matter or the like. Yes.

  The heatsinks 13 and 14 are copper plates having a thickness of 0.5 mm and a width (Z direction) of 5 mm, which are excellent in thermal conductivity, and the surface of a material having a small surface roughness is mirror-finished by silver plating. In the center of the heat radiating plate 13, a slit 13A for inserting the heat radiating plate 14 is provided. The heat radiating plate 14 is inserted into the slit 13 </ b> A so as to be orthogonal to the heat radiating plate 13. The heat radiating plate 13 is attached to fit into the slit 10 </ b> A of the case 10. Further, the LED element mounting portion of the heat radiating plate 13 is expanded to a shape suitable for mounting the LED element 2 by crushing or the like to be 2.0 mm square.

  The lead portions 15A and 15B are made of copper having excellent thermal conductivity, and silver plating is applied to the surface in order to provide the bonding property and light reflectivity of the wire 3. The lead portions 15A and 15B are bonded to the end face of the heat radiating plate 13 via an insulating layer 15a such as polyimide, so that the lead portions 15A and 15B are not short-circuited via the heat radiating plate 13.

  The spacer 16 is inserted into the case 10 to fix the lead portions 15A and 15B at predetermined positions and is insulated so as not to be electrically short-circuited with the case 10.

  Next, the manufacturing process of the light emitting device 1 according to the first embodiment will be described below.

  First, silver plating is performed in advance on the lead portions 15A and 15B held on a lead frame (not shown) in order to improve the bondability of the wire 3. Moreover, the light which hits a lead surface is reflected by giving silver plating. Next, the lead portions 15A and 15B are bonded to the end face of the heat radiating plate 13 which has been mirror-finished through the insulating layer 15a. Next, the LED element 2 is bonded to the end face of the heat radiating plate 13, an electrode (not shown) and the lead parts 15A and 15B are bonded with the wire 3, the LED element 2 is resin-sealed, and the mold part 2A is formed. Next, the lead portions 15A and 15B are separated from the lead frame. Next, the spacer 16 is assembled in the case 10. Next, the heat radiating plate 13 to which the LED element 2 and the lead portions 15A and 15B are bonded is inserted into the slit 10A of the case 10 and pushed to the position of the spacer 16. Next, the heat sink 14 is inserted into the slit 13 </ b> A of the heat sink 13. Next, the reflecting mirror portion 11 formed in advance is inserted into the lower surface of the case 10, that is, the opening located on the light emitting side of the LED element 2. Next, the transparent plate 12 is fitted and integrated on the upper surface of the case 10, that is, on the back side of the LED element 2.

  Next, operation | movement of the light-emitting device 1 of 1st Embodiment is demonstrated below.

  When power is supplied from a power supply unit (not shown) to the lead portions 15A and 15B exposed to the outside of the case 10, the LED element 2 is turned on. Nearly all of the light emitted from the LED element 2 is reflected by the reflecting mirror surface 11A of the reflecting mirror part 11 and reflected in the direction shown in FIG. 1C as reflected light parallel to the Z axis, that is, the back side of the LED element 2 The light including the light reflected by the inner wall surface of the case 10 and the surfaces of the heat dissipation plates 13 and 14 is also radiated to the outside through the transparent plate 12.

  Further, the heat generated along with the lighting of the LED element 2 is transferred to the case 10 via the heat radiating plates 13 and 14 and radiated to the atmosphere.

According to the first embodiment described above, the following effects can be obtained.
(1) Since the LED element 2 is mounted on the end face of the heat radiating plate 13, heat generated when the LED element 2 is turned on is quickly drawn into the case 10 via the lead portions 15A and 15B and the heat radiating plates 13 and 14. Thus, even if the amount of heat generation is increased by increasing the output of the LED element 2, good heat dissipation is obtained.

(2) The heat dissipation plates 13 and 14 that serve as heat dissipation portions have a heat dissipation width in the back direction (Z-axis direction) of the LED element 2. That is, since the normal direction of the surface is arranged in a direction perpendicular to the Z axis, the area of the LED element mounting portion including the LED element 2 and the heat radiation plates 13 and 14 with respect to the reflection surface of φ10 is as follows. It stays at about 15% and can maintain a sufficient area for heat transfer, and the area where the reflected light reflected by the reflecting mirror surface 11A hits the end faces of the radiator plates 13 and 14 becomes small, and the reflected light hits the end faces. It is possible to improve the external radiation by reducing stray light generated based on the above. And, it is possible to realize a small and highly efficient condensed radiation. Naturally, if the optical diameter is further increased, stray light can be further suppressed and the efficiency can be further increased. As in the prior art, heat transfer from a lead punched out of a metal flat plate can only be about twice as thick as the lead width, whereas in the present invention the lead width is A heat transfer area having a thickness 10 times or more (width in the back direction of the LED element 2) is obtained. In addition, the LED element mounting area with respect to the LED element 2 is also important in order to suppress the optical diameter to a small size and to obtain a small light emitting device. For example, even if a φ7.5 package on which a commercially available LED element 2 of 1 mm square is mounted is used, on the opposite reflecting surface of φ10, most of the light reflected by the reflecting surface is blocked by the package, and high efficiency is achieved. External radiation is not possible. At least, it is better to use an LED element mounting width within 5 times that of the LED element 2, preferably within 3 times the width. Naturally, even if the optical diameter is further increased, it is desirable to reduce the LED element mounting surface only in the degree of the effect of efficiency.

(3) Since the heat radiating plate 13 is supported by the case 10 and intersected with the heat radiating plate 14, structural strength as a support member for the LED element 2 and the lead portions 15A and 15B while using the thin heat radiating plate 13 is used. Can be secured.

(4) Since the inner wall surface of the case 10 and the surfaces of the heat sinks 13 and 14 have a high linear reflectance, the LED element 2 that is the light source has a size and a divergence angle with respect to the Z axis. Even if the reflected light reaches these, the reflected light reflected by the reflecting mirror surface 11A is not attenuated, and moreover, the reflected light is mostly reflected symmetrically with respect to the incident light. It can be emitted to the outside of the case 10 as it is.

(5) Since the inner wall surface of the case 10 has a high linear reflectivity, the heat sink has a width in the Z direction, and the inner wall surface of the case 10 is located in the optical path range of the reflected light reflected by the reflecting mirror surface 11A. Even if it does so, since it can be made to radiate | emit externally efficiently, a compact package is realizable. This also applies to reflected light having a further divergence angle by changing the shape of the reflecting mirror surface 11A. In this case, the effect is further increased.

(6) Since the case 10 is made of highly heat conductive aluminum, the heat of the heat radiating plate 13 is quickly transmitted to the entire case 10, and the heat generated by the LED element 2 is radiated to the atmosphere by the heat radiating plate 13 and the case 10. Is done. For this reason, a thermal resistance of 20 ° C./W or less can be achieved without using a heat sink required for a general large element.

  In the first embodiment, the configuration using the GaN-based LED element 2 has been described. However, for example, another LED element 2 such as AlInGaP can be used.

  Moreover, it is good also as a reflection type light-emitting device of a wavelength conversion type by containing fluorescent substance in the mold part 2A which seals the LED element 2. FIG. In this case, in the optical system by reflection, the refractive index does not differ depending on the emission wavelength as in the case of the lens type LED, and color separation does not occur in the condensed light.

  That is, for example, the white light source is composed of spectrum light of a plurality of wavelengths such as blue of LED and yellow of phosphor excited by the LED, or blue, green, red of phosphor excited by UV light of the LED. Has been. When this light is condensed and emitted by the lens, the refraction angle differs depending on the wavelength, and the light is emitted in different directions. This phenomenon becomes more prominent as the degree of light collection is higher and the irradiation distance is longer. On the other hand, since the reflection optical system does not depend on the reflection angle depending on the wavelength, this problem does not occur even when the irradiation distance is high.

  And in the case of the LED that is not a high light output type with a large current supply so far, the amount of light used is not sufficient for the light used for illuminating, and it is rare that color separation is a serious problem, but a large current is applied. The high output type can be used as a light source for illumination. And high-illuminance illumination of uniform color can be realized by high-efficiency condensing and radiating light that radiates spectrum light of multiple regions wavelength without color separation in high-power type LEDs that need countermeasures against heat dissipation. . The spectral light in a plurality of regions is not limited to the combination of the LED element and the phosphor. If the LED element itself has a spectral characteristic with a wide wavelength width, or a plurality of multi-color LED elements are closely arranged. Alternatively, it may be sealed with a light diffusing member. Furthermore, when the light is collected by the lens and the reflecting mirror around it, it is difficult to obtain uniform light by the light irradiated by the lens and the light irradiated by the reflecting mirror. However, since light is collected by a single reflecting surface, irradiation with high uniformity can be realized.

  Moreover, chip | tip LED can also be used as a light source part. The chip LED is a small LED obtained by mounting an LED element on a substrate or the like and making an electrical connection, then sealing the whole with a sealing material and dicing into a pellet.

  Further, the LED element 2 and the reflecting mirror surface 11A may be filled with a light transmissive material.

For radiating plate 13 and 14, if a metal material excellent in heat dissipation is not limited to copper, it may be formed of aluminum or other materials, the thermal conductivity of 100W ^· m ^-1 · k -1 or more It is preferable to use a material.

  The appropriate shape of the heat radiation plates 13 and 14 provided with a heat radiation width in the back direction of the light source unit depends not only on the thermal conductivity of the material but also on the input power to the light source and the heat resistance of the light source. However, by setting the heat dissipation width to three times or more with respect to the thickness direction of the heat dissipation plate, a difference from a lead frame having a flat plate shape orthogonal to the central axis of the reflecting mirror can be obtained.

  Further, the heat radiating portion may have a function of a heat radiating plate by giving the lead portions 15A and 15B a width in the back direction of the LED element 2.

  About the transparent plate 12, it is good also as what performs light collection and light diffusion as an optical system other than the function which covers the upper surface of case 10, for example. For example, it is possible to collect the reflected light emitted from the case 10 in a spot shape by using a condensing lens-shaped transparent portion. Further, one surface of the flat transparent plate 12 may be roughened by a hologram technique so that light is emitted in a predetermined angle range, and light emitted outside may be diffused.

  Moreover, the transparent plate 12 is formed of a glass material, and a phosphor layer is provided on the surface thereof in a thin film shape, so that it is excellent in light resistance and heat resistance, and wavelength conversion type light emission excellent in wavelength conversion with a small amount of phosphor used. Device 1 is obtained.

  FIG. 1D is an enlarged view of a mounting portion of the LED element 2. As described above, a portion on which the LED element 2 is mounted may be provided so as to protrude from the surfaces of the lead portions 15A and 15B. In this case, light emitted in the lateral direction of the LED element 2 is not hindered by the lead portions 15A and 15B, so that the light emission efficiency to the outside is improved.

  FIG. 2 is a cross-sectional view of a reflective light-emitting device according to the second embodiment of the present invention. The position of the cross section is the BB part shown in FIG. The light emitting device 1 according to the second embodiment is different from the light emitting device 1 according to the first embodiment in the configuration in which the concavo-convex portion 10 </ b> B for expanding the heat radiation area is formed on the outer peripheral surface of the case 10.

  According to the second embodiment described above, the surface area of the case 10 is enlarged by the concavo-convex portion 10B, whereby the heat transferred through the heat sinks 13 and 14 can be efficiently dissipated into the atmosphere. In addition to providing the uneven portion 10B, the same effect can be obtained by roughening the outer peripheral surface of the case 10 by blasting or the like. Moreover, you may use an uneven | corrugated process and a roughening process together.

  3A and 3B show a reflective light-emitting device according to a third embodiment of the present invention, in which FIG. 3A is a plan view, FIG. 3B is a cross-sectional view taken along a line DD in FIG. (A) It is a side view. The light emitting device 1 includes a heat dissipation column 17 made of a heat conductive material that supports the heat dissipation plates 13 and 14 at the center, and a lead portion 15B bonded to an end surface of the heat dissipation column 17, that is, a side facing the reflector portion 11. The structure having the substrate 18 bonded to the lower part of the case 10 is different from the light emitting device 1 of the first embodiment. In the following description, the same reference numerals are assigned to portions common to the first embodiment.

  The reflecting mirror portion 11 has an insulating layer 15a in a portion that contacts the lead portions 15A and 15B.

  The heat sinks 13 and 14 are 0.1 mm thick aluminum plates having excellent thermal conductivity, and are mirror-like plates having a small surface roughness. A slit (not shown) is provided in the center of the radiator plates 13 and 14 to be incorporated in the radiator column 17. The heat radiating plate 13 is supported by the case 10 via a spacer 16.

  The lead portions 15A and 15B are made of copper having excellent thermal conductivity, and the surface thereof is silver-plated to give light reflectivity. The lead portion 15 </ b> B has a shape in which a portion on which the LED element 2 is mounted is recessed in a concave shape, and is bonded to the end face of the heat dissipation column 17. The LED element 2 is sealed at the tip of the lead part 15B by a mold part 2A made of epoxy resin.

  The spacer 16 is made of aluminum having excellent thermal conductivity, and has an insulating layer 15a for electrically insulating the lead portions 15A and 15B on the bottom surface. The insulating layer 15a can also be provided on the lead portions 15A and 15B.

  The substrate 18 is made of aluminum in the same manner as the case 10 and bonded to the lower part of the case 10.

  4A and 4B are views showing the heat dissipation column, where FIG. 4A is a side view and FIG. 4B is a plan view. The heat dissipating column 17 is made of copper and has a surface plated with silver, and slits 17A and 17B are formed so as to support the heat dissipating plates 13 and 14 in a cross shape at the center.

  Next, the manufacturing process of the light emitting device 1 according to the third embodiment will be described below.

  First, silver plating is performed in advance on the lead portions 15A and 15B held on a lead frame (not shown) in order to improve the bondability of the wire 3. Next, the LED element 2 is joined to the tip of the lead part 15B, the electrode of the LED element 2 (not shown) and the lead parts 15A and 15B are bonded with the wire 3, the LED element 2 is sealed with resin, and the mold part 2A Form. Next, the heat-dissipating column 17 is joined to the tip of the lead portion 15B with a brazing material or the like. Next, the reflecting mirror part 11 formed in advance in the case 10 is incorporated. Next, the lead portions 15 </ b> A and 15 </ b> B in which the LED element 2 and the heat dissipation column 17 are integrated are incorporated in the case 10. Next, the lead portions 15A and 15B are separated from the lead frame (not shown). Next, the spacer 16 is assembled in the case 10. Next, the heat sinks 13 and 14 are assembled into the case 10. At this time, the heat sinks 13 and 14 are inserted into the slits 17 </ b> A and 17 </ b> B of the heat dissipation column 17 and the heat sink 13 is incorporated into the slits 16 </ b> A of the spacer 16. Next, the substrate 18 is bonded to the lower portion of the case 10. Next, the transparent plate 12 is fitted into the upper surface of the case 10 and integrated.

According to the above-described third embodiment, the following effects can be obtained.
(1) Since heat based on the lighting of the LED element 2 is transferred from the lead portion 15B to the heat radiating plates 13 and 14 via the heat radiating support column 17, the heat transfer performance has a margin for increasing the output of the LED element 2. A certain heat dissipation path can be secured.

(2) Since the heat radiation plates 13 and 14 are supported by the heat radiation support columns 17 so that the heat radiation plates 13 and 14 can be formed thinner than those described in the first embodiment, a configuration in which stray light is less likely to be obtained is obtained. And the external radiation of reflected light can be improved.

  5A and 5B show a reflective light emitting device according to a fourth embodiment of the present invention, in which FIG. 5A is a longitudinal sectional view, and FIG. 5B is a plan view seen from the Z direction. The light emitting device 1 has a configuration in which the transparent plate 12 of the light emitting device 1 described in the third embodiment is disposed below the heat radiating plates 13 and 14 as shown in FIG. That is, the transparent plate 12 is provided inside the case 10 below the heat radiating plates 13 and 14 as shown in (b), and opens the heat radiating plate to the atmosphere. Further, a heat radiating plate 19 is provided in addition to the heat radiating plates 13 and 14, whereby the heat radiating plates 13, 14, and 19 are arranged in a lattice pattern. Other configurations are the same as in the third embodiment.

  The transparent plate 12 has a through-hole 12 </ b> A that allows the heat dissipation column 17 to pass through, and is supported by the spacer 16 inside the case 10. Further, the heat dissipating column 17 is arranged in the center of the case 10 by the through hole 12A. Here, the reflecting mirror surface 11A has a diameter of 10 mm, and the heat sink 19 has a thickness of 0.1 mm.

  Next, the manufacturing process of the light emitting device 1 in the fourth embodiment will be described below.

  First, silver plating is performed in advance on the lead portions 15A and 15B held on a lead frame (not shown) in order to improve the bondability of the wire 3. Next, the LED element 2 is joined to the tip of the lead part 15B, the electrode of the LED element 2 (not shown) and the lead parts 15A and 15B are bonded with the wire 3, the LED element 2 is sealed with resin, and the mold part 2A Form. Next, the heat-dissipating column 17 is joined to the tip of the lead portion 15B with a brazing material or the like. Next, the reflecting mirror part 11 formed in advance in the case 10 is incorporated. Next, the lead portions 15 </ b> A and 15 </ b> B in which the LED element 2 and the heat dissipation column 17 are integrated are incorporated in the case 10. Next, the lead portions 15A and 15B are separated from the lead frame (not shown). Next, the spacer 16 is assembled in the case 10. Next, the substrate 18 is bonded to the lower portion of the case 10. Next, the transparent plate 12 is inserted into the case 10 from the upper side of the case 10 and fitted to the position of the spacer 16. At this time, the heat-dissipating support column 17 is passed through the through hole 12A. Next, the heat sinks 13 and 14 are assembled into the case 10. At this time, the central portions of the heat radiation plates 13 and 14 are inserted into the slits 17A and 17B of the heat radiation column 17. Further, a heat sink 19 is incorporated so as to be orthogonal to the heat sinks 13 and 14.

According to the fourth embodiment described above, the following effects can be obtained.
(1) Since the heat radiation support column 17 and the heat radiation plates 13, 14, and 19 are disposed outside the transparent plate 12, the heat radiation performance associated with the lighting of the LED element 2 is improved.

(2) Since the arrangement of the heat dissipation plates 13, 14, and 19 can be easily changed according to the heat generated by the LED element 2, the heat dissipation of the package according to the application can be set appropriately. Moreover, the light-emitting device which is excellent in the design property based on arrangement | positioning of the heat sinks 13, 14, and 19 is obtained.

(3) Since the heat radiation plates 13, 14, and 19 are thin plates, the influence of light shielding is in a negligible range, and the heat radiation area can be greatly increased. Furthermore, in addition to the effect of (1), sufficient heat dissipation can be obtained without necessarily radiating heat to the case 10.

(4) Since the heat radiating column 17 is supported by the through-hole 12A of the transparent plate 12, the heat radiating plates 13, 14, and 19 formed by thin plates can be stably disposed.

  FIG. 6 is a partial configuration diagram of a reflecting mirror section according to the fifth embodiment of the present invention. The reflecting mirror part 11 has a reflecting mirror surface 11 </ b> A having a convex part 11 </ b> B immediately below the LED element 2. Specifically, an elliptical line having a focal point at the position of the LED element 2 and the position 2R / 3 in the central axis direction from the LED element 2 and the position 2R / 3 in the direction perpendicular to the central axis is rotated around the central axis. is there.

  According to the fifth embodiment described above, since the light emitted directly under the LED element 2 is not reflected in the direction of the LED element 2, the light shielding of the LED element 2 can be reduced, and the reflected light can be reduced. The light extraction property to the outside can be improved. In the fifth embodiment, the convex portion 11B is described as being integrally provided on the reflecting mirror surface 11A. However, for example, the convex portion 11B is formed separately from the reflecting mirror surface 11A, and an adhesive or the like is formed. May be fixed to the reflecting mirror surface 11A.

  FIG. 7 is a partial configuration diagram of a mold part according to the sixth embodiment of the present invention. The mold part 2A has a concave part 2a in which the light emitting surface side of the LED element 2 is recessed in an arc shape.

  According to the above-described sixth embodiment, the light radiated immediately below the LED element 2 is refracted when radiated from the recess 2a to the outside of the mold part 2A. That is, since light does not enter the reflecting mirror surface 11A immediately below the LED element 2, the light extraction property of the reflected light to the outside can be improved.

  FIG. 8 is a partial configuration diagram of an LED element mounting portion according to the seventh embodiment of the present invention. The LED element 2 is a flip chip type, and is mounted on a submount element 21 made of aluminum nitride (AlN) having high thermal conductivity via Au bumps 4.

  The submount element 21 includes an electrode 21A electrically connected to the lead portion 15A and an electrode 21B electrically connected to the lead portion 15B. The electrodes 21A and 21B are formed in the submount element 21. Are electrically connected to the electrode (not shown) of the LED element 2 through the wiring layers 21C and 21D. A heat dissipation column 17 is attached to the submount element 21.

  According to the seventh embodiment described above, it is possible to mount the flip-chip type LED element 2 having excellent light extraction efficiency by attaching the submount element 21 to the heat dissipation column 17. Moreover, since no wire is used, the mold size can be made equal to the element, the light shielding of the LED element 2 can be reduced, and the light extraction property of the reflected light to the outside can be improved. In addition, heat generated based on the lighting of the LED element 2 can be transferred to the heat radiating column 17 via the submount element 21 having excellent thermal conductivity, and heat can be efficiently transmitted from the heat radiating plate joined to the heat radiating column 17. Can be dissipated.

  In each of the above-described embodiments, the configuration in which the LED element 2, the reflector portion 11, the lead portions 15A and 15B, the heat sinks 13 and 14 are accommodated in the case 10 has been described. Case 10 may be omitted.

  9A and 9B show a reflection type light emitting device according to an eighth embodiment of the present invention, in which FIG. 9A is a plan view, FIG. 9B is a cross-sectional view taken along the line BB in FIG. (A) It is a side view.

  The light emitting device 1 has a configuration in which one of the heat radiating plates is composed of two metal heat radiating plates 13B sandwiching the polyimide layer 13C and the copper foil 13D, and the power supply for the copper foil 13D to supply power to the LED elements. By becoming a member, the lead portion becomes unnecessary, and further, an insulating layer and a spacer for insulating the lead portion and the case 10 are unnecessary, and the glass-sealed LED 20 is electrically connected to the copper foil 13D. The connected configuration is different from the light emitting device 1 of the first embodiment. In the following description, parts having the same configuration and function as those of the first embodiment are denoted by the same reference numerals.

  FIG. 10 is a cross-sectional view showing an LED mounted on the light emitting device.

This LED 20 includes a flip-chip type GaN-based LED element 2 (light emission wavelength 470 nm) and a glass-containing Al ₂ O ₃ substrate 200 (thermal expansion coefficient 12.3 × 10 ⁻⁶ / ° C.) on which the GaN-based LED element 2 is mounted. A circuit pattern 201 made of tungsten (W) -nickel (Ni) -gold (Au) and formed on the glass-containing Al ₂ O ₃ substrate 200, and the GaN-based LED element 2 and the circuit pattern 201 are electrically connected. And a glass sealing portion 203 that seals the GaN-based LED element 2 and is bonded to the glass-containing Al ₂ O ₃ substrate 200. The LED 20 is bonded and fixed to the heat sink 13B with an insulating adhesive.

The glass-containing Al ₂ O ₃ substrate 200 has via holes 200A for conducting the circuit pattern 201 made of W metallized on the front and back surfaces of the substrate.

The glass sealing part 203 is formed of phosphoric acid glass (thermal expansion coefficient 11.4 × 10 ^{−6 /} ° C., Tg 390 ° C., n = 1.59) as a low melting point glass, and is hot pressed by a mold. It is formed in a rectangular shape having an upper surface 203A and a side surface 203B based on being cut by a dicer after being bonded to the glass-containing Al ₂ O ₃ substrate 200 by processing. In addition, you may radiate | emit white light by containing the fluorescent substance excited by the blue light radiated | emitted from the GaN-type LED element 2 in the glass sealing part 203. FIG.

  11A and 11B are diagrams showing the configuration of the heat radiating plate made of the heat radiating plate 13B, the polyimide layer 13C, and the copper foil 13D. FIG. 11A is a front view, FIG. 11B is a side view, and FIG. . The polyimide layer 13 </ b> C has a shape protruding from the edge of the heat sink 13 </ b> B at the side and lower portions. Further, the two copper foils 13D are located so as to be included in the polyimide layer 13C from the side surface protruding portion to the lower protruding portion of the polyimide layer, and further protrude from each protruding portion.

  Each of the two heat sinks 13B is a copper plate having a thickness of 0.2 to 0.3 mm excellent in thermal conductivity, and a surface facing a surface in contact with the polyimide layer 13C is a surface of a material having a small surface roughness. Mirror finish by silver plating is given. In addition, the other shapes conform to the heat sink 13 in the first embodiment. In addition, the metal material which comprises the heat sink 13B may be formed with another material, if it is excellent in heat conductivity, for example, may be formed with aluminum. In the case of aluminum, since it has high reflectivity in addition to high thermal conductivity, it is possible to omit mirror processing such as plating. For example, a material having a high linear reflectance (80%) during rolling may be used.

  A polyimide layer 13C is sandwiched between the two heat sinks 13B, and the polyimide layer 13C wraps the copper foil 13D. Here, the polyimide layer 13C also serves as a spacer that insulates the heat radiating plate 13B and the copper foil 13D and prevents a gap from being formed when the two heat radiating plates 13B are bonded together.

  As described above, the polyimide layer 13C and the copper foil 13D have a shape protruding from the edge of the heat sink 13B at the side surface and the lower portion, but the portion protruding from the lower protrusion of the polyimide layer 13C of the copper foil 13D is The LED element 2 is in contact with the electrode of the LED element 2 via a solder bump or the like, and the portion protruding from the side surface protruding portion of the polyimide layer 13C of the copper foil 13D is in contact with the lead wire or the like from the power source to supply power to the LED element 2. To do. Further, the polyimide layer 13C is used for protecting the copper foil in addition to the above-described insulation purpose for the side protrusion and the lower protrusion. In the present invention, not only polyimide but other insulating materials may be used.

  Moreover, FIG.11 (d) is a bottom view of the heat sink with the center part having thickness from both sides. The heat sink as shown in FIG. 11 (c) is suitable for mounting a standard size LED element of 0.3 × 0.3 mm, but for mounting a large size LED package of 1 × 1 mm. Is not appropriate because the thickness of the heat sink itself is insufficient. However, with the configuration as shown in FIG. 11D, a large-size LED package can be appropriately mounted without increasing the number of components.

  Furthermore, FIG.11 (e) is a bottom view of the heat sink which has a center part thicker than both sides, and has 2 sets of copper foils which are electric power feeding parts. When a large size LED package is mounted, power can be individually supplied to a plurality of LED elements mounted on the large size LED package. In addition, in the heat sink of FIG.11 (e), although 2 sets of copper foils are provided, the light-emitting device which concerns on this invention may have 3 or more sets of copper foils.

  Next, the manufacturing process of the heat sink in the light-emitting device of 8th Embodiment is demonstrated below.

  First, two heat sinks 13B are prepared, and two polyimide films that are slightly larger in size than the heat sink 13B are prepared. The copper foil 13D is sandwiched between two polyimide films so as to maintain a desired shape, and further sandwiched between two heat radiating plates 13B. Next, the portion of the polyimide layer 13C made of two polyimide films that protrudes from the two heat radiation plates 13B is cut out so as to leave the side surface and the lower protrusion as shown in FIG. And after giving the mirror surface process by silver plating to the surface of the heat sink 13B, the slit 13A is formed.

  Also, instead of preparing two polyimide films in advance, after applying polyimide resin to the heat radiating plate 13B and disposing the copper foil 13D, after further coating the polyimide resin and covering the copper foil 13D, another one The method of inserting | pinching with the heat sink 13B of a sheet | seat may be used.

  Alternatively, a copper foil may be attached to the polyimide film, and after etching the copper foil, a copper substrate may be laminated with another polyimide film to form a flexible substrate, and the flexible substrate may be attached to the heat dissipation plate 13B.

  Next, a method of connecting the LED element 2 and the copper foil 13D in the light emitting device of the eighth embodiment will be described.

  First, the lower protrusion of the polyimide layer 13C protruding from the lower part of the heat sink 13B is bent and fixed to the lower edge of the heat sink 13B with an adhesive. Next, the surface of the polyimide layer 13C that is not fixed to the heat dissipation plate 13B is scraped off to expose the copper foil 13D. Then, the exposed portion of the copper foil 13D and the electrode of the LED element 2 are connected via a solder bump or the like, and at the same time, the LED element 2 itself is fixed to the lower edge of the heat sink 13B with an adhesive. At this time, the polyimide layer 13C also has a function of insulating the LED element 2 and the heat sink 13B.

  According to the above-described eighth embodiment, since the copper foil 13D serving as the wiring layer is integrally provided as the insulating layer between the two heat sinks 13B via the polyimide layer 13C, the heat sink 13B with respect to the case 10 is provided. Assembly is improved. Further, since the insulation between the case 10 and the heat radiating plate 13B and the copper foil 13D is maintained by the polyimide layer 13C, it is not necessary to prepare an insulating member when assembling the heat radiating plate 13B to the case 10, and the number of parts can be reduced. Thus, a reflective light-emitting device can be formed at low cost.

  In addition, since the copper foil 13D is built in the cross section of the heat radiating plate 13B, a desired wiring pattern can be formed according to the LED 20 and the LED element 2 to be mounted, and the light extraction performance as a reflective light emitting device is impaired. Excellent wiring flexibility.

  For sealing material deterioration, light-emitting element sealing with an inorganic material, not resin sealing, self-heating of the light-emitting element, light absorption due to deterioration of the sealing material due to self-light emission, and external emission of the LED 20 A decrease in efficiency can be suppressed. In particular, in the GaN-based LED element 2, the light emission output lowering factor is mainly due to the deterioration of the sealing material. Therefore, by using glass sealing, the LED 20 with extremely small output deterioration can be obtained. Further, even with UV light of λ = 365 nm, both the initial transmittance and the transmittance maintenance rate can be made favorable.

  Regarding the refractive index, there is an example in which a silicon resin is used instead of an epoxy resin having a large resin deterioration. However, since the refractive index of the silicon resin is slightly lower than that of the epoxy resin, the light output is reduced by 5 to 10%. On the other hand, by selecting glass as the sealing material, it becomes easy to select a refractive index higher than the epoxy resin, such as a refractive index n = 1.55 or higher.

As for the disconnection due to the difference in thermal expansion coefficient, the sealing glass and the glass-containing Al ₂ O ₃ substrate 200 have the same thermal expansion coefficient. It is difficult to cause poor adhesion. In addition, since the thermal expansion coefficient is 1/5 or 1/10 or less than that of an epoxy resin or silicon resin generally used as a sealing material, disconnection due to the thermal expansion coefficient is extremely unlikely to occur. For this reason, even if the heat radiation width in the back direction of the light source part of the heat radiating plate is set to 3 mm, it is possible to have no significant influence. However, since it affects the long-term life and the like, it is preferable to ensure heat dissipation by, for example, setting the heat dissipation width to 5 times or more of the thickness of the heat dissipation plate. In addition to the manufacturing, the thermal stress caused by the heat generated by the large current type light-emitting element is eliminated by the thermal stress such as cracks because there is no member with a coefficient of thermal expansion that is significantly larger than that of other members. Problems that arise can be avoided. For this reason, even if it does not have the heat radiating means corresponding to the input power heat sink of several watts, it can be realized only by natural heat radiation from the heat sink and the case.

As for the downsizing of the package, the glass-containing Al ₂ O ₃ substrate and the glass 6 are bonded on the basis of a chemical bond via an oxide, so that a strong sealing strength can be obtained. A small package having bonding properties can be realized. For this reason, since it can be set as a package of 3 times or less with the LED element 2, it can be made into the thing with the low ratio which shields the light reflected by the reflective mirror surface 11A. In particular, the effect is great when a small reflecting mirror surface of about φ10 is used. This package corresponds to the light source unit. Moreover, it may be a small package in which a plurality of LED elements 2 are closely mounted, and in this case, the same characteristics are provided. However, at this time, it is desirable to increase the diameter of the reflecting mirror surface as the package becomes larger.

For the implementation of the above-described LED, by using a ceramic substrate having a thermal expansion coefficient equivalent to that of the low melting point glass, it has heat resistance during processing, and further, a temperature difference between processing and normal temperature, and a difference in thermal expansion coefficient. By suppressing the generation of thermal stress due to the above, cracks and the like are not generated. Furthermore, the light-emitting element can be processed in a high-viscosity glass state (10 ⁴ to 10 ⁹ poise) while using a flip mounting type that does not use a wire for mounting, and emits light based on hot press processing. Glass sealing is performed on the element and the ceramic substrate. As a result, the concept that the concept of the glass-sealed LED has been proposed but not realized has been solved.

Also, the LED 20, the phosphate glass (coefficient of thermal expansion ^{11.4 × 10 -6 / ℃, Tg390} ℃) and glass-containing _Al 2 _{O 3} substrate (coefficient of thermal expansion 12.3 × ^{10 -6} / ℃) Instead of the combination, a combination of silicate glass (thermal expansion coefficient 6.5 × 10 ⁻⁶ / ° C., Tg 500 ° C.) and an Al ₂ O ₃ substrate (thermal expansion coefficient 7.0 × 10 ⁻⁶ / ° C.) may be used. . When the thermal expansion coefficient of the sealing glass is about 7 × 10 ⁻⁶ / ° C., the thermal expansion coefficient is the same as that of the LED element 2, and the glass sealing can be performed even as the large-sized LED element 2. In addition, when the sealing material of the LED element 2 is a silicon resin, it is desirable to provide the transparent plate 12 because dust, dust, and the like are likely to adhere and are not easily removed. If it is glass, dust and dust hardly adhere to it and can be easily removed. For this reason, it is not necessary to provide the transparent plate 12, and in that case, there is an effect that heat radiation to the air from the inner surface of the case 10 or the reflecting mirror part 11 is promoted.

  Note that the circuit portion including the polyimide film is not necessarily used together with the heat radiating plate. When the heat radiating plate is not used, the polyimide surface may be subjected to mirror finishing such as silver plating or aluminum vapor deposition.

  12A and 12B show a reflective light emitting device according to the ninth embodiment of the present invention. FIG. 12A is a plan view seen from the light emission side, FIG. 12B is a rear view, and FIG. The longitudinal cross-sectional view in CC section of FIG. 1, (d) is a side view which shows the shape of the radiation fin of (b).

  In the light emitting device 1, light emitting portions 1R, 1G, and 1B that emit red (R), green (G), and blue (B) light are integrally provided in a substantially triangular case 10 made of copper. It is integrated with the reflecting mirror part 11 having the reflecting mirror surface 11A. The reflecting mirror unit 11 includes three reflecting mirror surfaces 11A that reflect R, G, and B light emitted from the three LED elements 3, respectively, and heat radiating fins 11C that are provided on the opposite side of the reflecting mirror surface 11A.

  The LED element 2 is an ultraviolet LED element that emits ultraviolet light, and is sealed with a phosphor-containing silicon resin described later.

  The case 10 is formed by punching a copper plate, and Ag plating is applied to the surface to enhance light reflectivity, and the surface is further overcoated with a transparent resin material. In addition, the three openings 100 for taking out the light emitted from the LED element 2 and reflected by the reflecting mirror surface 11A of the reflecting mirror part 11 and the heat radiation width in the back direction of the LED element 2 are reflected. A heat radiating plate 101 that radiates the heat generated by the LED element 2 without substantially blocking light reflected by the reflecting mirror surface 11A of the mirror unit 11 is provided. The heat radiating plate 101 is provided with an element mounting portion 101 </ b> A for mounting the LED element 2 in the center, and a circuit board 23 for supplying power to the LED element 2 is also mounted. The heat radiating plate 101 is integrally formed with the case 10 so as to efficiently conduct heat based on light emission of the LED element 2, and has a width w of 1 mm and a width h in the back direction of the light source unit including the LED element 2: It is formed with 7.5 mm.

  The reflector part 11 is made of copper like the case 10 and has an Ag plating on the surface. Further, the light emitted from the LED element 2 is reflected by the hemispherical reflecting mirror surface 11A provided at the opening 100 of the case 10 to extract the light to the side opposite to the light emitting direction of the LED element 2. It is formed as follows. Further, on the opposite side of the joint surface with the case 10, heat radiation fins 11C for improving heat radiation are provided in a straight line at a predetermined height and interval. In addition, the radiation fin 11C may be formed in a zigzag shape, for example, in addition to the illustrated linear shape, and may further be subjected to a roughening process that increases the surface area.

  13A and 13B partially show the heat sink and the element mounting portion, where FIG. 13A is a plan view seen from the light emission side, FIG. 13B is a sectional view taken along the line B-B in FIG. It is a cut view in CC section of b).

  As shown in FIG. 13A, a circuit board 23 formed in a thin film shape is bonded and fixed to the heat radiating plate 101, and the LED element 2 is mounted on the element mounting portion 101A via an AlN submount 25. The LED element 2 is sealed with a phosphor-containing silicon resin 24. Further, on the bottom surface of the AlN submount 25, there is provided a heat radiating sheet 26 made of a highly heat conductive material having adhesiveness that promotes heat radiating to the heat radiating plate 101. Instead of the heat dissipation sheet 26, any other adhesive material that promotes heat dissipation, such as Ag paste or solder, may be used.

  As shown in FIG. 13B, the circuit board 23 is a copper foil 230 serving as a conductive layer, a polyimide film 231 laminated on the copper foil 230, and a light reflecting film laminated on the surface polyimide film 231. And an Al vapor deposition portion 232.

  The phosphor-containing silicon resin 24 contains an RGB phosphor that is excited by ultraviolet light emitted from the LED element 2. In the present embodiment, a light emitting unit 1R that emits R excitation light, a light emitting unit 1G that emits G excitation light, and a light emitting unit 1B that emits B excitation light are given to the silicon resin. Is mixed in quantity. Therefore, white light based on the three primary colors of light can be obtained by simultaneously emitting light from the light emitting units 1R, 1G, and 1B.

  The AlN submount 25 is formed by electrically connecting a circuit pattern 25A made of W—Ni—Au provided on the mounting surface of the LED element 2 and the mounting surface to the circuit board 23 with a conductive pattern 25B.

  Further, as shown in FIG. 13C, the circuit board 23 is provided with an opening 231A for ensuring electrical connectivity with the AlN submount 25 in accordance with the circuit pattern 25A, and the opening 231A. The exposed Cu foil exposed portion 230A and the circuit pattern 25A provided on the bottom surface of the AlN submount 25 are electrically connected by solder or the like. The heat dissipating sheet 26 attached to the bottom surface of the AlN submount 25 comes into surface contact with the heat dissipating plate 101 through the through holes 233.

  According to the above-described ninth embodiment, the case 10 is integrally provided with the plurality of light emitting portions 1R, 1G, and 1B, and the light of the light emitting portions 1R, 1G, and 1B is reflected from the R, G, and B light. Since the external radiation is performed based on the reflection of the mirror surface 11A, a plurality of cellular light emitting portions can be arranged in a plane on the same surface, and a high-power full-color light emitting device that is thin and excellent in design is provided. can get.

  Although it is difficult to technically realize a halogen bulb of 10 W or less because it is difficult to obtain a sufficient halogen cycle even if there is a product need, as described in the ninth embodiment, a plurality of cellular light emitting units Are arranged in parallel and densely, so that the LED spot light source having excellent integration, compact and several W class can be realized. And since the light radiated | emitted from a LED light source does not contain a heat ray, even if objects, such as chocolate and a lipstick, adjoin, it has the characteristic that it does not melt | dissolve. In addition, the light emitting unit can be arranged in a spherical shape in addition to a planar shape.

  Since light of R, G, and B is externally radiated from the light emitting units 1R, 1G, and 1B disposed in the case 10 based on the reflection of the reflecting mirror surface 11A, R, G, and The light of B is irradiated to substantially the same area. As a result, the mixing of the three colors of light can be improved and illumination with good color rendering can be performed. Further, by performing energization control on the LED elements 2 of the light emitting units 1R, 1G, and 1B, a desired color can be irradiated with high luminance. In addition, the color expression range can be widened.

  In addition, in a light emitting device that generates white color by the complementary color of yellow light and blue light, when the light is collected using a condensing optical system using a lens, the difference in the degree of light collection by each wavelength is caused by the difference in refractive index based on the difference in the emission wavelength. In this case, ring-shaped color separation occurs in the condensed light. However, according to the configuration of the present invention, such color separation does not occur, which is suitable for lighting applications that require a strict color tone.

  Since the heat radiating plate 101 is integrally formed by punching the case 10, heat transfer is superior to the structure in which the heat radiating plate 101 is fitted into the case 10. Moreover, it is excellent in mass productivity.

  Furthermore, since the heat radiation fin 11C is integrally provided in the reflecting mirror part 11, the heat transmitted to the case 10 by the heat radiation plate 101 provided integrally with the case 10 increases, and this is transmitted to the heat radiation fin 11C. The heat dissipation to the air of the heat generated with the light emission of the LED element 2 is improved. Thus, even if the amount of heat generation increases due to the increase in the LED elements 2, no heat radiation failure occurs, and even when the LED elements 2 are driven for a long time, the light emission characteristics are not deteriorated due to heat.

  Since the case 10 and the reflecting mirror part 11 are formed of a metal material, the light emitting device 1 having excellent mechanical strength can be obtained. In particular, since the heat radiating plate 101 and the case 10 are integrally formed, the mechanical strength of the opening 100 is ensured, and the light radiation property is not impaired by crushing or deformation of this portion. In addition, since the LED element 2 is not exposed on the surface of the light emitting device 1, it can be structured to be hardly damaged by an external force or an impact.

  Since the LED element 2 is mounted and electrically connected to the thin film circuit board 23 made of the polyimide film 231 and the Cu foil 230, a simple wiring structure can be realized, and the light-emitting device 1 can be thinned, miniaturized, and produced. Can improve the performance. Moreover, since the Al vapor deposition part 232 provided in the surface of the polyimide film 231 reflects the light irradiated to the circuit board 23, and guides it to the reflective mirror surface 11A, it can suppress light loss.

  In addition, since the through hole 233 is opened in the circuit board 23, a heat transfer path between the AlN submount 25 and the heat sink 101 is formed, and the polyimide film 231 having a large thermal resistance is provided through the heat sink sheet 26. Therefore, it becomes possible to quickly dissipate the heat accompanying the heat generation of the LED element 2 without hindering the heat conductivity.

  In the ninth embodiment, the configuration of the light emitting device 1 having the light emitting units 1R, 1G, and 1B using the ultraviolet light LED element 2 and the RGB phosphor is described. However, the blue LED element 2 and the yellow excitation light are described. It is good also as white light emission part 1R, 1G, and 1B by the fluorescent substance which radiates | emits. As the phosphor in this case, for example, YAG (Yttrium Aluminum Garnet) activated with cerium can be used. Further, as another configuration using the blue LED element 2, a white color may be obtained by using a red phosphor and a green phosphor that emit red light when excited by blue light.

  Moreover, it is good also as the light-emitting device 1 which implement | achieves full-color illumination by arrange | positioning the LED element 2 of R, G, B close without using fluorescent substance, and radiating | emitting light based on reflection by the reflective mirror surface 11A.

  Furthermore, various changes can be made to the configuration of each unit described above. For example, the case 10 may be formed of a copper extrusion material. Further, the LED element 2 is not limited to the flip mounting type, and a face-up type LED element 2 can also be used. Further, the glass-sealed LED 20 described in the eighth embodiment may be mounted on the circuit board 23. In this case, the full color light emitting device 1 that is excellent in reliability over a long period of time can be obtained.

  14A and 14B show a modification of the ninth embodiment, in which FIG. 14A shows another example of the heat sink, FIG. 14B shows another example of the case, and FIG. 14C shows the case having irregularities on the surface. It is a formation example.

  In FIG. 14A, the heat radiating plate 101 is formed radially from the center of the substantially triangular case 10, and the design of the case 10 can be improved.

  FIG. 14B shows the case 10 having a circular outer shape. The case 10 is formed by extruding a copper alloy. By making the outer shape into a circular shape in this way, the light emitting device 1 having shape compatibility with an existing lamp or socket can be obtained.

  FIG. 14C shows an uneven surface 10C provided on the surface of a substantially triangular case 10, and heat dissipation can be improved by increasing the surface area. In addition to providing the uneven portion 10C, the same effect can be obtained by roughening the outer peripheral surface of the case 10 by blasting or the like. Moreover, you may use an uneven | corrugated process and a roughening process together.

  FIG. 15 is a plan view of a reflective light emitting apparatus according to the tenth embodiment of the invention.

  The light-emitting device 1 has a configuration in which a hexagonal case 10 is provided with seven light-emitting portions, a light-emitting portion 1B is arranged at the center, and two light-emitting portions 1G and four light-emitting portions 1R are arranged around it. Has been placed. Thus, by being able to arrange a plurality of light emitting portions close to each other, the full color light emitting device 1 having high brightness, small size, and excellent integration can be obtained. In addition, in the light-emitting device 1 which mounts the some LED element 2, it is preferable to give the unevenness | corrugation process and roughening process which improve heat dissipation to the surface of the case 10. FIG.

  FIG. 16 shows a light emitting unit of a reflective light emitting device according to an eleventh embodiment of the present invention, where (a) is a plan view of the light emitting unit, and (b) is a cross-sectional view taken along line AA of (a). It is.

  In this light emitting unit 1R, the heat sink 101 formed integrally with the case 10 shown in FIG. 16A is formed in a shape that does not block the light emitted from the LED 20, and is emitted from the LED 20. The reflecting mirror surface 11C is formed so that light is efficiently reflected by the reflecting mirror surface 11A of the reflecting mirror portion 11. Although the light emitting unit 1R is shown in the figure, for example, the light emitting units 1G and 1B shown in FIG. 12 can be formed similarly.

  The heat dissipating plate 101 is formed in a substantially pentagonal shape with the element mounting portion 101A protruding to the bottom surface side of the reflecting mirror surface 11A, and the LED 20 described in FIG. 10 is mounted on the element mounting portion 101A provided at the apex of the oblique side portion. . In the present embodiment, the LED 20 has a configuration in which a YAG phosphor is coated in a thin film on the surface of the blue LED element 2 to be mounted, thereby widening the light distribution that emits white light. It is a wavelength conversion type LED.

The reflecting mirror portion 11 is formed by injection molding of a resin material, and a mirror-like reflecting mirror surface 11A is formed by providing an Al vapor deposition film on a curved surface portion that becomes a reflecting mirror surface. The reflecting mirror surface 11A has a shape based on rotating an ellipse (f ₀ , f ₁ , focus) around the Z axis, and is 0 ° with respect to the Z axis direction of the LED 20 mounted on the element mounting portion 101A of the heat sink 101. The solid angle of the reflecting mirror surface 11A with respect to the LED 20 is set to 2.85πstrad in the range of ˜115 °. Depending on the light distribution of the light source, it is desirable for high-efficiency radiation to form a solid angle in the range of 0 ° to 90 ° or 120 ° with respect to the Z axis to 2π to 3.4πstrad.

  According to the eleventh embodiment described above, the LED 20 is mounted on the element mounting portion 101 protruding into the reflecting mirror portion 11 and the reflecting mirror portion 11 having a reflecting surface shape corresponding to the position of the LED 20 is provided. The heat dissipating area of the plate 101 is expanded and the heat dissipating property is improved. In addition, since the solid angle of the reflecting surface becomes large based on the arrangement of the LED 20 and the reflecting mirror surface 11A, almost all light emitted from the LED 20 having a wide light distribution characteristic is reflected by the reflecting mirror surface 11A and blocked by the heat sink 101. It is emitted efficiently without being generated. For this reason, it is particularly suitable for LEDs having a wide light distribution characteristic having phosphors. Further, higher luminance can be achieved by arranging and arranging a plurality of cellular light emitting portions.

  In the eleventh embodiment, the configuration in which the LED 20 is mounted on the circuit board 23 has been described. However, for example, a configuration in which the LED element 2 is mounted may be used.

1 is a reflection type light-emitting device according to a first embodiment of the present invention, in which (a) is a perspective view, (b) is a cross-sectional view taken along the line BB of (a), and (c) is (a). The longitudinal cross-sectional view in CC section of FIG. 1, (d) is the elements on larger scale of the modification of a LED element mounting part. It is sectional drawing of the reflection type light-emitting device based on the 2nd Embodiment of this invention. It is a reflection type light-emitting device concerning the 3rd Embodiment of this invention, (a) is a top view, (b) is a cross-sectional view in the DD section of (a), (c) is (a). It is a side view. It is a figure which shows a thermal radiation support | pillar, (a) is a side view, (b) is a top view. The reflective light-emitting device which concerns on the 4th Embodiment of this invention is shown, (a) is a longitudinal cross-sectional view, (b) is the top view seen from the Z direction. It is a partial block diagram of the reflective mirror part which concerns on the 5th Embodiment of this invention. It is a partial block diagram of the mold part which concerns on the 6th Embodiment of this invention. It is a partial block diagram of the LED element mounting part which concerns on the 7th Embodiment of this invention. It is a reflection type light-emitting device concerning the 8th Embodiment of this invention, (a) is a perspective view, (b) is a cross-sectional view in the BB part of (a), (c) is (a). It is a longitudinal cross-sectional view in CC section. It is sectional drawing which shows LED mounted in a light-emitting device. It is a heat sink which concerns on the 8th Embodiment of this invention, (a) is a front view, (b) is a side view, (c) is a bottom view, (d) and (e) are center parts on both sides It is a bottom view of the heat sink which has thickness rather than the part. It is a reflection type light-emitting device concerning a 9th embodiment of the present invention, (a) is a top view seen from the light radiation side, (b) is a rear view, (c) is CC of (a). (D) is a side view which shows the shape of the radiation fin of (b). The heat radiation part and the element mounting part are partially shown, (a) is a plan view seen from the light emission side, (b) is a cutaway view at the BB part of (a), (c) is C of (b) FIG. The modification of 9th Embodiment is shown, (a) is the other formation example of a thermal radiation part, (b) is the other formation example of a case, (c) is the formation example of the case which has an unevenness | corrugation on the surface. . It is a top view of the reflective light-emitting device which concerns on the 10th Embodiment of this invention. The light emission part of the reflection type light-emitting device based on the 11th Embodiment of this invention is shown, (a) is a top view of a light emission part, (b) is sectional drawing in the AA part of (a).

  As described above, according to the light-emitting device of the present invention, the heat radiating plate having the heat radiating width is provided in the back direction of the light-emitting element, and the reflection part provided to oppose the light emitted from the light-emitting element to the light-emitting surface side. Therefore, a high-power light-emitting element can be used, and a large amount of light can be irradiated with high efficiency.

  Further, according to the light emitting device of the present invention, a heat radiating plate having a heat radiating width is provided in the back direction of the light emitting element so as to be housed in a heat radiating case, and light emitted from the light emitting element is emitted on the light emitting surface side Since the light is reflected by the reflecting portion provided opposite to and radiated to the outside of the case, the heat dissipation is excellent, and the reduction of the radiation efficiency of reflected light can be minimized.

  Furthermore, according to the light emitting device of the present invention, the power supply unit for supplying power to the light emitting element is configured to use a metal thin film instead of the lead and sandwiched between two heat radiating plates, so that the number of parts can be reduced. Assembling becomes easy, and the cost can be reduced.

Claims (20)

A light-shielding heat sink made of a metal material;
A light source unit that is mounted on an end face of the heat sink and includes a solid-state light emitting element;
Power is supplied to the light source unit, insulated from the heat radiating plate, and integrally formed with the heat radiating plate ,
A light emitting device comprising: a reflection portion that reflects light emitted from the light source portion in a direction parallel to the heat dissipation plate and in a direction parallel to the heat dissipation plate . The power supply unit, the light emitting device according to claim 1, wherein the benzalkonium such a metallic thin film. The power supply unit, the light emitting device according to claim 2, characterized in that it is sandwiched enter through an insulator to the heat radiating plate of several.   4. The light emitting device according to claim 1, wherein the light source unit is packaged by sealing the solid light emitting element with a light transmissive material. 5. The light source unit includes the solid-state light emitting element that is flip-chip mounted.
Mounted on an inorganic material substrate formed with a conductive pattern for receiving and supplying power to the solid state light emitting device,
The light emitting device according to claim 4, wherein the light emitting device is sealed with an inorganic sealing material having a thermal expansion coefficient equivalent to that of the inorganic material substrate.   The light emitting device according to claim 5, wherein the inorganic sealing material is glass.   The light emitting device according to claim 6, wherein the inorganic sealing material has a refractive index of 1.55 or more.   8. The light emitting device according to claim 1, wherein spectrum light having a wavelength in a plurality of regions is emitted from the solid light emitting element or the periphery of the solid light emitting element.   The light-emitting device according to claim 8, wherein a phosphor is disposed around the solid-state light-emitting element. Accommodating the front Symbol reflective portion and the heat radiating plate, having cases having a first opening wherein the reflecting portion is disposed, and a second opening for taking out the reflected light in the reflective portion The light emitting device according to claim 1, wherein the light emitting device is a light emitting device. The light-emitting device according to claim 10, wherein the heat radiating plate is formed of the same member as the case. Wherein the case, the light emitting device according to claim 11, characterized in that it comprises a front surface reflect light. The outer peripheral surface of the case, in order to enlarge the heat release area, the light-emitting device according to claim 11 or 12, characterized in that the uneven portion is formed. The outer peripheral surface of the case, the light emitting apparatus according to claim 11 or 12, characterized that in order to enlarge the heat release area is roughened. The heat sink, the light emitting device according to any one of claims 1 14, characterized in Rukoto that having a front surface you reflect light. The light emitting device according to claim 15, wherein the heat radiating plate has a shape protruding toward the reflecting portion .   The light-emitting device according to claim 1, wherein the reflecting portion is formed of a resin material.   The light source device according to claim 1, wherein the light source unit includes a plurality of the solid light emitting elements. 19. The light-emitting device according to claim 1, comprising a plurality of the light source units, and having a plurality of reflection units and a heat radiating plate corresponding to the plurality of light source units. The light emitting device according to claim 19, wherein the plurality of light source units include light source units having red ( R ) , green ( G ) , and blue ( B ) emission colors.

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