JP3814810B2 - Bismuth glass composition - Google Patents
Bismuth glass composition Download PDFInfo
- Publication number
- JP3814810B2 JP3814810B2 JP11022096A JP11022096A JP3814810B2 JP 3814810 B2 JP3814810 B2 JP 3814810B2 JP 11022096 A JP11022096 A JP 11022096A JP 11022096 A JP11022096 A JP 11022096A JP 3814810 B2 JP3814810 B2 JP 3814810B2
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- Prior art keywords
- glass
- content
- glass composition
- thermal expansion
- bismuth
- Prior art date
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- 239000011521 glass Substances 0.000 title claims description 40
- 239000000203 mixture Substances 0.000 title claims description 12
- 229910052797 bismuth Inorganic materials 0.000 title claims description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 title claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 4
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- 238000007789 sealing Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000006066 glass batch Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052844 willemite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Description
【0001】
【産業上の利用分野】
本発明は電子部品の接着、封着、被覆等に好適なビスマス系ガラス組成物に関するものである。
【0002】
【従来の技術】
従来から電子部品の接着や封着材料として、或いは電子部品に形成された電極や抵抗体の保護や絶縁のための被覆材料としてガラスが用いられている。
【0003】
これらのガラスは、その用途に応じて化学耐久性、機械的強度、流動性、電気絶縁性等種々の特性が要求されるが、何れの用途にも共通する特性として、低温で焼成可能であることが挙げられる。それゆえ何れの用途においても、ガラスの融点を下げる効果が極めて大きいPbOを多量に含有した低融点ガラスが広く用いられている。
【0004】
【発明が解決しようとする課題】
しかしながら最近、PbO含有ガラスに対して環境上の問題が指摘されており、PbOを含まないガラスに置換することが望まれている。またPbOを多量に含有するガラスを用いて電気絶縁膜を形成すると、Pb2+イオンが拡散して電気絶縁性が低下し易いという不都合もある。
【0005】
本発明は上記事情に鑑みなされたものであり、650℃以下の温度で焼成が可能であるとともに、PbOを含有しないために環境問題が生じたり、電気絶縁性が低下する恐れがないガラス組成物を提供することを目的とする。
【0006】
【課題を解決するための手段】
本発明のビスマス系ガラス組成物は、重量百分率でBi2O3 20〜80%、B2O3 5〜35%、BaO 0〜35%、SrO 0〜30%、BaO+SrO 5〜40%(ただし5%を含まず)、ZnO 0〜9%、CaO 0〜10%、Fe2O3 0〜5%、CuO 2〜10%、ZnO+CaO+Fe2O3+CuO 2〜20%、SiO2 0〜8%、Al2O3 0〜5%、Cs2O 0〜5%、F2 0〜5%の組成を有し、本質的にPbOを含有しないことを特徴とする。
【0007】
【作用】
本発明のビスマス系ガラス組成物の組成を上記のように限定した理由は次のとおりである。
【0008】
Bi2 O3 はガラスの軟化点を下げるための主要成分であり、その含有量は20〜80%、好ましくは40〜75%である。Bi2 O3 の含有量が20%より少ないと軟化点が高くなり過ぎて650℃以下で焼成できなくなり、80%より多いと熱膨張係数が大きくなり過ぎて好ましくない。
【0009】
B2 O3 はガラス形成成分として必須であり、その含有量は5〜35%、好ましくは7〜25%である。B2 O3 の含有量が5%より少ないとガラスが不安定になって失透し易くなる。また失透を生じない場合でも、焼成時に結晶の析出速度が極めて大きく、接着、封着、被覆等の作業に必要な流動性が得られない。一方、B2 O3 が35%より多くなるとガラスの粘性が高くなり過ぎて650℃以下の温度で焼成が困難になる。
【0010】
BaOとSrOはガラスの安定化に大きな効果があり、これらを合量で5〜40%(ただし5%を含まず)、好ましくは7〜30%含有する。これらの成分の合量が5%以下であればその効果がなく、一方、40%より多くなると逆に安定なガラスが得られなくなる。またBaOの含有量は0〜35%、好ましくは0〜25%、SrOの含有量は0〜30%、好ましくは0〜20%である。BaO及びSrOがそれぞれその範囲を超えると安定なガラスが得られなくなる。
【0011】
ZnO、CaO、Fe2O3及びCuOは何れもガラスを安定化させるための成分であり、その含有量は合量で2〜20%、好ましくは2〜15%である。これらの成分が合量で2%より少ないとその効果がなく、20%より多いと逆にガラスが不安定になる。またZnOの含有量は0〜9%、好ましくは0.1〜9%、CaOの含有量は0〜10%、好ましくは0〜5%、Fe2O3の含有量は0〜5%、好ましくは0〜4%、CuOの含有量は2〜10%、好ましくは2〜5%である。各成分の含有量が上記範囲を超えると逆に安定なガラスが得られなくなる。
【0012】
SiO2 及びAl2 O3 は何れもガラスをより安定化させるために含有させる成分であり、SiO2 の含有量は0〜8%、好ましくは0〜5%、Al2 O3 の含有量は0〜5%、好ましくは0〜4%である。これらの成分が上記範囲を超えるとガラスの粘性が高くなり過ぎたり、失透し易くなって好ましくない。
【0013】
Cs2 OとF2 はガラスをより低粘性化する成分であり、Cs2 Oの含有量は0〜5%、好ましくは0〜3%、F2 の含有量は0〜5%、好ましくは0〜2%である。これらの成分が上記範囲を超えるとガラスの化学耐久性が低下する。
【0014】
なお上記成分以外にも、ガラスの粘性や熱膨張係数の調整のために、MgO、La2 O3 、TiO2 、ZrO2 、V2 O5 、Nb2 O5 、MoO3 、WO3 、Ag2 O、Na2 O、K2 O、Li2 O等を5%以下添加することが可能である。
【0015】
以上の組成を有するガラスは、ガラス転移点が約500℃以下であり、良好な流動性を示す非結晶性又は結晶性のガラスである。また30〜300℃における熱膨張係数が約80×10-7/℃以上であり、これと適合する高膨張材料を650℃以下の温度で接着、封着又は被覆することが可能である。
【0016】
一方、熱膨張係数の適合しない材料の接着、封着又は被覆を行う場合、対象物との熱膨張係数差を是正するために、耐火性フィラーを混合して使用することが可能である。また機械的強度が不足する場合も耐火性フィラーを混合して使用することができる。
【0017】
耐火性フィラーを混合する場合、その混合割合はガラス45〜95体積%と耐火性フィラー55〜5体積%であることが好ましい。両者の割合をこのように限定した理由は、耐火性フィラーが5体積%より少ないとその効果がなく、55体積%より多くなると流動性が悪くなるためである。
【0018】
耐火性フィラーとしては、チタン酸鉛系セラミック、ウイレマイト系セラミック、β−ユークリプタイト、コーディエライト、ジルコン系セラミック、酸化錫系セラミック、ムライト、石英ガラス、アルミナ等の粉末を単独、或は組み合わせて使用することが好ましい。
【0019】
なお本発明のビスマス系ガラス組成物の具体的な用途としては、▲1▼蛍光表示管−パッケージの封着、絶縁層の形成、▲2▼プラズマディスプレイ−パネルの気密封着、絶縁層や誘電体層の形成、バリアリブの形成、▲3▼磁気ヘッド−コア同士又はコアとスライダーの封着、等が挙げられる。また使用時の形態は特に制限はなく、粉末状、板状、棒状等、その用途に応じて種々の形態に成形して使用すればよい。
【0020】
【実施例】
以下、本発明のビスマス系低融点ガラス組成物を実施例に基づいて詳細に説明する。
【0021】
表1及び表2は、本発明の実施例(試料No.2、5及び10)を示すものである。なおその他の試料は参考例である。
【0022】
【表1】
【0023】
【表2】
【0024】
表の各試料は次のようにして調製した。
【0025】
まず表に示したガラス組成となるように各種酸化物、炭酸塩等を調合したガラスバッチを準備し、これを白金坩堝に入れて900〜1100℃で2時間溶融した後、溶融ガラスをステンレス製の金型に流しだし成形した。得られた各試料について、ガラス転移点、30〜300℃における熱膨張係数、焼成温度、及び結晶性か非結晶性かを評価した。結果を表に示す。
【0026】
表から明らかなように、実施例の各試料は、ガラス転移点が390〜452℃、30〜300℃の温度範囲における熱膨張係数が90〜110×10-7/℃であり、焼成温度が600℃以下であった。また試料No.2は非結晶性、No.5及びNo.10は結晶性であった。
【0027】
なお転移点は示差熱分析装置(DTA)により求めた。熱膨張係数は、成形したガラス体を直径4mm、長さ40mmの円柱状に研磨加工し、押し棒式熱膨張係数測定装置を用いて測定した。焼成温度は、次のようにして求めた。まずガラス体を粉砕してガラス粉末を得、ガラスの真比重に相当する重量のガラス粉末を金型を用いて外径20mm、高さ約5mmのボタン状に加圧成形した。次いでこのボタンを板ガラスの上に載せて電気炉に入れ、10℃/分の速度で昇温し、種々の温度で10分間保持した。このようにして得られたボタンの外径が21〜22mmの範囲にある温度を焼成温度とした。また結晶性か非結晶性かの判定は、焼成温度で10分間加熱された後の試料の外観を顕微鏡で観察し、結晶の析出状態から評価した。
【0028】
【発明の効果】
以上のように本発明のビスマス系ガラス組成物は、PbOを含有しないため、環境問題を引き起こす心配がない。また650℃以下の温度で焼成できるため、従来のPbOを含有する低融点ガラスの代替材料として、電子部品の接着、封着、被覆等の用途に使用することが可能である。[0001]
[Industrial application fields]
The present invention relates to a bismuth-based glass composition suitable for bonding, sealing, coating, etc. of electronic components.
[0002]
[Prior art]
Conventionally, glass has been used as an adhesive or sealing material for electronic components, or as a coating material for protecting and insulating electrodes and resistors formed on electronic components.
[0003]
These glasses are required to have various properties such as chemical durability, mechanical strength, fluidity, and electrical insulation depending on the application, but can be fired at a low temperature as a property common to all applications. Can be mentioned. Therefore, in any application, a low melting point glass containing a large amount of PbO that has a great effect of lowering the melting point of the glass is widely used.
[0004]
[Problems to be solved by the invention]
Recently, however, environmental problems have been pointed out with respect to PbO-containing glasses, and it is desired to replace them with glasses that do not contain PbO. In addition, when an electrical insulating film is formed using glass containing a large amount of PbO, there is also a disadvantage that Pb 2+ ions diffuse and electrical insulating properties are likely to be lowered.
[0005]
The present invention has been made in view of the above circumstances, and can be fired at a temperature of 650 ° C. or lower, and does not contain PbO, so that there is no risk of environmental problems or a decrease in electrical insulation. The purpose is to provide.
[0006]
[Means for Solving the Problems]
The bismuth-based glass composition of the present invention is, by weight percentage, Bi 2 O 3 20-80%, B 2 O 3 5-35%, BaO 0-35%, SrO 0-30%, BaO + SrO 5-40% (however, 5% free of), ZnO 0~9%, CaO 0~10 %, Fe 2 O 3 0~5%, CuO 2 ~10%, ZnO + CaO + Fe 2 O 3 + CuO 2 ~20%, SiO 2 0~8% , Al 2 O 3 0 to 5%, Cs 2 O 0 to 5%, F 2 0 to 5%, and essentially free of PbO.
[0007]
[Action]
The reason for limiting the composition of the bismuth-based glass composition of the present invention as described above is as follows.
[0008]
Bi 2 O 3 is a main component for lowering the softening point of the glass, and its content is 20 to 80%, preferably 40 to 75%. If the content of Bi 2 O 3 is less than 20%, the softening point becomes too high and it becomes impossible to fire at 650 ° C. or less, and if it exceeds 80%, the thermal expansion coefficient becomes too large.
[0009]
B 2 O 3 is essential as a glass forming component, and its content is 5 to 35%, preferably 7 to 25%. If the content of B 2 O 3 is less than 5%, the glass becomes unstable and tends to devitrify. Even when devitrification does not occur, the crystal deposition rate is extremely high during firing, and the fluidity necessary for operations such as adhesion, sealing, and coating cannot be obtained. On the other hand, if B 2 O 3 exceeds 35%, the viscosity of the glass becomes too high and firing at a temperature of 650 ° C. or less becomes difficult.
[0010]
BaO and SrO have a great effect on the stabilization of the glass, and these are contained in a total amount of 5 to 40% (excluding 5%) , preferably 7 to 30%. If the total amount of these components is 5% or less, the effect is not obtained. On the other hand, if it exceeds 40%, a stable glass cannot be obtained. The content of BaO is 0 to 35%, preferably 0 to 25%, and the content of SrO is 0 to 30%, preferably 0 to 20%. If BaO and SrO exceed the respective ranges, stable glass cannot be obtained.
[0011]
ZnO, CaO, Fe 2 O 3 and CuO is a component for stabilizing the glass any, its content is 2-20% in total, preferably 2 15%. If the total amount of these components is less than 2 %, the effect is not obtained, and if it exceeds 20%, the glass becomes unstable. The ZnO content is 0 to 9%, preferably 0.1 to 9%, the CaO content is 0 to 10%, preferably 0 to 5%, and the Fe 2 O 3 content is 0 to 5%. Preferably it is 0 to 4%, and the content of CuO is 2 to 10%, preferably 2 to 5%. If the content of each component exceeds the above range, a stable glass cannot be obtained.
[0012]
SiO 2 and Al 2 O 3 are both components that are added to stabilize the glass. The content of SiO 2 is 0 to 8%, preferably 0 to 5%, and the content of Al 2 O 3 is 0 to 5%, preferably 0 to 4%. If these components exceed the above range, the viscosity of the glass becomes too high or the glass tends to devitrify, which is not preferable.
[0013]
Cs 2 O and F 2 are components that lower the viscosity of the glass. The content of Cs 2 O is 0 to 5%, preferably 0 to 3%, and the content of F 2 is 0 to 5%, preferably 0-2%. When these components exceed the above range, the chemical durability of the glass is lowered.
[0014]
In addition to the above components, MgO, La 2 O 3 , TiO 2 , ZrO 2 , V 2 O 5 , Nb 2 O 5 , MoO 3 , WO 3 , Ag are used for adjusting the viscosity and thermal expansion coefficient of glass. It is possible to add 5% or less of 2 O, Na 2 O, K 2 O, Li 2 O and the like.
[0015]
The glass having the above composition is an amorphous or crystalline glass having a glass transition point of about 500 ° C. or less and showing good fluidity. Further, the coefficient of thermal expansion at 30 to 300 ° C. is about 80 × 10 −7 / ° C. or higher, and a high expansion material compatible therewith can be bonded, sealed or coated at a temperature of 650 ° C. or lower.
[0016]
On the other hand, when bonding, sealing, or coating a material that does not match the thermal expansion coefficient, it is possible to mix and use a refractory filler in order to correct the difference in thermal expansion coefficient from the object. Also, when the mechanical strength is insufficient, a refractory filler can be mixed and used.
[0017]
When mixing a refractory filler, the mixing ratio is preferably 45 to 95% by volume of glass and 55 to 5% by volume of refractory filler. The reason for limiting the ratio of the two in this way is that when the refractory filler is less than 5% by volume, the effect is not achieved, and when it exceeds 55% by volume, the fluidity is deteriorated.
[0018]
As the refractory filler, powders of lead titanate ceramics, willemite ceramics, β-eucryptite, cordierite, zircon ceramics, tin oxide ceramics, mullite, quartz glass, alumina, etc., alone or in combination Are preferably used.
[0019]
Specific applications of the bismuth-based glass composition of the present invention include (1) fluorescent display tube-sealing of a package, formation of an insulating layer, (2) hermetic sealing of a plasma display-panel, an insulating layer and a dielectric. Examples include formation of a body layer, formation of a barrier rib, and (3) sealing of a magnetic head-core or between a core and a slider. Moreover, the form at the time of use does not have a restriction | limiting in particular, What is necessary is just to shape | mold and use it in various forms according to the use, such as powder form, plate shape, rod shape.
[0020]
【Example】
Hereinafter, the bismuth-based low-melting glass composition of the present invention will be described in detail based on examples.
[0021]
Tables 1 and 2 show examples of the present invention (sample Nos. 2, 5, and 10 ). Other samples are reference examples.
[0022]
[Table 1]
[0023]
[Table 2]
[0024]
Each sample in the table was prepared as follows.
[0025]
First, a glass batch prepared by mixing various oxides, carbonates and the like so as to have the glass composition shown in the table was prepared, put in a platinum crucible and melted at 900 to 1100 ° C. for 2 hours, and then the molten glass was made of stainless steel. The mold was poured into the mold. About each obtained sample, the glass transition point, the thermal expansion coefficient in 30-300 degreeC, a calcination temperature, and crystalline or non-crystalline were evaluated. The results are shown in the table.
[0026]
As is apparent from the table, each sample of the examples has a glass transition point of 390 to 452 ° C. and a thermal expansion coefficient of 90 to 110 × 10 −7 / ° C. in a temperature range of 30 to 300 ° C., and a firing temperature. It was 600 ° C. or lower. Sample No. 2 is non-crystalline. 5 and no . 10 was crystalline.
[0027]
The transition point was determined by a differential thermal analyzer (DTA). The thermal expansion coefficient was measured using a push rod type thermal expansion coefficient measuring device after polishing the molded glass body into a cylindrical shape having a diameter of 4 mm and a length of 40 mm. The firing temperature was determined as follows. First, the glass body was pulverized to obtain a glass powder, and a glass powder having a weight corresponding to the true specific gravity of the glass was press-molded into a button shape having an outer diameter of 20 mm and a height of about 5 mm using a mold. Next, this button was placed on a plate glass, placed in an electric furnace, heated at a rate of 10 ° C./min, and held at various temperatures for 10 minutes. The temperature at which the outer diameter of the button thus obtained was in the range of 21 to 22 mm was defined as the firing temperature. The crystallinity or non-crystallinity was determined by observing the appearance of the sample after being heated at the firing temperature for 10 minutes with a microscope and evaluating from the crystal precipitation state.
[0028]
【The invention's effect】
As described above, since the bismuth-based glass composition of the present invention does not contain PbO, there is no concern of causing environmental problems. Moreover, since it can bake at the temperature of 650 degrees C or less, it can be used for uses, such as adhesion | attachment of an electronic component, sealing, and coating | cover, as an alternative material of the low melting glass containing conventional PbO.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11022096A JP3814810B2 (en) | 1996-04-05 | 1996-04-05 | Bismuth glass composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11022096A JP3814810B2 (en) | 1996-04-05 | 1996-04-05 | Bismuth glass composition |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005355739A Division JP4154732B2 (en) | 2005-12-09 | 2005-12-09 | Sealing bismuth glass mixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09278483A JPH09278483A (en) | 1997-10-28 |
| JP3814810B2 true JP3814810B2 (en) | 2006-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11022096A Expired - Fee Related JP3814810B2 (en) | 1996-04-05 | 1996-04-05 | Bismuth glass composition |
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| Country | Link |
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| JP (1) | JP3814810B2 (en) |
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-
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- 1996-04-05 JP JP11022096A patent/JP3814810B2/en not_active Expired - Fee Related
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