JP3880362B2

JP3880362B2 - Method and apparatus for cleaning polishing surface plate

Info

Publication number: JP3880362B2
Application number: JP2001319352A
Authority: JP
Inventors: 紀彦守屋
Original assignee: Fujikoshi Machinery Corp
Current assignee: Fujikoshi Machinery Corp
Priority date: 2001-10-17
Filing date: 2001-10-17
Publication date: 2007-02-14
Anticipated expiration: 2021-10-17
Also published as: JP2003117819A

Description

【０００１】
【発明の属する技術分野】
本発明は研磨定盤の洗浄方法及びその洗浄装置に関し、更に詳細には、両面研磨装置に設けられた上定盤と下定盤とを回転しつつ、互いに対向する前記上定盤と下定盤との研磨面の各々に沿って移動する噴射ノズルから水を噴射して各研磨面を洗浄する研磨定盤の洗浄方法及びその洗浄装置に関する。
【０００２】
【従来の技術】
シリコンウェーハに代表される薄板状の被加工物の両面を研磨する両面研磨装置としては、例えばラッピング装置が汎用されている。かかるラッピング装置を図９に示す。
図９に示すラッピング装置では、上定盤２０の下面にシリコンウェーハ等の薄板状の被加工物であるワーク１０をラッピングする研磨面が形成され、上面にキー２１が装着されている。この上定盤２０の上方には、空圧等のシリンダ装置２２が位置しており、シリンダ装置２２は門型フレーム１４の上部に設置されている。上定盤２０は、回転板２３及び連結ロッド２７を介し、シリンダ装置２２のピストンロッド２２ａの先端に吊り下げられ、回転自在に支持されている。すなわち、回転板２３に固定された連結部２２ｂによって、ピストンロッド２２ａは回転しない状態で、ピストンロッド２２ａに対し、連結ロッド２７を介して連繋された回転板２３及び上定盤２０が、回転可能且つ脱落しないように設けられている。このため、上定盤２０は、その自重に基づく下定盤３０への押圧力を、シリンダ装置２２による吊り上げ力の調整で加減圧可能に設けられている。
尚、下定盤３０への押圧力の調整は、シリンダ装置等の加圧手段によって上定盤２０に加えられる押圧力を調整して行う場合もある。
【０００３】
また、上定盤２０は、キー２１が駆動モータ７０の動力で回転される回し金５４のキー溝に挿入・係合しており、駆動モータ７０によって回転駆動される。回し金５４の下部には回し金シャフト５４ａが垂設されており、その下端部に設けられたシャフトギヤ５４ｂは、アイドルギヤ６３を介してスピンドル６０に設けられたスピンドルギヤ６４に噛合している。この動力伝達機構により、駆動モータ７０の動力が回し金５４を介して上定盤２０に伝達される。
尚、上定盤２０と回し金５４とをキー２１で連繋するのは、ワーク１０の給排或いは保守管理の際に、シリンダ装置２０を駆動して上定盤２０を下定盤３０との間隔が広く開くように吊り上げる必要のためである。
【０００４】
キャリア４０に噛合してキャリア４０を回転駆動するギアとしては、エクスターナルギヤ５０とインターナルギア５２とが形成されており、エクスターナルギヤ５０には、回し金シャフト５４ａの周囲に同心に設けられた第１中空シャフト５０ａが連結しており、その第１中空シャフト５０ａに設けられたシャフトギヤ５０ｂは、スピンドル６０に設けられたスピンドルギヤ６５に噛合している。
更に、下定盤３０には、第１中空シャフト５０ａの周囲に同心に設けられた第２中空シャフト３０ａが連結されており、その第２中空シャフト３０ａの中途部に設けられたシャフトギヤ３０ｂがスピンドル６０に設けられたスピンドルギヤ６１に噛合している。
【０００５】
また、インターナルギヤ５２には、第２中空シャフト３０ａの周囲に同心状に設けられた第３中空シャフト５２ａが連結されており、その第３中空シャフト５２ａに設けられたシャフトギヤ５２ｂがスピンドル６０に設けられたスピンドルギヤ６２に噛合している。このスピンドル６０は、可変減速機６９に連結されており、その可変減速機６９はベルトを介して電動モータ、油圧モータ等の駆動モータ７０に連結されている。
この様に、上定盤２０、下定盤３０、エクスターナルギヤ５０、インターナルギヤ５２は、同一の駆動モータ７０よって、可変減速機６９、ギヤ列、各シャフトを介してそれぞれ動力が伝達されて、回転駆動されている。
【０００６】
ところで、図９に示す下定盤３０の上向きの研磨面には、図１０に示す様に、横溝１２と縦溝１６とが格子状に形成されている。かかる格子状の横溝１２及び縦溝１６は、上定盤２０の下向きの研磨面にも形成されている。この各研磨面に形成された格子状の横溝１２及び縦溝１６は、ワーク１０の研磨屑や研磨液等を排出するためのものである。
かかる横溝１２及び縦溝１６には、ワーク１０の研磨が終了した後に残留した研磨屑や研磨剤等が次第に堆積し、遂にはワーク１０の研磨面を損傷する等の弊害が発生するため、所定枚数のワーク１０の研磨が終了した後、シリンダ装置２２を駆動して上定盤２０と下定盤３０との間を広げ、上定盤２０及び下定盤３０の各研磨面を洗浄する。
しかし、上定盤２０及び下定盤３０の各研磨面に形成された横溝１２及び縦溝１６に堆積した堆積物は固化しかけた状態であるため、その除去は人手によって金属板を溝中に挿入して堆積物を掻き出す掻出作業がなされていた。かかる掻出作業は、時間が掛かると共に、研磨面を損傷するおそれがあった。
【０００７】
この様な掻出作業を自動化すべく、特開平７−９３４２号公報には、図１１に示す洗浄装置が提案されている。この洗浄装置には、先端部にブラシ状部材１０２，１０２によって囲まれた二個の噴射ノズル１００ａ，１００ｂが、シャフト１０６に上下に設けられており、高圧ポンプ１０４から供給される高圧水が噴射ノズル１００ａ、１００ｂから上下方向に噴射される。かかる噴射ノズル１００ａ，１００ｂが設けられたシャフト１０６は、上下方向に昇降可能に設けられている共に、水平方向にも移動可能に設けられている。
このため、図１０に示す洗浄装置によれば、図１２に示す様に、回転している上定盤２０と下定盤３０との互いに対向する両研磨面間に、ブラシ状部材１０２，１０２の先端が同時に接触するように挿入した噴射ノズル１００ａ，１００ｂから各研磨面に向けて５０〜１００気圧程度の高圧水を同時に噴射しつつ、噴射ノズル１００ａ，１００ｂを研磨面のラジアル方向に移動することによって、各研磨面に形成された格子状の横溝１２及び縦溝１６に堆積した堆積物を除去することができる。
【０００８】
【発明が解決しようとする課題】
図９及び図１０に示す洗浄装置によれば、従来の人手による上定盤２０及び下定盤３０の各研磨面の洗浄を自動化できる。
更に、噴射ノズル１００ａ，１００ｂの各々から各研磨面に噴射水を噴射する際には、噴射ノズル１００ａ，１００ｂの各々は、ブラシ状部材１０２，１０２の各々と各研磨面とに囲まれた領域内に位置し、噴射ノズル１００ａ，１００ｂの各々から各研磨面に噴射された噴射水等は、この領域外に噴出することを防止できる。
しかし、上定盤２０及び下定盤３０の各研磨面の全面を洗浄するには、上定盤２０及び下定盤３０の各研磨面の外周端近傍も洗浄する必要がある。このため、噴射ノズル１００ａ，１００ｂを上定盤２０及び下定盤３０の各研磨面の外周端近傍まで移動すると、図１３に示す如く、上定盤２０及び下定盤３０の各外周端とブラシ状部材１００ａ，１００ｂとの間に隙間が形成される。このため、この隙間を経由して噴射ノズル１００ａ，１００ｂから噴射された噴射水や噴霧水等が噴出する。
【０００９】
下定盤３０の外周端との隙間から噴出する噴射ノズル１００ｂから噴射された噴射水や噴霧水等は、下定盤３０から排出される研磨液を受けて装置外に導く研磨液の排出受けに噴出される。この排出受けは、下定盤３０の外周面に沿って設けられており、下定盤３０の外周端に沿って開口されている。この開口には、図９に示す様に、インターナルギヤ５２等が設けられており、開口幅を狭くしている。このため、研磨液の排出受けに噴出した噴射水や噴霧水等は、研磨液の排出受けの開口から再噴出することはない。
これに対し、上定盤２０の外周端との隙間から噴出する、噴射ノズル１００ａから噴射された噴射水や噴霧水等は、研磨装置が載置されている空間に直接噴射される。
この様に、研磨装置が載置されている空間に直接噴射された噴射水や噴霧水等は、上定盤２０の研磨面を洗浄した洗浄水であるため、研磨製品等に付着して汚染したりする。
特に、シリコンウェーハに研磨を施す研磨装置は、クリーンルーム内に載置されていることが多く、上定盤２０の外周端との隙間から噴出する、噴射ノズル１００ａから噴射された噴射水や噴霧水等は、クリーンルーム内の清浄度を低下させる原因ともなる。
【００１０】
一方、上定盤２０の研磨面に噴射ノズル１００ａから噴射された噴射水や噴霧水等が、上定盤２０の外周端との隙間から噴出されないように、噴射ノズル１００ａ，１００ｂの移動範囲を制限すると、上定盤２０及び下定盤３０の研磨面の外周端近傍が洗浄されず、人手で各研磨面を洗浄しなければならない。このため、上定盤２０及び下定盤３０の各研磨面の洗浄を自動化することは困難となる。そこで、本発明の課題は、両面研磨装置に設けられた上定盤と下定盤との各研磨面の全面を、噴射ノズルから各研磨面に噴射した噴射水や噴霧水等を研磨装置が載置されている空間内に噴出することなく洗浄できる研磨定盤の洗浄方法及びその洗浄装置を提供することにある。
【００１１】
【課題を解決するための手段】
本発明者は、前記課題を解決すべく検討した結果、噴射ノズルを囲むブラシ状部材と上定盤の研磨面とによって画され、上定盤の研磨面に向けて噴射水を噴射する噴射ノズルを、上定盤の外周端近接に移動し、ブラシ状部材と上定盤の外周端との間に隙間が形成されたとき、この隙間を別のブラシ材によって閉塞することによって、研磨装置が載置されている空間に、上定盤の外周端とブラシ状部材との隙間から噴射水や噴霧水等が噴出することを防止できることを見出し、本発明に到達した。
すなわち、本発明は、両面研磨装置に設けられた上定盤と下定盤とを回転しつつ、互いに対向する前記上定盤と下定盤との研磨面の各々に沿って移動する噴射ノズルから水を噴射して各研磨面を洗浄する際に、該噴射ノズルを囲むように設けられ、前記噴射ノズルから洗浄対象の研磨面に噴射された噴射水等の飛散防止手段と、前記洗浄対象の研磨面に沿って噴射ノズルを移動する移動手段とを具備する洗浄装置を用い、前記上定盤の研磨面と飛散防止手段とによって囲まれ、前記上定盤の研磨面に向けて水を噴射する噴射ノズルを、前記上定盤の研磨面の外周端近傍を洗浄すべく、前記移動手段により上定盤の外周端近接に移動し、前記飛散防止手段と上定盤の外周端との間に隙間が形成されたとき、前記隙間を経由して噴射ノズルからの噴射水等が噴出しないように、前記隙間を隙間閉塞手段によって閉塞することを特徴とする研磨定盤の洗浄方法にある。
【００１２】
また、本発明は、両面研磨装置に設けられた上定盤と下定盤とを回転し、互いに対向する前記上定盤と下定盤との研磨面の各々に沿って移動する噴射ノズルから水を噴射して各研磨面を洗浄する研磨定盤の洗浄装置において、該噴射ノズルを取り囲むように設けられ、前記噴射ノズルから洗浄対象の研磨面に噴射された噴射水等の飛散防止手段と、前記洗浄対象の研磨面に沿って噴射ノズルを移動する移動手段とを具備し、前記上定盤の研磨面と飛散防止手段とによって囲まれ、前記上定盤の研磨面に向けて水を噴射する噴射ノズルを、前記移動手段により上定盤の外周端近接に移動し、前記飛散防止手段と上定盤の外周端との間に隙間が形成されたとき、前記間隙を経由して噴射ノズルからの噴射水等が噴出しないように、前記隙間を閉塞する隙間閉塞手段が設けられていることを特徴とする研磨定盤の洗浄装置にある。
【００１３】
かかる本発明において、噴射ノズルとして、上定盤の研磨面に向けて水を噴射する噴射ノズルと、下定盤の研磨面に向けて水を噴射する噴射ノズルとを備えることによって、上定盤の研磨面と下定盤の研磨面とを同時に洗浄できる。
或いは、噴射ノズルとして、回動可能に設けられた噴射ノズルを用い、洗浄対象の研磨面に水を噴射できるように前記噴射ノズルを回動する回動手段を備えることにより、上定盤と下定盤との各研磨面のうち、任意の研磨面を洗浄できる。また、飛散防止手段として、噴射ノズルを囲むように植設したブラシ状部材を用いることにより、ブラシ状部材は、その先端部が上定盤又は下定盤の各研磨面に当接して研磨面を洗浄すると共に、噴射ノズルから噴射された水が飛び散る範囲を画し、ブラシ状部材からは水が流出可能であるため、ブラシ状部材で囲まれた領域内に水が滞留することを防止できる。
更に、隙間閉塞手段として、飛散防止手段と上定盤の外周端との間に形成された隙間を閉塞する閉塞用ブラシ状部材と、前記閉塞用ブラシ状部材を前記間隙を閉塞する閉塞位置に移動する移動手段とを具備する隙間閉塞手段を用いることにより、飛散防止手段と上定盤の外周端面との間に形成された隙間を確実に閉塞できる。
かかる研磨装置では、上定盤の研磨面を洗浄した後、下定盤の研磨面を洗浄することにより、上定盤と下定盤との各研磨面を同時に洗浄した場合の様に、下定盤の研磨面を洗浄した後、上定盤の研磨面を洗浄した洗浄液が落下する事態を避けることができる。
【００１４】
本発明の対象とする両面研磨装置では、その下定盤の研磨面を噴射ノズルから噴射水を噴射して洗浄する際に、噴射ノズルを囲むように設けられ、噴射ノズルから噴射された噴射水等の飛散防止手段と下定盤の外周端との間に形成された隙間から噴射水等が噴出しても、両面研磨装置の構造から研磨装置が載置されている空間内に噴射水等が噴出することがない。
したがって、上定盤の研磨面を噴射ノズルから水を噴射して洗浄する際に、噴射ノズルから上定盤の研磨面に噴射した噴射水等を研磨装置が載置されている空間内に噴出させることなく上定盤の研磨面の全面を洗浄できれば、両面研磨装置の上定盤と下定盤との各研磨面の全面を、噴射ノズルから各研磨面に噴射した噴射水等を研磨装置が載置されている空間内に噴出することなく洗浄できる。
この点、本発明では、上定盤の研磨面と飛散防止手段とによって囲まれ、研磨面に向けて水を噴射する噴射ノズルを、上定盤の外周端近接に移動し、飛散防止手段と上定盤の外周端との間に形成された隙間から噴射水等が噴出しないように、この隙間を隙間閉塞手段によって閉塞する。
このため、噴射ノズルから上定盤の研磨面に噴射した噴射水や噴霧水等を研磨装置が載置されている空間内に噴出することなく、上定盤の研磨面の全面を洗浄できる結果、上定盤と下定盤との各研磨面の全面を、噴射ノズルから各研磨面に噴射した噴射水や噴霧水等を研磨装置が載置されている空間内に噴出することなく洗浄できる。
【００１５】
【発明の実施の形態】
本発明に係る洗浄装置の一例の概略を図１に示す。図１に示す洗浄装置には、図１１に示す洗浄装置と同様に、噴射水等の飛散防止手段としてのブラシ状部材１０２，１０２によって囲まれた二個の噴射ノズル１００ａ，１００ｂが、上定盤２０と下定盤３０との各研磨面に沿って延出されているシャフト１０６の先端部に上下に設けられており、高圧ポンプ１０４から供給される高圧水が噴射ノズル１００ａ、１００ｂから上下方向に噴射される。
この様に、噴射ノズル１００ａ，１００ｂの各々を囲むように植設されたブラシ状部材１０２，１０２は、その先端部が上定盤２０又は下定盤３０の各研磨面に当接して研磨面を洗浄すると共に、噴射ノズル１００ａ，１００ｂから噴射された噴射水が飛び散る範囲を画する。更に、ブラシ状部材１００ａ，１００ｂからは水が流出可能であるため、ブラシ状部材１００ａ，１００ｂで囲まれた領域内に水が滞留することを防止できる。
かかる噴射ノズル１００ａ，１００ｂが先端部に設けられたシャフト１０６は、昇降手段としてのハンドル１０８により上下方向に昇降可能に設けられている共に、移動手段としてのモータ１１０により水平方向にも移動可能に設けられている。
【００１６】
この図１に示す洗浄装置を、両面研磨装置の上定盤２０と下定盤３０との各研磨面の洗浄に使用できる。図１に示す洗浄装置によれば、回転している上定盤２０と下定盤３０との互いに対向する両研磨面間に、ブラシ状部材１０２，１０２の先端が同時に接触するように挿入した噴射ノズル１００ａ，１００ｂから各研磨面に向けて５０〜１００気圧程度の高圧水を同時に噴射しつつ、噴射ノズル１００ａ，１００ｂを研磨面に沿って移動することによって、各研磨面に形成された格子状の横溝１２及び縦溝１６に堆積した堆積物を除去できる。
かかる上定盤２０と下定盤３０との各研磨面の洗浄の際に、噴射ノズル１００ａ，１００ｂの各々は、ブラシ状部材１０２，１０２の各々と対応する研磨面とに囲まれた領域内に位置し、噴射ノズル１００ａ，１００ｂの各々から各研磨面に噴射された噴射水等は、この領域外に噴出することを防止できる。
【００１７】
図１に示す洗浄装置には、上定盤２０の外周端面にブラシ材１８の先端が接離可能となるように、上定盤２０の外周端面に接離可能に設けられたシャフト１１の先端部にブラシ材１８が設けられている。
このブラシ材１８は、図２に示す様に、隙間閉塞部材として用いられている。すなわち、上定盤２０と下定盤３０との各研磨面の外周端近傍を洗浄すべく、噴射ノズル１００ａ，１００ｂを上定盤２０と下定盤３０の各外周端近接に移動したとき、ブラシ状部材１０２，１０２の各々と各研磨面の外周端との間に隙間が形成される。
この際に、上定盤２０の外周端面に先端が当接するようにブラシ材１８が移動し、上定盤２０の外周端とブラシ状部材１０２との間に形成された間隙を、ブラシ材１８で閉塞することにより、間隙を経由して噴射ノズル１００ａから噴射された噴射水や噴霧水等を噴出することを防止できる。
一方、下定盤３０の外周端とブラシ状部材１０２との間に形成された間隙からは、噴射ノズル１００ｂから噴射された噴射水や噴霧水等が噴出される。
【００１８】
しかし、図１に示す洗浄装置が対象とする両面研磨装置では、下定盤３０の研磨面を噴射ノズル１００ｂから水を噴射して洗浄する際に、図２に示す様に、ブラシ状部材１０２と下定盤３０の外周端との間に形成された隙間から噴射水等が噴出しても、下定盤３０から排出される研磨液を受けて装置外に導く研磨液の排出受けに噴出される。この排出受けは、下定盤３０の外周面に沿って設けられており、下定盤３０の外周端に沿って開口されている。この開口には、図１０に示す様に、インターナルギヤ５２等が設けられており、開口幅を狭くしている。このため、研磨液の排出受けに噴出した噴射水や噴霧水等は、研磨液の排出受けの開口から再噴出することはない。
したがって、図１及び図２に示す洗浄装置によれば、両面研磨装置の上定盤２０と下定盤３０との各研磨面の全面を、噴射ノズル１００ａ，１００ｂから各研磨面に噴射した噴射水や噴霧水等を研磨装置が載置されている空間内に噴出することなく洗浄できる。
【００１９】
図１及び図２に示す洗浄装置では、上定盤２０と下定盤３０との各研磨面の全面を同時に洗浄するため、上定盤２０の下向きの研磨面を洗浄した洗浄水が、洗浄が完了した下定盤３０の上向きの研磨面に落下し、下定盤３０の研磨面を再汚染することがある。
また、上定盤２０及び下定盤３０の各研磨面に形成された格子状の横溝１２及び縦溝１６の形成密度や溝幅等が相違した場合、噴射ノズル１００ａ，１００ｂの最適移動速度は、上定盤２０及び下定盤３０の各研磨面は同一ではなく、研磨面の一方の洗浄が不足する場合がある。
この下定盤３０の研磨面を再汚染等は、図３に示す洗浄装置によって防ぐことができる。
図３に示す洗浄装置には、移動装置２６を昇降可能に支承するロッド２４ａのピストンが挿入された圧空駆動のシリンダ装置２４、噴射ノズル部３２に高圧水を供給する供給ポンプ３８及び供給ポンプ３８に水を供給するタンク３９等が設けられている。
【００２０】
この移動装置２６は、モータ２８によって正転方向又は逆転方向に回転されるボールネジ３６がケーシング内に設けられており、ボールネジ３６をモータ２８によって正転又は逆転すると、ケーシングの上面に設けられたレール４４に沿って移動体２５を移動できる。かかる移動体２５に載置されたモータ４５（アクチュエータであってもよい）には、一端部に噴射ノズル部３２が設けられて上定盤２０又は下定盤３０の各研磨面に沿って延出された延出部材２９の他端部が回動可能設けられている。
このため、噴射ノズル部３２は、移動体２５の移動に伴って上定盤２０又は下定盤３０の研磨面に沿って移動可能であり、モータ４５の回動に伴なって上定盤２０又は下定盤３０の研磨面方向に水を噴射し得るように回動可能である。
尚、移動体２５の移動限界位置を検出するため、ケーシングの先端部近傍と後端部近傍とに、近接センサ等の位置検出センサ４１，４２が設置されている。
【００２１】
延出部材２９の一端部に設けられた噴射ノズル部３２には、供給ポンプ３８から供給配管３３を経由して水が供給される噴射ノズル３５が設けられており、噴射ノズル３５の周囲はブラシ状部材３４によって囲まれている。ブラシ状部材３４は、その先端部が上定盤２０又は下定盤３０の各研磨面に当接して研磨面を洗浄すると共に、噴射ノズル３５から噴射された噴射水が飛び散る範囲を画する。更に、ブラシ状部材３４からは水が流出可能であるため、ブラシ状部材３４で囲まれた領域内に水が滞留することを防止している。
また、供給配管３３の途中には、制御弁（電磁弁）３７が設けられており、噴射ノズル３５への水の供給を制御している。
更に、先端部にブラシ材１８が設けられたシャフト１７の後端部には、シャフト１７の駆動装置としてのシリンダ装置１９が設けられている。このシリンダ装置１９を駆動することによって、ブラシ材１８の先端を上定盤２０の外周端面に接離できる。
【００２２】
図３に示す移動装置２６のモータ２８，４５、供給ポンプ３８、シリンダ装置１９，２４及び制御弁３７は、制御部４３によって制御されている。
つまり、図９に示すラッピング装置の上定盤２０及び下定盤３０の各研磨面を洗浄する際には、先ず、ラッピング装置のシリンダ装置２２を駆動し、停止状態の上定盤２０と下定盤３０との間を所定間隙となるように、上定盤２０を引き上げる。
更に、制御部４３からの信号によってモータ２８，４５及びシリンダ装置２４を駆動し、上定盤２０と下定盤３０との間に形成された所定間隔に噴射ノズル部３２を挿入し、水の噴射方向が上定盤２０の下向きの研磨面に向くように噴射ノズル部３２を回動する。
次いで、上定盤２０及び下定盤３０を回転し、回転する上定盤２０の下向きの研磨面を噴射ノズル部３２の噴射ノズル３５から水を噴射して洗浄した後、噴射ノズル部３２を回動して水の噴射方向を下定盤３０の上向きの研磨面とする。
その後、回転する下定盤３０の上向きの研磨面を噴射ノズル部３２の噴射ノズル３５から高圧水を噴射して洗浄する。
【００２３】
ここで、回転する上定盤２０の研磨面を洗浄する際には、制御部４３からの信号によって移動装置２６のモータ２８及びシリンダ装置２４を駆動し、回転する上定盤２０の外周端近傍に噴射ノズル部３２のブラシ状部材３４の先端部を当接した状態とした後、制御部４３からの信号によって供給ポンプ３８を起動すると共に、制御弁３７を開き、噴射ノズル部３２の噴射ノズル３５から水を上定盤２０の研磨面に向けて噴射する。かかる水は、１０〜９０℃、特に４０℃程度の温水とすることが研磨面の汚れを落ち易くでき、その圧力は、供給ポンプ３８の吐出口近傍で１０．７９ＭＰａ以上、特に１１．７６ＭＰａ以上の高圧水とすることが好ましい。
尚、水の供給圧力と噴射水量との関係は、水の供給圧力が高圧となる程、水の噴射量を減少できる。
【００２４】
この様に、上定盤２０の研磨面に水を噴射する噴射ノズル部３２は、制御部４３からの信号により駆動するモータ２８によって、上定盤２０の研磨面に水を噴射しつつ、上定盤２０の研磨面の外周端近傍から内周端近傍の方向に移動する。噴射ノズル部３２が内周端近傍に到達したとき、制御部４３は、噴射ノズル部３２を、そのブラシ状部材３４の先端部を上定盤２０の研磨面に当接させた状態で噴射ノズル３５から水を噴射しつつ、上定盤２０の外周端方向に移動するようにモータ２８を制御する。
上定盤２０の外周端近傍に噴射ノズル部３２が到達した際には、ブラシ状部材３４と上定盤２０の外周端との間に隙間が形成される。このため、制御部４３は、シリンダ装置１９を駆動し、図２に示す様に、ブラシ材１８の先端を上定盤２０の外周端面に当接し、ブラシ状部材３４と上定盤２０の外周端との間に形成された隙間を閉塞する。
その後、噴射ノズル部３２が、上定盤２０の外周端近傍から内周端近傍の方向に移動を開始し、ブラシ状部材３４と上定盤２０の外周端面との間に形成された隙間が消滅したときは、制御部４３は、シリンダ装置１９を駆動して上定盤２０の外周端面からブラシ材１８を離す。
この様にして、噴射ノズル３５ａから水を噴射しつつブラシ状部材３４の先端部を上定盤２０の研磨面に当接した状態で噴射ノズル部３２を、上定盤２０の研磨面に平行に往復動することによって、上定盤２０の研磨面を洗浄できる。
かかる上定盤２０の研磨面の洗浄時間は、予め実験等によって求めてタイマーに設定しておき、設定時間が経過したとき、上定盤２０の研磨面の洗浄を終了することができる。
尚、制御部４３は、噴射ノズル部３２ａが上定盤２０外周端近傍又は内周端近傍に到達したことは、位置センサ４１，４２からの信号で知ることができる。
【００２５】
制御部４３は、上定盤２０の研磨面の洗浄が終了した信号、例えばタイマーからの信号を受けた際に、供給ポンプ３８を停止する信号を発すると共に、制御弁３７を閉じる信号を発し、水の噴射方向が下定盤３０の上向きの研磨面に向くように噴射ノズル部３２を回動する信号をモータ４５に発する。
更に、下定盤３０の研磨面の外周端近傍に噴射ノズル部３２のブラシ状部材３４の先端部が当接したとき、制御部４３は、供給ポンプ３８を起動する信号を発すると共に、制御弁３７を開く信号を発し、噴射ノズル３５から水を下定盤３０の研磨面に噴射し、下定盤３０の研磨面の洗浄を施す。
かかる下定盤３０の研磨面の洗浄も、上定盤２０の研磨面と同様に、噴射ノズル部３２を、そのブラシ状部材３４の先端部が下定盤３０の研磨面に当接した状態で噴射ノズル３５から水を噴射しつつ、下定盤３０の外周端近傍と内周端近傍との間を往復動するようにモータ２８を制御する。
ところで、下定盤３０の研磨面を洗浄する際には、ブラシ状部材３４と下定盤３０の外周端との間に形成された隙間から噴射水等が研磨液の排出受けに噴出しても、先述した様に、研磨液の排出受けの開口から再噴出することがない。このため、ブラシ状部材３４と下定盤３０の外周端との間に形成された隙間を閉塞する隙間閉塞手段を設けることを要しないが、下定盤３０側にも隙間閉塞手段を設けてもよい。
【００２６】
この噴射ノズル３５の上定盤２０及び下定盤３０の各研磨面に沿った移動速度は、予め上定盤２０及び下定盤３０の各研磨面に形成された格子状の横溝１２及び縦溝１６に堆積した堆積物を充分に洗浄し得る移動速度を実験的に求めておき、制御部４３に設定しておくことが好ましい。
この様に、上定盤２０及び下定盤３０の各研磨面を洗浄する噴射ノズル部３２の移動速度の各々を予め実験的に求めて制御部４３に設定するのは、各研磨面に形成された格子状の横溝１２及び縦溝１６の形成密度や溝幅等によって、各研磨面を充分に洗浄し得る最適移動速度が異なるからである。
【００２７】
噴射ノズル３５から水を噴射しつつブラシ状部材３４の先端部を下定盤３０の研磨面に当接した状態で、下定盤２０の研磨面に沿って噴射ノズル部３２を往復動することによって、下定盤３０の研磨面を洗浄できる。その際に、下定盤３０の研磨面に付着した汚れを洗浄すると共に、上定盤２０の研磨面を洗浄して落下した洗浄水も洗い流すことができ、下定盤３０の研磨面には、上定盤２０の研磨面の洗浄水による再汚染を防止できる。
かかる下定盤３０の研磨面の洗浄時間も、予め実験等によって求めてタイマーに設定しておき、設定時間が経過したとき、下定盤３０の研磨面の洗浄を終了することができる。
下定盤３０の研磨面の洗浄を終了する際には、下定盤３０の研磨面の洗浄が終了した信号、例えばタイマーからの信号を受けた制御部４３は、供給ポンプ３８を停止する信号を発すると共に、制御弁３７を閉じる信号を発する。
更に、上定盤２０と下定盤３０との間隙から噴射ノズル部３２を抜出すことによって、上定盤２０及び下定盤３０の各研磨面の洗浄を終了する。
ここで、噴射ノズル部３２の移動速度は一定速度であってもよいが、上定盤２０及び下定盤３０の研磨面の洗浄面積及び周速度との関係で噴射ノズル部３２の移動速度を可変としてもよい。例えば、上定盤２０及び下定盤３０の研磨面の外周端近傍は、内周端近傍に比較して、洗浄面積が広く且つ周速度が速いため、外周端近傍の研磨面を洗浄する噴射ノズル部３２を、内周端近傍の研磨面を洗浄する噴射ノズル部３２よりも移動速度を低速とし、噴射ノズル部３２による外周端近傍における洗浄可能面積を可及的に広くしてもよい。
【００２８】
図３に示す噴射ノズル部３２には、噴射ノズル３５が１個設けられているが、上定盤２０及び下定盤３０の各研磨面の洗浄時間を短縮すべく、図４に示す様に、噴射ノズル部３２に複数個の噴射ノズル３５，３５・・を設けてもよい。かかる複数個の噴射ノズル３５，３５・・を、図４（ａ）に示す様に、噴射ノズル部３２の移動方向に並列状に並べてもよく、図４（ｂ）に示す様に、噴射ノズル部３２の移動方向に直列状に並べてもよい。
更に、複数個の噴射ノズル３５，３５・・の全部又は一部からは、水に超音波を照射しつつ噴射してもよい。この場合、噴射ノズル３５，３５・・のうち、一部の噴射ノズルからは供給ポンプ３８の吐出口近傍で１０．７９ＭＰａ以上の高圧水を噴射し、他の噴射ノズルからは供給ポンプ３８の吐出口近傍で１０．７９ＭＰａ未満の低圧水に超音波を照射しつつ噴射してもよい。この様に、高圧水の噴射と超音波を照射した低圧水の噴射とを併用することによって、上定盤２０及び下定盤３０の各研磨面に形成された格子状の横溝１２及び縦溝１６に堆積した堆積物を超音波で粉砕し、粉砕した粉砕物を高圧水の噴射で掻き出すことができる。
尚、複数個の噴射ノズル３５，３５・・の一部からは、防錆剤を含む液を噴射してもよい。
【００２９】
また、図３及び図４に示す噴射ノズル部３２の噴射ノズル３５を囲むように植設されたブラシ状部材３４は、所定の長さに揃えられているが、図５に示す様に、長さの異なるブラシ状部材３４を植設してもよい。図５に示すブラシ状部材３４は、二重構造となっており、内側に配設された内側ブラシ状部材３４ａの長さは、外側に配設された外側ブラシ状部材３４ｂよりも短く形成されている。かかる図５に示す長さの異なるブラシ状部材３４では、上定盤２０の研磨面を洗浄する際に、短い内側ブラシ状部材３４ａの先端部が研磨面に当接して洗浄しているとき、長い外側ブラシ状部材３４ｂの先端部は格子状の横溝１２（縦溝１６）に入り込み、横溝１２（縦溝１６）内を洗浄できる。
【００３０】
図３〜図５に示す洗浄装置では、噴射ノズル部３２は、図６に示す洗浄装置Ａの様に、上定盤２０及び下定盤３０の各研磨面に対して、その最外研磨面から最内研磨面に直線的に往復動しているが、洗浄装置Ｂに示す様に、噴射ノズル部３２を上定盤２０及び下定盤３０の各研磨面に対して弧状に回動させてもよい。また、洗浄装置Ａ及び洗浄装置Ｂを併設してもよい。
また、図３〜図５に示す洗浄装置のように、図１及び図２に示す洗浄装置でも、上定盤２０の研磨面を洗浄した後、下定盤３０の研磨面を洗浄するには、噴射ノズル１００ａ，１００ｂの各々に水を供給する供給配管を二本設けると共に、各供給配管に制御弁（電磁弁）を設け、各制御弁を制御する制御部を設けることによって可能である。この制御部では、噴射ノズル１００ａに水を供給する供給配管の制御弁を開いて上定盤２０の研磨面を洗浄した後、噴射ノズル１００ｂに水を供給する供給配管の制御弁を開いて下定盤３０の研磨面を洗浄するように、各制御弁を制御する。
【００３１】
ところで、図３〜図６に示す洗浄装置では、上定盤２０の下向きの研磨面を噴射ノズル３５から水を噴射して洗浄した後、下定盤３０の上向きの研磨面を、回動した噴射ノズル３５から水を噴射して洗浄する。このため、図１又は図２に示す上定盤２０及び下定盤３０の各研磨面に向けて２個の噴射ノズル１００ａ，１００ｂを設け、噴射ノズル１００ａ，１００ｂから同時に水を噴射する洗浄装置に比較して、洗浄速度が低下し易い傾向にある。
かかる洗浄速度の低下は、図７（ａ）に示す様に、同一方向に水を噴射する複数個の噴射ノズル部３２ａ，３２ｂ，３２ｃを、等間隔で直列状に延出部材２９に配設することによって解消し得る。
【００３２】
この様に、延出部材２９に噴射ノズル部３２ａ，３２ｂ，３２ｃを、等間隔で直列状に配設することによって、図７（ｂ）に示す様に、噴射ノズル部３２ａ，３２ｂ，３２ｃのうち、モータ４５側の噴射ノズル部３２ｃを、上定盤２０及び下定盤３０の各研磨面の最外研磨面に位置させることによって、延出部材２９の先端部に配設された噴射ノズル部３２ａが上定盤２０及び下定盤３０の各研磨面の内側面に位置する。このため、図７（ａ）に示す様に、複数個の噴射ノズル部３２ａ，３２ｂ，３２ｃを延出部材２９に直列状に配設することによって、図３に示す様に、延出部材２９に１個の噴射ノズル部３２が設けられ場合に比較して、各噴射ノズル部３２のストローク長を短くでき、洗浄速度の低下を防止できる。
かかる複数個の噴射ノズル部３２ａ，３２ｂ，３２ｃも、モータ４５を駆動して延出部材２９を回動することによって、同時に所定方向に回動できる。このため、上定盤２０の下向きの研磨面を複数個の噴射ノズル部３２ａ，３２ｂ，３２ｃから同時に水を噴出してを洗浄した後、回動した複数個の噴射ノズル部３２ａ，３２ｂ，３２ｃから下定盤３０の上向きの研磨面に同時に水を噴出して洗浄できる。
尚、図７（ａ）に示す洗浄装置では、図３に示す洗浄装置を形成する部材と同一部材は、同一番号を付して詳細な説明を省略した。
【００３３】
また、前述した洗浄速度の低下は、図８（ａ）に示す様に、上定盤２０の下向きの研磨面に水を噴射する上定盤用噴射ノズル３５ｄが設けられた上定盤用噴射ノズル部３２ｄと、下定盤３０の上向きの研磨面に水を噴射する下定盤用噴射ノズル３５ｅが設けられた下定盤用噴射ノズル部３２ｅとを設け、噴射ノズル３５ｄ，３５ｅの各々から各研磨面に水を噴射しつつ、上定盤用噴射ノズル部３２ｄと下定盤用噴射ノズル部３２ｅとを移動することによっても解消し得る。
但し、上定盤用噴射ノズル部３２ｄと下定盤用噴射ノズル部３２ｅとを同時に移動すると、上定盤２０の研磨面を洗浄した洗浄液が洗浄した下定盤３０の研磨面に落下し、下定盤３０の研磨面を再汚染する。このため、図８（ａ）に示す様に、上定盤３０の研磨面を洗浄して下定盤３０の研磨面に落下した洗浄水を洗浄するように、下定盤用噴射ノズル部３２ｅを上定盤用噴射ノズル部３２ｄよりも所定時間遅れて移動することによって、洗浄した下定盤３０の研磨面を上定盤２０の研磨面を洗浄した洗浄液に因る再汚染する懸念を解消し得る。
かかる上定盤用噴射ノズル部３２ｄと下定盤用噴射ノズル部３２ｅとは、図８（ａ）に示す様に、上定盤用噴射ノズル部３２ｄの直下に下定盤用噴射ノズル部３２ｅを設けてもよく、図８（ｂ）に示す様に、上定盤用噴射ノズル部３２ｄと下定盤用噴射ノズル部３２ｅとを別々の場所に設けてもよい。
尚、図８（ａ）の上定盤用噴射ノズル部３２ｄと下定盤用噴射ノズル部３２ｅとは、回動可能に設けられていなくてもよい。
【００３４】
これまで説明した洗浄装置に設けられた隙間閉塞部材としてのブラシ材１８としては、シャフト１１を経由して供給された水を噴射するノズルの周囲に植設されたブラシ材を用いることもできる。かかるブラシ材を用いることによって、ノズルから噴射された水とブラシ材の先端部とで上定盤２０の外周端面を洗浄しつつ、噴射ノズル部３２を構成するブラシ状部材３４と上定盤２０の外周端との間に形成され、噴射ノズル部３２の噴射ノズル３５からの噴射水や噴霧水等が噴出する隙間を閉塞できる。
また、説明してきた洗浄装置に設けられた噴射ノズル部には、ブラシ状部材３４が噴射ノズルの周囲に植設されていたが、噴射ノズル３５から噴射された噴射水や噴霧水等の飛散を防止できる材料であればよく、例えば網材や布材であってもよい。
更に、ブラシ状部材１０２（３４）と上定盤２０の外周端面との間に形成された隙間を閉塞するブラシ材１８も、噴射ノズル３５から噴射された噴射水や噴霧水等の飛散を防止できる材料であればよく、例えば網材や布材であってもよい。また、図１〜図８に示す洗浄装置は、研磨装置とは別個に設けたものであるが、研磨装置を洗浄装置と一体に設けてもよい。
以上、説明してきた洗浄装置は、シリコンウェーハ等のワークの両面を鏡面に研磨する両面ポリシング装置に用いてもよいことは勿論のことである。この場合も、両面ポリシング装置の研磨面に噴射する水は、１０〜９０℃、特に４０℃程度の温水とすることによって研磨面の汚れを落ち易くでき、その圧力は、供給ポンプの吐出口近傍で１０．７９ＭＰａ以上、特に１１．７６ＭＰａ以上の高圧水とすることが好ましい。
【００３５】
【発明の効果】
本発明によれば、両面研磨装置に設けられた上定盤と下定盤との各研磨面の全面を、噴射ノズルから各研磨面に噴射した噴射水や噴霧水等を研磨装置が載置されている空間内に噴出することなく洗浄できる。
このため、研磨装置をクリーンルーム内に載置しても、噴射ノズルから噴射された噴射水や噴霧水等によってクリーンルーム内の清浄度を低下させることがなく、シリコンウェーハ等の清浄度が要求される研磨を行うことができる。
【図面の簡単な説明】
【図１】本発明の洗浄装置の一例を説明するための部分断面図である。
【図２】図１に示す洗浄装置の動作を説明する説明図である。
【図３】本発明に係る洗浄装置の他の例の概略構造を説明する説明図である。
【図４】図３に示す洗浄装置に使用し得る噴射ノズル部の他の例を示す部分正面図である。
【図５】図３に示す洗浄装置に使用し得る噴射ノズル部の他の例を示す部分正面図である。
【図６】図３に示す洗浄装置の噴射ノズル部の移動方向を説明する説明図である。
【図７】本発明に係る洗浄装置の他の例を説明する説明図である。
【図８】本発明に係る洗浄装置の他の例を説明する概略図である。
【図９】両面研磨装置の一例としてラッピング装置の構造を説明する説明図である。
【図１０】図９に示すラッピング装置の下定盤３０の研磨面の状態を説明する部分平面図である。
【図１１】従来の洗浄装置を説明する概略図である。
【図１２】図１１に示す従来の洗浄装置の噴射ノズル部を説明する部分断面図である。
【図１３】図１１に示す噴射ノズル部と上定盤と下定盤との外周端近傍に移動したときの状態を説明する説明図である。
【符号の説明】
１８ブラシ材（隙間閉塞手段）
２０上定盤
２４シリンダ装置（昇降手段）
２４ａロッド
２５移動体
２８モータ
２９延出部材
３０下定盤
２６移動装置（移動手段）
３２，３２ａ，３２ｂ，３２ｃ，３２ｄ，３２ｅ，１００ａ，１００ｂ噴射ノズル部
３３供給配管
３４，１０２ブラシ状部材（飛散防止手段）
３５噴射ノズル
３７制御弁（電磁弁）
３８供給ポンプ（水供給手段）
４３制御部（制御手段）
４５モータ（回動手段）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing surface plate cleaning method and a cleaning apparatus thereof, and more specifically, the upper surface plate and the lower surface plate facing each other while rotating the upper surface plate and the lower surface plate provided in the double-side polishing apparatus. The present invention relates to a polishing surface plate cleaning method and a cleaning apparatus for cleaning each polishing surface by spraying water from an injection nozzle that moves along each of the polishing surfaces.
[0002]
[Prior art]
As a double-side polishing apparatus for polishing both surfaces of a thin plate-like workpiece typified by a silicon wafer, for example, a lapping apparatus is widely used. Such a wrapping apparatus is shown in FIG.
In the lapping apparatus shown in FIG. 9, a polishing surface for lapping the workpiece 10, which is a thin plate-like workpiece such as a silicon wafer, is formed on the lower surface of the upper surface plate 20, and a key 21 is mounted on the upper surface. Above the upper surface plate 20, a cylinder device 22 such as pneumatic pressure is located, and the cylinder device 22 is installed on the upper part of the portal frame 14. The upper surface plate 20 is suspended from the tip of the piston rod 22a of the cylinder device 22 via the rotating plate 23 and the connecting rod 27, and is supported rotatably. That is, the rotating plate 23 and the upper surface plate 20 connected to the piston rod 22a via the connecting rod 27 can rotate without the piston rod 22a rotating by the connecting portion 22b fixed to the rotating plate 23. And it is provided so that it may not fall off. For this reason, the upper surface plate 20 is provided so that the pressing force to the lower surface plate 30 based on its own weight can be increased or decreased by adjusting the lifting force by the cylinder device 22.
The pressing force applied to the lower surface plate 30 may be adjusted by adjusting the pressing force applied to the upper surface plate 20 by a pressing means such as a cylinder device.
[0003]
Further, the upper surface plate 20 is inserted and engaged with a key groove of a rotary 54 in which the key 21 is rotated by the power of the drive motor 70, and is rotated by the drive motor 70. A rotating shaft 54 a is suspended from a lower portion of the rotating metal 54, and a shaft gear 54 b provided at the lower end thereof meshes with a spindle gear 64 provided on the spindle 60 via an idle gear 63. . By this power transmission mechanism, the power of the drive motor 70 is transmitted to the upper surface plate 20 via the rotating metal 54.
The upper surface plate 20 and the turntable 54 are connected by the key 21 because the cylinder device 20 is driven and the upper surface plate 20 is separated from the lower surface plate 30 during supply / discharge of the workpiece 10 or maintenance management. This is because it is necessary to lift it so that it opens widely.
[0004]
An external gear 50 and an internal gear 52 are formed as gears that mesh with the carrier 40 and rotationally drive the carrier 40. The external gear 50 has a first concentrically provided around the rotary shaft 54a. A hollow shaft 50 a is connected, and a shaft gear 50 b provided on the first hollow shaft 50 a meshes with a spindle gear 65 provided on the spindle 60.
Further, the lower surface plate 30 is connected to a second hollow shaft 30a concentrically provided around the first hollow shaft 50a, and a shaft gear 30b provided in the middle of the second hollow shaft 30a is connected to the spindle. 60 is meshed with a spindle gear 61 provided on 60.
[0005]
The internal gear 52 is connected to a third hollow shaft 52a concentrically provided around the second hollow shaft 30a. The shaft gear 52b provided on the third hollow shaft 52a is connected to the spindle 60. Is engaged with a spindle gear 62 provided in The spindle 60 is connected to a variable speed reducer 69. The variable speed reducer 69 is connected to a drive motor 70 such as an electric motor or a hydraulic motor via a belt.
In this manner, the upper surface plate 20, the lower surface plate 30, the external gear 50, and the internal gear 52 are each transmitted with power by the same drive motor 70 via the variable speed reducer 69, the gear train, and the shafts. It is rotationally driven.
[0006]
Meanwhile, as shown in FIG. 10, the horizontal grooves 12 and the vertical grooves 16 are formed in a lattice pattern on the upward polishing surface of the lower surface plate 30 shown in FIG. The lattice-like horizontal grooves 12 and vertical grooves 16 are also formed on the downward polishing surface of the upper surface plate 20. The grid-like horizontal grooves 12 and vertical grooves 16 formed on each polishing surface are for discharging polishing debris, polishing liquid and the like of the work 10.
In such horizontal grooves 12 and vertical grooves 16, polishing scraps or abrasives remaining after the polishing of the workpiece 10 is gradually accumulated, and finally a bad effect such as damage to the polishing surface of the workpiece 10 occurs. After the polishing of the number of workpieces 10 is completed, the cylinder device 22 is driven to widen the space between the upper surface plate 20 and the lower surface plate 30, and the polished surfaces of the upper surface plate 20 and the lower surface plate 30 are cleaned.
However, since the deposits accumulated in the horizontal grooves 12 and the vertical grooves 16 formed on the polished surfaces of the upper surface plate 20 and the lower surface plate 30 are in a solidified state, the metal plate is manually inserted into the grooves for removal. Then, the scraping work to scrape the deposits was done. Such a scraping operation takes time and may damage the polished surface.
[0007]
In order to automate such a scraping operation, Japanese Patent Application Laid-Open No. 7-9342 proposes a cleaning apparatus shown in FIG. In this cleaning device, two injection nozzles 100a and 100b surrounded by brush-like members 102 and 102 at the tip are provided on the shaft 106 vertically, and high-pressure water supplied from the high-pressure pump 104 is injected. Injected in the vertical direction from the nozzles 100a and 100b. The shaft 106 provided with the injection nozzles 100a and 100b is provided so as to be movable up and down in the vertical direction, and is also provided so as to be movable in the horizontal direction.
For this reason, according to the cleaning apparatus shown in FIG. 10, as shown in FIG. 12, the brush-like members 102, 102 are disposed between the polishing surfaces of the rotating upper surface plate 20 and lower surface plate 30 facing each other. The spray nozzles 100a and 100b are moved in the radial direction of the polishing surface while simultaneously spraying high-pressure water of about 50 to 100 atm from the spray nozzles 100a and 100b inserted so that the tips are in contact with each other toward the polishing surfaces. Thus, the deposits deposited on the grid-like horizontal grooves 12 and vertical grooves 16 formed on each polished surface can be removed.
[0008]
[Problems to be solved by the invention]
According to the cleaning apparatus shown in FIGS. 9 and 10, it is possible to automate the cleaning of the polished surfaces of the upper surface plate 20 and the lower surface plate 30 by a conventional manual operation.
Further, when spray water is sprayed from the spray nozzles 100a and 100b to the polishing surfaces, the spray nozzles 100a and 100b are regions surrounded by the brush-like members 102 and 102 and the polishing surfaces, respectively. It is possible to prevent spray water or the like that is located inside and sprayed to each polishing surface from each of the spray nozzles 100a and 100b from being ejected outside this region.
However, in order to clean the entire polishing surfaces of the upper surface plate 20 and the lower surface plate 30, it is necessary to clean the vicinity of the outer peripheral ends of the polishing surfaces of the upper surface plate 20 and the lower surface plate 30. Therefore, when the spray nozzles 100a and 100b are moved to the vicinity of the outer peripheral ends of the polishing surfaces of the upper surface plate 20 and the lower surface plate 30, as shown in FIG. A gap is formed between the members 100a and 100b. For this reason, the jet water, the spray water, etc. which were jetted from the jet nozzles 100a and 100b are ejected through this gap.
[0009]
The spray water, spray water, etc. sprayed from the spray nozzle 100b sprayed from the gap with the outer peripheral edge of the lower surface plate 30 are ejected to the polishing liquid discharge receptacle that receives the polishing liquid discharged from the lower surface plate 30 and guides it outside the apparatus. Is done. The discharge receiver is provided along the outer peripheral surface of the lower surface plate 30 and is opened along the outer peripheral end of the lower surface plate 30. As shown in FIG. 9, the opening is provided with an internal gear 52 and the like to narrow the opening width. For this reason, spray water, spray water, or the like sprayed to the polishing liquid discharge receptacle does not re-spout from the opening of the polishing liquid discharge receptacle.
On the other hand, spray water, spray water, or the like sprayed from the spray nozzle 100a, which is sprayed from a gap with the outer peripheral edge of the upper surface plate 20, is directly sprayed into the space where the polishing apparatus is placed.
In this way, the spray water or spray water directly sprayed into the space where the polishing apparatus is placed is cleaning water that cleans the polishing surface of the upper surface plate 20, and thus adheres to and contaminates the polishing product. To do.
In particular, a polishing apparatus that polishes a silicon wafer is often placed in a clean room, and spray water or spray water sprayed from the spray nozzle 100a that is sprayed from a gap with the outer peripheral edge of the upper surface plate 20 is used. Etc. also cause a decrease in cleanliness in the clean room.
[0010]
On the other hand, the movement range of the injection nozzles 100a and 100b is set so that the sprayed water, spray water, or the like sprayed from the spray nozzle 100a on the polishing surface of the upper surface plate 20 is not ejected from the gap with the outer peripheral end of the upper surface plate 20. If it restrict | limits, the outer peripheral edge vicinity of the polishing surface of the upper surface plate 20 and the lower surface plate 30 will not be cleaned, but each polishing surface must be cleaned manually. For this reason, it becomes difficult to automate the cleaning of each polished surface of the upper surface plate 20 and the lower surface plate 30. Accordingly, the problem of the present invention is that the polishing apparatus mounts the entire surface of each polishing surface of the upper surface plate and the lower surface plate provided in the double-side polishing apparatus, spray water, spray water, or the like sprayed from the spray nozzle onto each polishing surface. It is an object of the present invention to provide a polishing surface plate cleaning method and a cleaning apparatus for the same that can be cleaned without being ejected into the space in which it is placed.
[0011]
[Means for Solving the Problems]
As a result of studying the above problems, the inventor of the present invention is defined by a brush-like member surrounding an injection nozzle and a polishing surface of an upper surface plate, and injects injection water toward the polishing surface of the upper surface plate Is moved close to the outer peripheral edge of the upper surface plate, and when a gap is formed between the brush-like member and the outer peripheral edge of the upper surface plate, the gap is closed by another brush material, so that the polishing apparatus The present inventors have found that it is possible to prevent spray water, spray water, and the like from being ejected from the gap between the outer peripheral edge of the upper surface plate and the brush-like member into the space where they are placed.
That is, the present invention provides water from an injection nozzle that moves along each of the polishing surfaces of the upper surface plate and the lower surface plate facing each other while rotating the upper surface plate and the lower surface plate provided in the double-side polishing apparatus. When the polishing surfaces are cleaned by spraying the spray nozzles, the spray nozzles are provided so as to surround the spray nozzles. A cleaning device having a moving means for moving the spray nozzle along the surface is used, and is surrounded by the polishing surface of the upper surface plate and the scattering prevention means, and sprays water toward the polishing surface of the upper surface plate. In order to clean the vicinity of the outer peripheral edge of the polishing surface of the upper surface plate, the spray nozzle is moved to the vicinity of the outer peripheral edge of the upper surface plate by the moving means, and between the scattering prevention means and the outer peripheral edge of the upper surface plate. When a gap is formed, the injection nozzle passes through the gap. As Imizu etc. have not been ejected, in the method of cleaning a polishing surface plate, characterized in that for closing the gap closing means the gap.
[0012]
In the present invention, the upper surface plate and the lower surface plate provided in the double-side polishing apparatus are rotated, and water is sprayed from the spray nozzles that move along the polishing surfaces of the upper surface plate and the lower surface plate facing each other. In the polishing surface plate cleaning apparatus for cleaning each polishing surface by spraying, the spray nozzle is provided so as to surround the spray nozzle, and means for preventing scattering of sprayed water or the like sprayed from the spray nozzle onto the polishing surface to be cleaned, Moving means for moving the spray nozzle along the polishing surface to be cleaned, surrounded by the polishing surface of the upper surface plate and the scattering prevention means, and sprays water toward the polishing surface of the upper surface plate The spray nozzle is moved to the vicinity of the outer peripheral edge of the upper surface plate by the moving means, and when a gap is formed between the scattering prevention means and the outer peripheral edge of the upper surface plate, the spray nozzle is removed from the spray nozzle via the gap. The gap is closed so that no jet water is ejected. It is in the cleaning apparatus of the polishing platen, wherein a gap closing means are provided that.
[0013]
In the present invention, the injection nozzle includes an injection nozzle that injects water toward the polishing surface of the upper surface plate, and an injection nozzle that injects water toward the polishing surface of the lower surface plate. The polishing surface and the polishing surface of the lower surface plate can be cleaned simultaneously.
Alternatively, the spray nozzle provided as a spray nozzle is used as a spray nozzle, and provided with a rotating means for rotating the spray nozzle so that water can be sprayed onto the polishing surface to be cleaned. Any polishing surface can be cleaned among the polishing surfaces with the board. Further, by using a brush-like member planted so as to surround the spray nozzle as a scattering prevention means, the tip of the brush-like member comes into contact with each polishing surface of the upper surface plate or the lower surface plate so that the polishing surface is While cleaning, it demarcates the range in which the water sprayed from the spray nozzle scatters, and since water can flow out from the brush-like member, it is possible to prevent water from staying in the region surrounded by the brush-like member.
Further, as the gap closing means, a closing brush-like member for closing a gap formed between the scattering prevention means and the outer peripheral edge of the upper surface plate, and the closing brush-like member at a closing position for closing the gap are provided. By using the gap closing means including the moving means that moves, it is possible to reliably close the gap formed between the scattering prevention means and the outer peripheral end surface of the upper surface plate.
In such a polishing apparatus, after the polishing surface of the upper surface plate is cleaned, the polishing surface of the lower surface plate is cleaned, so that the polishing surfaces of the upper surface plate and the lower surface plate are simultaneously cleaned. After cleaning the polished surface, it is possible to avoid a situation in which the cleaning liquid that cleaned the polished surface of the upper surface plate falls.
[0014]
In the double-side polishing apparatus that is the subject of the present invention, when the polishing surface of the lower surface plate is cleaned by spraying spray water from the spray nozzle, the spray water sprayed from the spray nozzle is provided so as to surround the spray nozzle. Even if spray water or the like is ejected from a gap formed between the scattering prevention means and the outer peripheral edge of the lower surface plate, the spray water or the like is ejected into the space where the polishing apparatus is placed from the structure of the double-side polishing apparatus There is nothing to do.
Therefore, when cleaning the polishing surface of the upper surface plate by spraying water from the spray nozzle, the spray water or the like sprayed from the spray nozzle to the polishing surface of the upper surface plate is sprayed into the space where the polishing device is placed. If the entire polishing surface of the upper surface plate can be washed without causing the polishing device to spray water, etc., sprayed from the injection nozzle onto each polishing surface over the entire polishing surface of the upper surface plate and lower surface plate of the double-side polishing device. It can be cleaned without being ejected into the space where it is placed.
In this regard, in the present invention, the spray nozzle that is surrounded by the polishing surface of the upper surface plate and the scattering prevention means and injects water toward the polishing surface moves to the vicinity of the outer peripheral edge of the upper surface plate, and the scattering prevention means The gap is closed by a gap closing means so that spray water or the like is not ejected from the gap formed between the outer peripheral edge of the upper surface plate.
As a result, the entire surface of the polishing surface of the upper surface plate can be cleaned without spraying spray water or spray water sprayed from the spray nozzle onto the polishing surface of the upper surface plate into the space where the polishing apparatus is placed. The entire surface of each polishing surface of the upper surface plate and the lower surface plate can be cleaned without spraying spray water, spray water, or the like sprayed from the spray nozzle onto each polishing surface into the space where the polishing apparatus is placed.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
An outline of an example of a cleaning apparatus according to the present invention is shown in FIG. As in the cleaning apparatus shown in FIG. 11, the cleaning apparatus shown in FIG. 1 has two injection nozzles 100a and 100b surrounded by brush-like members 102 and 102 as means for preventing scattering of injection water and the like. The high-pressure water provided from the high-pressure pump 104 is provided in the vertical direction from the injection nozzles 100a and 100b. Is injected into.
In this way, the brush-like members 102 and 102 implanted so as to surround each of the injection nozzles 100a and 100b are in contact with the respective polishing surfaces of the upper surface plate 20 or the lower surface plate 30 so that the polishing surfaces are made. While cleaning, the range which the spray water sprayed from spray nozzle 100a, 100b scatters is demarcated. Furthermore, since water can flow out from the brush-like members 100a and 100b, water can be prevented from staying in the region surrounded by the brush-like members 100a and 100b.
The shaft 106 provided with the injection nozzles 100a and 100b at the tip is provided so as to be vertically movable by a handle 108 as an elevating means, and is also movable in a horizontal direction by a motor 110 as a moving means. Is provided.
[0016]
The cleaning apparatus shown in FIG. 1 can be used for cleaning each polished surface of the upper surface plate 20 and the lower surface plate 30 of the double-side polishing apparatus. According to the cleaning apparatus shown in FIG. 1, the jets inserted so that the tips of the brush-like members 102, 102 are simultaneously in contact between the opposing polishing surfaces of the rotating upper surface plate 20 and lower surface plate 30. A lattice shape formed on each polishing surface by moving the injection nozzles 100a and 100b along the polishing surface while simultaneously spraying high pressure water of about 50 to 100 atm from the nozzles 100a and 100b toward the polishing surface. Deposits deposited in the horizontal grooves 12 and the vertical grooves 16 can be removed.
When the polishing surfaces of the upper surface plate 20 and the lower surface plate 30 are cleaned, each of the spray nozzles 100a and 100b is in a region surrounded by each of the brush-like members 102 and 102 and the corresponding polishing surface. It is possible to prevent spray water or the like that is located and sprayed from each of the spray nozzles 100a and 100b to each polishing surface from being ejected outside this region.
[0017]
In the cleaning apparatus shown in FIG. 1, the tip of the shaft 11 provided so as to be able to come into contact with and separate from the outer peripheral end surface of the upper surface plate 20 so that the tip of the brush material 18 can come into contact with and separate from the outer peripheral end surface of the upper surface plate 20. The brush material 18 is provided in the part.
This brush material 18 is used as a gap closing member as shown in FIG. That is, when the spray nozzles 100a and 100b are moved close to the outer peripheral ends of the upper surface plate 20 and the lower surface plate 30 in order to clean the vicinity of the outer peripheral ends of the polishing surfaces of the upper surface plate 20 and the lower surface plate 30, a brush shape is obtained. A gap is formed between each of the members 102 and 102 and the outer peripheral edge of each polishing surface.
At this time, the brush material 18 moves so that the tip comes into contact with the outer peripheral end surface of the upper surface plate 20, and the gap formed between the outer peripheral end of the upper surface plate 20 and the brush-like member 102 is changed to the brush material 18. It is possible to prevent the spray water, spray water, and the like sprayed from the spray nozzle 100a from being ejected via the gap.
On the other hand, from the gap formed between the outer peripheral edge of the lower surface plate 30 and the brush-like member 102, the spray water, spray water, etc. sprayed from the spray nozzle 100b are ejected.
[0018]
However, in the double-side polishing apparatus targeted by the cleaning apparatus shown in FIG. 1, when cleaning the polishing surface of the lower surface plate 30 by spraying water from the spray nozzle 100b, as shown in FIG. Even if spray water or the like is ejected from a gap formed between the outer peripheral edge of the lower surface plate 30, it is ejected to a polishing liquid discharge receptacle that receives the polishing liquid discharged from the lower surface plate 30 and guides it outside the apparatus. The discharge receiver is provided along the outer peripheral surface of the lower surface plate 30 and is opened along the outer peripheral end of the lower surface plate 30. As shown in FIG. 10, the opening is provided with an internal gear 52 and the like to narrow the opening width. For this reason, spray water, spray water, or the like sprayed to the polishing liquid discharge receptacle does not re-spout from the opening of the polishing liquid discharge receptacle.
Therefore, according to the cleaning apparatus shown in FIG. 1 and FIG. 2, the spray water sprayed from the spray nozzles 100a, 100b onto the respective polishing surfaces on the entire polishing surfaces of the upper surface plate 20 and the lower surface plate 30 of the double-side polishing device. Or spray water or the like can be washed without being spouted into the space where the polishing apparatus is placed.
[0019]
In the cleaning apparatus shown in FIGS. 1 and 2, since the entire surface of each polishing surface of the upper surface plate 20 and the lower surface plate 30 is simultaneously cleaned, the cleaning water that has cleaned the downward polishing surface of the upper surface plate 20 is cleaned. The finished lower surface plate 30 may fall on the upward polishing surface, and the polished surface of the lower surface plate 30 may be recontaminated.
Further, when the formation density and groove width of the grid-like horizontal grooves 12 and vertical grooves 16 formed on the polished surfaces of the upper surface plate 20 and the lower surface plate 30 are different, the optimum moving speed of the injection nozzles 100a and 100b is The polished surfaces of the upper surface plate 20 and the lower surface plate 30 are not the same, and cleaning of one of the polished surfaces may be insufficient.
Re-contamination of the polished surface of the lower surface plate 30 can be prevented by the cleaning device shown in FIG.
In the cleaning device shown in FIG. 3, a cylinder device 24 of pressure air drive in which a piston of a rod 24a for supporting the moving device 26 to be movable up and down is inserted, a supply pump 38 for supplying high-pressure water to the injection nozzle portion 32, and a supply pump 38 A tank 39 for supplying water is provided.
[0020]
In this moving device 26, a ball screw 36 that is rotated in the forward or reverse direction by a motor 28 is provided in the casing. When the ball screw 36 is rotated forward or reverse by the motor 28, a rail provided on the upper surface of the casing. The moving body 25 can be moved along 44. The motor 45 (which may be an actuator) mounted on the moving body 25 is provided with an injection nozzle portion 32 at one end and extends along each polishing surface of the upper surface plate 20 or the lower surface plate 30. The other end of the extended member 29 is provided to be rotatable.
For this reason, the injection nozzle part 32 can move along the polishing surface of the upper surface plate 20 or the lower surface plate 30 with the movement of the moving body 25, and the upper surface plate 20 or the The lower surface plate 30 can be rotated so that water can be jetted toward the polishing surface.
In order to detect the movement limit position of the moving body 25, position detection sensors 41 and 42 such as proximity sensors are installed in the vicinity of the front end portion and the rear end portion of the casing.
[0021]
The injection nozzle portion 32 provided at one end of the extending member 29 is provided with an injection nozzle 35 to which water is supplied from a supply pump 38 via a supply pipe 33, and the periphery of the injection nozzle 35 is a brush. It is surrounded by the member 34. The brush-like member 34 has a tip end abutting against each polishing surface of the upper surface plate 20 or the lower surface plate 30 to clean the polishing surface, and defines a range in which the spray water sprayed from the spray nozzle 35 scatters. Furthermore, since water can flow out from the brush-like member 34, water is prevented from staying in the region surrounded by the brush-like member 34.
A control valve (solenoid valve) 37 is provided in the middle of the supply pipe 33 to control the supply of water to the injection nozzle 35.
Furthermore, a cylinder device 19 as a drive device for the shaft 17 is provided at the rear end portion of the shaft 17 provided with the brush material 18 at the front end portion. By driving the cylinder device 19, the tip of the brush material 18 can be brought into and out of contact with the outer peripheral end surface of the upper surface plate 20.
[0022]
The motors 28 and 45, the supply pump 38, the cylinder devices 19 and 24, and the control valve 37 of the moving device 26 shown in FIG. 3 are controlled by the control unit 43.
That is, when cleaning each polished surface of the upper surface plate 20 and the lower surface plate 30 of the wrapping apparatus shown in FIG. 9, first, the cylinder device 22 of the wrapping device is driven to stop the upper surface plate 20 and the lower surface plate. The upper surface plate 20 is pulled up so that a predetermined gap is formed between the upper surface plate 20 and the upper surface plate 20.
Further, the motors 28 and 45 and the cylinder device 24 are driven by a signal from the control unit 43, and the injection nozzle unit 32 is inserted at a predetermined interval formed between the upper surface plate 20 and the lower surface plate 30, and water is injected. The injection nozzle portion 32 is rotated so that the direction is directed to the downward polishing surface of the upper surface plate 20.
Next, the upper surface plate 20 and the lower surface plate 30 are rotated, and the downward polishing surface of the rotating upper surface plate 20 is washed by spraying water from the spray nozzle 35 of the spray nozzle unit 32, and then the spray nozzle unit 32 is rotated. The water spray direction is set to the upward polishing surface of the lower surface plate 30.
Thereafter, the upward polishing surface of the rotating lower surface plate 30 is cleaned by spraying high-pressure water from the spray nozzle 35 of the spray nozzle portion 32.
[0023]
Here, when the polished surface of the rotating upper surface plate 20 is cleaned, the motor 28 and the cylinder device 24 of the moving device 26 are driven by a signal from the control unit 43, and the vicinity of the outer peripheral end of the rotating upper surface plate 20 After the tip of the brush-like member 34 of the injection nozzle part 32 is brought into contact with the supply nozzle 38, the supply pump 38 is activated by a signal from the control part 43, the control valve 37 is opened, and the injection nozzle of the injection nozzle part 32 Water is sprayed from 35 toward the polishing surface of the upper surface plate 20. Such water can be made to be warm water at 10 to 90 ° C., particularly about 40 ° C., to easily remove dirt on the polished surface, and the pressure thereof is 10.79 MPa or more, particularly 11.76 MPa or more in the vicinity of the discharge port of the supply pump 38. It is preferable to use high pressure water.
In addition, the relationship between the supply pressure of water and the amount of jet water can reduce the jet amount of water, so that the supply pressure of water becomes high.
[0024]
As described above, the spray nozzle unit 32 that sprays water onto the polishing surface of the upper surface plate 20 is sprayed with water onto the polishing surface of the upper surface plate 20 by the motor 28 driven by a signal from the control unit 43. It moves from the vicinity of the outer peripheral end of the polishing surface of the surface plate 20 toward the inner peripheral end. When the injection nozzle part 32 reaches the vicinity of the inner peripheral end, the control unit 43 causes the injection nozzle part 32 to contact the polishing surface of the upper surface plate 20 with the tip of the brush-like member 34 in contact with the polishing nozzle. The motor 28 is controlled so as to move toward the outer peripheral end of the upper surface plate 20 while jetting water from 35.
When the injection nozzle portion 32 reaches the vicinity of the outer peripheral end of the upper surface plate 20, a gap is formed between the brush-like member 34 and the outer peripheral end of the upper surface plate 20. For this reason, the control unit 43 drives the cylinder device 19, and as shown in FIG. 2, the tip of the brush material 18 abuts on the outer peripheral end surface of the upper surface plate 20, and the outer periphery of the brush-like member 34 and the upper surface plate 20. The gap formed between the ends is closed.
Thereafter, the injection nozzle portion 32 starts moving from the vicinity of the outer peripheral end of the upper surface plate 20 to the vicinity of the inner peripheral end, and a gap formed between the brush-like member 34 and the outer peripheral end surface of the upper surface plate 20 is formed. When it disappears, the control unit 43 drives the cylinder device 19 to release the brush material 18 from the outer peripheral end surface of the upper surface plate 20.
In this manner, the spray nozzle portion 32 is parallel to the polishing surface of the upper surface plate 20 in a state where the tip of the brush-like member 34 is in contact with the polishing surface of the upper surface plate 20 while water is sprayed from the spray nozzle 35a. By reciprocating, the polished surface of the upper surface plate 20 can be cleaned.
The cleaning time of the polishing surface of the upper surface plate 20 is obtained in advance by experiments or the like and set in a timer. When the set time has elapsed, the cleaning of the polishing surface of the upper surface plate 20 can be terminated.
The control unit 43 can know from the signals from the position sensors 41 and 42 that the injection nozzle unit 32a has reached the vicinity of the outer peripheral end or the inner peripheral end of the upper surface plate 20.
[0025]
The control unit 43 issues a signal to stop the supply pump 38 and a signal to close the control valve 37 when receiving a signal indicating that the polishing of the polishing surface of the upper surface plate 20 is completed, for example, a signal from a timer. A signal is sent to the motor 45 to rotate the spray nozzle portion 32 so that the water spray direction faces the upward polishing surface of the lower surface plate 30.
Further, when the tip of the brush-like member 34 of the injection nozzle portion 32 comes into contact with the vicinity of the outer peripheral end of the polishing surface of the lower surface plate 30, the control unit 43 issues a signal for starting the supply pump 38 and the control valve 37. A signal to open is issued, water is sprayed from the spray nozzle 35 onto the polishing surface of the lower surface plate 30, and the polishing surface of the lower surface plate 30 is cleaned.
As with the polishing surface of the upper surface plate 20, the cleaning of the polishing surface of the lower surface plate 30 is performed by spraying the injection nozzle portion 32 with the tip of the brush-like member 34 in contact with the polishing surface of the lower surface plate 30. The motor 28 is controlled to reciprocate between the vicinity of the outer peripheral end and the vicinity of the inner peripheral end of the lower surface plate 30 while jetting water from the nozzle 35.
By the way, when cleaning the polishing surface of the lower surface plate 30, even if spray water or the like is ejected from the gap formed between the brush-like member 34 and the outer peripheral end of the lower surface plate 30 to the discharge receiver of the polishing liquid, As described above, there is no re-emission from the opening of the polishing liquid discharge receptacle. For this reason, it is not necessary to provide a gap closing means for closing the gap formed between the brush-like member 34 and the outer peripheral edge of the lower surface plate 30, but a gap closing means may also be provided on the lower surface plate 30 side. .
[0026]
The movement speed along the polishing surfaces of the upper surface plate 20 and the lower surface plate 30 of the jet nozzle 35 is determined by the grid-like horizontal grooves 12 and the vertical grooves 16 formed on the polishing surfaces of the upper surface plate 20 and the lower surface plate 30 in advance. It is preferable to experimentally obtain a moving speed capable of sufficiently cleaning the deposit deposited on the control unit 43 and set it in the control unit 43.
In this way, each of the moving speeds of the spray nozzle portion 32 that cleans each polishing surface of the upper surface plate 20 and the lower surface plate 30 is experimentally obtained in advance and set in the control unit 43 is formed on each polishing surface. This is because the optimum moving speed at which each polished surface can be sufficiently cleaned differs depending on the formation density, groove width, and the like of the grid-like horizontal grooves 12 and vertical grooves 16.
[0027]
By reciprocating the injection nozzle portion 32 along the polishing surface of the lower surface plate 20 with the tip of the brush-like member 34 in contact with the polishing surface of the lower surface plate 30 while injecting water from the injection nozzle 35, The polished surface of the lower surface plate 30 can be cleaned. At that time, the dirt adhering to the polishing surface of the lower surface plate 30 can be washed, and the polishing surface of the upper surface plate 20 can be washed and washed away. Recontamination of the polished surface of the surface plate 20 with cleaning water can be prevented.
The cleaning time of the polishing surface of the lower surface plate 30 is also obtained in advance by experiments and set in a timer, and when the set time has elapsed, the cleaning of the polishing surface of the lower surface plate 30 can be terminated.
When the cleaning of the polishing surface of the lower surface plate 30 is completed, the control unit 43 that has received a signal indicating completion of cleaning of the polishing surface of the lower surface plate 30, for example, a signal from a timer, issues a signal to stop the supply pump 38. At the same time, a signal for closing the control valve 37 is issued.
Further, the cleaning of each polished surface of the upper surface plate 20 and the lower surface plate 30 is completed by extracting the injection nozzle portion 32 from the gap between the upper surface plate 20 and the lower surface plate 30.
Here, the moving speed of the injection nozzle part 32 may be a constant speed, but the movement speed of the injection nozzle part 32 is variable depending on the cleaning area and the peripheral speed of the polishing surfaces of the upper surface plate 20 and the lower surface plate 30. It is good. For example, the vicinity of the outer peripheral end of the polishing surface of the upper surface plate 20 and the lower surface plate 30 has a larger cleaning area and a higher peripheral speed than the vicinity of the inner peripheral end, and therefore, an injection nozzle that cleans the polishing surface near the outer peripheral end. The moving speed of the portion 32 may be lower than that of the spray nozzle portion 32 that cleans the polishing surface near the inner peripheral end, and the area that can be cleaned near the outer peripheral end by the spray nozzle portion 32 may be made as wide as possible.
[0028]
The spray nozzle portion 32 shown in FIG. 3 is provided with one spray nozzle 35, but in order to shorten the cleaning time of each polishing surface of the upper surface plate 20 and the lower surface plate 30, as shown in FIG. A plurality of injection nozzles 35, 35... May be provided in the injection nozzle portion 32. The plurality of injection nozzles 35, 35,... May be arranged in parallel in the moving direction of the injection nozzle portion 32 as shown in FIG. 4A, and as shown in FIG. The parts 32 may be arranged in series in the moving direction.
Further, water may be ejected from all or a part of the plurality of ejection nozzles 35, 35,. In this case, among some of the injection nozzles 35, 35,..., High pressure water of 10.79 MPa or more is injected near the discharge port of the supply pump 38 from some of the injection nozzles, and the discharge of the supply pump 38 is discharged from the other injection nozzles. You may inject | pour, irradiating an ultrasonic wave to the low pressure water below 10.79 MPa in the exit vicinity. In this way, by using both high-pressure water jet and low-pressure water jet irradiated with ultrasonic waves, the grid-like horizontal grooves 12 and vertical grooves 16 formed on the polished surfaces of the upper surface plate 20 and the lower surface plate 30. The deposit deposited on the substrate can be pulverized with ultrasonic waves, and the pulverized pulverized product can be scraped out by jetting high-pressure water.
In addition, you may inject the liquid containing a rust preventive agent from some injection nozzles 35 and 35 ....
[0029]
Further, the brush-like member 34 implanted so as to surround the injection nozzle 35 of the injection nozzle portion 32 shown in FIGS. 3 and 4 is aligned to a predetermined length, but as shown in FIG. You may plant the brush-shaped member 34 from which thickness differs. The brush-like member 34 shown in FIG. 5 has a double structure, and the length of the inner brush-like member 34a disposed on the inner side is shorter than that of the outer brush-like member 34b disposed on the outer side. ing. In the brush-like member 34 having a different length shown in FIG. 5, when cleaning the polishing surface of the upper surface plate 20, the tip of the short inner brush-like member 34 a is in contact with the polishing surface for cleaning. The tip of the long outer brush-like member 34b enters the lattice-like lateral groove 12 (vertical groove 16), and the inside of the lateral groove 12 (vertical groove 16) can be cleaned.
[0030]
In the cleaning device shown in FIGS. 3 to 5, the spray nozzle portion 32 is formed from the outermost polishing surface with respect to the polishing surfaces of the upper surface plate 20 and the lower surface plate 30 as in the cleaning device A shown in FIG. 6. Although it is reciprocating linearly with the innermost polishing surface, as shown in the cleaning device B, the spray nozzle 32 may be rotated in an arc with respect to the polishing surfaces of the upper surface plate 20 and the lower surface plate 30. Good. Further, the cleaning device A and the cleaning device B may be provided side by side.
Further, like the cleaning device shown in FIGS. 3 to 5, even in the cleaning device shown in FIGS. 1 and 2, after cleaning the polishing surface of the upper surface plate 20, to clean the polishing surface of the lower surface plate 30, This is possible by providing two supply pipes for supplying water to each of the injection nozzles 100a and 100b, providing a control valve (electromagnetic valve) for each supply pipe, and providing a control unit for controlling each control valve. In this control unit, the control valve of the supply pipe that supplies water to the injection nozzle 100a is opened to clean the polished surface of the upper surface plate 20, and then the control valve of the supply pipe that supplies water to the injection nozzle 100b is opened. Each control valve is controlled so as to clean the polished surface of the board 30.
[0031]
By the way, in the cleaning apparatus shown in FIGS. 3 to 6, the downward polishing surface of the upper surface plate 20 is cleaned by spraying water from the injection nozzle 35, and then the upward polishing surface of the lower surface plate 30 is rotated and sprayed. Water is jetted from the nozzle 35 for cleaning. For this reason, in the washing | cleaning apparatus which provides the two injection nozzles 100a and 100b toward each polishing surface of the upper surface plate 20 and the lower surface plate 30 shown in FIG. 1 or FIG. 2, and injects water simultaneously from the injection nozzles 100a and 100b. In comparison, the cleaning speed tends to decrease.
As shown in FIG. 7A, the decrease in the cleaning speed is achieved by arranging a plurality of injection nozzle portions 32a, 32b, 32c for injecting water in the same direction on the extending member 29 in series at equal intervals. It can be solved by doing.
[0032]
In this way, by arranging the injection nozzle portions 32a, 32b, 32c in series on the extending member 29 at equal intervals, as shown in FIG. 7B, the injection nozzle portions 32a, 32b, 32c Among these, the injection nozzle portion 32c on the motor 45 side is positioned on the outermost polishing surface of each polishing surface of the upper surface plate 20 and the lower surface plate 30, thereby disposing the injection nozzle portion disposed at the distal end portion of the extending member 29. 32 a is located on the inner surface of each polishing surface of the upper surface plate 20 and the lower surface plate 30. For this reason, as shown in FIG. 7A, by arranging a plurality of injection nozzle portions 32a, 32b, 32c in series with the extending member 29, as shown in FIG. Compared with the case where one injection nozzle part 32 is provided, the stroke length of each injection nozzle part 32 can be shortened, and the reduction in the cleaning speed can be prevented.
The plurality of injection nozzle portions 32a, 32b, and 32c can be simultaneously rotated in a predetermined direction by driving the motor 45 and rotating the extending member 29. For this reason, after cleaning the downward polishing surface of the upper surface plate 20 by simultaneously spraying water from the plurality of spray nozzle portions 32a, 32b, 32c, the plurality of spray nozzle portions 32a, 32b, 32c rotated. Thus, water can be simultaneously jetted onto the upward polishing surface of the lower surface plate 30 for cleaning.
In the cleaning apparatus shown in FIG. 7A, the same members as those forming the cleaning apparatus shown in FIG.
[0033]
Further, the decrease in the cleaning speed described above is caused by the upper surface plate injection provided with the upper surface plate injection nozzle 35d for injecting water onto the downward polishing surface of the upper surface plate 20, as shown in FIG. A nozzle portion 32d and a lower surface plate injection nozzle portion 32e provided with a lower surface plate injection nozzle 35e for injecting water onto the upward polishing surface of the lower surface plate 30 are provided, and each polishing surface is provided from each of the injection nozzles 35d, 35e. It can also be solved by moving the upper surface plate injection nozzle portion 32d and the lower surface plate injection nozzle portion 32e while injecting water.
However, if the upper surface plate spray nozzle portion 32d and the lower surface plate spray nozzle portion 32e are moved simultaneously, the cleaning liquid that cleans the polishing surface of the upper surface plate 20 falls onto the cleaned surface of the lower surface plate 30, and the lower surface plate Re-contamination of 30 polished surfaces. For this reason, as shown in FIG. 8A, the lower surface plate injection nozzle 32e is moved upward so as to clean the polishing surface of the upper surface plate 30 and wash the cleaning water dropped on the polishing surface of the lower surface plate 30. By moving after a predetermined time from the jet nozzle portion 32d for the platen, the concern that the polished surface of the cleaned lower platen 30 may be re-contaminated due to the cleaning liquid for cleaning the polished surface of the upper platen 20 can be eliminated.
The upper surface plate injection nozzle portion 32d and the lower surface plate injection nozzle portion 32e are provided with a lower surface plate injection nozzle portion 32e immediately below the upper surface plate injection nozzle portion 32d, as shown in FIG. Alternatively, as shown in FIG. 8B, the upper surface plate injection nozzle portion 32d and the lower surface plate injection nozzle portion 32e may be provided at different locations.
Note that the upper surface plate injection nozzle portion 32d and the lower surface plate injection nozzle portion 32e of FIG. 8A may not be provided so as to be rotatable.
[0034]
As the brush member 18 as the gap closing member provided in the cleaning device described so far, a brush member implanted around a nozzle for injecting water supplied via the shaft 11 can also be used. By using such a brush material, the brush-like member 34 and the upper surface plate 20 constituting the injection nozzle portion 32 are cleaned while the outer peripheral end surface of the upper surface plate 20 is washed with water sprayed from the nozzle and the tip of the brush material. It is possible to close a gap formed between the outer peripheral end of the jet nozzle portion 32 and from which jet water, spray water, or the like from the jet nozzle 35 of the jet nozzle portion 32 is ejected.
Further, although the brush-like member 34 is implanted around the spray nozzle in the spray nozzle portion provided in the cleaning device that has been described, the spray water sprayed from the spray nozzle 35, spray water, and the like are scattered. Any material can be used as long as it can be prevented. For example, it may be a net or cloth.
Furthermore, the brush material 18 that closes the gap formed between the brush-like member 102 (34) and the outer peripheral end surface of the upper surface plate 20 also prevents scattering of spray water, spray water, and the like sprayed from the spray nozzle 35. Any material can be used as long as it can be used, for example, a netting material or a cloth material. Moreover, although the cleaning apparatus shown in FIGS. 1-8 is provided separately from the polishing apparatus, the polishing apparatus may be provided integrally with the cleaning apparatus.
Of course, the cleaning apparatus described above may be used in a double-side polishing apparatus that polishes both surfaces of a workpiece such as a silicon wafer to a mirror surface. Also in this case, the water sprayed onto the polishing surface of the double-side polishing apparatus can easily remove dirt on the polishing surface by using hot water of about 10 to 90 ° C., particularly about 40 ° C., and the pressure is near the discharge port of the supply pump. The high-pressure water is preferably 10.79 MPa or more, particularly 11.76 MPa or more.
[0035]
【The invention's effect】
According to the present invention, the polishing apparatus is mounted on the entire polishing surface of the upper surface plate and the lower surface plate provided in the double-side polishing apparatus with spray water, spray water, or the like sprayed from the spray nozzle onto each polishing surface. It can be washed without spouting into the space.
For this reason, even if the polishing apparatus is placed in a clean room, the cleanliness in the cleanroom is not reduced by the spray water or spray water sprayed from the spray nozzle, and the cleanliness of the silicon wafer or the like is required. Polishing can be performed.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view for explaining an example of a cleaning apparatus of the present invention.
FIG. 2 is an explanatory view for explaining the operation of the cleaning apparatus shown in FIG. 1;
FIG. 3 is an explanatory diagram for explaining a schematic structure of another example of the cleaning apparatus according to the present invention.
4 is a partial front view showing another example of an injection nozzle portion that can be used in the cleaning device shown in FIG. 3. FIG.
5 is a partial front view showing another example of an injection nozzle portion that can be used in the cleaning device shown in FIG. 3. FIG.
6 is an explanatory view for explaining a moving direction of an injection nozzle portion of the cleaning apparatus shown in FIG. 3;
FIG. 7 is an explanatory view for explaining another example of the cleaning apparatus according to the present invention.
FIG. 8 is a schematic view for explaining another example of the cleaning apparatus according to the present invention.
FIG. 9 is an explanatory view illustrating the structure of a lapping apparatus as an example of a double-side polishing apparatus.
10 is a partial plan view for explaining the state of the polished surface of the lower surface plate 30 of the lapping apparatus shown in FIG. 9;
FIG. 11 is a schematic view illustrating a conventional cleaning apparatus.
12 is a partial cross-sectional view illustrating an injection nozzle portion of the conventional cleaning device shown in FIG.
13 is an explanatory diagram for explaining a state when the spray nozzle portion, the upper surface plate, and the lower surface plate shown in FIG.
[Explanation of symbols]
18 Brush material (Gap closing means)
20 Upper surface plate
24 Cylinder device (lifting means)
24a Rod
25 Mobile
28 Motor
29 Extension member
30 Lower surface plate
26 Moving device (moving means)
32, 32a, 32b, 32c, 32d, 32e, 100a, 100b injection nozzle part
33 Supply piping
34,102 Brush-like member (scattering prevention means)
35 Injection nozzle
37 Control valve (solenoid valve)
38 Supply pump (water supply means)
43 Control unit (control means)
45 Motor (turning means)

Claims

Each polishing is performed by injecting water from an injection nozzle that moves along each of the polishing surfaces of the upper surface plate and the lower surface plate facing each other while rotating the upper surface plate and the lower surface plate provided in the double-side polishing apparatus. When cleaning the surface,
A spray preventing means for spraying water sprayed from the spray nozzle onto the polishing surface to be cleaned; and a moving means for moving the spray nozzle along the polishing surface to be cleaned. Use the cleaning device
In order to clean the vicinity of the outer peripheral edge of the polishing surface of the upper platen, the spray nozzle that is surrounded by the polishing surface of the upper platen and the scattering prevention means and sprays water toward the polishing surface of the upper platen, When the moving means moves to the vicinity of the outer peripheral edge of the upper surface plate, and a gap is formed between the scattering prevention means and the outer peripheral edge of the upper surface plate, the spray water from the injection nozzle, etc. via the gap A method of cleaning a polishing platen, wherein the gap is closed by a gap closing means so as not to eject.

The method for cleaning a polishing surface plate according to claim 1, further comprising: an injection nozzle for injecting water toward the polishing surface of the upper surface plate, and an injection nozzle for injecting water toward the polishing surface of the lower surface plate.

2. The polishing surface plate cleaning according to claim 1, further comprising: a rotating means for rotating the spray nozzle so that water can be sprayed onto a polishing surface to be cleaned, using a spray nozzle that is rotatably provided as the spray nozzle. Method.

The method of cleaning a polishing surface plate according to any one of claims 1 to 3, wherein a brush-like member planted so as to surround the spray nozzle is used as the scattering prevention means.

As the gap closing means, a closing brush-like member that closes the gap formed between the scattering prevention means and the outer peripheral edge of the upper surface plate, and the closing brush-like member are moved to a closing position that closes the gap. The method for cleaning a polishing surface plate according to any one of claims 1 to 4, wherein a gap closing means comprising a moving means is used.

The method for cleaning a polishing surface plate according to any one of claims 1 to 5, wherein the polishing surface of the lower surface plate is cleaned after the polishing surface of the upper surface plate is cleaned.

Each polishing surface is made by spraying water from spray nozzles that rotate along the polishing surfaces of the upper and lower surface plates facing each other by rotating the upper and lower surface plates provided in the double-side polishing apparatus. In the polishing surface plate cleaning device for cleaning
The spray nozzle is provided so as to surround the spray nozzle, and means for preventing scattering of spray water or the like sprayed from the spray nozzle onto the polishing surface to be cleaned, and moving means for moving the spray nozzle along the polishing surface to be cleaned Equipped,
The injection nozzle that is surrounded by the polishing surface of the upper surface plate and the scattering prevention means and injects water toward the polishing surface of the upper surface plate is moved to the vicinity of the outer peripheral end of the upper surface plate by the moving means, When a gap is formed between the scattering prevention means and the outer peripheral edge of the upper surface plate, a gap closing means for closing the gap is provided so that spray water or the like from the injection nozzle does not jet through the gap. An apparatus for cleaning a polishing surface plate, characterized in that:

The apparatus for cleaning a polishing surface plate according to claim 7, further comprising: an injection nozzle for injecting water toward the polishing surface of the upper surface plate, and an injection nozzle for injecting water toward the polishing surface of the lower surface plate.

A water supply means for supplying water to the spray nozzle is provided, and a control means for controlling the water supply means is provided so as to clean the polishing surface of the lower surface plate after cleaning the polishing surface of the upper surface plate. The apparatus for cleaning a polishing surface plate according to claim 8.

The spray nozzle is a spray nozzle provided so as to be rotatable, and is provided with a rotating means for rotating the spray nozzle so that water can be sprayed toward the polishing surface to be cleaned. Cleaning machine for polishing surface plate.

A water supply means for supplying water to the spray nozzle is provided, and the water supply means and the spray nozzle are rotated so as to clean the polishing surface of the lower surface plate after cleaning the polishing surface of the upper surface plate. 11. The apparatus for cleaning a polishing surface plate according to claim 10, wherein control means for controlling the means is provided.

The apparatus for cleaning a polishing surface plate according to any one of claims 7 to 11, wherein the scattering prevention means is a brush-like member planted so as to surround the spray nozzle.

The gap closing means includes a closing brush-like member for closing a gap formed between the scattering prevention means and the outer peripheral edge of the upper surface plate, and the closing brush-like member is moved to a closing position for closing the gap. The apparatus for cleaning a polishing platen according to any one of claims 7 to 12, further comprising a moving means for performing the above operation.