JP3853030B2 - Electronic components - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a so-called leadless electronic component in which an insulating plate for mounting is attached to an end face of the electronic component in order to facilitate mounting of a lead wire type electronic component to a printed circuit board.
[0002]
[Prior art and problems]
As this type of conventional leadless electronic component, for example, there is an electrolytic capacitor as disclosed in Japanese Patent Application Laid-Open No. 59-211123.
In this leadless aluminum electrolytic capacitor, as shown in FIG. 4, the capacitor element 1 is housed in a metal case 2, and leads 3 and 3 extending from the capacitor element 1 are pulled out through a sealing member 4 that seals the open end of the case 2. The capacitor body 5, the through-holes 6 and 6 through which the leads 3 and 3 are abutted, and the through-holes 6 and 6 provided on the outer surface. It consists of an insulative mounting plate 8 having concave grooves 7 and 7 connected to each other, and the tips of the leads 3 and 3 penetrating through the through holes 6 and 6 are left as round bars or are flattened so that they are inside the concave grooves 7 and 7. And bent from the bent portion to a soldered portion to the printed circuit board.
[0003]
However, in this capacitor, since only the outer part of the peripheral surface of the leads 3 and 3 which are bent and accommodated in the concave grooves 7 and 7 becomes the soldering surface to the substrate, the soldering area is reduced, and the capacitor is printed. In the surface mounting process on the substrate, it is difficult to position the capacitor with respect to the printed circuit board. And since the contact area of a capacitor | condenser and the conductor of a printed circuit board is narrow, there is little amount of molten solder adhering between each other, Therefore Adhesive strength cannot fully be taken. Further, when the leads 3 and 3 are bent, stress is easily applied to the internal capacitor element 1 to easily deteriorate the characteristics. In order to reduce this, the leads 3 and 3 are bent in advance, for example, by cutting. Although bending is also facilitated, when a shock or vibration is applied to the capacitor mounted on the printed circuit board, the lead may be disconnected at the bent portion.
[0004]
Furthermore, such a capacitor has a problem that the lead must be inserted into the small-diameter through hole when the mounting plate is coupled to the capacitor element. This insertion operation is extremely inefficient if performed manually, and if it is to be automated, the interrelationship between the capacitor element and the mounting plate requires extremely high precision, especially when the lead is a thin wire. Since the leads are not necessarily parallel, handling is difficult. Therefore, if such work is automated, no matter how sophisticated the device is, the lead is not inserted into the through hole and is compressed into a flat lump between the capacitor body end face and the mounting plate. Such a thing may be sent out as a finished product. In the mass production process, if even one such defective product is found, all of the products in that lot are discarded, and the damage caused by this is very large.
[0005]
In order to solve the problem of the electrolytic capacitor with the mounting plate as described above, it is conceivable to provide slits 9 and 9 in the mounting plate 8 instead of the through holes 6 and 6 as shown in FIG. In the figure, metal plate terminals 10, 10 are joined to the outer surface of the mounting plate 8 by insert molding, and slits parallel to each other from one side edge 8 a of the mounting plate 8 toward the metal plate terminals 10, 10. 9 and 9 are provided. The lengths of the leads 3 and 3 of the capacitor body 5 are approximately equal to the thickness of the mounting plate 8, and the interval is approximately equal to the interval between the slits 9 and 9.
[0006]
When the mounting plate 8 and the capacitor body 5 are combined, the leads 3 and 3 are introduced from the mounting plate side edge 8a into the slits 9 and 9 so that the positions of the mounting plate 8 and the capacitor body 5 are in a predetermined relationship. The leads 3 and 3 are laser welded to the metal plate terminals 10 and 10 respectively.
[0007]
The capacitor shown in FIG. 5 is easy to produce because it is not necessary to insert the lead into a small-diameter through hole, and it is not necessary to bend the lead, so that adverse effects on the capacitor element and disconnection of the lead can be avoided. . In addition, since there is a metal plate terminal having a large area, soldering to the printed circuit board conductor is easy. This soldering is performed by adhering cream solder on a printed circuit board by a printing technique, placing an electrolytic capacitor with a mounting plate thereon, passing through a heating furnace, and melting the solder. However, in this case, it has been difficult to visually determine whether the metal plate terminals 10 and 10 of the capacitor and the board conductor are securely soldered. Accordingly, the present invention is intended to facilitate the determination of whether the soldering between the board conductor and the metal plate terminal of the capacitor is good or not, and to facilitate the repair in the case of a soldering failure.
[0008]
[Means for Solving the Problems]
The electronic component of the present invention includes an electronic component main body and an insulating mounting plate abutted on one end surface thereof. A plurality of leads are drawn out from the end face of the electronic component body. The mounting plate has metal plate terminals corresponding to the leads on the outer surface, and slits are formed from one side edge of the mounting plate to the metal plate terminals. The leads are located in the slits and are electrically connected to the metal plate terminals, respectively.
[0009]
As a feature of the present invention, each metal plate terminal extends from each slit position to the side edge portion of the mounting plate, and is bent here and rises in the direction of the electronic component body along the peripheral surface of the mounting plate. Yes. Therefore, when the solder is heated and melted, it rises along the rising portion of each metal plate terminal, so that this can be easily confirmed visually. If the soldering is poor, the solder does not rise along the rising portion of the metal plate terminal. If such a state is observed, the soldering iron or the like is used.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
In FIG. 1, an insulating mounting plate 8 is in contact with the end surface 5 a of the capacitor body 5. The metal plate terminals 10 and 10 are joined to the outer surface of the mounting plate 8, that is, the lower surface, from the opposite side edges 8b and 8c toward the center, respectively, and from the other side edge 8a to the metal plate terminals 10 and 10, respectively. The slits 9 and 9 parallel to each other are formed. From the end face 5a of the capacitor body 5, leads 3 and 3 that are substantially equal to the thickness of the mounting plate 8 are led out at intervals equal to the intervals between the slits 9 and 9. Laser welding is performed on the metal plate terminals 10 and 10 at the innermost portion.
[0011]
The metal plate terminal 10 is integrally coupled to the mounting plate 8 by insert molding when the mounting plate 8 is molded of an insulating resin. The metal plate terminal 10 has a generally rectangular shape, and as shown in an enlarged view in FIG. 2, a main portion 11 that is flush with the lower surface of the mounting plate 8, that is, the outer surface, and an upper side from one end of the main portion 11. A recess 12 that is slightly recessed, a rising portion 13 that is bent upward from the other end of the main portion 11, and tongue pieces 14 and 14 that are bent upward from both sides of the main portion 11. The U-shaped rising portion 15 formed upward in the recess 12 constitutes the inner wall surface of the slit 9 in cooperation with the mounting plate 8. The rising portion 13 is in close contact with the outer peripheral surface of the mounting plate 8, and the tongue pieces 14 and 14 are buried in the resin constituting the mounting plate 8.
[0012]
Protrusions 16, 16, 16, and 17 are provided at the four corners of the lower surface of the mounting plate 8 in order to form a thin solder layer having an appropriate thickness between the board conductor and the metal plate terminal main part 11. A resin injection gate 18 and a recess 19 surrounding the resin injection gate 18 are formed at the center of the protrusion 17.
[0013]
As shown in FIG. 3, a horseshoe-shaped barrier 20 opened in the direction of the side edge 8a where the slits 9 and 9 are opened is integrally formed on the upper surface of the mounting plate 8 along the side edges 8b, 8c and 8d. Yes. In this embodiment, the leads 3, 3 of the capacitor body 5 are introduced into the slits 9, 9 from the side edge 8 a side, and the leads 3, 3, while sliding the lower surface of the capacitor body 5 and the upper surface of the mounting plate 8. Is moved to a predetermined position at the innermost part of the slits 9 and 9, the peripheral surface of the capacitor body 5 is brought into contact with the inner peripheral surface of the barrier 16, so that no excessive stress is applied to the leads 3 and 3. Positioning can be performed.
[0014]
In the above-described embodiment, in order to strongly attach the electrolytic capacitor to the substrate conductor, it is necessary to surely solder the portions of the metal plate terminals 10 and 10 close to the attachment plate side edges 8c and 8d. Each of the terminals 10 and 10 has a rising portion 13 along the side edge of the mounting plate, and since the molten solder rises along these rising portions during soldering, it is possible to easily observe the quality of soldering by visual observation. it can.
[0015]
Although the above-described embodiment is directed to a cylindrical aluminum electrolytic capacitor, the present invention can be applied to other electronic components in which leads are similarly derived from one end face.
[0016]
【The invention's effect】
As described above, according to the present invention, when the mounting plate is coupled to the electronic component main body and leadless, the operation of inserting the lead extending from the electronic component main body into the through hole of the mounting plate can be avoided. In addition, it is possible to easily identify whether the leadless electronic component is attached to the board.
[Brief description of the drawings]
1A and 1B show an embodiment of the present invention, in which FIG. 1A is a cross-sectional view taken along line AA of a bottom view, and FIG.
2 shows a metal plate terminal used in the embodiment shown in FIG. 1 of the present invention, wherein (a) is an enlarged plan view and (b) is an enlarged front view. FIG.
3 shows a mounting plate used in the embodiment shown in FIG. 1 of the present invention, wherein (a) is a plan view and (b) is a side view. FIG.
4A and 4B show an example of a conventional surface-mount type electronic component, in which FIG. 4A is a partially cut front view, and FIG. 4B is a bottom view.
FIGS. 5A and 5B show an example of an improved surface mount electronic component not according to the present invention, in which FIG. 5A is a partially cut front view, and FIG. 5B is a bottom view.
[Explanation of symbols]
3 Lead 5 Electronic component body 8 Mounting plate 8a to 8d Side edge 9 Slit 10 Metal plate terminal 11 Main part 12 Recess 13 Rising part 14 Tongue piece 15 Rising part 16 Protrusion 17 Protrusion

Claims (3)

The electronic component main body in which a plurality of leads are drawn out from the same end surface, and an insulating mounting plate abutting on the end surface of the electronic component main body, the mounting plate is configured to Each has a metal plate terminal at a position corresponding to the lead, and a slit is formed in each of the mounting plate and the metal plate terminal between the first side edge of the mounting plate and the position corresponding to each lead. The leads are in the slits and are electrically and mechanically coupled to the metal plate terminals, respectively. The metal plate terminals are connected to the first side of the mounting plate from the slit positions. An electronic component characterized by having a rising portion that extends to different side edges other than the edge and is bent at the extended end along the peripheral surface of the mounting plate. There are two leads drawn out from the electronic component body, and each metal plate terminal extends to the second and third side edges adjacent to the first side edge of the mounting plate. The electronic component according to claim 1. 2. The electronic component according to claim 1, wherein each of the leads is welded to each of the metal plate terminals.

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