JP3750577B2

JP3750577B2 - Process liquid flow rate adjusting device and surface treatment device provided with the flow rate adjusting device

Info

Publication number: JP3750577B2
Application number: JP2001268343A
Authority: JP
Inventors: 英純加藤; 仁村松
Original assignee: Suzuki Motor Corp
Current assignee: Suzuki Motor Corp
Priority date: 2001-09-05
Filing date: 2001-09-05
Publication date: 2006-03-01
Anticipated expiration: 2021-09-05
Also published as: JP2003073892A

Description

【０００１】
【発明の属する技術分野】
本発明は、筒状部を有する中空体の内面に処理液を流通させて表面処理を施す表面処理装置に関する。更に詳しくは、内燃機関のシリンダブロック内に処理液を流してメッキや電解エッチング等の表面処理を施す表面処理装置に関する。
【０００２】
【従来の技術】
通常、自動車のエンジンに用いられるアルミニウム合金製シリンダブロックのシリンダボア面には、ピストンの摺動に対する耐摩耗性を向上させるために、鋳鉄スリーブが挿入されている。しかし、この鋳鉄スリーブによってエンジンの重量が大きくなり、車両の燃費が低下するおそれがあった。そこで、近年はエンジンの軽量化や性能向上を図るため、ニッケルメッキ皮膜中にＳｉＣ等の硬いセラミックス粒子を共析させてシリンダボア面に複合メッキを施すことによって、前記鋳鉄スリーブを廃止したアルミニウム合金製シリンダブロックの開発が進められている。
なお、以下の記載においては、皮膜（ニッケルメッキ皮膜等）中に粒子（ＳｉＣの硬質セラミックス粒子等）が取り込まれることを「共析」と呼ぶ。
【０００３】
このシリンダブロックのメッキにおいては、効率よくメッキを行うため、シリンダボア内に電極を配置し、該シリンダボア内にメッキ液を流しながらメッキ処理をする方法を採用している。
ここで、シリンダブロックは、その構造によって、直列４気筒やＶ型６気筒等に分類されている。この直列４気筒シリンダブロックのシリンダボア面にメッキ処理を施す場合や、Ｖ型６気筒シリンダブロックのシリンダボア面を片バンクずつメッキ処理する場合は、シリンダボアの軸線が鉛直方向になった状態のままメッキ処理を行うため、重力などの影響は受けず、メッキ皮膜中に共析した分散粒子の共析量は皮膜全体に亘って均一となる。
【０００４】
しかし、Ｖ型シリンダブロック２０１を両バンクのシリンダ共に同時にメッキ処理する場合は、図２５及び図２６に示すように、シリンダボア面２０３のうち、車両搭載状態において傾斜した下方側に位置するメッキ皮膜２０５中の分散粒子２０７の共析量が大きくなるという問題があった。つまり、Ｖ型シリンダブロック２０１においては、図２５に示すように、シリンダボア２０９が左右の斜め上方に向けて傾斜しているため、このシリンダボア２０９内をメッキ液が流れる場合、該メッキ液中のＳｉＣ等の分散粒子（硬質粒子）２０７は、特開平１１−１２７９０号公報に記載されているように、重力の影響によって傾斜した下方側のシリンダボア面２０３におけるメッキ皮膜２０５中（図２６参照）により多く共析しやすかった。
【０００５】
この問題を解決するため、特開平８−１４４０８２号公報では、Ｖ型シリンダブロックを片バンクのシリンダずつに分けて前処理とメッキ処理を施している。しかし、この方法では、同一のシリンダブロックを２回に分けて前処理及びメッキ処理をしなげればならず、作業工数が２倍かかるため、コストが高くなると共に、メッキラインも長くなるという問題があった。
【０００６】
【発明が解決しようとする課題】
本発明は、前記課題を解決し、筒状のワークの内面に処理液を流しながら皮膜を形成する場合に、前記内面の片側とこの片側に対向する他方側とで、処理液の流速を変えることができる流速調整装置及び該流速調整装置を備えた表面処理装置を提供することを目的とする。
【０００７】
本発明に係る処理液の流速調整装置は、前記目的を達成するため、一端側の蓋部に排出穴が穿設された有蓋筒状の本体を備えた処理液の流速調整装置であって、筒状のワークの開口面に前記本体の他端側を当接させ、前記ワーク内に流入させた処理液を、前記本体の内部を介して前記排出穴から排出させる際に、前記ワーク内部の被処理面の一部分における処理液の流速と、この一部分に対向する他の部分の被処理面における流速とに差異を設けるように構成している。
【０００８】
さらに、本発明に係る処理液の流速調整装置では、前記本体の内部に、複数の挿通穴を有する隔壁板を設け、該隔壁板で本体内部を軸方向に分け隔てることによって、前記他端側に位置する第１の空間及び前記一端側に位置する第２の空間を形成している。
【０００９】
前記隔壁板としては、例えば、メッキ処理用電極を取り付ける電極取付板などを用いることができる。
【００１０】
本発明に係る処理液の流速調整装置の一態様では、前記第１の空間側における本体の側壁に処理液の流出口を設け、第１の空間内に流入した処理液を前記流出口から流出させることによって、前記流出口の側における被処理面の処理液の流速を、流出口に対向する側の被処理面における処理液の流速よりも速くしている。
【００１１】
この流出口がいわゆるバイパス流路の役割を果たすため、簡単でかつ確実に被処理面における処理液の流速を速くすることができる。
【００１２】
そして、本発明に係る処理液の流速調整装置の別の態様では、前記第１の空間側における本体の側壁の内面に、切欠きによって形成した凹部を設け、この凹部側における被処理面の処理液の流速を、凹部の対向側における被処理面の処理液の流速よりも速くすることができる。
【００１３】
前記凹部によって、第１の空間における凹部側の流路面積が大きくなるため、結果的に、凹部側の被処理面における処理液の流速を速くすることができる。
【００１４】
さらに、本発明に係る処理液の流速調整装置の更に別の態様では、前記隔壁板の挿通穴を周方向に間隔を隔てて複数設けると共に、これらの挿通穴の径を、前記隔壁板の径方向の片側と、この片側に対向する他方側とで差異を設けている。
【００１５】
前記挿通穴の径を大きくした側の被処理面における処理液の流速が、他方側における被処理面の流速よりも速くなる。
【００１６】
そして、本発明に係る処理液の流速調整装置の更に別の態様では、前記隔壁板の挿通穴を、周方向に間隔を隔てて複数設けると共に、これらの挿通穴の隣同士の間隔を、前記隔壁板の径方向の一方側と他方側とで差異を設けている。
【００１７】
また、本発明に係る処理液の流速調整装置の更に別の態様では、前記隔壁板の挿通穴を周方向に間隔を隔てて複数設ける。
【００１８】
また、これと共に、この態様では、これらの挿通穴よりも小さい径を有する流通穴を設けたマスキング板を、前記隔壁板に回転可能に取り付けている。
【００１９】
そして、本発明に係る処理液の流速調整装置の更に別の態様では、前記隔壁板の挿通穴を周方向に間隔を隔てて複数設けると共に、隔壁板の径方向に摺動することによってこれらの挿通穴を塞ぐことができる遮蔽板を、前記隔壁板に摺動可能に取り付けている。
【００２０】
なお、本発明に係る表面処理装置は、前述した流速調整装置を備えている。
【００２１】
【発明の実施の形態】
以下に、本発明の実施の形態に係る表面処理装置について説明する。本発明は、筒状に形成されたワークの内面に処理液を流しながら表面処理を施す場合に、皮膜中の粒子を均一に分散させる表面処理装置である。本発明の実施の形態においては、Ｖ型シリンダブロックのシリンダボア面にメッキを施す表面処理を中心に説明をする。なお、本発明は、被処理面であるシリンダボア面が傾斜した状態で処理をする場合に限定されず、シリンダボア面が上下方向に沿った状態で処理をする場合にも適用することができる。
【００２２】
本発明は、Ｖ型シリンダにおいて、傾斜したシリンダ内のメッキ液の流速をシリンダボアの各部位ごとに細かく調整することによって、即ち、傾斜したシリンダのシリンダボア内において下方側のシリンダボア面を流れるメッキ液の流速を上方側よりも速くすることができる。これによって、下方側のシリンダボア面における硬質粒子の過剰な共析を防止し、メッキ皮膜中の全体に亘ってＳｉＣなどの硬質粒子を均一に分散して共析させる表面処理である。以下、第１から第８の実施の形態に分けて、図面を参照しながら説明する。なお、まず第１の実施の形態について詳細に説明をするが、第２の実施の形態以降については、重複する内容の説明は省略する。
【００２３】
［第１の実施の形態］
図１は、第１の実施の形態に係る表面処理装置１を用いて、ワークとなるＶ型シリンダブロック３をメッキ処理している状態を示す断面図である。
床面５上には、支持台７が配置されており、該支持台７の上部には下治具９が取り付けられている。これらの支持台７と下治具９の中央部には、貫通した穴１１が形成されており、該穴１１には、下治具９の内部にメッキ液１３を流入させる流入口１５が取り付けられている。また、この支持台７の上方には、流速調整装置１７が設けられている。
【００２４】
この流速調整装置１７は、先端に伸縮可能なロッド１９を有する上側治具固定装置２１と、該ロッド１９の端部に取り付けられ、蓋部を有する流出治具２３と、該流出治具２３の下端に固定した陽極取付板（隔壁板）２５、上治具２７及びパッキン２９とを備えている。そして、整流器３１の正極側は陽極取付板２５に接続され、負極側はワーク３に接続されている。また、流出治具２３から排出されたメッキ液１３は液槽３３に流入したのち、該液槽３３から配管３５を介してワーク３中に流入するように構成されている。
【００２５】
ワークであるＶ型シリンダブロック３のシリンダボアは、左右両側の斜め上方に傾斜して形成されており、前記上治具２７もこのシリンダボアに沿って傾斜して配設されている。この上治具２７の上部には、挿通穴３７が穿設された陽極取付板２５が載置され、また、上治具２７の側壁のうち外方側（傾斜した下方側）には、流出口３９が形成されている。この流出口３９は、細い筒状に形成されており、前記上治具２７の側壁の途中から分岐したのち、配管３５を介して液槽３３に連結されている。この配管３５には、合流点４１前においてバルブ４３が配設されており、また、合流点４１以降の配管においても流量計４５とバルブ４７が配設されている。
【００２６】
そして、上治具２７、陽極取付板２５及び流出治具２３は液密状に一体化され、ロッド１９を介して上側治具固定装置２１に取り付けられているため、上下に自由に移動させることができる。
【００２７】
さらに、ワークとなるＶ型シリンダブロック３は、ヘッド面４９を上にした状態で下治具９の上に載置され、クランプ５１によって固定されている。各気筒のシリンダ５３内に陽極５５が挿入され、絶縁性のパッキン２９を介して上治具２７及び流出治具２３を上側治具固定装置２１によって押圧することにより、Ｖ型シリンダブロック３は液密状にシールされている。
【００２８】
前記構成を有する表面処理装置１を用いて処理を行う手順を簡単に説明する。ＳｉＣなどの粒子を含むメッキ液１３は、液槽３３からポンプ５７により圧送され、下治具９の下側に設けられた流入口１５から下治具９を通ってＶ型シリンダブロック３内に流入する。このＶ型シリンダブロック３内において、下治具９及びクランクケース部５９がバッファの役目を果たすため、Ｖ型シリンダブロック３内に流入するメッキ液１３の流れは均一化される。
【００２９】
次いで、メッキ液１３は左右両側のシリンダボア６１に分かれて流入するが、上治具２７には、下方側に流出口３９が設けられているため、シリンダボア６１内では下方側の方がメッキ液１３の流速が速くなる。さらに、各気筒のシリンダ５３内のメッキ液１３の流速は、流量計４５及びバルブ４３，４７により制御される。メッキ液１３を流しながら、Ｖ型シリンダブロック３をマイナス、陽極５５をプラスとして通電させることにより、シリンダボア面６３にメッキ皮膜を形成させることができる。ここで、シリンダボア６１内では下方側の方がメッキ液１３の流速が速いため、下方側のシリンダボア面６３におけるＳｉＣなどの粒子の過剰な共析を防止することができる。さらに、流出口３９への流速は、バルブ４３で制御することにより、ＳｉＣなどの粒子を均一に共析させることができる。
【００３０】
［第２の実施の形態］
前記第１の実施の形態においては、メッキ処理を施す形態について説明をしたが、第２の実施の形態においては、電解エッチング等の処理を行う場合について説明する。
図２に示すように、第２の実施の形態に係る表面処理装置７１においては、上治具７３の側壁のうち、上方側に流出口７５を設けている。
前記電解エッチングとは、電極をシリンダボア６１内に配置し、リン酸や硫酸などの電解液８３を流しながらシリンダブロック３を陽極、電極７７を陰極とし、シリンダボア面６３を腐食除去したりする処理であり、処理中に多量のガス７９が発生する。傾いたシリンダ５３では、処理中に発生したガスは矢印８１に示すように上方に流れるため、シリンダボア面６３の上方側が電解エッチングされにくい。
【００３１】
しかし、上治具７３の上方側には流出口７５を設けてあるため、上方側の電解液８３の流れがスムーズになり、かつ、流出口７５から、発生するガス７９を効率良く抜くことによって、シリンダボア面６３の処理を各部位について均一に行うことができる。
【００３２】
［第３の実施の形態］
第３の実施の形態に係る表面処理装置９１においては、図３に示すように、上治具９３の内側面のうち、下方側の面に凹部９５を形成しているため、電極９７の上部９７ａから凹部９５までの距離が下方側の方が大きく広がっている。また、電極取付板９９に穿設された挿通穴３７の大きさも、下方側の方を適宜大きめに形成している。従って、上治具９３とシリンダボア６１の下方側のメッキ液１３の流速は、上方側よりも大きくなり、シリンダボア面６３の下方側におけるＳｉＣなどの粒子の過剰な分散を防ぎ、シリンダボア面６３の皮膜全体に亘って均一に分散させることができる。
【００３３】
［第４の実施の形態］
第４の実施の形態に係る表面処理装置１０１においては、図４に示すように、上治具１０３の上方側の側壁に凹部１０５を形成しているため、電極１０７の上部１０７ａと凹部１０５との距離は、上方側の方が広がっている。また、電極取付板１０９の挿通穴３７も、上方側の方が大きく形成されているため、電解液８３をシリンダボア６１内に流すときは、上治具１０３及びシリンダボア６１の上方側の流速が大きくなる。
【００３４】
前記構成を有する表面処理装置１０１によれば、電極１０７をシリンダボア６１内に配置し、リン酸や硫酸などの電解液８３を流しながらシリンダブロック３を陽極、電極１０７を陰極として電解エッチングなどを施す場合は、処理中に発生し上方に流れるガス７９の抜けを良くできるので、シリンダボア６１内の電解エッチングの処理をシリンダボア面６３全体を均一に行うことができる。
【００３５】
［第５の実施の形態］
第５の実施の形態に係る表面処理装置１１１においては、図５〜図１０に示すように、陽極取付板２５に設けた挿通穴の大きさ、形状及び配置を変えることによって、シリンダボア内の処理液の流速を調整している。
図５は、表面処理装置１１１全体を示す断面図であり、整流器３１の正極が接続された陽極取付板２５には図６及び図７に示すような挿通穴１１３が形成されている。これらの図から判るように、上方側の流出口１１３ａは、下方側の流出口１１３ｂよりも小さく形成されているため、シリンダボア６１の下方側の方がメッキ液１３の流速が速くなる。
【００３６】
また、図８に示すように、陽極取付板２５の上方側に位置する挿通穴１１３に埋め栓１１７を施すことによっても、シリンダボア６１の下方側におけるメッキ液１３の流速を速くすることができる。
さらに、図９に示すように、上方側の挿通穴１１３ａを小さくすると共に、下方側の流出口１１３ｂを連通させて一つの長い穴に拡大すれば、メッキ液１３の流速の差を上方側と下方側とでより大きくすることができる。
なお、図１０に示すように、挿通穴１１３を細長いスリット形状の穴に形成し、シリンダボア６１内の上方側から下方側に向かって漸次的に間隔が密になるように複数個配列させている。穴の形状は、特に限定されず、楕円や台形などでも良い。
【００３７】
以上、図７〜図１０に示すような挿通穴１１３を有する陽極取付板２５によって、メッキ液１３中の粒子の沈降が抑制され、粒子が均一に分散したメッキ皮膜を得ることができる。これにより、Ｖ型シリンダブロック３のシリンダ５３を両バンクとも同時にメッキすることが可能となるため、片バンクずつメッキする場合に比較して、メッキに要するコストを半分に削減できると共に、及びメッキラインの長さも半分に短縮することができる。
【００３８】
［第６の実施の形態］
第６の実施の形態においては、図１１〜図１６に示すように、陽極取付板２５に予め穿設した挿通穴１１３を回転式マスキング板１２３又はスライド式遮蔽板１３３で塞ぐことによって、シリンダボア６１内のメッキ液１３の流速を調整している。
【００３９】
まず、図１１〜図１３は、扇形の回転式マスキング板１２３を示している。陽極取付板２５には、図１１と図１２に示すように、同一径の円形を有する挿通穴１１３が同一間隔で穿設されており、この挿通穴１１３のうち、３つを塞ぐことができる大きさの扇形の回転式マスキング板１２３が陽極取付板２５の中央部１２７を中心にピン１２９（図１３参照）によって回転可能に取り付けられている。また、回転式マスキング１２３には、前記挿通穴１１３よりも小さな径を有する別の流出口１３１が穿設されているため、図１３に示すように、シリンダボア６１の下方側におけるメッキ液１３の流速が上方側の流速よりも速くなる。前記マスキング板１２３は、特に限定されず、種々の形状と大きさとすることができる。
【００４０】
さらに、図１４〜図１６に示すように、スライド式遮蔽板１３３を挿通穴１１３にそれぞれ個別に配設している。このスライド式遮蔽板１３３を陽極取付板２５の径方向に出し入れすることによって、各々の流出口１１３を任意の大きさに塞ぐことができる。図１４には、流出口１１３の５ケ所にスライド式遮蔽板１３３を配設しているが、その個数、大きさ、及び形状はこれに限定されるものではない。
【００４１】
［第７の実施の形態］
第７の実施の形態においては、クランク軸受けジャーナル１３５が突出しているＶ型シリンダブロック１３７においてもジャーナル１３６の近傍におけるメッキ液１３の流速を均一化させることができる。
図１７〜図２０に示すＶ型シリンダブロック１３７には、クランク軸受けジャーナル１３５が突出している。図２０に示すように、このクランク軸受けジャーナル１３５の段部の近傍に陽極５５の下端部５５ａが位置するため、ジャーナル１３５の近傍におけるメッキ液１３の流速が遅くなり、メッキ液１３中の分散粒子が偏析しやすくなるおそれがある。
【００４２】
そこで、図１９に示すように、陽極取付板２５における挿通穴１１３を、クランク軸受けジャーナル１３５側に近づくにつれて徐々に大きくし、遠ざかるにつれて徐々に小さく形成している。これによって、ジャーナル側におけるメッキ液１３の流れ抵抗を小さくし、ジャーナル１３５の反対側における流れ抵抗を増加させることで、シリンダボア６１内における流速の均一性を図ることができる。
【００４３】
［第８の実施の形態］
第８の実施の形態では、水平対向エンジンにおいて、エンジン搭載状態で下側となるシリンダボア面に硬質粒子をあえて多く分散させている。
水平対向エンジン等は、エンジン搭載時に鉛直下側となるシリンダボア面がピストン荷重により特に摩耗しやすいため、この鉛直下側のシリンダボア面において、ＳｉＣ等の硬質粒子の共析量を上側よりも増加させる必要がある。
【００４４】
本発明は、このような水平対向エンジンにも適用可能であり、例えば、図２１〜図２４に示すように、直列２気筒型のシリンダブロック１４１を垂直に立てた状態でメッキをする場合において、陽極取付板２５に穿設した挿通穴の穴位置や大きさを適宜設定することによって、シリンダボア面６３の円周方向における硬質粒子の共析量を増減させることができる。
【００４５】
このように、エンジン搭載時に下側となるシリンダボア面６３の硬質粒子１４３の共析量を増加させたシリンダブロック１４１を組み合わせて使用することで、ピストン荷重による下側における偏摩耗を防止することができる。
【００４６】
【発明の効果】
本発明によれば、傾斜した被処理面に処理液中の粒子が均一に共析した皮膜を形成することができ、また、上下に延びる被処理面には、片側と他方側とで粒子の分散度合を変えた皮膜を形成することができる。
【図面の簡単な説明】
【図１】第１の実施の形態における表面処理装置を示す断面図である。
【図２】第２の実施の形態における表面処理装置の要部を示す断面図である。
【図３】第３の実施の形態における表面処理装置を示す断面図である。
【図４】第４の実施の形態における表面処理装置の要部を示す断面図である。
【図５】第５の実施の形態における表面処理装置を示す断面図である。
【図６】本図のうち、（ａ）は図５の陽極及び陽極取付板を示す斜視図であり、（ｂ）は（ａ）の側面図である。
【図７】第５の実施の形態における陽極取付板を示す平面図である。
【図８】第５の実施の形態における別の陽極取付板を示す平面図である。
【図９】第５の実施の形態における更に別の陽極取付板を示す平面図である。
【図１０】第５の実施の形態における更に別の陽極取付板を示す平面図である。
【図１１】第６の実施の形態における陽極取付板を示す平面図である。
【図１２】図１１のマスキング板を回転させた状態の陽極取付板を示す平面図である。
【図１３】図１２のＡ−Ａ線による断面図である。
【図１４】第６の実施の形態における別の陽極取付板を示す平面図である。
【図１５】図１４のスライド式遮蔽板を移動させた状態の陽極取付板を示す平面図である。
【図１６】図１５のＢ−Ｂ線による断面図である。
【図１７】第７の実施の形態を適用することができるシリンダブロックの平面図である。
【図１８】図１７のＣ−Ｃ線による断面図である。
【図１９】第７の実施の形態における陽極取付板を示す平面図である。
【図２０】第７の実施の形態に係る表面処理装置を用いて処理をしているシリンダブロックの断面図である。
【図２１】第８の実施の形態に係る表面処理装置を用いて処理をしているシリンダブロックの断面図である。
【図２２】本図のうち、（ａ）と（ｂ）は、第８の実施の形態に係る表面処理装置に用いる陽極取付板を示す平面図である。
【図２３】本図のうち、（ａ）と（ｂ）は、第８の実施の形態に係る表面処理装置を用いて処理したシリンダブロックの断面図である。
【図２４】図２３のシリンダブロックを組み合わせて作製した水平対向エンジンの断面図である。
【図２５】従来の処理方法を用いてシリンダボア面を表面処理したシリンダブロックの断面図である。
【図２６】図２５のシリンダブロックをＤ方向から見たメッキ被膜を示す概念図である。
【符号の説明】
１，７１，９１，１０１，１１１表面処理装置
３，１３７，１４１Ｖ型シリンダブロック
５床面
７支持台
９下治具
１１穴
１３メッキ液
１５流入口
１７流速調整装置
１９ロッド
２１上側治具固定装置
２３流出治具
２５陽極取付板
２７，７３，９３，１０３，１１５上治具
２９パッキン
３１整流器
３３液槽
３５配管
３７，１１３挿通穴
３９，７５流出口
４１合流点
４３，４７バルブ
４５流量計
４９ヘッド面
５１クランプ
５３シリンダ
５５陽極
５７ポンプ
５９クランクケース部
６１シリンダボア
６３シリンダボア面
７７，９７，１０７電極
７９ガス
８１ガス流れ
８３電解液
９５，１０５凹部
９９電極取付板
１１７埋め栓
１２３回転式マスキング板
１２７中央部
１２９ピン
１３１流出口
１３３スライド式遮蔽板
１３５クランク軸受けジャーナル
１４３硬質粒子[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface treatment apparatus that performs a surface treatment by circulating a treatment liquid on an inner surface of a hollow body having a cylindrical portion. More specifically, the present invention relates to a surface treatment apparatus that performs a surface treatment such as plating or electrolytic etching by flowing a treatment liquid into a cylinder block of an internal combustion engine.
[0002]
[Prior art]
Usually, a cast iron sleeve is inserted in a cylinder bore surface of an aluminum alloy cylinder block used in an automobile engine in order to improve wear resistance against sliding of a piston. However, this cast iron sleeve increases the weight of the engine, which may reduce the fuel consumption of the vehicle. Therefore, in recent years, in order to reduce the weight and improve the performance of the engine, the cast iron sleeve has been abolished by co-depositing hard ceramic particles such as SiC in the nickel plating film and applying composite plating to the cylinder bore surface. Cylinder blocks are being developed.
In the following description, the incorporation of particles (such as SiC hard ceramic particles) into a film (such as a nickel plating film) is referred to as “eutectoid”.
[0003]
In this cylinder block plating, in order to perform the plating efficiently, an electrode is disposed in the cylinder bore, and a plating process is performed while flowing a plating solution into the cylinder bore.
Here, the cylinder blocks are classified into in-line 4-cylinders, V-type 6-cylinders, and the like according to their structures. When plating the cylinder bore surface of this in-line 4-cylinder cylinder block, or when plating the cylinder bore surface of the V-type 6-cylinder cylinder block one bank at a time, the plating process is performed with the cylinder bore axis in the vertical direction. Therefore, the amount of the eutectoid of the dispersed particles co-deposited in the plating film is uniform throughout the film.
[0004]
However, when the V-type cylinder block 201 is plated on both cylinders at the same time, as shown in FIGS. 25 and 26, the plating film 205 positioned on the lower side of the cylinder bore surface 203 that is inclined in the vehicle mounted state. There is a problem that the amount of eutectoid of the dispersed particles 207 in the medium increases. That is, in the V-type cylinder block 201, as shown in FIG. 25, since the cylinder bore 209 is inclined obliquely upward and left and right, when the plating solution flows in the cylinder bore 209, the SiC in the plating solution As described in JP-A No. 11-12790, more dispersed particles (hard particles) 207, etc., are present in the plating film 205 on the lower cylinder bore surface 203 inclined by the influence of gravity (see FIG. 26). It was easy to eutect.
[0005]
In order to solve this problem, Japanese Patent Laid-Open No. 8-144082 discloses that the V-type cylinder block is divided into cylinders of one bank and subjected to pretreatment and plating treatment. However, in this method, the same cylinder block must be divided into two times to perform the pretreatment and plating treatment, and the work man-hours are doubled, which increases the cost and the plating line. was there.
[0006]
[Problems to be solved by the invention]
The present invention solves the above-mentioned problems, and changes the flow rate of the processing liquid between one side of the inner surface and the other side facing the one side when forming a film while flowing the processing liquid on the inner surface of the cylindrical workpiece. It is an object of the present invention to provide a flow rate adjusting device capable of performing the above and a surface treatment apparatus including the flow rate adjusting device.
[0007]
In order to achieve the above-mentioned object , the flow rate adjusting device for a processing solution according to the present invention is a flow rate adjusting device for a processing solution comprising a covered cylindrical main body having a discharge hole formed in a lid portion on one end side, The other end of the main body is brought into contact with the opening surface of the cylindrical workpiece, and the processing liquid that has flowed into the workpiece is discharged from the discharge hole through the main body. A difference is provided between the flow rate of the processing liquid in a part of the surface to be processed and the flow rate in the surface of the other part facing the part.
[0008]
Furthermore, in the flow rate adjusting apparatus for a processing liquid according to the present invention, a partition plate having a plurality of insertion holes is provided inside the main body, and the main body is separated in the axial direction by the partition plate, whereby the other end side is provided. And a second space located on the one end side.
[0009]
As the partition plate, for example, an electrode mounting plate to which a plating electrode is attached can be used.
[0010]
In one aspect of the processing liquid flow rate adjusting apparatus according to the present invention, a processing liquid outlet is provided on the side wall of the main body on the first space side, and the processing liquid flowing into the first space flows out from the outlet. By doing so, the flow rate of the processing liquid on the surface to be processed on the outlet side is made faster than the flow rate of the processing liquid on the surface to be processed on the side facing the outlet.
[0011]
Since the outlet serves as a so-called bypass channel, the flow rate of the processing liquid on the surface to be processed can be easily and reliably increased.
[0012]
In another aspect of the apparatus for adjusting the flow rate of the processing liquid according to the present invention, a recess formed by a notch is provided on the inner surface of the side wall of the main body on the first space side, and the processing of the surface to be processed on the recess side is provided. The flow rate of the liquid can be made faster than the flow rate of the processing liquid on the surface to be processed on the opposite side of the recess.
[0013]
The concave portion increases the flow path area on the concave side in the first space, and as a result, the flow rate of the processing liquid on the surface to be processed on the concave side can be increased.
[0014]
Furthermore, in yet another aspect of the flow rate adjusting apparatus for processing liquid according to the present invention, a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction, and the diameters of these insertion holes are set to the diameter of the partition plate. There is a difference between one side of the direction and the other side facing this one side.
[0015]
The flow rate of the processing liquid on the processing surface on the side where the diameter of the insertion hole is increased is faster than the flow rate of the processing surface on the other side.
[0016]
And in still another aspect of the flow rate adjusting apparatus for processing liquid according to the present invention, a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction, and the interval between these insertion holes is set to A difference is provided between one side and the other side in the radial direction of the partition plate.
[0017]
Further, in still another aspect of the processing liquid flow rate adjusting apparatus according to the present invention, a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction .
[0018]
In addition, in this embodiment, a masking plate provided with a flow hole having a smaller diameter than these insertion holes is rotatably attached to the partition plate.
[0019]
And in still another aspect of the flow rate adjusting device for the processing liquid according to the present invention, a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction, and these are slid in the radial direction of the partition plate. A shielding plate capable of closing the insertion hole is slidably attached to the partition plate.
[0020]
The surface treatment apparatus according to the present invention includes the above-described flow rate adjusting device.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
The surface treatment apparatus according to the embodiment of the present invention will be described below. The present invention is a surface treatment apparatus that uniformly disperses particles in a film when a surface treatment is performed while flowing a treatment liquid on the inner surface of a workpiece formed in a cylindrical shape. In the embodiment of the present invention, the description will focus on the surface treatment for plating the cylinder bore surface of the V-shaped cylinder block. In addition, this invention is not limited to the case where it processes in the state where the cylinder bore surface which is a to-be-processed surface inclined, It can apply also when processing in the state where a cylinder bore surface followed the up-down direction.
[0022]
According to the present invention, in the V-shaped cylinder, the flow rate of the plating solution in the inclined cylinder is finely adjusted for each part of the cylinder bore, that is, the plating solution flowing on the lower cylinder bore surface in the cylinder bore of the inclined cylinder. The flow rate can be made faster than the upper side. This is a surface treatment that prevents excessive eutectoid of hard particles on the lower cylinder bore surface and uniformly disperses hard particles such as SiC throughout the plating film. The following description will be divided into first to eighth embodiments with reference to the drawings. First, the first embodiment will be described in detail. However, in the second and subsequent embodiments, the description of overlapping contents will be omitted.
[0023]
[First Embodiment]
FIG. 1 is a cross-sectional view showing a state in which a V-type cylinder block 3 serving as a workpiece is plated using the surface treatment apparatus 1 according to the first embodiment.
A support base 7 is disposed on the floor surface 5, and a lower jig 9 is attached to the upper part of the support base 7. A through hole 11 is formed in the center of the support base 7 and the lower jig 9, and an inlet 15 through which the plating solution 13 flows into the lower jig 9 is attached to the hole 11. It has been. A flow rate adjusting device 17 is provided above the support base 7.
[0024]
The flow rate adjusting device 17 includes an upper jig fixing device 21 having a rod 19 that can be expanded and contracted at the tip, an outflow jig 23 attached to the end of the rod 19 and having a lid, An anode mounting plate (partition plate) 25 fixed to the lower end, an upper jig 27, and a packing 29 are provided. The positive side of the rectifier 31 is connected to the anode mounting plate 25, and the negative side is connected to the work 3. Further, the plating solution 13 discharged from the outflow jig 23 flows into the liquid tank 33 and then flows into the workpiece 3 from the liquid tank 33 through the pipe 35.
[0025]
The cylinder bore of the V-type cylinder block 3 that is a workpiece is formed to be inclined obliquely upward on the left and right sides, and the upper jig 27 is also provided to be inclined along the cylinder bore. On the upper part of the upper jig 27, an anode mounting plate 25 having an insertion hole 37 is placed, and on the outer side (inclined lower side) of the side wall of the upper jig 27, there is a flow. An outlet 39 is formed. The outlet 39 is formed in a thin cylindrical shape, and is branched from the middle of the side wall of the upper jig 27 and is connected to the liquid tank 33 through a pipe 35. The pipe 35 is provided with a valve 43 in front of the junction 41, and a pipe 45 and a valve 47 are also provided in the pipe after the junction 41.
[0026]
Since the upper jig 27, the anode mounting plate 25, and the outflow jig 23 are integrated in a liquid-tight manner and are attached to the upper jig fixing device 21 via the rod 19, they can be freely moved up and down. Can do.
[0027]
Further, the V-shaped cylinder block 3 serving as a workpiece is placed on the lower jig 9 with the head surface 49 facing upward, and is fixed by a clamp 51. The anode 55 is inserted into the cylinder 53 of each cylinder, and the upper jig 27 and the outflow jig 23 are pressed by the upper jig fixing device 21 through the insulating packing 29, so that the V-type cylinder block 3 is liquid. It is tightly sealed.
[0028]
A procedure for performing the treatment using the surface treatment apparatus 1 having the above configuration will be briefly described. The plating solution 13 containing particles such as SiC is pumped from the liquid tank 33 by the pump 57 and passes through the lower jig 9 from the inlet 15 provided on the lower side of the lower jig 9 and enters the V-shaped cylinder block 3. Inflow. In the V-shaped cylinder block 3, the lower jig 9 and the crankcase portion 59 serve as a buffer, so that the flow of the plating solution 13 flowing into the V-shaped cylinder block 3 is made uniform.
[0029]
Next, the plating solution 13 flows separately into the left and right cylinder bores 61, but since the upper jig 27 is provided with an outlet 39 on the lower side, the lower side in the cylinder bore 61 has the plating solution 13. The flow rate becomes faster. Further, the flow rate of the plating solution 13 in the cylinder 53 of each cylinder is controlled by a flow meter 45 and valves 43 and 47. A plating film can be formed on the cylinder bore surface 63 by energizing the V-shaped cylinder block 3 with minus and the anode 55 plus with flowing the plating solution 13. Here, since the flow rate of the plating solution 13 is faster in the cylinder bore 61, excessive eutectoid of particles such as SiC on the cylinder bore surface 63 on the lower side can be prevented. Furthermore, by controlling the flow rate to the outlet 39 by the valve 43, particles such as SiC can be co-deposited.
[0030]
[Second Embodiment]
In the first embodiment, the form of performing the plating process has been described. In the second embodiment, the case of performing a process such as electrolytic etching will be described.
As shown in FIG. 2, in the surface treatment apparatus 71 according to the second embodiment, an outflow port 75 is provided on the upper side of the side wall of the upper jig 73.
The electrolytic etching is a process in which the electrode is disposed in the cylinder bore 61 and the cylinder block 3 is used as an anode and the electrode 77 is used as a cathode while flowing an electrolyte 83 such as phosphoric acid or sulfuric acid, and the cylinder bore surface 63 is removed by corrosion. Yes, a large amount of gas 79 is generated during processing. In the tilted cylinder 53, the gas generated during the process flows upward as indicated by an arrow 81, so that the upper side of the cylinder bore surface 63 is difficult to be electrolytically etched.
[0031]
However, since the outlet 75 is provided on the upper side of the upper jig 73, the flow of the electrolyte solution 83 on the upper side becomes smooth, and the generated gas 79 is efficiently extracted from the outlet 75. The processing of the cylinder bore surface 63 can be performed uniformly for each part.
[0032]
[Third Embodiment]
In the surface treatment apparatus 91 according to the third embodiment, as shown in FIG. 3, the recess 95 is formed on the lower surface of the inner surface of the upper jig 93, so that the upper portion of the electrode 97 The distance from 97a to the concave portion 95 is greatly increased on the lower side. In addition, the size of the insertion hole 37 formed in the electrode mounting plate 99 is formed to be appropriately large on the lower side. Accordingly, the flow rate of the plating solution 13 below the upper jig 93 and the cylinder bore 61 is larger than the upper side, preventing excessive dispersion of particles such as SiC on the lower side of the cylinder bore surface 63 and preventing the coating on the cylinder bore surface 63. It can be uniformly dispersed throughout.
[0033]
[Fourth Embodiment]
In the surface treatment apparatus 101 according to the fourth embodiment, as shown in FIG. 4, since the concave portion 105 is formed on the upper side wall of the upper jig 103, the upper portion 107 a and the concave portion 105 of the electrode 107 are formed. This distance is wider on the upper side. Further, since the insertion hole 37 of the electrode mounting plate 109 is also formed larger on the upper side, when the electrolytic solution 83 is caused to flow into the cylinder bore 61, the flow velocity on the upper side of the upper jig 103 and the cylinder bore 61 is larger. Become.
[0034]
According to the surface treatment apparatus 101 having the above-described configuration, the electrode 107 is disposed in the cylinder bore 61, and electrolytic etching or the like is performed using the cylinder block 3 as an anode and the electrode 107 as a cathode while flowing an electrolytic solution 83 such as phosphoric acid or sulfuric acid. In this case, it is possible to improve the escape of the gas 79 generated during the process and flowing upward, so that the entire process of the cylinder bore surface 63 can be uniformly performed by the electrolytic etching process in the cylinder bore 61.
[0035]
[Fifth Embodiment]
In the surface treatment apparatus 111 according to the fifth embodiment, as shown in FIGS. 5 to 10, by changing the size, shape, and arrangement of the insertion holes provided in the anode mounting plate 25, the treatment in the cylinder bore is performed. The liquid flow rate is adjusted.
FIG. 5 is a cross-sectional view showing the entire surface treatment device 111, and an insertion hole 113 as shown in FIGS. 6 and 7 is formed in the anode mounting plate 25 to which the positive electrode of the rectifier 31 is connected. As can be seen from these drawings, since the upper outlet 113a is formed smaller than the lower outlet 113b, the flow rate of the plating solution 13 is higher on the lower side of the cylinder bore 61.
[0036]
Further, as shown in FIG. 8, the flow rate of the plating solution 13 on the lower side of the cylinder bore 61 can also be increased by providing a plug 117 in the insertion hole 113 positioned on the upper side of the anode mounting plate 25.
Furthermore, as shown in FIG. 9, if the upper insertion hole 113a is made smaller and the lower outlet 113b is communicated and enlarged to one long hole, the difference in the flow rate of the plating solution 13 is compared with the upper side. It can be made larger on the lower side.
As shown in FIG. 10, the insertion holes 113 are formed as elongated slit-shaped holes, and a plurality of the insertion holes 113 are arranged so that the intervals gradually increase from the upper side to the lower side in the cylinder bore 61. . The shape of the hole is not particularly limited, and may be an ellipse or a trapezoid.
[0037]
As described above, the anode mounting plate 25 having the insertion holes 113 as shown in FIGS. 7 to 10 can suppress the sedimentation of the particles in the plating solution 13 and obtain a plating film in which the particles are uniformly dispersed. As a result, both cylinders 53 of the V-shaped cylinder block 3 can be plated at the same time, so that the cost required for plating can be reduced by half compared to the case of plating one bank at a time, and the plating line. Can be cut in half.
[0038]
[Sixth Embodiment]
In the sixth embodiment, as shown in FIGS. 11 to 16, the cylinder bore 61 is formed by closing the insertion hole 113 previously drilled in the anode mounting plate 25 with a rotary masking plate 123 or a sliding shielding plate 133. The flow rate of the plating solution 13 is adjusted.
[0039]
First, FIGS. 11 to 13 show a fan-shaped rotary masking plate 123. As shown in FIGS. 11 and 12, the anode mounting plate 25 has circular holes 113 having the same diameter and are formed at the same interval, and three of the through holes 113 can be closed. A fan-shaped rotary masking plate 123 having a size is rotatably mounted by a pin 129 (see FIG. 13) around the central portion 127 of the anode mounting plate 25. Further, since another rotary outlet 131 having a smaller diameter than the insertion hole 113 is formed in the rotary masking 123, the flow rate of the plating solution 13 on the lower side of the cylinder bore 61 as shown in FIG. Becomes faster than the upper flow velocity. The masking plate 123 is not particularly limited and can have various shapes and sizes.
[0040]
Furthermore, as shown in FIGS. 14 to 16, slide type shielding plates 133 are individually arranged in the insertion holes 113. By inserting and removing the slide type shielding plate 133 in the radial direction of the anode mounting plate 25, each outflow port 113 can be closed to an arbitrary size. In FIG. 14, slide type shielding plates 133 are disposed at five locations of the outlet 113, but the number, size, and shape are not limited thereto.
[0041]
[Seventh Embodiment]
In the seventh embodiment, the flow rate of the plating solution 13 in the vicinity of the journal 136 can be made uniform even in the V-type cylinder block 137 from which the crank bearing journal 135 protrudes.
A crank bearing journal 135 protrudes from the V-type cylinder block 137 shown in FIGS. As shown in FIG. 20, since the lower end portion 55a of the anode 55 is positioned in the vicinity of the step portion of the crank bearing journal 135, the flow rate of the plating solution 13 in the vicinity of the journal 135 becomes slow, and the dispersed particles in the plating solution 13 May be easily segregated.
[0042]
Therefore, as shown in FIG. 19, the insertion hole 113 in the anode mounting plate 25 is formed to gradually increase as it approaches the crank bearing journal 135 side and gradually decrease as it moves away. Accordingly, the flow resistance of the plating solution 13 on the journal side is reduced and the flow resistance on the opposite side of the journal 135 is increased, so that the flow velocity in the cylinder bore 61 can be made uniform.
[0043]
[Eighth Embodiment]
In the eighth embodiment, in the horizontally opposed engine, a large amount of hard particles are intentionally dispersed on the lower cylinder bore surface when the engine is mounted.
In a horizontally opposed engine or the like, the cylinder bore surface, which is vertically lower when the engine is mounted, is particularly easily worn by piston load. Therefore, the eutectoid amount of hard particles such as SiC is increased on the vertically lower cylinder bore surface from the upper side. There is a need.
[0044]
The present invention is also applicable to such horizontally opposed engines. For example, as shown in FIGS. 21 to 24, in the case where plating is performed in a state where an in-line two-cylinder type cylinder block 141 is set up vertically, By appropriately setting the hole position and size of the insertion hole drilled in the anode mounting plate 25, the amount of eutectoid of hard particles in the circumferential direction of the cylinder bore surface 63 can be increased or decreased.
[0045]
In this way, by using the cylinder block 141 in which the eutectoid amount of the hard particles 143 on the lower cylinder bore surface 63 when the engine is mounted is used in combination, it is possible to prevent uneven wear on the lower side due to the piston load. it can.
[0046]
【The invention's effect】
According to the present invention, it is possible to form a film in which particles in the processing liquid are uniformly eutectoid on the inclined surface to be processed, and in the surface to be processed extending vertically, particles on one side and the other side are formed. Films with different degrees of dispersion can be formed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a surface treatment apparatus according to a first embodiment.
FIG. 2 is a cross-sectional view showing a main part of a surface treatment apparatus according to a second embodiment.
FIG. 3 is a sectional view showing a surface treatment apparatus according to a third embodiment.
FIG. 4 is a cross-sectional view showing a main part of a surface treatment apparatus according to a fourth embodiment.
FIG. 5 is a cross-sectional view showing a surface treatment apparatus in a fifth embodiment.
6A is a perspective view showing the anode and the anode mounting plate of FIG. 5, and FIG. 6B is a side view of FIG. 6A.
FIG. 7 is a plan view showing an anode mounting plate in a fifth embodiment.
FIG. 8 is a plan view showing another anode mounting plate in the fifth embodiment.
FIG. 9 is a plan view showing still another anode mounting plate according to the fifth embodiment.
FIG. 10 is a plan view showing still another anode mounting plate according to the fifth embodiment.
FIG. 11 is a plan view showing an anode mounting plate in a sixth embodiment.
12 is a plan view showing an anode mounting plate in a state where the masking plate of FIG. 11 is rotated. FIG.
13 is a cross-sectional view taken along line AA in FIG.
FIG. 14 is a plan view showing another anode mounting plate in the sixth embodiment.
15 is a plan view showing the anode mounting plate in a state where the sliding type shielding plate of FIG. 14 is moved.
16 is a cross-sectional view taken along line BB in FIG.
FIG. 17 is a plan view of a cylinder block to which the seventh embodiment can be applied.
18 is a cross-sectional view taken along the line CC in FIG.
FIG. 19 is a plan view showing an anode mounting plate in a seventh embodiment.
FIG. 20 is a cross-sectional view of a cylinder block that is processed using a surface treatment apparatus according to a seventh embodiment.
FIG. 21 is a cross-sectional view of a cylinder block that is processed using a surface treatment apparatus according to an eighth embodiment.
22A and 22B are plan views showing an anode mounting plate used in the surface treatment apparatus according to the eighth embodiment. FIG.
23A and 23B are cross-sectional views of a cylinder block processed by using the surface treatment apparatus according to the eighth embodiment. FIG.
24 is a cross-sectional view of a horizontally opposed engine manufactured by combining the cylinder blocks of FIG.
FIG. 25 is a cross-sectional view of a cylinder block having a cylinder bore surface surface-treated using a conventional processing method.
26 is a conceptual diagram showing a plating film when the cylinder block of FIG. 25 is viewed from the D direction.
[Explanation of symbols]
1, 71, 91, 101, 111 Surface treatment device 3, 137, 141 V-type cylinder block 5 Floor surface 7 Support base 9 Lower jig 11 Hole 13 Plating solution 15 Inlet 17 Flow rate adjusting device 19 Rod 21 Upper jig fixing Device 23 Outflow jig 25 Anode mounting plate 27, 73, 93, 103, 115 Upper jig 29 Packing 31 Rectifier 33 Liquid tank 35 Pipe 37, 113 Insertion hole 39, 75 Outlet 41 Junction point 43, 47 Valve 45 Flow meter 49 Head surface 51 Clamp 53 Cylinder 55 Anode 57 Pump 59 Crankcase 61 Cylinder bore 63 Cylinder bore surface 77, 97, 107 Electrode 79 Gas 81 Gas flow 83 Electrolytic solution 95, 105 Recess 99 Electrode mounting plate 117 Filling plug 123 Rotary masking plate 127 Center part 129 Pin 131 Outlet 133 Sliding shield 135 Rank bearing journal 143 hard particles

Claims

A flow rate adjusting device for a processing liquid comprising a covered cylindrical main body with a discharge hole drilled in a lid portion on one end side, and the other end side of the main body is brought into contact with the opening surface of the cylindrical workpiece, When the processing liquid that has flowed into the work is discharged from the discharge hole through the inside of the main body, the flow rate of the processing liquid in a part of the surface to be processed in the work and other parts facing this part An apparatus for adjusting a flow rate of a processing liquid in which a difference in flow rate on a surface to be processed is provided, wherein a partition plate having a plurality of insertion holes is provided inside the main body, and the inner portion of the main body is pivoted by the partition plate. By separating in the direction, a first space located on the other end side and a second space located on the one end side are formed, and a processing liquid outlet is provided on the side wall of the main body on the first space side. Provided, and the processing liquid flowing into the first space flows out from the outlet. By the flow rate of the treatment liquid to be processed surface on the side of the outlet, characterized by being faster than the flow rate of the processing solution in the processing surface on the side facing the outlet treatment liquid flow rate adjustment device .

A flow rate adjusting device for a processing liquid comprising a covered cylindrical main body with a discharge hole drilled in a lid portion on one end side, and the other end side of the main body is brought into contact with the opening surface of the cylindrical workpiece, When the processing liquid that has flowed into the work is discharged from the discharge hole through the inside of the main body, the flow rate of the processing liquid in a part of the surface to be processed in the work and other parts facing this part An apparatus for adjusting a flow rate of a processing liquid in which a difference in flow rate on a surface to be processed is provided, wherein a partition plate having a plurality of insertion holes is provided inside the main body, and the inner portion of the main body is pivoted by the partition plate. By separating in a direction, a first space located on the other end side and a second space located on the one end side are formed, and the inner surface of the side wall of the main body on the first space side is formed by a notch. The formed recess is provided and the surface to be processed on the recess side The flow rate of the physical mixture, the recess flow rate adjusting device of the treatment liquid, characterized in that it has faster than the flow rate of the treatment liquid to be processed surface in opposite sides of the.

A flow rate adjusting device for a processing liquid comprising a covered cylindrical main body with a discharge hole drilled in a lid portion on one end side, and the other end side of the main body is brought into contact with the opening surface of the cylindrical workpiece, When the processing liquid that has flowed into the work is discharged from the discharge hole through the inside of the main body, the flow rate of the processing liquid in a part of the surface to be processed in the work and other parts facing this part An apparatus for adjusting a flow rate of a processing liquid in which a difference in flow rate on a surface to be processed is provided, wherein a partition plate having a plurality of insertion holes is provided inside the main body, and the inner portion of the main body is pivoted by the partition plate. A first space located on the other end side and a second space located on the one end side are formed by dividing the direction into the direction, and a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction. The diameter of these insertion holes is set to one side in the radial direction of the partition plate. Treatment liquid flow rate adjusting device, characterized in that a difference in the other side opposed to the one side.

A flow rate adjusting device for a processing liquid comprising a covered cylindrical main body with a discharge hole drilled in a lid portion on one end side, and the other end side of the main body is brought into contact with the opening surface of the cylindrical workpiece, When the processing liquid that has flowed into the work is discharged from the discharge hole through the inside of the main body, the flow rate of the processing liquid in a part of the surface to be processed in the work and other parts facing this part An apparatus for adjusting a flow rate of a processing liquid in which a difference in flow rate on a surface to be processed is provided, wherein a partition plate having a plurality of insertion holes is provided inside the main body, and the inner portion of the main body is pivoted by the partition plate. A first space located on the other end side and a second space located on the one end side are formed by dividing in the direction, and a plurality of insertion holes for the partition plate are provided at intervals in the circumferential direction. In addition, the distance between the adjacent insertion holes is the diameter of the partition plate. Flow rate adjusting device of the treatment liquid, characterized in that a difference between one side and the other side of the direction.

A flow rate adjusting device for a processing liquid comprising a covered cylindrical main body with a discharge hole drilled in a lid portion on one end side, and the other end side of the main body is brought into contact with the opening surface of the cylindrical workpiece, When the processing liquid that has flowed into the work is discharged from the discharge hole through the inside of the main body, the flow rate of the processing liquid in a part of the surface to be processed in the work and other parts facing this part An apparatus for adjusting a flow rate of a processing liquid in which a difference in flow rate on a surface to be processed is provided, wherein a partition plate having a plurality of insertion holes is provided inside the main body, and the inner portion of the main body is pivoted by the partition plate. A first space located on the other end side and a second space located on the one end side are formed by dividing the direction into the direction, and a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction. Provide a flow hole with a smaller diameter than these insertion holes The masking plate, a flow rate adjusting device of the treatment liquid, characterized in that rotatably mounted on the partition plate.

A flow rate adjusting device for a processing liquid comprising a covered cylindrical main body with a discharge hole drilled in a lid portion on one end side, and the other end side of the main body is brought into contact with the opening surface of the cylindrical workpiece, When the processing liquid that has flowed into the work is discharged from the discharge hole through the inside of the main body, the flow rate of the processing liquid in a part of the surface to be processed in the work and other parts facing this part An apparatus for adjusting a flow rate of a processing liquid in which a difference in flow rate on a surface to be processed is provided, wherein a partition plate having a plurality of insertion holes is provided inside the main body, and the inner portion of the main body is pivoted by the partition plate. A first space located on the other end side and a second space located on the one end side are formed by dividing the direction into the direction, and a plurality of insertion holes of the partition plate are provided at intervals in the circumferential direction. Insert these by sliding in the radial direction of the partition plate A shielding plate which can be closed, and the flow rate adjustment device of the treatment liquid, characterized in that mounted slidably in said partition plate.

A surface treatment apparatus comprising the flow rate adjusting device according to any one of claims 1 to 6 .