JP3528366B2 - Integrated circuit device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device having a position detection pattern which is image-recognized when positioning or positioning an integrated circuit chip in a semiconductor manufacturing process.

[0002]

2. Description of the Related Art In a series of semiconductor manufacturing processes, for example, in a wire bonding process, a position detecting pattern provided on a chip is recognized by a pattern recognizing optical system of a wire bonder and based on the recognition result. Continuous wire bonding is performed while correcting a minute deviation of the bonding position. In the pattern recognition, the position detection pattern on the chip is image-recognized by using the recognition area of the pattern recognition optical system, the image is binarized by image processing, and the binarized image data is stored together with the position coordinate data. ing. When actually performing wire bonding, the position detection pattern on the chip to be bonded is image-recognized, and the binarized data is compared with the prestored binarized data to serve as a reference. Automatically recognize the deviation from the coordinate position,
I am trying to correct it.

By the way, in this type of pattern recognition, in order to improve the recognition accuracy and recognition speed, the black-and-white ratio of the binarized image at the time of image recognition is substantially the same (ideally, white is 50%, Black is preferably 50%). The reason is that if the black-and-white ratio is substantially the same, if the position-detection pattern actually recognized by the image is deviated from the reference position-detection pattern, the change amount of the white-and-white ratio due to the pattern deviation is remarkable. To appear in.

[0004]

However, depending on the specifications of the semiconductor manufacturing equipment manufacturer, if the recognition area of the pattern recognition optical system is a square (this is the specification for company A) and if it is rectangular (this is for company B). There are specifications).
Therefore, even if the same integrated circuit device is used,
When image recognition is performed using each pattern recognition optical system of the B company specification, even if the B / B ratio of the binarized image is almost the same in the A company specification, the B / B ratio of the binarized image is in the B company specification. There is a large disparity, and on the contrary, the black and white ratio of the binarized image is almost the same in the specification of company B, but it is 2 in the specification of company A.
There is a problem in that the recognition accuracy and the recognition speed are deteriorated in either one of the manufacturer specifications, such as a large disparity in the black-and-white ratio of the binarized image.

The present invention has been made to solve the above problems, and its purpose is to improve the pattern recognition accuracy and the recognition speed without depending on the specifications of the semiconductor manufacturing apparatus manufacturer. To provide a device.

[0006]

The present invention has been made to achieve the above object, and an image is recognized by a recognition area of a pattern recognition optical system at a corner portion on the main surface side of an integrated circuit chip. An integrated circuit device having a position detection pattern, wherein a first pattern in which the black and white ratios of binary images at the time of image recognition are substantially the same when the recognition area is a square, and a first pattern when the recognition area is a rectangle The position detection pattern is configured by the second pattern in which the black-and-white ratio of the binarized image at the time of image recognition including the pattern is substantially the same.

In the integrated circuit device of the present invention, only the first pattern is image-recognized when the recognition area of the pattern recognition optical system is a square, and the first pattern and the second pattern are recognized when the recognition area is a rectangle. By recognizing the image and the pattern, the black-and-white ratio of the binary image at the time of image recognition becomes substantially the same regardless of whether the recognition area is a square or a rectangle.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view of an essential part showing a first embodiment of an integrated circuit device according to the present invention. In the configuration of the integrated circuit device shown in FIG. 1, the position detection pattern 2 is formed at the corner portion on the main surface side of the integrated circuit chip 1. The position detection pattern 2 is used for highly accurate positioning and positioning of the integrated circuit chip 1, and as described in the prior art example, the pattern recognition optical system equipped in the wire bonder or the like. The image is recognized by. The pattern itself is, for example, aluminum vapor deposition, along with the electrode pad and the wiring pattern connected to it.
It can be formed into an arbitrary shape and size by using coating, metallizing, etching, marking technology, or the like.

Therefore, in the first embodiment, the position detecting pattern 2 for image recognition includes the first pattern 2a having a cross shape and the second pattern having an I shape as shown in the figure.
And the pattern 2b.

Of these, for the first pattern 2a, when the recognition area of the pattern recognition optical system is a square, the black-and-white ratio of the binarized image at the time of image recognition is substantially the same, that is, the one-dot chain line in the figure. The dimensions L ₁ and L ₂ of the respective pattern portions are set so that the area ratio of the pattern area that is hatched to the right in the figure is about 50% in the square recognition area E ₁ shown by.

On the other hand, for the second pattern 2b, when the recognition area of the pattern recognition optical system is rectangular, the black-and-white ratio of the binarized image at the time of image recognition including the first pattern 2a is substantially the same. That is, that is, in the recognition area E ₂ shown by the chain double-dashed line in the figure, the pattern pattern parts are arranged such that the area ratio occupied by the total pattern area that is hatched to the upper right and the lower right in the figure is about 50%. The dimensions L ₃ and L ₄ are set.

Therefore, in the integrated circuit device according to the first embodiment, when the recognition area of the pattern recognition optical system is a square, only the first pattern 2a is arranged in the recognition area E _{1 of a} square for pattern recognition. By performing image recognition of the position detection pattern in this state, the black-and-white ratio of the binarized image becomes substantially the same. On the other hand, when the recognition area is rectangular, the first pattern 2a and the second pattern 2b are arranged in the rectangular recognition area E ₂ for pattern recognition, and in this state, the image recognition of the position detection pattern is performed. By performing the above, the black-and-white ratio of the binarized image becomes substantially the same. Thereby, whether the recognition area of the pattern recognition optical system is square or rectangular, the black-and-white ratio of the binary image at the time of image recognition can be made substantially the same.

FIG. 2 is a diagram showing another pattern form in the first embodiment. First, FIG. 2A shows an example in which a cross-shaped first pattern 2a and an I-shaped second pattern 2b are integrally combined. Further, FIG. 2B is an example in which the second pattern 2b divided into two pieces is closely arranged and combined with the first pattern 2a having a cross shape. Further, FIG. 2C is an example in which a first pattern 2a having a circular shape and a second pattern 2b having an I-shape are closely arranged and combined.

With respect to the first and second patterns 2a and 2b constituting the position detecting pattern 2 as described above, the pattern shape and arrangement form can be freely selected.
However, the recognition error can be suppressed by adopting a pattern form (for example, a combination of a cross shape and an I shape) in which the contour line of the pattern is always parallel or perpendicular to the scanning direction when performing image processing. It is more suitable.

FIG. 3 shows a second integrated circuit device according to the present invention.
It is a principal part top view which shows embodiment. In the structure of the integrated circuit device shown in FIG. 3, the position detecting pattern 2 is formed in the corner portion on the main surface side of the integrated circuit chip 1 by the following structure.
Are formed. That is, the first pattern 2 in which the black-and-white ratio of the binarized image becomes substantially the same when the image is recognized in the square recognition area E ₁ shown by the chain line in the figure.
When a is formed and the image is recognized by the rectangular recognition areas E ₂ and E ₃ indicated by the two-dot chain line in the figure,
The second pattern 2b in which the black-and-white ratio of the binarized image including the pattern 2a is substantially the same as that of the first pattern 2a is formed.

In the second embodiment, as in the first embodiment, whether the recognition area of the pattern recognition optical system is a square or a rectangle, the black-and-white ratio of the binary image at the time of image recognition is substantially the same. Of course, they can be the same,
Even if the set direction of the integrated circuit chip 1 with respect to the wire bonder or the like is reversed by 90 ° or the recognition area of the pattern recognition optical system is a vertically long rectangle, the black-and-white ratio of the binary image at the time of image recognition Can be substantially the same.

The position detecting pattern 2 is not only used for positioning and positioning the chip by image recognition,
An electrode pad formed on the chip or a part of the wiring pattern may also be used. Also, the step of applying the position detection pattern 2 is not limited to the wire bonding step described above, and other packages that require chip positioning, such as a dicing step, a die bonding step, an inner lead bonding step, etc. It can also be widely applied to the casting process.

Further, in the application to the dicing process, by providing the position detecting pattern consisting of the first and second patterns as described above at the corners of the main surface of each integrated circuit chip built on the wafer, When setting the dicing line from the pattern position of both ends, even if the position detection patterns of adjacent integrated circuit chips are close,
There is also an advantage that the position detecting pattern to be image-recognized can be accurately extracted from the directionality of the second pattern with respect to the first pattern.

[0019]

As described above, according to the integrated circuit device of the present invention, whether the recognition area of the pattern recognition optical system is square or rectangular, the black-and-white ratio of the binarized image at the time of pattern recognition. Therefore, it is possible to improve the pattern recognition accuracy and the recognition speed without depending on the specifications of the semiconductor manufacturing apparatus manufacturer.

[Brief description of drawings]

FIG. 1 is a plan view of essential parts showing a first embodiment of an integrated circuit device according to the present invention.

FIG. 2 is a diagram showing another pattern form.

FIG. 3 is a main part plan view showing a second embodiment of the integrated circuit device according to the present invention.

[Explanation of symbols]

1 integrated circuit chip 2 position detection patterns 2a first pattern 2b second pattern E ₁ to E ₃ recognition area

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 H01L 21/60 H01L 21/66 H01L 21/82 H01L 21/027 H05K 13/00-13 / 08 G06T 1/00 G06T 7/00

Claims (2)

(57) [Claims] 1. An integrated circuit device having a position detection pattern for image recognition with a recognition area of a pattern recognition optical system in a corner portion on the main surface side of an integrated circuit chip, wherein the position detection pattern is the recognition pattern. When the area is a square, the first pattern in which the black-and-white ratio of the binary image at the time of image recognition is substantially the same, and when the recognition area is a rectangle, the binarization at the time of image recognition including the first pattern An integrated circuit device comprising: a second pattern having substantially the same black and white ratio of images. 2. The integrated circuit device according to claim 1, wherein the pattern for position detection is formed by arranging the second pattern in a direction perpendicular to the first pattern.