JP3425267B2 - Adhesive tape for removing foreign matter from precision electronic components - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape for removing foreign matter, which is applied to a cleaning step in the manufacturing process of precision electronic parts such as semiconductors and liquid crystal display panels.

[0002]

2. Description of the Related Art As the density and integration of LSIs increase, and the density and size of liquid crystal display panels increase, the presence of foreign substances such as dust and metal impurities on semiconductor wafers and glass substrates. ) Has come to have a great influence on product yield and product reliability. For example, a foreign substance existing on the surface of a semiconductor wafer (circuit pattern forming surface) causes a disconnection or a short circuit of a circuit when the circuit is formed.
Also, the back surface of the semiconductor wafer (the surface opposite to the circuit pattern surface)
The foreign matter existing in the surface causes the focus to be deviated in the exposure process at the time of forming the circuit, and when transferred to the surface of the adjacent wafer, it causes the disconnection of the circuit and the short.

Therefore, in the LSI manufacturing process, efforts are being made to improve the level of cleanliness in the manufacturing process and the level of wafer cleaning technology, and various cleaning technologies have been proposed and implemented. Especially, the cleaning process is about 2
It accounts for 0 to 30%, and is the key to yield and reliability improvement.
It is a point. The same applies to the manufacturing process of liquid crystal display panels and the manufacturing process of other precision electronic components. However, with the recent technological development, the problem of the conventional cleaning method has become apparent.

For example, the wafer cleaning method includes wet cleaning (using ultrapure water, chemical solution, etc.) and dry cleaning (U
V ozone, O ₂ plasma, etc.), and in general, wet cleaning is frequently applied because of its good balance of versatility and economy. However, a problem in wet cleaning is re-adhesion of foreign matter removed from the wafer by cleaning to the wafer, and especially foreign matter adhering to the back surface of the wafer becomes a significant pollution source. Also, since wet cleaning requires a drying process, there is a problem of wafer contamination in the drying process as well.

As a cleaning method for compensating the disadvantages of wet cleaning, dry cleaning methods (UV ozone, O ₂ plasma, etc.) are being advanced, and advantages such as reduction of redeposition of foreign matters and omission of a drying step are utilized. However, it has been found that dry cleaning does not show a sufficient ability to remove foreign substances and is not suitable for removing a large amount of contaminants.

As another attempt, JP-A-48-35771
Japanese Patent Application Laid-Open No. Hei 1-135574, etc., a method of using an adhesive tape to remove foreign matter adhering to the surface of a semiconductor wafer, a glass substrate, etc. by adsorbing it to the adhesive layer surface of the tape. Is proposed. Since this tape method can be said to be a kind of dry cleaning, it is possible to avoid the problem of reattachment of foreign matter in wet cleaning and the problem of contamination in the drying process, and further, it is possible to avoid other problems such as UV ozone and O ₂ plasma. It is expected that the ability to remove foreign matter will be further improved compared to dry cleaning.

[0007]

However, in order to protect the pressure-sensitive adhesive layer and to improve the handleability, the pressure-sensitive adhesive tape is usually formed by attaching a separator to the surface of the pressure-sensitive adhesive layer. This separator is often made of polyester film or the like that has been subjected to a mold release treatment with silicone, wax, etc. from the standpoint of peelability.

However, when the above-mentioned separator is peeled off at the time of using the adhesive tape, the release treating agent such as silicone or wax is transferred to the adhesive layer and transferred to the semiconductor tape. When adhering and removing foreign matter on the adherend by peeling after adhering to the adherend such as a glass substrate or the like, the release treatment agent adheres to the adherend and contaminates the adherend, This causes a problem that the foreign matter removal rate is reduced.

In view of the above-mentioned circumstances, the present invention provides a method for manufacturing a precision electronic component such as a semiconductor or a liquid crystal display panel in a cleaning process in which a pressure sensitive adhesive tape is attached or peeled off, such as a semiconductor wafer or a glass substrate. The purpose is to remove foreign matter adhering to the adherend with a high removal rate without contaminating the adherend.

[0010]

Means for Solving the Problems The inventors of the present invention have made extensive studies as to the above object, and as a result, as a separator to be attached to the adhesive layer surface of an adhesive tape, the adhesive surface protection of a specific structure By using a film, it was found that the foreign matter adhering to the adherend can be adsorbed and removed at a high removal rate without the problem of contamination of the adherend such as a semiconductor wafer or a glass substrate caused by the film, and the present invention It was completed.

That is, the present invention has a pressure-sensitive adhesive layer on a support film, and a pressure-sensitive adhesive surface protection film made of a polyolefin resin is laminated on the support film as a separator to remove foreign matter from a precision electronic component. Tape smell
The adhesive surface protection film described above has an antistatic function.
And its surface resistivity (according to ASTM D257)
Precision electron characterized by less than 1 × 10 ¹² Ω / □
The present invention relates to a foreign matter removing adhesive tape for a part (Claim 1). In this foreign matter removing adhesive tape, the critical surface tension of the adhesive surface protective film is 32 dyne /
The composition is not more than cm (Claim 2), and the peeling force with respect to the pressure-sensitive adhesive surface (according to JIS Z0237, Z1529) is 5
˜150 g / 50 mm width (Claim 3), and the total amount of the thermal deterioration inhibitor and the lubricant contained in the film is 0.01 to 0.5 parts by weight per 100 parts by weight of the polyolefin resin. Claim 4), heat distortion temperature of polyolefin resin (according to JIS K7207, load 4.6).
kgf / cm ² ) is 80 ° C. or higher (Claim 5) ,
This is a particularly preferable mode.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a foreign matter removing adhesive tape of the present invention. 1 is adhesive tape,
An adhesive layer 12 is provided on a support film 11, and a separator 13 is superposed on the adhesive layer 12.

The support film 11 is made of plastic such as polyester, polycarbonate, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer. However, a film having a thickness of 10 to 1,000 μm is usually used.

The pressure-sensitive adhesive layer 12 is made of acrylic resin or silicone.
Any polymer having various polymers such as silicone resin, fluorine resin, rubber (natural rubber, synthetic rubber) as a main component and having an adhesive force under normal conditions, that is, a pressure sensitive adhesive property may be used. Among these, acrylic resin-based ones having stable adhesive properties are particularly preferable. The pressure-sensitive adhesive layer 12 may be of a type that is cured by heating or light irradiation.

The thickness of the pressure-sensitive adhesive layer 12 may be appropriately determined, but is generally 5 to 100 μm. Adhesive strength is usually 50 to 500 g / 20 mm width in 180 ° peeling adhesive strength (normal temperature, peeling speed 300 mm / min) for a silicon wafer measured according to JIS Z-0237, and can be peeled after pasting It is necessary to have adhesive strength. In the case of the curing type, before the curing, the adhesive strength is equal to or greater than the above, and usually 1 to 10 after the curing.
A width of 0 g / 20 mm is desirable.

As the separator 13, a pressure-sensitive adhesive surface protective film made of a polyolefin resin is used, which is made of silicone or wax like the conventional polyester film by selecting the material composition. Even if the release treatment is not performed, a material having a low critical surface tension can be easily obtained, and the peeling force with respect to the pressure-sensitive adhesive surface can be set to a desired degree. Therefore, this type of film is essentially free from the problem of contamination of the adherend due to the release agent. In the case of a film made of soft polyvinyl chloride, a large amount of plasticizer contained in the film migrates to the surface of the adhesive to contaminate the adherend, or hydrogen chloride released from polyvinyl chloride causes contamination of the adherend. However, there is no such problem with the polyolefin resin.

Examples of the polyolefin resin used for the pressure-sensitive adhesive surface protection film include polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate.
A copolymer or the like can also be used. The thickness of the pressure-sensitive adhesive surface protective film made of such a polyolefin resin may be arbitrarily determined, but is usually 25 to 100 μm.

The critical surface tension of this pressure-sensitive adhesive surface protection film is preferably 32 dyne / cm or less, and more preferably 30 dyne / cm or less, as a value derived by contact angle measurement (water droplet). In addition, JIS K6768
Wet index standard solution of
In the present invention, the above-mentioned method of measuring the contact angle (water droplet) is adopted because it cannot be measured at less than / cm. Further, the above-mentioned critical surface tension is intended for at least the contact surface side of the pressure-sensitive adhesive layer 12, and in some cases, the opposite surface side may have a different critical surface tension.

By virtue of having such a critical surface tension, the peeling force (according to JIS Z0237, Z1529) from the pressure sensitive adhesive surface to an acrylic resin type pressure sensitive adhesive or the like is 5 to 150 g / 50 mm width, particularly preferably 10
It has a moderate width of up to 100 g / 50 mm, and the peeling force necessary for surface protection can be secured, and at the same time, the peelability that can be easily peeled off when the adhesive tape is used is secured. On the other hand, if the above-mentioned peeling force is too small, the adhesive surface protection function cannot be sufficiently fulfilled, and conversely, if it is too large, the peeling property is poor when the adhesive tape is used, and it is automatically attached by the machine. It is easy to cause inconvenience such as difficult to attach.

This pressure-sensitive adhesive surface protective film is produced by processing a polyolefin resin into a film by using a film forming apparatus such as an extruder or a calender, and the appearance and dimensions of the film and the mechanical properties are stable. Various additives are added to the polyolefin resin in order to improve the productivity or productivity. Typical additives include a heat deterioration preventing agent, a lubricant, an anti-blocking agent, and the like. Among them, the heat deterioration preventing agent and the lubricant are always added during the film-like processing.

Examples of the heat deterioration inhibitor include phenol type, aromatic amine type, organic sulfur type, organic phosphorus type, organic compound type and the like. Further, examples of the lubricant include higher aliphatic alcohol type, fatty acid ester type, fatty acid amide type and the like. The total amount of these thermal deterioration inhibitor and lubricant is
0.01 to 100 parts by weight of polyolefin resin
˜0.5 parts by weight, preferably 0.02 to 0.3 parts by weight. If too much is used, it causes contamination of the adherend and is not preferable.

The adhesive tape 1 for removing foreign matter is coated with an adhesive solution on the corona-treated surface of the support film 11 and is applied to
The adhesive layer 12 is formed by drying and cross-linking by heating at about 90 ° C., and then the separator 13 having the above-mentioned structure is laminated on the adhesive layer 12, which is a conventional method for producing an adhesive tape. Can be made. However, in this method, foreign matter adheres to the surface of the adhesive during the heating process, which causes the adhesive tape to
There is a risk that it will transfer to the adherend during use of the tape and prevent effective removal of foreign matter.

Therefore, instead of the above-mentioned method, an adhesive solution is coated on an adhesive surface protection film made of a polyolefin resin which constitutes the separator 13, and this is dried in the same manner as above. It is desirable to employ a method in which the adhesive layer 12 is formed by crosslinking treatment and then the corona-treated surface side of the support film 11 is attached thereon. According to this, since the surface of the pressure-sensitive adhesive is completely sealed at the same time as the application of the pressure-sensitive adhesive, there is no possibility that foreign matter will adhere to the surface of the pressure-sensitive adhesive thereafter. However, in this method, the separator 13
Must be able to withstand the heating process,
Polyolefin resin, which is a film forming material, has a heat distortion temperature (according to JIS K7207, load of 4.6 kgf).
/ Cm ² ) is desired to be 80 ° C. or higher.

Even when the above-mentioned method is adopted, foreign matter may have already adhered to the coated surface side of the film just before the adhesive solution is applied onto the adhesive surface protection film. . In order to prevent this, it is desirable that the film be subjected to an antistatic treatment in advance to prevent airborne particles from adhering to the surface of the film as much as possible. The film subjected to the antistatic treatment has a surface specific resistance (ASTM D2
57) is 1 × 10 ¹² Ω / □ or less, particularly preferably 1 × 10 ¹⁰ Ω / □ or less. Examples of the antistatic treatment agent used here include a surfactant type, a conductive organic substance type (carbon black, organic semiconductor, etc.), a metal type, a metal oxide type and the like. The surface to be subjected to antistatic treatment is
In consideration of contamination, it is desirable that the surface of the pressure-sensitive adhesive surface protection film is the surface opposite to the contact surface of the pressure-sensitive adhesive layer 12.

In the present invention, the pressure-sensitive adhesive tape 1 having the above structure
As an example of applying the above to the cleaning step in the manufacturing process of the precision electronic component, for example, a method of peeling and removing foreign matter adhering to the semiconductor wafer will be described. First, after peeling off the separator 13 from the adhesive tape 1, as shown in FIG. 2, the adhesive tape 1 is attached to the entire front surface 2a and / or back surface 2b of the semiconductor wafer 2, The surface of the pressure-sensitive adhesive layer 12 is sufficiently adapted to the foreign matter 3 on the wafer 2. This may be done by any method such as pressing with a hand roller and then leaving it for several minutes.

After sticking in this way, the adhesive tape 1
If it is a curing type, it is cured by heating or irradiation with light, and then peeled from the end of the adhesive tape 1. When a peeling operation is performed, the foreign matter 3 on the semiconductor wafer 2 is removed.
Is easily peeled off while being adsorbed and held on the surface of the adhesive layer 12. At that time, the adhesive residue of the pressure-sensitive adhesive and the contamination due to the conventional separator 13 (the release treating agent thereof) are hardly observed. Therefore, the foreign matter on the semiconductor wafer is cleaned and removed at a substantially higher removal rate as compared with the conventional dry cleaning as well as the wet cleaning.

By cleaning and removing the foreign matter on the semiconductor wafer at a high removal rate in this manner, the occurrence of circuit disconnection, shots, and exposure defects at the time of circuit formation is reduced, and the yield of semiconductor devices finally manufactured is reduced. And reliability is greatly improved. This is the same even when applied to the cleaning step in the manufacturing process of other precision electronic components such as a liquid crystal display panel, and the same effect as in the case of the above semiconductor is obtained. Also,
From the standpoint of global environmental protection, by replacing the conventional wet cleaning and dry cleaning methods that consume large amounts of pure water, chemicals, air, electric power, etc., with the method of the present invention, Can also make a significant contribution to

[0028]

As described above, according to the present invention, by using the adhesive surface protective film having a specific constitution as the separator of the adhesive tape for removing foreign matter, particularly, the critical surface tension and peeling of this film are obtained. Force, amount of heat deterioration inhibitor and lubricant,
By optimizing the heat distortion temperature and surface resistivity, it is possible to prevent the contamination of semiconductor wafers, glass substrates, etc. due to this separator while maintaining the adhesive surface protection function and peelability as a separator. Since the foreign substances can be effectively removed from these members by the tape method, it can greatly contribute to the improvement of the yield and reliability of precision electronic parts.

[0029]

EXAMPLES Next, examples of the present invention will be described to more specifically describe. In the following, "parts" means "parts by weight". In addition, "Examples 1 to 6" described below
Of these, only "Example 6" is included in the claims of the present invention.
It corresponds to the included examples, and other "Examples 1 to 5" are for reference.
It is shown as an example.

Example 1 100 parts of low-density polyethylene resin [Sumikasen F208-1 manufactured by Sumitomo Chemical Co., Ltd.], 0.01 part of a phenol-based heat deterioration inhibitor and 0.01 part of a fatty acid ester-based lubricant
Parts are added and a flat film manufacturing apparatus [made by Modern Machinery Co., Ltd.] is used to form a film at an extrusion temperature of 200 ° C. and a take-up speed of 4 m / min to prepare a 100 μm-thick adhesive surface protective film. did.

Regarding this pressure-sensitive adhesive surface protection film, the critical surface tension of the film, the acrylic resin, the type of resin used, the heat distortion temperature, the amount of additive (the total number of parts used of the heat deterioration inhibitor and the lubricant per 100 parts of the resin), the acrylic The results of examining the peeling force and the surface resistivity with respect to the pressure-sensitive adhesive are shown in Table 1 below.
It was shown to.

Next, the pressure-sensitive adhesive surface-protecting film was used as a separator, and an acrylic pressure-sensitive adhesive solution was applied onto the separator, dried by heating at 80 ° C. for 5 minutes, and then crosslinked.
A pressure-sensitive adhesive layer having a thickness of 20 μm was formed, and a corona-treated surface of a support film made of a polyethylene terephthalate film having a thickness of 50 μm was laminated on the pressure-sensitive adhesive layer to prepare a pressure-sensitive adhesive tape for removing foreign matter.

This adhesive tape silicon wafer (mirror)
The adhesive strength to the surface was 180 ° peeling adhesive strength (normal temperature, peeling speed 300 mm / min) measured according to JIS Z-0237, and was 165 g / 20 mm width. In addition,
The peeling force with respect to the acrylic adhesive shown in Table 1 was obtained by fixing the support film side of the above-mentioned adhesive tape to a flat stainless steel plate with a double-sided adhesive tape and separating it in the 180 ° direction.
The stress (peeling speed 300 mm / min, sample width 50 mm) at the time of peeling the tape was examined.

A 5-inch silicon wafer with no foreign matter having a size of 0.2 μm or more (a mirror without a circuit pattern)
A wafer is passed through a predetermined process (ion implantation process) to adhere foreign matter, and adhered to the mirror surface using a laser surface inspection device [LS-5000 manufactured by Hitachi Electronics Engineering Co., Ltd.]. The number of foreign matters having a size of 0.2 μm or more was counted. In addition, in order to count the foreign matters adhering to the front and back of the wafer, the same inspection was performed in two cases in which the mirror surfaces were reversed.

As a foreign matter cleaning test, the adhesive tape prepared by the above method was applied to the mirror surface of the silicon wafer on which the foreign matter was adhered as described above, and the adhesive surface protective film as a separator was pulled. After peeling it off, attach it using a hand roller and leave it for 3 minutes, then use this adhesive tape.
The mirror surface was washed by peeling the mold. After this cleaning, the number of foreign matters having a size of 0.2 μm or more attached to the mirror surface was counted again using the laser surface inspection device.

The foreign matter removal rates on both front and back surfaces of the silicon wafer were calculated from the number of foreign matter after cleaning by such a sticking and peeling operation and the number of foreign matter before cleaning. In the above-mentioned foreign matter cleaning test (measurement of foreign matter removal rate), a series of work was performed in a class 10 clean room (temperature 23 ° C, humidity 60%). The results of this cleaning test were as shown in Table 2 below.

Example 2 A polypropylene resin [HYPOL F-600 manufactured by Mitsui Petrochemical Industry Co., Ltd.] was used instead of the low density polyethylene resin.
50 μm in the same manner as in Example 1 except that
A pressure-sensitive adhesive surface protection film was prepared. Table 1 shows the type of resin used in this film, the heat distortion temperature, the amount of additive (the total number of parts of the thermal deterioration inhibitor and the lubricant used per 100 parts of the resin), the critical surface tension of the film, and the acrylic adhesive. The results of examining the peeling force and the surface resistivity in the same manner as above are shown.

A foreign matter removing adhesive tape having an adhesive layer with a thickness of 20 μm was prepared in the same manner as in Example 1 except that this adhesive surface protection film was used as a separator. The adhesive strength of this adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. Also, this adhesive tape
Table 2 shows the results of a foreign matter cleaning test (measurement of the foreign matter removal rate) performed by the same procedure as in Example 1.

Example 3 0.1 part of the thermal deterioration inhibitor was added, and 0.1 part of the lubricant was added.
A thickness of 5 was obtained in the same manner as in Example 1 except that the thickness was changed to 2 parts.
A 0 μm pressure-sensitive adhesive surface protection film was prepared. In Table 1,
The type of resin used in this pressure sensitive adhesive surface protection film, the heat distortion temperature, the amount of additives (total number of parts used for the thermal deterioration inhibitor and lubricant per 100 parts of resin), the critical surface tension of the film, and the acrylic pressure sensitive adhesive The results of examining the peeling force and the surface resistivity in the same manner as above are shown.

A foreign matter removing adhesive tape having an adhesive layer with a thickness of 20 μm was produced in the same manner as in Example 1 except that this adhesive surface protection film was used as a separator. The adhesive strength of this adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. Also, this adhesive tape
Table 2 shows the results of a foreign matter cleaning test (measurement of the foreign matter removal rate) performed by the same procedure as in Example 1.

Example 4 The same procedure as in Example 3 was carried out except that Sumikasen F208-1 manufactured by Sumitomo Chemical Co., Ltd. was used as the low-density polyethylene resin instead of Sumikasen F208-1 manufactured by Sumitomo Chemical Co., Ltd. An adhesive surface protection film having a thickness of 50 μm was produced. Table 1 shows the type of resin used in this pressure-sensitive adhesive surface protection film, the heat distortion temperature, the amount of additive (the total number of parts used of the heat deterioration inhibitor and the lubricant per 100 parts of the resin), the critical surface tension of the film, and the acrylic resin. The results of examining the peeling force and the surface resistivity with respect to the pressure-sensitive adhesive in the same manner as above are shown.

A foreign matter removing adhesive tape having an adhesive layer with a thickness of 20 μm was produced in the same manner as in Example 1 except that this adhesive surface protection film was used as a separator. The adhesive strength of this adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. Also, this adhesive tape
Table 2 shows the results of a foreign matter cleaning test (measurement of the foreign matter removal rate) performed by the same procedure as in Example 1.

Example 5 In the same manner as in Example 2 except that as the polypropylene resin, the Hypollon F-650 manufactured by Mitsui Petrochemical Co., Ltd. was used instead of the Hypolle F-600 manufactured by the same company. Thus, a pressure-sensitive adhesive surface protection film having a thickness of 50 μm was produced. Table 1
In addition to the type of resin used in this film, the heat distortion temperature, and the amount of additive (total number of parts used for the thermal deterioration inhibitor and lubricant per 100 parts of resin), the critical surface tension of the film and the peeling force for the acrylic adhesive. And the results of examining the surface resistivity in the same manner as above are shown.

A foreign matter removing adhesive tape having an adhesive layer with a thickness of 20 μm was prepared in the same manner as in Example 1 except that this adhesive surface protection film was used as a separator. The adhesive strength of this adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. Also, this adhesive tape
Table 2 shows the results of a foreign matter cleaning test (measurement of the foreign matter removal rate) performed by the same procedure as in Example 1.

Example 6 A surface active agent-based antistatic agent was applied to the surface opposite to the surface to be contacted with the pressure-sensitive adhesive after film formation, except that
A pressure-sensitive adhesive surface protection film was prepared in the same manner as in Example 1. Table 1 shows the type of resin used in this pressure-sensitive adhesive surface protection film, the heat distortion temperature, the amount of additive (the total number of parts used of the heat deterioration inhibitor and the lubricant per 100 parts of the resin), the critical surface tension of the film, and the acrylic resin. The results of examining the peeling force and the surface resistivity with respect to the pressure-sensitive adhesive in the same manner as above are shown.

A foreign matter removing adhesive tape having an adhesive layer with a thickness of 20 μm was prepared in the same manner as in Example 1 except that this adhesive surface protective film was used as a separator. The adhesive strength of this adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. Also, this adhesive tape
Table 3 shows the results of a foreign matter cleaning test (measurement of the foreign matter removal rate) performed using the test piece in the same manner as in Example 1.

Comparative Example 1 100 parts of polyvinyl chloride resin, 30 parts of adipic acid polyester plasticizer, 2 parts of epoxy plasticizer, Ba / Zn
1 part of system heat deterioration preventive agent is mixed with mixin-gol
The mixture was kneaded at 80 ° C., and this was put into a calendar film forming apparatus to prepare an adhesive surface protective film having a thickness of 80 μm. Table 1 shows the type and heat distortion temperature of the resin used in this film, the amount of additive (the total number of used parts of the two types of plasticizer and the heat deterioration inhibitor per 100 parts of resin), the critical surface tension of the film, The results of examining the peeling force and the surface resistivity with respect to the acrylic pressure-sensitive adhesive are shown.

Example 1 was repeated except that the pressure-sensitive adhesive surface protection film was used as a separator and the heating condition after coating the acrylic pressure-sensitive adhesive solution on the separator was 90 ° C. for 5 minutes. In the same manner as above, a pressure-sensitive adhesive tape for removing foreign matter having a pressure-sensitive adhesive layer having a thickness of 20 μm was produced. This adhesive tape
Adhesive strength to silicon wafer (mirror surface)
180 ° peel strength measured according to IS Z-0237 (at room temperature, peeling speed 300 mm / min) 120 g
The width was / 20 mm. Further, using this adhesive tape, a foreign matter cleaning test (measurement of foreign matter removal rate) was conducted in the same manner as in Example 1, and the results are shown in Table 3.

Comparative Example 2 A polyethylene terephthalate film having a thickness of 50 μm was subjected to silicone treatment on one side to obtain a pressure-sensitive adhesive surface protection film. Table 1 shows the type of resin used in this film, the heat distortion temperature, the amount of additive (the total number of parts used of the thermal deterioration inhibitor and the lubricant per 100 parts of resin), the critical surface tension of the film (silicone treated surface). ), And the results of examining the peeling force and the surface resistivity with respect to the acrylic pressure-sensitive adhesive are shown.

This pressure-sensitive adhesive surface protection film was used as a separator, and the silicone-treated surface was coated with a solution of an acrylic pressure-sensitive adhesive, and a pressure-sensitive adhesive layer having a thickness of 20 μm was formed in the same manner as in Example 1 below. An adhesive tape for removing foreign matter was prepared. The adhesive strength of this adhesive tape to a silicon wafer (mirror surface) is measured according to JIS Z-0237. 18
0 ° peeling adhesive strength (at room temperature, peeling speed 300 mm / min)
The width was 155 g / 20 mm. Using this adhesive tape, a foreign matter cleaning test (measurement of foreign matter removal rate) was carried out in the same manner as in Example 1, and the results are shown in Table 3.

Comparative Example 3 A polyethylene terephthalate film having a thickness of 50 μm was used as it was as a pressure-sensitive adhesive surface protection film without subjecting it to silicone treatment. Table 1 shows the type of resin used in this film, the heat distortion temperature, and the amount of additive (resin 100
The results of examining the critical surface tension and the surface resistivity of the film are shown together with the total number of used parts of the heat deterioration inhibitor and the lubricant).

With respect to this pressure-sensitive adhesive surface protection film, the peeling force with respect to the acrylic pressure-sensitive adhesive was also measured, but it was impossible to measure because the pressure-sensitive adhesive tape body broke when the film was peeled off. Therefore, using this pressure-sensitive adhesive surface protection film as a separator, a pressure-sensitive adhesive tape for removing foreign matters having a pressure-sensitive adhesive layer having a thickness of 20 μm was prepared in the same manner as in Example 1, and the tape was used in Examples. An attempt was made to carry out the foreign matter cleaning test (measurement of the foreign matter removal rate) in the same manner as in No. 1, but as described above, the cleaning test could not be conducted because it was difficult to peel off the separator.

[0053]

[Table 1]

In Table 1, the reference numerals indicating the types of resin are as follows. PE: Polyethylene resin PP: Polypropylene resin PET: Polyethylene terephthalate resin PVC: Polyvinyl chloride resin

[0055]

[Table 2]

[0056]

[Table 3]

From the results of Tables 1 to 3 above , Examples 1 to 1
According to the adhesive tape of No. 6, the problem of wafer contamination due to the adhesive surface protection film used for the separator is small, and about 75% of the foreign matter adhered to the front and back surfaces of the silicon wafer is reduced.
The adhesive tape of Example 6 of the present invention in which the above film is subjected to the antistatic treatment can be removed at a high removal rate as described above, and there is no adherence of floating particles at the time of coating the adhesive, which is close to about 80%. It can be seen that a high removal rate is obtained. For this reason, the adhesive tapes of Examples 1 to 6, particularly Example 6 of the present invention , were finally applied by being applied to a semiconductor wafer manufacturing process including a cleaning step for removing foreign matters. As a result of aggregation and the yield of the semiconductor device, the adhesive tape of Comparative example 2 described later - the divide that higher yields than the flop is obtained.

On the other hand, in the pressure-sensitive adhesive tape of Comparative Example 1 in which the pressure-sensitive adhesive surface protective film made of soft polyvinyl chloride resin was used as a separator, a large amount of the plasticizer contained in the film migrated to the pressure-sensitive adhesive surface. However, since this is further transferred to the wafer, a large amount of plasticizer is detected on the wafer after the peeling operation of the adhesive tape, the number of foreign substances on the front side of the wafer increases conversely, and the foreign substance removal rate on the back side of the wafer is extremely high. It was low.
Also, since the critical surface tension of the film as a separator is large and the peeling force is too large, the continuous peeling of the adhesive tape by a machine makes it difficult for the film to peel from the adhesive surface. In addition, there were frequent pasting mistakes.

Further, in the pressure-sensitive adhesive tape of Comparative Example 2 using the pressure-sensitive adhesive surface protection film made of a polyethylene terephthalate film subjected to silicone treatment as a separator, the wafer after the peeling operation of the pressure-sensitive adhesive tape was performed. The silicone treatment agent was detected from above, and the foreign matter removal rate was less than 70% on both the front and back surfaces. Incidentally, when this adhesive tape was applied to the manufacturing process of the liquid crystal display glass substrate separately from the above-mentioned semiconductor wafer cleaning test, sufficient adhesion between the base and the alignment film was not obtained when the alignment film was formed. , Furthermore, the unevenness of the alignment film occurs,
It was not possible to satisfy the required optical characteristics.

In addition, in the adhesive tape of Example 6 of the present invention, in addition to the surface resistivity of the adhesive surface protective film made of a polyolefin resin used as a separator ,
The critical surface tension, peeling force, additive amount, and heat distortion temperature are set to the appropriate values described in the present text.
It was also confirmed that if these values deviate significantly from the aptitude values, it becomes difficult to stably maintain the high foreign matter removal rate. For example, if the amount of the above additives, that is, the total amount of the thermal deterioration inhibitor and the lubricant is too large, the foreign matter removal rate tends to decrease, and if the heat distortion temperature of the film is too low, after the adhesive coating. In consideration of the heating step, it is necessary to coat the adhesive film on the support film, and to bond the above film as a separator on this, but in this case, floating particles on the adhesive surface during the heating process. It was also found that the foreign matter removal rate also decreased due to the adherence of.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of an adhesive tape for removing foreign matter of the present invention.

FIG. 2 is a cross-sectional view showing a method for removing foreign matter by using the foreign matter-removing adhesive tape of the present invention.

[Explanation of symbols]

1 Adhesive tape 11 Support film 12 Adhesive layer 13 Separator (adhesive surface protection film) 2 Semiconductor wafer 3 Foreign matter attached to semiconductor wafer

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-147623 (JP, A) JP-A-6-330005 (JP, A) JP-A-3-171627 (JP, A) JP-A-3- 185852 (JP, A) JP-A-6-65548 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/304 B08B 7/00 B32B 7/12 C09J 7/02

Claims (5)

(57) [Claims] 1. A pressure-sensitive adhesive tape for removing foreign matter of a precision electronic component, comprising a pressure-sensitive adhesive layer on a support film, and a pressure-sensitive adhesive surface protection film made of a polyolefin resin on the support film, which is laminated as a separator . , The adhesive surface above
The protective film has antistatic ability and its surface resistivity (A
STM D257) is less than 1 × 10 ¹² Ω / □
Adhesive tape for foreign matter removal of precision electronic parts characterized by
-P . 2. The adhesive tape for removing foreign matter of precision electronic parts according to claim 1, wherein the critical surface tension of the adhesive surface protective film is 32 dyne / cm or less. 3. The adhesive tape for removing foreign matter of precision electronic parts according to claim 1, wherein the adhesive surface protection film has a peeling force (according to JIS Z0237, Z1529) from the adhesive surface of 5 to 150 g / 50 mm width. Pu. 4. The total amount of the heat deterioration preventing agent and the lubricant contained in the pressure-sensitive adhesive surface protection film is the polyolefin resin 10.
It is 0.01 to 0.5 parts by weight per 0 parts by weight.
Adhesive tape for foreign matter removal of precision electronic parts described in. 5. The foreign matter removal of precision electronic parts according to claim 1, wherein the heat distortion temperature of the polyolefin resin (load according to JIS K7207, 4.6 kgf / cm ² ) of the adhesive surface protective film is 80 ° C. or higher. Adhesive tape.