JP3497525B2 - Insulated wire - Google Patents
Insulated wireInfo
- Publication number
- JP3497525B2 JP3497525B2 JP15731393A JP15731393A JP3497525B2 JP 3497525 B2 JP3497525 B2 JP 3497525B2 JP 15731393 A JP15731393 A JP 15731393A JP 15731393 A JP15731393 A JP 15731393A JP 3497525 B2 JP3497525 B2 JP 3497525B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- acid
- isocyanate
- compound
- diisocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002253 acid Substances 0.000 claims description 93
- 239000012948 isocyanate Substances 0.000 claims description 59
- 150000002513 isocyanates Chemical class 0.000 claims description 59
- 238000000576 coating method Methods 0.000 claims description 57
- 239000011248 coating agent Substances 0.000 claims description 55
- 150000001875 compounds Chemical class 0.000 claims description 51
- 239000004962 Polyamide-imide Substances 0.000 claims description 40
- 229920002312 polyamide-imide Polymers 0.000 claims description 40
- -1 diisocyanate compound Chemical class 0.000 claims description 32
- 150000001412 amines Chemical class 0.000 claims description 24
- 229920001228 polyisocyanate Polymers 0.000 claims description 24
- 239000005056 polyisocyanate Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 18
- 239000003973 paint Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 7
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 230000002194 synthesizing effect Effects 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 15
- ICLCCFKUSALICQ-UHFFFAOYSA-N 1-isocyanato-4-(4-isocyanato-3-methylphenyl)-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(C=2C=C(C)C(N=C=O)=CC=2)=C1 ICLCCFKUSALICQ-UHFFFAOYSA-N 0.000 description 11
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 7
- 238000007664 blowing Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 3
- KZTYYGOKRVBIMI-UHFFFAOYSA-N S-phenyl benzenesulfonothioate Natural products C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 3
- 239000001110 calcium chloride Substances 0.000 description 3
- 229910001628 calcium chloride Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000003949 imides Chemical class 0.000 description 3
- 230000001050 lubricating effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 229920003055 poly(ester-imide) Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- DIZQYYDUHDRLEL-DDHJBXDOSA-N (2r,3r,4s,5r)-2-(5,6-dibromobenzimidazol-1-yl)-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound O[C@@H]1[C@H](O)[C@@H](CO)O[C@H]1N1C2=CC(Br)=C(Br)C=C2N=C1 DIZQYYDUHDRLEL-DDHJBXDOSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000004984 aromatic diamines Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 238000007039 two-step reaction Methods 0.000 description 2
- VCFRAMZVMJTSDM-UHFFFAOYSA-N (1,2,2,3,3,3-hexafluoro-1-phenylpropyl)benzene Chemical compound C=1C=CC=CC=1C(F)(C(F)(F)C(F)(F)F)C1=CC=CC=C1 VCFRAMZVMJTSDM-UHFFFAOYSA-N 0.000 description 1
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- GVEDOIATHPCYGS-UHFFFAOYSA-N 1-methyl-3-(3-methylphenyl)benzene Chemical group CC1=CC=CC(C=2C=C(C)C=CC=2)=C1 GVEDOIATHPCYGS-UHFFFAOYSA-N 0.000 description 1
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 description 1
- JITXMLLVGWGFGV-UHFFFAOYSA-N 2-chloro-4-(3-chloro-4-isocyanatophenyl)-1-isocyanatobenzene Chemical compound C1=C(N=C=O)C(Cl)=CC(C=2C=C(Cl)C(N=C=O)=CC=2)=C1 JITXMLLVGWGFGV-UHFFFAOYSA-N 0.000 description 1
- RAADBCJYJHQQBI-UHFFFAOYSA-N 2-sulfoterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(S(O)(=O)=O)=C1 RAADBCJYJHQQBI-UHFFFAOYSA-N 0.000 description 1
- HUWXDEQWWKGHRV-UHFFFAOYSA-N 3,3'-Dichlorobenzidine Chemical group C1=C(Cl)C(N)=CC=C1C1=CC=C(N)C(Cl)=C1 HUWXDEQWWKGHRV-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical group C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- QZWKEPYTBWZJJA-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine-4,4'-diisocyanate Chemical compound C1=C(N=C=O)C(OC)=CC(C=2C=C(OC)C(N=C=O)=CC=2)=C1 QZWKEPYTBWZJJA-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- HSSYVKMJJLDTKZ-UHFFFAOYSA-N 3-phenylphthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C=CC=CC=2)=C1C(O)=O HSSYVKMJJLDTKZ-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- DMOSWVCKHJJLLN-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-2-methylaniline Chemical group C1=C(N)C(C)=CC(C=2C(=CC(N)=CC=2)C)=C1 DMOSWVCKHJJLLN-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- XRWMYQLURQHNCL-UHFFFAOYSA-N 4-(4-amino-3-ethoxyphenyl)-2-ethoxyaniline Chemical group C1=C(N)C(OCC)=CC(C=2C=C(OCC)C(N)=CC=2)=C1 XRWMYQLURQHNCL-UHFFFAOYSA-N 0.000 description 1
- VLZIZQRHZJOXDM-UHFFFAOYSA-N 4-(4-amino-3-ethylphenyl)-2-ethylaniline Chemical group C1=C(N)C(CC)=CC(C=2C=C(CC)C(N)=CC=2)=C1 VLZIZQRHZJOXDM-UHFFFAOYSA-N 0.000 description 1
- QPEJQQPAHOIHOS-UHFFFAOYSA-N 4-(4-aminophenyl)-2,3-dibromoaniline Chemical group C1=CC(N)=CC=C1C1=CC=C(N)C(Br)=C1Br QPEJQQPAHOIHOS-UHFFFAOYSA-N 0.000 description 1
- SZDCQDGTODDBKZ-UHFFFAOYSA-N 4-(4-aminophenyl)-2-methylaniline Chemical group C1=C(N)C(C)=CC(C=2C=CC(N)=CC=2)=C1 SZDCQDGTODDBKZ-UHFFFAOYSA-N 0.000 description 1
- LFEWXDOYPCWFHR-UHFFFAOYSA-N 4-(4-carboxybenzoyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C=C1 LFEWXDOYPCWFHR-UHFFFAOYSA-N 0.000 description 1
- CIDXHVBJLZSYQM-UHFFFAOYSA-N 4-(5-amino-5-methylcyclohexa-1,3-dien-1-yl)-2-methylaniline Chemical group C1=C(N)C(C)=CC(C=2CC(C)(N)C=CC=2)=C1 CIDXHVBJLZSYQM-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 239000004135 Bone phosphate Substances 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- PTZQVBCTRCXDFM-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C(C=C1)=CC=C1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.N=C=O.C(C=C1)=CC=C1OC1=CC=CC=C1 PTZQVBCTRCXDFM-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- RAGXPRCIICFJIK-UHFFFAOYSA-N Phenanthrene-4,5-dicarboxylate Chemical compound C1=CC=C(C(O)=O)C2=C3C(C(=O)O)=CC=CC3=CC=C21 RAGXPRCIICFJIK-UHFFFAOYSA-N 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- CJPIDIRJSIUWRJ-UHFFFAOYSA-N benzene-1,2,4-tricarbonyl chloride Chemical compound ClC(=O)C1=CC=C(C(Cl)=O)C(C(Cl)=O)=C1 CJPIDIRJSIUWRJ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- YCGAZNXXGKTASZ-UHFFFAOYSA-N thiophene-2,5-dicarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)S1 YCGAZNXXGKTASZ-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Polyurethanes Or Polyureas (AREA)
- Organic Insulating Materials (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、たとえばモータのコア
に捲き付けられる、耐加工性にすぐれた絶縁電線に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulated wire which is wound around a core of a motor and has excellent workability.
【0002】[0002]
【従来の技術】近年、機器の小型化、軽量化の傾向に伴
い、モータについても、より小型、軽量で、しかも高性
能のものが要求されるようになってきた。この要求に答
えるには、モータのコアにより多くの絶縁電線を捲き付
ける必要があるが、コアのスロット内に絶縁電線を強引
に詰め込むことになり、捲線工程で絶縁被膜に損傷を生
じる危険性がある。そして、絶縁被膜に損傷が生じる
と、レアー不良やアース不良等が発生し、モータの電気
特性に不具合を生じるという問題がある。2. Description of the Related Art In recent years, with the trend toward smaller size and lighter weight of equipment, there has been a demand for smaller and lighter motors with higher performance. To meet this requirement, it is necessary to wind more insulated wires around the motor core, but this will forcefully pack the insulated wires into the slots of the core, and there is a risk that the insulating coating will be damaged during the winding process. is there. When the insulating coating is damaged, there is a problem that a lare defect, a ground defect, etc. occur, causing a problem in the electric characteristics of the motor.
【0003】そこで、通常は、ポリアミドイミド系の塗
料の塗布、焼付けにより形成された、機械的強度にすぐ
れた絶縁被膜を有する絶縁電線が、上記用途に使用され
ている。なお、ポリアミドイミドとしては、ジフェニル
メタン−4,4′−ジイソシアネートとトリメリット酸
無水物との反応生成物が、一般的に使用される(たとえ
ば特公昭44−19274号公報、特公昭45−276
11号公報等参照)。Therefore, an insulated wire having an insulating coating excellent in mechanical strength, which is formed by coating and baking a polyamideimide-based paint, is usually used for the above-mentioned use. As the polyamide-imide, a reaction product of diphenylmethane-4,4'-diisocyanate and trimellitic anhydride is generally used (for example, JP-B-44-19274 and JP-B-45-276).
No. 11, etc.).
【0004】[0004]
【発明が解決しようとする課題】しかし、最近ではさら
に小型、軽量で性能の良いモータが要求され、それに対
応すべく、絶縁電線の捲線量がさらに増大する傾向にあ
り、コアのスロット内に絶縁電線を強引に詰め込んでい
る。このためスロット内の絶縁電線は、高荷重が加えら
れた状態で接触することになり、さらに発熱しやすい状
態にあるため、通常のポリアミドイミド系の絶縁被膜で
は、使用時の加熱によって絶縁被膜が軟化して導体同士
が接触するレアーショートの発生する危険性が高いとい
う問題がある。However, in recent years, motors with smaller size, lighter weight and better performance are required, and in order to meet the demand, the winding amount of the insulated wire tends to further increase, and the insulation in the slot of the core is increased. The wires are stuffed forcibly. For this reason, the insulated wire in the slot comes into contact with each other under a high load, and is more likely to generate heat. Therefore, in a typical polyamide-imide insulating coating, the insulating coating is heated by heat during use. There is a problem that there is a high risk of softening and a rare short circuit in which the conductors come into contact with each other.
【0005】本発明は以上の事情に鑑みてなされたもの
であって、可撓性にすぐれるとともに、高温下での耐熱
軟化性にすぐれた絶縁被膜を有する絶縁電線を提供する
ことを目的としている。The present invention has been made in view of the above circumstances, and an object thereof is to provide an insulated wire having an insulating coating film which is excellent in flexibility and heat softening resistance at high temperature. There is.
【0006】[0006]
【課題を解決するための手段】上記課題を解決するため
本発明者らは、ポリアミドイミドの構造について検討を
行った。その結果、3つ以上の官能基を有する多官能の
成分を用いて、ポリアミドイミドの構造中に多官能基を
導入して、その架橋密度を向上させると、耐熱軟化性が
向上して、高温下でもレアーショートしにくい絶縁被膜
を形成できることを見出した。そして、架橋構造をどの
程度の割合で構造中に導入すればよいかをさらに検討し
た結果、本発明を完成するに至った。In order to solve the above problems, the present inventors have studied the structure of polyamide-imide. As a result, when a polyfunctional group having three or more functional groups is used to introduce a polyfunctional group into the structure of the polyamide-imide and the crosslink density thereof is improved, the heat softening resistance is improved and It has been found that an insulating film that is less likely to cause a short-circuit can be formed even underneath. Then, as a result of further studying what proportion of the crosslinked structure should be introduced into the structure, the present invention has been completed.
【0007】すなわち本発明の絶縁電線は、少なくとも
ジイソシアネート化合物を含むイソシアネート成分と酸
成分とを原料とするポリアミドイミド系塗料の塗布、焼
付けにより形成された絶縁被膜を有する絶縁電線におい
て、上記ポリアミドイミド系塗料として、3つ以上のイ
ソシアネート基を有する多官能のポリイソシアネート化
合物、および3つ以上のカルボン酸基を有する多官能の
ポリカルボン酸化合物のうちの少なくとも1種を合計
で、イソシアネート成分および酸成分の総量中に0.5
〜8モル%の割合で含有するとともに、3,3′−ジメ
チルビフェニル−4,4′−ジイソシアネートを、イソ
シアネート成分中に10〜80モル%の割合で含有する
イソシアネート成分と酸成分とを、溶媒とともに140
℃未満の温度で一定時間、加熱した後、昇温してさらに
一定時間、加熱して合成したものを用いたことを特徴と
する。Namely insulated wire of the present invention, in the insulated wire having a polyamide coating of imide coatings, insulating coatings formed by baking to the isocyanate component and an acid component as a raw material comprising at least a diisocyanate compound, the polyamideimide As the coating material, at least one of a polyfunctional polyisocyanate compound having three or more isocyanate groups and a polyfunctional polycarboxylic acid compound having three or more carboxylic acid groups is added in total.
And 0.5 in the total amount of the isocyanate component and the acid component.
In a proportion of up to 8 mol% and containing 3,3'-dimes
Cylbiphenyl-4,4'-diisocyanate
10 to 80 mol% of cyanate component
Isocyanate component and acid component together with solvent 140
After heating at a temperature below ℃ for a certain time, raise the temperature and
It is characterized in that it was synthesized by heating for a certain period of time .
【0008】また本発明の他の絶縁電線は、ジアミン化
合物であるアミン成分と酸成分との反応生成物であるイ
ミドジカルボン酸と、少なくともジイソシアネート化合
物を含むイソシアネート成分とを原料とするポリアミド
イミド系塗料の塗布、焼付けにより形成された絶縁被膜
を有する絶縁電線において、原料としての酸成分および
イソシアネート成分が、3つ以上のカルボン酸基を有す
る多官能のポリカルボン酸化合物および3つ以上のイソ
シアネート基を有する多官能のポリイソシアネート化合
物のうちの少なくとも1種を含有し、かつアミン成分、
酸成分、イソシアネート成分の総量に対する、これらポ
リカルボン酸化合物、ポリイソシアネート化合物の合計
の含有割合が0.5〜8モル%であることを特徴とす
る。Another insulated wire according to the present invention is a polyamide-imide based coating material containing imidedicarboxylic acid which is a reaction product of an amine component which is a diamine compound and an acid component, and an isocyanate component which contains at least a diisocyanate compound. In an insulated wire having an insulating coating formed by coating and baking, the acid component and the isocyanate component as raw materials contain a polyfunctional polycarboxylic acid compound having three or more carboxylic acid groups and three or more isocyanate groups. An amine component containing at least one of the polyfunctional polyisocyanate compounds having
The total content of the polycarboxylic acid compound and the polyisocyanate compound is 0.5 to 8 mol% with respect to the total amount of the acid component and the isocyanate component.
【0009】本発明のうち前者の、イソシアネート成分
と酸成分とから1段階の反応によりポリアミドイミドを
製造する場合に、原料としてのイソシアネート成分に含
有される多官能のポリイソシアネート化合物としては、
トリフェニルメタントリイソシアネート、ジフェニルエ
ーテルトリイソシアネート、ジイソシアネート化合物の
3量体であるポリイソシアネート(住友バイエルウレタ
ン社の商品名デスモジュールL、デスモジュールAP
等)、ポリメチレンポリフェニルイソシアネートなどが
あげられる。これらは単独で使用できる他、2種類以上
を併用することもできる。In the former case of the present invention, in the case of producing a polyamideimide by a one-step reaction from an isocyanate component and an acid component, the polyfunctional polyisocyanate compound contained in the isocyanate component as a raw material is
Polyisocyanate, which is a trimer of triphenylmethane triisocyanate, diphenyl ether triisocyanate, and diisocyanate compound (Desmodur L and Desmodur AP, trade names of Sumitomo Bayer Urethane Co., Ltd.
Etc.), polymethylene polyphenyl isocyanate and the like. These can be used alone or in combination of two or more.
【0010】また原料としての酸成分に含有される多官
能のポリカルボン酸化合物としては、トリメリット酸、
ピロメリット酸、ブタンテトラカルボン酸、ビフェニル
テトラカルボン酸、ベンゾフェノンテトラカルボン酸、
ジフェニルスルホンテトラカルボン酸などがあげられ
る。これらは単独で使用できる他、2種類以上を併用す
ることもできる。The polyfunctional polycarboxylic acid compound contained in the acid component as a raw material is trimellitic acid,
Pyromellitic acid, butanetetracarboxylic acid, biphenyltetracarboxylic acid, benzophenonetetracarboxylic acid,
Examples include diphenyl sulfone tetracarboxylic acid. These can be used alone or in combination of two or more.
【0011】これらポリカルボン酸化合物の中でも、入
手のしやすさやコスト等の点で、下記式(3):Of these polycarboxylic acid compounds, the following formula (3):
【0012】[0012]
【化3】 [Chemical 3]
【0013】で表されるトリメリット酸が、本発明に好
適に使用される。本発明においては、原料としてのイソ
シアネート成分および酸成分が、上記ポリイソシアネー
ト化合物およびポリカルボン酸化合物のうちの少なくと
も1種を含有し、かつイソシアネート成分および酸成分
の総量に対する、上記ポリイソシアネート化合物および
/またはポリカルボン酸化合物の合計の含有割合が0.
5〜8モル%に限定される。The trimellitic acid represented by the following formula is preferably used in the present invention. In the present invention, the isocyanate component and the acid component as raw materials contain at least one of the polyisocyanate compound and the polycarboxylic acid compound, and with respect to the total amount of the isocyanate component and the acid component, the polyisocyanate compound and / Alternatively, the total content of the polycarboxylic acid compounds is 0.
It is limited to 5 to 8 mol%.
【0014】詳細に説明すると本発明には、(ア)
原料としてのイソシアネート成分にポリイソシア
ネート化合物を含有させる、(イ)
原料としての酸成分にポリカルボン酸化合物を含
有させる、(ウ)
原料としてのイソシアネート成分にポリイソシア
ネート化合物を含有させるとともに、酸成分にポリカル
ボン酸化合物を含有させる、
の3つの場合があり、(ア)の場合は、イソシアネート
成分および酸成分の総量に対するポリイソシアネート化
合物の含有割合が0.5〜8モル%に限定され、(イ)
の場合は、イソシアネート成分および酸成分の総量に対
するポリカルボン酸化合物の含有割合が0.5〜8モル
%に限定され、(ウ)の場合は、イソシアネート成分お
よび酸成分の総量に対する、ポリイソシアネート化合
物、ポリカルボン酸化合物の合計の含有割合が0.5〜
8モル%に限定される。Specifically, in the present invention, (a) an isocyanate component as a raw material contains a polyisocyanate compound, (a) an acid component as a raw material contains a polycarboxylic acid compound, and (c) a raw material There are three cases in which the polyisocyanate compound is contained in the isocyanate component and the polycarboxylic acid compound is contained in the acid component. In the case of (a) , the polyisocyanate compound is contained with respect to the total amount of the isocyanate component and the acid component. The ratio is limited to 0.5 to 8 mol%, (a)
In the case of, the content ratio of the polycarboxylic acid compound with respect to the total amount of the isocyanate component and the acid component is limited to 0.5 to 8 mol%, and in the case of (c) , the polyisocyanate compound is contained with respect to the total amount of the isocyanate component and the acid component. , The total content of polycarboxylic acid compounds is 0.5 to
Limited to 8 mol%.
【0015】上記の含有割合が0.5モル%未満では、
十分な架橋構造が得られず、架橋密度が低いため、絶縁
被膜は熱によって軟化しやすいものとなってしまう。一
方、含有割合が8モル%を超えると、架橋密度が高すぎ
るため、絶縁被膜は剛直で可撓性に劣り、割れたり剥離
したりしやすいものとなってしまう。なお上記含有割合
は、上記範囲の中でもとくに、0.5〜3モル%の範囲
内であるのが好ましい。If the above content ratio is less than 0.5 mol%,
Since a sufficient crosslinked structure cannot be obtained and the crosslink density is low, the insulating coating tends to be softened by heat. On the other hand, when the content ratio exceeds 8 mol%, the cross-linking density is too high, so that the insulating coating is rigid and inferior in flexibility, and easily cracks or peels off. The above content ratio is preferably within the range of 0.5 to 3 mol% in the above range.
【0016】請求項 1 記載の発明において、ポリイソシ
アネート化合物とともにイソシアネート成分中に含まれ
る他のイソシアネートとしては、式 (1a) : In the invention according to claim 1 , the polyisocylate is
Included in the isocyanate component along with the anate compound
Other isocyanates include the formula (1a) :
【0017】[0017]
【化4】 [Chemical 4]
【0018】で表される3,3′−ジメチルビフェニル
−4,4′−ジイソシアネートを少なくとも含むジイソ
シアネート化合物が、ポリアミドイミドを得るために必
須の成分である。上記3,3′−ジメチルビフェニル−
4,4′−ジイソシアネートの、イソシアネート成分に
対する含有割合は、絶縁被膜を高強度化することと、絶
縁被膜の耐熱軟化性の低下を防止することとを考慮する
と10〜80モル%に限定される。すなわち、上記の含
有割合が10モル%未満では、3,3′−ジメチルビフ
ェニル−4,4′−ジイソシアネートを含有させたこと
による、絶縁被膜を高強度化する効果が得られない。ま
た80モル%を超える場合には、たとえ多官能成分を前
記の含有割合で含有させたとしても、絶縁被膜の耐熱軟
化性が低下してしまう。 3,3'-dimethylbiphenyl represented by
Diiso containing at least 4,4'-diisocyanate
Cyanate compounds are essential for obtaining polyamideimide.
It is an ingredient of broth. The above 3,3'-dimethylbiphenyl-
For the isocyanate component of 4,4'-diisocyanate
The content ratio with respect to
Considering to prevent deterioration of heat resistance of edge coating
And 10 to 80 mol%. That is, including the above
If the proportion is less than 10 mol%, 3,3'-dimethylbiph
Containing phenyl-4,4'-diisocyanate
Therefore, the effect of increasing the strength of the insulating coating cannot be obtained. Well
If it exceeds 80 mol%, the polyfunctional component
Even if it is contained in the above content ratio,
The chemical conversion decreases.
【0019】上記3,3′−ジメチルビフェニル−4,
4′−ジイソシアネート以外の他のジイソシアネート化
合物としては、とくに構造中に芳香族環を有する芳香族
ジイソシアネートが好適に使用される。芳香族ジイソシ
アネートとしては、たとえばジフェニルメタン−4,
4′−ジイソシアネート、ジフェニルメタン−3,3′
−ジイソシアネート、ジフェニルメタン−3,4′−ジ
イソシアネート、ジフェニルエーテル−4,4′−ジイ
ソシアネート、ベンゾフェノン−4,4′−ジイソシア
ネート、ジフェニルスルホン−4,4′−ジイソシアネ
ート、トリレン−2,4−ジイソシアネート、トリレン
−2,6−ジイソシアネート、ナフチレン−1,5−ジ
イソシアネート、m−キシリレンジイソシアネート、p
−キシリレンジイソシアネート等、従来公知の種々の化
合物があげられる。これらは単独で使用される他、2種
以上を併用することもできる。The above 3,3'-dimethylbiphenyl-4,
As the diisocyanate compound other than 4'-diisocyanate , an aromatic diisocyanate having an aromatic ring in its structure is particularly preferably used. Examples of aromatic diisocyanates include diphenylmethane-4,
4'-diisocyanate, diphenylmethane-3,3 '
-Diisocyanate, diphenylmethane-3,4'-diisocyanate, diphenylether-4,4'-diisocyanate, benzophenone-4,4'-diisocyanate, diphenylsulfone-4,4'-diisocyanate, tolylene-2,4-diisocyanate, tolylene- 2,6-diisocyanate, naphthylene-1,5-diisocyanate, m-xylylene diisocyanate, p
-Various conventionally known compounds such as xylylene diisocyanate can be used. These may be used alone or in combination of two or more.
【0020】また、請求項3記載の発明において用い
る、下記一般式(1): The invention according to claim 3 is also used.
The following general formula (1):
【0021】[0021]
【化5】 [Chemical 5]
【0022】〔式中R 1 ,R 2 は同一または異なって、
水素原子、アルキル基、アルコキシ基またはハロゲン原
子を示す。m,nは同一または異なって1〜4の数を示
す。〕で表される芳香族ジイソシアネート化合物の具体
例としては、前記3,3′−ジメチルビフェニル−4,
4′−ジイソシアネートが最も好ましいが、その他にも
たとえばビフェニル−4,4′−ジイソシアネート、ビ
フェニル−3,3′−ジイソシアネート、ビフェニル−
3,4′−ジイソシアネート、3,3′−ジクロロビフ
ェニル−4,4′−ジイソシアネート、2,2′−ジク
ロロビフェニル−4,4′−ジイソシアネート、3,
3′−ジブロモビフェニル−4,4′−ジイソシアネー
ト、2,2′−ジブロモビフェニル−4,4′−ジイソ
シアネート、3,3′−ジメチルビフェニル−4,4′
−ジイソシアネート、2,2′−ジメチルビフェニル−
4,4′−ジイソシアネート、2,3′−ジメチルビフ
ェニル−4,4′−ジイソシアネート、3,3′−ジエ
チルビフェニル−4,4′−ジイソシアネート、2,
2′−ジエチルビフェニル−4,4′−ジイソシアネー
ト、3,3′−ジメトキシビフェニル−4,4′−ジイ
ソシアネート、2,2′−ジメトキシビフェニル−4,
4′−ジイソシアネート、2,3′−ジメトキシビフェ
ニル−4,4′−ジイソシアネート、3,3′−ジエト
キシビフェニル−4,4′−ジイソシアネート、2,
2′−ジエトキシビフェニル−4,4′−ジイソシアネ
ート、2,3′−ジエトキシビフェニル−4,4′−ジ
イソシアネート等があげられる。これらは単独で、ある
いは2種以上混合して使用される。[ Wherein R 1 and R 2 are the same or different,
Hydrogen atom, alkyl group, alkoxy group or halogen source
Indicates a child. m and n are the same or different and represent a number of 1 to 4.
You ] Specific examples of the aromatic diisocyanate compound represented by the above include 3,3'-dimethylbiphenyl-4,
Most preferred is 4'-diisocyanate, but others such as biphenyl-4,4'-diisocyanate, biphenyl-3,3'-diisocyanate, biphenyl-
3,4'-diisocyanate, 3,3'-dichlorobiphenyl-4,4'-diisocyanate, 2,2'-dichlorobiphenyl-4,4'-diisocyanate, 3,
3'-dibromobiphenyl-4,4'-diisocyanate, 2,2'-dibromobiphenyl-4,4'-diisocyanate, 3,3'-dimethylbiphenyl-4,4 '
-Diisocyanate, 2,2'-dimethylbiphenyl-
4,4'-diisocyanate, 2,3'-dimethylbiphenyl-4,4'-diisocyanate, 3,3'-diethylbiphenyl-4,4'-diisocyanate, 2,
2'-diethylbiphenyl-4,4'-diisocyanate, 3,3'-dimethoxybiphenyl-4,4'-diisocyanate, 2,2'-dimethoxybiphenyl-4,
4'-diisocyanate, 2,3'-dimethoxybiphenyl-4,4'-diisocyanate, 3,3'-diethoxybiphenyl-4,4'-diisocyanate, 2,
Examples thereof include 2'-diethoxybiphenyl-4,4'-diisocyanate and 2,3'-diethoxybiphenyl-4,4'-diisocyanate. These may be used alone or in combination of two or more.
【0023】ポリカルボン酸化合物とともに酸成分中に
含まれる他の酸成分としては、トリメリット酸無水物、
トリメリット酸クロライド、または、トリメリット酸の
誘導体のうちの三塩基酸等があげられる。とくに、入手
のしやすさやコスト等の点で、下記式(4)で表されるト
リメリット酸無水物が、好適に使用される。Other acid components contained in the acid component together with the polycarboxylic acid compound include trimellitic anhydride,
Examples thereof include trimellitic acid chloride, and tribasic acid among trimellitic acid derivatives. In particular, trimellitic anhydride represented by the following formula (4) is preferably used in terms of availability and cost.
【0024】[0024]
【化6】 [Chemical 6]
【0025】また酸成分中には、テトラカルボン酸無水
物や二塩基酸、たとえば、ピロメリット酸二無水物、ビ
フェニルテトラカルボン酸二無水物、ベンゾフェノンテ
トラカルボン酸二無水物、ジフェニルスルホンテトラカ
ルボン酸二無水物、テレフタル酸、イソフタル酸、スル
ホテレフタル酸、ジクエン酸、2,5−チオフェンジカ
ルボン酸、4,5−フェナントレンジカルボン酸、ベン
ゾフェノン−4,4′−ジカルボン酸、フタルジイミド
ジカルボン酸、ビフェニルジカルボン酸、2,6−ナフ
タレンジカルボン酸、ジフェニルスルホン−4,4′−
ジカルボン酸、アジピン酸等を、一部添加することもで
きる。In the acid component, tetracarboxylic acid anhydride or dibasic acid such as pyromellitic acid dianhydride, biphenyltetracarboxylic acid dianhydride, benzophenonetetracarboxylic acid dianhydride, diphenylsulfonetetracarboxylic acid is used. Dianhydride, terephthalic acid, isophthalic acid, sulfoterephthalic acid, dicitric acid, 2,5-thiophenedicarboxylic acid, 4,5-phenanthrenedicarboxylic acid, benzophenone-4,4'-dicarboxylic acid, phthaldiimidedicarboxylic acid, biphenyldicarboxylic acid Acid, 2,6-naphthalenedicarboxylic acid, diphenyl sulfone-4,4'-
A part of dicarboxylic acid, adipic acid, etc. may be added.
【0026】上記イソシアネート成分と酸成分とから、
本発明に使用されるポリアミドイミド系塗料を製造する
には、たとえば、略化学量論量のイソシアネート成分と
酸成分とを適当な有機溶媒中で共重合させる、従来のポ
リアミドイミド系塗料と同様の製造方法を採用すること
ができる。より詳細には、ポリイソシアネート化合物お
よび/またはポリカルボン酸化合物を前記の割合で含有
する、略等モル量のイソシアネート成分および酸成分
を、適当な有機溶媒中で0〜180℃の温度で1〜24
時間、より具体的には、まず140℃未満の温度で一定
時間、加熱した後、昇温してさらに一定時間、加熱して
反応させると、イソシアネート成分と酸成分との共重合
体であるポリアミドイミドが、有機溶媒中に溶解または
分散したポリアミドイミド系塗料が得られる。From the above isocyanate component and acid component,
In order to produce the polyamide-imide-based coating used in the present invention, for example, a substantially stoichiometric amount of an isocyanate component and an acid component are copolymerized in a suitable organic solvent. A manufacturing method can be adopted. More specifically, the isocyanate component and the acid component, which contain the polyisocyanate compound and / or the polycarboxylic acid compound in the above-described proportions and are approximately equimolar, are mixed in a suitable organic solvent at a temperature of 0 to 180 ° C. 24
Time , more specifically, constant at a temperature below 140 ° C
After heating for a period of time, the temperature is raised and further heated for a certain period of time to cause a reaction, whereby polyamideimide, which is a copolymer of an isocyanate component and an acid component, is dissolved or dispersed in an organic solvent. An imide-based paint is obtained.
【0027】本発明のうち後者の、アミン成分と酸成分
とを反応させてイミドジカルボン酸を得、このイミドジ
カルボン酸とイソシアネート成分とを反応させてポリア
ミドイミドを製造する2段階の反応の場合に、原料とし
ての酸成分およびイソシアネート成分に含有される多官
能のポリカルボン酸化合物およびポリイソシアネート化
合物としては、前記例示の各種化合物があげられる。本
発明においては、原料としてのアミン成分、酸成分およ
びイソシアネート成分が、上記ポリカルボン酸化合物お
よびポリイソシアネート化合物のうちの少なくとも1種
を含有し、かつアミン成分、酸成分、イソシアネート成
分の総量に対する、これらポリカルボン酸化合物、ポリ
イソシアネート化合物の合計の含有割合が0.5〜8モ
ル%に限定される。In the latter case of the present invention, in the case of a two-step reaction in which an amine component and an acid component are reacted to obtain imidedicarboxylic acid and the imidedicarboxylic acid is reacted with an isocyanate component to produce polyamideimide. As the polyfunctional polycarboxylic acid compound and the polyisocyanate compound contained in the acid component and the isocyanate component as the raw materials, the above-exemplified various compounds can be mentioned. In the present invention, the amine component as a raw material, the acid component and the isocyanate component contain at least one of the polycarboxylic acid compound and the polyisocyanate compound, and to the total amount of the amine component, the acid component, the isocyanate component, The total content of these polycarboxylic acid compounds and polyisocyanate compounds is limited to 0.5 to 8 mol%.
【0028】詳細に説明すると本発明には、(ア)
原料としての酸成分にポリカルボン酸化合物を含
有させる、(イ)
原料としてのイソシアネート成分にポリイソシア
ネート化合物を含有させる、(ウ)
原料としての酸成分にポリカルボン酸化合物を含
有させるとともに、イソシアネート成分にポリイソシア
ネート化合物を含有させる、
の3つの場合があり、(ア)の場合は、アミン成分、酸
成分およびイソシアネート成分の総量に対するポリカル
ボン酸化合物の含有割合が0.5〜8モル%に限定さ
れ、(イ)の場合は、上記3成分の総量に対するポリイ
ソシアネート化合物の含有割合が0.5〜8モル%に限
定される。More specifically, in the present invention, (a) an acid component as a raw material contains a polycarboxylic acid compound, (a) an isocyanate component as a raw material contains a polyisocyanate compound, (c) as a raw material There are three cases in which the polycarboxylic acid compound is contained in the acid component and the polyisocyanate compound is contained in the isocyanate component. In the case of (a) , the polycarboxylic acid relative to the total amount of the amine component, the acid component and the isocyanate component is included. The content ratio of the acid compound is limited to 0.5 to 8 mol%, and in the case of (a) , the content ratio of the polyisocyanate compound is limited to 0.5 to 8 mol% with respect to the total amount of the above three components.
【0029】また(ウ)の場合は、上記3成分の総量に
対する、ポリカルボン酸化合物、ポリイソシアネート化
合物の合計の含有割合が0.5〜8モル%に限定され
る。In the case of (c) , the total content of the polycarboxylic acid compound and the polyisocyanate compound is limited to 0.5 to 8 mol% with respect to the total amount of the above three components.
【0030】上記の含有割合が0.5モル%未満では、
十分な架橋構造が得られず、架橋密度が低いため、絶縁
被膜は熱によって軟化しやすいものとなってしまう。一
方、含有割合が8モル%を超えると、架橋密度が高すぎ
るため、絶縁被膜は剛直で可撓性に劣り、割れたり剥離
したりしやすいものとなってしまう。When the above content ratio is less than 0.5 mol%,
Since a sufficient crosslinked structure cannot be obtained and the crosslink density is low, the insulating coating tends to be softened by heat. On the other hand, when the content ratio exceeds 8 mol%, the cross-linking density is too high, so that the insulating coating is rigid and inferior in flexibility, and easily cracks or peels off.
【0031】なお上記含有割合は、上記範囲の中でもと
くに、0.5〜3モル%の範囲内であるのが好ましい。
アミン成分としてはジアミン化合物が、ポリアミドイミ
ドを得るために必須の成分である。ジアミン化合物とし
ては、とくに構造中に芳香族環を有する芳香族ジアミン
が好適に使用される。The above content ratio is preferably in the range of 0.5 to 3 mol%, especially in the above range.
As the amine component, a diamine compound is an essential component for obtaining polyamideimide. As the diamine compound, an aromatic diamine having an aromatic ring in its structure is preferably used.
【0032】芳香族ジアミンとしては、たとえば4,
4′−ジアミノジフェニルエーテル、3,4′−ジアミ
ノジフェニルエーテル、3,3′−ジアミノジフェニル
エーテル、4,4′−ジアミノジフエニルメタン、4,
4′−ジアミノジフェニルスルホン、4,4′−ジアミ
ノジフェニルスルフィド、4,4′−ジアミノジベンゾ
フェノン、4,4′−ジアミノジフェニルプロパン、
4,4′−ジアミノジフェニルヘキサフルオロプロパ
ン、4,4′−〔ビス(4−アミノフェノキシ)〕ビフ
ェニル、4,4′−〔ビス(4−アミノフェノキシ)〕
ジフェニルエーテル、4,4′−〔ビス(4−アミノフ
ェノキシ)〕ジフェニルスルホン、4,4′−〔ビス
(4−アミノフェノキシ)〕ジフェニルメタン、4,
4′−〔ビス(4−アミノフェノキシ)〕ジフェニルプ
ロパン、4,4′−〔ビス(4−アミノフェノキシ)〕
ジフェニルヘキサフルオロプロパン等、従来公知の種々
のジアミン化合物があげられる。これらは単独で、ある
いは2種以上混合して使用される。As the aromatic diamine, for example, 4,
4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,
4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 4,4'-diaminodibenzophenone, 4,4'-diaminodiphenylpropane,
4,4'-diaminodiphenylhexafluoropropane, 4,4 '-[bis (4-aminophenoxy)] biphenyl, 4,4'-[bis (4-aminophenoxy)]
Diphenyl ether, 4,4 '-[bis (4-aminophenoxy)] diphenyl sulfone, 4,4'-[bis (4-aminophenoxy)] diphenylmethane, 4,
4 '-[bis (4-aminophenoxy)] diphenylpropane, 4,4'-[bis (4-aminophenoxy)]
Examples include various conventionally known diamine compounds such as diphenylhexafluoropropane. These may be used alone or in combination of two or more.
【0033】またとくに、下記一般式(2):In particular, the following general formula (2):
【0034】[0034]
【化7】 [Chemical 7]
【0035】〔式中R3,R4は同一または異なって、
水素原子、アルキル基、アルコキシ基またはハロゲン原
子を示す。p,qは同一または異なって1〜4の数を示
す。〕で表される芳香族ジアミン化合物および/または
前記一般式(1)で表される芳香族ジイソシアネート化合
物を、アミン成分およびイソシアネート成分の総量中に
10〜80モル%の割合で含有する系は、絶縁被膜の高
強度化の点で好適である反面、耐熱軟化性の低下が大き
いので、本発明の構成が積極的に採用される。なお上記
芳香族ジアミン化合物、芳香族ジイソシアネート化合物
を合計で、アミン成分およびイソシアネート成分の総量
中に80モル%を超えて含有する系では耐熱軟化性の低
下が著しいので、多官能成分を配合しても十分な効果は
得られない。[Wherein R 3 and R 4 are the same or different,
A hydrogen atom, an alkyl group, an alkoxy group or a halogen atom is shown. p and q are the same or different and represent a number of 1 to 4. ] A system containing an aromatic diamine compound represented by and / or an aromatic diisocyanate compound represented by the general formula (1) in a proportion of 10 to 80 mol% in the total amount of the amine component and the isocyanate component, While it is suitable in terms of increasing the strength of the insulating coating, it has a large decrease in heat softening resistance, so that the constitution of the present invention is positively adopted. In addition, in the system containing the aromatic diamine compound and the aromatic diisocyanate compound in a total amount of more than 80 mol% in the total amount of the amine component and the isocyanate component, the heat softening resistance is remarkably lowered, so that a polyfunctional component is added. But not enough effect.
【0036】上記一般式(2)で表される芳香族ジアミン
化合物の具体例としては、たとえばベンジジン、3−メ
チル−4,4′−ジアミノビフェニル、3,3′−ジメ
チル−4,4′−ジアミノビフェニル、2,3′−ジメ
チル−4,4′−ジアミノビフェニル、2,2′−ジメ
チル−4,4′−ジアミノビフェニル、3,3′−ジメ
チル−3,4′−ジアミノビフェニル、3,3′−ジメ
チル−3,3′−ジアミノビフェニル、3,3′−ジエ
チル−4,4′−ジアミノビフェニル、3,3′−ジメ
トキシ−4,4′−ジアミノビフェニル、3,3′−ジ
エトキシ−4,4′−ジアミノビフェニル、3,3′−
ジクロロ−4,4′−ジアミノビフェニル、3,3′−
ジブロモ−4,4′−ジアミノビフェニル等があげられ
る。これらは単独で、あるいは2種以上混合して使用さ
れる。Specific examples of the aromatic diamine compound represented by the above general formula (2) include, for example, benzidine, 3-methyl-4,4'-diaminobiphenyl and 3,3'-dimethyl-4,4'-. Diaminobiphenyl, 2,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dimethyl-3,4'-diaminobiphenyl, 3, 3'-dimethyl-3,3'-diaminobiphenyl, 3,3'-diethyl-4,4'-diaminobiphenyl, 3,3'-dimethoxy-4,4'-diaminobiphenyl, 3,3'-diethoxy- 4,4'-diaminobiphenyl, 3,3'-
Dichloro-4,4'-diaminobiphenyl, 3,3'-
Examples include dibromo-4,4'-diaminobiphenyl and the like. These may be used alone or in combination of two or more.
【0037】上記各芳香族ジアミン化合物の中でも、入
手のしやすさやコスト等の点で、下記式(2a)で表される
3,3′−ジメチル−4,4′−ジアミノビフェニル
が、本発明に最も好適に使用される。Among the above aromatic diamine compounds, 3,3'-dimethyl-4,4'-diaminobiphenyl represented by the following formula (2a) is the present invention in view of availability and cost. Most preferably used.
【0038】[0038]
【化8】 [Chemical 8]
【0039】上記アミン成分とともに使用される酸成
分、イソシアネート成分、ならびに、酸成分に含有され
るポリカルボン酸化合物、イソシアネート成分に含有さ
れるポリイソシアネート化合物としては、先の発明で例
示したものが使用できる。上記アミン成分、酸成分およ
びイソシアネート成分から、本発明に使用されるポリア
ミドイミド系塗料を製造するには、たとえば、略化学量
論量のアミン成分と酸成分とを適当な有機溶媒中で反応
させてイミドジカルボン酸を生成させ、これを、略化学
量論量のイソシアネート成分と共重合させる、従来のポ
リアミドイミド系塗料と同様の製造方法を採用すること
ができる。As the acid component, the isocyanate component, the polycarboxylic acid compound contained in the acid component, and the polyisocyanate compound contained in the isocyanate component, those exemplified in the above invention are used. it can. In order to produce the polyamideimide-based coating used in the present invention from the amine component, the acid component and the isocyanate component, for example, a substantially stoichiometric amount of the amine component and the acid component are reacted in a suitable organic solvent. It is possible to employ the same production method as that for a conventional polyamide-imide-based coating composition in which imide dicarboxylic acid is produced and is copolymerized with a substantially stoichiometric amount of an isocyanate component.
【0040】より詳細には、酸成分およびその略1/2
倍モル量のアミン成分を、適当な有機溶媒中で0〜15
0℃の温度で1〜24時間反応させると、アミン成分と
酸成分との反応生成物であるイミドジカルボン酸が、反
応液中に生成する。つぎにこの反応液に、イミドジカル
ボン酸と略等モル量のイソシアネート成分を添加して、
0〜150℃の温度で1〜24時間反応させると、ポリ
アミドイミドが、有機溶媒中に溶解または分散したポリ
アミドイミド系塗料が得られる。More specifically, the acid component and its approximately 1/2
A molar amount of amine component of 0 to 15 in a suitable organic solvent.
When the reaction is carried out at a temperature of 0 ° C. for 1 to 24 hours, imidodicarboxylic acid which is a reaction product of an amine component and an acid component is produced in the reaction solution. Next, to this reaction solution, an isocyanate component in an approximately equimolar amount with imidodicarboxylic acid was added,
By reacting at a temperature of 0 to 150 ° C. for 1 to 24 hours, a polyamideimide-based coating material in which polyamideimide is dissolved or dispersed in an organic solvent is obtained.
【0041】なお、本発明に使用されるポリアミドイミ
ド系塗料には、さらに必要に応じて、顔料、染料、無機
または有機のフィラー、潤滑剤等の各種添加剤を添加し
てもよい。本発明の絶縁電線は、上記ポリアミドイミド
系塗料を電線の表面に直接に、または他の絶縁材料から
なる下地層を介して塗布し、焼付けて絶縁被膜を形成す
ることで製造される。If necessary, various additives such as pigments, dyes, inorganic or organic fillers and lubricants may be added to the polyamide-imide type coating material used in the present invention. The insulated wire of the present invention is manufactured by applying the above-mentioned polyamide-imide-based coating material directly to the surface of the wire or through an underlying layer made of another insulating material and baking it to form an insulating coating.
【0042】絶縁被膜の膜厚については本発明ではとく
に限定されず、電線のサイズ等に応じて、従来と同程度
の膜厚に形成することができる。他の絶縁材料からなる
下地層上に上記ポリアミドイミド系塗料を塗布、焼付け
する場合、当該下地層としては、絶縁被膜および電線と
の密着性のよい材料からなるものが、好適に採用され
る。The film thickness of the insulating coating is not particularly limited in the present invention, and it can be formed to the same film thickness as the conventional one, depending on the size of the electric wire and the like. When the above-mentioned polyamide-imide-based coating material is applied and baked on a base layer made of another insulating material, the base layer is preferably made of a material having good adhesion to the insulating coating and the electric wire.
【0043】上記下地層としては、たとえばポリウレタ
ン系、ポリエステル系、ポリエステルイミド系、ポリエ
ステルアミドイミド系、ポリアミドイミド系、ポリイミ
ド系等、従来公知の種々の絶縁塗料の塗布、焼付けによ
り形成される絶縁膜があげられる。中でも、ポリアミド
イミド系塗料、ポリエステルイミド系塗料またはポリエ
ステル系塗料の塗布、焼付けにより形成される下地層が
好ましい。The base layer is an insulating film formed by coating and baking various conventionally known insulating coating materials such as polyurethane, polyester, polyesterimide, polyesteramideimide, polyamideimide, and polyimide. Can be given. Of these, a base layer formed by applying or baking a polyamideimide-based paint, a polyesterimide-based paint or a polyester-based paint is preferable.
【0044】下地層の膜厚についても本発明ではとくに
限定されないが、被膜の機械的強度等を考慮すれば、絶
縁被膜と下地層との膜厚の比が1/10〜10/1の範
囲内であることが好ましい。電線の表面に直接に絶縁被
膜を形成する場合、その表面には上塗層を設けてもよ
い。上塗層としては、たとえばポリウレタン系、ポリエ
ステル系、ポリエステルイミド系、ポリエステルアミド
イミド系、ポリアミドイミド系、ポリイミド系等、従来
公知の種々の絶縁塗料の塗布、焼付けにより形成される
絶縁膜があげられる。The film thickness of the underlayer is not particularly limited in the present invention either, but in consideration of the mechanical strength of the film, the ratio of the film thickness between the insulating film and the underlayer is in the range of 1/10 to 10/1. It is preferably within. When the insulating coating is formed directly on the surface of the electric wire, an overcoat layer may be provided on the surface. Examples of the overcoat layer include insulating films formed by coating and baking various conventionally known insulating coating materials such as polyurethane-based, polyester-based, polyesterimide-based, polyesteramideimide-based, polyamideimide-based, and polyimide-based. .
【0045】また絶縁被膜の上層には、絶縁被膜の表面
に潤滑性を付与すべく、表面潤滑層を設けてもよい。表
面潤滑層としては、流動パラフィン、固形パラフィンと
いったパラフィン類の塗膜も使用できるが、耐久性等を
考慮すると、各種ワックス、ポリエチレン、フッ素樹
脂、シリコーン樹脂等の潤滑剤をバインダー樹脂で結着
した表面潤滑層がより好ましい。Further, a surface lubricating layer may be provided on the upper surface of the insulating coating in order to impart lubricity to the surface of the insulating coating. As the surface lubricating layer, a coating film of paraffin such as liquid paraffin or solid paraffin can be used, but in consideration of durability etc., various waxes, lubricants such as polyethylene, fluororesin and silicone resin are bound with a binder resin. A surface lubricating layer is more preferred.
【0046】[0046]
【実施例】以下に、本発明の絶縁電線を、実施例並びに
比較例に基づいて説明する。
実施例1
温度計、冷却管、塩化カルシウム充填管、攪拌器、窒素
吹き込み管を取り付けたフラスコ中に、上記窒素吹き込
み管から毎分150mlの窒素ガスを流しながらトリメリ
ット酸無水物(以下「TMA」という)、トリメリット
酸(以下「ETM」という)の2種の酸成分と、この2
種の酸成分と略等モル量の、ジフェニルメタン−4,
4′−ジイソシアネート(以下「MDI」という)およ
び3,3′−ジメチルビフェニル−4,4′−ジイソシ
アネート(以下「TODI」という)の2種のイソシア
ネート成分とを投入した。ポリカルボン酸化合物である
ETMの、酸成分およびイソシアネート成分の総量に対
する含有割合は1.7モル%であった。またTODIの
イソシアネート成分中に占める割合は20モル%であっ
た。EXAMPLES The insulated wire of the present invention will be described below based on Examples and Comparative Examples. Example 1 In a flask equipped with a thermometer, a cooling tube, a calcium chloride filling tube, a stirrer, and a nitrogen blowing tube, trimellitic acid anhydride (hereinafter referred to as "TMA" while flowing 150 ml of nitrogen gas per minute from the nitrogen blowing tube. 2) and trimellitic acid (hereinafter referred to as “ETM”)
Species acid component and approximately equimolar amounts, diphenylmethane -4,
4'-diisocyanate (hereinafter referred to as "MDI") and
And 3,3'-dimethylbiphenyl-4,4'-diisocyanate
Two types of isocyanate, anate (hereinafter referred to as "TODI")
And nate ingredients . The content ratio of ETM, which is a polycarboxylic acid compound, with respect to the total amount of the acid component and the isocyanate component was 1.7 mol%. Also of TODI
The proportion in the isocyanate component is 20 mol%
It was
【0047】つぎに、上記フラスコ中に溶媒としてのN
−メチル−2−ピロリドンを入れ、攪拌器で攪拌しつつ
80℃で3時間加熱し、さらに、3時間かけて140℃
まで昇温した後、140℃で1時間加熱した。そして、
1時間経過した段階で加熱を止め、放冷して、濃度25
%のポリアミドイミド系塗料を得た。このポリアミドイ
ミド系塗料を、直径1.0mmの銅線表面に、常法によっ
て塗布、焼付けして、膜厚35μmの絶縁被膜を有する
絶縁電線を作製した。Next, N as a solvent was placed in the flask.
-Methyl-2-pyrrolidone was added and heated at 80 ° C for 3 hours while stirring with a stirrer, and then 140 ° C over 3 hours.
After heating up to 140 ° C., it was heated at 140 ° C. for 1 hour. And
When 1 hour has passed, stop heating and allow to cool to a concentration of 25
% Polyamide imide-based paint was obtained. This polyamide-imide-based coating material was applied onto a surface of a copper wire having a diameter of 1.0 mm and baked by a conventional method to prepare an insulated electric wire having an insulating coating film having a film thickness of 35 μm.
【0048】実施例2
ポリアミドイミド系塗料作製時のMDIおよびTODI
の仕込み量を変え、TODIのイソシアネート成分中に
占める割合を40モル%としたこと以外は、実施例1と
同様にして絶縁電線を作製した。
実施例3
ポリアミドイミド系塗料作製時のMDIおよびTODI
の仕込み量を変え、TODIのイソシアネート成分中に
占める割合を50モル%としたこと以外は、実施例1と
同様にして絶縁電線を作製した。実施例4 ポリアミドイミド系塗料作製時のMDIおよびTODI
の仕込み量を変え、TODIのイソシアネート成分中に
占める割合を75モル%としたこと以外は、実施例1と
同様にして絶縁電線を作製した。 Example 2 MDI and TODI at the time of preparing a polyamide-imide type coating material
Changing the charged amount, in the isocyanate component of TODI
Except that the proportion of 40 mol% was prepared insulated wire in the same manner as in Example 1. Example 3 MDI and TODI at the time of producing a polyamide-imide-based coating material
Changing the charged amount, in the isocyanate component of TODI
An insulated wire was produced in the same manner as in Example 1 except that the proportion occupied was 50 mol%. Example 4 MDI and TODI at the time of preparing a polyamide-imide-based paint
Change the charge amount of
Example 1 except that the proportion occupied was 75 mol%.
An insulated wire was produced in the same manner.
【0049】比較例1
ポリアミドイミド系塗料作製時にETMを仕込まず、T
MAの仕込み量を、イソシアネート成分と略等モル量と
したこと以外は、実施例3と同様にして絶縁電線を作製
した。
比較例2
ポリアミドイミド系塗料作製時にMDIを仕込まず、T
ODIの仕込み量を、酸成分と略等モル量としたこと以
外は、実施例1と同様にして絶縁電線を作製した。Comparative Example 1 ETM was not charged during preparation of the polyamide-imide type coating, and T
The charge of MA, except that a substantially equimolar amount min isocyanate formed, to prepare an insulated wire in the same manner as in Example 3. Comparative Example 2 When preparing a polyamide-imide-based paint, do not charge MDI
An insulated wire was produced in the same manner as in Example 1 except that the amount of ODI charged was substantially equimolar to the acid component .
【0050】上記各実施例、比較例の絶縁電線につい
て、以下の各試験を行った。
可撓性試験
実施例、比較例の絶縁電線に、直径1mmのものから1mm
ずつ段階的に直径が大きくなる複数の丸棒を順次あてが
って、電線を丸棒の外形に対応させて曲げた際の、絶縁
被膜の割れや剥離を観察し、絶縁被膜に異状が見られな
かった最小の丸棒の直径d(mm)を記録した。The following tests were conducted on the insulated wires of the above Examples and Comparative Examples. Flexibility test Insulated wires of Examples and Comparative Examples, from 1 mm in diameter to 1 mm
No damage was observed in the insulation coating when the wires were bent in accordance with the outer shape of the round rod by sequentially applying multiple round rods whose diameters gradually increased. The smallest round bar diameter d (mm) was recorded.
【0051】軟化点測定
絶縁被膜の軟化点(℃)を、JIS C3003 「エ
ナメル銅線及びエナメルアルミニウム線試験方法」所載
の方法に準拠した方法にて測定した。以上の結果を表1
に示す。Measurement of Softening Point The softening point (° C.) of the insulating coating was measured by a method according to the method described in JIS C3003 “Test method for enamel copper wire and enamel aluminum wire”. The above results are shown in Table 1.
Shown in.
【0052】[0052]
【表1】 [Table 1]
【0053】上記表1の結果より、芳香族ジイソシアネ
ート化合物であるTODIを、イソシアネート成分中に
10〜80モル%の割合で含有する系では、本発明の構
成を採用することで、耐熱軟化性の低下を防止できるこ
とがわかった。またTODIを、イソシアネート成分中
に80モル%を超えて含有する系では、本発明の構成を
採用しても、耐熱軟化性の低下を防止できないこともわ
かった。From the results shown in Table 1 above , the aromatic diisocyanate was obtained.
Of TODI, which is a salt compound, in the isocyanate component
In a system containing 10 to 80 mol%, the composition of the present invention is
By adopting the composition, it is possible to prevent the deterioration of heat softening resistance.
I understood. In addition, TODI in the isocyanate component
In a system containing more than 80 mol% of
Even if it is adopted, it may not be possible to prevent deterioration in heat softening resistance.
It was
【0054】実施例5
温度計、冷却管、塩化カルシウム充填管、攪拌器、窒素
吹き込み管を取り付けたフラスコ中に、上記窒素吹き込
み管から毎分150mlの窒素ガスを流しながらTMA、
ETMの2種の酸成分と、この2種の酸成分の合計の略
1/2倍モル量の、アミン成分としての4,4′−ジア
ミノジフェニルメタン(以下「DDM」という)とを投
入した。Example 5 In a flask equipped with a thermometer, a cooling tube, a calcium chloride filling tube, a stirrer, and a nitrogen blowing tube, while flowing 150 ml of nitrogen gas per minute from the nitrogen blowing tube, TMA,
Two acid components of ETM and 4,4'-diaminodiphenylmethane (hereinafter referred to as "DDM") as an amine component in an amount of about 1/2 times the total amount of the two acid components were charged.
【0055】つぎに、上記フラスコ中にN−メチル−2
−ピロリドンを入れ、攪拌器で攪拌しつつ80℃で2時
間加熱して、イミドジカルボン酸を生成させた。つぎに
上記反応液中に、イミドジカルボン酸と略等モル量のM
DIを添加し、攪拌器で攪拌しつつ80℃で2時間、1
40℃で2時間、さらに180℃で2時間加熱し、その
後放冷して、固形分濃度25%のポリアミドイミド系塗
料を得た。Next, N-methyl-2 was added to the flask.
-Pyrrolidone was added and heated at 80 ° C for 2 hours while stirring with a stirrer to generate imidodicarboxylic acid. Next, in the above reaction solution, an approximately equimolar amount of M with imidodicarboxylic acid was added.
Add DI and stir with a stirrer at 80 ° C for 2 hours, 1
It was heated at 40 ° C. for 2 hours and further at 180 ° C. for 2 hours, and then allowed to cool to obtain a polyamideimide-based coating material having a solid content concentration of 25%.
【0056】そして、このポリアミドイミド系塗料を使
用して、前記実施例1と同様にして絶縁電線を作製し
た。なお原料段階における、アミン成分、酸成分および
イソシアネート成分の総量に対するETMの含有割合は
3.6モル%であった。Then, using this polyamide-imide type coating material, an insulated wire was prepared in the same manner as in Example 1. The content ratio of ETM with respect to the total amount of the amine component, the acid component and the isocyanate component in the raw material stage was 3.6 mol%.
【0057】実施例6
ポリアミドイミド系塗料作製時にETMを仕込まず、T
MAの仕込み量を、アミン成分の略2倍モル量とすると
ともに、イソシアネート成分としてMDIとC−MDI
とを使用したこと以外は、実施例5と同様にして絶縁電
線を作製した。ポリイソシアネート化合物であるC−M
DIの、アミン成分、酸成分およびイソシアネート成分
の総量に対する含有割合は0.85モル%であった。Example 6 ETM was not charged at the time of preparing a polyamide-imide-based coating, and T
The amount of MA charged was approximately twice the molar amount of the amine component, and MDI and C-MDI were used as isocyanate components.
An insulated wire was produced in the same manner as in Example 5 except that and were used. CM which is a polyisocyanate compound
The content ratio of DI to the total amount of the amine component, the acid component and the isocyanate component was 0.85 mol%.
【0058】上記各実施例の絶縁電線について、前記可
撓性試験および軟化点測定の両試験を行った。結果を表
2に示す。Both the flexibility test and the softening point measurement were conducted on the insulated wire of each of the above examples. The results are shown in Table 2.
【0059】[0059]
【表2】 [Table 2]
【0060】上記表2の結果より、2段階の反応で製造
されるポリアミドイミド系塗料を用いた絶縁電線におい
ても、多官能の成分を含有させることで、絶縁被膜の耐
熱軟化性が向上することがわかった。 From the results shown in Table 2 above, it is possible to improve the heat resistance and softening property of the insulating coating by including the polyfunctional component in the insulated wire using the polyamide-imide type coating produced by the two-step reaction. I understood .
【0061】実施例7
温度計、冷却管、塩化カルシウム充填管、攪拌器、窒素
吹き込み管を取り付けたフラスコ中に、上記窒素吹き込
み管から毎分150mlの窒素ガスを流しながらTMA、
ETMの2種の酸成分と、この2種の酸成分の合計の略
1/2倍モル量の、DDMおよび3,3′−ジメチル−
4,4′−ジアミノビフェニル(以下「DBRB」とい
う)の2種のアミン成分とを投入した。 Example 7 In a flask equipped with a thermometer, a cooling tube, a calcium chloride filling tube, a stirrer, and a nitrogen blowing tube, while flowing 150 ml of nitrogen gas per minute from the nitrogen blowing tube, TMA,
The two acid components of ETM and a molar amount of DDM and 3,3′-dimethyl-about 1/2 times the total amount of the two acid components.
Two kinds of amine components of 4,4'-diaminobiphenyl (hereinafter referred to as "DBRB") were added.
【0062】つぎに、上記フラスコ中にN−メチル−2
−ピロリドンを入れ、攪拌器で攪拌しつつ80℃で2時
間加熱して、イミドジカルボン酸を生成させた。つぎに
上記反応液中に、イミドジカルボン酸と略等モル量のM
DIを添加し、攪拌器で攪拌しつつ80℃で2時間、1
40℃で2時間、さらに180℃で2時間加熱し、その
後放冷して、固形分濃度25%のポリアミドイミド系塗
料を得た。Next, N-methyl-2 was added to the flask.
-Pyrrolidone was added and heated at 80 ° C for 2 hours while stirring with a stirrer to generate imidodicarboxylic acid. Next, in the above reaction solution, an approximately equimolar amount of M with imidodicarboxylic acid was added.
Add DI and stir with a stirrer at 80 ° C for 2 hours, 1
It was heated at 40 ° C. for 2 hours and further at 180 ° C. for 2 hours, and then allowed to cool to obtain a polyamideimide-based coating material having a solid content concentration of 25%.
【0063】そして、このポリアミドイミド系塗料を使
用して、前記実施例1と同様にして絶縁電線を作製し
た。なお原料段階における、アミン成分、酸成分および
イソシアネート成分の総量に対するETMの含有割合は
3.6モル%であった。またDBRBのアミン成分およ
びイソシアネート成分の総量中に占める割合は50モル
%であった。Then, using this polyamide-imide type coating material, an insulated wire was prepared in the same manner as in Example 1. The content ratio of ETM with respect to the total amount of the amine component, the acid component and the isocyanate component in the raw material stage was 3.6 mol%. The ratio of the DBRB amine component and isocyanate component in the total amount was 50 mol%.
【0064】上記実施例の絶縁電線について、前記可撓
性試験および軟化点測定の両試験を行った。結果を表3
に示す。Both the flexibility test and the softening point measurement were conducted on the insulated wire of the above example. The results are shown in Table 3.
Shown in.
【0065】[0065]
【表3】 [Table 3]
【0066】上記表3の結果より、芳香族ジアミン化合
物であるDBRBを、アミン成分およびイソシアネート
成分の総量中に10〜80モル%の割合で含有する系で
は、本発明の構成を採用することで、耐熱軟化性の低下
を防止できることがわかった。From the results shown in Table 3 above, in the system containing DBRB, which is an aromatic diamine compound, in a proportion of 10 to 80 mol% in the total amount of the amine component and the isocyanate component, the constitution of the present invention was adopted. It was found that the deterioration of heat softening resistance can be prevented.
【0067】[0067]
【発明の効果】本発明の絶縁電線によれば、ポリアミド
イミドの構造中に多官能基を導入して架橋密度を向上さ
せることにより、可撓性にすぐれるとともに、高温下で
の耐熱軟化性にすぐれた絶縁被膜を形成することができ
る。したがって、本発明の絶縁電線はとくに耐熱性にす
ぐれており、たとえばモータの捲線に使用する場合に
は、コアへの捲線量を従来より増大させても、高温下で
もレアーショートするおそれがなく、より小型、軽量で
性能の良いモータの要求に対応することができる。EFFECTS OF THE INVENTION According to the insulated wire of the present invention, by introducing a polyfunctional group into the structure of polyamide-imide to improve the crosslink density, it is excellent in flexibility and has heat-softening resistance at high temperature. An excellent insulating film can be formed. Therefore, the insulated wire of the present invention is particularly excellent in heat resistance, and when it is used, for example, in winding of a motor, even if the winding amount to the core is increased more than before, there is no risk of a rare short even at high temperature, It is possible to meet the demand for smaller and lighter motors with better performance.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01B 3/16 - 3/56 H01B 7/00 - 7/02 H01B 7/30 - 7/36 ─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. 7 , DB name) H01B 3/16-3/56 H01B 7/ 00-7/02 H01B 7/ 30-7/36
Claims (3)
イソシアネート成分と酸成分とを原料とするポリアミド
イミド系塗料の塗布、焼付けにより形成された絶縁被膜
を有する絶縁電線において、上記ポリアミドイミド系塗
料として、 3つ以上のイソシアネート基を有する多官能のポリイソ
シアネート化合物、および3つ以上のカルボン酸基を有
する多官能のポリカルボン酸化合物のうちの少なくとも
1種を合計で、イソシアネート成分および酸成分の総量
中に0.5〜8モル%の割合で含有するとともに、3,
3′−ジメチルビフェニル−4,4′−ジイソシアネー
トを、イソシアネート成分中に10〜80モル%の割合
で含有するイソシアネート成分と酸成分とを、溶媒とと
もに140℃未満の温度で一定時間、加熱した後、昇温
してさらに一定時間、加熱して合成したものを用いたこ
とを特徴とする絶縁電線。1. A least diisocyanate compound coating of polyamideimide paint an isocyanate component and an acid component as a raw material containing, in insulated wire having an insulating coating formed by baking, the polyamideimide paint
As the material, at least one of a polyfunctional polyisocyanate compound having three or more isocyanate groups and a polyfunctional polycarboxylic acid compound having three or more carboxylic acid groups is added in total to form an isocyanate component and an acid component. Total amount of
In addition to the content of 0.5 to 8 mol% in the
3'-Dimethylbiphenyl-4,4'-diisocyanate
Of the isocyanate component in the proportion of 10 to 80 mol%
With the isocyanate component and the acid component contained in, with a solvent
After heating at a temperature below 140 ° C for a certain period of time, then raising the temperature
Then , an insulated electric wire characterized in that it is obtained by heating and synthesizing for a certain period of time .
との反応生成物であるイミドジカルボン酸と、少なくと
もジイソシアネート化合物を含むイソシアネート成分と
を原料とするポリアミドイミド系塗料の塗布、焼付けに
より形成された絶縁被膜を有する絶縁電線において、原
料としての酸成分およびイソシアネート成分が、3つ以
上のカルボン酸基を有する多官能のポリカルボン酸化合
物および3つ以上のイソシアネート基を有する多官能の
ポリイソシアネート化合物のうちの少なくとも1種を含
有し、かつアミン成分、酸成分、イソシアネート成分の
総量に対する、これらポリカルボン酸化合物、ポリイソ
シアネート化合物の合計の含有割合が0.5〜8モル%
であることを特徴とする絶縁電線。2. Formed by coating and baking a polyamideimide-based coating material containing imidedicarboxylic acid which is a reaction product of an amine component which is a diamine compound and an acid component, and an isocyanate component which contains at least a diisocyanate compound. In an insulated wire having an insulating coating, an acid component and an isocyanate component as raw materials are a polyfunctional polycarboxylic acid compound having three or more carboxylic acid groups and a polyfunctional polyisocyanate compound having three or more isocyanate groups. The content ratio of the total of these polycarboxylic acid compounds and polyisocyanate compounds is 0.5 to 8 mol% based on the total amount of the amine component, the acid component, and the isocyanate component containing at least one of them.
Insulated wire characterized by being.
下記一般式(2): 【化1】 〔式中R3,R4は同一または異なって、水素原子、ア
ルキル基、アルコキシ基またはハロゲン原子を示す。
p,qは同一または異なって1〜4の数を示す。〕で表
される芳香族ジアミン化合物、および一般式 (1) : 【化2】 〔式中R 1 ,R 2 は同一または異なって、水素原子、ア
ルキル基、アルコキシ基またはハロゲン原子を示す。
m,nは同一または異なって1〜4の数を示す。〕で表
される芳香族ジイソシアネート化合物のうちの少なくと
も一種を含有し、かつ原料としてのアミン成分、イソシ
アネート成分の総量に対する、これら芳香族ジアミン化
合物、芳香族ジイソシアネート化合物の合計の含有割合
が10〜80モル%であることを特徴とする請求項2記
載の絶縁電線。3. An amine component and an isocyanate component,
The following general formula (2): [In the formula, R 3 and R 4 are the same or different and each represents a hydrogen atom, an alkyl group, an alkoxy group or a halogen atom.
p and q are the same or different and represent a number of 1 to 4. ] And an aromatic diamine compound represented by the general formula (1) : [Wherein R 1 and R 2 are the same or different and each represents a hydrogen atom,
It represents a alkyl group, an alkoxy group or a halogen atom.
m and n are the same or different and represent a number of 1 to 4. ] At least one of the aromatic diisocyanate compounds represented by, and the total content ratio of these aromatic diamine compounds and aromatic diisocyanate compounds with respect to the total amount of amine components and isocyanate components as raw materials is 10-80 3. The composition according to claim 2, wherein the content is mol%.
Placing insulated wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15731393A JP3497525B2 (en) | 1993-06-28 | 1993-06-28 | Insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15731393A JP3497525B2 (en) | 1993-06-28 | 1993-06-28 | Insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0721849A JPH0721849A (en) | 1995-01-24 |
| JP3497525B2 true JP3497525B2 (en) | 2004-02-16 |
Family
ID=15646957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15731393A Expired - Lifetime JP3497525B2 (en) | 1993-06-28 | 1993-06-28 | Insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3497525B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69932293T2 (en) | 1998-02-13 | 2007-07-05 | The Furukawa Electric Co., Ltd. | ISOLATED WIRE |
| JP2010031101A (en) * | 2008-07-28 | 2010-02-12 | Sumitomo Electric Wintec Inc | Polyamideimide resin coating and insulated electric wire using it |
-
1993
- 1993-06-28 JP JP15731393A patent/JP3497525B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0721849A (en) | 1995-01-24 |
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