JP3476685B2 - Adhesive sheet and method of using the same - Google Patents
Adhesive sheet and method of using the sameInfo
- Publication number
- JP3476685B2 JP3476685B2 JP23552298A JP23552298A JP3476685B2 JP 3476685 B2 JP3476685 B2 JP 3476685B2 JP 23552298 A JP23552298 A JP 23552298A JP 23552298 A JP23552298 A JP 23552298A JP 3476685 B2 JP3476685 B2 JP 3476685B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- pressure
- sensitive adhesive
- adhesive sheet
- shrinkable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Adhesive Tapes (AREA)
Description
【０００１】[0001]
【発明の技術分野】本発明は、粘着シートに関し、特
に、脆い被着体の保護あるいは一時的は固定に好ましく
用いられる粘着シートに関する。TECHNICAL FIELD The present invention relates to a pressure-sensitive adhesive sheet, and more particularly to a pressure-sensitive adhesive sheet which is preferably used for protecting or temporarily fixing a fragile adherend.
【０００２】[0002]
【発明の技術的背景】近年、ＩＣカードの普及が進み、
さらなる薄型化が望まれている。このため、従来は厚さ
が３５０μｍ程度であった半導体チップを、厚さ５０〜
１００μｍあるいはそれ以下まで薄くする必要が生じて
いる。BACKGROUND OF THE INVENTION In recent years, with the spread of IC cards,
Further thinning is desired. For this reason, the semiconductor chip which has been conventionally about 350 μm thick is
It is necessary to reduce the thickness to 100 μm or less.
【０００３】回路パターン形成後にウエハ裏面を研削す
ることは従来より行われていたが、ウエハをたとえば厚
さ１００μｍ以下にまで研削しようとすると、ウエハの
強度が低下し、破損しやすくなる。特に、ウエハは脆い
ため、ウエハ内に僅かでも欠陥があると、この欠陥に起
因してクラックが発生し、このクラックがウエハ全体に
大きく広がり、チップの歩留りを著しく低下させること
がある。It has been conventionally practiced to grind the back surface of a wafer after forming a circuit pattern. However, if the wafer is to be ground to a thickness of 100 μm or less, the strength of the wafer is lowered and the wafer is easily damaged. In particular, since the wafer is fragile, even if there is a slight defect in the wafer, a crack is generated due to the defect, the crack spreads over the entire wafer, and the yield of chips may be significantly reduced.
【０００４】上記のようなクラックの拡大によるウエハ
の損壊を防ぐため、特開平５−７４９３４号公報には、
以下の工程からなる薄型チップの形成方法が開示されて
いる。In order to prevent the damage of the wafer due to the expansion of cracks as described above, Japanese Patent Application Laid-Open No. 5-74934 discloses that
A method of forming a thin chip including the following steps is disclosed.
【０００５】第１工程：複数のチップを区画するための
ストリートに沿って所定の深さの溝をウエハ表面から削
成する。
第２工程：前記ウエハの表面全体を覆う状態に保護テー
プを接着する。First step: A groove having a predetermined depth is cut from the wafer surface along a street for partitioning a plurality of chips. Second step: A protective tape is adhered to cover the entire surface of the wafer.
【０００６】第３工程：前記溝の底部を除去するまで前
記ウエハの裏面を研削して個々のチップに分割する。
第４工程：研削された前記ウエハの裏面全体を覆う状態
に樹脂テープを接着する。Third step: the back surface of the wafer is ground to divide it into individual chips until the bottom of the groove is removed. Fourth step: A resin tape is adhered so as to cover the entire back surface of the ground wafer.
【０００７】第５工程：前記ウエハの表面に接着した保
護テープを除去する。
第６工程：前記ウエハの裏面に接着した樹脂テープを引
伸して、前記分割した個々のチップの間隔を拡げる。Fifth step: The protective tape adhered to the surface of the wafer is removed. Sixth step: The resin tape adhered to the back surface of the wafer is stretched to widen the intervals between the divided individual chips.
【０００８】そして、第６工程の後、チップのピックア
ップが行われる。このようなチップ形成方法によれば、
欠陥を起点にしてウエハ内に広がるクラックを溝で止め
ることができる。Then, after the sixth step, chip pickup is performed. According to such a chip forming method,
A crack can be used to stop a crack that spreads in the wafer starting from a defect.
【０００９】しかし、上記のような方法であっても、チ
ップを直接ピックアップするため、個々のチップのダメ
ージは低減できない。樹脂テープとして従来の紫外線硬
化型粘着テープを使用した場合であっても、吸引コレッ
トの吸引力のみでは、硬化後の粘着剤とチップとが気密
的に密着しているためピックアップが困難であり、やは
りニードル等による突き上げが必要となる。このため、
二ードルの突き上げ時にチップが損壊することがあり、
やはりチップの歩留りが低下してしまう。However, even with the method described above, since the chips are directly picked up, damage to individual chips cannot be reduced. Even when using a conventional UV-curable adhesive tape as the resin tape, only the suction force of the suction collet makes it difficult to pick up because the adhesive and the chip after curing are airtightly adhered, After all, pushing up with a needle or the like is necessary. For this reason,
The tip may be damaged when the needle is pushed up,
After all, the yield of chips will decrease.
【００１０】[0010]
【発明の目的】本発明は、上記のような従来技術に鑑み
てなされたものであって、極薄のＩＣチップを歩留りよ
く製造することが可能なプロセスに好適な粘着シート及
び該粘着シートを用いた信頼性の高い半導体の製造方法
を提供することを目的としている。DISCLOSURE OF THE INVENTION The present invention has been made in view of the above-mentioned conventional techniques, and a pressure-sensitive adhesive sheet suitable for a process capable of manufacturing an ultrathin IC chip with a high yield, and the pressure-sensitive adhesive sheet. It is an object of the present invention to provide a highly reliable semiconductor manufacturing method using the same.
【００１１】[0011]
【発明の概要】本発明に係る粘着シートは、第１のフィ
ルムと、この上に形成された収縮性の第２のフィルム
と、第２のフィルム上に形成された粘着剤層とからな
り、第２のフィルムに多数の微細な切込みが設けられて
いることを特徴としている。The pressure-sensitive adhesive sheet according to the present invention comprises a first film, a shrinkable second film formed thereon, and a pressure-sensitive adhesive layer formed on the second film. It is characterized in that the second film is provided with a large number of fine cuts.
【００１２】本発明においては、上記第１のフィルム
が、非収縮性フィルムからなることが好ましく、また上
記粘着剤層が、紫外線硬化型粘着剤からなることが好ま
しい。このような本発明に係る粘着シートによれば、各
種の被着体を一時的に固定した後、簡単な操作により、
容易に被着体を剥離することができ、たとえば上述した
ような極薄のＩＣチップを歩留りよく製造できる。In the present invention, the first film is preferably made of a non-shrinkable film, and the pressure-sensitive adhesive layer is preferably made of an ultraviolet curable pressure-sensitive adhesive. According to such an adhesive sheet of the present invention, after temporarily fixing various adherends, by a simple operation,
The adherend can be easily peeled off, and the ultrathin IC chip as described above can be manufactured with high yield.
【００１３】本発明に係る半導体の加工方法は、該粘着
シートを半導体ウエハの表面または裏面に貼付し、半導
体ウエハに所定の加工を施した後、収縮性フィルムを収
縮させて、該粘着シートと半導体ウエハとの接触面積を
低減し、剥離する工程からなることを特徴としている。According to the semiconductor processing method of the present invention, the pressure-sensitive adhesive sheet is attached to the front surface or the back surface of the semiconductor wafer, the semiconductor wafer is subjected to predetermined processing, and then the shrinkable film is shrunk to obtain the pressure-sensitive adhesive sheet. It is characterized by comprising a step of reducing the contact area with the semiconductor wafer and peeling.
【００１４】[0014]
【発明の具体的説明】以下、図面を参照しながら、本発
明についてさらに具体的に説明する。本発明に係る粘着
シート１０は、図１に示すように、基材１とこの上に形
成された粘着剤層４とからなり、基材１は、第１のフィ
ルム２と、収縮性の第２のフィルム３との積層体であ
り、第２のフィルム３に多数の微細な切込み５が設けら
れている。DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described more specifically with reference to the drawings. As shown in FIG. 1, a pressure-sensitive adhesive sheet 10 according to the present invention comprises a substrate 1 and a pressure-sensitive adhesive layer 4 formed thereon, and the substrate 1 comprises a first film 2 and a shrinkable first layer. The second film 3 has a large number of fine cuts 5 formed therein.
【００１５】フィルム２としては、特に限定されず、種
々の薄層品が用いられ、たとえば紙、金属箔、合成樹脂
フィルム等が用いられる。これらの中でも、本発明にお
いては、耐水性、耐熱性、伸縮性等の点から、合成樹脂
フィルムが好ましく用いられる。したがって、種々の汎
用樹脂フィルムの中でも、特に伸縮性に富み、伸張可能
なフィルムが好ましい。また、第１のフィルム２として
は、後述する収縮性フィルム３よりも収縮性の少ないフ
ィルムが好ましく用いられる。このような非収縮性フィ
ルムとしては、具体的には、ポリエチレンフィルム、ポ
リプロピレンフィルム、ポリブテンフィルム、ポリメチ
ルペンテンフィルム等のポリオレフィンフィルム；ポリ
塩化ビニルフィルム、ポリエチレンテレフタレートフィ
ルム、ポリブチレンテレフタレートフィルム、ポリブタ
ジエンフィルム、ポリウレタンフィルム、エチレン酢ビ
フィルム、エチレン（メタ）アクリル酸共重合体フィル
ム、エチレン（メタ）アクリル酸エステル共重合体フィ
ルムなどが用いられる。The film 2 is not particularly limited, and various thin layer products are used, such as paper, metal foil, synthetic resin film and the like. Among these, in the present invention, a synthetic resin film is preferably used in terms of water resistance, heat resistance, stretchability, and the like. Therefore, among various general-purpose resin films, a film which is particularly rich in elasticity and stretchable is preferable. Further, as the first film 2, a film having less shrinkage than the shrinkable film 3 described later is preferably used. Specific examples of such non-shrinkable film include polyolefin films such as polyethylene film, polypropylene film, polybutene film, and polymethylpentene film; polyvinyl chloride film, polyethylene terephthalate film, polybutylene terephthalate film, polybutadiene film, Polyurethane film, ethylene vinyl acetate film, ethylene (meth) acrylic acid copolymer film, ethylene (meth) acrylic acid ester copolymer film and the like are used.
【００１６】フィルム２として用いられる非収縮性フィ
ルムは、通常、その収縮率が１０％未満のフィルムであ
る。なお、ここでフィルムの収縮率は、収縮前の寸法と
収縮後の寸法とから、下記の数式に基づき算出する。The non-shrinkable film used as the film 2 is usually a film having a shrinkage rate of less than 10%. Here, the shrinkage rate of the film is calculated from the dimension before shrinkage and the dimension after shrinkage based on the following mathematical formula.
【００１７】[0017]
【数１】 [Equation 1]
【００１８】上記収縮率は、フィルムを１２０℃に加熱
した前後の寸法に基づいて算出される。上記のような非
収縮性フィルムの厚さは、通常５〜３００μｍであり、
好ましくは１０〜２００μｍである。なお、フィルム２
は、上記した各種フィルムの単層品であってもよく積層
品であってもよい。The shrinkage ratio is calculated based on the dimensions before and after the film is heated to 120.degree. The thickness of the non-shrinkable film as described above is usually 5 to 300 μm,
It is preferably 10 to 200 μm. In addition, film 2
May be a single-layer product or a laminated product of the various films described above.
【００１９】本発明の粘着シートをダイシングテープや
樹脂テープとして使用する場合、用いられる第１のフィ
ルムとしては、２３℃における弾性率が１×１０9Ｎ／m
2未満、好ましくは１×１０7〜１×１０9Ｎ／m2の範囲
にあるものが望ましい。弾性率がこの範囲であれば、ピ
ックアップの際に粘着シートをエキスパンドする工程が
あっても問題なく使用できる。When the pressure-sensitive adhesive sheet of the present invention is used as a dicing tape or a resin tape, the first film used has an elastic modulus at 23 ° C. of 1 × 10 9 N / m.
It is preferably less than 2 , preferably in the range of 1 × 10 7 to 1 × 10 9 N / m 2 . When the elastic modulus is within this range, it can be used without problems even if there is a step of expanding the pressure-sensitive adhesive sheet during pickup.
【００２０】収縮性フィルム３としては、何ら限定され
るものではないが、主として熱収縮性フィルムが用いら
れる。本発明で用いられる収縮性フィルム３の収縮率は
１０〜９０％が好ましく、さらに好ましくは２０〜８０
％である。The shrinkable film 3 is not particularly limited, but a heat shrinkable film is mainly used. The shrinkage rate of the shrinkable film 3 used in the present invention is preferably 10 to 90%, more preferably 20 to 80.
%.
【００２１】上記のような収縮性フィルム３としては、
従来、種々のものが知られているが、本発明において
は、一般に被着体にイオン汚染等の悪影響を与えないも
のであればいかなるものでも用いることができる。具体
的には、ポリエチレンテレフタレート、ポリエチレン、
ポリスチレン、ポリプロピレン、ナイロン、ウレタン、
ポリ塩化ビニリデン、ポリ塩化ビニルなどの二軸延伸フ
ィルム等を例示することができる。As the shrinkable film 3 as described above,
Conventionally, various types are known, but in the present invention, any type can be used as long as it does not adversely affect the adherend such as ion contamination. Specifically, polyethylene terephthalate, polyethylene,
Polystyrene, polypropylene, nylon, urethane,
Examples thereof include biaxially stretched films of polyvinylidene chloride, polyvinyl chloride and the like.
【００２２】なお、収縮性フィルムと非収縮性フィルム
との違いは、その収縮率が異なる点にある。たとえば、
ポリエチレンフィルムを製造する際に、その製造条件等
を適宜設定することにより、収縮率の異なる二種のポリ
エチレンフィルムを製造することが可能である。The difference between the shrinkable film and the non-shrinkable film is that the shrinkage ratio is different. For example,
When a polyethylene film is manufactured, it is possible to manufacture two kinds of polyethylene films having different shrinkage rates by appropriately setting the manufacturing conditions and the like.
【００２３】上記のような収縮性フィルム３の厚さは、
通常５〜３００μｍであり、好ましくは１０〜２００μ
ｍである。収縮性フィルム３としては、特に熱収縮性の
ポリエチレン、ポリプロピレン、ポリエチレンテレフタ
レート等のフィルムを用いることが好ましい。The thickness of the shrinkable film 3 as described above is
Usually 5 to 300 μm, preferably 10 to 200 μm
m. As the shrinkable film 3, it is particularly preferable to use a film of heat shrinkable polyethylene, polypropylene, polyethylene terephthalate or the like.
【００２４】収縮性フィルム３は、上記した各種収縮性
フィルムの単層品であってもよく積層品であってもよ
い。上記基材１においては、収縮性フィルム３に多数の
微細な切込み５が設けられている。切込み５は、収縮性
フィルム３の略全厚に至るように設けられており、さら
に界面を越えて一部フィルム２にまで及んでいてもよい
が、好ましくは収縮性フィルム３の厚さに略等しい。The shrinkable film 3 may be a single layer product or a laminated product of the various shrinkable films described above. In the base material 1, a large number of fine cuts 5 are provided in the shrinkable film 3. The notch 5 is provided so as to reach substantially the entire thickness of the shrinkable film 3, and may extend beyond the interface to a part of the film 2, but preferably the thickness of the shrinkable film 3 is substantially the same. equal.
【００２５】切込み５の間隔（切込みピッチ）は、剥離
される個々の被着体６の大きさに応じて決定され、好ま
しくは被着体６の底面の最大長の０．０１〜２倍、より
好ましくは０．１〜１倍のピッチで設けられる。または
切込み５がピッチで０．１〜２０mm、より好ましくは１
〜１０mmであればよい。The interval between the notches 5 (notch pitch) is determined according to the size of each adherend 6 to be peeled off, and is preferably 0.01 to 2 times the maximum length of the bottom surface of the adherend 6, More preferably, they are provided at a pitch of 0.1 to 1 times. Or, the notch 5 has a pitch of 0.1 to 20 mm, more preferably 1
It may be 10 mm.
【００２６】切込み５の形状は、特に限定はされず、た
とえば格子状、同心円状、放射線状、あるいはこれらを
組み合わせたパターン状であってもよく、またランダム
に形成されていてもよい。また、切込み５は、粘着シー
ト全面にわたって形成してもよいが、特開平５−７４９
３４号公報記載の樹脂テープとして使用する場合は、貼
付するウエハと略同等の円形の内側にだけ切込み５を設
け外周部に切込み５を設けない形状としても良い。この
ような粘着シートの切込み形成部に、ウエハを一致させ
て貼れば、切込みを形成していない部分の収縮により、
シートのエキスパンドを行なうことなく、チップ間隔を
拡げることができる。The shape of the notches 5 is not particularly limited and may be, for example, a lattice shape, a concentric circle shape, a radial shape, or a pattern shape in which these are combined, or may be randomly formed. The cut 5 may be formed over the entire surface of the pressure-sensitive adhesive sheet.
When used as the resin tape described in JP-A No. 34-34, the shape may be such that the notch 5 is provided only inside the circular shape which is substantially the same as the wafer to be stuck and the notch 5 is not provided at the outer peripheral portion. If the wafer is aligned and stuck to the notch forming portion of such an adhesive sheet, contraction of the portion not having the notch causes
The chip interval can be expanded without expanding the sheet.
【００２７】フィルム２と収縮性フィルム３とは、ドラ
イラミネート等により直接積層されていてもよく、ま
た、接着剤等を介して積層してもよい。上記において、
フィルムの接合に用いられる接着剤としては、特に制限
されることなく、従来より汎用の接着剤が用いられ、ア
クリル系、ゴム系、シリコーン系などの粘着剤、ポリエ
ステル系、ポリアミド系、エチレン共重合体系、エポキ
シ系、ウレタン系等の熱可塑性または熱硬化性の接着剤
が挙げられる。特に粘着剤や、収縮性フィルムを収縮さ
せる温度での弾性率が１０9dyn/cm2以下の熱可塑性接着
剤を接着剤層として用いれば、収縮性フィルムが薄い場
合であっても、第１のフィルムによって収縮を拘束され
にくいので好ましい。The film 2 and the shrinkable film 3 may be directly laminated by dry lamination or the like, or may be laminated with an adhesive or the like. In the above,
The adhesive used for joining the films is not particularly limited, and a general-purpose adhesive is conventionally used, such as an acrylic-based, rubber-based or silicone-based adhesive, polyester-based, polyamide-based, ethylene copolymer Examples thereof include thermoplastic or thermosetting adhesives such as system-based, epoxy-based and urethane-based adhesives. In particular, when a pressure-sensitive adhesive or a thermoplastic adhesive having an elastic modulus at the temperature of shrinking the shrinkable film of 10 9 dyn / cm 2 or less is used as the adhesive layer, even if the shrinkable film is thin, It is preferable that the shrinkage is not restrained by the film.
【００２８】また収縮性フィルム３の上面、すなわち粘
着剤層４が設けられる側の面には粘着剤との密着性を向
上するために、コロナ処理を施したりプライマー等の他
の層を設けてもよい。On the upper surface of the shrinkable film 3, that is, the surface on which the pressure-sensitive adhesive layer 4 is provided, corona treatment or another layer such as a primer is provided in order to improve the adhesion with the pressure-sensitive adhesive. Good.
【００２９】基材１は、上記のような第１のフィルム２
および第２の収縮性フィルム３を積層した後、収縮性フ
ィルム３に切込み５を設けることで製造される。切込み
５を設ける手段は特に限定はされないが、たとえば所定
高さの刃を備えたローラー状の抜き型により連続的に行
われる。The substrate 1 is the first film 2 as described above.
After laminating the second shrinkable film 3 and the shrinkable film 3, a cut 5 is provided in the shrinkable film 3. The means for providing the cut 5 is not particularly limited, but it is continuously performed by, for example, a roller-shaped cutting die having a blade of a predetermined height.
【００３０】なお、本発明の粘着シートを使用する場合
に、後述するように、第２のフィルム３の収縮の前また
は後に、粘着剤層４に紫外線を照射することがあるが、
この場合には、基材１を構成する全フィルムは透明であ
る必要がある。When the pressure-sensitive adhesive sheet of the present invention is used, the pressure-sensitive adhesive layer 4 may be irradiated with ultraviolet rays before or after the contraction of the second film 3, as described later.
In this case, all the films constituting the base material 1 need to be transparent.
【００３１】本発明に係る粘着シート１０は、図１に示
すように、上記基材１の第２のフィルム３上に粘着剤層
４が形成されてなる。粘着シート１０の粘着剤層４は、
従来より公知の種々の感圧性粘着剤により形成され得
る。このような粘着剤としては、何ら限定されるもので
はないが、たとえばゴム系、アクリル系、シリコーン
系、ポリビニルエーテル等の粘着剤が用いられる。ま
た、放射線硬化型や加熱発泡型の粘着剤も用いることが
できる。As shown in FIG. 1, the pressure-sensitive adhesive sheet 10 according to the present invention has a pressure-sensitive adhesive layer 4 formed on the second film 3 of the substrate 1. The adhesive layer 4 of the adhesive sheet 10 is
It can be formed by various conventionally known pressure-sensitive adhesives. The pressure-sensitive adhesive is not particularly limited, but rubber-based, acrylic-based, silicone-based, polyvinyl ether, and other pressure-sensitive adhesives are used. Further, a radiation-curable or heat-foaming type adhesive can also be used.
【００３２】粘着剤層４の厚さは、その材質にもよる
が、通常は３〜１００μｍ程度であり、好ましくは１０
〜５０μｍ程度である。上記のような粘着剤としては、
種々の粘着剤が特に制限されることなく用いられる。放
射線硬化（光硬化、紫外線硬化、電子線硬化）型粘着剤
としては、たとえば、特公平１−５６１１２号公報、特
開平７−１３５１８９号公報等に記載のものが好ましく
使用されるがこれらに限定されることはない。しかしな
がら、本発明においては、特に紫外線硬化型粘着剤を用
いることが好ましい。The thickness of the pressure-sensitive adhesive layer 4, which depends on its material, is usually about 3 to 100 μm, preferably 10 μm.
It is about 50 μm. As the above-mentioned adhesive,
Various adhesives can be used without particular limitation. As the radiation-curable (photo-curable, ultraviolet-curable, electron-beam curable) type pressure-sensitive adhesive, for example, those described in Japanese Patent Publication No. 1-56112 and Japanese Patent Application Laid-Open No. 7-135189 are preferably used, but are not limited thereto. It will not be done. However, in the present invention, it is particularly preferable to use an ultraviolet curable adhesive.
【００３３】粘着剤層４は、切込み５を設けた後に収縮
性フィルム３上に形成することが好ましいが、粘着剤層
４を形成した後に、例えばダイシング装置等により粘着
剤層４ごと収縮性フィルム３に切込み５を設けてもよ
い。この場合、粘着シート１０に紫外線硬化型粘着剤を
使用して被着体６に貼付するには、窒素等の不活性気体
中で行なうのが好ましい。このようにすれば、切込み５
に存在する酸素による粘着剤の硬化不良が阻止される。The pressure-sensitive adhesive layer 4 is preferably formed on the shrinkable film 3 after the cuts 5 are provided, but after the pressure-sensitive adhesive layer 4 is formed, the pressure-sensitive adhesive film 4 together with the pressure-sensitive adhesive layer 4 is formed by, for example, a dicing device. You may provide the notch 5 in 3. In this case, when the adhesive sheet 10 is attached to the adherend 6 by using the ultraviolet curable adhesive, it is preferably carried out in an inert gas such as nitrogen. If you do this, cut 5
The curing failure of the pressure-sensitive adhesive due to the oxygen existing in is prevented.
【００３４】このような、本発明に係る粘着シート１０
は、半導体チップ等の微小な被着体６の表面保護や、加
工の際の一時的な固定手段として好適に用いられる。す
なわち、図２に示すように、被着体６の保護すべき表面
を粘着シート１０に貼付して表面保護を行うか、または
被着体６の加工を施すべき面が、上側に位置するように
被着体６を粘着シート１０に貼付して所定の表面保護ま
たは加工を行う。次いで、図３に示すように、加熱等の
手段で、収縮性フィルム３を収縮させると、これに同伴
して粘着剤層４が変形し、被着体６との接触面積が減少
し、接着力が低下する。この結果、被着体６をニードル
などの手段を用いることなく、容易に剥離できる。特に
粘着剤層４として、紫外線硬化型粘着剤を用いると、紫
外線照射によって接着力が激減するため、薄型ＩＣチッ
プのような脆い被着体であっても容易にピックアップで
きる。The pressure-sensitive adhesive sheet 10 according to the present invention as described above.
Is preferably used as a surface protection for a minute adherend 6 such as a semiconductor chip, or as a temporary fixing means during processing. That is, as shown in FIG. 2, the surface of the adherend 6 to be protected is attached to the pressure-sensitive adhesive sheet 10 for surface protection, or the surface of the adherend 6 to be processed is positioned on the upper side. Then, the adherend 6 is attached to the pressure-sensitive adhesive sheet 10 to perform predetermined surface protection or processing. Next, as shown in FIG. 3, when the shrinkable film 3 is shrunk by heating or the like, the pressure-sensitive adhesive layer 4 is deformed accompanying it and the contact area with the adherend 6 is reduced, resulting in adhesion. The power decreases. As a result, the adherend 6 can be easily peeled off without using a means such as a needle. In particular, when an ultraviolet curable adhesive is used as the adhesive layer 4, the adhesive force is drastically reduced by the irradiation of ultraviolet rays, so that even a fragile adherend such as a thin IC chip can be easily picked up.
【００３５】すなわち、本発明に係る半導体の加工方法
は、上記粘着シート１０を半導体ウエハの表面または裏
面に貼付し、半導体ウエハに所定の加工を施した後、収
縮性フィルム３を収縮させて、該粘着シート１０と半導
体ウエハとの接触面積を低減し、剥離する工程からなる
ことを特徴としている。That is, in the semiconductor processing method according to the present invention, the adhesive sheet 10 is attached to the front surface or the back surface of the semiconductor wafer, the semiconductor wafer is subjected to predetermined processing, and then the shrinkable film 3 is shrunk. It is characterized by comprising a step of reducing the contact area between the pressure-sensitive adhesive sheet 10 and the semiconductor wafer and peeling it off.
【００３６】ここで、所定の加工とは、たとえば、ウエ
ハ（チップ）の裏面研削ならびに表面保護、転写、ダイ
シング時の固定などが挙げられる。本発明に係る粘着シ
ート１０を、ウエハ（チップ）の裏面研削ならびに表面
保護に用いる場合には、以下のような工程を採用でき
る。Here, the predetermined processing includes, for example, back surface grinding and surface protection of a wafer (chip), transfer, fixing during dicing, and the like. When the pressure-sensitive adhesive sheet 10 according to the present invention is used for back surface grinding and surface protection of a wafer (chip), the following steps can be adopted.
【００３７】第１工程：複数のチップを区画するための
ストリートに沿って所定の深さの溝７をウエハ８表面か
ら削成する（図４参照）。
第２工程：前記ウエハの表面全体を覆う状態に本発明の
粘着シート１０を接着する（図５参照）。First step: Grooves 7 having a predetermined depth are cut from the surface of the wafer 8 along the streets for partitioning a plurality of chips (see FIG. 4). Second step: The pressure-sensitive adhesive sheet 10 of the present invention is adhered so as to cover the entire surface of the wafer (see FIG. 5).
【００３８】第３工程：前記溝７の底部を除去し、所定
の厚さになるまでウエハの裏面を研削して個々のチップ
９に分割する（図６参照）。
第４工程：粘着シートを加熱し、収縮性フィルム３を収
縮させる。この結果、チップ９と粘着剤層４との接触面
積が減少し、容易にチップ９を剥離できるようになる
（図７参照）。この際、粘着剤層４を紫外線硬化型粘着
剤から形成した場合には、紫外線照射を行うと、接着力
をさらに低減できる。Third step: The bottom of the groove 7 is removed, and the back surface of the wafer is ground to a predetermined thickness to divide it into individual chips 9 (see FIG. 6). Fourth step: the pressure-sensitive adhesive sheet is heated to shrink the shrinkable film 3. As a result, the contact area between the chip 9 and the adhesive layer 4 is reduced, and the chip 9 can be easily peeled off (see FIG. 7). At this time, when the pressure-sensitive adhesive layer 4 is formed of a UV-curable pressure-sensitive adhesive, irradiation with UV light can further reduce the adhesive strength.
【００３９】第５工程：必要に応じ、粘着シート１０を
延伸し、チップ間隔を拡げた後、分割した個々のチップ
をピックアップ（図８参照）し、所定の基体上にマウン
トする。Fifth step: If necessary, the pressure-sensitive adhesive sheet 10 is stretched to widen the chip interval, and then the divided individual chips are picked up (see FIG. 8) and mounted on a predetermined substrate.
【００４０】このようなプロセスによれば、薄型ＩＣチ
ップを歩留りよく、容易に製造することができる。According to such a process, thin IC chips can be easily manufactured with high yield.
【００４１】[0041]
【発明の効果】以上説明してきたように、本発明に係る
粘着シートによれば、各種の被着体を一時的に固定した
後、簡単な操作により、容易に被着体を剥離することが
でき、たとえば上述したような極薄のＩＣチップを歩留
りよく製造できる。As described above, according to the pressure-sensitive adhesive sheet of the present invention, various adherends can be temporarily fixed and then easily peeled off by a simple operation. Therefore, the ultrathin IC chip as described above can be manufactured with a high yield.
【００４２】[0042]
【実施例】以下本発明を実施例により説明するが、本発
明はこれら実施例に限定されるものではない。EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.
【００４３】なお、以下の実施例および比較例において
は、垂直剥離力は次のようにして測定した。
〔評価方法〕（研磨用保護テープとしての使用）
直径６インチ、厚み７００μｍのシリコンウエハをダイ
シングシート（AdwillD-628、リンテック社製）に貼付
し、３５μｍ厚のブレードで、切込み量４００μｍ、チ
ップサイズ１０mm□の条件で溝を形成した。次いで、実
施例および比較例で製造した粘着シートに転写し、ダイ
シングシートを剥離した後、厚さ８０μｍになるまでグ
ラインドを行なった。In the following examples and comparative examples, the vertical peeling force was measured as follows. [Evaluation method] (Use as a protective tape for polishing) A silicon wafer having a diameter of 6 inches and a thickness of 700 μm is attached to a dicing sheet (Adwill D-628, manufactured by Lintec Co., Ltd.), a blade having a thickness of 35 μm is used to cut a depth of 400 μm and a chip size. Grooves were formed under the condition of 10 mm □. Then, it was transferred to the pressure-sensitive adhesive sheets produced in Examples and Comparative Examples, the dicing sheet was peeled off, and then grinding was performed until the thickness became 80 μm.
【００４４】グラインド後、紫外線硬化型粘着剤を用い
た場合（実施例１〜５、７および比較例１、２）におい
ては、紫外線照射（光量１３５ｍＪ／cm2）を行った。
なお、実施例６および比較例３では、紫外線照射を行な
わずに次の工程に移行した。After the grinding, in the case where an ultraviolet-curable pressure-sensitive adhesive was used (Examples 1 to 5 and 7 and Comparative Examples 1 and 2), ultraviolet irradiation (light amount 135 mJ / cm 2 ) was performed.
In addition, in Example 6 and Comparative Example 3, the process proceeded to the next step without performing the ultraviolet irradiation.
【００４５】次いで、収縮性フィルムを１１０℃で３０
秒加熱収縮させた後、各チップの上部に、エポキシ系接
着剤にてフックを取付け、万能引張試験機を用いて剥離
強度を測定する（剥離スピード７００mm／分）。
〔評価方法〕（転写テープとしての使用）
直径６インチ、厚み７００μｍのシリコンウエハをダイ
シングシート（AdwillD-628、リンテック社製）に貼付
し、３５μｍ厚のブレードで、切込み量４００μｍ、チ
ップサイズ１０mm□の条件で溝を形成した。次いで、ダ
イシングシートとは反対面に研磨用保護シート（Adwill
E-6142S、リンテック社製）を貼付し、ダイシングシー
トを紫外線照射して剥離し、８０μｍになるまでグライ
ンドを行なった。The shrinkable film is then heated at 110 ° C. for 30 minutes.
After heat-shrinking for 2 seconds, a hook is attached to the top of each chip with an epoxy adhesive and the peel strength is measured using a universal tensile tester (peel speed 700 mm / min). [Evaluation Method] (Use as Transfer Tape) A silicon wafer having a diameter of 6 inches and a thickness of 700 μm is attached to a dicing sheet (Adwill D-628, manufactured by Lintec Co., Ltd.), a blade having a thickness of 35 μm is used to cut 400 μm, and a chip size is 10 mm □. The groove was formed under the condition of. Then, on the side opposite to the dicing sheet, a protective sheet for polishing (Adwill
E-6142S, manufactured by Lintec Co., Ltd.) was attached, the dicing sheet was irradiated with ultraviolet rays to be peeled off, and grinded to a thickness of 80 μm.
【００４６】続いて、実施例および比較例で製造した粘
着シートを、研磨用保護シートとは反対面に貼付し、研
磨用保護シートに紫外線を照射して剥離した。次いで、
紫外線硬化型粘着剤を用いた場合（実施例１〜５、７お
よび比較例１、２）においては、紫外線照射（光量１３
５ｍＪ／cm2）を行った。なお、実施例６および比較例
３では、紫外線照射を行なわずに次の工程に移行した。Subsequently, the pressure-sensitive adhesive sheets produced in Examples and Comparative Examples were attached to the surface opposite to the polishing protective sheet, and the polishing protective sheet was irradiated with ultraviolet rays to be peeled off. Then
In the case where the UV-curable pressure-sensitive adhesive was used (Examples 1 to 5, 7 and Comparative Examples 1 and 2), UV irradiation (light amount 13
5 mJ / cm 2 ) was performed. In addition, in Example 6 and Comparative Example 3, the process proceeded to the next step without performing the ultraviolet irradiation.
【００４７】次いで、収縮性フィルムを１１０℃で３０
秒加熱収縮させた後、各チップの上部に、エポキシ系接
着剤にてフックを取付け、万能引張試験機を用いて剥離
強度を測定する（剥離スピード７００mm／分）。Then, the shrinkable film is heated at 110 ° C. for 30 minutes.
After heat-shrinking for 2 seconds, a hook is attached to the top of each chip with an epoxy adhesive and the peel strength is measured using a universal tensile tester (peel speed 700 mm / min).
【００４８】[0048]
【実施例１】図９に示される構成の粘着シート２０を以
下のようにして調製した。
1-〔粘着剤２４の製造〕
アクリル系粘着剤（n-ブチルアクリラートとアクリル酸
との共重合体）１００重量部と、分子量７０００のウレ
タンアクリラートオリゴマー２００重量部と、架橋剤
（イソシアナート系）１０重量部と、紫外線硬化型反応
開始剤（ベンゾフェノン系）１０重量部とを混合し、粘
着剤組成物を作成した。
1-〔フィルム貼合用の接着剤２６〕
フィルム貼合用接着剤としてポリウレタン系接着剤（弾
性率＝３．０×１０8Ｎ／ｍ2）を用いた。
1-〔第１のフィルム２２と第２のフィルム２３との積
層〕
1-の接着剤をエチレン−メタクリル酸共重合体フィル
ム（第１のフィルム、厚さ１００μｍ、弾性率２．１５
×１０8Ｎ／ｍ2）上に厚さ５μｍとなるように塗布し、
１００℃で３０秒間加熱した。次いで、熱収縮性ポリエ
チレンテレフタレートフィルム（収縮性の第２のフィル
ム、厚さ３０μｍ、１２０℃における収縮率が５０％）
を、該エチレン−メタクリル酸共重合体フィルム上の接
着剤層に貼合し、収縮性の第２のフィルム２３と第１の
フィルム２２との積層体を作成した。
1-〔切込み２５の付与〕
1-で得た積層体の収縮性の第２のフィルム２３の側
に、ローラ状の抜き型で、１５５mmφの範囲に切込み深
さ３０μｍ、５mmのピッチで碁盤目状に切込みを設け
た。
1-〔粘着シート２０の製造〕
上記1-で得られた粘着剤組成物を、剥離処理された厚
さ２５μｍのポリエチレンテレフタレートフィルム上に
厚さ１０μｍとなるように塗布し、１００℃で１分間乾
燥した。次いで1-で得られた積層体（切込み作成済）
の収縮性フィルムの側に貼り合わせ、切込み部分を中心
として、２０７mmφの円形に型抜きして、図９に示す構
成の紫外線硬化粘着型の粘着シート２０を作成した。Example 1 A pressure-sensitive adhesive sheet 20 having the structure shown in FIG. 9 was prepared as follows. 1- [Production of Adhesive 24] 100 parts by weight of acrylic adhesive (copolymer of n-butyl acrylate and acrylic acid), 200 parts by weight of urethane acrylate oligomer having a molecular weight of 7,000, and crosslinking agent (isocyanate) System) and 10 parts by weight of a UV-curable reaction initiator (benzophenone series) were mixed to prepare a pressure-sensitive adhesive composition. 1- [Adhesive for Film Lamination 26] As a film laminating adhesive, a polyurethane-based adhesive (elastic modulus = 3.0 × 10 8 N / m 2 ) was used. 1- [Lamination of the first film 22 and the second film 23] The adhesive of 1-is used as an ethylene-methacrylic acid copolymer film (first film, thickness 100 μm, elastic modulus 2.15).
X 10 8 N / m 2 ) to a thickness of 5 μm,
Heated at 100 ° C. for 30 seconds. Next, heat-shrinkable polyethylene terephthalate film (shrinkable second film, thickness 30 μm, shrinkage rate at 120 ° C. is 50%)
Was bonded to the adhesive layer on the ethylene-methacrylic acid copolymer film to prepare a laminate of the shrinkable second film 23 and the first film 22. 1- [Applying Cuts 25] A roller-shaped die is provided on the side of the shrinkable second film 23 of the laminate obtained in 1-with a cutting depth of 30 μm and a pitch of 5 mm in a range of 155 mmφ. A notch was made in the shape. 1- [Production of Adhesive Sheet 20] The adhesive composition obtained in 1-is applied onto a release-treated polyethylene terephthalate film having a thickness of 25 μm so as to have a thickness of 10 μm, and at 100 ° C. for 1 minute Dried. Next, the laminated body obtained in 1- (cutting completed)
It was attached to the side of the shrinkable film, and punched out into a circular shape of 207 mmφ centering on the notched portion to prepare an ultraviolet-curing adhesive type pressure-sensitive adhesive sheet 20 having the configuration shown in FIG.
【００４９】得られた粘着シートを用いて上記のように
して垂直剥離力を測定した。結果を表１に示す。The vertical peeling force was measured as described above using the obtained pressure-sensitive adhesive sheet. The results are shown in Table 1.
【００５０】[0050]
【実施例２】1-において、１５５mmφの範囲に切込み
深さ３０μｍ、２mmのピッチで碁盤目状に切込みを設け
た以外は、実施例１と同様にして粘着シートを作成し
た。結果を表１に示す。[Example 2] In 1-, a pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the cut depth was 30 µm in the range of 155 mmφ and the cuts were formed in a grid pattern at a pitch of 2 mm. The results are shown in Table 1.
【００５１】[0051]
【実施例３】1-で得られた粘着剤組成物を、剥離処理
された厚さ２５μｍのポリエチレンテレフタレートフィ
ルム上に厚さ１０μｍとなるように塗布し、１００℃で
１分間乾燥した。次いで1-で得られた積層体（切込み
作成前）の収縮性の第２のフィルムの側に貼り合わせて
粘着シートを作成した。次いで、粘着シートの粘着剤層
２４および収縮性の第２のフィルム２３に、ローラ状の
抜き型で、１５５mmφの範囲に切込み深さ４０μｍ、５
mmのピッチで碁盤目状に切込みを設け、図１０に示す構
成の粘着シート３０を作成した。結果を表１に示す。Example 3 The pressure-sensitive adhesive composition obtained in 1- was coated on a release-treated 25 μm-thick polyethylene terephthalate film to a thickness of 10 μm, and dried at 100 ° C. for 1 minute. Then, the pressure-sensitive adhesive sheet was prepared by laminating the laminate obtained in 1- (before making cuts) to the shrinkable second film side. Then, the adhesive layer 24 and the shrinkable second film 23 of the adhesive sheet are cut into a range of 155 mmφ by a roller-shaped punching die with a depth of 40 μm, 5
Cuts were made in a grid pattern at a pitch of mm to prepare an adhesive sheet 30 having the structure shown in FIG. The results are shown in Table 1.
【００５２】[0052]
【実施例４】1-において、第１のフィルムをエチレン
−メタクリル酸共重合体フィルムに代えて、ポリエチレ
ンテレフタレートフィルム（厚さ１００μｍ、弾性率
５．３×１０9Ｎ／ｍ2）を用いた以外は、実施例１と同
様にして粘着シートを作成した。結果を表１に示す。Example 4 In 1-, a polyethylene terephthalate film (thickness 100 μm, elastic modulus 5.3 × 10 9 N / m 2 ) was used in place of the ethylene-methacrylic acid copolymer film as the first film. A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except for the above. The results are shown in Table 1.
【００５３】[0053]
【実施例５】収縮性の第２のフィルムを、熱収縮性ポリ
エチレンフィルム（厚さ３０μｍ、１２０℃における収
縮率が３０％）に替えた以外は、実施例１と同様にして
粘着シートを作成した。結果を表１に示す。Example 5 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the heat-shrinkable polyethylene film (thickness: 30 μm, shrinkage at 120 ° C .: 30%) was used as the shrinkable second film. did. The results are shown in Table 1.
【００５４】[0054]
【実施例６】粘着剤２４を、再剥離性アクリル系粘着剤
（n-ブチルアクリレートと2-ヒドロキシエチルアクリレ
ートとの共重合体）１００重量部と架橋剤（イソシアナ
ート系）１０重量部からなる組成物に替えた以外は、実
施例１と同様にして粘着シートを作成した。結果を表１
に示す。[Embodiment 6] The pressure-sensitive adhesive 24 is composed of 100 parts by weight of a removable acrylic pressure-sensitive adhesive (copolymer of n-butyl acrylate and 2-hydroxyethyl acrylate) and 10 parts by weight of a crosslinking agent (isocyanate type). A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the composition was changed. The results are shown in Table 1.
Shown in.
【００５５】[0055]
【実施例７】第１のフィルムをエチレン−メタクリル酸
共重合体フィルムに替えて、熱収縮性ポリエチレンテレ
フタレートフィルム（厚さ３０μｍ、１２０℃における
収縮率が５０％）を用い基材を２層の収縮性フィルムと
した以外は、実施例１と同様にして粘着シートを作成し
た。結果を表１に示す。Example 7 The first film was replaced with an ethylene-methacrylic acid copolymer film, and a heat-shrinkable polyethylene terephthalate film (thickness: 30 μm, shrinkage rate at 120 ° C .: 50%) was used as a base material having two layers. A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the shrinkable film was used. The results are shown in Table 1.
【００５６】[0056]
【比較例１】実施例１において、基材として厚さ１００
μｍ、弾性率が２．１５×１０8Ｎ／ｍ2のエチレン−メ
タクリル酸共重合体フィルムのみからなる基材を用いた
以外は、実施例１と同様にして粘着シートを作成した。
結果を表１に示す。[Comparative Example 1] In Example 1, the thickness of the base material was 100.
A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that a substrate consisting of an ethylene-methacrylic acid copolymer film having a μm and an elastic modulus of 2.15 × 10 8 N / m 2 was used.
The results are shown in Table 1.
【００５７】[0057]
【比較例２】実施例１において、基材として厚さ１００
μｍ、弾性率が５．３×１０9Ｎ／ｍ2のポリエチレンテ
レフタレートフィルムのみからなる基材を用いた以外
は、実施例１と同様にして粘着シートを作成した。結果
を表１に示す。[Comparative Example 2] In Example 1, the thickness of the base material was 100.
A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that a substrate consisting of a polyethylene terephthalate film having a μm and an elastic modulus of 5.3 × 10 9 N / m 2 was used. The results are shown in Table 1.
【００５８】[0058]
【比較例３】実施例６において、基材として厚さ１００
μｍ、弾性率が５．３×１０9Ｎ／ｍ2のポリエチレンテ
レフタレートフィルムのみからなる基材を用いた以外
は、実施例６と同様にして粘着シートを作成した。結果
を表１に示す。[Comparative Example 3] In Example 6, a substrate having a thickness of 100 was used.
A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 6 except that a substrate consisting of a polyethylene terephthalate film having a μm and an elastic modulus of 5.3 × 10 9 N / m 2 was used. The results are shown in Table 1.
【００５９】[0059]
【表１】 [Table 1]
【図１】本発明に係る粘着シートの断面図を示す。FIG. 1 shows a sectional view of an adhesive sheet according to the present invention.
【図２】本発明に係る粘着シートに被着体を貼付した状
態を示す。FIG. 2 shows a state in which an adherend is attached to the pressure-sensitive adhesive sheet according to the present invention.
【図３】本発明に係る粘着シートからの被着体の剥離方
法を示す。FIG. 3 shows a method for peeling an adherend from an adhesive sheet according to the present invention.
【図４】本発明に係る粘着シートを用いた薄型ＩＣチッ
プの製造工程を示す。FIG. 4 shows a manufacturing process of a thin IC chip using the adhesive sheet according to the present invention.
【図５】本発明に係る粘着シートを用いた薄型ＩＣチッ
プの製造工程を示す。FIG. 5 shows a manufacturing process of a thin IC chip using the adhesive sheet according to the present invention.
【図６】本発明に係る粘着シートを用いた薄型ＩＣチッ
プの製造工程を示す。FIG. 6 shows a manufacturing process of a thin IC chip using the adhesive sheet according to the present invention.
【図７】本発明に係る粘着シートを用いた薄型ＩＣチッ
プの製造工程を示す。FIG. 7 shows a process of manufacturing a thin IC chip using the adhesive sheet according to the present invention.
【図８】本発明に係る粘着シートを用いた薄型ＩＣチッ
プの製造工程を示す。FIG. 8 shows a manufacturing process of a thin IC chip using the adhesive sheet according to the present invention.
【図９】実施例１で作成した粘着シートの概略断面図を
示す。FIG. 9 shows a schematic cross-sectional view of the pressure-sensitive adhesive sheet prepared in Example 1.
【図１０】実施例３で作成した粘着シートの概略断面図
を示す。FIG. 10 shows a schematic cross-sectional view of the PSA sheet prepared in Example 3.
１…基材
２（２２）…第１のフィルム
３（２３）…第２のフィルム（収縮性フィルム）
４（２４）…粘着剤層
５（２５）…切込み
６…被着体
７…溝
８…ウエハ
８…チップ
１０…粘着シート
２０…実施例１で作成した粘着シート
２６…第１のフィルム２２と第２のフィルム２３とを貼
合する接着剤層
３０…実施例３で作成した粘着シートDESCRIPTION OF SYMBOLS 1 ... Substrate 2 (22) ... 1st film 3 (23) ... 2nd film (shrinkable film) 4 (24) ... Adhesive layer 5 (25) ... Notch 6 ... Adherent 7 ... Groove 8 Wafer 8 Chip 10 Adhesive sheet 20 Adhesive sheet 26 prepared in Example 1 Adhesive layer 30 for adhering first film 22 and second film 23 Adhesive sheet prepared in Example 3
───────────────────────────────────────────────────── フロントページの続き (72)発明者 沼 田 英 夫 神奈川県川崎市幸区小向東芝町１番地 株式会社東芝 多摩川工場内 (72)発明者 黒 澤 哲 也 神奈川県川崎市幸区小向東芝町１番地 株式会社東芝 多摩川工場内 (56)参考文献 特開 平８−124881（ＪＰ，Ａ) 特開 平７−201787（ＪＰ，Ａ) 特開 平９−165558（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C09J 7/02 H01L 21/304 622 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideo Numata Hideo Numata 1 Komukai Toshiba-cho, Kouki-ku, Kawasaki-shi, Kanagawa Toshiba Tamagawa factory (72) Inventor Tetsuya Kurosawa Ko, Kawasaki-shi, Kanagawa Muko Toshiba Town No. 1 TOSHIBA CORPORATION Tamagawa Plant (56) Reference JP-A-8-124881 (JP, A) JP-A-7-201787 (JP, A) JP-A-9-165558 (JP, A) ( 58) Fields investigated (Int.Cl. 7 , DB name) C09J 7/02 H01L 21/304 622
Claims (4)
収縮性の第２のフィルムと、第２のフィルム上に形成さ
れた粘着剤層とからなり、第２のフィルムに多数の微細
な切込みが設けられていることを特徴とする粘着シー
ト。1. A first film, a shrinkable second film formed on the first film, and an adhesive layer formed on the second film. A pressure-sensitive adhesive sheet that is provided with various cuts.
らなることを特徴とする請求項１に記載の粘着シート。2. The pressure-sensitive adhesive sheet according to claim 1, wherein the first film is a non-shrinkable film.
ることを特徴とする請求項１または２に記載の粘着シー
ト。3. The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer is made of an ultraviolet curable pressure-sensitive adhesive.
体ウエハの表面または裏面に貼付し、半導体ウエハに所
定の加工を施した後、収縮性フィルムを収縮させて、該
粘着シートと半導体ウエハとの接触面積を低減し、剥離
することを特徴とする半導体の加工方法。4. The pressure-sensitive adhesive sheet according to any one of claims 1 to 3 is attached to the front surface or the back surface of a semiconductor wafer, the semiconductor wafer is subjected to predetermined processing, and then the shrinkable film is shrunk, so that the pressure-sensitive adhesive sheet and the semiconductor. A method of processing a semiconductor, characterized in that a contact area with a wafer is reduced and the wafer is separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23552298A JP3476685B2 (en) | 1998-08-21 | 1998-08-21 | Adhesive sheet and method of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23552298A JP3476685B2 (en) | 1998-08-21 | 1998-08-21 | Adhesive sheet and method of using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000063773A JP2000063773A (en) | 2000-02-29 |
| JP3476685B2 true JP3476685B2 (en) | 2003-12-10 |
Family
ID=16987231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23552298A Expired - Lifetime JP3476685B2 (en) | 1998-08-21 | 1998-08-21 | Adhesive sheet and method of using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3476685B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9889630B2 (en) | 2009-03-06 | 2018-02-13 | Bestac Advanced Material Co., Ltd. | Polishing equipment having discontinuous adhesion points and method for making the sheet |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003334902A (en) * | 2002-05-17 | 2003-11-25 | Toyobo Co Ltd | Easily adhesive stretched film of syndiotactic polystyrene |
| JP5087372B2 (en) * | 2007-11-19 | 2012-12-05 | 日東電工株式会社 | Resin laminate, pressure-sensitive adhesive sheet, method of processing an adherend using the pressure-sensitive adhesive sheet, and apparatus for peeling the same |
| BRPI1014911A2 (en) * | 2009-05-26 | 2016-07-26 | 3M Innovative Proferties Company | process for manufacturing loaded resins |
| JP2011040476A (en) * | 2009-08-07 | 2011-02-24 | Lintec Corp | Device and method for applying energy |
| CN102947930B (en) | 2010-04-20 | 2016-08-10 | 日东电工株式会社 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, the production method of semiconductor device and flip chip type semiconductor device |
| JP5801584B2 (en) * | 2011-03-29 | 2015-10-28 | リンテック株式会社 | Dicing tape and chip-shaped part manufacturing method |
-
1998
- 1998-08-21 JP JP23552298A patent/JP3476685B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9889630B2 (en) | 2009-03-06 | 2018-02-13 | Bestac Advanced Material Co., Ltd. | Polishing equipment having discontinuous adhesion points and method for making the sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000063773A (en) | 2000-02-29 |
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