JP3465165B2 - IC card manufacturing equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a thin contactless IC.
The present invention relates to an IC card manufacturing apparatus suitable for use in manufacturing a card.

[0002]

2. Description of the Related Art Generally, an IC card having a built-in electronic component such as an IC chip is known. Since the IC card accommodates electronic components inside the card, it is necessary to manufacture the IC surface so that the surface of the card is not uneven, and the manufacturing method and apparatus therefor are also disclosed in Japanese Examined Patent Publication No. 2-16234. Japanese Patent Laid-Open No. 6-176214 and Japanese Patent Laid-Open No. 9-27
It is proposed in Japanese Patent No. 7766 and Japanese Patent Laid-Open No. 11-48660.

By the way, recently, a flexible thin non-contact IC card having a thickness of several hundreds of micrometers has been put into practical use. FIG. 11 shows such a thin non-contact type I.
1 shows a typical IC card manufacturing apparatus 50 for manufacturing a C card. The IC card manufacturing apparatus 50 includes a lower press plate 51 and an upper press plate 52. The lower press plate 51 is attached to the base portion 54 via a heat insulating plate 53, and the upper press plate 52 is moved up and down via a heat insulating plate 55. Attach to the body 56. As a result, the lower press board 51 becomes the fixed side and the upper press board 52 becomes the movable side. Further, a heater 57 for heating and a water channel 58 for cooling are provided inside the lower press board 51, and a heater 59 for heating is provided inside the upper press board 52.
And a cooling water passage 60 are provided. Further, the base 54 has a cylindrical lower chamber 61 that covers the lower press platen 51.
In addition to the above, the elevating body portion 56 is provided with an upper chamber portion 62 that covers the periphery of the upper press board 52. The lower chamber portion 61 and the upper chamber portion 62 are engaged with each other when the upper press platen 52 is lowered to form a chamber 63 whose inside is sealed. On the other hand, reference numeral 64 denotes a deaeration port provided in the upper chamber portion 62, and by connecting a deaeration device (a vacuum pump or the like) (not shown) to the deaeration port 64, the inside of the chamber 63 is deaerated. You can Incidentally, 65 is the upper chamber portion 6
It is the sealing material provided in 2.

According to such an IC card manufacturing apparatus 50, the laminated base material M used when manufacturing an IC card is set on the lower press platen 51. In this case, the laminated base material M
Are configured as shown in FIG. P is an electronic component including an IC chip Pi and an antenna Pa, and is mounted on the base sheet S. Then, the base sheet S and the electronic component P are arranged on both sides of the hot melt sheets Ta, Tb,
Further, from the outside thereof, a thermoplastic resin sheet (polyethylene terephthalate etc.) La with adhesives Ba, Bb La,
It is sandwiched by Lb. On the other hand, when the laminated base material M is thermocompression-bonded, the elevating body portion 56 shown in FIG. 11 is lowered, the chamber 63 is deaerated, and the heaters 57, ... When the laminated base material M is pressed by the lower press board 51 and the upper press board 52, the laminated base material M is thermocompression-bonded in a state where the bubbles contained therein are removed. Thereafter, the energization of the heating heaters 57 ... And 59 ... Is stopped, and the cooling water is flowed through the cooling water channels 58 ... And 60.

By the way, when an IC card of this type having a thin and flexible property is manufactured, the state of heating and pressurization at the time of thermocompression bonding of the laminated base material M has a great influence on the manufacturing quality. If the control is not executed properly, the flatness of the product will be impaired due to warping or distortion, and if the pressure control is not executed properly, layer misalignment or partial peeling will occur easily. This leads to deterioration and variation, and further, deterioration of commercial properties.

Therefore, in the above-described conventional IC card manufacturing apparatus 50, the lower press platen 51 and the upper press platen 52 are responsible for both the heating step and the cooling step, so that the continuity of heating control and pressurization control is achieved. However, the laminated base material M
The manufacturing cycle time until the end of manufacturing is long, the productivity and mass productivity are poor, and there is a problem that energy saving and economical efficiency are poor due to an increase in energy consumption.

If the heating step and the cooling step are performed in different steps, such a problem can be solved, but on the other hand, as described above, when the heating step is changed to the cooling step,
Since the heating state and the pressurizing state are released, the quality and variations of the product are deteriorated, and further the commercial property is deteriorated.

Therefore, the present applicant has already removed the laminated base material sandwiching portion composed of the upper sandwiching portion and the lower sandwiching portion for sandwiching and sealing the laminated base material M from both sides, and the inside of the laminated base material sandwiching portion. The degassing part to be aired, the preheating press part to raise the delaminated base material sandwiching part sandwiching the lamination base material M at a preheating temperature lower than the normal heating temperature, and the lamination sent from the preheating press part. IC card manufacturing apparatus (basic device) including a thermocompression-bonding press part for thermocompression-bonding the base material sandwiching part at a regular heating temperature and a cooling press part for cooling the laminated base material sandwiching part sent from the thermocompression-bonding press part (Japanese Patent Application No. 10-354966)
issue).

According to this basic apparatus, since the laminated base material sandwiching portion is provided, the laminated base material M is housed inside the hermetically sealed and degassed laminated base material sandwiching portion, and is continuously heated and pressed. Property is secured, that is, the heat retaining property and the pressure retaining property for the laminated base material M are ensured. As a result, the product quality can be remarkably enhanced by the improvement in quality and homogeneity.

[0010]

By the way, the laminated base material sandwiching portion provided in such a basic device has an upper sandwiching portion and a lower sandwiching portion, and the upper sandwiching portion and the lower sandwiching portion are respectively a frame portion and a plate. Consists of parts. The plate portion projects outward from the pressing surface of the press board, and its edge portion is fixed to the frame portion. Therefore, the inside of the plate portion that is in direct contact with the press platen is heated to a high temperature, but the outside of the plate part and the frame part that are located outside the press platen are not heated. As a result, the whole is transformed into a wok.

In this case, if the plate portion is thin,
Deformation of the plate portion is suppressed by the pressing force of the press board, but when the plate portion has a thickness of 1 [mm] or more, deformation occurs even when pressed by the press board. However, even if the thickness is slight, the laminated base material M having a thickness of about several hundreds of micrometers cannot be pressed to an accurate thickness, and in some cases, cannot be pressed. When the pressure applied to the plate portion is released, the laminated base material M (IC
The card) peels off from the plate portion, and the change in cooling rate causes uneven gloss and wrinkles on the surface of the IC card. As described above, in the basic device, when the plate portion becomes thicker, there is a problem to be solved such that the quality and the variation are deteriorated, and further the productability is deteriorated, and the yield (productivity) is decreased.

The present invention solves the above-mentioned problems, and improves the yield (productivity) during manufacturing, improves the quality and homogeneity of the IC card, and further significantly enhances the marketability of the IC. The purpose is to provide a card manufacturing device.

[0013]

Means for Solving the Problems and Embodiments The present invention is directed to a laminated base material M in which an electronic component P such as an IC chip is sandwiched between sheet members including thermoplastic resin sheets La and Lb.
Is a pair of press board parts 2u, which have pressing surfaces 3u, 3d.
When configuring the IC card manufacturing apparatus 1 including the thermocompression-bonding press section 2 that heats and pressurizes from both sides by 2d, the IC card manufacturing apparatus 1 is configured separately from the manufacturing apparatus body 1x, and the laminated base material M is provided on both sides. A laminated base material sandwiching portion 1y having an upper sandwiching portion 5u and a lower sandwiching portion 5d for sandwiching and sealing from above, and the upper sandwiching portion 5u and the lower sandwiching portion 5d are the same as the pressing surfaces 3u and 3d or the pressing surfaces 3u and 3d. Plate portions 6u and 6d that protrude outward from the plate by a predetermined width Xe, and the plate portions 6u and 6d.
The frame parts 7u and 7d larger than u and 6d, the plate parts 6u and 6d and the frame parts 7u and 7d, and the connecting parts 8u and 8d for absorbing the deformation of the plate parts 6u and 6d due to heat. Is characterized by.

In this case, according to the preferred embodiment, the predetermined width Xe is 5 to 10 mm or less. On the other hand, the connecting portions 8u and 8d are integrally formed with the plate portions 6u and 6d, protrude from the edge portions of the plate portions 6u and 6d, and are connected at predetermined intervals along the edge portions. .. and 9d ... are used. Note that the connecting piece portions 9u ... And 9d.
It is projected in a direction Hd different from the deformation direction Hs of d. Further, the IC card manufacturing apparatus 1 is provided with a degassing section 10 for degassing the inside of the laminated base material sandwiching section 1y. Further, it is desirable that the frame portions 7u and 7d be heated to a temperature between the heating temperature and the cooling temperature of the plate portions 6u and 6d.

As a result, when the laminated base material M is pressed and heated, the press plate portions 2u and 2d are moved to the plate portions 6u and 6 respectively.
The plate portions 6u and 6d are pressed and heated by the press plate portions 2u and 2d. At this time, even if the plate portions 6u and 6d are deformed (enlarged) by heat (high temperature), the deformation is caused by the connection portions 8u and 8d (the plurality of connection piece portions 9).
u and 9d ...), the laminated base material M is always thermocompression bonded by the pair of highly parallel plate portions 6u and 6d.

[0016]

The preferred embodiments of the present invention will be described below in detail with reference to the drawings.

First, the configuration of the IC card manufacturing apparatus 1 according to this embodiment will be described with reference to FIGS.

The IC card manufacturing apparatus 1 includes a manufacturing apparatus main body 1
x, and a laminated base material sandwiching portion 1y configured separately from the manufacturing apparatus main body 1x, and the laminated base material sandwiching portion 1y constitutes a main part of the present invention.

The laminated base material sandwiching portion 1y has an upper sandwiching portion 5u and a lower sandwiching portion 5d shown in FIG. 1, and the upper sandwiching portion 5u overlaps the lower sandwiching portion 5d so that the inside is sealed. It becomes the base material holding portion 1y. The upper sandwiching portion 5u includes the upper plate portion 6
u and an upper frame portion 7u configured in a rectangular frame shape larger than the upper plate portion 6u, the upper plate portion 6u overlaps the upper surface of the laminated base material M. The upper plate portion 6u can be made of a stainless material having a constant thickness, and has a thickness of 3
Within [mm], preferably about 1 [mm] is suitable. Further, the upper plate portion 6u is formed to have the same size as the pressing surface 3u of the upper press platen 2u or a size protruding outward from the pressing surface 3u by a predetermined width Xe. This predetermined width Xe is 5
10 mm or less.

Further, the upper plate portion 6u and the upper frame portion 7u are connected to each other via a connecting portion 8u which absorbs deformation of the upper plate portion 6u due to heat. As shown in FIG. 3, the connecting portion 8u uses a plurality of rectangular connecting piece portions 9u ... Formed integrally with the upper plate portion 6u. Each connecting piece 9u ...
The upper plate portion 6u protrudes from a pair of opposing edge portions and is provided at regular intervals along the edge portions. In this case, each connecting piece 9u ...
The protrusions are formed in different directions Hd with respect to the deformation direction Hs, that is, as shown in FIG. Then, all or part of the tips of the connecting piece portions 9u ... Are screwed to the upper frame portion 7u by using the fixing screws 11.

The lower holding portion 5d is basically constructed in the same manner as the upper holding portion 5u. 6d is a lower plate part, 7d is a lower frame part, 8d is a connecting part, and 9d ... are a plurality of connecting piece parts. On the other hand, the sealing material 15 along the peripheral edge is fixed to the upper surface of the lower plate portion 6d. Further, the upper plate portion 6u is provided with a deaeration port 16, and the deaeration port 16 is connected to a deaeration device (vacuum pump or the like) 18 via a ventilation pipe 17. With this, the deaeration unit 10 that deaerates the inside of the laminated base material holding unit 1y is configured, the inside of the laminated base material holding unit 1y can be deaerated, and the laminated base material holding unit 1y is switched from the deaeration port 16 by switching. Air can be supplied to the inside of the. In addition, at a predetermined position of the upper frame portion 7u and the lower frame portion 7d, a positioning portion (not shown) for positioning the two when they are stacked is provided.

On the other hand, the manufacturing apparatus main body 1x has three press units, namely, a preheating press unit (not shown) and a thermocompression bonding press unit 2.
And a cooling press unit (not shown). FIG. 2 shows only the thermocompression bonding press part 2. The thermocompression bonding press section 2 includes a fixed press board section 2u arranged on the upper side and a movable press board section 2d arranged on the lower side.

As shown in FIG. 2, the movable press board portion 2d includes a press board body portion 21 having a pressing surface 3d and a press board base portion 22 for pressing the press board body portion 21. The press board main body portion 21 is configured by sequentially stacking a hot plate portion 23 having a pressing surface 3d at its tip, a heat insulating portion 24, and a support board 25, and they are integrated by fixing bolts 26. In this case, the heating plate 23 has a large number of heating rod heaters 27 incorporated therein.

Further, four air cushion parts 30a, 30b ... Which are different in position are interposed between the press board main body portion 21 and the press board base portion 22. The respective air cushion portions 30a ... Are arranged symmetrically one by one in the front, rear, left and right. Each of the air cushion portions 30a ... Has four rectangular convex portions 31a, 31b ... Integrally provided on the press board base portion 22 and a concave disk portion 3 having a concave portion on the lower surface which covers the rectangular convex portions 31a.
2a, 32b ..., The seal rings 33a, 33b ... are accommodated in the grooves formed on the side surfaces of the rectangular convex portions 31a.
The recesses 32a ... And the rectangular protrusions 31a ... Are sealed, and the upper surfaces of the recesses 32a. As a result, the air cushion portions 30a ... Having the air chambers Ra, Rb ... Sealed between the recessed discs 32a ... And the rectangular protrusions 31a. Move up and down. Further, each recessed plate portion 32a is provided with air supply ports 34a, 34b, and an air supply unit (not shown) including a compressor, an air control circuit and the like is connected to the air supply ports 34a. This air supply unit detects the pressure of each air chamber Ra ...
It has a function of performing feedback control so that the pressure of the air chambers Ra ... Has a target value and individually setting the pressure of each air cushion portion 30a.

On the other hand, numeral 35 is a machine base portion, and this machine base portion 3
The movable press board 2d is supported by a toggle link mechanism 36 installed between the movable press board 2 and the movable press board 2d. Further, 37 is a drive mechanism section for driving the toggle link mechanism 36. The drive mechanism section 37 is provided with a servo motor 38 attached to the machine base section 35, and a ball screw mechanism 39 driven by the servo motor 38. . As a result, the ball screw portion 40 of the ball screw mechanism 39 is rotationally driven by the servomotor 38 and the ball screw mechanism 39
The nut portion 41 of is the input portion of the toggle link mechanism 36.

Further, the fixed press platen 2u is provided with a pressing surface 3
A press board body portion 42 having u is provided. Unlike the lower press board body portion 21, the press board body portion 42 is directly attached to a fixed press board base portion (not shown). The press board body portion 42 includes a hot platen portion 4 whose tip is a pressing surface 3u.
3, the heat insulating portion 44 and the support board 45 are sequentially stacked, and integrated by the fixing bolts 46. In this case, the heating plate 4
3 has a large number of heating rod heaters 47. In addition, 48 ... Air passages provided inside the hot platen 23, 49
Is an air passage provided inside the heating plate portion 43, and the laminated base material holding portion 1y (the lower plate portion 6d and the upper plate portion 6u) is separated from the pressing surfaces 3u and 3d by sending air from the outside. be able to.

Next, the operation (function) of the IC card manufacturing apparatus 1 according to this embodiment will be described with reference to the drawings.

First, the laminated base material M is housed in the laminated base material holding portion 1y. That is, by placing the laminated base material M on the upper surface of the lower sandwiching portion 5d and stacking the upper sandwiching portion 5u from above, the laminated base material M is sandwiched by the upper sandwiching portion 5u and the lower sandwiching portion 5d. Then, the deaerator 18 is operated to deaerate the inside of the laminated base material holding portion 1y. As a result, the laminated base material M has the upper holding portion 5u.
And the laminated base material M while being pressed by the lower holding portion 5d.
The bubbles contained inside the are completely removed.

Then, the laminated base material holding portion 1y containing the laminated base material M is first preheated by a preheating press portion (not shown). That is, the laminated base material sandwiching portion 1y is pressed by a pair of press plates to prevent a preheating temperature lower than a regular heating temperature during thermocompression bonding, specifically, plastic deformation or welding of the hot melt sheets Ta and Tb. It is heated to a temperature immediately before starting (for example, around 70 ° C.). As a result, the laminated base material M is gradually heated by the preheating temperature while being pressurized, and degassing is promoted.

Next, the preheated laminated base material holding portion 1
y is supplied to the thermocompression bonding press unit 2. In this case, since the movable press board 2d is lowered, the laminated base material holding portion 1
After placing y on the movable press board 2d, the servo motor 3
When 8 is operated, the nut portion 41 is raised, and the toggle link mechanism 36 raises the movable press board portion 2d. Then, the laminated base material holding portion 1y is brought into pressure contact with the upper pressure surface 3u,
When the extremely low pressure is applied to the laminated base material holding portion 1y, the moving press platen portion 2d is temporarily stopped from rising. At this time, even when the thickness of the laminated base material M differs depending on the position, the pressure of each air cushion portion 30a ... Is set individually, that is, the pressure corresponding to the thick portion of the laminated base material M is set high. At the same time, the pressure corresponding to the thin part is set low, and the laminated base material M
The pair of pressurizing surfaces 3u and 3d for pressurizing are made parallel to each other.

In this case, the fixed press platen 2u and the movable press platen 2d are provided with heating rod heaters 47 ,.
7 is heated to a regular heating temperature (for example, around 120 ° C.). The laminated base material M is sandwiched between the upper sandwiching portion 5u and the lower sandwiching portion 5d on both sides, and is housed inside the laminated base material sandwiching portion 1y in a sealed state. Since the inside is degassed by the degassing device 18, even if the laminated base material M moves from the preheating press section to the thermocompression bonding press section 2, the continuity of the heated state and the pressurized state is ensured, that is, the laminated substrate The heat retaining property and the pressure retaining property for the material M are secured.

When the set time has elapsed and the laminated base material M has softened (plasticized), the servo motor 38 is actuated again to raise the movable press platen 2d, and the pressing surface 3d is moved to the IC card. Stop at the thickness position. As a result, the laminated base material holding portion 1y is heated and pressed from above and below by the fixed press board portion 2u and the movable press board portion 2d, and the laminated base material M is thermocompression bonded. At this time, the laminated base material holding portion 1y
The plate portions 6u and 6d in (1) are deformed (enlarged) by heat (high temperature), but the deformation is caused by the plurality of connecting piece portions 9u ...
And 9d ..., the laminated base material M is always thermocompression bonded by the pair of plate portions 6u and 6d having high parallelism.

After this, set time (for example, around 20 seconds)
After the time elapses, the movable press platen 2d is lowered, and the thermocompression-bonded laminated base material M, that is, the manufactured IC card is transferred to the cooling press unit and cooled. In the cooling process, IC
The card is cooled while being pressurized. On the other hand, after the cooling treatment, in order to take out the IC card from the laminated base material holding portion 1y, air may be supplied from the deaeration port 16 to the inside of the laminated base material holding portion 1y. As a result, the degassed state of the laminated base material holding portion 1y is released, and the laminated base material M becomes the laminated base material holding portion 1y.
peel from y. Therefore, the upper holding portion 5u can be raised and the manufactured IC card can be taken out.

In the above steps, the upper frame portion 7u and the lower frame portion 7d are connected to the plate portions 6u and 6d.
It is heated to a temperature intermediate between the heating temperature and the cooling temperature of (approximately the center). For example, when the plate parts 6u and 6d are heated to 140 [° C.] and then cooled to 40 [° C.], the temperatures of the upper frame part 7u and the lower frame part 7d are 90 [° C.].
Control heating. Thereby, the plate portions 6u and 6d
And, the relative change amount of the temperature of the upper frame portion 7u and the lower frame portion 7d can be halved.

As described above, by using the IC card manufacturing apparatus 1 according to this embodiment, even if the plate portions 6u and 6d are deformed by heat, the deformation is caused by the plurality of connecting piece portions 9u ...
Since the laminated base material M is absorbed by d ..., the laminated base material M is always thermocompression bonded by the pair of plate portions 6u and 6d having a high degree of parallelism, so that the yield (productivity) at the time of manufacturing can be improved, and the IC card Improved quality and homogeneity,
Furthermore, the product characteristics can be significantly improved.

Further, the air cushion portions 30a, 30b ...
Because of the provision of the above, the pair of pressing surfaces 3 that press the laminated base material M even when the thickness of the laminated base material M differs depending on the position.
u and 3d can be parallel to each other, the applied pressure can be applied accurately and stably from extremely low pressure to medium pressure (high pressure), and the height having a uniform thickness is not affected by the thickness state of the laminated base material M. A quality IC card can be obtained. Moreover, the movable press platen portion 2 is pressed by the toggle link mechanism 36.
Since the air cushion portions 30a are provided on the d side, it is possible to perform accurate pressure control without disabling the pressure control even with the toggle link mechanism 36 having a large force expansion rate.

The embodiment has been described in detail above.
The present invention is not limited to such an embodiment,
The detailed configuration, shape, quantity, material, numerical values, etc. can be arbitrarily changed, added, or deleted without departing from the scope of the present invention. For example, the structure and material of the laminated base material M (IC card) are not limited to the examples, and can be applied to any type.

Further, in the embodiment, the connecting piece portions 9u ..., 9d ...
Although the case of integrally forming the plate parts 6u and 6d is shown, the connecting piece parts 9u ..., 9d ... may be formed separately from the plate parts 6u, 6d or may be formed of different materials. . Further, the case where the tips of the connecting piece portions 9u ..., 9d ... Are screwed to the frame portions 7u, 7d is shown, but as shown in FIG. 6, the connecting piece portions 9u are attached to the frame portions 7u, 7d.
, 9d are inserted in a displaceable manner, and the frame portions 7u, 7d are inserted.
The positions of the plate portions 6u and 6d may be finely adjusted by the adjusting screws 71u and 71d screwed to the outer surface of the. 6, the same parts as those in FIG. 1 are designated by the same reference numerals.

On the other hand, the connecting piece portions 9d ... (Same for 9u ... side)
Is a direction H different from the deformation direction Hs of the plate portion 6d.
As a form of projecting on d, a case of bending into a crank shape is shown, but as shown in FIG. 7, the plate portion 6d is formed.
And the plate portion 6d
It may be in the form of being inclined with respect to the end portion. Also, 72
Reference numeral d denotes a mounting frame to the frame portion 7d, and the mounting frame 72d, the connecting piece portion 9d ... And the plate portion 6d can be integrally formed by a punching press. Further, the connecting piece portions 9d ... (Same for 9u ...) may be formed by a combination of thin ribs as shown in FIG. In this case as well, the connecting piece portions 9d ... Include a portion protrudingly formed in a direction different from the deformation direction of the plate portion 6d. The embodiment shown in FIG. 8 can be integrally formed by punching press, as in the embodiment shown in FIG. Moreover, the same effects as those of the embodiments of FIGS. 1 to 5 can be obtained in the embodiments of FIGS. 7 and 8. Furthermore, in the embodiment of FIGS. 7 and 8, as shown in FIG. 9, the mounting frame 72d can be screwed to the frame portion 7d as it is by using the fixing screws 73d.

[0040]

As described above, the IC card manufacturing apparatus according to the present invention is constructed separately from the manufacturing apparatus main body, and has the upper and lower clamping sections for clamping and sealing the laminated base material from both sides. A laminated base material holding portion having, an upper holding portion and a lower holding portion,
A plate portion that is the same as the pressing surface or projects outward from the pressing surface by a predetermined width, a frame portion that is larger than this plate portion, the plate portion and the frame portion are connected, and the deformation of the plate portion due to heat is absorbed. Even if the plate part is deformed by heat (high temperature), the deformation is absorbed by the connecting part, and the laminated base material is always thermocompression bonded by the pair of plate parts having high parallelism. Therefore,
It is possible to improve the yield (productivity) at the time of manufacturing, improve the quality and homogeneity of the IC card, and further significantly improve the commercialability.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional front view showing a main part of a thermocompression bonding press section in an IC card manufacturing apparatus according to a preferred embodiment of the present invention,

FIG. 2 is a partially sectional front view showing a thermocompression bonding press section in the IC card manufacturing apparatus,

FIG. 3 is a plan view of a laminated base material sandwiching unit in the IC card manufacturing apparatus,

FIG. 4 is an enlarged cross-sectional front view showing a part of a laminated base material holding portion in the IC card manufacturing apparatus;

FIG. 5 is a cross-sectional side view showing an enlarged part of a laminated base material sandwiching portion in the IC card manufacturing apparatus;

FIG. 6 is a cross-sectional front view showing an enlarged part of a laminated base material holding portion according to another embodiment of the IC card manufacturing apparatus;

FIG. 7 is a plan view of a plate portion and a connecting portion of a laminated base material holding portion according to another embodiment of the IC card manufacturing apparatus;

FIG. 8 is a plan view of a plate portion and a connecting portion of a laminated base material holding portion according to another embodiment of the IC card manufacturing apparatus,

FIG. 9 is a sectional front view (a sectional view taken along line AA in FIG. 8) showing an enlarged part of a laminated base material sandwiching portion according to another embodiment of the IC card manufacturing apparatus.

FIG. 10 is an exploded sectional front view of a laminated base material manufactured by an IC card manufacturing apparatus,

FIG. 11 is a vertical cross-sectional view of an IC card manufacturing apparatus according to a conventional technique,

[Explanation of symbols]

1 IC card manufacturing equipment 1x Manufacturing equipment body 1y Laminated substrate sandwiching part 2 Thermo-compression press section 2u ... Press board 3u ... Pressurized surface 5u upper clamping part 5d Lower clamping part 6u plate part 7u frame part 8u connecting part 9u ... Connecting piece 10 Degassing section La ... Thermoplastic resin sheet P electronic parts M laminated base material Xe predetermined width

Claims (6)

(57) [Claims] 1. A laminated base material in which an electronic component such as an IC chip is sandwiched between sheet members including a thermoplastic resin sheet,
In an IC card manufacturing apparatus including a thermocompression bonding press section that heats and pressurizes and thermocompresses from both sides by a pair of pressing boards having a pressing surface, the IC card manufacturing apparatus is configured separately from the manufacturing apparatus body, and the laminated base material is A laminated base material sandwiching unit having an upper sandwiching unit and a lower sandwiching unit that sandwiches and seals from both sides is provided, and the upper sandwiching unit and the lower sandwiching unit are the same as the pressing surface or outward from the pressing surface by a predetermined width. An IC characterized in that it is configured by a plate portion projecting to the side, a frame portion larger than the plate portion, a connecting portion that connects the plate portion and the frame portion, and that absorbs deformation of the plate portion due to heat. Card manufacturing equipment. 2. The IC card manufacturing apparatus according to claim 1, wherein the predetermined width is 5 to 10 mm or less. 3. The connecting portion is integrally formed with the plate portion, and protrudes from an end side portion of the plate portion,
The IC card manufacturing apparatus according to claim 1, wherein the IC card manufacturing apparatus comprises a plurality of connecting piece portions provided along the edge portion at predetermined intervals. 4. The IC card manufacturing apparatus according to claim 3, wherein the connecting piece portion is projected in a direction different from a deformation direction of the plate portion. 5. The IC card manufacturing apparatus according to claim 1, further comprising a degassing unit that degasses the inside of the laminated base material sandwiching unit. 6. The IC card manufacturing apparatus according to claim 1, wherein the frame portion heats the plate portion to an intermediate temperature between a heating temperature and a cooling temperature of the plate portion.