JP3322990B2 - Resin composition for composite material and molding material containing the same - Google Patents
Resin composition for composite material and molding material containing the sameInfo
- Publication number
- JP3322990B2 JP3322990B2 JP12324494A JP12324494A JP3322990B2 JP 3322990 B2 JP3322990 B2 JP 3322990B2 JP 12324494 A JP12324494 A JP 12324494A JP 12324494 A JP12324494 A JP 12324494A JP 3322990 B2 JP3322990 B2 JP 3322990B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molding
- fiber
- resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 29
- 239000012778 molding material Substances 0.000 title claims description 22
- 239000002131 composite material Substances 0.000 title claims description 16
- 239000000835 fiber Substances 0.000 claims description 46
- 239000005011 phenolic resin Substances 0.000 claims description 23
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 claims description 22
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical group CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 16
- 239000000945 filler Substances 0.000 claims description 12
- 239000001087 glyceryl triacetate Substances 0.000 claims description 11
- 235000013773 glyceryl triacetate Nutrition 0.000 claims description 11
- 229960002622 triacetin Drugs 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 8
- 150000003512 tertiary amines Chemical class 0.000 claims description 8
- 239000002562 thickening agent Substances 0.000 claims description 7
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- 239000003677 Sheet moulding compound Substances 0.000 description 23
- 238000000465 moulding Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 17
- 229920003987 resole Polymers 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- -1 for example Substances 0.000 description 10
- 239000002243 precursor Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 7
- 238000007872 degassing Methods 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004412 Bulk moulding compound Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000008961 swelling Effects 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 230000032683 aging Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- ALOUNLDAKADEEB-UHFFFAOYSA-N dimethyl sebacate Chemical compound COC(=O)CCCCCCCCC(=O)OC ALOUNLDAKADEEB-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000009730 filament winding Methods 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 238000009787 hand lay-up Methods 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- TZIHFWKZFHZASV-UHFFFAOYSA-N methyl formate Chemical compound COC=O TZIHFWKZFHZASV-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- UYVWNPAMKCDKRB-UHFFFAOYSA-N 1,2,4,5-tetraoxane Chemical compound C1OOCOO1 UYVWNPAMKCDKRB-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HXDLWJWIAHWIKI-UHFFFAOYSA-N 2-hydroxyethyl acetate Chemical compound CC(=O)OCCO HXDLWJWIAHWIKI-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 229930188104 Alkylresorcinol Natural products 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 239000004348 Glyceryl diacetate Substances 0.000 description 1
- 101100061307 Homo sapiens C17orf80 gene Proteins 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- LOMVENUNSWAXEN-UHFFFAOYSA-N Methyl oxalate Chemical compound COC(=O)C(=O)OC LOMVENUNSWAXEN-UHFFFAOYSA-N 0.000 description 1
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 102100037950 Uncharacterized protein C17orf80 Human genes 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008431 aliphatic amides Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000005325 alkali earth metal hydroxides Chemical class 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- 229940014772 dimethyl sebacate Drugs 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000010881 fly ash Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 238000001641 gel filtration chromatography Methods 0.000 description 1
- 235000019443 glyceryl diacetate Nutrition 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012510 hollow fiber Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229960004337 hydroquinone Drugs 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 210000000329 smooth muscle myocyte Anatomy 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、複合材用樹脂組成物及
びそれを含む成形材料に関する。本発明の複合材用樹脂
組成物は、各種の繊維基材を用いて成る成形材料、例え
ばシート・モールディング・コンパウンド(以下、SM
Cと略記する)、バルク・モールディング・コンパウン
ド(以下、BMCと略記する)若しくはプルトルージョ
ン法(引抜成形法)、フィラメントワインディング法、
ハンドレイアップ法、スプレイアップ法、レジンインジ
ェクション法(樹脂圧入法)、樹脂移送成形法(RT
M)等による複合材などの製造に有用であるほか、シリ
カ粉等の充填材を含んで成る封止材や一般的な非繊維系
成形材料又は複合材の製造にも利用することができる。The present invention relates to a resin composition for a composite material and a molding material containing the same. The resin composition for a composite material of the present invention is a molding material using various fiber base materials, for example, a sheet molding compound (hereinafter referred to as SM).
C), bulk molding compound (hereinafter abbreviated as BMC) or pultrusion method (pultruding method), filament winding method,
Hand lay-up method, spray-up method, resin injection method (resin injection method), resin transfer molding method (RT
M) and the like, and can also be used for the production of a sealing material containing a filler such as silica powder, and a general non-fiber-based molding material or composite material.
【0002】[0002]
【従来の技術】従来、各種の繊維を強化材として、熱硬
化性フェノール樹脂をマトリックス樹脂とした成形材
料、例えばSMC、BMC等においては、一般にマトリ
ックス樹脂として水酸化ナトリウム等のアルカリを触媒
として製造された液状レゾール型フェノール樹脂が用い
られている。2. Description of the Related Art Conventionally, a molding material using a thermosetting phenol resin as a matrix resin using various fibers as a reinforcing material, for example, SMC, BMC, etc., is generally manufactured using an alkali such as sodium hydroxide as a matrix resin as a matrix resin. Liquid resol type phenol resin is used.
【0003】しかしながら、この種の液状レゾール型フ
ェノール樹脂を用いた場合は、成形時に多量のガスが発
生して成形品にボイドや膨れを生じ易いため、成形時に
煩雑なガス抜き操作を行う必要があった。また、品質面
においては、成形収縮率が大きく寸法精度に劣るという
問題があった。However, when a liquid resol type phenol resin of this kind is used, a large amount of gas is generated at the time of molding to easily cause voids and swelling of the molded product, so that it is necessary to perform a complicated degassing operation at the time of molding. there were. In terms of quality, there is a problem that the molding shrinkage is large and the dimensional accuracy is inferior.
【0004】[0004]
【発明が解決しようとする課題】本発明は、このような
事情に鑑みなされたものであり、その第1の目的は成形
時にガス抜き操作を施さなくても成形品にボイドや膨れ
を生じることがない複合材用樹脂組成物を提供すること
にある。また、第2の目的は成形収縮率が小さい成形品
を得ることができる複合材用樹脂組成物を提供すること
にある。また、第3の目的は成形時の臭気が従来同様に
微弱である複合材用樹脂組成物を提供することにある。
さらに、第4の目的はこのような特質を有する樹脂組成
物を含有して成る成形材料を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to produce a void or a blister in a molded article without performing a degassing operation at the time of molding. It is an object of the present invention to provide a resin composition for a composite material which does not have the above. A second object is to provide a resin composition for a composite material that can obtain a molded product having a small molding shrinkage. Further, a third object is to provide a resin composition for a composite material in which odor at the time of molding is weak as in the conventional case.
Further, a fourth object is to provide a molding material containing a resin composition having such characteristics.
【0005】[0005]
【課題を解決するための手段】本発明者らは、前記従来
技術の問題を解決すべく鋭意検討した結果、特定の液状
レゾール型フェノール樹脂及び特定の脂肪族カルボン酸
エステルを含有して成る複合材用樹脂組成物は、前記課
題の達成に極めて有効であることを見出し、本発明を完
成するに至った。Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above-mentioned problems of the prior art, and as a result, have found that a composite containing a specific liquid resol type phenol resin and a specific aliphatic carboxylic acid ester is used. The material resin composition was found to be extremely effective in achieving the above object, and the present invention was completed.
【0006】すなわち、本発明の第1は第三級アミン
(好ましくはトリエチルアミン)を触媒として製造され
た液状レゾール型フェノール樹脂、トリアセチン及び/
又はエチレングリコールジアセテートを含有して成る複
合材用樹脂組成物(以下、単に樹脂組成物と略記する)
である。さらに第2の発明は前記樹脂組成物及び繊維を
含有して成る成形材料であり、そしてその第3は前記樹
脂組成物、繊維、充填材及び増粘剤を含有して成る成形
材料である。That is, the first aspect of the present invention is a liquid resol type phenol resin produced using a tertiary amine (preferably triethylamine) as a catalyst , triacetin and / or triacetin.
Or a resin composition for a composite material containing ethylene glycol diacetate (hereinafter simply referred to as a resin composition)
It is. A second invention is to further a molding material comprising said resin composition and fibers, and the third is a molding material comprising said resin composition, fiber, filler and thickener .
【0007】本発明に係る樹脂組成物において用いられ
る液状レゾール型フェノール樹脂は、成形材料ないし複
合材の構成成分、例えば繊維、充填材などを結合一体化
させるための硬化性マトリックス樹脂として機能するも
のであって、このものは第三級アミン(触媒)の存在下
でフェノール類とアルデヒド類とを反応させることによ
って製造することができる。特に、不揮発分が70〜9
0重量%、25℃における粘度が100〜1000 mPa
・s 及び数平均分子量が180〜300の範囲にある樹
脂が実用上好ましい。なお、この液状レゾール型フェノ
ール樹脂には、繊維や充填材と樹脂との接着性をより向
上させる目的でシランカップリング剤を加えても差し支
えない。The liquid resol type phenol resin used in the resin composition according to the present invention functions as a curable matrix resin for binding and integrating components of a molding material or a composite material, such as fibers and fillers. Which can be prepared by reacting phenols with aldehydes in the presence of a tertiary amine (catalyst). In particular, the non-volatile content is 70 to 9
0% by weight, viscosity at 25 ° C. is 100 to 1000 mPa
A resin having an s and a number average molecular weight in the range of 180 to 300 is practically preferable. It should be noted that a silane coupling agent may be added to the liquid resol-type phenol resin for the purpose of further improving the adhesiveness between the fiber and the filler and the resin.
【0008】好適なシランカップリング剤としては、例
えばγ−アミノプロピルトリエトキシシラン、N−β
(アミノエチル)−γ−アミノプロピルトリメトキシシ
ラン、γ−アミノプロピルメチルジメトキシシラン等の
アミノ系シラン、γ−グリシドキシプロピルトリメトキ
シシラン、β−(3,4−エポキシシクロヘキシル)エ
チルトリメトキシシラン等のエポキシ系シラン、γ−メ
ルカプトプロピルトリメトキシシラン等のメルカプト系
シランなどが挙げられる。かかるシランカップリング剤
は、1種又は2種以上を組み合せて用いてもよく、また
液状レゾール型フェノール樹脂に対して通常0.1〜3
重量%、好ましくは0.1〜2重量%の範囲で用いられ
る。Preferred silane coupling agents include, for example, γ-aminopropyltriethoxysilane, N-β
Amino-based silanes such as (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane Epoxy silanes, and mercapto silanes such as γ-mercaptopropyltrimethoxysilane. Such silane coupling agents may be used alone or in combination of two or more, and usually 0.1 to 3 with respect to the liquid resol type phenol resin.
%, Preferably in the range of 0.1 to 2% by weight.
【0009】前記フェノール類としては、例えばフェノ
ール、クレゾール、キシレノール、ノニルフェノール、
パラターシャリブチルフェノール、パラクミルフェノー
ル、フェニルフェノール等の非置換あるいは置換1価フ
ェノール、レゾルシノール、アルキルレゾルシノール、
カテコール、ハイドロキノン、ピロガロール、フロログ
ルシノール等の非置換あるいは置換多価フェノール、ビ
スフェノールA、ビスフェノールF、ビスフェノールS
等のビスフェノール、クレゾール残渣、レゾルシン残
渣、ビスフェノールA残渣等のフェノール系精製残渣な
どが挙げられる。The phenols include, for example, phenol, cresol, xylenol, nonylphenol,
Unsubstituted or substituted monohydric phenols such as para-tert-butylphenol, paracumylphenol and phenylphenol, resorcinol, alkylresorcinol,
Unsubstituted or substituted polyphenols such as catechol, hydroquinone, pyrogallol, and phloroglucinol, bisphenol A, bisphenol F, bisphenol S
And phenol-based purified residues such as bisphenol A, cresol residues, resorcinol residues, and bisphenol A residues.
【0010】また、アルデヒド類としては、例えばホル
ムアルデヒド、パラホルムアルデヒド、トリオキサン、
テトラオキサン、ポリアセタール、グリオキザール、フ
ルフラールの他、アセトアルデヒド、ブチルアルデヒ
ド、クロトンアルデヒド、ベンズアルデヒド、ヒドロオ
キシベンズアルデヒドなどが挙げられる。The aldehydes include, for example, formaldehyde, paraformaldehyde, trioxane,
In addition to tetraoxane, polyacetal, glyoxal, furfural, acetaldehyde, butyraldehyde, crotonaldehyde, benzaldehyde, hydroxybenzaldehyde and the like can be mentioned.
【0011】これらを反応させる際にはそれぞれを1種
又は2種以上組み合せて用いてもよい。さらに、前記フ
ェノール類(X)とアルデヒド類(Y)の配合割合は、
モル比(Y/X)で通常1.0〜2.5、好ましくは
1.1〜1.6である。配合割合が1.0未満では硬化
性が悪く、逆に2.5を越えるとガスの発生量が多くな
り好ましくない。When reacting them, they may be used alone or in combination of two or more. Further, the mixing ratio of the phenols (X) and the aldehydes (Y) is as follows:
The molar ratio (Y / X) is usually 1.0 to 2.5, preferably 1.1 to 1.6. If the compounding ratio is less than 1.0, the curability is poor, and if it exceeds 2.5, the amount of generated gas is increased, which is not preferable.
【0012】触媒として用いられる第三級アミンは、ア
ンモニアの水素原子をアルキル基又はアリール基で置換
して生じるアミンであり、このような第三級アミンの例
としては、例えばトリエチルアミン、トリメチルアミ
ン、トリプロピルアミン、ベンジルジメチルアミン、ジ
メチルアニリン、N−メチルピペリジンなどが挙げられ
る。中でも特にトリエチルアミンが触媒活性及び毒性の
点から好ましい。The tertiary amine used as a catalyst is an amine formed by replacing a hydrogen atom of ammonia with an alkyl group or an aryl group. Examples of such a tertiary amine include, for example, triethylamine, trimethylamine and trimethylamine. Propylamine, benzyldimethylamine, dimethylaniline, N-methylpiperidine and the like. Among them, triethylamine is particularly preferred in terms of catalytic activity and toxicity.
【0013】第三級アミンの配合量は、その触媒活性を
考慮して適宜決定されるが、一般的にはフェノール類に
対して10重量%以下、好ましくは1〜5重量%であ
る。なお、第三級アミンは、必要に応じて本発明の効果
を阻害しない範囲内において他の塩基性触媒、例えばア
ルカリ金属の水酸化物、酸化物及びりん酸塩、アルカリ
土類金属の水酸化物及び酸化物、アンモニア、アルカノ
ールアミンなどと併用することができる。The amount of the tertiary amine is appropriately determined in consideration of its catalytic activity, but is generally 10% by weight or less, preferably 1 to 5% by weight, based on phenols. If necessary, the tertiary amine may be used in the form of other basic catalysts such as hydroxides, oxides and phosphates of alkali metals, and hydroxides of alkaline earth metals as long as the effects of the present invention are not impaired. And oxides, ammonia, alkanolamines and the like.
【0014】また、前記液状レゾール型フェノール樹脂
と組合せて用いられる脂肪族カルボン酸エステルは、成
形性及び成形収縮率、特に成形性の改善に好適に機能す
るものであって、このような脂肪族カルボン酸エステル
としては、例えばギ酸メチル、ギ酸エチル、ギ酸プロピ
ル、乳酸エチル、コハク酸ジメチル、マロン酸ジメチ
ル、セバシン酸ジメチル、シュウ酸ジメチル、エチレン
グリコールモノアセテート、エチレングリコールジアセ
テート、モノアセチン、ジアセチン、トリアセチンなど
が挙げられるが、中でも本発明の目的を一層効果的に達
成せしめるためには、エチレングリコールジアセテート
及び/又はトリアセチンが好ましい。 また、その配合量
は液状レゾール型フェノール樹脂に対して通常1〜30
重量%、好ましくは1〜10重量%、より好ましくは2
〜5重量%である。配合量が1重量%未満では本発明の
目的を達成することができず、逆に30重量%を越えて
もさらなる効果の向上を得ることができず経済的に不利
である。The aliphatic carboxylic acid ester used in combination with the liquid resol type phenol resin preferably functions to improve moldability and molding shrinkage, particularly moldability. the carboxylic acid esters such as methyl formate, ethyl formate, propyl formate, ethyl lactate, dimethyl succinate, dimethyl malonate, dimethyl sebacate, dimethyl oxalate, ethylene glycol monoacetate, ethylene glycol diacetic <br/> tape DOO , Mo Noasechin, diacetin, but like triacetin, even to allowed to more effectively achieve the object of the present invention in ethylene glycol diacetate and / or triacetin is not preferred. Also, from 1 to 30 the amount thereof relative to the liquid resol type phenolic resin
% By weight, preferably 1 to 10% by weight, more preferably 2% by weight.
~ 5% by weight. If the amount is less than 1% by weight, the object of the present invention cannot be achieved, and if it exceeds 30% by weight, further improvement in effect cannot be obtained, which is economically disadvantageous.
【0015】本発明に係る樹脂組成物を用いて成形材
料、複合材など(以下、単に成形材料等という)を製造
する際に用いられる繊維としては、例えば天然繊維、合
成繊維、再生繊維、無機繊維、金属繊維、繊維を中空化
又は表面被覆処理を施した機能性繊維、ウィスカ及びこ
れらの2種以上を組み合せたものなどが挙げられる。具
体的には木粉、パルプ、リンター、屑布、古紙再生繊
維、ナイロン繊維、ポリビニルアルコール繊維、アクリ
ル繊維、ポリエチレン繊維、ポリプロピレン繊維、ポリ
エステル繊維、アラミド繊維、ポリエステル中空繊維、
銅被覆ポリエステル繊維、フェノール繊維、炭素繊維、
ガラス繊維、ロックウール繊維、炭化珪素繊維、アルミ
ナ繊維、セラミック繊維、ボロン繊維、アルミニウム繊
維、銅繊維、ステンレス繊維、チタン酸カリウムウィス
カ、硫酸カルシウムウィスカ等が例示される。The fibers used for producing molding materials, composite materials, etc. (hereinafter simply referred to as molding materials, etc.) using the resin composition according to the present invention include, for example, natural fibers, synthetic fibers, recycled fibers, inorganic fibers, and the like. Examples thereof include fibers, metal fibers, functional fibers obtained by hollowing or surface-coating fibers, whiskers, and combinations of two or more of these. Specifically, wood flour, pulp, linter, waste cloth, recycled paper fiber, nylon fiber, polyvinyl alcohol fiber, acrylic fiber, polyethylene fiber, polypropylene fiber, polyester fiber, aramid fiber, polyester hollow fiber,
Copper-coated polyester fiber, phenol fiber, carbon fiber,
Glass fiber, rock wool fiber, silicon carbide fiber, alumina fiber, ceramic fiber, boron fiber, aluminum fiber, copper fiber, stainless steel fiber, potassium titanate whisker, calcium sulfate whisker and the like are exemplified.
【0016】かかる繊維の配合量は、成形材料等の製
法、用途及び要求特性、繊維形態等に応じて適宜決定さ
れるが、特に補強効果の点から一般的には成形材料等に
占める割合で5重量%以上、好ましくは10〜50重量
%である。また、これら繊維は用途に応じて任意の形
態、例えばフィラメント、ストランド、チョップドスト
ランド、チョップドストランドマット、コンティヌアス
ストランドマット、ロービング、ロービングクロス、ス
トランドクロス、ミルドファイバー、不織布状のものを
適宜選択して用いることができる。The compounding amount of the fiber is appropriately determined according to the manufacturing method, application and required characteristics of the molding material, the fiber form, and the like. It is at least 5% by weight, preferably 10 to 50% by weight. In addition, these fibers are appropriately selected in any form depending on the use, for example, a filament, a strand, a chopped strand, a chopped strand mat, a continuum strand mat, a roving, a roving cloth, a strand cloth, a milled fiber, and a nonwoven fabric. Can be used.
【0017】また、充填材としては例えば炭酸カルシウ
ム、硫酸バリウム、タルク、クレー、カオリン、シリカ
粉、微砂、珪藻土、マイカーフレーク、石膏、水酸化ア
ルミニウム、フライアッシュ、グラファイト、粉末状ゴ
ム、ガラスバルーン、シラスバルーン、硬化樹脂バルー
ン、中空バルーン類などが挙げられるが、これらに限定
されるものではない。かかる充填材は1種又は2種以上
を組み合せて用いてもよい。充填材の配合量は、成形材
料等の製法、用途、要求特性及びコスト、樹脂組成物の
塗工性等を考慮して適宜決定されるが、一般的には液状
レゾール型フェノール樹脂に対して10〜200重量
%、好ましくは50〜150重量%である。Examples of the filler include calcium carbonate, barium sulfate, talc, clay, kaolin, silica powder, fine sand, diatomaceous earth, mica flake, gypsum, aluminum hydroxide, fly ash, graphite, powder rubber, and glass balloon. , Shirasu balloons, cured resin balloons, hollow balloons, and the like, but are not limited thereto. Such fillers may be used alone or in combination of two or more. The amount of the filler is determined as appropriate in consideration of the manufacturing method of the molding material, the use, the required characteristics and cost, the coatability of the resin composition, and the like. It is 10 to 200% by weight, preferably 50 to 150% by weight.
【0018】また、増粘剤は、熟成によって樹脂組成物
の粘度を高めて成形材料の成形性や取扱い性を良くする
ための調整剤であって、このような性質を有する好適な
例としてはアルカリ土類金属の水酸化物又は酸化物が挙
げられるが、中でも酸化マグネシウム、水酸化マグネシ
ウム及びこれらの組合せがより好適であり、とりわけヨ
ード吸着量が10〜50mg/g、好ましくは10〜20
mg/gの酸化マグネシウムが好ましい。増粘剤の配合量
は、液状レゾール型フェノール樹脂に対して通常1〜1
0重量%、好ましくは2〜5重量%である。ヨード吸着
量が10mg/g又は配合量が1重量%未満では、成形材
料の増粘調整(成形性調整工程)に長時間を要し、若し
くは所望の粘度に達し得ず、逆にヨード吸着量が50mg
/g又は配合量が10重量%を超えると粘度の制御が困
難であるのみならず、保存安定性の悪化という不都合が
生じる。The thickener is a regulator for increasing the viscosity of the resin composition by aging to improve the moldability and handleability of the molding material. A preferable example having such properties is Alkali earth metal hydroxides or oxides are mentioned, and among them, magnesium oxide, magnesium hydroxide and a combination thereof are more preferable, and especially, the iodine adsorption amount is 10 to 50 mg / g, preferably 10 to 20 mg / g.
mg / g of magnesium oxide is preferred. The amount of the thickener is usually 1 to 1 with respect to the liquid resol type phenol resin.
0% by weight, preferably 2 to 5% by weight. If the iodine adsorption amount is 10 mg / g or the blending amount is less than 1% by weight, it takes a long time to adjust the viscosity of the molding material (the step of adjusting the moldability), or the desired viscosity cannot be attained. Is 50mg
If / g or the amount exceeds 10% by weight, not only is it difficult to control the viscosity, but also disadvantageously, storage stability deteriorates.
【0019】本発明に係る樹脂組成物には、前記成分以
外に必要に応じて離型剤を配合することができる。離型
剤としては、例えばステアリン酸、ステアリン酸カルシ
ウム、ステアリン酸亜鉛、脂肪族アマイド系ワックス、
カルナバろう系ワックス、ポリプロピレン系ワックス等
が用いられ、その配合量は液状レゾール型フェノール樹
脂に対して通常0.5〜5重量%の範囲で選ばれる。さ
らに、その他の任意の添加剤、例えば粘度調整剤、難燃
剤、可塑剤、着色剤等を適量配合することができる。The resin composition according to the present invention may optionally contain a release agent in addition to the above components. Examples of the release agent include stearic acid, calcium stearate, zinc stearate, an aliphatic amide wax,
Carnauba wax, polypropylene wax and the like are used, and the amount of the wax is usually selected in the range of 0.5 to 5% by weight based on the liquid resol type phenol resin. Furthermore, other optional additives such as a viscosity modifier, a flame retardant, a plasticizer, and a coloring agent can be added in an appropriate amount.
【0020】かくして前記液状レゾール型フェノール樹
脂、トリアセチン及び/又はエチレングリコールジアセ
テートを含む本発明に係る樹脂組成物は、前述した繊
維、充填材、増粘剤、その他の添加剤などと適宜組み合
せて用いることによって各種の成形材料、封止材及び複
合材などを製造することができる。例えば、ロービン
グ、マット、その他の任意形態を有する繊維を単一で又
は組合せて連続的に樹脂組成物槽(場合によっては個別
に樹脂槽及び脂肪族カルボン酸エステル槽)に供給し
て、繊維に樹脂組成物を含浸させるとともに樹脂組成物
と繊維の割合を調整した後、これを所定の成形品形状を
有する金型(ダイス)内に引き込み、加熱硬化させ、連
続又は断続的に引き抜き成形する、所謂プルトルージョ
ン法(引抜成形法)による複合材の製造の他、フィラメ
ントワインディング法、ハンドレイアップ法、スプレイ
アップ法、レジンインジェクション法(樹脂圧入法)、
樹脂移送成形法(RTM)等による複合材の製造にも適
用することができる。The liquid resol type phenol resin , triacetin and / or ethylene glycol diacetate
The resin composition according to the present invention containing tate is used to produce various molding materials, sealing materials, composite materials, and the like by appropriately combining the above-described fibers, fillers, thickeners, and other additives. be able to. For example, a roving, mat, or fiber having any other form is singly or combined and continuously supplied to a resin composition tank (in some cases, individually, a resin tank and an aliphatic carboxylic acid ester tank) to form fibers. After impregnating the resin composition and adjusting the ratio of the resin composition and the fiber, the resin composition is drawn into a mold (die) having a predetermined molded product shape, heated and cured, and continuously or intermittently drawn and molded. In addition to manufacturing composite materials by the so-called pultrusion method (pultruding method), filament winding method, hand lay-up method, spray-up method, resin injection method (resin injection method),
The present invention can be applied to the production of a composite material by a resin transfer molding method (RTM) or the like.
【0021】また、一定の速度で同一方向に移動する上
下2枚のポリエチレンフィルムの合わせ面側それぞれ
に、樹脂組成物、充填材、増粘材及び必要に応じて加え
れる離型剤その他の添加剤からなる樹脂ペーストをドク
ターブレード等で塗布して樹脂ペースト層を形成する。
また、下位ポリエチレンフィルム側の樹脂ペースト層上
にはさらに所定量の繊維を散布もしくは載置して繊維層
を形成する。そして、樹脂ペースト層で繊維層を挟持す
るように上下ポリエチレンフィルムを貼り合わせた後、
ローラー等で圧縮して繊維層間に樹脂ペーストを含浸さ
せるとともに脱泡してシートを作製し、次いで得られた
シートを室温〜60℃の温度で熟成させて樹脂ペースト
を所望の状態(成形性や取扱い性)に至るまで増粘させ
る、所謂SMCの製造に適用することができる。Also, a resin composition, a filler, a thickener, and a release agent and other additives added as necessary to each of the mating surfaces of the two upper and lower polyethylene films moving in the same direction at a constant speed. A resin paste made of an agent is applied with a doctor blade or the like to form a resin paste layer.
Further, a predetermined amount of fibers is further sprayed or placed on the resin paste layer on the lower polyethylene film side to form a fiber layer. Then, after bonding the upper and lower polyethylene films so that the fiber layer is sandwiched by the resin paste layer,
The resin paste is impregnated with a roller or the like to impregnate the resin paste between the fiber layers and defoamed to form a sheet. Then, the obtained sheet is aged at room temperature to 60 ° C. to bring the resin paste into a desired state (formability or formability). The present invention can be applied to the production of so-called SMC in which the viscosity is increased up to (handling ability).
【0022】また、SMC同様の配合物をニーダー等の
混練機で均一に混合した後、これに繊維を加えて更に混
練して繊維が均一に分散したBMC前駆体を作製し、こ
れを前記SMCと同様に熟成処理する、所謂BMCの製
造に適用することができる。さらには、シリカ粉等の充
填材を含んで成る封止材や一般的な非繊維系成形材料の
製造にも利用することができる。Further, after blending the same compound as SMC uniformly with a kneading machine such as a kneader, the fiber is added thereto and further kneaded to prepare a BMC precursor in which the fiber is uniformly dispersed, and this is mixed with the SMC. It can be applied to the production of a so-called BMC which undergoes aging treatment in the same manner as described above. Further, it can be used for the production of a sealing material containing a filler such as silica powder or a general non-fibrous molding material.
【0023】[0023]
【実施例】次に、実施例により本発明をさらに具体的か
つ詳細に説明するが、本発明はこれらの例によって限定
されるものではない。EXAMPLES Next, the present invention will be described more specifically and in detail with reference to examples, but the present invention is not limited to these examples.
【0024】製造例1 攪拌機、還流冷却器及び温度計を備えかつ減圧可能な反
応容器にフェノール1000g、47重量%ホルムアル
デヒド水溶液880g及び触媒としてトリエチルアミン
30gを仕込んだ後攪拌しながら昇温し、還流温度(1
00℃近傍)で1時間反応させた。その後、70mmHgの
減圧下で脱水濃縮して不揮発分70重量%の液状レゾー
ル型フェノール樹脂(A)を調製した。得られたフェノ
ール樹脂(A)は、数平均分子量が230、粘度が20
0 mPa・s (25℃)であった。なお、不揮発分は加熱
減量法(180℃×40分)、粘度はB型回転粘度計で
測定し、また数平均分子量は、東ソー(株)製HLC8
010型ゲルろ過クロマトグラフィー(分離カラムはG
XL1000+2000、溶離液はテトラヒドロフラン
1ml/min、UV検出器)により分子量分布曲線を得、こ
れを標準ポリスチレンに基づく分子量検量線により校正
して求めた。Production Example 1 1000 g of phenol, 880 g of a 47% by weight aqueous solution of formaldehyde, and 30 g of triethylamine as a catalyst were charged into a reaction vessel equipped with a stirrer, a reflux condenser and a thermometer and capable of reducing pressure. (1
(Around 00 ° C.) for 1 hour. Thereafter, the mixture was dehydrated and concentrated under a reduced pressure of 70 mmHg to prepare a liquid resol type phenol resin (A) having a nonvolatile content of 70% by weight. The obtained phenol resin (A) has a number average molecular weight of 230 and a viscosity of 20.
It was 0 mPa · s (25 ° C.). The nonvolatile content was measured by a heating loss method (180 ° C. × 40 minutes), the viscosity was measured by a B-type rotational viscometer, and the number average molecular weight was measured by HLC8 manufactured by Tosoh Corporation.
010 type gel filtration chromatography (separation column is G
XL1000 + 2000, eluent: tetrahydrofuran 1 ml / min, UV detector) to obtain a molecular weight distribution curve, which was determined by calibrating with a molecular weight calibration curve based on standard polystyrene.
【0025】製造例2 製造例1と同様に反応容器にフェノール1000g、4
7重量%ホルムアルデヒド水溶液880g及び触媒とし
て水酸化ナトリウム10gを仕込んだ後攪拌しながら昇
温し、還流温度(100℃近傍)で1時間反応させた。
その後、50℃まで冷却しパラトルエンスルホン酸で中
和し、次いで70mmHgの減圧下で脱水濃縮して不揮発分
70重量%の液状レゾール型フェノール樹脂(B)を調
製した。得られたフェノール樹脂(B)は、数平均分子
量が240、粘度が300 mPa・s (25℃)であっ
た。Production Example 2 In the same manner as in Production Example 1, 1000 g of phenol was added to a reaction vessel.
After charging 880 g of a 7% by weight aqueous formaldehyde solution and 10 g of sodium hydroxide as a catalyst, the mixture was heated with stirring and reacted at a reflux temperature (around 100 ° C.) for 1 hour.
Thereafter, the mixture was cooled to 50 ° C., neutralized with paratoluenesulfonic acid, and then dehydrated and concentrated under a reduced pressure of 70 mmHg to prepare a liquid resol type phenol resin (B) having a nonvolatile content of 70% by weight. The obtained phenol resin (B) had a number average molecular weight of 240 and a viscosity of 300 mPa · s (25 ° C.).
【0026】実施例1 まず、前記製造例1で調製したフェノール樹脂(A)1
00gに対し、脂肪族カルボン酸エステルとしてトリア
セチンを3g、充填材として炭酸カルシウムを100
g、増粘剤として酸化マグネシウム(ヨード吸着量20
mg/g)を5g及びステアリン酸亜鉛(離型剤)を3g
の割合で加えた後、実験用混合機で混合して樹脂ペース
トを得た。次いで、これをポリエチレンフィルム上に塗
布し、さらに繊維として長さ約25mmのガラスチョップ
ドストランドを散布したシートを2枚作製した。次い
で、これらのシートを貼り合わせてポリエチレンフィル
ム/樹脂ペースト及びガラス繊維/ポリエチレンフィル
ムの3層構造を有するシートとした後、これをロールで
圧縮してガラスチョップドストランドに樹脂ペーストを
含浸させるとともに脱泡してSMC前駆体を得た。な
お、ガラスチョップドストランドはSMC前駆体(成形
材料)中に30重量%含まれるように配合した。次い
で、このSMC前駆体を40℃で60時間熟成して増粘
させた粘度が6.3×106mPa・s (40℃)のSMC
(I)を得た。得られたSMCの単位面積当たりの重量
(以後「単重」と略称する)は3.0kg/m2であった。
なお、増粘処理後の粘度とは、SMC前駆体の熟成条件
と同一条件下で処理した樹脂ペーストをB型粘度計で測
定した値である。Example 1 First, the phenolic resin (A) 1 prepared in Production Example 1 was used.
3 g of triacetin as an aliphatic carboxylic acid ester and 100 g of calcium carbonate as a filler
g, magnesium oxide as a thickener (iodine adsorption amount 20
mg / g) and zinc stearate (release agent) 3 g
And then mixed with a laboratory mixer to obtain a resin paste. Next, this was applied on a polyethylene film, and two sheets of glass chopped strands having a length of about 25 mm were scattered as fibers to prepare two sheets. Next, these sheets are laminated to form a sheet having a three-layer structure of polyethylene film / resin paste and glass fiber / polyethylene film, and then compressed by a roll to impregnate the glass chopped strand with the resin paste and defoam. Thus, an SMC precursor was obtained. The glass chopped strand was blended so as to be contained at 30% by weight in the SMC precursor (molding material). Then, the SMC precursor was aged at 40 ° C. for 60 hours to increase the viscosity, and the SMC having a viscosity of 6.3 × 10 6 mPa · s (40 ° C.)
(I) was obtained. The weight per unit area of the obtained SMC (hereinafter abbreviated as “single weight”) was 3.0 kg / m 2 .
The viscosity after the thickening treatment is a value measured by a B-type viscometer on a resin paste treated under the same conditions as the aging conditions of the SMC precursor.
【0027】実施例2 実施例1において、トリアセチンに代えてエチレングリ
コールジアセテートを用いた以外は実施例1と同様にし
てSMC前駆体を作成した後、これを40℃で熟成して
粘度が5.4×106mPa・s (40℃)で単重が3.0
kg/m2のSMC(II)を得た。Example 2 An SMC precursor was prepared in the same manner as in Example 1 except that ethylene glycol diacetate was used in place of triacetin. 0.4 × 10 6 mPa · s (40 ° C.) and unit weight of 3.0
kg / m 2 of SMC (II) was obtained.
【0028】比較例1 実施例1において、トリアセチンを除いた以外は実施例
1と同様にしてSMC前駆体を作成した後、これを40
℃で熟成して粘度が6.8×106mPa・s (40℃)で
単重が3.0kg/m2のSMC(III)を得た。Comparative Example 1 An SMC precursor was prepared in the same manner as in Example 1 except that triacetin was omitted.
Aging at ℃ gave SMC (III) having a viscosity of 6.8 × 10 6 mPa · s (40 ° C.) and a unit weight of 3.0 kg / m 2 .
【0029】比較例2 実施例1において、フェノール樹脂(A)に代えてフェ
ノール樹脂(B)を用いた以外は実施例1と同様にして
SMC前駆体を作成し、これを40℃で熟成して粘度が
5.6×106mPa・s (40℃)で単重が3.0kg/m2
のSMC(IV)を得た。Comparative Example 2 An SMC precursor was prepared in the same manner as in Example 1 except that the phenol resin (B) was used instead of the phenol resin (A), and this was aged at 40 ° C. The viscosity is 5.6 × 10 6 mPa · s (40 ° C.) and the unit weight is 3.0 kg / m 2
SMC (IV) was obtained.
【0030】比較例3 実施例1において、フェノール樹脂(A)に代えてフェ
ノール樹脂(B)を用い、かつトリアセチンを除いた以
外は実施例1と同様にしてSMC前駆体を作成した後、
これを40℃で熟成して粘度が5.6×106mPa・s
(40℃)で単重が3.0kg/m2のSMC(V) を得
た。Comparative Example 3 An SMC precursor was prepared in the same manner as in Example 1 except that the phenol resin (B) was used instead of the phenol resin (A) and triacetin was omitted.
This is aged at 40 ° C. to have a viscosity of 5.6 × 10 6 mPa · s.
At 40 ° C., an SMC (V) having a unit weight of 3.0 kg / m 2 was obtained.
【0031】〔SMCの評価〕実施例1及び2と比較例
1〜3で得たSMCは、成形温度150℃、成形圧力
9.8×106 Pa、成形時間180秒で加熱加圧成形し
て試験体(長さ30cm×幅30cm×厚み3mm)を作製す
るとともに、成形時の臭気及びガスの発生状態について
調べた。なお、ガスの発生状態については、成形時にガ
ス抜きを行なわずに成形して得た試験体を目視で評価
し、試験体にボイド又は膨れのあるものを不良、膨れの
ないものを良好とした。また、成形収縮率の測定は JIS
-K-6911 に準じて行った。この際、実施例1、2の試験
体はガス抜きせずに成形し、比較例1〜3の試験体はボ
イド、膨れが生じないよう成形時にガス抜きを行って成
形したものを使用した。その結果を表1に示した。[Evaluation of SMC] The SMCs obtained in Examples 1 and 2 and Comparative Examples 1 to 3 were heated and pressed at a molding temperature of 150 ° C., a molding pressure of 9.8 × 10 6 Pa, and a molding time of 180 seconds. A test specimen (length 30 cm × width 30 cm × thickness 3 mm) was prepared, and the state of generation of odor and gas during molding was examined. For the state of gas generation, a test specimen obtained by molding without degassing at the time of molding was visually evaluated, and a specimen having a void or swelling was evaluated as defective, and a specimen without swelling was evaluated as good. . The measurement of the molding shrinkage is JIS
-I went according to K-6911. At this time, the test pieces of Examples 1 and 2 were formed without degassing, and the test pieces of Comparative Examples 1 to 3 were formed by degassing at the time of forming so as not to cause voids and swelling. The results are shown in Table 1.
【0032】[0032]
【表1】 [Table 1]
【0033】表1から明らかなように、本発明に係る樹
脂組成物を用いて得られるSMCは、従来のSMCのよ
うな成形時にガス抜きを行わなくてもボイドや膨れのな
い成形物を得ることができること、また成形収縮率が小
さくなることが確認された。また、これらの効果はトリ
エチルアミンを触媒として製造された液状レゾール型フ
ェノール樹脂とトリアセチン(脂肪族カルボン酸エステ
ル)の組合せに基づいてのみ達成できることも実施例1
と比較例2の比較により確認された。また、本発明のS
MCは成形時の臭気が従来のSMCと遜色のない程度に
微弱であることも確認された。As is clear from Table 1, the SMC obtained by using the resin composition according to the present invention can obtain a molded product without voids and blisters without degassing at the time of molding like the conventional SMC. It was also confirmed that the molding shrinkage ratio was small. In addition, Example 1 shows that these effects can be achieved only based on a combination of a liquid resol type phenol resin produced using triethylamine as a catalyst and triacetin (aliphatic carboxylic acid ester).
And Comparative Example 2 were confirmed. In addition, S of the present invention
It was also confirmed that MC had an odor at the time of molding, which was as weak as conventional SMC.
【0034】[0034]
【発明の効果】本発明に係る複合材用樹脂組成物によれ
ば、従来技術のようにガス抜き処理しなくてもボイドや
膨れを生じない良好な成形品を提供することができる。
また成形収縮率が従来技術より小さい成形品を提供する
ことができる。さらには成形時の臭気が従来技術と遜色
のない程度に少ないことなどの諸効果を奏する。また、
このような効果を奏する本発明組成物を用いて得られ
る、特に成形材料は、労働環境の汚染を伴わず、かつ成
形作業を簡素化して生産性の向上に寄与し得、しかも成
形収縮率の小さい成形品を提供することができるため、
厳しい寸法精度が要求される成形分野において有用であ
り、その産業上の価値は極めて高いものである。According to the resin composition for a composite material according to the present invention, it is possible to provide a good molded product which does not cause voids or swelling even without degassing as in the prior art.
Further, it is possible to provide a molded product having a molding shrinkage smaller than that of the prior art. Further, various effects such as the odor at the time of molding being reduced to a level not inferior to the prior art are exhibited. Also,
The molding material obtained by using the composition of the present invention having such an effect, particularly the molding material, can contribute to the improvement of productivity by simplifying the molding operation without contaminating the working environment, and can further reduce the molding shrinkage. Because we can provide small molded products,
It is useful in the molding field where strict dimensional accuracy is required, and its industrial value is extremely high.
フロントページの続き (51)Int.Cl.7 識別記号 FI C08K 7/02 C08K 7/02 (56)参考文献 特開 昭50−84690(JP,A) 特開 昭49−16793(JP,A) 特開 平4−249543(JP,A) 特開 平4−320442(JP,A) 特開 平7−138450(JP,A) 特開 平7−178507(JP,A) 特開 平5−23788(JP,A) 特開 平6−179040(JP,A) 特開 昭61−168574(JP,A) 特開 昭58−154433(JP,A) 特開 昭57−186(JP,A) 特開 平6−239948(JP,A) 特開 昭53−94565(JP,A) Holzforschung,48[2 ](1994),p.150−156 J.Appl.Polym.Sc i.,49[12](1993),p.2157− 2170 (58)調査した分野(Int.Cl.7,DB名) C08L 61/04 - 61/16 C08G 8/00 - 8/38 C08J 5/04 - 5/10 C08J 5/24 B29B 11/16 B29B 15/08 - 15/14 CA(STN) REGISTRY(STN)Continuation of the front page (51) Int.Cl. 7 identification code FI C08K 7/02 C08K 7/02 (56) References JP-A-50-84690 (JP, A) JP-A-49-16793 (JP, A) JP-A-4-249543 (JP, A) JP-A-4-320442 (JP, A) JP-A-7-138450 (JP, A) JP-A-7-178507 (JP, A) JP-A-5-23788 (JP, A) JP-A-6-179040 (JP, A) JP-A-61-168574 (JP, A) JP-A-58-154433 (JP, A) JP-A-57-186 (JP, A) JP-A-6-239948 (JP, A) JP-A-53-94565 (JP, A) Holzforschung, 48 [2] (1994), p. 150-156J. Appl. Polym. Sc i. , 49 [12] (1993), p. 2157− 2170 (58) Fields investigated (Int.Cl. 7 , DB name) C08L 61/04-61/16 C08G 8/00-8/38 C08J 5/04-5/10 C08J 5/24 B29B 11 / 16 B29B 15/08-15/14 CA (STN) REGISTRY (STN)
Claims (4)
状レゾール型フェノール樹脂、トリアセチン及び/又は
エチレングリコールジアセテートを含有して成る複合材
用樹脂組成物。1. A liquid resol-type phenol resin produced using a tertiary amine as a catalyst , triacetin and / or
A resin composition for a composite material comprising ethylene glycol diacetate .
請求項1記載の複合材用樹脂組成物。2. The resin composition according to claim 1, wherein the tertiary amine is triethylamine.
繊維を含有して成る成形材料。3. A molding material comprising the resin composition according to claim 1 or 2 and fibers.
維、充填材及び増粘剤を含有して成る成形材料。4. A molding material comprising the resin composition according to claim 1 or 2 , a fiber, a filler and a thickener.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12324494A JP3322990B2 (en) | 1994-05-13 | 1994-05-13 | Resin composition for composite material and molding material containing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12324494A JP3322990B2 (en) | 1994-05-13 | 1994-05-13 | Resin composition for composite material and molding material containing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07304928A JPH07304928A (en) | 1995-11-21 |
| JP3322990B2 true JP3322990B2 (en) | 2002-09-09 |
Family
ID=14855779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12324494A Expired - Fee Related JP3322990B2 (en) | 1994-05-13 | 1994-05-13 | Resin composition for composite material and molding material containing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3322990B2 (en) |
-
1994
- 1994-05-13 JP JP12324494A patent/JP3322990B2/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| Holzforschung,48[2](1994),p.150−156 |
| J.Appl.Polym.Sci.,49[12](1993),p.2157−2170 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07304928A (en) | 1995-11-21 |
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