JP3128235B2 - Curing method - Google Patents
Curing methodInfo
- Publication number
- JP3128235B2 JP3128235B2 JP32004790A JP32004790A JP3128235B2 JP 3128235 B2 JP3128235 B2 JP 3128235B2 JP 32004790 A JP32004790 A JP 32004790A JP 32004790 A JP32004790 A JP 32004790A JP 3128235 B2 JP3128235 B2 JP 3128235B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- curing
- resin
- dicarboxylic acid
- phenol resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001723 curing Methods 0.000 title claims description 41
- 239000005011 phenolic resin Substances 0.000 claims description 37
- 239000003054 catalyst Substances 0.000 claims description 18
- 150000003839 salts Chemical class 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 11
- 150000007522 mineralic acids Chemical class 0.000 claims description 8
- 150000007524 organic acids Chemical class 0.000 claims description 8
- 229920003986 novolac Polymers 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000000460 chlorine Substances 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- -1 polypropylene Polymers 0.000 description 16
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 12
- 229920001568 phenolic resin Polymers 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 150000001299 aldehydes Chemical class 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 235000013312 flour Nutrition 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical class OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical class CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical class NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 3
- JSYBAZQQYCNZJE-UHFFFAOYSA-N benzene-1,2,4-triamine Chemical compound NC1=CC=C(N)C(N)=C1 JSYBAZQQYCNZJE-UHFFFAOYSA-N 0.000 description 3
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical class OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 3
- 239000004312 hexamethylene tetramine Substances 0.000 description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000003739 xylenols Chemical class 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical class C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- KDSNLYIMUZNERS-UHFFFAOYSA-N 2-methylpropanamine Chemical compound CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 description 2
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- LULAYUGMBFYYEX-UHFFFAOYSA-N 3-chlorobenzoic acid Chemical compound OC(=O)C1=CC=CC(Cl)=C1 LULAYUGMBFYYEX-UHFFFAOYSA-N 0.000 description 2
- XHQZJYCNDZAGLW-UHFFFAOYSA-N 3-methoxybenzoic acid Chemical compound COC1=CC=CC(C(O)=O)=C1 XHQZJYCNDZAGLW-UHFFFAOYSA-N 0.000 description 2
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Chemical class C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- OJGMBLNIHDZDGS-UHFFFAOYSA-N N-Ethylaniline Chemical compound CCNC1=CC=CC=C1 OJGMBLNIHDZDGS-UHFFFAOYSA-N 0.000 description 2
- AFBPFSWMIHJQDM-UHFFFAOYSA-N N-methylaniline Chemical compound CNC1=CC=CC=C1 AFBPFSWMIHJQDM-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Chemical class O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical group OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical class O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- UFDHBDMSHIXOKF-UHFFFAOYSA-N cyclohexene-1,2-dicarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 2
- LJOODBDWMQKMFB-UHFFFAOYSA-N cyclohexylacetic acid Chemical compound OC(=O)CC1CCCCC1 LJOODBDWMQKMFB-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JBDSSBMEKXHSJF-UHFFFAOYSA-N cyclopentanecarboxylic acid Chemical compound OC(=O)C1CCCC1 JBDSSBMEKXHSJF-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- GPSDUZXPYCFOSQ-UHFFFAOYSA-N m-toluic acid Chemical compound CC1=CC=CC(C(O)=O)=C1 GPSDUZXPYCFOSQ-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- LPNBBFKOUUSUDB-UHFFFAOYSA-N p-toluic acid Chemical compound CC1=CC=C(C(O)=O)C=C1 LPNBBFKOUUSUDB-UHFFFAOYSA-N 0.000 description 2
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- 229920003987 resole Polymers 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
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- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
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- 239000002023 wood Substances 0.000 description 2
- JBLFIYDHGYMNEJ-UHFFFAOYSA-N (4-azaniumylphenyl)azanium;oxalate Chemical compound OC(=O)C(O)=O.NC1=CC=C(N)C=C1 JBLFIYDHGYMNEJ-UHFFFAOYSA-N 0.000 description 1
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- RQEUFEKYXDPUSK-UHFFFAOYSA-N 1-phenylethylamine Chemical compound CC(N)C1=CC=CC=C1 RQEUFEKYXDPUSK-UHFFFAOYSA-N 0.000 description 1
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- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- AOPBDRUWRLBSDB-UHFFFAOYSA-N 2-bromoaniline Chemical compound NC1=CC=CC=C1Br AOPBDRUWRLBSDB-UHFFFAOYSA-N 0.000 description 1
- XRXMNWGCKISMOH-UHFFFAOYSA-N 2-bromobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Br XRXMNWGCKISMOH-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical compound NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- IKCLCGXPQILATA-UHFFFAOYSA-N 2-chlorobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Cl IKCLCGXPQILATA-UHFFFAOYSA-N 0.000 description 1
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- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- NCBZRJODKRCREW-UHFFFAOYSA-N m-anisidine Chemical compound COC1=CC=CC(N)=C1 NCBZRJODKRCREW-UHFFFAOYSA-N 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical class NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 235000019426 modified starch Nutrition 0.000 description 1
- 239000003110 molding sand Substances 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- VMPITZXILSNTON-UHFFFAOYSA-N o-anisidine Chemical compound COC1=CC=CC=C1N VMPITZXILSNTON-UHFFFAOYSA-N 0.000 description 1
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- BHAAPTBBJKJZER-UHFFFAOYSA-N p-anisidine Chemical compound COC1=CC=C(N)C=C1 BHAAPTBBJKJZER-UHFFFAOYSA-N 0.000 description 1
- FXLOVSHXALFLKQ-UHFFFAOYSA-N p-tolualdehyde Chemical compound CC1=CC=C(C=O)C=C1 FXLOVSHXALFLKQ-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- HKOOXMFOFWEVGF-UHFFFAOYSA-N phenylhydrazine Chemical compound NNC1=CC=CC=C1 HKOOXMFOFWEVGF-UHFFFAOYSA-N 0.000 description 1
- 229940067157 phenylhydrazine Drugs 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical class OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- BHRZNVHARXXAHW-UHFFFAOYSA-N sec-butylamine Chemical compound CCC(C)N BHRZNVHARXXAHW-UHFFFAOYSA-N 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical class OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001864 tannin Chemical class 0.000 description 1
- 239000001648 tannin Chemical class 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Chemical class 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はフェノール樹脂を低温短時間で硬化させる方
法、特に繊維、木粉、セラミック、鋳物砂等のバインダ
ーとして使用されるフェノール樹脂を低温、短時間で硬
化させる方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for curing a phenolic resin at a low temperature and in a short time, particularly, a phenolic resin used as a binder for fibers, wood flour, ceramics, molding sand and the like at a low temperature. It relates to a method of curing in a short time.
〔従来の課題〕 従来、この種のバインダーとしてはレゾール型フェノ
ール樹脂粉末またはノボラック型フェノール樹脂とヘキ
サメチレンテトラミンのようなアルデヒド供与体との混
合粉末が使用されていた。しかしながらこのようなフェ
ノール樹脂は硬化温度が約200℃と高く、フェルトのバ
インダーとして用いる場合には繊維が熱により変質脆化
するし、ポリプロピレン繊維のような低融点繊維の場合
にはバインダーとして全く使用出来ない。セラミックや
鋳物砂のバインダーとして用いる場合でもこのような高
温で硬化させるには加熱装置の規模が大きくなるし、ま
たは熱エネルギーが浪費される。[Conventional Problems] Conventionally, as this type of binder, a resol-type phenol resin powder or a mixed powder of a novolak-type phenol resin and an aldehyde donor such as hexamethylenetetramine has been used. However, such a phenolic resin has a high curing temperature of about 200 ° C, and when used as a binder for felt, the fiber is denatured and embrittled by heat, and when used as a low melting point fiber such as polypropylene fiber, it is used as a binder at all. Can not. Even when used as a binder for ceramics or foundry sand, curing at such a high temperature requires a large-scale heating device or wastes heat energy.
このためハイオルソ型の速硬化性フェノール樹脂が用
いられる場合があるが、このものは低温短時間で硬化さ
せた場合、見かけの硬化は速いが、硬化後の樹脂の強度
は通常のフェノール樹脂に比べて著しく弱くなると云う
欠点があった。For this reason, a high-ortho-type fast-curing phenol resin may be used, but when cured at a low temperature for a short time, the apparent curing speed is fast, but the strength of the cured resin is lower than that of a normal phenol resin. There is a disadvantage that it becomes significantly weaker.
本発明は上記従来の課題を解決するための手段とし
て、フェノール樹脂を有機酸または無機酸(酸化剤を除
く)と窒素含有塩素との塩である硬化触媒によって硬化
させる硬化方法、およびノボラック型フェノール樹脂と
その硬化剤であるアルデヒド供与体との混合物を有機酸
または無機酸(酸化剤を除く)と窒素含有塩基との塩で
ある硬化触媒によって硬化させる硬化方法を提供するも
のである。The present invention provides a curing method for curing a phenolic resin with a curing catalyst which is a salt of an organic acid or an inorganic acid (excluding an oxidizing agent) and nitrogen-containing chlorine, and a novolak-type phenol. An object of the present invention is to provide a curing method in which a mixture of a resin and an aldehyde donor as a curing agent thereof is cured with a curing catalyst which is a salt of an organic acid or an inorganic acid (excluding an oxidizing agent) and a nitrogen-containing base.
以下に本発明を詳細に説明するが、下記例示は本発明
を限定するものではない。Hereinafter, the present invention will be described in detail, but the following examples do not limit the present invention.
[フェノール樹脂] フェノール樹脂は云うまでもなくフェノール、クレゾ
ール、キシレノール等のフェノール類の一種または二種
以上の混合物とホルムアルデヒドとの反応により得られ
るものであり、例えばフェノール樹脂およびo−クレゾ
ール、m−クレゾール、p−クレゾール、エチルフェノ
ール、iso−プロピルフェノール、キシレノール、3,5−
キシレノール、ブチルフェノール、ノニルフェノール等
のアルキルフェノール、o−フルオロフェノール、m−
フルオロフェノール、p−フルオロフェノール、o−ク
ロロフェノール、m−クロロフェノール、p−クロロフ
ェノール、o−ブロモフェノール、m−ブロモフェノー
ル、p−ブロモフェノール、o−ヨードフェノール、m
−ヨードフェノール、p−ヨードフェノール、o−アミ
ノフェノール、m−アミノフェノール、p−アミノフェ
ノール、o−ニトロフェノール、m−ニトロフェノー
ル、p−ニトロフェノール、2,4−ジニトロフェノー
ル、2,4,6−トリニトロフェノール等の一価フェノール
置換体、ナフトール類等の一価フェノール類の一種また
は二種以上の混合物とホルムアルデヒド等のアルデヒド
供与体との反応により得られるものであり、反応触媒と
してアンモニア、カセイソーダ等のアルカリ触媒を用い
たレゾール型フェノール樹脂、硫酸、塩酸等の酸触媒等
を用いたノボラック型フェノール樹脂のどちらでも本発
明のフェノール樹脂として用いられる。[Phenol resin] Needless to say, the phenol resin is obtained by reacting one or a mixture of two or more phenols such as phenol, cresol and xylenol with formaldehyde. Cresol, p-cresol, ethylphenol, iso-propylphenol, xylenol, 3,5-
Alkylphenols such as xylenol, butylphenol and nonylphenol, o-fluorophenol, m-
Fluorophenol, p-fluorophenol, o-chlorophenol, m-chlorophenol, p-chlorophenol, o-bromophenol, m-bromophenol, p-bromophenol, o-iodophenol, m
-Iodophenol, p-iodophenol, o-aminophenol, m-aminophenol, p-aminophenol, o-nitrophenol, m-nitrophenol, p-nitrophenol, 2,4-dinitrophenol, 2,4, It is obtained by reacting a monohydric phenol substituent such as 6-trinitrophenol, or a mixture of one or more monohydric phenols such as naphthols with an aldehyde donor such as formaldehyde. Any of resol type phenol resins using an alkali catalyst such as sodium hydroxide and caustic soda, and novolak type phenol resins using an acid catalyst such as sulfuric acid and hydrochloric acid can be used as the phenol resin of the present invention.
また本発明においてはフェノール樹脂に所望なれば、
レゾルシン、アルキルレゾルシン、カテコール、アルキ
ルカテコール、ハイドロキノン、アルキルハイドロキノ
ン、ピロガロール、フロログリシン、尿素、メラミン、
チオ尿素、ベンゾグアナミン、トルエン、キシレン、ク
マロン、シクロヘキサノン、カシューオイル、タンニン
類、ダンマー、セラック、ロジンまたはロジン誘導体、
石油樹脂、メタノール、エタノール、イソロパノール、
ブタノール、エチレングリコール、グリセリン、フルフ
リルアルコール、アマニ油、桐油、ひまし油等の一種ま
たは二種以上を用いて変性したものであってもよい。In the present invention, if desired in the phenolic resin,
Resorcin, alkyl resorcin, catechol, alkyl catechol, hydroquinone, alkyl hydroquinone, pyrogallol, phloroglysin, urea, melamine,
Thiourea, benzoguanamine, toluene, xylene, coumarone, cyclohexanone, cashew oil, tannins, dammer, shellac, rosin or rosin derivative,
Petroleum resin, methanol, ethanol, islopanol,
It may be modified with one or more of butanol, ethylene glycol, glycerin, furfuryl alcohol, linseed oil, tung oil, castor oil and the like.
[硬化触媒] 本発明においては硬化触媒として、有機酸または無機
酸(酸化剤を除く)と窒素含有塩基との塩が用いられ
る。上記有機酸としては、蟻酸、酢酸、プロピオン酸、
酪酸、吉草酸、蓚酸、コハク酸、マレイン酸、酒石酸、
カプロン酸、カプリル酸、カプリン酸、ラウリン酸、ミ
リスチン酸、パルミチン酸、ステアリン酸、オレイン
酸、リノール酸、リノレン酸等の脂肪酸、ピクリン酸、
フェニル酢酸、安息香酸、o−トルイル−酸、m−トル
イル酸、p−トルイル酸、o−クロロ安息香酸、m−ク
ロロ安息香酸、p−クロロ安息香酸、o−ブロモ安息香
酸、m−ブロモ安息香酸、p−ブロモ安息香酸、o−ニ
トロ安息香酸、m−ニトロ安息香酸、p−ニトロ安息香
酸、フタル酸、イソフタル酸、テレフタル酸、サリチル
酸、p−ヒドロキシ安息香酸、アントラニル酸、o−ア
ミノ安息香酸、m−アミノ安息香酸、p−アミノ安息香
酸、o−メトキシ安息香酸、m−メトキシ安息香酸、p
−メトキシ安息香酸等の芳香族カルボン酸、およびシク
ロブタンカルボン酸、シクロブタン−1,2−ジカルボン
酸、シクロブタン−1,3−ジカルボン酸、シクロプロパ
ンカルボン酸、シクロプロパン−1,1−ジカルボン酸、
シクロプロパン−1,2−ジカルボン酸、シクロプロパン
−1,1,2−トリカルボン酸、シクロプロパン−1,2,3−ト
リカルボン酸、1,3−シクロヘキサジエン−1−カルボ
ン酸、1,3−シクロヘキサジエン−1,2−ジカルボン酸、
1,3−シクロヘキサジエン−1,3−ジカルボン酸、1,3−
シクロヘキサジエン−1,4−ジカルボン酸、1,3−シクロ
ヘキサジエン−1,6−ジカルボン酸、1,3−シクロヘキサ
ジエン−2,3−ジカルボン酸、1,3−シクロヘキサジエン
−2,5−ジカルボン酸、1,3−シクロヘキサジエン−3,5
−ジカルボン酸、1,3−シクロヘキサジエン−5,6−ジカ
ルボン酸、1,4−シクロヘキサジエン−1,2−ジカルボン
酸、1,4−シクロヘキサジエン−1,4−ジカルボン酸、1,
4−シクロヘキサジエン−1,6−ジカルボン酸、1,4−シ
クロヘキサジエン−3,6−ジカルボン酸、シクロヘキサ
ノール−2−カルボン酸、シクロヘキサノンカルボン
酸、シクロヘキサンカルボン酸、シクロヘキサン−1,2
−ジカルボン酸、シクロヘキサン−1,3−ジカルボン
酸、シクロヘキサン−1,4−ジカルボン酸、シクロヘキ
サンヘキサカルボン酸、シクロヘキシル酢酸、シクロヘ
キセンカルボン酸、シクロヘキセン−1,2−ジカルボン
酸、シクロヘキセン−1,3−ジカルボン酸、シクロヘキ
セン−1,4−ジカルボン酸、シクロヘキセン−1,5−ジカ
ルボン酸、シクロヘキセン−1,6−ジカルボン酸、シク
ロヘキセン−3,4−ジカルボン酸、シクロヘキセン−3,5
−ジカルボン酸、シクロヘキセン−3,6−ジカルボン
酸、シクロヘキセン−4,5−ジカルボン酸、シクロペン
タンカルボン酸、シクロペンタン−1,1−ジカルボン
酸、シクロペンタン−1,2−ジカルボン酸、シクロペン
タン−1,3−ジカルボン酸、シクロペンテン−3−カル
ボン酸等の脂環式カルボン酸等が例示され、上記無機酸
としては、硫酸、塩酸、燐酸等が例示される。窒素含有
塩基としてはアンモニアおよびヒドロキシルアミン、フ
ェニルヒドラジン、セミカルバジド、ヒドラジン等のア
ンモニア誘導体、メチルアミン、ジメチルアミン、トリ
メチルアミン、エチルアミン、ジエチルアミン、トリエ
チルアミン、n−プロピルアミン、ジ−n−プロピルア
ミン、トリ−n−プロピルアミン、iso−プロピルアミ
ン、ジ−iso−プロピルアミン、n−ブチルアミン、iso
−ブチルアミン、sec−ブチルアミン、ter−ブチルアミ
ン、ベンジルアミン、α−フェニルエチルアミン、β−
フェニルエチルアミン、エチレンジアミン、テトラメチ
レンジアミン、テトラエチレンジアミン、ヘキサメチレ
ンジアミン、水酸化テトラメチルアンモニウム等の脂肪
族アミン、アニリン、メチルアニリン、エチルアニリ
ン、ジメチルアニリン、ジエチルアニリン、ジフェニル
アミン、トリフェニルアミン、o−トルイジン、m−ト
ルイジン、p−トルイジン、o−アニシジン、m−アニ
シジン、p−アニシジン、o−クロロアニリン、m−ク
ロロアニリン、p−クロロアニリン、o−ブロモアニリ
ン、m−ブロモアニリン、p−ブロモアニリン、o−ニ
トロアニリン、o−フェニレンジアミン、m−フェニレ
ンジアミン、p−フェニレンジアミン、1,2,3−トリア
ミノベンゼン、1,2,4−トリアミノベンゼン、1,2,5−ト
リアミノベンゼン、1−ナフチルアミン、2−ナフチル
アミンおよびそれらの誘導体等の芳香族アミン、シクロ
ブチルアミン、シクロヘキシルアミン、シクロプロピル
アミン、シクロヘプチルアミン、シクロペンチルアミン
等の脂環式アミン、ピペリジン、ピリジン、キノリン、
イミダゾール等の複素環化合物の塩基が例示される。[Curing Catalyst] In the present invention, a salt of an organic acid or an inorganic acid (excluding an oxidizing agent) and a nitrogen-containing base is used as a curing catalyst. The organic acids include formic acid, acetic acid, propionic acid,
Butyric acid, valeric acid, oxalic acid, succinic acid, maleic acid, tartaric acid,
Fatty acids such as caproic acid, caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, linolenic acid, picric acid,
Phenylacetic acid, benzoic acid, o-toluic acid, m-toluic acid, p-toluic acid, o-chlorobenzoic acid, m-chlorobenzoic acid, p-chlorobenzoic acid, o-bromobenzoic acid, m-bromobenzoic acid Acid, p-bromobenzoic acid, o-nitrobenzoic acid, m-nitrobenzoic acid, p-nitrobenzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid, p-hydroxybenzoic acid, anthranilic acid, o-aminobenzoic acid Acid, m-aminobenzoic acid, p-aminobenzoic acid, o-methoxybenzoic acid, m-methoxybenzoic acid, p
Aromatic carboxylic acids such as -methoxybenzoic acid, and cyclobutanecarboxylic acid, cyclobutane-1,2-dicarboxylic acid, cyclobutane-1,3-dicarboxylic acid, cyclopropanecarboxylic acid, cyclopropane-1,1-dicarboxylic acid,
Cyclopropane-1,2-dicarboxylic acid, cyclopropane-1,1,2-tricarboxylic acid, cyclopropane-1,2,3-tricarboxylic acid, 1,3-cyclohexadiene-1-carboxylic acid, 1,3- Cyclohexadiene-1,2-dicarboxylic acid,
1,3-cyclohexadiene-1,3-dicarboxylic acid, 1,3-
Cyclohexadiene-1,4-dicarboxylic acid, 1,3-cyclohexadiene-1,6-dicarboxylic acid, 1,3-cyclohexadiene-2,3-dicarboxylic acid, 1,3-cyclohexadiene-2,5-dicarboxylic acid Acid, 1,3-cyclohexadiene-3,5
-Dicarboxylic acid, 1,3-cyclohexadiene-5,6-dicarboxylic acid, 1,4-cyclohexadiene-1,2-dicarboxylic acid, 1,4-cyclohexadiene-1,4-dicarboxylic acid,
4-cyclohexadiene-1,6-dicarboxylic acid, 1,4-cyclohexadiene-3,6-dicarboxylic acid, cyclohexanol-2-carboxylic acid, cyclohexanonecarboxylic acid, cyclohexanecarboxylic acid, cyclohexane-1,2
-Dicarboxylic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, cyclohexanehexacarboxylic acid, cyclohexylacetic acid, cyclohexenecarboxylic acid, cyclohexene-1,2-dicarboxylic acid, cyclohexene-1,3-dicarboxylic acid Acid, cyclohexene-1,4-dicarboxylic acid, cyclohexene-1,5-dicarboxylic acid, cyclohexene-1,6-dicarboxylic acid, cyclohexene-3,4-dicarboxylic acid, cyclohexene-3,5
-Dicarboxylic acid, cyclohexene-3,6-dicarboxylic acid, cyclohexene-4,5-dicarboxylic acid, cyclopentanecarboxylic acid, cyclopentane-1,1-dicarboxylic acid, cyclopentane-1,2-dicarboxylic acid, cyclopentane- Alicyclic carboxylic acids such as 1,3-dicarboxylic acid and cyclopentene-3-carboxylic acid are exemplified, and examples of the inorganic acid include sulfuric acid, hydrochloric acid, and phosphoric acid. Examples of the nitrogen-containing base include ammonia and ammonia derivatives such as hydroxylamine, phenylhydrazine, semicarbazide, and hydrazine, methylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, n-propylamine, di-n-propylamine, and tri-n -Propylamine, iso-propylamine, di-iso-propylamine, n-butylamine, iso
-Butylamine, sec-butylamine, ter-butylamine, benzylamine, α-phenylethylamine, β-
Aliphatic amines such as phenylethylamine, ethylenediamine, tetramethylenediamine, tetraethylenediamine, hexamethylenediamine, tetramethylammonium hydroxide, aniline, methylaniline, ethylaniline, dimethylaniline, diethylaniline, diphenylamine, triphenylamine, o-toluidine , M-toluidine, p-toluidine, o-anisidine, m-anisidine, p-anisidine, o-chloroaniline, m-chloroaniline, p-chloroaniline, o-bromoaniline, m-bromoaniline, p-bromoaniline , O-nitroaniline, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 1,2,3-triaminobenzene, 1,2,4-triaminobenzene, 1,2,5-triaminobenzene , 1-na Butylamine, 2-naphthylamine and aromatic amines such as derivatives thereof, cyclobutylamine, cyclohexylamine, cyclopropylamine, cycloheptylamine, alicyclic amines such as cyclopentylamine, piperidine, pyridine, quinoline,
Bases of heterocyclic compounds such as imidazole are exemplified.
[アルデヒド供与体] フェノール樹脂としてノボラック型を用いた場合には
硬化剤としてアルデヒド供与体が添加される。上記アル
デヒド供与体としてはホルマリン、ホルムアルデヒド、
パラホルムアルデヒド、トリオキサン、アセトアルデヒ
ド、プロピオンアルデヒド、ポリオキシメチレン、クロ
ラール、ヘキサメチレンテトラミン、フルフラール、グ
リオキザール、n−ブチルアルデヒド、カプロアルデヒ
ド、ベンズアルデヒド、アクロレイン、テトラオキシメ
チレン、フェニルアセトアルデヒド、o−トルアルデヒ
ド、m−トルアルデヒド、p−トルアルデヒド、サリチ
ルアルデヒド等の一種あるいはこれらの二種以上の混合
物等が例示される。[Aldehyde Donor] When a novolak type phenol resin is used, an aldehyde donor is added as a curing agent. As the aldehyde donor, formalin, formaldehyde,
Paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, caproaldehyde, benzaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, m Examples include -tolualdehyde, p-tolualdehyde, salicylaldehyde, and the like, or a mixture of two or more thereof.
[配合] 本発明の硬化方法は上記フェノール樹脂を有機酸また
は酸化剤を除く無機酸と窒素含有塩基との塩を硬化触媒
として硬化させるものであるが、その配合比率は一般的
に云って上記フェノール樹脂100重量部に対して上記硬
化触媒を0.05〜30重量部程度とされる。[Blending] The curing method of the present invention cures the phenolic resin using a salt of a nitrogen-containing base with an inorganic acid other than an organic acid or an oxidizing agent as a curing catalyst. The curing catalyst is used in an amount of about 0.05 to 30 parts by weight based on 100 parts by weight of the phenol resin.
上記フェノール樹脂に上記硬化触媒を配合する方法と
しては、(1)上記フェノール樹脂と上記硬化触媒とを
共に粉末状態で混合する方法、(2)フェノール樹脂を
製造し固体粉末にする前の溶液状態において硬化触媒を
添加してから固体粉末とする方法、(3)上記フェノー
ル樹脂の溶液に硬化触媒を混合溶解させる方法等が採用
される。上記方法(1)および(2)では粉末状の組成
物が得られ、方法(3)では溶液状の組成物が得られ
る。The method of blending the curing catalyst with the phenol resin includes (1) a method in which the phenol resin and the curing catalyst are mixed together in a powder state, and (2) a solution state before the phenol resin is produced and made into a solid powder. , A method of adding a curing catalyst to obtain a solid powder, and (3) a method of mixing and dissolving the curing catalyst in the solution of the phenol resin. In the above methods (1) and (2), a powdery composition is obtained, and in the method (3), a solution-like composition is obtained.
上記フェノール樹脂がノボラック型の場合には更に硬
化剤として上記アルデヒド供与体が添加使用されるが、
この場合通常上記フェノール樹脂100重量部に対して1
〜30重量部程度配合される。またレゾール型フェノール
樹脂の場合でも必要ならば上記アルデヒド供与体を適宜
添加してもよい。When the phenolic resin is a novolak type, the aldehyde donor is used as a curing agent.
In this case, usually 1 to 100 parts by weight of the above phenol resin
About 30 parts by weight are blended. Further, even in the case of a resol type phenol resin, the above aldehyde donor may be appropriately added if necessary.
[第三物質] 本発明においては上記配合物に更に必要ならば第三物
質を配合することも出来る。第三物質としては例えば、
天然ゴムおよびその誘導体、SBR,NBR,CR,EPT等の合成ゴ
ム、酢酸ビニル樹脂、エチレン−酢酸ビニル共重合樹
脂、アクリル樹脂、メタクリル樹脂、塩化ビニル樹脂、
塩化ビニリデン樹脂、ポリスチレン、ポリエチレン、ポ
リプロピレン、塩素化ポリエチレン、塩素化ポリプロピ
レン、ポリエステル樹脂、ウレタン樹脂、ポリアミド樹
脂、エポキシ樹脂、ブチラール樹脂、ポリアクリル酸、
ポリアクリルアミド、ポリビニルアルコール、メチルセ
ルローズ、カルボキシメチルセルローズ、ヒドロキシメ
チルセルローズ、ヒドロキシエチルセルロース等のセル
ローズ誘導体、アルギン酸ソーダ、でんぷん、でんぷん
誘導体、ゼラチン、膠、血粉等の蛋白質、炭酸カルシウ
ム、タルク、カーボンブラック、シリカ、木粉、クルミ
粉、椰子殻粉、小麦粉等の充填剤、顔料、染料、防腐
剤、防虫剤、老化防止剤、紫外線吸収剤、酸化防止剤、
三酸化アンチモン、水酸化アルミニウム、ブロム化合物
等の防炎剤、ワックス、シリコン樹脂等の離型剤、撥水
剤等であり、これらの一種または二種以上の混合物を添
加し、変性してもよい。[Third substance] In the present invention, a third substance can be further added to the above-mentioned compound if necessary. As the third substance, for example,
Natural rubber and its derivatives, synthetic rubber such as SBR, NBR, CR, EPT, vinyl acetate resin, ethylene-vinyl acetate copolymer resin, acrylic resin, methacrylic resin, vinyl chloride resin,
Vinylidene chloride resin, polystyrene, polyethylene, polypropylene, chlorinated polyethylene, chlorinated polypropylene, polyester resin, urethane resin, polyamide resin, epoxy resin, butyral resin, polyacrylic acid,
Cellulose derivatives such as polyacrylamide, polyvinyl alcohol, methylcellulose, carboxymethylcellulose, hydroxymethylcellulose, hydroxyethylcellulose, sodium alginate, starch, starch derivatives, gelatin, glue, blood powder and other proteins, calcium carbonate, talc, carbon black, silica , Wood flour, walnut flour, coconut husk flour, flour and other fillers, pigments, dyes, preservatives, insect repellents, anti-aging agents, ultraviolet absorbers, antioxidants,
Antimony trioxide, aluminum hydroxide, flame retardants such as bromo compounds, waxes, release agents such as silicone resins, water repellents, etc., even if one or a mixture of two or more of these is added and denatured Good.
[作用] 本発明においてはフェノール樹脂、またはフェノール
樹脂がノボラック型である場合は更にアルデヒド供与体
を加えた混合物と、有機酸または酸化剤を除く無機酸と
窒素含有塩基との塩の混合状態では常温で殆んど硬化し
ないが、加熱すると上記塩が触媒的に作用し、フェノー
ル樹脂を急激に硬化させ、低温短時間で硬化が完了し、
また生成した樹脂は市販ハイオルソ型フェノール樹脂の
場合のような強度低下を起さない。[Action] In the present invention, when the phenol resin or the phenol resin is of a novolak type, a mixture of an aldehyde donor and a salt of an inorganic acid excluding an organic acid or an oxidizing agent and a nitrogen-containing base are mixed. It hardly cures at room temperature, but when heated, the above salt acts as a catalyst, rapidly curing the phenolic resin, curing is completed in a short time at low temperature,
Further, the produced resin does not cause a decrease in strength as in the case of a commercially available high ortho-type phenol resin.
実施例1〜4、比較例1〜2 ノボラック型フェノール樹脂粉末(以下樹脂NB−Aと
云う)およびハイオルソノボラックフェノール樹脂(以
下樹脂NB−Bと云う)に酸と窒素含有塩基との塩の硬化
触媒として蓚酸−p−フェニレンジアミンを用い、また
アルデヒド供与体としてヘキサメチレンテトラミンを用
い、表1に示す混合比率の硬化組成物とし、ゲル化時
間、成形性およびキュラストメーターによる応力の試験
を行った。Examples 1-4, Comparative Examples 1-2 Novolak-type phenolic resin powder (hereinafter referred to as resin NB-A) and high-ortho novolac phenolic resin (hereinafter referred to as resin NB-B) were prepared by adding a salt of an acid and a nitrogen-containing base to a resin. Using oxalic acid-p-phenylenediamine as a curing catalyst, and hexamethylenetetramine as an aldehyde donor, a curing composition having a mixing ratio shown in Table 1 was used to test the gelation time, moldability, and stress with a curastometer. went.
その結果を表1に示した。 The results are shown in Table 1.
実施例5〜6、比較例3〜4 実施例1および3で用いたと同様のノボラック型フェ
ノール樹脂粉末(樹脂NB−A)に酸と窒素含有塩基との
塩の硬化触媒と、酸と窒素非含有塩基との塩を用いて前
記実施例と同様のゲル化時間、成形性の試験を行った。 Examples 5 to 6 and Comparative Examples 3 to 4 The same novolak type phenol resin powder (resin NB-A) as used in Examples 1 and 3 was cured with a salt curing catalyst of an acid and a nitrogen-containing base, and an acid and a nitrogen-free catalyst. Using the salt with the contained base, the same gelation time and moldability test as in the above Examples were performed.
配合処方および硬化試験の結果は表2のようであっ
た。Table 2 shows the formulation and the result of the curing test.
上記の結果から、酸と窒素含有塩基との塩である硬化
触媒を添加した実施例では比較例に比して低温、短時間
で硬化することが判る。 From the above results, it can be seen that in Examples in which a curing catalyst which is a salt of an acid and a nitrogen-containing base was added, curing was performed at a lower temperature and in a shorter time than in Comparative Examples.
したがって本発明においてはフェノール樹脂の硬化温
度が低くなるから、耐熱性の低い繊維のバイダーとして
もフェノール樹脂を用いることが可能となり、また硬化
の際の熱エネルギーが大巾に節減される。そして本発明
においてはフェノール樹脂の硬化後の強度は通常のフェ
ノール樹脂と同等またはそれ以上である。Therefore, in the present invention, the curing temperature of the phenolic resin is lowered, so that the phenolic resin can be used as a binder for fibers having low heat resistance, and the heat energy during curing is greatly reduced. In the present invention, the strength of the phenol resin after curing is equal to or higher than that of a normal phenol resin.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特公 昭43−17803(JP,B1) 米国特許3474054(US,A) (58)調査した分野(Int.Cl.7,DB名) C08J 3/00 - 3/28 C08L 61/06 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-B-43-17803 (JP, B1) US Patent 3,470,544 (US, A) (58) Fields investigated (Int. Cl. 7 , DB name) C08J 3 / 00-3/28 C08L 61/06
Claims (2)
化剤を除く)と窒素含有塩素との塩である硬化触媒によ
って硬化させることを特徴とする硬化方法1. A curing method comprising curing a phenol resin with a curing catalyst which is a salt of an organic acid or an inorganic acid (excluding an oxidizing agent) and nitrogen-containing chlorine.
であるアルデヒド供与体との混合物を有機酸または無機
酸(酸化剤を除く)と窒素含有塩基との塩である硬化触
媒によって硬化させることを特徴とする硬化方法2. A mixture of a novolak type phenol resin and an aldehyde donor as a curing agent thereof is cured by a curing catalyst which is a salt of an organic acid or an inorganic acid (excluding an oxidizing agent) and a nitrogen-containing base. And curing method
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32004790A JP3128235B2 (en) | 1990-11-21 | 1990-11-21 | Curing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32004790A JP3128235B2 (en) | 1990-11-21 | 1990-11-21 | Curing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04189836A JPH04189836A (en) | 1992-07-08 |
| JP3128235B2 true JP3128235B2 (en) | 2001-01-29 |
Family
ID=18117143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32004790A Expired - Fee Related JP3128235B2 (en) | 1990-11-21 | 1990-11-21 | Curing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3128235B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040116647A1 (en) * | 2002-12-04 | 2004-06-17 | Swedo Raymond J. | Novel phenolic resins |
| CN115569671B (en) * | 2022-11-18 | 2023-05-23 | 苏州大学 | Method for synthesizing deoxidizing catalyst by solvent-free dry method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3474054A (en) | 1966-09-13 | 1969-10-21 | Permalac Corp The | Surface coating compositions containing pyridine salts or aromatic sulfonic acids |
-
1990
- 1990-11-21 JP JP32004790A patent/JP3128235B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3474054A (en) | 1966-09-13 | 1969-10-21 | Permalac Corp The | Surface coating compositions containing pyridine salts or aromatic sulfonic acids |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04189836A (en) | 1992-07-08 |
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