JP3176867B2 - CV cable external semiconductive layer shaving machine and shaving method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CV cable outer semiconductive layer shaving machine for shaving an outer semiconductive layer of a CV cable into a tapered shape when performing a terminal treatment when connecting a power cable, and a shaving machine using the same. It concerns the construction method.

[0002]

2. Description of the Related Art When a CV cable having an external semiconductive layer which is extruded simultaneously with an insulator and integrated with the insulator is connected, a conventional external semiconductive layer stripping operation performed as a terminal treatment is performed using glass. A work method is performed in which the outer semiconductive layer is scraped off in the axial direction of the cable using a piece or the like, and finally the surface of the insulator is smoothly finished with an emery cloth (sandpaper) or the like. In addition, a construction method is also used in which an external semiconductive layer shaving machine for shaving an external semiconductive layer by rotating a cutting blade in a cable circumferential direction manually or by a drive motor is used. (For example, Japanese Utility Model Publication No. 58-12498,
JP-A-59-75707 and JP-A-5-801.
No. 16)

[0003]

By the way, the tip of the outer semiconductive layer must be tapered to a length of 15 to 50 mm so as not to form a step in order to reduce the electric field. However, since the cross-sectional shape of the CV cable is not a perfect circle, it is extremely difficult to perform this work with the above-mentioned external semiconductive layer shaving machine. As in the case of the pencil ring, the finishing must be finally performed by hand using a hand tool such as a piece of glass.

As described above, the formation of the pencil ring at the tip of the outer semi-conductive layer of the CV cable connection is inevitably manual work, and the outer semi-conductive layer is smoothed on a continuous surface from the flat cut portion. A high degree of skill is required to sharpen the slope, and there is a concern that the surface of the cable insulator may be damaged by biting a piece of glass or the like. Also, in order to make the surface of the outer semiconductive layer slope smoothly continuous with the flat part cut by the outer semiconductive layer shaving machine, it is absolutely necessary to cut the flat part further by hand. In the vicinity, a thin portion of the insulator locally occurs, and the degree of the thickness becomes uneven due to the work and also on the circumference of the cable, from the viewpoint of adhesion to the reinforcing insulator attached on the processing surface It was not preferable.

The present invention has been made in view of the above circumstances, and has an external semi-conductive layer for shaving an external semi-conductive layer of a CV cable having an incomplete circular cross section to a constant thickness in accordance with the shape of the cable. It is intended to provide a layer cutter. Another object of the present invention is to provide a new method for forming a gentle taper surface by applying this shaving machine.

[0006]

SUMMARY OF THE INVENTION The present invention is directed to the above-mentioned object.
External semi-conductor for CV cable termination processing to achieve
A pedestal that fixes the cutting blade in a shaving machine that cuts the electric layer
To the cutting blade that moves up and down integrally with the cutting blade.
External semi-conductivity of CV cable by spring force of id roller
Layer, and the pedestal is
While turning in the circumferential direction of the V cable,
By rotating the engaged screw shaft, the pedestal is
It is configured to be able to move in the axial direction of the CV cable,
The guide roller is moved by the spring force to the outer semiconductive layer.
Keep the cutting depth of the cutting blade constant according to the external shape
The outer semiconductive layer to a uniform thickness.
CV cable external semiconducting characterized by the following configuration
This is to provide a scraper. In addition, the present invention
For the purpose of CV cable termination
The outer semiconductive layer of the CV cable is cut off.
In the method of shaving with a machine, the outer semiconductive layer
Guide roller on the pedestal for fixing the cutting blade
On the outer semiconductive layer of CV cable by spring force
Press the guide roller to form the outer semiconductive layer
The external semi-conductor is guided by the cutting blade while following the shape.
The thickness of the outer semiconductive layer is reduced while the thickness of the
Has a triangular (tapered) cross section of height equivalent to the height
The part of the outer semiconductive layer that requires penciling
And the guide roller is mounted on the spacer.
The cutting depth of the cutting blade is gradually increased by raising
And the outer semiconductive layer is pen-shaped within a predetermined length.
CV cable external semiconductive characterized by shilling
The purpose of the present invention is to provide a cutting method using a layer cutting machine.

In order to continuously move from the flat cutting portion to the pencilling portion, it is necessary to perform the pencilling according to the shape of the power cable which is not perfectly round. Therefore, it is desirable to form a tape or a sheet having a constant thickness by winding it around the power cable. In this case, a stepped spacer is formed with a thin (about 0.1 mmt) tape in order to finish the pencil ring surface more smoothly. The height of this spacer is, of course, high enough to completely pencil the outer semiconductive layer.
Further, the height is determined in consideration of the deformation due to running on the guide roller.

As a material of the spacer, an elastic material such as rubber has a large deformation at the time of riding on the roller, and a deformation amount changes due to a repulsive force of the rubber at the time of turning of the roller, so that a uniform cut surface cannot be obtained. According to an experiment, when a rubber sheet (having a hardness of about 70 °) having a triangular cross section is wound around a cable and bound with an adhesive tape to form a spacer, a change in the amount of deformation due to the repulsive force occurs as described above, and Pencilling was difficult. On the other hand, when a Mylar tape having a thickness of 0.1 mmt or less is wound up to form a spacer, the amount of deformation due to running over the roller is kept substantially constant,
It was confirmed that a smooth pencilling surface was obtained.

[0009]

According to the present invention, the outer semiconductive layer can be cut to a certain thickness in accordance with the shape of the cable, even if the cross section of the power cable is not a perfect circle. Moreover, the desired tapered surface can be easily formed continuously from the flat portion by the copying method of the pencilling portion.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a CV cable external semiconductive layer shaving machine according to the present invention will be described below with reference to the drawings. Figure 3 shows CV
It is a cross-sectional view which shows the structure of a cable connection part. That is, the end of the CV cable to be connected is stripped off to expose the cable conductor 1, the cable insulator 2, and the external semiconductive layer 3. Then, as shown in FIG. 2, the tip 3a of the external semiconductive layer 3 which is extruded at the same time as the cable insulator and is integrated with the cable insulator 2 is scraped off, and the cable insulator 2 is smoothed and finished. The next external semiconductive layer is
A terminal treatment for forming the pencilling portion 3b in a tapered shape with a length of 5 to 50 mm is performed. Thereafter, the cable conductors 1 of the CV cable 10 that have been subjected to the terminal treatment as described above are abutted with each other, covered with the connection pipe 4 and pressed to connect the cable conductors 1 to each other. An epoxy unit 6 having a buried shield electrode 5 is fitted onto the connection pipe 4, a stress cone 7 is inserted from both sides, and the stress cone 7 is pressed from both sides by a spring unit 8 to connect the stress cone 7 to the epoxy unit 6. The CV cable connection part is formed by closely adhering to the cable insulator 2.

FIG. 1 is a side view showing the configuration of an external semiconductive layer shaving machine. That is, the left and right sides of the rotating plate 1
2, 12 ′ are rotatably provided, and are rotatably driven by a drive motor 13 attached to the machine frame 11.
A split fixing member 14 for fixing the CV cable 10 is provided on the left rotating plate 12 'side, and the machine frame 11 is sandwiched between the CV cable 10 by a hole provided at the center thereof.
It is configured to be fixed to. On the other hand, a chuck 15 for fixing the tip of the cable conductor 2 is provided at the center of the left rotating plate 12, and the tip of the cable conductor 2 is fixed and mounted.

A screw shaft 17 for guiding a turntable 16 moving in the left and right axial directions is attached to the rotating plates 12 and 12 '. The screw shaft 17 is used to move the turntable 16 left and right. The screw cylinder 16a is fitted. Then, the cutting blade 19 and the guide roller 20 are
A pedestal 21 to which is fixed. The guide roller 20 is always driven by the CV cable 1 by the spring 22.
0 is pressed against the surface of the external semiconductive layer 3. Rotating plate 1
With the rotation of 2, 12 ', the pedestal 21
, The screw shaft 15 is also rotated by a motor (not shown) to move the rotary table 16 rightward at a certain pitch, and the guide roller 20 and the cutting blade 19
1 to remove the outer semiconductive layer 3 on the surface of the CV cable 10 with a constant thickness. That is, although the cross-sectional shape of the CV cable is not necessarily a perfect circle, the guide blade 20 always comes into contact with the surface of the CV cable to guide the cutting blade 19 while following the surface thereof, so that the external semiconductive layer integrally provided on the surface of the insulator 2 is provided. 3 can be cut off with a constant thickness according to its cross-sectional shape.

Next, the case where the pencilling portion 3a is formed by cutting using the CV cable outer semiconductive layer shaving machine will be described. First, a taper spacer 23 having the same taper surface as the taper surface to be formed is formed by winding a thin tape or sheet around the outer semiconductive layer 3 in the vicinity of the position where the pencilling is to be formed. Therefore, when the guide roller 20 rides on the taper spacer 23,
Since the cutting blade 19 is guided while following this, the cutting blade 1
9 is gradually lifted by the taper spacer 23, and the pencilling portion 3a of the external semiconductive layer 3 corresponding to the taper spacer shape is formed.

In the above example, the taper spacer is formed by winding a thin tape or sheet. The taper spacer is divided into two parts having a tapered surface on the inner surface and a curved surface on the inner surface corresponding to the outer diameter of the semiconductive layer of the CV cable. It can also be formed by attaching a plastic or metal taper spacer.

[0015]

As described above, according to the outer semiconductive layer shaving machine of the present invention, the thickness of the outer semiconductive layer of a CV cable which is not perfectly round is uniformly cut off according to the shape of the CV cable. Is possible. Further, the tipping of the outer semiconductive layer can be continuously performed. Conventionally, the external semiconductive layer shaving and pencilling work, which had been manually performed using a piece of glass or the like, has been mechanized, eliminating variations due to the skill of the worker, and there is no fear of causing damage to the cable insulator. This makes it possible to reliably cut the outer semiconductive layer. Further, it is possible to shorten the working time by increasing the rotation speed of the cutting blade.

[Brief description of the drawings]

FIG. 1 is a side view showing a configuration of an external semiconductive layer shaving machine according to an embodiment;

FIG. 2 is a cross-sectional view of a terminal processing unit of the CV cable,

FIG. 3 is a cross-sectional view illustrating a configuration example of a connection portion for a CV cable.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 cable conductor 2 cable insulator 3 outer semiconductive layer 10 CV cable 11 machine frame 12, 12 ′ rotating plate 13 motor 14 fixing member 15 chuck 16 rotating table 16 a screw cylinder 17 screw shaft 18 spring 19 cutting blade 20 guide roller 21 pedestal

──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yoichi Watanabe 5-1-1 Hidakacho, Hitachi City, Ibaraki Prefecture Inside the Hidaka Factory, Hitachi Cable Corporation (72) Inventor Ryuichi Suzuki Hidakacho, Hitachi City, Ibaraki Prefecture 5-1-1, Hidaka Electric Wire Co., Ltd. (72) Inventor Noriaki Matsuzaki 5-1-1, Hidaka-cho, Hitachi City, Ibaraki Pref. Hitachi, Ltd. In Hidaka Factory (72) Inventor Tanno Shiro 5-1-1, Hidaka-cho, Hitachi City, Ibaraki Prefecture Power System Laboratory, Hitachi, Ltd. (56) References JP-A-8-223732 (JP, A) JP-A-6-205518 (JP, A) JP-A-6-205520 (JP, A) Japanese Utility Model Laid-Open No. 5995720 (JP, U) Japanese Utility Model Laid-Open No. 5995722 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H02G 1/14 H02G 1/12

Claims (4)

(57) [Claims] 1. A CV cable sharpener scraping the outer semiconducting layer for terminal processing, mounted on a pedestal for fixing the cutting blade, CV cable guide rollers up and down the cutting blade and together with the spring force wherein C by pressing the outer semiconductive layer, the base drive motor or the like
While turning in the circumferential direction of the V cable ,
By rotating the engaged screw shaft, the pedestal is
Configured to be moved in the axial direction of the CV cable, constant cutting depth of the cutting edge the <br/> guide rollers so as to follow the outer shape of the outer semiconductive layer in the spring force
The outer semiconductive layer to a uniform thickness .
A CV cable outer semi-conductive layer shaving machine characterized by the following configuration . 2. The CV cable for terminal processing of a CV cable.
The outer semiconductive layer of the V cable is
In the external semi-conductive layer shaving machine
Spring guide rollers on the pedestal to fix the cutting blade
By force on the outer semiconductive layer of the CV cable
Follows the outer shape of the outer semiconductive layer with the guide roller
Thickness of the outer semiconductive layer by the cutting blade
Constant over cut in, provided with a spacer having a cross-section of the outer semiconductive layer height triangle shape corresponding to the thickness of the (tapered) in the vicinity of penciling main processing portion of the outer semiconductive layer, before Symbol guide roller gradually shallower depth of cut of the cutting edge by the letting ride on the spacer,
Method scraping by CV cable outer semiconductive layer sharpener characterized by penciling the outer semiconductive layer in a predetermined length range. Wherein the triangular spacer Rukoto wound a thin tape or sheet to the outer semiconducting layer
Method scraping by CV cable outer semiconductive layer sharpener according to claim 2, wherein the formation child by. Wherein said triangular spacers, formed by molded plastics or split metal workpiece axially split, attached it to near <br/> beside the penciling main processing unit, the external half 3. The method for shaving with a semi-conductive layer shaving machine according to claim 2, wherein the pencil is stuck with a conductive layer shaving machine.