JP3032881B2 - Composite resin composition and hot melt adhesive - Google Patents
Composite resin composition and hot melt adhesiveInfo
- Publication number
- JP3032881B2 JP3032881B2 JP7215226A JP21522695A JP3032881B2 JP 3032881 B2 JP3032881 B2 JP 3032881B2 JP 7215226 A JP7215226 A JP 7215226A JP 21522695 A JP21522695 A JP 21522695A JP 3032881 B2 JP3032881 B2 JP 3032881B2
- Authority
- JP
- Japan
- Prior art keywords
- composite resin
- resin composition
- weight
- ethylene
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 31
- 239000000805 composite resin Substances 0.000 title claims description 25
- 239000004831 Hot glue Substances 0.000 title claims description 12
- 238000000034 method Methods 0.000 claims description 25
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 18
- 229920001577 copolymer Polymers 0.000 claims description 13
- 239000000155 melt Substances 0.000 claims description 13
- -1 styrene compound Chemical class 0.000 claims description 12
- 239000004711 α-olefin Substances 0.000 claims description 11
- 230000000379 polymerizing effect Effects 0.000 claims description 9
- 238000006116 polymerization reaction Methods 0.000 claims description 8
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 7
- 229920001519 homopolymer Polymers 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 239000000178 monomer Substances 0.000 claims description 6
- 229920001155 polypropylene Polymers 0.000 claims description 6
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 5
- 239000005977 Ethylene Substances 0.000 claims description 5
- 230000015556 catabolic process Effects 0.000 claims description 5
- 238000006731 degradation reaction Methods 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920005606 polypropylene copolymer Polymers 0.000 claims description 2
- 208000037062 Polyps Diseases 0.000 claims 1
- 239000003921 oil Substances 0.000 description 12
- 239000011347 resin Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920000098 polyolefin Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 150000001735 carboxylic acids Chemical class 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- XPVIQPQOGTVMSU-UHFFFAOYSA-N (4-acetamidophenyl)arsenic Chemical compound CC(=O)NC1=CC=C([As])C=C1 XPVIQPQOGTVMSU-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920013640 amorphous poly alpha olefin Polymers 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 101100438229 Solanum tuberosum PCM4 gene Proteins 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- WXCZUWHSJWOTRV-UHFFFAOYSA-N but-1-ene;ethene Chemical compound C=C.CCC=C WXCZUWHSJWOTRV-UHFFFAOYSA-N 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 235000019808 microcrystalline wax Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- DPLUMPJQXVYXBH-UHFFFAOYSA-N n,n-diethyl-2-phenylethenamine Chemical compound CCN(CC)C=CC1=CC=CC=C1 DPLUMPJQXVYXBH-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Graft Or Block Polymers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、複合樹脂組成物お
よびホットメルト接着剤に関する。さらに詳しくは耐熱
クリ−プ性、接着性、オイル保持性等に優れた複合樹脂
組成物および、それからなる、特にポリオレフィン成形
品の接着に適したホットメルト接着剤に関する。The present invention relates to a composite resin composition and a hot melt adhesive. More specifically, the present invention relates to a composite resin composition having excellent heat creep properties, adhesive properties, oil retaining properties and the like, and a hot melt adhesive comprising the same, particularly suitable for bonding a polyolefin molded article.
【0002】[0002]
【従来の技術】従来、ポリオレフィン系のフィルム、不
織布、樹脂成形品等の接着に用いられるホットメルト接
着剤としては、結晶性ポリオレフィンにスチレンをグ
ラフト共重合した変性ポリオレフィンからなるもの(例
えば特公平1−49187号公報)が知られている。ま
た本出願人はエチレン/プロピレン共重合体および低
分子量ポリオレフィン系樹脂共存下にスチレンをグラフ
トしたものからなるものを先に出願した(特願平6−2
02704号明細書)。2. Description of the Related Art Conventionally, as a hot-melt adhesive used for bonding a polyolefin-based film, nonwoven fabric, resin molded product, etc., a modified polyolefin obtained by graft copolymerizing styrene with a crystalline polyolefin (for example, Japanese Patent Publication No. No. 49187) is known. The applicant of the present invention has previously filed an application consisting of a product obtained by grafting styrene in the presence of an ethylene / propylene copolymer and a low molecular weight polyolefin resin (Japanese Patent Application No. 6-2).
02704).
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記
のものはホットメルト接着剤として使用した場合オープ
ンタイムが短く、またこれを改善するためオイル等を添
加すると滲み出す等の問題がある。また、のものはオ
ープンタイムは保たれているが、耐熱クリ−プ性が必ず
しも充分ではないという問題点がある。However, there is a problem that the above-mentioned materials have a short open time when used as a hot-melt adhesive and bleed out when oil or the like is added in order to improve this. Further, although the open time is maintained, there is a problem that the heat creep resistance is not always sufficient.
【0004】[0004]
【課題を解決するための手段】本発明者らは、これらの
問題点を解決し、耐熱クリープ性、オイル保持性の良好
なホットメルト接着剤を得ることを目的として鋭意検討
した結果、αオレフィン単独重合体および/またはエチ
レン−αオレフィン共重合体と特定の低粘度ポリオレフ
ィン系樹脂の共存下においてスチレン系化合物等を重合
してグラフト変性した複合樹脂を用いることにより、性
能が飛躍的に向上することを見い出し、本発明に到達し
た。すなわち本発明は、ASTM D1238−L法に
よるメルトインデックスが1〜100であるαオレフィ
ン単独重合体(A1)および/または同法によるメルト
インデックスが10より大で100以下であるエチレン
/αオレフィン共重合体(A2)からなるαオレフィン
系(共)重合体(A)および熱減成法で得られる低分子
量ポリプロピレン系(共)重合体と重合法で得られる結
晶化度10%以下のポリプロピレン系(共)重合体から
なる190℃における溶融粘度が30〜100,000
cPの低粘度ポリオレフィン系樹脂(B)の存在下に、
スチレン系化合物、ビニル基含有カルボン酸もしくはそ
の誘導体および(メタ)アクリロニトリルからなる群よ
り選ばれる少なくとも1種のラジカル重合性単量体
(C)を加熱溶融混練機中で重合してなり、(A):
(B):(C)の重量比が100:(30〜300):
(1〜50)である複合樹脂組成物;ならびに該組成物
からなるホットメルト接着剤である。DISCLOSURE OF THE INVENTION The present inventors have intensively studied to solve these problems and to obtain a hot melt adhesive having good heat creep resistance and oil retention. By using a composite resin obtained by graft-modifying a styrene compound or the like in the presence of a homopolymer and / or an ethylene-α-olefin copolymer and a specific low-viscosity polyolefin resin, the performance is dramatically improved. This has led to the present invention. That is, the present invention relates to an α-olefin homopolymer (A1) having a melt index of 1 to 100 according to the ASTM D1238-L method and / or an ethylene / α-olefin copolymer having a melt index of more than 10 and 100 or less according to the same method. Α-olefin-based (co) polymer (A) composed of the polymer (A2) and a low-molecular-weight polypropylene-based (co) polymer obtained by a thermal degradation method and a polypropylene-based polymer having a crystallinity of 10% or less obtained by a polymerization method ( A melt viscosity at 190 ° C. of 30 to 100,000
In the presence of a low viscosity polyolefin resin (B) of cP,
(A) polymerizing at least one radical polymerizable monomer (C) selected from the group consisting of a styrene-based compound, a vinyl group-containing carboxylic acid or a derivative thereof, and (meth) acrylonitrile in a hot melt kneader; ):
The weight ratio of (B) :( C) is 100: (30-300):
(1-50) a composite resin composition; and a hot melt adhesive comprising the composition.
【0005】本発明における(A)を構成するαオレフ
ィン単独重合体(A1)の具体例としては、プロピレ
ン、1−ブテン、1−ペンテン、4−メチル−1−ペン
テン等の単独重合体が挙げられる。エチレン/αオレフ
ィン共重合体(A2)の具体例としてはエチレンと上記
αオレフィンとの共重合体が挙げられる。Specific examples of the α-olefin homopolymer (A1) constituting (A) in the present invention include homopolymers such as propylene, 1-butene, 1-pentene and 4-methyl-1-pentene. Can be Specific examples of the ethylene / α-olefin copolymer (A2) include a copolymer of ethylene and the above-mentioned α-olefin.
【0006】αオレフィン系(共)重合体(A)の具体
例としては、上記(A1)、(A2)およびこれらの
(共)重合体のビニル基含有カルボン酸類によるグラフ
ト変性体、ならびにこれらの(共)重合体もしくは変性
体の2種以上のブレンド物等が挙げられる。これらのう
ち好ましいものはブテン−1単独重合体およびエチレン
/ブテン−1共重合体である。Specific examples of the α-olefin (co) polymer (A) include the above (A1) and (A2) and graft-modified products of these (co) polymers with vinyl group-containing carboxylic acids, A blend of two or more (co) polymers or modified products may be used. Preferred among these are butene-1 homopolymer and ethylene / butene-1 copolymer.
【0007】(A1)のASTM D1238−L法
(230℃、2160g)によるメルトインデックスは
通常1〜100、好ましくは5〜50である。(A1)
のメルトインデックスが100を越えると耐油性が不十
分となり、1未満では十分な加工性が得られない。The melt index of (A1) by the ASTM D1238-L method (230 ° C., 2160 g) is usually 1 to 100, preferably 5 to 50. (A1)
If the melt index exceeds 100, the oil resistance becomes insufficient, and if it is less than 1, sufficient workability cannot be obtained.
【0008】(A2)のASTM D1238−L法
(230℃、2160g)によるメルトインデックスは
通常10より大で100以下、好ましくは10より大で
50以下である。(A2)のメルトインデックスが10
0を越えると耐油性が不十分となり、10以下では十分
な加工性が得られない。The melt index of (A2) according to the ASTM D1238-L method (230 ° C., 2160 g) is usually from 10 to 100, preferably from 10 to 50. (A2) has a melt index of 10
If it exceeds 0, the oil resistance becomes insufficient, and if it is 10 or less, sufficient workability cannot be obtained.
【0009】低粘度ポリオレフィン系樹脂(B)として
は、熱減成で得られる低分子量ポリプロピレン系(共)
重合体と公知の重合法で得られる結晶化度10%以下の
ポリプロピレン系(共)重合体との併用およびこれらの
ビニル基含有カルボン酸類[(メタ)アクリル酸、(無
水)マレイン酸、フマール酸、イタコン酸等]によるグ
ラフト変性体を挙げることができる。また、(B)中の
プロピレン単位含量は通常30重量%以上、好ましくは
50重量%以上である。(B)中のプロピレン含量が3
0重量%未満では複合樹脂組成物の耐熱性が低下する。As the low-viscosity polyolefin-based resin (B), low-molecular-weight polypropylene-based resin (co) obtained by thermal degradation
Use of the polymer in combination with a polypropylene (co) polymer having a crystallinity of 10% or less obtained by a known polymerization method and these vinyl group-containing carboxylic acids [(meth) acrylic acid, (anhydride) maleic acid, fumaric acid , Itaconic acid, etc.]. The propylene unit content in (B) is usually at least 30% by weight, preferably at least 50% by weight. (B) the propylene content is 3
If the amount is less than 0% by weight, the heat resistance of the composite resin composition decreases.
【0010】(B)の190℃での溶融粘度は、通常3
0〜100,000cP、好ましくは40〜20,00
0cPである。溶融粘度が30cP未満では複合樹脂組
成物の強度が不十分となり、100,000cPを越え
ると得られる複合樹脂組成物が高粘度となるため、加工
性および塗工性が低下する。The melt viscosity at 190 ° C. of (B) is usually 3
0 to 100,000 cP, preferably 40 to 20,000 cP
0 cP. If the melt viscosity is less than 30 cP, the strength of the composite resin composition will be insufficient, and if it exceeds 100,000 cP, the resulting composite resin composition will have a high viscosity, resulting in reduced processability and coatability.
【0011】本発明において、(A)および(B)のグ
ラフト変性に用いられるラジカル重合性単量体(C)と
しては、スチレン系化合物、ビニル基含有カルボン酸類
もしくはその誘導体、(メタ)アクリロニトリル等が挙
げられる。これらのうち好ましいものは、熱安定性の面
からスチレン系化合物およびスチレン系化合物と上記他
の単量体との併用である。In the present invention, the radical polymerizable monomer (C) used for the graft modification of (A) and (B) includes styrene compounds, vinyl group-containing carboxylic acids or derivatives thereof, (meth) acrylonitrile and the like. Is mentioned. Of these, styrene-based compounds and combinations of the styrene-based compounds with the above-mentioned other monomers are preferable from the viewpoint of thermal stability.
【0012】スチレン系化合物としては、スチレン、t
−ブチルスチレン、α-メチルスチレン、p−メチルス
チレン、クロルスチレン、ブロムスチレン、フルオロス
チレン、エチルスチレン、ジビニルベンゼン、N,N−
ジエチルアミノスチレン等が挙げられる。これらのうち
特に好ましいものはスチレンである。The styrene compounds include styrene, t
-Butylstyrene, α-methylstyrene, p-methylstyrene, chlorostyrene, bromostyrene, fluorostyrene, ethylstyrene, divinylbenzene, N, N-
And diethylaminostyrene. Particularly preferred among these is styrene.
【0013】ビニル基含有カルボン酸類もしくはその誘
導体としては、ビニル基含有カルボン酸[例えば、(メ
タ)アクリル酸、無水マレイン酸、フマール酸、イタコ
ン酸等]、(メタ)アクリル酸エステル[炭素数1〜1
8のアルキル(メチル、エチル、プロピル、オクチル、
ドデシル等)(メタ)アクリレート、炭素数6〜12の
脂環式アルキル(シクロヘキシル、ジシクロヘキシル
等)(メタ)アクリレート、炭素数7〜21のアラルキ
ル(ベンジル等)(メタ)アクリレート、ヒドロキシア
ルキル(炭素数2〜6)(メタ)アクリレート、グリシ
ジル(メタ)アクリレート等]、ビニル基含有ジカルボ
ン酸のイミド化物[マレイミド、N−メチルマレイミ
ド、N−ブチルマレイミド、N−フェニルマレイミド
等]等が挙げられる。これらのうち好ましいのは(メ
タ)アクリル酸、無水マレイン酸およびこれらのエステ
ル化物である。Examples of the vinyl group-containing carboxylic acids or derivatives thereof include vinyl group-containing carboxylic acids [eg, (meth) acrylic acid, maleic anhydride, fumaric acid, itaconic acid, etc.] and (meth) acrylic acid esters [1 carbon atom. ~ 1
Alkyl of 8 (methyl, ethyl, propyl, octyl,
Dodecyl, etc.) (meth) acrylate, C6-C12 alicyclic alkyl (cyclohexyl, dicyclohexyl, etc.) (meth) acrylate, C7-C21 aralkyl (benzyl, etc.) (meth) acrylate, hydroxyalkyl (carbon number) 2-6) (meth) acrylate, glycidyl (meth) acrylate, etc.], and imidized vinyl group-containing dicarboxylic acid [maleimide, N-methylmaleimide, N-butylmaleimide, N-phenylmaleimide, etc.]. Of these, (meth) acrylic acid, maleic anhydride and esterified products thereof are preferred.
【0014】本発明において、(A):(B):(C)
の重量比は通常100:(30〜300):(1〜5
0)、好ましくは100:(50〜200):(3〜3
0)である。(B)の比率が30未満では得られる複合
樹脂が高粘度となり、ホットメルト接着剤として使用す
る場合の作業性が悪く、300を越えると複合樹脂組成
物のゴム弾性およびオイル保持性が低下する。また、
(C)の比率が1未満では凝集力が弱くなり、複合樹脂
組成物の強度および耐熱クリ−プ性が不十分となり、5
0を越えると複合樹脂組成物の溶融粘度が高くなり加工
性が不十分となる。In the present invention, (A) :( B) :( C)
Is usually 100: (30-300) :( 1-5
0), preferably 100: (50-200) :( 3-3
0). If the ratio of (B) is less than 30, the resulting composite resin will have a high viscosity, resulting in poor workability when used as a hot melt adhesive. If it exceeds 300, the rubber elasticity and oil retention of the composite resin composition will decrease. . Also,
When the ratio of (C) is less than 1, the cohesive strength becomes weak, and the strength and heat creep resistance of the composite resin composition become insufficient, and
If it exceeds 0, the melt viscosity of the composite resin composition becomes high and the processability becomes insufficient.
【0015】本発明において、複合樹脂組成物の低粘度
化およびオイル保持性をさらに向上させるために、必要
によって(液状)水添ポリブタジエン(D)含有させる
ことができる。使用する場合の該(D)の含有量は通常
50重量%以下、好ましくは30重量%以下である。
(D)の比率が50重量%を越えると複合樹脂組成物の
凝集力が低下し、耐熱クリ−プ性が不十分となる。In the present invention, a (liquid) hydrogenated polybutadiene (D) can be contained, if necessary, in order to lower the viscosity of the composite resin composition and further improve the oil retention. When used, the content of (D) is usually 50% by weight or less, preferably 30% by weight or less.
When the proportion of (D) exceeds 50% by weight, the cohesive strength of the composite resin composition decreases, and the heat creep resistance becomes insufficient.
【0016】本発明の組成物を製造する方法は、特に限
定されないが、例えば下記の方法が挙げられる。 あらかじめ(A)の存在下で(C)を重合したものと
(B)の存在下で(C)を重合したものを混合する方
法; (B)の存在下で(C)を重合したものと(A)の存
在下に(C)を重合する方法; (A)の存在下で(C)を重合したものと(B)の存
在下に(C)を重合する方法; (A)および(B)の存在下に(C)を重合する方
法;等が挙げられる。これらのうち好ましいものはの
方法である。The method for producing the composition of the present invention is not particularly limited, and examples thereof include the following method. A method of mixing a polymer obtained by polymerizing (C) in the presence of (A) and a polymer obtained by polymerizing (C) in the presence of (B); a polymer obtained by polymerizing (C) in the presence of (B); A method of polymerizing (C) in the presence of (A); a method of polymerizing (C) in the presence of (A) and a method of polymerizing (C) in the presence of (B); (A) and ( A method of polymerizing (C) in the presence of B); Of these, the preferred method is the following method.
【0017】重合に用いる加熱溶融混練機機としては、
その様式形状等は特に限定されるものではないが、例え
ば逆ネジ部を有する圧縮性の高い形状のスクリューまた
はリボン状攪拌機を有する混合機、ニーダー、押出機、
ミキサー等を挙げることができる。これらのうち非開放
型の装置を用いるのが好ましく、重合の際には窒素等の
不活性ガス雰囲気下で混練することが好ましい。As the heat-melt kneader used for the polymerization,
The style and the like are not particularly limited, for example, a mixer having a highly compressible screw having a reverse threaded portion or a ribbon-shaped stirrer, a kneader, an extruder,
A mixer etc. can be mentioned. Among these, it is preferable to use a non-open type apparatus, and it is preferable to knead the mixture in an atmosphere of an inert gas such as nitrogen during polymerization.
【0018】重合には必要により公知の重合開始剤や有
機溶剤を使用することができる。重合開始剤としては、
ケトンパーオキサイド、パーオキシケタール、ハイドロ
パーオキサイド、ジアルキルパーオキサイド、ジアシル
パーオキサイド、パーオキシジカーボネート、パ−オキ
シエステル等の有機過酸化物、アゾイソブチロニトリル
等のアゾ系化合物等が挙げられる。有機溶剤としては脂
環式炭化水素系溶剤、芳香族炭化水素系溶剤、アルコー
ル系溶剤、ハロゲン系溶剤、ケトン系溶剤、エーテル系
溶剤等が挙げられる。Known polymerization initiators and organic solvents can be used for the polymerization, if necessary. As the polymerization initiator,
Organic peroxides such as ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxydicarbonates, and peroxyesters; and azo compounds such as azoisobutyronitrile. . Examples of the organic solvent include an alicyclic hydrocarbon solvent, an aromatic hydrocarbon solvent, an alcohol solvent, a halogen solvent, a ketone solvent, and an ether solvent.
【0019】重合の温度は特に限定はなく、実質的に単
量体を重合させる温度であればよいが通常80〜260
℃である。The temperature of the polymerization is not particularly limited, and may be any temperature at which the monomer can be substantially polymerized.
° C.
【0020】本発明の組成物をホットメルト接着剤とし
て用いる際には、公知の種々の添加剤[例えば、粘着性
付与剤(ロジン誘導体、テルペン系樹脂、クマロン−イ
ンデン系樹脂、石油樹脂等)、ワックス(パラフィンワ
ックス、マイクロクリスタリンワックス、低分子量ポリ
オレフィンワックス等)、酸化防止剤、フィラー、可塑
剤等]を添加してもよい。When the composition of the present invention is used as a hot melt adhesive, various known additives such as tackifiers (rosin derivatives, terpene resins, cumarone-indene resins, petroleum resins, etc.) , A wax (paraffin wax, microcrystalline wax, low molecular weight polyolefin wax, etc.), an antioxidant, a filler, a plasticizer, etc.].
【0021】[0021]
【発明の実施の形態】以下、実施例により本発明をさら
に説明するが、本発明はこれに限定されるものではな
い。以下において、「部」は重量部を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described below with reference to examples, but the present invention is not limited to these examples. In the following, “parts” indicates parts by weight.
【0022】[0022]
実施例1〜5および比較例1〜3 ジャケットの熱媒温度を160℃に設定した直径5イン
チ、L/D=10の連続混合装置(栗本鉄工製KRC
S5)を用い、表1に記載の比率で分散した樹脂とモノ
マーの混合物を連続混合装置の原料供給口から供給し滞
留時間が10分になるように保ちながら重合した。得ら
れた混合物を、二軸押し出し機(池貝鉄工製PCM4
5、L/D=50)で脱モノマ−を行い、本発明の複合
樹脂および比較の樹脂を製造した。Examples 1 to 5 and Comparative Examples 1 to 3 A continuous mixing device having a diameter of 5 inches and L / D = 10 (KRC manufactured by Kurimoto Tekko Co., Ltd.) with the heating medium temperature of the jacket set at 160 ° C.
Using S5), a mixture of a resin and a monomer dispersed in the ratio shown in Table 1 was supplied from a raw material supply port of a continuous mixing apparatus, and polymerization was performed while keeping the residence time at 10 minutes. The obtained mixture is subjected to a twin-screw extruder (PCM4 manufactured by Ikegai Iron Works).
5, L / D = 50), and the composite resin of the present invention and a comparative resin were produced.
【0023】[0023]
【表1】 ‖St |MA |BPB|EPR|EBM|APAO|WAX‖ −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− 実施例1‖100| |0.5| |400| 500| ‖ 実施例2‖100| |0.5| |350| 350|200‖ 実施例3‖100| |0.5| |350| 450|100‖ 実施例4‖200| |1.0| |250| 350|200‖ 実施例5‖ 50| 50|0.5| |350| 350|200‖ −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− 比較例1‖130| | |PE 100| 100| ‖ 比較例2‖ | | |SEBS100| | ‖ 比較例3‖100|DCP 1.0|350| | 450|100‖ −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− (上記実施例1は参考例である。) (記号等の説明) St:スチレン MA:無水マレイン酸 BPB:t−ブチルパーオキシベンゾエート EPR:エチレン−プロピレン共重合体(メルトインデ
ックス2、日本合成ゴム製「EP912P」) EBM:エチレン−ブテン1共重合体(メルトインデッ
クス35、住友化学工業製「エスプレンN0377」) APAO:非晶質エチレン−プロピレン共重合体(結晶
化度5%、190℃溶融粘度1500cP、宇部レキセ
ン製「ウベタックUT2315」) WAX:熱減成法で得られた低分子量ポリプロピレン
(190℃溶融粘度45cps、三洋化成工業製「ビス
コール660P」) PE:結晶性高密度ポリエチレン(メルトインデックス
8) SEBS:水素添加スチレン−ブタジエンブロック共重
合体(メルトインデックス1以下) DCP:ジクミルパーオキサイド[Table 1] {St | MA | BPB | EPR | EBM | APAO | WAX} --------------------------------------------------------------------------- −−− Example 1 {100 | | 0.5 | || 400 | 500 |} Example 2 {100 | | 0.5 | | 350 | 350 | 200} Example 3 {100 | | 0.5 | | 350 | 450 | 100} Example 4 {200 | | 1.0 | | 250 | 350 | 200} Example 5 {50 | 50 | 0.5 | | 350 | 350 | 200} −−−−−−−−− −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−− Comparative example 1 {130 | | | PE 100 | 100 | 比較 Comparative example 2} | | | SEBS100 | | ‖ Comparative Example 3 {100 | DCP 1.0 | 350 | | 450 | 100} −−−−−−−−−−−−−−−−−− --------------------The above-mentioned Example 1 is a reference example. (Explanation of symbols etc.) St: Styrene MA: Maleic anhydride BPB: t-butyl peroxy Benzoate EPR: ethylene-propylene copolymer (melt index 2, Nippon Synthetic Rubber's "EP912P") EBM: ethylene-butene 1 copolymer (melt index 35, Sumitomo Chemical's "Esprene N0377") APAO: amorphous Ethylene-propylene copolymer (crystallinity 5%, 190 ° C melt viscosity 1500 cP, “Ube Tack UT2315” manufactured by Ube Lexen) WAX: low molecular weight polypropylene (190 ° C melt viscosity 45 cps, Sanyo Chemical Industries, Ltd.) obtained by thermal degradation method PESC: crystalline high-density polyethylene (melt index 8) SEBS Hydrogenated styrene - butadiene block copolymer (melt index 1 or less) DCP: dicumyl peroxide
【0024】試験例1 得られた複合樹脂組成物を射出成形機で成形して試験片
を作成した。該試験片を用いて測定した樹脂物性値を表
2に示す。Test Example 1 The obtained composite resin composition was molded by an injection molding machine to prepare a test piece. Table 2 shows the physical properties of the resin measured using the test piece.
【0025】[0025]
【表2】 (測定方法) 引張破断強度:JIS K6301(単位:kgf/c
m2) 硬度 :JIS K6301(JIS A) MI(メルトインデックス):ASTM D1238−
L法[Table 2] (Measurement method) Tensile breaking strength: JIS K6301 (unit: kgf / c)
m 2 ) Hardness: JIS K6301 (JIS A) MI (melt index): ASTM D1238-
L method
【0026】試験例2 得られた各複合樹脂80部、タッキファイヤー(軟化点
100℃の水添石油樹脂、出光石油化学製「アイマーブ
P−100」)100部、プロセスオイル(出光興産製
「ダイアナプロセスPW−90」)20部、酸化防止剤
(チバガイギー製「イルガノックス1010」)1部お
よび酸化防止剤(旭電化工業製「アデカスタブ211
2」)1部を溶融混合し、ホットメルト接着剤を得た。
得られた各接着剤の性能測定結果を表3に示す。これら
の結果から、比較例に対して、耐熱クリープ性、T型剥
離接着強度およびオイル保持性が向上していることが分
かる。Test Example 2 80 parts of each of the obtained composite resins, 100 parts of tackifier (hydrogenated petroleum resin having a softening point of 100 ° C., “Imarb P-100” manufactured by Idemitsu Petrochemical) and process oil (“Diana” manufactured by Idemitsu Kosan Co., Ltd.) 20 parts of process PW-90), 1 part of an antioxidant (“Irganox 1010” manufactured by Ciba-Geigy) and an antioxidant (“ADK STAB 211” manufactured by Asahi Denka Kogyo)
2)) 1 part was melt-mixed to obtain a hot melt adhesive.
Table 3 shows the performance measurement results of the obtained adhesives. From these results, it can be seen that the heat creep resistance, the T-peel adhesive strength, and the oil retention were improved with respect to the comparative example.
【0027】[0027]
【表3】 (測定方法) 耐熱クリ−プ性せん断:アルミ板に25×25mm、厚
さ50μmで接着剤を塗布し、100℃×10sec×
1kg/cm2の条件でポリエステルフィルムを圧着
し、60℃、1kgせん断荷重でクリープ試験を行っ
た。(単位:mm/hour) 耐熱クリ−プ性T型剥離:ポリエステルフィルムに25
×25mm、厚さ50μmで接着剤を塗布し、100℃
×10sec×1kg/cm2の条件でポリエステルフ
ィルムを圧着し、50℃、100g荷重でT型剥離クリ
ープ試験を行った。(単位:mm/hour) T型剥離接着強度:ポリプロピレンフィルムに25×2
5mm、厚さ100μmで接着剤を塗布し、100℃×
10sec×1kg/cm2の条件でポリプロピレンフ
ィルムを圧着し、23℃、引張速度300mm/min
でT型剥離強度を測定した。(単位:g/25mm) オイル保持性:接着剤を濾紙に塗布し0.5kg/cm
2の荷重をかけ、50℃で24時間温調後、濾紙にオイ
ルの滲みだしが認められるかを目視で判定した。 評価基準 ○:滲みだしなし、△:わずかに滲みだしあ
り、×:滲みだしあり[Table 3] (Measurement method) Heat-resistant creep shear: Apply an adhesive to an aluminum plate at 25 × 25 mm and a thickness of 50 μm, and apply 100 ° C. × 10 sec ×
The polyester film was pressed under the condition of 1 kg / cm 2, and a creep test was performed at 60 ° C. under a shear load of 1 kg. (Unit: mm / hour) Heat-resistant creep T-peel: 25 on polyester film
× 25mm, 50μm thick, apply adhesive, 100 ℃
The polyester film was pressure-bonded under the conditions of × 10 sec × 1 kg / cm 2, and a T-type peeling creep test was performed at 50 ° C. under a load of 100 g. (Unit: mm / hour) T-type peel adhesion strength: 25 × 2 on polypropylene film
Apply adhesive at 5mm, thickness 100μm, 100 ℃ ×
A polypropylene film is pressure-bonded under the conditions of 10 sec × 1 kg / cm 2, 23 ° C., tensile speed 300 mm / min.
Was used to measure the T-peel strength. (Unit: g / 25 mm) Oil retention: 0.5 kg / cm after applying adhesive to filter paper
After applying a load of 2 and controlling the temperature at 50 ° C. for 24 hours, it was visually determined whether or not oil bleeding was observed on the filter paper. Evaluation criteria ○: no bleeding, Δ: slight bleeding, ×: bleeding
【0028】[0028]
【発明の効果】本発明の複合樹脂組成物は従来のものに
比べ下記の効果を奏する。 (1)耐熱クリ−プ性が良好であるため、クリープ力の
かかる部位への接着に優れる。 (2)オイル保持性が良好であるので、オイル滲みだし
の問題が少ない。 (3)各種材料に対して優れた接着性を示す。特にポリ
オレフィン系材料等の難接着材料に対する接着性が良好
である。 上記の効果を奏することから、本発明の複合樹脂組成物
は、特にホットメルト接着剤または粘着剤として有用で
あるほか、有機溶剤溶液、エマルジョン、ディスパージ
ョン、フィルム等の形でも使用可能である。また、本発
明の複合樹脂組成物はプラスチック改質材、シーラン
ト、熱硬化性樹脂の改質材、アスファルト改質材、各種
配合物の相溶化剤等にも用いることができる。The composite resin composition of the present invention has the following effects as compared with conventional ones. (1) Since the heat-resistant creep property is good, it is excellent in adhesion to a portion where a creep force is applied. (2) Since the oil retaining property is good, there is little problem of oil seeping out. (3) It shows excellent adhesion to various materials. In particular, it has good adhesiveness to difficult-to-bond materials such as polyolefin-based materials. Because of the above effects, the composite resin composition of the present invention is particularly useful as a hot-melt adhesive or pressure-sensitive adhesive, and can also be used in the form of an organic solvent solution, emulsion, dispersion, film or the like. In addition, the composite resin composition of the present invention can be used as a plastic modifier, a sealant, a modifier of a thermosetting resin, an asphalt modifier, a compatibilizer of various compounds, and the like.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭49−9546(JP,A) 特開 平1−236259(JP,A) 特開 昭63−270754(JP,A) 特開 昭63−54478(JP,A) 特開 昭57−100105(JP,A) 特開 昭52−123443(JP,A) 特開 平8−48731(JP,A) (58)調査した分野(Int.Cl.7,DB名) C08F 255/00 - 255/08 C08L 51/06 C09J 151/06 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-49-9546 (JP, A) JP-A-1-236259 (JP, A) JP-A-63-270754 (JP, A) JP-A-63-270754 54478 (JP, A) JP-A-57-100105 (JP, A) JP-A-52-123443 (JP, A) JP-A-8-48731 (JP, A) (58) Fields investigated (Int. 7 , DB name) C08F 255/00-255/08 C08L 51/06 C09J 151/06
Claims (6)
トインデックスが1〜100であるαオレフィン単独重
合体(A1)および/または同法によるメルトインデッ
クスが10より大で100以下であるエチレン/αオレ
フィン共重合体(A2)からなるαオレフィン系(共)
重合体(A)および熱減成法で得られる低分子量ポリプ
ロピレン系(共)重合体と重合法で得られる結晶化度1
0%以下のポリプロピレン系(共)重合体からなる19
0℃における溶融粘度が30〜100,000cPの低
粘度ポリオレフィン系樹脂(B)の存在下に、スチレン
系化合物、ビニル基含有カルボン酸もしくはその誘導体
および(メタ)アクリロニトリルからなる群より選ばれ
る少なくとも1種のラジカル重合性単量体(C)を加熱
溶融混練機中で重合してなり、(A):(B):(C)
の重量比が100:(30〜300):(1〜50)で
ある複合樹脂組成物。1. An α-olefin homopolymer (A1) having a melt index of 1 to 100 according to the ASTM D1238-L method and / or an ethylene / α-olefin copolymer having a melt index of more than 10 and 100 or less according to the same method. Α-olefin (co) consisting of coalescing (A2)
Polymer (A) and low molecular weight polyp obtained by thermal degradation method
Crystallinity 1 obtained by propylene (co) polymer and polymerization method
19 % or less of a polypropylene (co) polymer
In the presence of a low-viscosity polyolefin resin (B) having a melt viscosity at 30C of 30 to 100,000 cP, at least one selected from the group consisting of a styrene compound, a vinyl group-containing carboxylic acid or a derivative thereof, and (meth) acrylonitrile. (A): (B): (C) by polymerizing a kind of radically polymerizable monomer (C) in a hot melt kneader.
Is a composite resin composition having a weight ratio of 100: (30-300) :( 1-50).
/またはエチレン−ブテン−1共重合体である請求項1
記載の組成物。2. The composition according to claim 1, wherein (A) is a homopolymer of butene-1 and / or an ethylene-butene-1 copolymer.
A composition as described.
ポリプロピレンとプロピレン単位が30重量%以上含ま
れる非晶質低分子量エチレン−プロピレン共重合体から
なる請求項1または2記載の複合樹脂組成物。3. The method of claim 1, wherein (B) is a low molecular weight obtained by a thermal degradation method.
Contains at least 30% by weight of polypropylene and propylene units
Amorphous low molecular weight ethylene-propylene copolymer
Consisting claim 1 or 2 composite resin composition.
する請求項1〜3いずれか記載の複合樹脂組成物。4. The composite resin composition according to claim 1, wherein (C) essentially contains a styrene compound.
(B)および(C)の合計重量に対して50重量%以下
の量含有させてなる請求項1〜4いずれか記載の複合樹
脂組成物。5. A method according to claim 1, wherein the hydrogenated polybutadiene (D) is (A)
50% by weight or less based on the total weight of (B) and (C)
The composite resin composition according to any one of claims 1 to 4, wherein the composition comprises:
成物からなるホットメルト接着剤。6. A hot melt adhesive comprising the composite resin composition according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7215226A JP3032881B2 (en) | 1995-07-31 | 1995-07-31 | Composite resin composition and hot melt adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7215226A JP3032881B2 (en) | 1995-07-31 | 1995-07-31 | Composite resin composition and hot melt adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0940724A JPH0940724A (en) | 1997-02-10 |
| JP3032881B2 true JP3032881B2 (en) | 2000-04-17 |
Family
ID=16668804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7215226A Expired - Fee Related JP3032881B2 (en) | 1995-07-31 | 1995-07-31 | Composite resin composition and hot melt adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3032881B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4477152B2 (en) * | 1997-05-16 | 2010-06-09 | 株式会社共和 | Skin protective material for stoma or acne |
| JP3615103B2 (en) | 1999-11-18 | 2005-01-26 | 日本製紙株式会社 | Modified polyolefin composition and use thereof |
| ES2341977T3 (en) * | 2004-06-28 | 2010-06-30 | Dow Global Technologies Inc. | ADHESION PROMOTERS FOR MULTIESTRUCTURAL STRATIFIED MATERIALS. |
| DK2435671T3 (en) * | 2009-05-28 | 2019-01-14 | Waertsilae Nsd Schweiz Ag | Lubricating oil pump, cylinder lubrication system and internal combustion engine |
| JP6023399B2 (en) * | 2010-12-27 | 2016-11-09 | ヘンケルジャパン株式会社 | Hot melt adhesive |
| JP6104974B2 (en) * | 2015-04-03 | 2017-03-29 | ヘンケルジャパン株式会社 | Hot melt adhesive |
-
1995
- 1995-07-31 JP JP7215226A patent/JP3032881B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0940724A (en) | 1997-02-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103140557B (en) | The heat-fusible processing contact adhesive of fibre | |
| US4554304A (en) | Hot melt butylene/ethylene adhesives | |
| EP1799765A1 (en) | Combinations of tackifier and polyalphaolefin oil | |
| EP1354015A1 (en) | Pressure sensitive adhesive blends comprising (meth)acrylate polymers and articles therefrom | |
| CN103210048A (en) | Highly tackified, hot melt processable, acrylate pressure sensitive adhesives | |
| JP5738135B2 (en) | Modified propylene-based resin composition and adhesive comprising the composition | |
| WO1995010575A1 (en) | Adhesives from low molecular weight polypropylene | |
| JP2001131250A (en) | Acrylic copolymer, acrylic pressure sensitive adhesive composition, acrylic pressure sensitive adhesive tape or sheet, and acrylic adhesive composition | |
| JP3032881B2 (en) | Composite resin composition and hot melt adhesive | |
| WO1993021246A1 (en) | Polymer composite, molding product thereof, and laminate | |
| US20030143409A1 (en) | Blends of high Tg polymer emulsions and pressure sensitive adhesive polymer emulsions useful as pressure sensitive adhesives | |
| US6815504B2 (en) | Pressure sensitive adhesive formulation including enhanced polyisobutylene modifier | |
| JP4559084B2 (en) | Rubber-acrylic adhesive formulation | |
| JP5133113B2 (en) | Hot melt adhesive for difficult-to-adhere substrates | |
| JP2005105205A (en) | Hotmelt adhesive composition | |
| JP3333286B2 (en) | Composite resin composition and hot melt adhesive | |
| JP3038549B2 (en) | Adhesive additive and hot melt adhesive composition | |
| JP3133245B2 (en) | Resin composition and hot melt adhesive | |
| JPH0144222B2 (en) | ||
| JP2001187874A (en) | Hot-melt adhesive | |
| JP2004292716A (en) | Hot melt adhesive composition | |
| JPH0848731A (en) | Composite resin composition and hot-melt adhesive | |
| JP3041687B2 (en) | Adhesive modifier and hot melt adhesive composition | |
| JP2003292919A (en) | Hot-melt adhesive | |
| JP3292659B2 (en) | Resin composition and hot melt adhesive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080218 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090218 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |