JP3019769B2 - Terminal fitting for soldering and fixing - Google Patents
Terminal fitting for soldering and fixingInfo
- Publication number
- JP3019769B2 JP3019769B2 JP8042956A JP4295696A JP3019769B2 JP 3019769 B2 JP3019769 B2 JP 3019769B2 JP 8042956 A JP8042956 A JP 8042956A JP 4295696 A JP4295696 A JP 4295696A JP 3019769 B2 JP3019769 B2 JP 3019769B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- terminal fitting
- solder
- fixing
- fixing terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 49
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半田付け固定用端
子金具に関し、特に、半田槽で半田の流路中にさらして
半田付け固定する半田付け固定用端子金具に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering / fixing terminal fitting, and more particularly to a soldering / fixing terminal fitting that is exposed to a solder flow path in a solder bath and fixed by soldering.
【０００２】[0002]
【従来の技術】従来、半田付け固定用端子金具として、
特開平５−１２１１４２号公報に開示された図１１に示
すものが知られている。同図に示す端子金具１は表裏面
に半田メッキ２を施した素材３をプレスによって型抜き
して外形を形成されており、さらに、図１２及び図１３
に示すように断面半円形の成形溝を有する一対のプレス
金型４，４にて両面から押圧され、断面が円形となるよ
うに形成されている。これにより、プレスによる型抜き
をする前に素材３の表裏面に施されていた半田メッキ２
は円柱状となった端子金具１の全周にいきわたり、プリ
ント基板５の端子接続孔５ａに挿通せしめて半田付けす
るときに半田が浸透しやすくなるというものである。2. Description of the Related Art Conventionally, as terminal fittings for fixing by soldering,
FIG. 11 disclosed in Japanese Patent Application Laid-Open No. 5-121142 is known. The terminal fitting 1 shown in FIG. 1 is formed by punching out a material 3 having solder plating 2 on the front and back surfaces by a press to form an outer shape.
As shown in FIG. 7, the pair of press dies 4 and 4 having a molding groove having a semicircular cross section are pressed from both sides to form a circular cross section. As a result, the solder plating 2 applied to the front and back surfaces of the material 3 before the die is removed by pressing.
Is that the solder penetrates the entire periphery of the columnar terminal fitting 1 and is easily penetrated when it is inserted into the terminal connection hole 5a of the printed circuit board 5 and soldered.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来の半田付
け固定用端子金具においては、次のような課題があっ
た。プレス金型４，４にて押圧せしめたときに半田メッ
キ２が全周にいきわたることの真偽はさておき、プレス
金型４，４の型開き面に沿って不均一な凹凸が生じるが
このような凹凸がある（突起部分がある）まま半田槽を
通すと、図１４に示すように粘度の高い半田の流れを乱
して渦流が生じ、半田の付着しないピンホールが生じて
しまう。The above-mentioned conventional soldering and fixing terminal fittings have the following problems. Regardless of the fact that the solder plating 2 spreads over the entire circumference when pressed by the press dies 4 and 4, uneven unevenness occurs along the mold opening surfaces of the press dies 4 and 4. When the solder is passed through the solder bath with irregularities (projections), as shown in FIG. 14, the flow of the high-viscosity solder is disturbed and a vortex is generated, and pinholes to which the solder does not adhere are generated.
【０００４】本発明は、上記課題にかんがみてなされた
もので、半田の付着しないピンホールを生じなくするこ
とが可能な半田付け固定用端子金具の提供を目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a soldering-fixing terminal fitting capable of preventing pin holes from which solder does not adhere.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、請求項１にかかる発明は、半田槽で半田の流路中に
さらして半田付け固定する半田付け固定用端子金具であ
って、半田付けのピンホールが生じないように突起部分
を削り仕上げした構成としてある。According to one aspect of the present invention, there is provided a soldering / fixing terminal fitting which is exposed to a solder flow path in a solder bath and fixed by soldering. The protruding portion is cut and finished so that no additional pinholes occur.
【０００６】また、請求項２にかかる発明は、請求項１
に記載の半田付け固定用端子金具において、上記突起部
分はプレスによって打ち抜いたときの破断面の端部部分
であり、同端部部分に削り仕上げした構成としてある。
さらに、請求項３にかかる発明は、請求項１または請求
項２に記載の半田付け固定用端子金具において、上記突
起部分は金型を押し当てて面取り加工した端部部分であ
り、同端部部分に削り仕上げした構成としてある。[0006] The invention according to claim 2 is based on claim 1.
In the terminal fitting for fixing by soldering described in (1), the protruding portion is an end portion of a fractured surface when punched by a press, and the end portion is cut and finished.
Further, according to a third aspect of the present invention, in the terminal fitting for soldering and fixing according to the first or second aspect, the protruding portion is an end portion which is chamfered by pressing a mold. There is a configuration that has been cut and finished.
【０００７】さらに、請求項４にかかる発明は、請求項
１乃至請求項３のいずれかに記載の半田付け固定用端子
金具において、上記削り仕上げはシェービングで行う構
成としてある。さらに、請求項５にかかる発明は、削り
仕上げした断面形状が半田の流路方向と平行な略流線形
となるように構成してある。Furthermore, the invention according to claim 4, in soldered terminal fitting according to any one of claims 1 to 3, the finish cutting is a structure to perform shaving. Further, the invention according to claim 5 is configured such that the cross-sectional shape obtained by shaving is substantially streamline parallel to the flow direction of the solder.
【０００８】[0008]
【作用】上記のように構成した請求項１にかかる発明に
おいては、突起部分を削り仕上げすることにより、半田
槽を通過するときに液状の半田を横切っても細かな渦流
が生じないので、ピンホールが生じない。According to the first aspect of the present invention, a fine eddy current is not generated even if the liquid solder is traversed when passing through the solder bath by shaving and finishing the projection. No holes are created.
【０００９】また、上記のように構成した請求項２にか
かる発明においては、プレスによって打ち抜いたときに
剪断面においては細かな突起が生じないものの破断面の
端部部分においてはダレ等によって鋭利な突起部分が生
じ、これによって半田に渦流を生じることになりかねな
いが、同突起部分を削り仕上げしておくことにより、渦
流を生じない。なお、破断面自体を丸めるなどの面取り
加工をしたとしても鋭利な突起部分が残ることがあり、
削り仕上げして削除しておくことにより渦流によるピン
ホールが生じなくなる。Further, in the invention according to claim 2 configured as described above, fine projections do not occur in the sheared surface when punched by a press, but sharp edges are formed at the end portion of the fractured surface by sagging or the like. Protrusions may be formed, which may cause eddy currents in the solder. However, eddy currents are not generated by cutting and finishing the protruded portions. In addition, even if chamfering such as rounding the fractured surface itself, a sharp projection may remain,
By shaving and removing, pinholes due to eddy currents do not occur.
【００１０】さらに、上記のように構成した請求項３に
かかる発明においては、加工過程で金型を押し当てて面
取り加工することもあるが、押し当てられた中央部分は
表面が圧延されて突起部分が生じないものの、金型にて
引き延ばされた端部にしわ状の突起部分が生じることが
あり、この突起部分を削り仕上げしておくことにより、
渦流を生じなくなる。さらに、上記のように構成した請
求項４にかかる発明においては、端子金具をプレスで打
ち抜いたときの破断面や、金型を押し当てて面取り加工
した端部部分に突起部分が生じやすく、プレスや金型と
同方向に駆動されるシェービングで端面を削り取ること
により、上記突起部分が削除される。Further, in the invention according to claim 3 configured as described above, the mold may be pressed and chamfered in the working process. Although there are no parts, wrinkle-shaped projections may be generated at the ends extended by the mold, and by cutting and finishing these projections,
No eddy currents occur. Further, in the invention according to claim 4 configured as described above, a protruding portion is apt to be generated in a fractured surface when the terminal fitting is punched out by a press or in an end portion which is chamfered by pressing a mold. By shaving the end face with shaving driven in the same direction as that of the mold or the mold, the above-mentioned protruding portion is deleted.
【００１１】さらに、上記のように構成した請求項５に
かかる発明においては、断面形状が流線形となっている
ので半田槽を通過するときに半田の流れを乱さなくな
り、かつ、削り仕上げにて渦流が生じないようにしてピ
ンホールが生じないようにしている。Further, in the invention according to claim 5 configured as described above, since the cross-sectional shape is streamlined, the flow of the solder is not disturbed when passing through the solder bath, and the cut finish is achieved. A vortex is not generated to prevent pinholes.
【００１２】[0012]
【発明の効果】以上説明したように本発明は、突起を生
じないようにすることにより粘度の高い半田槽を通過し
ても細かな渦流が生じることはなく、半田のピンホール
も生じなくすることが可能な半田付け固定用端子金具を
提供することができる。As described above, according to the present invention, no projections are formed, so that a fine eddy current does not occur even when passing through a high-viscosity solder bath, and a pinhole of solder does not occur. It is possible to provide a soldering-fixing terminal fitting capable of performing the above.
【００１３】また、請求項２にかかる発明によれば、プ
レスの破断面で生じやすい突起部分をなくしてピンホー
ルを生じなくすることができる。さらに、請求項３にか
かる発明によれば、金型を押し当てたときに生じやすい
突起部分をなくしてピンホールを生じなくすることがで
きる。さらに、請求項４にかかる発明によれば、シェー
ビングによって容易に突起部分を削り仕上げすることが
できる。さらに、請求項５にかかる発明によれば、端子
金具が流線形となることにより半田に大きな流れの乱れ
を生じないため、気泡なども入りにくく、さらに突起部
分がなくなってよりピンホールを生じにくくすることが
できる。Further, according to the second aspect of the present invention, it is possible to eliminate a projection which is likely to be formed on a fractured surface of the press, thereby eliminating a pinhole. Further, according to the third aspect of the present invention, it is possible to eliminate a protruding portion which is likely to be generated when the mold is pressed, thereby preventing a pinhole from being generated. Further, according to the fourth aspect of the present invention, it is possible to easily finish the protruding portion by shaving. Further, according to the fifth aspect of the present invention, since the terminal fittings are streamlined so that a large flow disturbance is not generated in the solder, bubbles and the like hardly enter, and furthermore, the protrusions are eliminated and pinholes are less likely to occur. can do.
【００１４】[0014]
【発明の実施の形態】以下、図面にもとづいて本発明の
実施形態を説明する。図１は本発明の一実施形態にかか
る半田付け固定用端子金具を適用した電子回路基板を斜
視図により示しており、図２は断面図により示してい
る。同図において、半田付け固定用端子金具１０は後述
するようにしてプレスによる型抜きにて形成された雄側
端子金具であり、側方に開口を有する雄側コネクタハウ
ジング２０の奥壁２１を圧入して貫通された後、突き出
た端部を底面に向かって屈曲せしめている。プリント基
板３０には端子貫通孔３１を形成してあり、同半田付け
固定用端子金具１０の先端を挿通せしめるようにして雄
側コネクタハウジング２０を載置している。この後、他
の電子部品も載置して図３に示すウェーブ式半田付け装
置４０の半田槽などを通過させて半田付けする。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an electronic circuit board to which a soldering-fixing terminal fitting according to an embodiment of the present invention is applied, and FIG. 2 is a sectional view. In the figure, a soldering-fixing terminal fitting 10 is a male terminal fitting formed by die-cutting with a press as described later, and press-fits an inner wall 21 of a male connector housing 20 having an opening on the side. After that, the protruding end is bent toward the bottom surface. A terminal through-hole 31 is formed in the printed circuit board 30, and the male connector housing 20 is placed so that the tip of the soldering-fixing terminal fitting 10 can be inserted therethrough. Thereafter, other electronic components are also placed and passed through a solder tank or the like of the wave type soldering device 40 shown in FIG. 3 and soldered.
【００１５】本実施形態においては、半田付け固定用端
子金具１０を雄側コネクタハウジング２０に支持される
雄側端子金具に適用しているが、半田槽を通過して半田
付け固定されるような端子部分であれば良く、コネクタ
の端子金具である必要はないし、適用対象としては各種
の端子部分に適用可能である。また、この意味で、端子
状のものでもよくブラケットのような金具の一部であっ
ても構わない。むろん、半田槽に関しては半田付け固定
用端子金具１０が半田の流路中にさらされるようなもの
であればよく、本実施形態のように噴流式半田付けを行
うウェーブ式半田装置に限るものでもない。ここにいう
半田の流路中にさらすという意味は、相対的なものであ
り、半田が停止していて半田付け固定用端子金具１０が
移動していても良いし、半田だけが流れて半田付け固定
用端子金具１０が停止しているものでも良い。すなわ
ち、粘度の高い液状の半田を半田付け固定用端子金具１
０がかき乱すように横切るようなものを意味する。In the present embodiment, the terminal fitting for soldering fixing 10 is applied to the male terminal fitting supported by the male connector housing 20. However, the terminal fitting for soldering is fixed by passing through a solder bath. It is sufficient if it is a terminal portion, and it is not necessary to be a terminal fitting of a connector, and the present invention can be applied to various terminal portions. In this sense, it may be a terminal-like member or a part of a bracket such as a bracket. Of course, the solder bath may be any as long as the soldering-fixing terminal fitting 10 is exposed in the flow path of the solder, and is not limited to the wave-type soldering device that performs the jet-flow soldering as in the present embodiment. Absent. The meaning of exposure in the flow path of the solder herein is relative, and the soldering-fixing terminal fitting 10 may move while the solder is stopped, or only the solder flows and the soldering is performed. The fixing terminal fitting 10 may be stopped. That is, a liquid solder having high viscosity is soldered and fixed to the terminal fitting 1.
It means something that crosses 0 disturbingly.
【００１６】この半田付け固定用端子金具１０は、図４
に示すように、板状の素材を一対のプレス金型５１，５
２にて型抜きして概略の外形を形成されている。型抜き
により、半田付け固定用端子金具１０の側面には図５に
示すように剪断面１１と破断面１２とが形成され、破断
面の端部については図５に示すようにいわゆるダレと呼
ばれる下方に垂れ下がった突起部分１３が生じる。この
ようにプレスによる型抜きの時点で既に半田付け固定用
端子金具１０には突起部分１３が生じている。The solder fixing terminal fitting 10 is shown in FIG.
As shown in FIG.
2, a rough outline is formed. By the die cutting, a shear surface 11 and a fracture surface 12 are formed on the side surface of the soldering fixing terminal fitting 10 as shown in FIG. 5, and the end of the fracture surface is called so-called sag as shown in FIG. A protruding portion 13 hanging downward is generated. As described above, the projecting portion 13 has already been formed on the soldering and fixing terminal fitting 10 at the time of die removal by pressing.
【００１７】次に、このダレた部分を含めて半田付け固
定用端子金具１０の四隅の面取りを行うべく、図６に示
すように断面凹型の一対のプレス金型５３，５４にて上
下から挟み込むようにして押圧する。このような金型を
押し付ける面取り加工により、押し当てられる中側部分
は外方に引き延ばされることになり、押圧面は滑らかに
なる。しかしながら、引き延ばされた端部、すなわち、
半田付け固定用端子金具１０の側面には上方からと下方
から引き延ばされた素材の一部が押し寄せるようにして
四箇所の突起部分１４を形成する。Next, in order to chamfer the four corners of the soldering-fixing terminal fitting 10 including the sagged portion, as shown in FIG. 6, the terminal fitting 10 is sandwiched from above and below by a pair of pressing dies 53, 54 having a concave cross section. Press in this manner. By the chamfering process of pressing the mold, the pressed middle portion is extended outward, and the pressing surface becomes smooth. However, the elongated end, ie,
Four projecting portions 14 are formed on the side surface of the soldering fixing metal fitting 10 so that a part of the material stretched from above and from below is pushed in.
【００１８】本実施形態においては、上方と下方とから
断面凹型のプレス金型５３，５４を押し付けているが、
かかる金型に限定される必要はなく、少なくとも一つの
角部に対して金型を押し付けて面取りするようなもので
あれば、両側に押し広げたことによってその部分に突起
部分が形成される。この後、図７に示すように半田付け
固定用端子金具１０よりもわずかに幅狭に形成した凹部
を有するシェービング金型５５を数回押し付けることに
より、側面に残っている突起部分１４がそぎ落とされ
る。上述したように、半田付け固定用端子金具１０はプ
レス金型５１，５２による型抜きとプレス金型５３，５
４による面取りとを施され、最後の削り仕上げにおいて
もシェービング金型５５を採用することによって一連の
押し付け加工方向が一致する。すなわち、型抜き、面取
り、シェービングとが一連の作業となっ金型を往復動さ
せることになるので、生産作業場での加工効率が向上す
る。In this embodiment, the press dies 53 and 54 having concave cross sections are pressed from above and below.
It is not necessary to be limited to such a mold. If the mold is pressed against at least one corner and chamfered, a protrusion is formed at the portion by pushing and expanding the mold on both sides. Thereafter, as shown in FIG. 7, a shaving mold 55 having a concave portion formed slightly narrower than the soldering-fixing terminal fitting 10 is pressed several times so that the protruding portion 14 remaining on the side surface is scraped off. It is. As described above, the terminal fittings 10 for soldering and fixing are removed by the press dies 51 and 52 and the press dies 53 and 5 are used.
4 and the shaving mold 55 is used in the final shaving finish, so that a series of pressing directions coincide with each other. That is, since the die cutting, chamfering, and shaving are a series of operations and the die is reciprocated, the processing efficiency in the production workplace is improved.
【００１９】むろん、半田付け固定用端子金具１０に残
っている突起部分１３，１４がなくなればよいので、シ
ェービング以外の削り仕上げ、例えば、ブラッシングな
どによって仕上げることも可能であるが、上述したよう
に往復駆動動作でそぎ落とすシェービングは効率がよ
い。このようにして突起部分をなくす削り仕上げを施し
た半田付け固定用端子金具１０が半田槽を通過する場
合、図８に示すように、粘度のある半田をかき分けても
細かな渦流が生じにくい。これに比して、図９のＡ及び
Ｂに示すように、突起部分１３が残っている半田付け固
定用端子金具１０であったりすると細かな渦流が生じる
ため、粘度の高い半田が付着せずにピンホールが生じて
しまうことがある。Needless to say, it is only necessary that the protruding portions 13 and 14 remaining on the soldering fixing terminal fitting 10 be eliminated, so that it is possible to finish by shaving other than shaving, for example, brushing, but as described above. Shaving to remove by reciprocating drive operation is efficient. As shown in FIG. 8, when the soldering-fixing terminal fitting 10 that has been cut and finished so as to eliminate the protruding portion passes through the solder bath, a fine vortex is unlikely to be generated even if the viscous solder is pushed through. On the other hand, as shown in FIGS. 9A and 9B, when the soldering and fixing terminal fitting 10 has the protruding portion 13, a fine vortex is generated, so that the solder having high viscosity does not adhere. In some cases, pinholes may occur.
【００２０】本実施形態においては、面取りした後の突
起部分１４を削り仕上げで落とすようにしているが、上
述したようにプレスによる型抜きにて生じる突起部分１
３を削り仕上げで落とすようにしても良いし、また、図
１０に示すようにして面取り部分を大きくすると、半田
付け固定用端子金具１０の断面形状を流線形に近くする
こともでき、さらに削り仕上げすることによって半田槽
を通過するときにあまり半田の流れを乱さないようにす
ることができる。このようにすればより気泡なども生じ
難くなり、結果として半田のピンホールも生じない。In the present embodiment, the protruding portion 14 which has been chamfered and is removed by shaving is removed as described above.
Alternatively, if the chamfered portion is enlarged as shown in FIG. 10, the cross-sectional shape of the soldering-fixing terminal fitting 10 can be made closer to a streamlined shape. By finishing, it is possible to prevent the flow of the solder from being disturbed much when passing through the solder bath. In this way, bubbles and the like are less likely to be generated, and as a result, pinholes of the solder are not generated.
【００２１】このように、ウェーブ式半田付け装置など
の半田槽で半田の流路中にさらして半田付け固定する半
田付け固定用端子金具１０について、型抜きや面取りに
よって生じる鋭利な突起部分１３，１４をシェービング
などによって削り仕上げして落とすことにより、半田槽
を通過するときに細かな渦流が生じなくなり、結果とし
てピンホールを生じ難くさせることができる。As described above, with respect to the soldering fixing terminal fitting 10 which is exposed to the solder flow path in a solder bath such as a wave type soldering apparatus and the like, and is fixed by soldering, the sharp protrusions 13 formed by die-cutting or chamfering are used. By shaving and finishing 14 to remove it, fine eddies are not generated when passing through the solder bath, and as a result, pinholes can be hardly generated.
【図１】本発明の一実施形態にかかる半田付け固定用端
子金具を適用した電子回路基板の斜視図である。FIG. 1 is a perspective view of an electronic circuit board to which a terminal fitting for soldering and fixing according to an embodiment of the present invention is applied.
【図２】同半田付け固定用端子金具を適用した電子回路
基板の断面図である。FIG. 2 is a cross-sectional view of an electronic circuit board to which the soldering-fixing terminal fitting is applied.
【図３】同半田付け固定用端子金具に半田付けする半田
付け装置の斜視図である。FIG. 3 is a perspective view of a soldering device for soldering to the soldering-fixing terminal fitting.
【図４】同半田付け固定用端子金具を型抜きするプレス
金型を示す概略断面図である。FIG. 4 is a schematic cross-sectional view showing a press die for die-cutting the soldering-fixing terminal fitting.
【図５】型抜き後の半田付け固定用端子金具の断面図で
ある。FIG. 5 is a cross-sectional view of the soldering-fixing terminal fitting after die-cutting.
【図６】同半田付け固定用端子金具を面取りするプレス
金型を示す概略断面図である。FIG. 6 is a schematic sectional view showing a press die for chamfering the soldering-fixing terminal fitting.
【図７】同半田付け固定用端子金具をシェービングする
金型を示す概略断面図である。FIG. 7 is a schematic sectional view showing a mold for shaving the soldering-fixing terminal fitting.
【図８】同半田付け固定用端子金具が半田槽で半田の流
路中にさらされた状態を示す模式図である。FIG. 8 is a schematic diagram showing a state where the soldering and fixing terminal fitting is exposed in a solder flow path in a solder bath.
【図９】突起部分がある半田付け固定用端子金具が半田
槽で半田の流路中にさらされた状態を示す模式図であ
る。FIG. 9 is a schematic diagram showing a state in which a soldering-fixing terminal fitting having a protruding portion is exposed in a solder flow path in a solder bath.
【図１０】変形例にかかる半田付け固定用端子金具の断
面図である。FIG. 10 is a sectional view of a soldering-fixing terminal fitting according to a modification.
【図１１】従来の半田付け固定用端子金具の斜視図であ
る。FIG. 11 is a perspective view of a conventional soldering and fixing terminal fitting.
【図１２】同半田付け固定用端子金具の製造工程を示す
側面図である。FIG. 12 is a side view showing a manufacturing process of the soldering-fixing terminal fitting.
【図１３】同半田付け固定用端子金具の製造工程を示す
側面図である。FIG. 13 is a side view showing a manufacturing step of the soldering-fixing terminal fitting.
【図１４】同半田付け固定用端子金具が半田槽で半田の
流路中にさらされた状態を示す模式図である。FIG. 14 is a schematic view showing a state where the soldering-fixing terminal fitting is exposed in a solder flow path in a solder bath.
１０…半田付け固定用端子金具 １１…剪断面 １２…破断面 １３，１４…突起部分 ４０…ウェーブ式半田付け装置 ５１，５２…プレス金型 ５３，５４…プレス金型 ５５…シェービング金型 DESCRIPTION OF SYMBOLS 10 ... Terminal fitting for soldering fixation 11 ... Shear surface 12 ... Breaking surface 13, 14 ... Protrusion part 40 ... Wave-type soldering apparatus 51, 52 ... Press mold 53, 54 ... Press mold 55 ... Shaving mold
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 1/08 320 H01L 23/50 H01R 4/02 H01R 12/32 H01R 43/02 H01R 43/16 H05K 3/34 506 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) B23K 1/08 320 H01L 23/50 H01R 4/02 H01R 12/32 H01R 43/02 H01R 43/16 H05K 3 / 34 506
Claims (5)
け固定する半田付け固定用端子金具であって、半田付け
のピンホールが生じないように突起部分を削り仕上げし
たことを特徴とする半田付け固定用端子金具。1. A soldering and fixing terminal fitting which is exposed to a solder flow path in a solder bath and fixed by soldering, characterized in that a protruding portion is cut and finished so that a pinhole for soldering does not occur. Terminal fittings for soldering.
子金具において、上記突起部分はプレスによって打ち抜
いたときの破断面の端部部分であることを特徴とする半
田付け固定用端子金具。2. The terminal fitting for soldering and fixing according to claim 1, wherein the protrusion is an end portion of a fractured surface when punched by a press.
田付け固定用端子金具において、上記突起部分は金型を
押し当てて面取り加工した端部部分であることを特徴と
する半田付け固定用端子金具。3. The soldering and fixing terminal according to claim 1, wherein the projection is an end portion which is chamfered by pressing a mold. Terminal fittings.
記載の半田付け固定用端子金具において、上記削り仕上
げはシェービングで行うことを特徴とする半田付け固定
用端子金具。Wherein said at soldered terminal fitting according to any one of claims 1 to 3, the finish cutting is soldered terminal fitting which is characterized in that in shaving.
記載の半田付け固定用端子金具において、削り仕上げし
た断面形状が半田の流路方向と平行な略流線形であるこ
とを特徴とする半田付け固定用端子金具。5. A soldered terminal fitting according to any one of claims 1 to 4, and wherein the cross-sectional shape of the finishing is a solder flow path parallel to the direction substantially streamlined Terminal fittings for soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8042956A JP3019769B2 (en) | 1996-02-29 | 1996-02-29 | Terminal fitting for soldering and fixing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8042956A JP3019769B2 (en) | 1996-02-29 | 1996-02-29 | Terminal fitting for soldering and fixing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09237860A JPH09237860A (en) | 1997-09-09 |
| JP3019769B2 true JP3019769B2 (en) | 2000-03-13 |
Family
ID=12650487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8042956A Expired - Lifetime JP3019769B2 (en) | 1996-02-29 | 1996-02-29 | Terminal fitting for soldering and fixing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3019769B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3471220A1 (en) * | 2017-10-16 | 2019-04-17 | TE Connectivity Germany GmbH | Bent electric contact element with chamfered edges and method for its manufacture |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007103251A (en) * | 2005-10-06 | 2007-04-19 | Matsushita Electric Works Ltd | Outlet plug |
| CN102598423B (en) * | 2010-10-28 | 2013-11-27 | 深圳盛凌电子股份有限公司 | Processing method and device for chamfering the crimping area of a metal terminal |
| JP7389591B2 (en) * | 2019-09-05 | 2023-11-30 | ダイハツ工業株式会社 | How to process flat wire |
-
1996
- 1996-02-29 JP JP8042956A patent/JP3019769B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3471220A1 (en) * | 2017-10-16 | 2019-04-17 | TE Connectivity Germany GmbH | Bent electric contact element with chamfered edges and method for its manufacture |
| US10770856B2 (en) | 2017-10-16 | 2020-09-08 | Te Connectivity Germany Gmbh | Bent electric contact element with chamfered edges and method for its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09237860A (en) | 1997-09-09 |
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