JP3013994B2 - Image sensor support device - Google Patents
Image sensor support deviceInfo
- Publication number
- JP3013994B2 JP3013994B2 JP1178268A JP17826889A JP3013994B2 JP 3013994 B2 JP3013994 B2 JP 3013994B2 JP 1178268 A JP1178268 A JP 1178268A JP 17826889 A JP17826889 A JP 17826889A JP 3013994 B2 JP3013994 B2 JP 3013994B2
- Authority
- JP
- Japan
- Prior art keywords
- solid
- image sensor
- support plate
- imaging device
- state imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 claims description 32
- 230000003287 optical effect Effects 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Viewfinders (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子カメラあるいはビデオカメラ等に設け
られ、固体撮像素子を撮影レンズ系の支持部材あるいは
カメラボデーに対して固定させるための装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus provided in an electronic camera, a video camera, or the like, for fixing a solid-state imaging device to a supporting member of a photographic lens system or a camera body. .
従来の電子スチルカメラ等において、固体撮像素子
は、カメラボデー内において撮影レンズ系の後方に配設
され、プリント基板に一体的に取付けられてこれに電気
的に接続される。プリント基板は、撮影レンズ系の支持
部材（例えばズーム環の基部）に調整ねじにより連結さ
れており、撮影レンズ系の光軸方向に沿った固体撮像素
子の位置調整すなわちピント調整は、調整ねじを回し
て、この固体撮像素子とプリント基板を光軸方向に沿っ
て変位させることにより行われる。In a conventional electronic still camera or the like, a solid-state imaging device is disposed behind a photographic lens system in a camera body, is integrally attached to a printed circuit board, and is electrically connected thereto. The printed circuit board is connected to a supporting member of the photographing lens system (for example, a base of a zoom ring) by an adjusting screw. To adjust the position of the solid-state imaging device along the optical axis direction of the photographing lens system, that is, to adjust the focus, adjust the adjusting screw. This is performed by rotating the solid-state imaging device and the printed board along the optical axis.
このような従来の構成において、プリント基板は、ピ
ント調整のために固体撮像素子を撮影レンズ系に対して
高精度に位置決めしなければならなず、このため調整ね
じを締めつけたときに変形することが許されない。とこ
ろが、プリント基板は一般に合成樹脂から成形されるた
め、調整ねじの締めつけに対して十分な剛性を有するた
めには、ある程度の肉厚を必要とする。しかして従来の
プリント基板は、薄肉に成形することができず、これに
よりカメラの軽量化おび小型化が妨げられていた。In such a conventional configuration, the printed circuit board must position the solid-state image sensor with respect to the photographing lens system with high accuracy for focus adjustment, and therefore, the printed circuit board may be deformed when the adjustment screw is tightened. Is not allowed. However, since the printed circuit board is generally formed of a synthetic resin, a certain thickness is required in order to have sufficient rigidity for tightening the adjusting screw. However, the conventional printed circuit board cannot be formed into a thin wall, which hinders weight reduction and size reduction of the camera.
本発明は、プリント基板を薄くしてカメラをさらに軽
量かつ小型化することを目的としてなされたものであ
る。An object of the present invention is to make a printed circuit board thinner to further reduce the weight and size of a camera.
本発明に係る撮像素子支持装置は、レンズの光軸に垂
直な所定の面内においてレンズに対して相対移動可能な
取付板と、固体撮像素子を支持するとともに、上記取付
板に対してレンズの光軸方向の相対距離が調整可能であ
ってかつ光軸に垂直な方向において固定される撮像素子
支持板と、上記撮像素子支持板のレンズ側に固定され、
上記撮像素子支持板との間で上記固体撮像素子を保持す
る押さえ枠と、上記押さえ枠の上記固体撮像素子より上
記レンズ側に一体的に固定されるフィルタと、電気回路
を形成されるとともに上記固体撮像素子の接続端子に電
気的に接続され、かつ上記接続端子のみによって上記固
体撮像素子に固定される回路基板とを備えたことを特徴
としている。An image pickup device supporting device according to the present invention includes a mounting plate that is relatively movable with respect to the lens within a predetermined plane perpendicular to the optical axis of the lens, and supports the solid-state imaging device, and mounts the lens with respect to the mounting plate. An image sensor supporting plate whose relative distance in the optical axis direction is adjustable and is fixed in a direction perpendicular to the optical axis, and is fixed to the lens side of the image sensor supporting plate,
A holding frame for holding the solid-state imaging device between the imaging device support plate, a filter integrally fixed to the lens side of the holding frame with respect to the solid-state imaging device, and an electric circuit formed and A circuit board electrically connected to a connection terminal of the solid-state imaging device and fixed to the solid-state imaging device only by the connection terminal.
以下図示実施例により、本発明を説明する。 Hereinafter, the present invention will be described with reference to the illustrated embodiments.
電子スチルカメラでは、第２図に示すように、カメラ
ボデー10内において撮影レンズ系12の後方には固体撮像
素子14が配設され、撮影レンズ系12の側方には撮影範囲
確認用の透視ファインダ16が配設されている。In the electronic still camera, as shown in FIG. 2, a solid-state image sensor 14 is disposed in the camera body 10 behind the photographing lens system 12, and a perspective for photographing range confirmation is provided beside the photographing lens system 12. A finder 16 is provided.
第１図、および第３図〜第５図は本発明の一実施例に
係る撮像素子支持装置を示す。FIGS. 1 and 3 to 5 show an image pickup device supporting apparatus according to an embodiment of the present invention.
カメラボデーの前部内壁に支柱（図示せず）を介して
固定された支持板36には、中央部に開口36aが形成され
ている。この支持板36には次のような構成の撮像ブロッ
ク38が取付けられる。An opening 36a is formed at the center of the support plate 36 fixed to a front inner wall of the camera body via a column (not shown). An imaging block 38 having the following configuration is mounted on the support plate 36.
すなわち、略Ｔ字状に形成された撮像素子支持板40
は、例えば金属製の薄板から成形され、その中央部は第
４図に示すように後方に凹んでいる。一方、押さえ枠42
は第１図および第４図に示す如く、前方に突出された中
央部前面に開口42aが形成され、中央部背面に２段の凹
部42b、42cが形成されている。凹部42b内にはフィルタ4
4が、凹部42c内には固体撮像素子46がそれぞれ嵌合され
ている。これらのフィルタ44および固体撮像素子46は、
ねじ48で押さえ枠42を撮像素子支持板40に螺着すること
により、撮像素子支持板40に固定される。That is, the imaging element support plate 40 formed in a substantially T-shape
Is formed from a thin metal plate, for example, and its center is recessed rearward as shown in FIG. Meanwhile, the holding frame 42
As shown in FIGS. 1 and 4, an opening 42a is formed in a front surface of a central portion protruding forward, and two steps of recesses 42b and 42c are formed in a rear surface of the central portion. Filter 4 is in recess 42b
4, the solid-state imaging device 46 is fitted in the recess 42c. These filters 44 and solid-state imaging device 46
The holding frame 42 is screwed to the image sensor supporting plate 40 with the screw 48, thereby being fixed to the image sensor supporting plate 40.
撮像素子支持板40の端部３か所には、孔40aが形成さ
れ、これらの孔40aには調整ねじ50が貫通している。第
４図に示すように、調整ねじ40aの先端は、取付板52に
形成された螺孔52aに螺入されている。撮像素子支持板4
0と取付板52との間において、調整ねじ50の外周には、
圧縮コイルばね54が嵌合され、このばね54は撮像素子支
持板40と取付板52を互いに離間する方向へ押圧してい
る。Holes 40a are formed at three end portions of the imaging element support plate 40, and adjustment screws 50 pass through these holes 40a. As shown in FIG. 4, the tip of the adjusting screw 40a is screwed into a screw hole 52a formed in the mounting plate 52. Image sensor support plate 4
Between 0 and the mounting plate 52, on the outer periphery of the adjusting screw 50,
A compression coil spring 54 is fitted, and the spring 54 presses the image sensor support plate 40 and the mounting plate 52 in a direction away from each other.
取付板52には開口52bが形成され、この開口52bを通じ
て押さえ枠42が前方に突出している。An opening 52b is formed in the mounting plate 52, and the holding frame 42 protrudes forward through the opening 52b.
電気回路を形成された回路基板すなわちプリント基板
56は、第１図に二点鎖線で示すように、撮像素子支持板
40とは別体に成形され、固体撮像素子46の複数の端子ピ
ン46aに固定されて、固体撮像素子46に電気的に接続さ
れている。Circuit board or printed circuit board on which electric circuit is formed
Reference numeral 56 denotes an image sensor support plate as shown by a two-dot chain line in FIG.
The solid-state imaging device 46 is formed separately from the solid-state imaging device 46, is fixed to a plurality of terminal pins 46a of the solid-state imaging device 46, and is electrically connected to the solid-state imaging device 46.
以上が撮像ブロック38の構成である。 The above is the configuration of the imaging block 38.
取付板52は、板ばね58を用いて支持板36の背面へ次の
ように摺動自在に取付けられている。The mounting plate 52 is slidably mounted on the back surface of the support plate 36 using a leaf spring 58 as follows.
すなわち、この板ばね58は、第１図に示す如く略Ｔ字
状であり、中央部58aから両端部58bへ向かって傾斜さ
れ、中央部58aには孔58cが形成されている。一方、取付
板52の対角線上の２か所に貫通孔52cが形成され、これ
に対応して、上記支持板36には螺孔36bが形成されてい
る。ねじ60が板ばね58の孔58cに貫通されてその先端が
支持板36の螺孔36bに螺入され、ねじ60の頭部60aと取付
板52との間に板ばね58が介在されることにより、取付板
52が支持板36に対して、所定の圧接力をもって押さえ付
けられている。That is, the leaf spring 58 has a substantially T shape as shown in FIG. 1, and is inclined from the central portion 58a toward both ends 58b, and a hole 58c is formed in the central portion 58a. On the other hand, through holes 52c are formed at two positions on the diagonal line of the mounting plate 52, and correspondingly, screw holes 36b are formed in the support plate 36. The screw 60 penetrates through the hole 58c of the leaf spring 58, its tip is screwed into the screw hole 36b of the support plate 36, and the leaf spring 58 is interposed between the head 60a of the screw 60 and the mounting plate 52. By mounting plate
52 is pressed against the support plate 36 with a predetermined pressing force.
取付板52が支持板36に取り付けられた状態では、支持
板36の開口36aと押さえ枠42との間には第１図および第
３図に示す如く、ΔＤの間隙が存在する。When the mounting plate 52 is mounted on the support plate 36, there is a gap ΔD between the opening 36a of the support plate 36 and the holding frame 42 as shown in FIGS. 1 and 3.
次に、上記の如く構成された本実施例の動作を説明す
る。Next, the operation of the present embodiment configured as described above will be described.
板ばね58により、撮像ブロック38の一構成要素である
取付板52は、支持板36に対して適当な圧接力、すなわ
ち、取付板52をその面方向に移動させることができ、自
然に摺動することのない程度の圧接力で半固定されてい
る。The leaf spring 58 allows the mounting plate 52, which is a component of the imaging block 38, to have an appropriate pressing force against the support plate 36, that is, the mounting plate 52 can be moved in the plane direction, and can slide naturally. It is semi-fixed with a pressing force that does not cause any pressure.
一方、カメラより所定の距離だけ離れている被写体を
撮影レンズ系12を介して固体撮像素子14により撮影して
CRTモニタに映し出す。カメラ固定状態で、固体撮像素
子46を撮影レンズ系12の光軸と垂直な面内で移動させれ
ば、モニタ画像の視野が変化する。On the other hand, a subject that is a predetermined distance from the camera is photographed by the solid-state imaging device 14 through the photographing lens system 12.
Display on CRT monitor. If the solid-state imaging device 46 is moved in a plane perpendicular to the optical axis of the photographing lens system 12 in the camera fixed state, the field of view of the monitor image changes.
そこで、透視ファインダ16にて被写体を覗き、モニタ
画像の視野が透視ファインダ16の視野に一致するよう
に、治具（図示せず）を用いて取付板52をその面内に移
動させる。この取付板52の移動範囲（調整範囲）は、一
般に、左右、上下の両方向とも1mmあれば充分である。Then, the subject is peeped through the perspective finder 16 and the mounting plate 52 is moved into the plane using a jig (not shown) so that the field of view of the monitor image matches the field of view of the perspective finder 16. In general, it is sufficient for the moving range (adjustment range) of the mounting plate 52 to be 1 mm in both the left, right, up, and down directions.
かくして両視野が一致した状態でねじ60を強く締め付
けると、取付板52は支持板36に強く圧着されて固定状態
となる。Thus, when the screw 60 is strongly tightened in a state where the two visual fields match, the mounting plate 52 is strongly pressed against the support plate 36 to be in a fixed state.
また３か所の調整ねじ50を回すことにより、撮像素子
支持板40の３点をそれぞれ取付板52に対して接離させる
ことができ、撮影レンズ系12の光軸方向に対する固体撮
像素子46の位置の調整、すなわち所定被写体距離に対す
るピント調整を行うことができる。Also, by turning the three adjustment screws 50, three points of the imaging element support plate 40 can be brought into contact with and separated from the mounting plate 52, respectively, and the solid-state imaging element 46 with respect to the optical axis direction of the photographing lens system 12 can be moved. Position adjustment, that is, focus adjustment for a predetermined subject distance can be performed.
しかして上記実施例において、プリント基板56は調整
ねじを介して支持板36に連結されるものではないので、
十分な剛性を有する必要がなく、したがって従来のよう
に厚く成形される必要がない。すなわちプリント基板56
は極力薄く成形されることとなり、またその配置場所も
撮像素子板40の背面である必要はなく、自由に選択され
得る。一方、撮像素子支持板40は例えば金属板のように
十分な剛性を有する部材から成形されるため、その板厚
は薄くてもよい。したがって、撮像ブロック38は従来よ
りも小形化され、また軽量化される。Thus, in the above embodiment, since the printed circuit board 56 is not connected to the support plate 36 via the adjustment screw,
It does not need to have sufficient rigidity, and therefore does not need to be formed as thick as in the past. That is, the printed circuit board 56
Is formed as thin as possible, and the arrangement position does not need to be on the back surface of the imaging element plate 40, and can be freely selected. On the other hand, since the imaging element support plate 40 is formed from a member having sufficient rigidity such as a metal plate, the plate thickness may be small. Therefore, the imaging block 38 is made smaller and lighter than before.
また、プリント基板56は撮像素子支持板40とは別体に
成形されるため、レンズのピント調整後に取り外してピ
ントに影響を与えることはなく、容易に交換することが
できる。Further, since the printed circuit board 56 is formed separately from the imaging element support plate 40, the printed circuit board 56 can be easily replaced without being removed after adjusting the focus of the lens without affecting the focus.
なお、上記実施例では、本発明を電子スチルカメラに
適用した場合を説明したが、電子ムービィカメラに適用
することもできる。In the above embodiment, the case where the present invention is applied to an electronic still camera has been described. However, the present invention can also be applied to an electronic movie camera.
以上のように本発明によれば、プリント基板等の回路
基板を薄くすることができ、ひいてはカメラをさらに軽
量かつ小型化することが可能となるという効果が得られ
る。また本発明によれば、ピント調整後も回路基板を容
易に交換することができるという効果が得られる。As described above, according to the present invention, it is possible to reduce the thickness of a circuit board such as a printed circuit board, and furthermore, it is possible to obtain an effect that the camera can be further reduced in weight and size. Further, according to the present invention, an effect is obtained that the circuit board can be easily replaced even after the focus adjustment.
第１図は本発明の一実施例の要部を示し、第３図のＩ−
Ｉ線に沿う断面図、 第２図は電子スチルカメラの要部斜視図、 第３図は電子スチルカメラの背面から見たカメラ内の視
差調整機構を示す正面図、 第４図は第３図のIV−IV線に沿う断面図、 第５図は第３図のＶ−Ｖ線に沿う断面図である。 40……撮像素子支持板 46……固体撮像素子 56……プリント基板FIG. 1 shows a main part of one embodiment of the present invention, and FIG.
FIG. 2 is a perspective view of an essential part of the electronic still camera, FIG. 3 is a front view showing a parallax adjusting mechanism in the camera as viewed from the back of the electronic still camera, FIG. 4 is FIG. 5 is a sectional view taken along the line VV in FIG. 3. FIG. 40: Image sensor support plate 46: Solid-state image sensor 56: Printed circuit board
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 伸治 東京都板橋区前野町２丁目36番９号 旭 光学工業株式会社内 (56)参考文献 特開 昭63−78115（ＪＰ，Ａ) 特開 昭62−163474（ＪＰ，Ａ) 実開 昭59−67950（ＪＰ，Ｕ) 実開 昭60−68755（ＪＰ，Ｕ) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Shinji Suzuki 2-36-9 Maenocho, Itabashi-ku, Tokyo Asahi Optical Industry Co., Ltd. (56) References JP-A-63-78115 (JP, A) JP-A-63-78115 Sho-62-163474 (JP, A) Sho-sho 59-67950 (JP, U) Sho-sho 60-68755 (JP, U)
Claims (1)
て、レンズに対して相対移動可能な取付板と、 固体撮像素子を支持するとともに、上記取付板に対して
レンズの光軸方向の相対距離が調整可能であってかつ光
軸に垂直な方向において固定される撮像素子支持板と、 上記撮像素子支持板のレンズ側に固定され、上記撮像素
子支持板との間で上記固体撮像素子を保持する押さえ枠
と、 上記押さえ枠の上記固体撮像素子より上記レンズ側に一
体的に固定されるフィルタと、 電気回路を形成されるとともに上記固体撮像素子の接続
端子に電気的に接続され、かつ上記接続端子のみによっ
て上記固体撮像素子に固定される回路基板とを備えたこ
とを特徴とする撮像素子支持装置。1. A mounting plate which is movable relative to a lens in a predetermined plane perpendicular to the optical axis of the lens, supports a solid-state image pickup device, and is mounted in the optical axis direction of the lens with respect to the mounting plate. An image sensor support plate whose relative distance is adjustable and fixed in a direction perpendicular to the optical axis; and the solid-state image sensor fixed to the lens side of the image sensor support plate and between the image sensor support plate A holding frame for holding the filter, a filter integrally fixed to the lens side of the holding frame with respect to the solid-state imaging device, and an electric circuit formed and electrically connected to a connection terminal of the solid-state imaging device; And a circuit board fixed to the solid-state imaging device only by the connection terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1178268A JP3013994B2 (en) | 1989-07-11 | 1989-07-11 | Image sensor support device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1178268A JP3013994B2 (en) | 1989-07-11 | 1989-07-11 | Image sensor support device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63124780A Division JP2706944B2 (en) | 1988-03-11 | 1988-05-21 | Adjusting the parallax of an electronic camera |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02223281A JPH02223281A (en) | 1990-09-05 |
| JP3013994B2 true JP3013994B2 (en) | 2000-02-28 |
Family
ID=16045515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1178268A Expired - Lifetime JP3013994B2 (en) | 1989-07-11 | 1989-07-11 | Image sensor support device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3013994B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106687844A (en) * | 2014-09-25 | 2017-05-17 | 日本电产科宝株式会社 | Imaging device, optical device, electronic device, vehicle, and production method for imaging device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5967950U (en) * | 1982-10-26 | 1984-05-08 | シャープ株式会社 | Semiconductor image sensor mounting device |
| JPS6068755U (en) * | 1983-10-17 | 1985-05-15 | 株式会社ニコン | Solid-state image sensor mounting adjustment device |
| JPS62163474A (en) * | 1986-01-13 | 1987-07-20 | Hitachi Ltd | Fitting mechanism for solid-state image pickup element |
-
1989
- 1989-07-11 JP JP1178268A patent/JP3013994B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02223281A (en) | 1990-09-05 |
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