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JP3001339B2 - Burn-in board inspection equipment - Google Patents

Burn-in board inspection equipment

Info

Publication number
JP3001339B2
JP3001339B2 JP5030040A JP3004093A JP3001339B2 JP 3001339 B2 JP3001339 B2 JP 3001339B2 JP 5030040 A JP5030040 A JP 5030040A JP 3004093 A JP3004093 A JP 3004093A JP 3001339 B2 JP3001339 B2 JP 3001339B2
Authority
JP
Japan
Prior art keywords
burn
board
socket
displacement meter
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5030040A
Other languages
Japanese (ja)
Other versions
JPH06241734A (en
Inventor
茂 葛原
Original Assignee
山口日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山口日本電気株式会社 filed Critical 山口日本電気株式会社
Priority to JP5030040A priority Critical patent/JP3001339B2/en
Publication of JPH06241734A publication Critical patent/JPH06241734A/en
Application granted granted Critical
Publication of JP3001339B2 publication Critical patent/JP3001339B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、バーインボードに取付
けられた複数のICソケット(以下単にソケットを呼
ぶ)の基準位置からの位置を検査するバーインボード検
査装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in board inspection apparatus for inspecting the positions of a plurality of IC sockets (hereinafter simply referred to as sockets) mounted on a burn-in board from a reference position.

【0002】[0002]

【従来の技術】従来は、このバーインボード上のソケッ
ト位置を検査するのに、基準位置にもっとも近い位置に
あるソケットの位置をスケール等で測定したソケットと
隣接するソケット間の隙間に検査治具(隙間ゲージ)挿
入することで隙間が正しいか否かで検査を行っていた。
2. Description of the Related Art Conventionally, in order to inspect the position of a socket on a burn-in board, an inspection jig is inserted into a gap between a socket and an adjacent socket measured by measuring the position of a socket closest to a reference position with a scale or the like. (Gap gauge) Inspection was performed to determine whether the gap was correct by inserting.

【0003】また、別の方法では、工具顕微鏡のステー
ジにバーインボードを乗せ、ICソケットの位置を計測
し、その計測値でもって良否を判定していた。
[0003] In another method, a burn-in board is placed on a stage of a tool microscope, the position of an IC socket is measured, and pass / fail is determined based on the measured value.

【0004】[0004]

【発明が解決しようとする課題】しかしながら検査治具
(隙間ゲージ)による検査において、検査治具に加える
力、検査治具挿入方向により測定結果が左右され検査結
果の信頼性が低いという問題がある。
However, in an inspection using an inspection jig (gap), there is a problem that the measurement result is affected by the force applied to the inspection jig and the insertion direction of the inspection jig, and the reliability of the inspection result is low. .

【0005】また、工場顕微鏡による測定では、バーイ
ンボードが、工場顕微鏡のステージに比べて大きい種類
が多く、1枚のバーインボード上のICソケットの位置
全てを1回で測定することが出来ない。そのため、数回
に分けて測定する必要があり、そしてこの数回の測定値
を集計する必要性が発生する。このため、測定工数の増
大するばかりか測定誤差の増大を生む不具合がある。さ
らに、人偽的な測定誤差などの含むことがある。その
上、バーインボード上のソケット位置の良否判定を、測
定値と基準値とを人が比較して行うという工数を必要と
していた。
In the measurement using a factory microscope, there are many types of burn-in boards that are larger than the stage of the factory microscope, and it is not possible to measure all the positions of the IC sockets on one burn-in board at one time. For this reason, it is necessary to perform measurement in several times, and it is necessary to add up the measured values in several times. For this reason, there is a problem that not only increases the number of measurement steps but also increases the measurement error. In addition, there may be a false measurement error. In addition, the man-hour required to judge the acceptability of the socket position on the burn-in board by comparing the measured value and the reference value with each other is required.

【0006】従って、本発明の目的は、人偽的の誤差を
含むことなく自動的にソケットの位置を測定し、位置の
良否も判定できるバーインボード検査装置を提供するこ
とである。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a burn-in board inspection apparatus capable of automatically measuring the position of a socket without including false errors and determining whether the position is good.

【0007】[0007]

【課題を解決するための手段】本発明の特徴は、複数の
ソケット並べて配置されたバーインボードを載置する
テーブルと、このバーインボードの面に対し所定の角度
に傾むく傾斜面からレーザ光を前記バーインボードの面
に照射し該面からの反射光を前記傾斜面に受光するレー
ザ変位計とを備え、前記傾斜面を背面側にし前記ソケッ
トの並ぶ方向に前記レーザ変位計と前記バーインボード
とを相対的に移動させ、前記ソケット上面からの反射光
を受光し前記ソケットの位置を認識し基準値と比較し
記ソケットの間隔の良否を判定するバーインボード検査
装置である。
A feature of the present invention is that a table on which a burn-in board on which a plurality of sockets are arranged is placed, and a predetermined angle with respect to the surface of the burn-in board.
Laser light from the inclined surface that is inclined to the surface of the burn-in board
And a laser displacement meter for receiving the reflected light from the surface on the inclined surface , wherein the inclined surface is on the rear side and the socket is
The laser displacement meter and the burn-in board in the direction in which
And the light reflected from the upper surface of the socket.
To recognize the position of the socket and compare with the reference value before
This is a burn-in board inspection device that determines whether or not the interval between the sockets is good.

【0008】[0008]

【実施例】次に、本発明について図面を参照して説明す
る。
Next, the present invention will be described with reference to the drawings.

【0009】図1は本発明の一実施例におけるバーイン
ボード検査装置の概略を示す図である。このバーインボ
ード検査装置は、図1に示すように、ソケット4が複数
個並べ取付けられたバーインボードを載置し2次元方向
に移動するXYテーブル1と、ポールに固定されレーザ
光をバーインボードに照射しその反射光を受光面2aで
検知しソケット4の位置を認識するレーザ変位計2を備
えている。
FIG. 1 is a view schematically showing a burn-in board inspection apparatus according to one embodiment of the present invention. As shown in FIG. 1, this burn-in board inspection apparatus mounts a burn-in board on which a plurality of sockets 4 are arranged and mounted, and moves in an two-dimensional direction to an XY table 1; There is provided a laser displacement meter 2 for detecting the position of the socket 4 by detecting the reflected light on the light receiving surface 2a.

【0010】図2(a)及び(b)は図1のレーザ変位
計の動作を説明するための図である。次に、ソケットの
位置を認識するレーザ変位計について説明する。このレ
ーザ変位計2は、発光面と受光面がバーインボード6に
対して傾斜しており、図2(a)に示すように、高さの
異なる被測定物7あるいは8に対して90度の角度でレ
ーザ光5を照射すると、このレーザ光5のレーザ反射光
6は約11度傾いた角度で受光面2aで受光するように
なっている。このため、被測定物7と8の高さの違いが
受光ポイントの違いとして測定することが出来る。従っ
て、本発明は、この原理を応用してソケットの位置を認
識することが出来る見通しを得た。
FIGS. 2A and 2B are diagrams for explaining the operation of the laser displacement meter of FIG. Next, a laser displacement meter that recognizes the position of the socket will be described. In this laser displacement meter 2, the light emitting surface and the light receiving surface are inclined with respect to the burn-in board 6, and as shown in FIG. When the laser light 5 is irradiated at an angle, the laser reflected light 6 of the laser light 5 is received by the light receiving surface 2a at an angle inclined by about 11 degrees. Therefore, the difference between the heights of the objects 7 and 8 can be measured as the difference between the light receiving points. Therefore, the present invention has obtained the prospect that the position of the socket can be recognized by applying this principle.

【0011】このように位置認識出来るレーザ変位計2
を用いて、図2(b)に示すように、前述の移動量測定
機能をもつXYテーブル1に載置されたバーインボード
3にレーザ光を照射し、XYテーブルの矢印方向の移動
に伴ないソケット4からの反射光をレーザ変位計2の受
光面2aが受光しソケット4の位置を検知し、検知した
位置とその位置と基準位置からの移動量をカウントすれ
ば自動的にソケット4の位置が測定出来る。
The laser displacement meter 2 capable of recognizing the position as described above
As shown in FIG. 2B, the burn-in board 3 placed on the XY table 1 having the above-described movement amount measuring function is irradiated with laser light, and the XY table is moved in the arrow direction. The light receiving surface 2a of the laser displacement meter 2 receives the reflected light from the socket 4, detects the position of the socket 4, and counts the detected position, its position, and the amount of movement from the reference position. Can be measured.

【0012】図3(a)〜(e)は移動方向によるレー
ザ変位計の出力波形の挙動を示す図である。ここで、レ
ーザ変位計の向きと移動方向について説明する。もし、
レーザ変位計のレーザ反射光を受ける受光面2aの傾き
方向のバーインボードの移動方向が逆の方向、すなわ
ち、図3(e)に示すような場合は、正確にソケット4
の端を検知できない。
FIGS. 3A to 3E are diagrams showing the behavior of the output waveform of the laser displacement meter according to the moving direction. Here, the direction and the moving direction of the laser displacement meter will be described. if,
In the case where the direction of movement of the burn-in board in the direction of inclination of the light receiving surface 2a receiving the laser reflected light of the laser displacement meter is opposite, that is, as shown in FIG.
Edge cannot be detected.

【0013】何となれば、ソケットの端付近をレーザ光
が通過した場合、レーザ光がバーインボードとソケット
の両方を検知し、測定値が平均化され、レーザ変位計の
出力電圧レベルが、図3(a)に示すように、曲線を描
くようになる。また、バーインボードの光沢が変化する
場合、図3(b)に示すように、電圧レベルが光沢の具
合で異なる。さらに、バーインボード上の半田付跡等の
反射率がソケットに比べて著しく異なる物体をレーザ光
で走査しととき、図3(c)に示すように、急峻な波形
を生じ誤測定を招くことになる。また、バーインボード
自身にも光沢が場所によっつも異なり、いずれにして
も、図3(d)のように不安定な波形しか得られない。
In the case where the laser beam passes near the end of the socket, the laser beam detects both the burn-in board and the socket, the measured values are averaged, and the output voltage level of the laser displacement meter is changed as shown in FIG. A curve is drawn as shown in FIG. When the gloss of the burn-in board changes, the voltage level differs depending on the degree of the gloss, as shown in FIG. Further, when an object such as a trace of soldering on the burn-in board, whose reflectance is significantly different from that of the socket, is scanned with a laser beam, a steep waveform is generated as shown in FIG. become. Further, the gloss of the burn-in board itself also differs depending on the location, and in any case, only an unstable waveform as shown in FIG. 3D can be obtained.

【0014】この問題を解消するために、移動方向とレ
ーザ変位計2の受光面2aを図2(b)に示すようにす
ると、レーザ反射光6がソケット4に遮断され、バーイ
ンボードからの反射光は受光することが無くなる。そし
て移動に伴ないソケット4にレーザ光がかかると、レー
ザ変位計2はソケットの高さに応じた電圧レベルを発生
する。さらに移動してもソケット4の上面から反射する
光のみ受光し、バーインボードからの反射光を受光する
ことがない。すなわち、ソケットの高さからこのレーザ
変位計の受光面2aの傾斜度を決定される。
In order to solve this problem, if the moving direction and the light receiving surface 2a of the laser displacement meter 2 are set as shown in FIG. 2B, the laser reflected light 6 is blocked by the socket 4 and reflected from the burn-in board. Light will not be received. When a laser beam is applied to the socket 4 as it moves, the laser displacement meter 2 generates a voltage level corresponding to the height of the socket. Even if it moves further, it receives only the light reflected from the upper surface of the socket 4 and does not receive the reflected light from the burn-in board. That is, the inclination of the light receiving surface 2a of the laser displacement meter is determined from the height of the socket.

【0015】次に、このバーインボード検査装置の動作
を説明する。まず、バーインボード3の基準点にレーザ
変位計2を位置決めし、そのときの座標を読み取る。次
に、図1の移動方向に直角に所定の距離だけバーインボ
ード3を移動させる。次に、XYテーブル1を矢印の方
向に移動し、レーザ変位計2で走査する。このとき、ソ
ケット4の端部から反射するレーザ反射光の受光による
パルス状の電圧波形の間隔から移動距離を求める。そし
て予じめ記憶しておいた基準の移動距離と比較し、良否
の判定をする。また、この矢印で示す移動方向と直角方
向の位置を検査する場合は、レーザ変位計の向きを90
度変えてから、同様の操作で検査する。
Next, the operation of the burn-in board inspection apparatus will be described. First, the laser displacement meter 2 is positioned at the reference point of the burn-in board 3, and the coordinates at that time are read. Next, the burn-in board 3 is moved by a predetermined distance at right angles to the moving direction in FIG. Next, the XY table 1 is moved in the direction of the arrow and scanned by the laser displacement meter 2. At this time, the moving distance is obtained from the interval of the pulse-like voltage waveform due to the reception of the laser reflected light reflected from the end of the socket 4. Then, it is compared with the reference moving distance stored in advance to determine the quality. When inspecting the position in the direction perpendicular to the moving direction indicated by the arrow, the direction of the laser displacement meter should be 90 degrees.
After changing the temperature, the inspection is performed in the same manner.

【0016】この実施例では、レーザ変位計を固定し、
バーインボードを二次元的に移動し、レーザ光を走査し
てソケットの位置を認識していたが、逆に、バーインボ
ードを固定し、レーザ変位計を二次元的に移動させ、レ
ーザ光を走査させても良く、むしろ、この方法の方が装
置として小型になるという利点がある。
In this embodiment, the laser displacement meter is fixed,
The burn-in board was moved two-dimensionally and the laser light was scanned to recognize the position of the socket.On the contrary, the burn-in board was fixed, the laser displacement meter was moved two-dimensionally, and the laser light was scanned. Alternatively, this method has the advantage that the apparatus becomes smaller.

【0017】[0017]

【発明の効果】以上説明したように本発明は、複数のソ
ケットを並べて配置されたバーインボードを装置するテ
ーブルと、バーインボードにレーザ光を照射し反射光を
受光する受光面が所定の傾斜度をもつレーザ変位計を備
え、このバーインボードとレーザ変位計とを相対的に二
次元的に移動させ、レーザ光をバーインボードに走査さ
せ、ソケットからの反射光のみを受光し、この反射光か
ら得られるパルス出力郡の間隔をカウントしてソケット
の位置を求めることによって、人為的な誤差を含むこと
無く、自動的にソケットの位置を定量的に求められ、良
否の判定も出来るという効果がある。
As described above, according to the present invention, a table for installing a burn-in board in which a plurality of sockets are arranged and a light receiving surface for irradiating the burn-in board with laser light and receiving reflected light have a predetermined inclination. The burn-in board and the laser displacement meter are relatively two-dimensionally moved, the laser light is scanned on the burn-in board, and only the reflected light from the socket is received. By counting the intervals between the obtained pulse output groups and determining the socket position, the socket position can be automatically and quantitatively determined without any artificial error, and the pass / fail judgment can be made. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例におけるバーインボード検査
装置の概略を示す図である。
FIG. 1 is a view schematically showing a burn-in board inspection apparatus according to an embodiment of the present invention.

【図2】図1のレーザ変位計の動作を説明するための図
である。
FIG. 2 is a diagram for explaining the operation of the laser displacement meter of FIG.

【図3】移動方向によるレーザ変位計の出力波形の挙動
を示す図である。
FIG. 3 is a diagram illustrating behavior of an output waveform of a laser displacement meter according to a moving direction.

【符号の説明】[Explanation of symbols]

1 XYテーブル 2 レーザ変位計 2a 受光面 3 バーインボード 4 ソケット 5 レーザ光 6 レーザ反射光 7,8 被測定物 DESCRIPTION OF SYMBOLS 1 XY table 2 Laser displacement meter 2a Light-receiving surface 3 Burn-in board 4 Socket 5 Laser light 6 Laser reflected light 7,8 DUT

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) G01B 11/00 - 11/30 102 H05K 13/08 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 7 , DB name) G01B 11/00-11/30 102 H05K 13/08

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 複数のソケット並べて配置されたバー
インボードを載置するテーブルと、このバーインボード
の面に対し所定の角度に傾むく傾斜面からレーザ光を前
記バーインボードの面に照射し該面からの反射光を前記
傾斜面に受光するレーザ変位計とを備え、前記傾斜面を
背面側にし前記ソケットの並ぶ方向に前記レーザ変位計
と前記バーインボードとを相対的に移動させ、前記ソケ
ット上面からの反射光を受光し前記ソケットの位置を認
識し基準値と比較し前記ソケットの間隔の良否を判定す
ることを特徴とするバーインボード検査装置。
1. A table on which a burn-in board on which a plurality of sockets are arranged is placed, and the burn-in board is mounted on the table.
Laser light from an inclined surface that is inclined at a predetermined angle to the surface
Irradiating the surface of the burn-in board and reflecting light from the surface
A laser displacement meter that receives light on the inclined surface,
The laser displacement meter in the direction in which the sockets are lined up on the back side
And the burn-in board are relatively moved, and
A burn-in board inspection apparatus, comprising: receiving reflected light from the upper surface of a socket, recognizing a position of the socket, and comparing it with a reference value to determine whether the interval between the sockets is good or not.
JP5030040A 1993-02-19 1993-02-19 Burn-in board inspection equipment Expired - Fee Related JP3001339B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5030040A JP3001339B2 (en) 1993-02-19 1993-02-19 Burn-in board inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5030040A JP3001339B2 (en) 1993-02-19 1993-02-19 Burn-in board inspection equipment

Publications (2)

Publication Number Publication Date
JPH06241734A JPH06241734A (en) 1994-09-02
JP3001339B2 true JP3001339B2 (en) 2000-01-24

Family

ID=12292716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5030040A Expired - Fee Related JP3001339B2 (en) 1993-02-19 1993-02-19 Burn-in board inspection equipment

Country Status (1)

Country Link
JP (1) JP3001339B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4568405B2 (en) * 2000-06-02 2010-10-27 エスエス製薬株式会社 Method for measuring the length of punches for tableting

Also Published As

Publication number Publication date
JPH06241734A (en) 1994-09-02

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