JP3067213B2 - Vapor phase soldering equipment - Google Patents
Vapor phase soldering equipmentInfo
- Publication number
- JP3067213B2 JP3067213B2 JP3002207A JP220791A JP3067213B2 JP 3067213 B2 JP3067213 B2 JP 3067213B2 JP 3002207 A JP3002207 A JP 3002207A JP 220791 A JP220791 A JP 220791A JP 3067213 B2 JP3067213 B2 JP 3067213B2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- liquid
- vapor phase
- inert liquid
- inert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012808 vapor phase Substances 0.000 title claims description 27
- 238000005476 soldering Methods 0.000 title claims description 13
- 239000007788 liquid Substances 0.000 claims description 112
- 229920006395 saturated elastomer Polymers 0.000 claims description 19
- 238000001914 filtration Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000012442 inert solvent Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【0001】〔発明の目的〕[Object of the invention]
【0002】[0002]
【産業上の利用分野】本発明は、飽和蒸気相の気化潜熱
を利用してはんだ付けを行う気相式はんだ付け装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor phase soldering apparatus for performing soldering utilizing latent heat of vaporization of a saturated vapor phase.
【0003】[0003]
【従来の技術】特開平1−271071号公報に示され
るように、蒸気槽の下部に設けられた液槽部の不活性液
を加熱することにより蒸気槽内に飽和蒸気相を形成し、
この飽和蒸気相の内部を通過するワ―クを飽和蒸気相の
気化潜熱によりリフロ―はんだ付けするとともに、前記
液槽部の不活性液をフィルタリング回路により循環しな
がら濾過する気相式はんだ付け装置がある。2. Description of the Related Art As shown in Japanese Patent Application Laid-Open No. 1-271071, a saturated vapor phase is formed in a steam tank by heating an inert liquid in a liquid tank provided below the steam tank.
A vapor phase soldering apparatus for reflow soldering the work passing through the inside of the saturated vapor phase by the latent heat of vaporization of the saturated vapor phase and filtering the inert liquid in the liquid tank while circulating it through a filtering circuit. There is.
【0004】[0004]
【発明が解決しようとする課題】蒸気槽での不活性液の
消費が進み、この蒸気槽の液槽部に減少分の不活性液を
補給するときは、新しい不活性液を蒸気槽の液槽部に直
接補給する場合より、フィルタリング回路を経て補給す
ることが、液槽部での不活性液の温度降下を防止する上
で好ましい。When the consumption of the inert liquid in the steam tank progresses and a reduced amount of the inert liquid is supplied to the liquid tank section of the steam tank, a new inert liquid is supplied to the liquid in the steam tank. It is more preferable that the replenishment is performed through a filtering circuit than in the case where the replenishment is performed directly to the tank, in order to prevent a temperature drop of the inert liquid in the liquid tank.
【0005】しかし、フィルタリング回路中の不活性液
も温度降下しているので、減少分の不活性液を迅速に
(多量に)液槽部へ戻す場合は、この多量の戻し液によ
り液槽部での不活性液温度も低下して、飽和蒸気相のレ
ベルが一時的に降下する問題がある。However, since the temperature of the inert liquid in the filtering circuit also drops, if the reduced amount of the inert liquid is quickly (largely) returned to the liquid tank, the large amount of the returning liquid causes the liquid tank to return. There is a problem that the temperature of the inert liquid at the time is also lowered, and the level of the saturated vapor phase temporarily drops.
【0006】本発明は、このような点に鑑みなされたも
ので、気相式はんだ付け装置の飽和蒸気相のレベルに影
響を与えることなく、減少分の不活性液を迅速に補給で
きるようにすることを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has been made in view of the above circumstances. Accordingly, it is possible to quickly supply a reduced amount of an inert liquid without affecting the level of a saturated vapor phase of a vapor phase soldering apparatus. The purpose is to do.
【0007】〔発明の構成〕[Configuration of the Invention]
【0008】[0008]
【課題を解決するための手段】本発明は、蒸気槽21の
下部に設けられた液槽部21a の不活性液22を加熱するこ
とにより蒸気槽21内に飽和蒸気相24を形成し、この飽和
蒸気相24の内部を通過するワ―ク25を飽和蒸気相24の気
化潜熱によりリフロ―はんだ付けするとともに、前記液
槽部21a の不活性液22をフィルタリング回路Fにより循
環しながら濾過する気相式はんだ付け装置において、フ
ィルタリング回路Fから液槽部21a への不活性液戻し管
路74中に加熱槽72を設けた気相式はんだ付け装置であ
る。According to the present invention, a saturated vapor phase 24 is formed in a steam tank 21 by heating an inert liquid 22 in a liquid tank section 21a provided at a lower portion of the steam tank 21. The work 25 passing through the inside of the saturated vapor phase 24 is reflow-soldered by the latent heat of vaporization of the saturated vapor phase 24, and the inert gas 22 in the liquid tank portion 21a is filtered while being circulated by the filtering circuit F. In the phase soldering apparatus, a heating tank 72 is provided in an inert liquid return pipe 74 from the filtering circuit F to the liquid tank section 21a.
【0009】[0009]
【作用】本発明は、蒸気槽21での不活性液22の消費が進
み、その液槽部21a に減少分の不活性液を迅速に補給す
る必要があるときは、不活性液を加熱槽72で加熱してか
ら液槽部21a に循環することにより、前記減少分の不活
性液を迅速に(多量に)液槽部21a に補給しても、この
液槽部21a 内の不活性液22の温度が低下しない。According to the present invention, when the consumption of the inert liquid 22 in the steam tank 21 progresses and it is necessary to quickly supply the reduced amount of the inert liquid to the liquid tank section 21a, the inert liquid is heated in the heating tank. By heating in 72 and circulating to the liquid tank 21a, even if the reduced amount of the inert liquid is quickly (largely) supplied to the liquid tank 21a, the inert liquid in the liquid tank 21a can be supplied. Temperature of 22 does not decrease.
【0010】[0010]
【実施例】以下、本発明を図1に示される実施例を参照
して詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to an embodiment shown in FIG.
【0011】気相式はんだ付け装置の本体部分では、蒸
気槽21の液槽部21a に収納された不活性液(フッ素系不
活性溶剤)22がヒ―タ23により加熱されて蒸発され、蒸
気槽21内に飽和蒸気相24が形成されている。In the main body of the vapor-phase soldering apparatus, an inert liquid (fluorine-based inert solvent) 22 contained in a liquid tank portion 21a of a steam tank 21 is heated by a heater 23 and evaporated to form a vapor. A saturated vapor phase 24 is formed in the tank 21.
【0012】この飽和蒸気相24の内部を通過するワ―ク
25に飽和蒸気相24の気化潜熱が与えられ、リフロ―はん
だ付けがなされる。The work passing through the inside of the saturated vapor phase 24
The vaporized latent heat of the saturated vapor phase 24 is given to 25, and reflow soldering is performed.
【0013】蒸気槽21のワ―ク搬入側およびワ―ク搬出
側には冷却コイル26が配置され、冷却水配管27が設けら
れ、そして、冷却コイル26の凝縮作用によって蒸気槽21
内から外部への蒸気漏出が防止されている。A cooling coil 26 is provided on a work carry-in side and a work carry-out side of the steam tank 21, a cooling water pipe 27 is provided, and the steam tank 21 is condensed by the cooling coil 26.
Steam leakage from inside to outside is prevented.
【0014】さらに、この蒸気槽21のワ―ク搬入部分お
よびワ―ク搬出部分は排気配管28を経て液回収ユニット
29に連通され、そして、ブロワBによりこの液回収ユニ
ット29の内部に強制的に吸込まれたベーパまたはミスト
(ベーパ粒子が成長したもの)は、内部の衝突板や冷却
コイル等により液化され、管30を経て蒸気槽21に回収さ
れる。Further, a work carry-in portion and a work carry-out portion of the steam tank 21 are connected to a liquid recovery unit via an exhaust pipe 28.
The vapor or mist (growth of vapor particles) which is communicated with the liquid recovery unit 29 by the blower B and is forcibly sucked by the blower B is liquefied by an internal collision plate, a cooling coil, and the like, and After passing through 30, it is collected in the steam tank 21.
【0015】前記蒸気槽21の液槽部21a にはフィルタリ
ング回路Fが接続されている。このフィルタリング回路
Fについて説明する。A filtering circuit F is connected to the liquid tank portion 21a of the steam tank 21. The filtering circuit F will be described.
【0016】前記蒸気槽21の底部から不活性液取出管路
31が引出され、この取出管路31にY形ストレ―ナ32、液
排出用電動弁33および安全用電動弁34を経て液温降下槽
35の上部が接続されている。An inert liquid outlet pipe from the bottom of the steam tank 21
A liquid temperature lowering tank 31 passes through a Y-strainer 32, a liquid discharge electric valve 33, and a safety electric valve 34.
The top of 35 is connected.
【0017】この液温降下槽35の内部には冷却コイル36
が配管され、モ―タにより回転される撹拌翼37が設けら
れている。前記電動弁33にはバイパス管路38が設けら
れ、この管路38に手動調整弁39が設けられている。A cooling coil 36 is provided inside the liquid temperature drop tank 35.
Are provided, and a stirring blade 37 rotated by a motor is provided. The motor-operated valve 33 is provided with a bypass pipe 38, and the pipe 38 is provided with a manual adjustment valve 39.
【0018】前記液温降下槽35の下部から引出された管
路41には、ドレン管42を介してドレン閉止弁43が設けら
れ、さらに停止用電動弁44が設けられ、そして耐熱ポン
プ45が設けられている。A pipe 41 drawn out from the lower part of the liquid temperature drop tank 35 is provided with a drain shut-off valve 43 through a drain pipe 42, an electric stop valve 44, and a heat-resistant pump 45. Is provided.
【0019】この管路41から、不活性液戻し管路46とフ
ィルタリング管路47とが分岐され、その各管路46,47に
は電磁弁48,49が設けられている。An inert liquid return pipe 46 and a filtering pipe 47 are branched from the pipe 41, and the pipes 46, 47 are provided with solenoid valves 48, 49, respectively.
【0020】前記戻し管路46は、前記蒸気槽21の液槽部
21a に接続され、また、前記フィルタリング管路47は、
カ―トリッジフィルタ51,52を経て液温降下槽35の上部
に接続されている。前記液温降下槽35の上部には不活性
液補給槽53がバルブ54を介して接続されている。The return pipe 46 is a liquid tank part of the steam tank 21.
21a, and the filtering line 47 is
It is connected to the upper part of the liquid temperature drop tank 35 through the cartridge filters 51 and 52. An inert liquid replenishing tank 53 is connected to the upper part of the liquid temperature lowering tank 35 via a valve 54.
【0021】液温降下槽35の内部には蒸気槽21の液槽部
21a に収容されている不活性液22と同一の不活性液(フ
ッ素系不活性溶剤)22a がほぼ等量、予め収容され、冷
却コイル36によりフィルタ51,52の耐熱性が保たれる温
度まで冷却され、前記撹拌翼37によってその温度が均一
化されている。The liquid tank of the steam tank 21 is provided inside the liquid temperature drop tank 35.
An inert liquid (fluorinated inert solvent) 22a, which is the same as the inert liquid 22 contained in the liquid 21a, is preliminarily stored in an equal amount, and is cooled to a temperature at which the heat resistance of the filters 51 and 52 is maintained by the cooling coil 36. It is cooled and its temperature is made uniform by the stirring blade 37.
【0022】前記液槽部21a から引出された不活性液取
出管路31および液温降下槽35にはそれぞれ液位検知装置
61,62が管63を介して接続されている。A liquid level detecting device is provided in the inert liquid extracting pipe 31 and the liquid temperature lowering tank 35 drawn out from the liquid tank section 21a.
61 and 62 are connected via a tube 63.
【0023】この液位検知装置61,62は、それぞれ液槽
部21aおよび液温降下槽35との間で連通管として働く耐
熱ガラスの透明パイプ64を有し、この透明パイプ64を挟
んで対向設置された投光器と受光器とにより前記不活性
液22,22a の有無を検知してその液位を検出する多段の
フォトセンサ65を有している。The liquid level detectors 61 and 62 have a heat-resistant glass transparent pipe 64 serving as a communication pipe between the liquid tank section 21a and the liquid temperature drop tank 35, respectively. A multi-stage photosensor 65 is provided to detect the presence or absence of the inert liquids 22 and 22a by the installed light emitter and light receiver to detect the liquid level.
【0024】前記管路41は、前記管路46との分岐部から
電磁弁71を経て加熱槽72の上部に接続されている。この
加熱槽72は、前記液槽部21a に循環される不活性液22b
を加熱するためのヒータ73を備えており、不活性液戻し
管路74を経て蒸気槽21に接続されている。The pipe 41 is connected to the upper part of the heating tank 72 via a solenoid valve 71 from a branch point with the pipe 46. The heating tank 72 contains an inert liquid 22b circulated through the liquid tank section 21a.
Is provided, and is connected to the steam tank 21 via an inert liquid return line 74.
【0025】次に、この実施例の作用を説明する。Next, the operation of this embodiment will be described.
【0026】運転中は、原則として弁33,34,44,48,
49を開くとともに、弁39,43,54,71を閉じる。During operation, the valves 33, 34, 44, 48,
Open 49 and close valves 39, 43, 54, 71.
【0027】この運転中、蒸気槽21内の高温の不活性液
22が、少しずつ液温降下槽35に取出され、この槽内で90
℃以下に温度降下される。During this operation, the high temperature inert liquid in the steam tank 21
22 is taken out little by little into the liquid temperature drop tank 35, where 90
The temperature is lowered below ℃.
【0028】この低温の不活性液22a の一部は、ポンプ
45によって前記フィルタリング管路47に圧送され、この
フィルタリング管路47中に設けられたカ―トリッジ式フ
ィルタ51,52により濾過されて液温降下槽35に循環され
る。A part of the low-temperature inert liquid 22a is supplied to a pump
The pressure is fed to the filtering line 47 by 45, filtered by the cartridge type filters 51 and 52 provided in the filtering line 47, and circulated to the liquid temperature lowering tank 35.
【0029】したがって、この液温降下槽35の内部の不
活性液22a は、常に低温に保たれるとともに清浄に保た
れる。Therefore, the inert liquid 22a inside the liquid temperature lowering tank 35 is always kept at a low temperature and kept clean.
【0030】同時に、この液温降下槽35内の不活性液22
a が前記ポンプ45により不活性液戻し管路46を経て、前
記蒸気槽21からの取出流量と等しい流量で蒸気槽21に循
環される。At the same time, the inert liquid 22
a is circulated to the steam tank 21 by the pump 45 via the inert liquid return pipe 46 at a flow rate equal to the removal flow rate from the steam tank 21.
【0031】このように、蒸気槽21の不活性液22が、少
しずつ取出されて液温降下槽35に入り、この槽内の清浄
な低温不活性液22a と混ざることで汚染度が緩和され
る。As described above, the inert liquid 22 in the steam tank 21 is taken out little by little and enters the liquid temperature lowering tank 35, where it is mixed with the clean low-temperature inert liquid 22a in the tank to reduce the pollution degree. You.
【0032】蒸気槽21での不活性液の消費が進み、この
蒸気槽21に不活性液22を補給するときは、前記補給槽53
のバルブ54を開き、補給槽53から液温降下槽35に新しい
不活性液を供給し、そして、減少分の不活性液を蒸気槽
21に迅速に補給する。When the consumption of the inert liquid in the steam tank 21 progresses and the inert liquid 22 is supplied to the steam tank 21, the supply tank 53 is used.
Open the valve 54, supply the new inert liquid from the replenishing tank 53 to the liquid temperature drop tank 35,
Refill 21 quickly.
【0033】この場合、液槽部21a への不活性液の迅速
補給により液槽部21a の不活性液22の温度が低下する
と、飽和蒸気相24のレベルも下がるので、それを防ぐた
めに、減少分の不活性液を迅速補給するときは、電磁弁
71を開くとともに電磁弁48を閉じ、不活性液戻し管路
を、不活性液戻し管路46から加熱槽72および不活性液戻
し管路74に切換える。In this case, when the temperature of the inert liquid 22 in the liquid tank section 21a decreases due to the quick supply of the inert liquid to the liquid tank section 21a, the level of the saturated vapor phase 24 also decreases. Solenoid valve when quickly replenishing
71 is opened and the electromagnetic valve 48 is closed, and the inert liquid return line is switched from the inert liquid return line 46 to the heating tank 72 and the inert liquid return line 74.
【0034】電磁弁71から加熱槽72に供給された不活性
液22bは、加熱槽72内でヒータ73により加熱されてか
ら、不活性液戻し管路74により蒸気槽21を経て液槽部21
a に循環されるから、前記減少分の不活性液を迅速に
(多量に)液槽部21a に補給しても、この液槽部21a 内
の不活性液22の温度が低下しない。これにより、飽和蒸
気相24のレベルも低下しない。The inert liquid 22b supplied from the solenoid valve 71 to the heating tank 72 is heated by the heater 73 in the heating tank 72 and then passed through the vapor tank 21 through the inert liquid return pipe 74 to the liquid tank section 21.
Therefore, even if the reduced amount of the inert liquid is quickly (largely) supplied to the liquid tank section 21a, the temperature of the inert liquid 22 in the liquid tank section 21a does not decrease. As a result, the level of the saturated vapor phase 24 does not decrease.
【0035】[0035]
【発明の効果】本発明によれば、フィルタリング回路か
ら蒸気槽の液槽部への不活性液戻し管路中に加熱槽を設
けたから、この加熱槽により不活性液を加熱して減少分
の不活性液を迅速に(多量に)液槽部に補給でき、液槽
部での不活性液の減少に迅速に対応できるとともに、こ
の液槽部内の不活性液の温度低下を防止でき、飽和蒸気
相のレベル低下を防止できる。According to the present invention, since the heating tank is provided in the inert liquid return line from the filtering circuit to the liquid tank section of the steam tank, the heating tank heats the inert liquid to reduce the amount of reduction. Inert liquid can be quickly (largely) replenished to the liquid tank, and the inert liquid can be reduced quickly in the liquid tank. In addition, the temperature of the inert liquid in the liquid tank can be prevented from lowering, and the liquid can be saturated. The level of the vapor phase can be prevented from lowering.
【図1】本発明の一実施例を示す気相式はんだ付け装置
の回路図である。FIG. 1 is a circuit diagram of a vapor phase soldering apparatus showing one embodiment of the present invention.
21 蒸気槽 21a 液槽部 22 不活性液 24 飽和蒸気相 25 ワ―ク 72 加熱槽 74 不活性液戻し管路 F フィルタリング回路 21 Steam tank 21a Liquid tank section 22 Inert liquid 24 Saturated vapor phase 25 Work 72 Heating tank 74 Inert liquid return line F Filtering circuit
フロントページの続き (56)参考文献 特開 平2−15873(JP,A) 特開 平1−271071(JP,A) 特開 昭64−44273(JP,A) 特開 昭63−123565(JP,A) 特開 昭63−90361(JP,A) 特開 平1−197060(JP,A) 特開 平1−104468(JP,A) (58)調査した分野(Int.Cl.7,DB名) B23K 1/015 H05K 3/34 507 Continuation of front page (56) References JP-A-2-15873 (JP, A) JP-A-1-271071 (JP, A) JP-A-64-44273 (JP, A) JP-A-63-123565 (JP) JP-A-63-90361 (JP, A) JP-A-1-197060 (JP, A) JP-A-1-104468 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB Name) B23K 1/015 H05K 3/34 507
Claims (1)
性液を加熱することにより蒸気槽内に飽和蒸気相を形成
し、この飽和蒸気相の内部を通過するワ―クを飽和蒸気
相の気化潜熱によりリフロ―はんだ付けするとともに、
前記液槽部の不活性液をフィルタリング回路により循環
しながら濾過する気相式はんだ付け装置において、フィ
ルタリング回路から液槽部への不活性液戻し管路中に加
熱槽を設けたことを特徴とする気相式はんだ付け装置。1. A saturated vapor phase is formed in a steam tank by heating an inert liquid in a liquid tank provided at a lower portion of the steam tank, and a work passing through the inside of the saturated vapor phase is saturated. Reflow soldering by the latent heat of vaporization of the vapor phase,
In a vapor phase soldering apparatus for filtering the inert liquid in the liquid tank portion while circulating the same through a filtering circuit, a heating tank is provided in an inert liquid return line from the filtering circuit to the liquid tank portion. Vapor-phase soldering equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002207A JP3067213B2 (en) | 1991-01-11 | 1991-01-11 | Vapor phase soldering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3002207A JP3067213B2 (en) | 1991-01-11 | 1991-01-11 | Vapor phase soldering equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04270065A JPH04270065A (en) | 1992-09-25 |
| JP3067213B2 true JP3067213B2 (en) | 2000-07-17 |
Family
ID=11522908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3002207A Expired - Lifetime JP3067213B2 (en) | 1991-01-11 | 1991-01-11 | Vapor phase soldering equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3067213B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019212161A1 (en) * | 2019-08-14 | 2021-02-18 | Rehm Thermal Systems Gmbh | REFLOW CONDENSATION SOLDERING SYSTEM |
-
1991
- 1991-01-11 JP JP3002207A patent/JP3067213B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04270065A (en) | 1992-09-25 |
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