JP2961094B2 - Heat-dissipating molded plate covering the semiconductor substrate on which the integrated circuit chip is mounted - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a heat sink, a reinforcing plate, a drawn product for reinforcing heat dissipation, or a resin sheet around which an adhesive is applied by screen printing, intaglio printing or letterpress printing. The present invention relates to a heat-dissipating molded plate that covers a semiconductor substrate on which an integrated circuit chip using a molded product prepared by the above method is mounted.

[0002]

2. Description of the Related Art Conventionally, after a protective film coated with an adhesive is attached to a metal plate material, it is press-formed into a predetermined shape such as a heat radiating plate, a reinforcing plate, or the like. Peeled off and used.

That is, when these are manufactured by a conventional method, a protective film coated with an adhesive is applied to a metal plate material and then pressed to form a radiating plate 1 as shown in FIG. Then, a heat radiating plate member composed of the adhesive 3 and the protective film 4 and a reinforcing plate member composed of the reinforcing plate 2, the adhesive 3 and the protective film 4 are produced. Next, when these two members are laminated and bonded on the semiconductor substrate 6 on which the integrated circuit chip 5 is mounted, the protective film is peeled off from these members and bonded, as shown in FIG. A semiconductor component having a simple sectional view is manufactured.

[0004] Further, when manufacturing by a conventional method, a protective film coated with an adhesive is attached to a metal plate material and then press-formed to form a heat dissipation reinforcing plate as shown in FIG. A heat radiation reinforcing plate member made of a drawn product 7, an adhesive 3, and a protective film 4 is produced. Next, when this member is bonded onto the semiconductor substrate 6 on which the integrated circuit chip 5 is mounted, a protective film is peeled off from this member and bonded to form a semiconductor having a cross-sectional view as shown in FIG. A part is produced.

[0005]

In the above conventional method, a protective film coated with an adhesive is attached to a metal plate material, and the metal plate material to which the protective film is attached is press-formed. Although a radiator plate, a reinforcing plate, or a drawn product for the radiator plate is manufactured, there is a problem that it is difficult to wash and remove metal powder generated during press forming. For this reason, there has been a problem that a short circuit in the circuit due to the metal powder and a flaw or the like caused by the short circuit are generated to cause a defective product.

Further, when a metal plate material is formed into a shape such as a heat sink or a reinforcing plate by press working and washed, and then a protective film coated with an adhesive is adhered thereto, it is necessary to remove metal powder. Although it is possible, it is difficult to form the protective film coated with an adhesive in the shape of the heat sink or the reinforcing plate, and to attach the protective film. Also, when assembling a semiconductor, it is difficult to peel off the protective film. There was a problem that work existed. Then, the present invention was invented to solve these problems.

[0007]

According to the present invention, a radiating plate, a reinforcing plate, or a drawn product for a radiating reinforcing plate, to which an adhesive has been applied by screen printing, intaglio printing, or letterpress printing, is manufactured by the following steps. You.

(1) A metal plate material is press-formed and processed into a shape of a heat sink, a reinforcing plate, or a drawn product for the heat sink. (2) The pressed radiator plate, reinforcing plate, or drawn product for the radiator plate is washed to remove metal powder, oil, and the like. (3) An adhesive is applied by a method such as screen printing, intaglio printing, or letterpress printing to the adhesive surface of the heat-radiating plate, the reinforcing plate, or the drawn product for the heat-radiating reinforcing plate.

Further, the insert molded product for a heat radiation reinforcing plate in which the heat radiation plate is surrounded by a molding resin according to the present invention is manufactured by the following steps.

(1) A metal plate material is pressed to be processed into a flat heat sink or a drawn product for the heat sink. (2) Press-formed flat heat radiating plate or drawn product for heat radiating plate is surrounded by resin and molded to be an insert molded product. (3) An adhesive is applied to the bonding surface of the insert molded product by a method such as screen printing, intaglio printing, or letterpress printing.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION As shown in FIG. 3, a heat radiating plate 1 and a reinforcing plate 2 are obtained by washing a metal plate material after press forming, as shown in FIG. The adhesive 3 is applied to the washed radiator plate and reinforcing plate by a method such as screen printing, intaglio printing, or letterpress printing. When the heat radiating plate and the reinforcing plate coated with the adhesive are used as an assembly member of a semiconductor component, the heat radiating plate and the reinforcing plate are laminated on the semiconductor substrate 6 on which the integrated circuit chip 5 is mounted and bonded. By coupling, the semiconductor component having the cross section shown in FIG. 3 is assembled.

Further, in the drawn product for a heat dissipation reinforcing plate of the present invention, as shown in FIG. 4, a metal plate material is press-formed and then washed to obtain a drawn product 7 for a heat dissipation reinforcing plate. The adhesive 3 is applied by a method such as screen printing, intaglio printing, or letterpress printing to the adhesive surface of the washed drawn product for the heat dissipation reinforcing plate. When the drawn product for the heat dissipation reinforcing plate to which the adhesive is applied is used as an assembly member of a semiconductor component, the drawn product for the heat dissipation reinforcing plate is overlaid on the semiconductor substrate 6 on which the integrated circuit chip 5 is mounted. The semiconductor components having the cross section shown in FIG. 4 are assembled by adhesive bonding.

Further, in the insert molded product for a heat radiation reinforcing plate of the present invention formed by surrounding a flat heat radiation plate or a drawn product for a heat radiation plate with a molding resin, as shown in FIG. Then, the metal plate material is washed after press forming to obtain a flat heat sink 8 or a drawn product 9 for the heat sink. An insert-molded product is obtained by surrounding the periphery of the cleaned heat sink 8 or drawn product 9 with the resin 10 and molding. The adhesive 3 is applied to the bonding surface by a method such as screen printing, intaglio printing, or letterpress printing. When the insert molded product to which the adhesive is applied is used as a member for assembling a semiconductor component, the insert molded product is overlaid on a semiconductor substrate 6 on which the integrated circuit chip 5 is mounted, and adhesively bonded.
A semiconductor component having the cross section shown in FIG. 5 is assembled.

The adhesive used in the present invention includes a thermoplastic or thermosetting resin adhesive, and the metal plate used as a heat radiating plate or a reinforcing plate is a copper plate, a copper alloy plate, or an aluminum plate. , A stainless steel plate, or a surface-treated plate thereof, and the molding resin includes polyphenylene sulfide or polyetherimide. Less than,
The present invention will be described more specifically based on examples.

[0015]

EXAMPLE 1 A copper alloy plate having a thickness of 0.3 mm was pressed to produce a heat radiating plate of 35 mm × 35 mm. The same copper alloy plate was punched and pressed to form a hole having a size corresponding to an integrated circuit chip at the center of the hole.
mm was produced. A thermoplastic resin adhesive (manufactured by Alpha Metal Co., Ltd., trade name: Stay Stick) was applied to one surface of the formed heat sink and reinforcing plate by a screen printing method, and then dried to form an adhesive layer. As shown in FIG. 3, the heat-dissipating plate and the reinforcing plate on which the adhesive was applied and dried were stacked on a semiconductor substrate, and heated and pressed to produce a semiconductor component bonded and bonded via the adhesive.

[0016]

Embodiment 2 A 0.3 mm thick Ni-plated copper alloy plate is pressed to form a 35 mm × 35 mm heat dissipation reinforcing plate having a central portion having a projection having a size corresponding to an integrated circuit chip. A drawn product was produced. A thermoplastic resin adhesive was applied by a screen printing method to the adhesive surface of the pressed product for a heat-radiating reinforcing plate, and then dried to form an adhesive layer. As shown in FIG. 4, the drawn product for the heat dissipation reinforcing plate on which the adhesive was applied and dried was overlaid on a semiconductor substrate and heated to produce a semiconductor component bonded and bonded via the adhesive. .

[0017]

Embodiment 3 A 0.25-mm-thick Ni-plated copper alloy plate is pressed to have a flat heat-dissipating plate of 33 mm × 33 mm or a convex portion having a size corresponding to an integrated circuit chip at the center thereof. A drawn product for a heat sink was produced. An insert molded product in which the flat heat radiating plate or a drawn product for the heat radiating plate having a convex portion having a size corresponding to an integrated circuit chip at the center thereof was surrounded by a molding resin was produced. A thermoplastic resin adhesive was applied to the adhesive surface by a screen printing method, and then dried to form an adhesive layer. As shown in FIG. 5, the insert molded product to which the adhesive was applied and dried was overlaid on a semiconductor substrate and heated to produce a semiconductor component bonded and bonded via the adhesive.

[0018]

Conventionally, when manufacturing a member using an adhesive, an adhesive is applied to a protective film, which is adhered to a metal plate material and then pressed to form a heat radiating plate or a reinforcing plate. When formed into a shape and combined, the protective film was peeled off and bonded. However, in such a conventional method, since the metal powder generated during the press working cannot be completely washed and removed, defective products caused by the metal powder frequently occur.

However, according to the present invention, the metal plate material is pressed into a shape such as a radiator plate or a reinforcing plate and then washed to completely remove the metal powder, and then an adhesive is applied thereto. The present invention is capable of performing an assembling work without causing a defective product accident due to the metal powder and without requiring complicated work such as peeling of a protective film before bonding in the conventional method. A unique and significant effect can be produced.

[Brief description of the drawings]

FIG. 1 is a view showing a process of assembling and manufacturing a semiconductor component using a heat sink and a reinforcing plate according to a conventional method.

FIG. 2 is a view showing a process of manufacturing a semiconductor component using a drawn product for a heat dissipation reinforcing plate according to a conventional method.

FIG. 3 is a view showing a process of assembling and manufacturing a semiconductor component using a heat sink and a reinforcing plate according to the present invention.

FIG. 4 is a view showing a process of manufacturing a semiconductor component using a drawn product for a heat dissipation reinforcing plate according to the present invention.

FIG. 5 is a view showing a process of assembling and manufacturing a semiconductor component using an insert molded product according to the present invention.

[Explanation of symbols]

1: heat radiating plate, 2: reinforcing plate, 3: adhesive, 4: protective film, 5: integrated circuit chip, 6: semiconductor substrate, 7: drawn product for heat radiating reinforcing plate, 8: flat heat radiating plate for insert ,
9: A drawn product for a heat sink for an insert, 10: Molded resin.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Matsuba required 93, Hirakawa Yokomichi, Joyo-shi, Kyoto, Japan Inside Yamaoka Works (72) Inventor Kazuo Kitao 93, Hirakawa Yokomichi, Jyoyo, Kyoto, Japan Inside Yamaoka Works (56) References JP-A-9-183853 (JP, A) JP-A-3-40461 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/36 H01L 23/46

Claims (3)

(57) [Claims] 1. A heat radiation molding plate covering a semiconductor substrate on which an integrated circuit chip is mounted, a heat radiation plate obtained by pressing a metal plate material, and a lower surface of a reinforcing plate having an opening for accommodating the integrated circuit chip. After the cleaning, the adhesive is applied by screen printing, intaglio printing or letterpress printing, respectively, and the heat sink and the reinforcing plate to which the adhesive is applied are placed on the semiconductor substrate in the order of the reinforcing plate and the heat sink. The heat-dissipating molded plate, which is adhered to the substrate. 2. A drawn product for heat dissipation reinforcement, comprising a convex portion for accommodating an integrated circuit chip, obtained by pressing a metal plate material in a heat dissipation molded plate covering a semiconductor substrate on which an integrated circuit chip is mounted. The lower surface of the substrate is formed by applying an adhesive after washing by screen printing, intaglio printing or letterpress printing, and the heat dissipation is performed by bonding a squeezed product for heat dissipation reinforcement to which the adhesive has been applied onto a semiconductor substrate. Molding plate. 3. A heat dissipation molding plate covering a semiconductor substrate on which an integrated circuit chip is mounted, wherein a heat dissipation plate obtained by pressing a metal plate material or a heat dissipation reinforcing plate formed by surrounding the drawn product with a resin. The lower surface of the resin portion is made of an adhesive coated by screen printing, intaglio printing or letterpress printing after cleaning, and the heat dissipation reinforcing plate coated with the adhesive is bonded to the semiconductor substrate. Molding plate.