JP2818551B2 - Semiconductor wafer marking equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for marking a semiconductor wafer.

[0002]

2. Description of the Related Art After a large number of semiconductor elements having a predetermined circuit function are formed on a semiconductor wafer, an electrical characteristic test for determining whether or not a desired circuit is formed is performed at the final stage of the wafer manufacturing process. This is performed by bringing the prober probes into contact with the electrodes on the semiconductor elements of the wafer.

In this test, the semiconductor device is determined to be good or defective for each semiconductor element, and the defective product is marked on the surface of the semiconductor device and discarded. Without being performed, the process is shifted to a separation process and an assembly process for each semiconductor element, thereby completing a semiconductor device.

Here, as a device for marking the surface of a defective semiconductor element, there are a laser marker, a scratch type marker, an ink type marker, and the like. It is necessary to make a mark so that the image processing device on the surface of the semiconductor element can be reliably identified.

For example, if a mark indicating a defective product cannot be identified, a semiconductor device is manufactured by assembling a defective semiconductor element as a non-defective product, resulting in waste in the manufacturing process, raw materials, and the like. .

[0006] Such an indistinguishable accident often occurs when the surface area of the mark is smaller than the surface area of the semiconductor element. This is because in the image processing apparatus, if the mark relatively detected is small, the mark cannot be identified.

On the other hand, if the surface area of the mark is too large, the image processing apparatus can identify the mark. However, when a semiconductor element having a small surface area flows, the mark is formed even on the surface of an adjacent semiconductor element. In addition to this, when a laser marker or the like is used, there is a drawback in that much dust is generated.

In particular, when the surface area of a semiconductor element is variable due to various uses, it is an essential function to automatically change the surface area of the mark in accordance with the variable.

[0009] Under the circumstances described above, automatically forming a mark having a ratio within a predetermined range with respect to the surface area of a semiconductor element has become a very important issue in a manufacturing process.

Referring to the block diagram of FIG. 5 showing a prober for automatically forming such a mark, a marking section 53 for marking a surface of a semiconductor device, a post-marking recognition section 51 for detecting the mark, A marking area calculation unit 52, a marking area standard storage unit 55, and a comparison unit 5 that compares the calculation result of the marking area with the standard value
6, a comparison result determination unit 57, and a stage driving unit 58
And a stage 54.

First, the recognition unit 51 recognizes after marking by the marking unit 53, and the marking area is calculated by the calculation unit 52. The marking area calculated by the calculation unit 52 is compared with the marking area standard stored in the storage unit 55, and the determination unit 57 determines whether the standard is satisfied. If the standard is satisfied (OK), a signal is sent to the stage drive unit 58 to move the stage 54 to the next semiconductor element to be marked. If the standard is not satisfied (NG), a signal is sent to the marking unit 53, marking is performed again at the same position of the same element, and the above operation is repeated until the determination unit 57 determines that the standard is satisfied.

However, in this type of prober, the size of the marking area with respect to the surface area of the semiconductor element is not used as the determination information, and if the marking area ratio is small, it is not possible to recognize after marking in a later step.

When the marking area does not meet the standard, the marking is performed again. However, since the marking is performed at the same position, the marking is performed only at a size determined by, for example, the probe of the prober. In order to obtain the above, there is a problem that the position of the semiconductor element is separately changed in a later step and marking is performed again.

Incidentally, with reference to Japanese Patent Application Laid-Open No. 61-52151, which shows a conventional method for forming a defective mark on a semiconductor chip, a plurality of defective marks are simultaneously formed on a semiconductor chip with a marker having a comb-like needle portion. Only how to do that is described. However, when the surface area of the semiconductor chip is changed, a problem common to the above-described technology occurs, and the problem of the area ratio has not been solved at all.

[0015]

In view of the above problems, the present invention has the following objects. (1) The ratio of the mark area to the surface area of the semiconductor element is kept within a predetermined allowable range. (2) When the surface area of the semiconductor element is changed, the mark area is automatically changed accordingly. (3) To enable the image processing device after marking to accurately recognize the presence of the mark. (4) To avoid waste in the production process and raw materials. (5) The marking should not be performed on the surface of the adjacent semiconductor element. (6) At the time of marking, dust generation should be reduced as much as possible to prevent damage accidents. (7) The marking operation should be completed in a short time. (8) Avoid adding a manufacturing process.

[0016]

[0017]

A first configuration of the present invention, in order to solve the problems],
In a semiconductor wafer marking device provided with a means for marking a surface of a semiconductor element not conforming to a predetermined standard among semiconductor elements formed on the semiconductor wafer, a surface area of the semiconductor element is detected. Means for calculating the required surface area of the mark based on the means, and control means for forming the mark based on the specified value of the means. I do.

[0018]

[0019]

[0020]

[0021]

FIG. 1 shows a marking device associated with the present invention .
Referring to the block diagram, the device is - The Ma -
A marking section 13 for marking the surface of the semiconductor element by using a marker, a scratch marker, an ink marker, or the like;
Ma - Ma to detect the presence of King trace - King mark recognition unit 11
A marking area calculation unit 12 for calculating the area of the recognized mark; and a marking area standard storage unit for standardizing and storing in advance the marking area required for the semiconductor device. 15, a comparing unit 16 for comparing data between the calculating unit 12 and the storage unit 15, and a determining unit 17 for determining whether or not the compared data is within a predetermined allowable range.
If the compared data is within a predetermined range, the next semiconductor device after this semiconductor device is determined.
A stage driving unit 18 for moving a stage, a stage 14 for moving by the driving unit 18, and a marking corresponding to a shortage of a marking area when the stage is not within a predetermined allowable range. The number of times, that is, the number of times the marking should be performed, and the number-of-markings calculation unit 20, and the insufficient number-of-times marking storage unit 1 for temporarily storing the number of times of marking.
9, a marking position recognizing unit 14 for detecting where the marking position exists on the surface of the semiconductor element, and a stage for calculating the movement amount of the stage based on the position of the recognizing unit 14.
A stage movement amount calculation unit 21 and a stage movement amount storage unit 22 for temporarily storing data of the calculation unit 21 are provided.

Here, the stage driving section 18 is provided in the storage section 1.
It is driven based on the data of 9, 22 as well.

First, a mark of a minimum area unit is formed on the surface of a semiconductor element as a first mark.

Next, the marking mark marked by the marking unit 13 is recognized by the post-marking recognition unit 11, the mark area is calculated by the marking area calculation unit 12, and the position of the mark is determined by the marking position recognition unit 14. Recognize by. The area calculated by the calculation unit 12 and the standard value stored in advance in the marking area standard storage unit 4 are
The comparison unit 9 makes a comparison, and the determination unit 10 determines whether or not the standard is satisfied, that is, whether or not the value falls within a predetermined range.

Here, if the standard is satisfied, a signal is sent to the stage drive unit 18 to move the stage 14 to the next semiconductor element to be marked.

If the standard is not satisfied, the shortage marking number calculation unit 20 calculates the number of times that the shortage of the area with respect to the standard can be satisfied by marking, and the shortage marking number storage unit 19. To be stored temporarily.

Further, in order to satisfy the shortage of the area by the number of times of marking calculated by the insufficient number of times of marking calculation unit 20 based on the marking position recognized by the marking position recognizing unit 14, how much the stage 14 is moved. The movement size of whether or not it should be calculated is calculated by the stage movement amount calculation unit 21 and stored in the stage movement amount storage unit 22. Next, by using the number of times of marking stored in the shortage marking times storage unit 19 and the amount of stage movement stored in the stage movement amount storage unit 22, the stage 14 is moved to perform marking, thereby providing the same semiconductor. By changing the marking position on the surface of the element a plurality of times, the area of the entire mark is increased and a mark of an appropriate size is formed.

Referring to the perspective view of FIG. 2 showing a state in which a mark is formed on the surface of a semiconductor pellet using this marking device , a first mark 31 is first applied. Next, the apparatus shown in FIG. 1 operates as described above. As a result, it is judged that the number of times of marking "1" is insufficient, and after the semiconductor pellet 30 is moved by the drive unit 18, the second mark 32 is applied. . Here, the marking ends.

Although the total area of the marks with respect to the surface area of one such semiconductor element is possible if it is 2% or more,
More preferably, it is about 10% to 30%. this is,
It also depends on image processing capabilities.

Further, in order to confirm whether or not the second mark 32 has been normally performed, it is necessary to operate the device again to confirm that the determination unit 17 satisfies the standard. It is more preferable to improve the properties.

This marking device compares the marking area with the standard and calculates the number of times of marking the area shortage to satisfy the standard. And a stage movement amount calculating unit 22 for calculating how much the stage should be moved in order to change the marking position. -Since the king can be made, the marking area can be increased.

As a result, even if the surface area of the semiconductor element is changed, marking of an appropriate size is performed, and confirmation is performed after the marking. Since no large marks are formed, there is little dust generation and marking work can be performed in a short time.
Further, there is an advantage that there is no need to add a separate manufacturing process.

Referring to the block diagram of FIG. 3 showing a marking device according to an embodiment of the present invention , this embodiment has a stage 40 on which a semiconductor element is mounted, and an image input for imaging the surface of the semiconductor element. Means 41, a marking section 46 for performing marking by any of the above-described methods, a mark surface area calculation section 42 ', a surface area calculation section 42 of the semiconductor element, and an appropriate Designating unit 43 for calculating and designating a large mark area, a moving amount calculating unit 44 for calculating the moving amount of the stage based on the specified value of the specifying unit 43, and a calculating unit 4
A comparing unit 48 for comparing the calculated value of 2 'with the calculating means 42
When the comparison value in the comparing section 48 is "good", that is, when the marking is performed normally, the stage is driven. When the comparison is not performed normally, the marking is performed again. It comprises a judging section 49 for instructing and a stage driving section 45.

First, a semiconductor element is mounted on the stage 40, the surface of the element is imaged by the image input means 41, and the surface area of the imaged semiconductor element is calculated by the calculating means 42. Designating part 43 for designating the area of
Then, the moving amount of the marking unit 46 is calculated by the calculating unit 44 based on the designated value, and the marking unit 46 forms a mark having an area corresponding to the surface area of the semiconductor element.

As described above, for the purpose of simply forming a mark having an appropriate area, the stage 40 and the image input means 4 are used.
1, a surface area calculating means 42, a mark area designating section 43, a calculating section 44, and a marking section 46 are required. However, in order to check the marking trace and confirm whether or not the marking is accurate, it is necessary to calculate the mark surface area. Section 42 ', comparison section 4
8, a judging unit 49 and a stage driving unit 45 are added to the above block.

That is, the surface area after marking is calculated by the mark surface area calculation section 42 ', and the calculated value of the calculation means 42 is compared with the calculated value of the calculation means 42 by the comparison section 48 to determine whether or not this is a value corresponding to the surface area of the semiconductor element. If it is within the allowable range, the marking of the semiconductor element is completed, and the stage 40 is moved to perform marking of the next semiconductor element. But,
If the value does not fall within the allowable range, the marking section 46 is re-started.
Is used to form a mark on the same semiconductor element with the same amount of movement as the first time.

Referring to the perspective view of FIG. 4 showing a state in which the surface of a defective semiconductor pellet is marked using the marking device of the above-described embodiment, the surface of the semiconductor pellet 47 has On the basis of the amount of movement specified by the calculating unit 44, the marking unit 46 applies the mark 48 at one time, and the processing ends. That is, the marking operation is completed only once. When confirming the area of the mark 48, the configuration as described above is used.

According to this embodiment , the mark area is designated by calculating the semiconductor surface area. Therefore , even if the surface area of the semiconductor element is changed, the mark area can be changed immediately. In addition, since the marking traces are checked, no waste is caused in the manufacturing process, and the unnecessary area is not marked, so that it is possible to mark adjacent semiconductor elements. There is an advantage that there is no accident and the marking work is completed in a short time. Further, even in comparison with techniques <br/> surgery conventional 5, there is an advantage that it is not necessary to add a new fabrication process. Further, since only one marking operation is required, the operation time is extremely short, and the operation efficiency is improved.

Although the semiconductor pellet 47 shown in FIG. 4 has been described in units of pellets that have already been separated, the present invention is not limited to this. Also, the present invention described above
The marking device of the above embodiment can be used. In this case, the stage is controlled so that defective elements among the semiconductor elements arranged in the semiconductor wafer are marked.

In the embodiment of the present invention, the case in which the stage 40 moves has been described. On the contrary, the marking section 46 may move, in other words, any structure may be used as long as it moves relatively.

In FIG. 2 and FIG.
1, 32 and 48 are also formed such that the boundaries of the marks are formed in the oblique direction with respect to the rectangular pellets, but at a 45 ° angle so that the markings can be clearly distinguished from the separation bands of the pellets and the wiring on the surface. A tilt mark of the order of magnitude is preferred, and 30 to 60 degrees is possible.

Each of the blocks shown in FIGS. 1 and 3 can be realized by a combination of a wiring board having a semiconductor integrated circuit device as a main component, except for a mechanical portion and an optical device portion.
In addition to incorporating predetermined circuit functions into such a plurality of wiring boards, the present invention can also be realized by incorporating a prescribed program into a personal computer and using a personal computer. Function can be changed.

[0043]

As described above, according to the present invention, since a mark having an area corresponding to a semiconductor element or a semiconductor pellet is formed, the mark can be accurately read, and the above-mentioned (1) to (8) ) Are all achieved.

[Brief description of the drawings]

FIG. 1 is a block diagram of a marking device related to the present invention .

FIG. 2 is a perspective view showing a mark formed by the marking device having the configuration of FIG . 1 ;

FIG. 3 is a block diagram of an embodiment of the present invention .

[4] 3 Ma formed by embodiments of the present invention -
FIG.

FIG. 5 is a block diagram showing a conventional marking device.

[Explanation of symbols]

 11,51 Marking mark recognition unit 12,52 Marking area calculation unit 13,46,53 Marking unit 14,40,54 Stage 15,55 Marking area standard storage unit 16,48,56 Comparison section 17, 49, 57 Judgment section 18, 45, 58 Stage drive section 19 Insufficient marking number storage section 20 Marking number calculation section 21 Stage movement amount calculation section 22 Stage movement amount storage Sections 31, 32, 48 Marks 30, 47 Semiconductor pellets 41 Image input means 42 Surface area calculation means 42 'Mark surface area calculation section 43 Mark surface area designation section 44 Stage movement amount calculation section

Claims (1)

(57) [Claims] 1. A semiconductor wafer marking apparatus comprising: means for marking a surface of a semiconductor element which does not conform to a predetermined standard among semiconductor elements formed on the semiconductor wafer. A semiconductor wafer comprising: means for detecting and calculating; means for specifying a required area of the mark based on the means; and control means for forming the mark based on a value specified by the means. Marking device.