JP2848918B2 - Resin for double-sided flexible printed circuit boards. - Google Patents
Resin for double-sided flexible printed circuit boards.Info
- Publication number
- JP2848918B2 JP2848918B2 JP2121177A JP12117790A JP2848918B2 JP 2848918 B2 JP2848918 B2 JP 2848918B2 JP 2121177 A JP2121177 A JP 2121177A JP 12117790 A JP12117790 A JP 12117790A JP 2848918 B2 JP2848918 B2 JP 2848918B2
- Authority
- JP
- Japan
- Prior art keywords
- mol
- double
- flexible printed
- printed circuit
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 title claims description 10
- 239000004697 Polyetherimide Substances 0.000 claims description 11
- 229920001601 polyetherimide Polymers 0.000 claims description 11
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 claims description 9
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 9
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 claims description 2
- KHYXYOGWAIYVBD-UHFFFAOYSA-N 4-(4-propylphenoxy)aniline Chemical compound C1=CC(CCC)=CC=C1OC1=CC=C(N)C=C1 KHYXYOGWAIYVBD-UHFFFAOYSA-N 0.000 claims description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 2
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 2
- 150000004984 aromatic diamines Chemical class 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- -1 ether imide Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Paints Or Removers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、両面フレキシブルプリント回路基板用樹脂
組成物に関するものであり、さらに詳しくは、銅箔との
接着力に優れたフィルムを形成するポリエーテルイミド
に関するものである。Description: TECHNICAL FIELD The present invention relates to a resin composition for a double-sided flexible printed circuit board, and more particularly, to a resin composition for forming a film having excellent adhesion to a copper foil. It relates to ether imide.
（従来の技術） 近年、電子・電気工業の発展に伴い、通信用、民生用
機器の実装方式の簡略化、小型化、高信頼性が要求さ
れ、プリント回路基板の使用が望まれている。特に軽量
で立体的に実装できるフレキシブルプリント回路板の使
用が有利であり、注目されている。(Prior Art) In recent years, with the development of the electronics and electric industries, simplification, miniaturization, and high reliability of mounting systems for communication and consumer devices have been demanded, and the use of printed circuit boards has been desired. Particularly, the use of a flexible printed circuit board which is lightweight and can be mounted three-dimensionally is advantageous and attracts attention.
さらに、最近では多層構造を有するフレキシブルプリ
ント回路基板の使用が強く望まれている。Furthermore, recently, there is a strong demand for the use of flexible printed circuit boards having a multilayer structure.
従来、ポリイミド樹脂を用いた２層フレキシブルプリ
ント回路基板を製造するには、銅箔上にポリアミック酸
のワニスを塗布し、これを乾燥、硬化させる方法が一般
的に用いられている。しかしながら、これらのポリアミ
ック酸を両面フレキシブルプリント回路基板に用いた場
合、乾燥条件が穏やかな場合、銅箔同志を張り合わせた
ときに、イミド化の際に生成する水などにより、銅箔上
に、膨れ、しわなどを生じ、反対に、乾燥条件が強すぎ
ると十分な接着力が得られないという欠点があった。Conventionally, in order to manufacture a two-layer flexible printed circuit board using a polyimide resin, a method of applying a varnish of a polyamic acid on a copper foil, drying and curing the varnish is generally used. However, when these polyamic acids are used for a double-sided flexible printed circuit board, when the drying conditions are mild, when the copper foils are bonded together, water or the like generated during imidization swells on the copper foils. On the contrary, if the drying conditions are too strong, there is a disadvantage that a sufficient adhesive strength cannot be obtained.
また、熱可塑性のポリイミドを用いた例もいくつか報
告されているが、接着力、耐熱性の面でまだ十分とは言
えない。Although some examples using thermoplastic polyimides have been reported, their adhesive strength and heat resistance are not yet satisfactory.
（発明が解決しようとする課題） 本発明は、耐熱性に優れ、しかも銅箔との接着力に優
れたポリエーテルイミド樹脂組成物からなる両面フレキ
シブルプリント回路基板を得ようとして研究した結果得
られたものである。(Problems to be Solved by the Invention) The present invention is obtained as a result of research for obtaining a double-sided flexible printed circuit board made of a polyetherimide resin composition having excellent heat resistance and excellent adhesion to copper foil. It is a thing.
（課題を解決するための手段） 本発明は、ベンゾフェノンテトラカルボン酸二無水物
（以下BTDAと略す）とビフェニルテトラカルボン酸二無
水物（以下BPDAと略す）とのモル比（BTDA:BPDA）が70:
30〜30:70である芳香族カルボン酸二無水物成分と、2,2
−ビス［４−（４−アミノフェノキシ）フェニル］プロ
パン（以下BAPPと略す）と1,3−ビス（３−アミノフェ
ノキシ）ベンゼン（以下APBと略す）とのモル比（BAPP:
APB）が40:60〜60:40である芳香族ジアミン成分との重
縮合体からなる一般式（１）で表される両面フレキシブ
ルプリント回路基板用ポリエーテルイミド樹脂である。(Means for Solving the Problems) The present invention relates to a benzophenone tetracarboxylic dianhydride (hereinafter abbreviated as BTDA) and a biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA) molar ratio (BTDA: BPDA). 70:
An aromatic carboxylic dianhydride component of 30 to 30: 70, and 2,2
The molar ratio of -bis [4- (4-aminophenoxy) phenyl] propane (hereinafter abbreviated as BAPP) to 1,3-bis (3-aminophenoxy) benzene (hereinafter abbreviated as APB) (BAPP:
APB) is a polyetherimide resin for a double-sided flexible printed circuit board represented by the general formula (1), comprising a polycondensate with an aromatic diamine component having a ratio of 40:60 to 60:40.
（式中、Arは30〜70モル％が式（Ａ）、その残りが式
（Ｂ）である４価の芳香族残基、 Ｙは式（Ｃ）を40〜60モル％、その残りが式（Ｄ）であ
る２価の基である。） （作用） 本発明において用いられるポリエーテルイミドは、Ｎ
−メチル−２−ピロリドン、ジメチルアセトアミド、ジ
メチルホルムアミド、クレゾール等の溶媒中で、BTDA、
BPDA、BAPP、APBを加熱撹拌することにより得ることが
できる。 (Wherein, Ar is a tetravalent aromatic residue having 30 to 70 mol% of the formula (A) and the remainder of the formula (B), Y is a divalent group represented by the formula (C) in an amount of 40 to 60 mol% and the remainder represented by the formula (D). ) (Action) The polyetherimide used in the present invention is N
-Methyl-2-pyrrolidone, dimethylacetamide, dimethylformamide, BTDA, in a solvent such as cresol
It can be obtained by heating and stirring BPDA, BAPP, and APB.
ポリエーテルイミド中のBTDAとBPDAのモル比は70:30
〜30:70が好ましい。BTDAの量が70モル％を超えると生
成するポリエーテルイミドの溶解性が低下し、同様に30
モル％未満では銅箔への密着性が低下する。The molar ratio of BTDA and BPDA in the polyetherimide is 70:30
~ 30: 70 is preferred. If the amount of BTDA exceeds 70 mol%, the solubility of the resulting polyetherimide decreases, and
If it is less than mol%, the adhesion to the copper foil will be reduced.
また、BAPPとAPBのモル比は40:60〜60:40が好まし
い。BAPPの量が40モル％未満では生成するポリエーテル
イミドの溶解性が低下し、同様に60モル％を超えると接
着力が低下する。The molar ratio between BAPP and APB is preferably from 40:60 to 60:40. If the amount of BAPP is less than 40 mol%, the solubility of the resulting polyetherimide decreases, and if it exceeds 60 mol%, the adhesive strength decreases.
本発明の樹脂組成物は、貼り合わせる銅箔の一方ある
いは両方へ塗布し、樹脂を塗布した面を合わせてこれら
を貼り合わせることによって両面フレキシブルプリント
基板を得ることができる。The resin composition of the present invention is applied to one or both of the copper foils to be bonded, and the surfaces on which the resin is applied are aligned and then bonded to each other to obtain a double-sided flexible printed board.
銅箔に塗布した樹脂組成物の乾燥温度は、通常80〜25
0℃であり、溶剤を除去後、２枚の銅箔を貼り合わせ、3
00〜380℃の範囲で３〜10分間、加熱・加圧硬化させる
か、上記温度以下で加圧、圧着後、300〜380℃の範囲で
３〜10分間加熱することによって、両面フレキシブルプ
リント基板を得ることができる。The drying temperature of the resin composition applied to the copper foil is usually 80 to 25
After the solvent was removed at 0 ° C, two pieces of copper foil were stuck together.
By heating and pressurizing at a temperature in the range of 00 to 380 ° C for 3 to 10 minutes, or by pressing and pressing at a temperature not higher than the above temperature, and then heating at a temperature in the range of 300 to 380 ° C for 3 to 10 minutes, a double-sided flexible printed board Can be obtained.
（実施例） 実施例１ 攪拌機、温度計、窒素導入管、水分定量器を備えた４
ツ口フラスコへ、BTDA9.76g（0.03mol）、BPDA20.60g
（0.07mol）、BAPP20.53g（0.05mol）、APB14.62g（0.0
5mol）を加え、さらにＮ−メチル−２−ピロリドン471g
トルエン118gを添加し、窒素気流下でよく撹拌した。次
いで、系内の温度を150℃まで昇温し、生成する水を系
外に除去しながら、150〜160℃で６時間撹拌し、ポリエ
ーテルイミドを得た。(Example) Example 1 4 equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a moisture meter.
9.76 g (0.03 mol) of BTDA, 20.60 g of BPDA
(0.07 mol), BAPP20.53 g (0.05 mol), APB 14.62 g (0.0
5 mol), and 471 g of N-methyl-2-pyrrolidone was further added.
118 g of toluene was added, and the mixture was stirred well under a nitrogen stream. Next, the temperature inside the system was raised to 150 ° C., and the system was stirred at 150 to 160 ° C. for 6 hours while removing generated water outside the system to obtain polyetherimide.
得られた樹脂溶液は透明であり、室温においても充分
な流動性を有していた。The obtained resin solution was transparent and had sufficient fluidity even at room temperature.
実施例２ 撹拌機、温度計、窒素導入管、水分定量器を備えた４
ツ口フラスコへ、BTDA19.33g（0.06mol）、BPDA11.77g
（0.04mol）、BAPP20.53g（0.05mol）、APB14.62g（0.0
5mol）を加え、さらにＮ−メチル−２−ピロリドン477g
トルエン119gを添加し、窒素気流下でよく撹拌した。次
いで、系内の温度を150℃まで昇温し、生成する水を系
外に除去しながら、150〜160℃で６時間撹拌し、ポリエ
ーテルイミドを得た。Example 2 4 equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a moisture quantifier
BTDA 19.33g (0.06mol), BPDA 11.77g
(0.04 mol), BAPP20.53 g (0.05 mol), APB 14.62 g (0.0
5mol), and 477 g of N-methyl-2-pyrrolidone was further added.
119 g of toluene was added, and the mixture was stirred well under a nitrogen stream. Next, the temperature inside the system was raised to 150 ° C., and the system was stirred at 150 to 160 ° C. for 6 hours while removing generated water outside the system to obtain polyetherimide.
得られた樹脂溶液は透明であり、室温においても充分
な流動性を有していた。The obtained resin solution was transparent and had sufficient fluidity even at room temperature.
比較例１ 撹拌機、温度計、窒素導入管、水分定量器を備えた４
ツ口フラスコへ、BTDA25.78g（0.08mol）、BPDA5.88g
（0.02mol）、BAPP20.53g（0.05mol）、APB14.62g（0.0
5mol）を加え、さらにＮ−メチル−２−ピロリドン485g
トルエン121gを添加し、窒素気流下でよく撹拌した。次
いで、系内の温度を150℃まで昇温し、生成する水を系
外に除去しながら、150〜160℃で６時間撹拌し、ポリエ
ーテルイミドを得た。Comparative Example 1 4 equipped with a stirrer, thermometer, nitrogen inlet tube, and moisture meter
BTDA25.78g (0.08mol), BPDA5.88g
(0.02 mol), BAPP 20.53 g (0.05 mol), APB 14.62 g (0.0
5 mol), and 485 g of N-methyl-2-pyrrolidone was further added.
121 g of toluene was added, and the mixture was stirred well under a nitrogen stream. Next, the temperature inside the system was raised to 150 ° C., and the system was stirred at 150 to 160 ° C. for 6 hours while removing generated water outside the system to obtain polyetherimide.
得られた樹脂溶液は透明であったが、室温まで冷却す
るとゼリー状となり、流動性が得られなかった。Although the obtained resin solution was transparent, it became jelly-like when cooled to room temperature, and fluidity was not obtained.
比較例２ 撹拌機、温度計、窒素導入管、水分定量器を備えた４
ツ口フラスコへ、BPDA29.42g（0.10mol）、BAPP20.53g
（0.05mol）、APB14.62g（0.05mol）を加え、さらにＮ
−メチル−２−ピロリドン465gトルエン116gを添加し、
窒素気流下でよく撹拌した。次いで、系内の温度を150
℃まで昇温し、生成する水を系外に除去しながら、150
〜160℃で６時間撹拌し、ポリエーテルイミドを得た。Comparative Example 2 4 equipped with a stirrer, a thermometer, a nitrogen inlet tube, and a moisture meter
To a one-necked flask, BPDA 29.42 g (0.10 mol), BAPP 20.53 g
(0.05 mol), 14.62 g (0.05 mol) of APB, and further added N
-Methyl-2-pyrrolidone 465 g toluene 116 g was added,
The mixture was well stirred under a nitrogen stream. Next, the temperature in the system was increased to 150
Temperature to 150 ° C and remove the generated water out of the system.
The mixture was stirred at -160 ° C for 6 hours to obtain polyetherimide.
得られた樹脂溶液は透明であり、室温においても充分
な流動性を有していた。The obtained resin solution was transparent and had sufficient fluidity even at room temperature.
以上、実施例１、２および比較例２で合成した樹脂溶
液を乾燥後の厚みが、25μｍになるように、厚さ35μｍ
の銅箔上へ流延塗布した後、乾燥機に入れて100℃で１
時間、220℃で１時間乾燥させ、樹脂を塗布した面に別
の銅箔を重ね合わせ、温度350℃、圧力50kg/cm2で５分
間プレスし、両面フレキシブル基板を得た。As described above, the resin solutions synthesized in Examples 1 and 2 and Comparative Example 2 were dried to a thickness of 35 μm so that the thickness after drying was 25 μm.
After casting and coating on a copper foil, place in a dryer at 100 ° C for 1
After drying at 220 ° C. for 1 hour, another copper foil was overlaid on the surface coated with the resin, and pressed at a temperature of 350 ° C. and a pressure of 50 kg / cm 2 for 5 minutes to obtain a double-sided flexible substrate.
得られた両面フレキシブル基板を評価した結果を第１
表に示す。The evaluation result of the obtained double-sided flexible substrate
It is shown in the table.
実施例１および２の樹脂組成物を用いた両面フレキシ
ブル基板は、比較例２と較べ、３〜４倍のピール強度を
示した。The double-sided flexible substrates using the resin compositions of Examples 1 and 2 exhibited a peel strength three to four times that of Comparative Example 2.
（発明の効果） 本発明により、耐熱性に優れ、接着力に優れた両面フ
レキシブルプリント回路基板用樹脂組成物を得ることが
可能となった。 (Effects of the Invention) According to the present invention, a resin composition for a double-sided flexible printed circuit board having excellent heat resistance and excellent adhesive strength can be obtained.
Claims (1)
（以下BTDAと略す）とビフェニルテトラカルボン酸二無
水物（以下BPDAと略す）とのモル比（BTDA:BPDA）が70:
30〜30:70である芳香族カルボン酸二無水物成分と、2,2
−ビス［４−（４−アミノフェノキシ）フェニル］プロ
パン（以下BAPPと略す）と1,3−ビス（３−アミノフェ
ノキシ）ベンゼン（以下APBと略す）とのモル比（BAPP:
APB）が40:60〜60:40である芳香族ジアミン成分との重
縮合体からなる一般式（１）で表される両面フレキシブ
ルプリント回路基板用ポリエーテルイミド樹脂。 （式中、Arは30〜70モル％が式（Ａ）、その残りが式
（Ｂ）である４価の芳香族残基、 Ｙは式（Ｃ）を40〜60モル％、その残りが式（Ｄ）であ
る２価の基である。） A benzophenone tetracarboxylic dianhydride (hereinafter abbreviated as BTDA) to a biphenyltetracarboxylic dianhydride (hereinafter abbreviated as BPDA) having a molar ratio (BTDA: BPDA) of 70:
An aromatic carboxylic dianhydride component of 30 to 30: 70, and 2,2
The molar ratio of -bis [4- (4-aminophenoxy) phenyl] propane (hereinafter abbreviated as BAPP) to 1,3-bis (3-aminophenoxy) benzene (hereinafter abbreviated as APB) (BAPP:
APB) is a polyetherimide resin for a double-sided flexible printed circuit board represented by the general formula (1), comprising a polycondensate with an aromatic diamine component having a ratio of 40:60 to 60:40. (Wherein, Ar is a tetravalent aromatic residue having 30 to 70 mol% of the formula (A) and the remainder of the formula (B), Y is a divalent group represented by the formula (C) in an amount of 40 to 60 mol% and the remainder represented by the formula (D). )
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2121177A JP2848918B2 (en) | 1990-05-14 | 1990-05-14 | Resin for double-sided flexible printed circuit boards. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2121177A JP2848918B2 (en) | 1990-05-14 | 1990-05-14 | Resin for double-sided flexible printed circuit boards. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04153224A JPH04153224A (en) | 1992-05-26 |
| JP2848918B2 true JP2848918B2 (en) | 1999-01-20 |
Family
ID=14804759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2121177A Expired - Lifetime JP2848918B2 (en) | 1990-05-14 | 1990-05-14 | Resin for double-sided flexible printed circuit boards. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2848918B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG44486A1 (en) * | 1992-06-04 | 1997-12-19 | Sumitomo Bakelite Co | Film adhesive and process for production thereof |
| JPH0680777A (en) * | 1992-08-31 | 1994-03-22 | Sumitomo Bakelite Co Ltd | Soluble polyimide resin |
| GB9506725D0 (en) | 1995-03-31 | 1995-05-24 | Hooley Anthony | Improvements in or relating to loudspeakers |
| DE60036958T2 (en) | 1999-09-29 | 2008-08-14 | 1...Ltd. | METHOD AND DEVICE FOR ORIENTING SOUND WITH A GROUP OF EMISSION WANDERS |
| JP4445705B2 (en) | 2001-03-27 | 2010-04-07 | １．．．リミテッド | Method and apparatus for creating a sound field |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61143433A (en) * | 1984-12-15 | 1986-07-01 | Nitto Electric Ind Co Ltd | Moisture-resistant polyimide |
-
1990
- 1990-05-14 JP JP2121177A patent/JP2848918B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04153224A (en) | 1992-05-26 |
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