JP2674580B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket in which a flat IC package is sandwiched and fixed, and an IC carrier can be connected to a lead and a contact pin of the IC package.

[0002]

2. Description of the Related Art This type of IC socket is a so-called open top type, and when an IC carrier holding and fixing an IC package therein is mounted, the IC carrier is inserted from above the socket body. Has become.

FIG. 7 has already been proposed by the present applicant (Japanese Patent Application No. 2).
No. 89791) shows an example of the structure of this type of IC socket. In FIG. 7, reference numeral 21 denotes an IC carrier which can hold and fix, for example, a flat IC package by its locking claws. As shown in FIG. 5, the IC package 22 is housed in the IC carrier 21 so that its leads 22a are horizontally arranged.

Reference numeral 23 designates a socket body adapted to accommodate the IC carrier 21 in a predetermined position, 24 designates contact pins arranged in a row on the socket body 23, and 25 designates a socket body 23 which is vertically movable. Outer frame,
A plurality of coil springs 26 are provided at appropriate positions on a pedestal 27 fixed to the socket body 23 and urge the outer frame 25 upward.

Further, 28 is a rotary plate pivotally attached to four side portions of the socket body 23 via a support shaft 29, and 30 is planted in the outer frame 25 and of the rotary plate 28. The drive pin 31 fitted in the long hole 28a is formed in a gate shape, and one end of the arm portions 31a on both sides is pin-coupled to the rotary plate 28 via the connecting pin 32, so that the pressing portion 31b is held. Is a carrier holding metal fitting that is horizontally mounted on the socket body 23, and is adapted to hold down the IC carrier 21 housed in the socket body 23 from above with reference to FIG. 9 (A). There is. Reference numeral 33 is a guide pin which is planted in the socket body 23 and is fitted in the long hole 31c of the carrier pressing fitting 31. These members constitute a link mechanism, and the outer frame 25 and the carrier pressing fitting 31 are interlocked with each other via the link mechanism.

In such a conventional IC socket, the IC
When the carrier 21 is mounted, when the outer frame 25 is pushed down against the elastic force of the coil spring 26, the rotating plate 28 is rotated leftward around the support shaft 29 through the elongated hole 28a by the downward movement of the drive pin 30. (FIG. 9 (B), arrow A) Further, when the arm portion 31a of the carrier pressing member 31 is moved upward through the connecting pin 32, the arm portion 31a guided by the guide pin 33 moves upward while moving to the right. It is turned (arrow B in FIG. 9B).

As a result, the holding portion 31b of the carrier holding fitting 31 is opened as shown in FIG. 9 (B), whereby the IC carrier 21 can be inserted into the socket body 23. Then, the IC carrier 21 is attached to the socket body 2
3 is set at a predetermined position, and when the pushing down on the outer frame 25 is released, the outer frame 25 is moved to the coil spring 2
It is pushed up by the elasticity of 6. As a result, the drive pin 30 moves upward, and contrary to the case of pushing down the outer frame 25, the carrier holding metal fitting 3 is rotated by turning the rotating plate 28 clockwise.
1 is closed and the holding portion 31b holds the IC carrier 21 from above. As described above, in the conventional IC socket, the IC carrier 21 can be inserted and removed through the link mechanism by moving the outer frame 25 up and down.

[0008]

However, such a conventional IC socket is provided with the link mechanism constructed as described above, but this link mechanism has a complicated structure and the number of parts constituting it is small. There was no choice but to increase. In particular, since the number of metal parts such as the carrier retainer 31 is large, it is troublesome to mount the metal parts after molding with synthetic resin, and a long assembling time is required.
Further, there are problems that the material cost is high and the product cost is inevitably high.

In view of the above situation, the present invention effectively realizes cost reduction by eliminating the link and latch mechanism made of metal parts and forming the latch mechanism by mold parts and simplifying the manufacturing and assembling thereof. It is an object of the present invention to provide an IC socket of this kind which is capable of ensuring a reliable latch function.

[0010]

[MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
In, IC socket according to claim 1, by mounting the IC carrier carrying the IC package to the socket body and adapted to connect the contact pins planted on the lead and the socket body of the IC package I
A C socket, which is attached to the socket body so as to be movable up and down through an ammunition means, has a cover having an action portion configured to press and tilt the contact pin, and a pivotal support for the socket body. The cover is vertically moved to lock and unlock the IC carrier.
And a latch means adapted to take a release position.
In the IC socket, the contact pin has an arc shape.
A spring portion, which extends from the arc-shaped spring portion and contacts the acting portion
Between the pressing part and the arcuate spring part.
And a contact portion that comes into contact with the provided lead,
The arcuate spring part is inside the IC socket, and the pressing part is
It is arranged so as to be on the outside, and the above-mentioned operating portion is IC.
From the inside of the socket, engage with the pressing part,
Engages the contact pins due to the downward movement of the cover
Push down the contact pin and tilt it
A slightly inclined or curved first surface and the above-mentioned pushing down inclination
The above-mentioned first surface that can be engaged so as to hold the tilted state and
It is formed by a stepped cam surface consisting of a vertical second surface and
The latch means is biased by the ammunition means and is
A) The latching position for latching the cover and the cover
By moving downward against the urging force of the above-mentioned ammunition means
The above action part is engaged with the contact pin on the second surface.
To take the unlocked position where the latched state is released
And the IC is operated by vertically moving the cover.
The feature is that the carrier can be inserted and removed.
I have. The IC socket according to claim 2 is the IC
From the upper side and the lower side of the carrier,
So that it is clamped by the contact pin
It is characterized by that.

[0011]

According to the present invention, when the cover is pushed down, the pressing portion of the contact pin is first pressed by the first surface of the operating portion of the cover, and the contact portion is separated from the contact position.
In addition, it can be tilted to the outside of the socket body. When the cover is further pushed down, the latch means is rotated by the cover to the outside of the socket body, whereby the IC
The carrier can be inserted into the socket body.
At this time, since the pressing portion of the contact pin falls into the second surface of the acting portion of the cover, it is held in the tilted state.

In this state, when the IC carrier is inserted into the socket body and the pushing down on the cover is released, the cover described above is released.
Until the contact pin comes off from the second surface of the working part of the
The contact pin remains held in the tilted state
Therefore, the latch means is rotated inside the socket body first , thereby locking the IC carrier from the upper side. Then, the pressing portion of the contact pin is
Since the second surface of the action portion is separated from and moves to the first surface, the contact pin is restored from its tilted state by its elasticity, whereby the IC carrier held from the upper side by the latch means is moved to the lower side. Then, the contact portion of the contact pin is connected to the lead of the IC package housed in the IC carrier. At the same time , the IC carrier is clamped from above and below via the leads .

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, I according to the present invention will be described with reference to FIGS.
An example of the C socket will be described. In the present embodiment, it is described with shall sandwiched and fixed IC carrier flat type IC package to an inner portion is used. In the figure, 1 is a socket body, 2 is an IC carrier to be housed in the socket body 1, and its schematic shape is shown by a chain double-dashed line. Is indicated by reference numeral 2a (FIG. 1). Reference numeral 3 denotes a contact pin 3 which has a contact portion 3a with the lead, a pressing portion 3b, and an arcuate spring portion 3c . It is a guide pin. The IC carrier 2 housed in the socket body 1 is mounted on the mounting surface 1a of the socket body 1 and positioned on the guide pin 4.

Reference numeral 5 has a substantially frame-like plane shape (see FIG. 1), and the fitting projection 5a is guided by the guide wall 1b of the socket body 1 and is mounted on the socket body 1 so as to be vertically movable. Covers 6 are compression coil springs that are mounted between the socket body 1 and the cover 5 at each of the four corners of the socket body 1 (FIG. 3) to urge the cover 5 upward. The cover 5 is provided with a stopper 5b for restricting its upward movement when being biased by the compression coil spring 6, and a guide wall 5c for guiding the IC carrier 2 when it is inserted. ing. 7 is a working portion for the contact pins (3) formed integrally with the cover 5, the contact pin
Slightly inclined or curved than the horizontal plane that pushes down and tilts button 3.
Keep the first surface 7a, which is a flat surface, and the depressed and tilted state.
Second surface 7 that is substantially perpendicular to the first surface 7a that can be engaged
and a stepped cam surface composed of b and
The contact pin 3 is pressed by pressing the pressing portion 3b of the contact pin 3 in response to the vertical movement of the socket pin 1
It can be tilted to the outside of.

Further, 8 is a latch means pivotally supported on both sides of the socket body 1 via a support shaft 9 in a central region of the socket body 1 in the longitudinal direction (direction in which the contact pins 3 are arranged). 10 is a torsion coil spring latching means 8 have been rotated above the support shaft 9 wound is urged to rotate in an inward direction of the socket body 1. The latch means 8 is in a normal state (the cover 5 is a compression coil spring 6 and
When the latch portion 8a is pushed up by the contact pin 3 , the position where the latch portion 8a can push the IC carrier 2 housed in the socket body 1 from the upper side by the elasticity of the torsion coil spring 10 as shown in FIG. Is coming to. Further, R is provided on both sides of the latch means 8.
A step portion 8b formed in a shape of a circle is provided (see FIGS. 1 and 3).
On the other hand, the cover 5 is engaged with the stepped portion 8b corresponding to the vertical movement of the cover 5, so that the cover 5 resists the elastic force of the torsion coil spring 10 as shown in FIG. 5d is provided so that it can be rotated toward the outside. When the latch means 8 is in the above-mentioned normal state, as shown in FIG. 4, a gap g is formed between the inclined surface portion 5d and the step portion 8b. At this time, the pressing portion of the contact pin 3
3b is in contact with the first surface 7a of the action portion 7.

In the above case, guide walls 11 for guiding the IC carrier 2 when the IC carrier 2 is mounted on the mounting surface 1a are provided upright at the four corners of the socket body 1. ing. A partition wall 12 is provided between the contact pins 3 (see FIG. 2) to prevent contact accidents between the contact pins 3 and guide the tilting operation.

Since the IC socket according to the present invention is constructed as described above, when accommodating the IC carrier 2 in the IC socket, the cover 5 at the raised position is pushed down against the elasticity of the compression coil spring 6. First, as shown in FIG.
The pressing portion 3b of the contact pin 3 is pressed, whereby the contact pin 3
It is caused to tilt outwardly of the socket body 1. In this case, since the gap g is set between the sloped portion 5d of the cover 5 and the stepped portion 8b of the latch means 8, the latch 5 is pressed until the cover 5 is moved downward by a stroke corresponding to the gap g. The means 8 are kept in a normal state.

Further, when the cover 5 is pushed down, the pressing portion 3b of the contact pin 3 is disengaged from the first surface 7a of the acting portion 7 and slides on the second surface 7b as shown in FIG. /> As a result, the state at that time is maintained without further leaning. On the other hand, when the cover 5 is pushed down, the slope 5d and the stepped portion 8b shown in FIG. 5 come into contact with each other, and both of them come into sliding contact with each other. The cover 5 rotates the socket main body 1 in the outward direction against the elastic force of the torsion coil spring 10 (FIG. 6). At this time, the contact pin is held in the tilted state, and thus the IC carrier 2 can be inserted into the socket body 1.

Next, when the IC carrier 2 is inserted into the socket body 1, the IC carrier 2 is inserted by being guided by the guide wall 5c and the guide wall 11 of the cover 5 in the insertable state, and then inserted into the socket body 1. It is positioned by the implanted guide pin 4 and placed on the placing surface 1 a of the socket body 1. Thus, after the IC carrier 2 is inserted, the pushing down on the cover 5 is released, that is, the cover 5 moves upward due to the elastic force of the compression coil spring 6, and thus the latch means 8 first causes the slope 5d of the cover 5 to move above. On the contrary, by moving upward, the elastic force of the torsion coil spring 10 causes it to rotate inside the socket body 1. As a result, the latch portion 8a of the latch means 8 presses the IC carrier 2 from above. Then, when the cover 5 further rises and returns to its normal position, the contact pin 3 is below the IC carrier 2 which is pressed from above by the latch means 8 so as to be restored from the tilted state by its elasticity. Enter the side and push up the IC carrier 2. Thus, the contact portion 3a of the contact pin 3 comes into pressure contact with the lead of the IC package housed in the IC carrier 2. At the same time, the IC carrier 2 is clamped from above and below.

The IC carrier 2 housed in the IC socket is accurately positioned by the guide pin 4, and each contact pin 3 is also precisely positioned by the partition wall 12, so that the contact pin 3 corresponds to the corresponding IC. Securely connected to the package lead. When removing the accommodated IC carrier 2 from the IC socket, the latch 5 is released from the IC carrier 2 by pushing down the cover 5 again, and the pushing up of the IC carrier 2 by the contact pin 3 is also stopped. Therefore, the IC carrier 2 can be easily and easily taken out.

By operating the cover 5 up and down in this manner, the IC carrier 2 can be inserted and removed.
Since the contact pin 3 and the latch means 8 are made to interlock with each other at an appropriate timing in correspondence with the vertical movement of the cover 5, the IC carrier 2 can be accurately operated without using a link mechanism in the IC socket of this type as in the conventional case. Can be inserted and removed. Therefore, the number of parts can be reduced, and since no metal parts are used, the assembly is easy and the product is inexpensive. Further, in particular, when the cover 5 is moved up and down, the pressing portion 3b of the contact pin 3 is disengaged from the action portion 7 as described above, so that the contact pin 3 is tilted with respect to the vertical movement stroke of the cover 5. The movement stroke can be reduced, and thus the dimension of the contact pin 3 can be reduced by the amount by which the tilt movement stroke is reduced.

[0022]

Effects of the Invention According to the present invention as described above, contactor
Extends the top pin from the arc-shaped spring part and from the arc-shaped spring part
Between the pressing part and the arc-shaped spring part
It has a contact part that comes into contact with the protruding lead,
The arcuate spring part is inside the IC socket and the pressing part is outside.
And the working part is inside the IC socket.
Since it is designed to engage with the pressing part from the contact pin,
Can be configured compactly, and the
Most of the contact pins are arranged to make the entire IC socket small.
Can be typed. Furthermore, the pressing part is located at the tip and the contact part is
Since it is located in the middle part, the lever principle when pressing the cover
Therefore, a small pressing force may be sufficient. Also, the action part is horizontal
The first surface that is slightly inclined or curved and almost the first surface
Is formed by a stepped cam surface consisting of a vertical second surface
Then, press the contact pin when it is pressed for a predetermined distance.
The downward tilting state is maintained, the pressing force becomes almost constant, and
Useless effort because the amount of contact pin to be pushed in is small.
To improve work efficiency and eliminate contact pins
The durability of is also improved. Also, the latch means is
It is urged more to form a latch action for the IC carrier
Move the locking position and the cover downwards against the urging force of the ammunition means.
Action causes contact on the second surface
Take the release position where the latched state is released while engaging the pin.
Because it is configured to obtain,
The operation timing of the contact pin and the latch should be properly adjusted.
It is done in minutes, and the operation is reliable.

[Brief description of the drawings]

FIG. 1 is a plan view of one embodiment of an IC socket according to the present invention.

FIG. 2 is a side sectional view for explaining the vertical movement of the cover in the embodiment of the IC socket according to the present invention.

FIG. 3 is a front vertical sectional view of an embodiment of an IC socket according to the present invention.

FIG. 4 is a partial vertical cross-sectional view showing the positional relationship between the action portion and the latch means in the normal state of the cover of the IC socket according to the present invention.

FIG. 5 is a partial vertical sectional view showing a state where the cover of the IC socket according to the present invention is being pushed down.

FIG. 6 is a partial vertical cross-sectional view showing a state when the cover of the IC socket according to the present invention is completely pushed down.

FIG. 7 is a side view of a conventional IC socket.

FIG. 8 is a vertical cross-sectional view of an IC carrier housed in a conventional IC socket.

FIG. 9 is a partial vertical sectional view for explaining the operation of the link mechanism in the conventional IC socket.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket body 2 IC carrier 3 Contact pin 3a Contact part 3b Pressing part 3c Circular spring part 4 Guide pin 5 Cover 6 Compression coil spring 7 Working part 7a First surface 7b Second surface 8 Latching means 9 Spindle 10 Torsional coil spring 11 Guide wall 12 Partition wall

Claims (2)

(57) [Claims] The method according to claim 1 to an IC carrier carrying the IC package is mounted on the socket body, an IC socket which is adapted to connect the contact pins planted on the lead and the socket body of the IC package,
A cover which is mounted on the socket body so as to be movable up and down through an ammunition means and has an action portion which allows the contact pin to be tilted by pushing the contact pin; and a cover which is pivotally supported on the socket body and which covers the cover body. The above IC by vertical movement
To be able to take the locking and unlocking position with respect to the carrier
And an IC socket provided with the latching means
Te, the contact pin, an arcuate spring portion, the circular arc
A pressing portion that extends from the spring portion and comes into contact with the acting portion, and the pressing portion.
The lead projecting between the pressure part and the arc-shaped spring part
And an arc-shaped spring portion,
Placed inside the IC socket with the above-mentioned pressing part on the outside.
And the above-mentioned operating portion is located inside the IC socket.
The action part is engaged with the pressing part and the contact part is moved by the downward movement of the cover.
And push down the contact pin to tilt it.
The first surface that is slightly inclined or curved than the horizontal surface, and
The above can be engaged so as to hold the depressed and tilted state.
Shaped with a stepped cam surface consisting of a first surface and a second surface that is almost perpendicular
Made, said latch means, IC calibration urged by bullets mover means
The latching position that latches the rear and the cover
Is moved downward against the biasing force of the above-mentioned ammunition means.
The above action part engages with the contact pin on the second surface
You can take the unlocked position where the latched state is released
When the cover is moved up and down, the I
An IC socket characterized in that the C carrier can be inserted and removed . 2. The IC socket according to claim 1, wherein the IC carrier is clamped from above and below by the latch means and the elastic contact pin.