JP2577368B2 - Method for manufacturing bus bar wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention [Industrial Application Field] The present invention relates to a bus bar wiring board of an electric junction box (junction block) used for electric wiring of an automobile, for example, and a current carrying value in a limited space. The present invention relates to a method of easily designing a bus bar group having a required width and manufacturing the bus bar group at a high yield.

[Conventional technology]

As shown in FIG. 3, a bus bar wiring board is generally provided with a plurality of bus bars 1A, 1B, 1C... Having a desired pattern on an insulating substrate 2 and standing at an end or an intermediate portion of each bus bar. Are formed so as to form an electrode group 4, 4 ', in which the tab terminals 3a, 3b, 3c...

As shown in FIG. 4, as a method of manufacturing such a bus bar wiring board, a single conductive thin plate is punched to form a large number of bus bars 1A, 1B, 1C. A method has been proposed in which a punched plate M is formed on the insulating substrate 2 and the connecting pieces 5 are cut off to make each bus bar independent (Japanese Patent Application Laid-Open No. Sho 47-47).
No. 44157). In the figure, a group of 3a ', 3b', 3c '... Are tab-shaped development parts, which are bent at the same time as the punching to form tab terminals.

[Problems to be solved by the invention]

If all the busbars arranged on the insulating substrate are manufactured as a series of punched plates M, each busbar has a tab-like developed portion, so that the developed busbar must be considered.
There are significant restrictions and difficulties in circuit design. For example, the bus bar 1B located between the bus bars 1A and 1C is for a large current, and it is preferable that the bus bar 1B except for the branch portion 1B 'is formed so as to have a uniform width. In order to form the tab-shaped unfolded portions 3a 'and 3c' of 1C, it is necessary to take the narrow portion 1b. In addition, bus bar 1B
In order to form the tab terminals 3b, the size of the punched plate M is not sufficient at the portion surrounded by the dashed line X, and a conductive thin plate having a size substantially indicated by the dashed line Y is required. Therefore, the arrangement density of the bus bars cannot be increased to the left, and the yield decreases.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a bus bar wiring board which solves the above-mentioned problems and which can easily design and manufacture a bus bar and has a high yield.

[Means for solving the problem]

In order to achieve the above object, the present invention provides a method of manufacturing a bus bar wiring board in which a large number of bus bars having upright tab terminals are arranged on an insulating substrate, wherein one conductive thin plate is formed. A bus bar group that can be punched out and placed on the insulating substrate as it is and formed with a mixture of at least one bus bar whose position and direction need to be rearranged before being disposed, and then rearranged The necessary bus bar has a tab-shaped development portion extending from one side to the other between the adjacent bus bars at the regular arrangement position, and the tab-shaped development portion of the bus bar is bent to form a tab terminal. The bus bar that needs to be rearranged is arranged at the regular position.

In FIG. 1, a group of bus bars 11A, 11B,... That can be disposed on the insulating substrate 12 as they are, is formed as a punched plate N integrally connected to each other via a connecting piece 15 as before.
Tabs 13a ', 13b', 13c '... Of each bus bar are bent upward or downward to form tab terminals 13a, 13b, 13c.
After being formed, it is adhered to the insulating substrate 12 or mounted on a mounting groove (not shown) provided corresponding to the pattern. Numeral 16 denotes a through hole for the tab terminal, through which a required tab terminal is penetrated downward or a tab terminal from a lower wiring board is penetrated upward. Then, after disposing the punching plate N, the connecting piece 15 is cut off by an appropriate means.

On the other hand, the bus bar 11X is formed by punching separately from the punching plate N, that is, the group of bus bars 11A, 11B..., And the tab-shaped development portion 13x 'is bent to form the tab terminal 13x. As shown in the figure, it is arranged between the bus bars 11A and 11B.

Busbar 11 formed separately from a large number of busbar groups
The selection of X should give priority to the one that has the greatest influence on the arrangement of other busbars in the busbar circuit design. For example, one or several pieces may be selected on the basis of one having a complicated circuit pattern and a large number of tab terminals, or one that minimizes the size of the conductive thin plate required for busbar formation by separate formation. In the figure, busbar 11X
Is formed for a relatively wide, large current, but is also applicable to a narrow, small current like the bus bar 11B.

(Operation)

According to the method of the present invention, the tab-shaped development portions 13a ', 13b', 13c ',... Of the punching plate N composed of a group of bus bars 11A, 11B.
Are folded to form the tab terminals 13a, 13b, 13c,... On a jig (not shown).
Bus bar 11X formed by bending 13x into bus bars 11A and 11B
The busbar wiring board 10 is assembled by placing the insulating substrate 12 on the predetermined position therebetween.

When a jig is used, there is no need to provide a hole for punching in the insulating substrate 12 when cutting off the connecting piece 15 thereon.

Since at most several bus bars X are formed separately from the punching plate N, the bus bar X hardly affects the pattern of the entire bus bar, and its direction and position are not changed.

The size of the conductive thin plate P necessary for forming the punched plate N and the bus bar X is set at a small plate portion P at one corner (upper right corner in the figure) of the punched plate N as shown in FIG. ′ Is sufficient, and the small plate portion P ′ can be formed close to the punched plate N, so that the minimum size is sufficient and the waste is small as a whole.

Effect of the Invention As described above, the present invention is a method for manufacturing a bus bar wiring board in which a large number of bus bars having upright tab terminals are arranged on an insulating substrate, and a single conductive thin plate is punched out. It is necessary to form a bus bar group that can be arranged on the insulating substrate as it is and at least one bus bar whose position and direction need to be rearranged before the arrangement, and to form and rearrange the bus bar. A bus bar has a tab-shaped development portion extending from one side to the other between the adjacent bus bars at the regular arrangement position, and the tab-shaped development portion of the bus bar is bent to form a tab terminal, Since the busbars that need to be rearranged are arranged at the regular positions, the circuit design and manufacture of the busbars are easy, and this is wasteful when punching from a conductive thin plate. The generation of portions can be minimized, and the yield is improved.

[Brief description of the drawings]

FIG. 1 is an exploded view of a bus bar showing a method of manufacturing a bus bar wiring board of the present invention, FIG. 2 is a plan view of a bus bar wiring board in which the bus bar is disposed on an insulating substrate, and FIG. 3 is a conventional bus bar wiring board. FIG. 4 is a development view of the bus bar of FIG. 10 ... Bus bar wiring board, 11A, 11B ... 11X ... Bus bar, 12
…… Insulated substrate, 13a, 13b, 13c… 13x …… Tab terminal, 13a ′,
13b ', 13c' ... 13x '... tab-shaped unfolded part, 15 ... connecting piece,
N ... Punched plate.

Claims (1)

(57) [Claims] 1. A method for manufacturing a bus bar wiring board comprising a plurality of bus bars having tab terminals in an upright state arranged on an insulating substrate, wherein a single conductive thin plate is punched out, and A bus bar group that can be arranged on the insulating substrate and at least one bus bar whose position and direction need to be rearranged before the arrangement are hybridized and formed, and the bus bar that needs to be rearranged is a regular arrangement. A tab-shaped development portion extending from one side to the other is interposed between the adjacent bus bars at the position, and the tab-shaped development portion of the bus bar is bent to form a tab terminal, and at the regular position, A method of manufacturing a bus bar wiring board, comprising arranging the bus bar that needs to be rearranged.