JP2024131746A - Management device and management method - Google Patents

Abstract

To provide a management device capable of easily performing a factor investigation of an inspection result of a substrate by an inspection device.SOLUTION: A management device 100 comprises: an acquisition part 110 that acquires: (i) a threshold value that becomes a reference for determining whether or not a state of a component mounting device is a normal or an abnormal by comparing a measurement value of a sensor 370 provided by the component mounting device for mounting a component to a substrate; (ii) a first measurement value that is a measurement value when mounting the component to a first substrate; (iii) a determination result of the state of the component mounting device when the component is mounted to the first substrate, determined on the basis of the threshold value and the first measurement value; and (iv) a first inspection result as an inspection result of the first substrate by an inspection device 350 that inspects the substrate to which the component is mounted by the component mounting device; and a control part 120 that integrally displays the threshold value, the first measurement value, the determination result, and the first inspection result to a display part 210.SELECTED DRAWING: Figure 1

Description

The present invention relates to a management device and a management method.

Conventionally, devices that mount components on a board and inspection devices that inspect boards on which components are mounted have been disclosed (see, for example, Patent Document 1).

JP 2010-212395 A

For example, if the inspection results from an inspection device that inspects boards on which components are mounted indicate a defect in the board, the inspection results are fed back to the device that mounts components on the board, causing part of the operation of the device to be changed or stopped. In addition, such inspection results are notified to the user, for example, as an image on a display. At this time, if the inspection results indicate a defect in the board, the user will look at the inspection results displayed on a display, for example, and investigate the reason why the board was determined to be defective. However, the inspection results are often enormous, and it can be difficult for the user to look at the displayed inspection results and investigate the reason why the board was determined to be defective.

The present invention provides a management device that can easily determine the cause of the results of a board inspection performed by an inspection device.

The management device according to one aspect of the present invention includes an acquisition unit that acquires (i) a threshold value that is a reference for determining whether the state of the component mounting device is normal or abnormal by comparing with a measurement value of a sensor provided in the component mounting device for mounting components on a board, (ii) a first measurement value that is the measurement value when the component is mounted on a first board, (iii) a judgment result of the state of the component mounting device when the component is mounted on the first board, which is judged based on the threshold value and the first measurement value, and (iv) a first inspection result that is an inspection result of the first board by an inspection device that inspects the board on which the component is mounted by the component mounting device, and a control unit that causes the threshold value, the first measurement value, the judgment result, and the first inspection result to be displayed collectively on a display unit.

The management method according to one aspect of the present invention is a management method executed by a computer, and includes an acquisition step of acquiring: (i) a threshold value serving as a reference for judging whether the state of the component mounting device is normal or abnormal by comparing with a measurement value of a sensor provided in the component mounting device for mounting components on a board; (ii) a first measurement value which is the measurement value when the component is mounted on a first board; (iii) a judgment result of the state of the component mounting device when the component is mounted on the first board, which is judged based on the threshold value and the first measurement value; and (iv) a first inspection result which is an inspection result of the first board by an inspection device that inspects the board on which the component is mounted by the component mounting device; and a control step of displaying the threshold value, the first measurement value, the judgment result, and the first inspection result all at once on a display unit.

The present invention provides a management device that can easily determine the cause of the results of a board inspection performed by an inspection device.

FIG. 1 is a block diagram showing a functional configuration of a component mounting system according to an embodiment. FIG. 2 is a diagram showing an image displayed on a display unit according to the embodiment. FIG. 3 is a diagram showing an image displayed on a display unit according to the embodiment. FIG. 4 is a diagram showing an image displayed on the display unit according to the embodiment. FIG. 5 is a diagram showing an image displayed on a display unit according to the embodiment. FIG. 6 is a flowchart illustrating a processing procedure of the management device according to the embodiment.

The following describes in detail the embodiments of the present invention with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims of the present invention are described as optional components.

In addition, each figure is a schematic diagram and is not necessarily an exact illustration. Therefore, for example, the scales of each figure do not necessarily match. In addition, in each figure, substantially the same configuration is given the same reference numerals, and duplicate explanations are omitted or simplified.

In addition, in this specification, terms that indicate relationships between elements, such as "same," as well as numerical values and numerical ranges, are not expressions that express only the strict meaning, but are expressions that include a substantially equivalent range, for example, a difference of about a few percent (e.g., about 10%).

In addition, in this specification, ordinal numbers such as "first" or "second" do not refer to the number or order of components, unless otherwise specified, but are used for the purpose of avoiding confusion between similar components and distinguishing between components.

(Embodiment)
[composition]
First, the configuration of a component mounting system according to an embodiment will be described.

Figure 1 is a block diagram showing the functional configuration of a component mounting system 400 according to an embodiment.

The component mounting system 400 is a system for producing display panels and the like by bonding components to a substrate. In the component mounting system 400, for example, an anisotropic conductive member such as an ACF (Anisotropic Conductive Film) is attached to an electrode portion provided on the substrate, and the substrate and components are thermocompression bonded via the anisotropic conductive member.

An example of the substrate is a flexible substrate made of resin. The substrate may also be a display panel such as a liquid crystal panel using a glass substrate or an organic EL (Electro-Luminescence) panel.

Examples of components include IC (Integrated Circuit) chips, TCP (Tape Carrier Package), COF (Chip on Film), and FPC (Flexible Printed Circuit).

The component mounting system 400 includes a component mounting facility 300 and a management system 200.

The component mounting equipment 300 is a component mounting line for mounting components onto a board.

The component mounting equipment 300 includes a loader 310, an ACF attachment device 320, a temporary pressure bonding device 330, a full pressure bonding device 340, an inspection device 350, an unloader 360, and a sensor 370. The loader 310 is connected to the ACF attachment device 320, the temporary pressure bonding device 330, the full pressure bonding device 340, the inspection device 350, and the unloader 360 in this order. The board is transported from the loader 310 to the ACF attachment device 320, the temporary pressure bonding device 330, the full pressure bonding device 340, the inspection device 350, and the unloader 360 in this order.

The loader 310 is a device that transports the substrate into the ACF attachment device 320.

The loader 310 is realized, for example, by a moving mechanism that transports the substrate, and a computer that controls the moving mechanism and other mechanisms of the loader 310 and communicates with the management system 200. The computer is realized, for example, by a communication interface for communicating with the management system 200, etc., a non-volatile memory that stores a program, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, and a processor that executes the program.

The ACF attachment device 320 is a device that receives, for example, a rectangular substrate carried in from the loader 310, and attaches an ACF, which is an adhesive material, to each of a number of electrode portions on the periphery of the substrate. In other words, the ACF attachment device 320 performs an attachment operation in which the ACF is attached to the electrode portions of the substrate. The ACF attachment device 320 then carries out the substrate with the ACF attached to the temporary pressure bonding device 330. Each of the multiple electrode portions is, for example, composed of a number of electrodes.

The ACF attachment device 320 is also provided with a sensor 371.

The sensor 371 is a sensor that detects the state of particles or the amount of static electricity in the ACF attachment device 320. The ACF attachment device 320 judges whether its own device is normal or abnormal based on the detection result of the sensor 371. The judgment result is output to, for example, the management system 200 (specifically, the management device 100).

The ACF attachment device 320 is realized, for example, by a moving mechanism for transporting the substrate, an attachment mechanism for attaching the ACF to the substrate, and a computer for controlling the moving mechanism and attachment mechanism of the ACF attachment device 320 and for communicating with the management system 200. The computer is realized, for example, by a communication interface for communicating with the management system 200, etc., a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, and a processor for executing the program.

The temporary bonding device 330 is a device that performs temporary bonding work by mounting components on the area of the board where the ACF is attached (i.e., the area to be bonded) and temporarily bonding the components. For example, the temporary bonding device 330 temporarily bonds components supplied from a component supply device (not shown) to the board via the ACF. The component supply device is a device that performs component supply work by supplying components to the temporary bonding device 330. The temporary bonding device 330 receives the board that has been unloaded from the ACF attachment device 320, and performs temporary bonding work by mounting the components supplied from the component supply device on the area of the board where the ACF is attached and temporarily bonding the components. The temporary bonding device 330 then unloads the board to which the components have been temporarily bonded to the main bonding device 340.

In addition, the temporary pressure bonding device 330 is provided with a sensor 372.

The sensor 372 is a sensor that detects the state of particles or the amount of static electricity in the temporary bonding device 330. The temporary bonding device 330 judges whether its own device is normal or abnormal based on the detection result of the sensor 372. The judgment result is output to the management system 200, for example.

The pre-bonding device 330 is realized, for example, by a moving mechanism for transporting the substrate, a pre-bonding mechanism such as a pre-bonding head for pre-bonding components to the substrate, and a computer for controlling the moving mechanism and pre-bonding mechanism of the pre-bonding device 330 and for communicating with the management system 200. The computer is realized, for example, by a communication interface for communicating with the management system 200, etc., a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, and a processor for executing the program.

The final bonding device 340 is a device that performs the final bonding operation of final bonding (i.e., thermocompression bonding) the components that have been provisionally bonded to the board by the provisional bonding device 330. In this way, the electrodes formed on the board and the components are electrically connected via the ACF. In other words, the components are mounted on the board by this final bonding.

The pressure bonding device 340 is also provided with a sensor 373.

The sensor 373 is a sensor that detects the state of particles or the amount of static electricity in the main bonding device 340. The main bonding device 340 determines whether the device is normal or abnormal based on the detection result of the sensor 373. The determination result is output to the management system 200, for example.

The bonding apparatus 340 is realized, for example, by a moving mechanism for transporting the substrate, a bonding mechanism such as a bonding head for bonding components to the substrate, and a computer for controlling the moving mechanism and bonding mechanism of the bonding apparatus 340 and for communicating with the management system 200. The computer is realized, for example, by a communication interface for communicating with the management system 200, etc., a non-volatile memory in which a program is stored, a volatile memory which is a temporary storage area for executing the program, an input/output port for sending and receiving signals, and a processor for executing the program.

The ACF attachment device 320, the temporary pressure bonding device 330, and/or the final pressure bonding device 340 are examples of component mounting devices. The component mounting devices perform component mounting work to mount components on a board that has been brought in. A mounted board is produced by this component mounting work.

In the following, the ACF attachment device 320, the temporary pressure bonding device 330, and/or the final pressure bonding device 340 may be referred to as component mounting devices.

The bonding device 340 transports the produced mounting board to the inspection device 350.

The inspection device 350 is a device that inspects the board (mounted board) received from the main pressure bonding device 340. For example, the inspection device 350 inspects the mounting state of the components on the board. The inspection device 350 then notifies the management system 200 of the results of the inspection as the board inspection results.

The inspection device 350 includes, for example, an inspection camera. The inspection camera captures an image of the components mounted on the board from below through the board. The entire board, or the portion of the board on which the components are mounted, is configured as a translucent material. Thus, an inspection image is generated by capturing an image with the inspection camera, showing the joint portion between the component and the board. The inspection device 350 determines whether the board is good or defective by, for example, using image processing to compare the inspection image with a correct answer image stored in advance. In other words, the inspection device 350 determines whether the board is good or defective, and outputs the determination result to the management device 100.

The inspection device 350 is realized, for example, by an indentation inspection device and/or a component misalignment inspection device. For example, the inspection device 350 inspects the mounting state of the components on the board (specifically, the mounting state of COG (chip on glass) or FOG (film on glass)) after the mounting process (for example, the ACF attachment process, the temporary pressure bonding process, and the main pressure bonding process), the number of indentations of the conductive particles contained in the ACF attached to the board, the indentation contrast, and the misalignment of the components (specifically, ICs or FPCs, etc.). For example, the inspection device 350 inspects the misalignment of the components on the board in the XYθ directions.

The unloader 360 is a device that transports or stores the substrate received from the main bonding device 340 to a device downstream of the component mounting equipment 300.

The unloader 360 is realized, for example, by a moving mechanism for transporting substrates, and a computer that controls the moving mechanism and other mechanisms equipped in the unloader 360 and communicates with the management system 200. The computer is realized, for example, by a communication interface for communicating with the management system 200, etc., a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, and a processor that executes the program.

Sensor 370 is a sensor for detecting the state of component mounting devices such as ACF attachment device 320, temporary pressure bonding device 330, and/or full pressure bonding device 340. For example, sensor 370 is a sensor group including sensor 371, sensor 372, and sensor 373.

Note that in the following, when there is no particular distinction between sensors 371, 372, and 373, they may be described as sensor 370.

Sensor 370 detects, for example, the number of particles, the amount of static electricity, the load during the main bonding in main bonding device 340, the temperature of the joint between the component and the substrate in main bonding device 340, and/or the time for main bonding. For example, sensor 370 is realized by a particle sensor, a static electricity sensor, a load sensor, a load cell, and/or a thermocouple.

The measurement items detected by sensors 371, 372, and 373 may be the same or different.

The management system 200 is a system for managing each device of the component mounting equipment 300. For example, the management system 200 communicates with each device of the component mounting equipment 300 to obtain various information from each device, and notifies the user of the obtained information using images or the like. In addition, for example, the management system 200 manages (stores) the thresholds and mounting conditions used by each device of the component mounting equipment 300, and changes the thresholds and mounting conditions used by each device of the component mounting equipment 300 based on instructions (input) from the user.

The management system 200 includes a management device 100, a display unit 210, an input unit 220, and a memory unit 230.

The management device 100 is a device that communicates with each device in the component mounting equipment 300 to obtain various information from each device, and notifies the user of the obtained information using images, etc.

The management device 100 is, for example, a computer, and is realized by a communication interface for communicating with each device of the component mounting system 400, a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input/output port for sending and receiving signals, and a processor that executes the program.

The management device 100 includes an acquisition unit 110 and a control unit 120.

The acquisition unit 110 is a processing unit that acquires various information from the component mounting equipment 300, the input unit 220, the memory unit 230, and the like. For example, the acquisition unit 110 acquires a threshold value that serves as a reference for determining whether the state of the component mounting device is normal or abnormal by comparing it with the measurement value of the sensor 370, a first measurement value, a determination result of the state of the component mounting device, and a first inspection result that is an inspection result of the first board by the inspection device 350.

The threshold here is, for example, (i) a threshold that serves as a reference for determining whether the state of the component mounting device is normal or abnormal by comparing with the measured value of a sensor 370 provided in a component mounting device for mounting components on a board. In this embodiment, the component mounting devices are the ACF attachment device 320, the temporary pressure bonding device 330, and the full pressure bonding device 340. For example, the acquisition unit 110 acquires a threshold value from the storage unit 230 or the ACF attachment device 320 for the ACF attachment device 320 to determine the state of its own device by comparing with the measured value of the sensor 371. Also, for example, the acquisition unit 110 acquires a threshold value from the storage unit 230 or the temporary pressure bonding device 330 for the temporary pressure bonding device 330 to determine the state of its own device by comparing with the measured value of the sensor 372. Also, for example, the acquisition unit 110 acquires a threshold value from the storage unit 230 or the temporary pressure bonding device 340 for the full pressure bonding device 340 to determine the state of its own device by comparing with the measured value of the sensor 373.

The first measurement value is, for example, (ii) a measurement value when a component is mounted on the first board. The first board is an example of a board on which components are mounted by a component mounting device. For example, the acquisition unit 110 acquires the measurement values of sensors 371, 372, and 373 when the ACF attachment device 320, the temporary pressure bonding device 330, and the permanent pressure bonding device 340 attach an ACF to a board (first board), temporarily pressure bond the components, and then permanently bond them, as the first measurement value from each of the sensors 371, 372, and 373 (specifically, the ACF attachment device 320, the temporary pressure bonding device 330, and the permanent pressure bonding device 340 equipped with the sensors 371, 372, and 373).

The judgment result is (iii) a judgment result of the state of the component mounting device when the component is mounted on the first board, which is judged based on the threshold value and the first measurement value. For example, the acquisition unit 110 acquires the judgment results of the state of the ACF attachment device 320, the temporary pressure bonding device 330, and the final pressure bonding device 340 from each of the ACF attachment device 320, the temporary pressure bonding device 330, and the final pressure bonding device 340, based on the first measurement value and the threshold value detected by the sensors 371, 372, and 373 when the ACF attachment device 320, the temporary pressure bonding device 330, and the final pressure bonding device 340 attach the ACF to the board, temporarily pressure bond the component, and then perform the final pressure bonding.

The first inspection result is, for example, (iv) the inspection result of the first board by an inspection device 350 that inspects a board on which components are mounted by a component mounting device. For example, the acquisition unit 110 acquires the inspection result of the first board from the inspection device 350.

Furthermore, for example, the acquisition unit 110 acquires information (also simply referred to as input) input by a user using, for example, the input unit 220. For example, the acquisition unit 110 acquires an input for changing a threshold value. Also, for example, the acquisition unit 110 acquires an input for changing the mounting conditions for components on a board by a component mounting device.

The information acquired by the acquisition unit 110 may be acquired by the acquisition unit 110 via, for example, a communication interface provided in the management device 100 that communicates with an external server.

The control unit 120 is a processing unit that controls the display unit 210 based on the information acquired by the acquisition unit 110, specifically, that controls the image displayed on the display unit 210. For example, the control unit 120 causes the display unit 210 to display the threshold value, the first measurement value, the judgment result, and the first test result acquired by the acquisition unit 110 all at once.

Also, for example, if the first inspection result is defective, the control unit 120 causes the display unit 210 to display the second measurement value for the second substrate for which the inspection result by the inspection device 350 was defective, together with the first measurement value.

The second board is an example of a board on which components are mounted by a component mounting device. The second board is, for example, a board on which components have been mounted by a component mounting device and inspected by inspection device 350 prior to the first board. The first board and the second board are, for example, mounting boards on which the same type of components are mounted.

The second measurement value is, for example, a measurement value when a component is mounted on the second board. For example, the acquisition unit 110 acquires the measurement values of sensors 371, 372, and 373 when the ACF attachment device 320, the temporary bonding device 330, and the permanent bonding device 340 attach an ACF to a board (second board), temporary bond the component, and then permanently bond the component as the second measurement value from each of the sensors 371, 372, and 373 (specifically, the ACF attachment device 320, the temporary bonding device 330, and the permanent bonding device 340 that are equipped with the sensors 371, 372, and 373).

For example, when the first inspection result indicates that the first board is defective, the control unit 120 causes the display unit 210 to display, together with the first measurement value, the second measurement value, which is the measurement value detected by the sensors 371, 372, and 373 when a second board that was produced earlier than the first board and for which the inspection result by the inspection device 350 was defective, was produced.

For example, the control unit 120 changes various pieces of information used by the component mounting device based on the information acquired by the acquisition unit 110. For example, the control unit 120 changes a threshold value based on the input acquired by the acquisition unit 110. For example, the control unit 120 causes the component mounting device to change mounting conditions based on the input acquired by the acquisition unit 110.

Each processing unit, such as the acquisition unit 110 and the control unit 120, is realized, for example, by a processor and a memory in which a control program executed by the processor is stored.

The display unit 210 is a display that displays images based on the control of the management device 100 (more specifically, the control unit 120). The display unit 210 is realized by a display device such as a liquid crystal panel or an organic EL panel, for example.

The input unit 220 is a user interface that accepts user operations. The input unit 220 is realized by a mouse, a keyboard, a touch panel, and/or hardware buttons, etc.

The display unit 210 and the input unit 220 may be integrated into one device such as a touch panel display.

The memory unit 230 is a storage that stores the threshold value of the sensor 370, and the mounting conditions for mounting components on a board in each device, such as the main bonding device 340, provided in the component mounting equipment 300. The memory unit 230 also stores a production history that includes, for example, the mounting conditions at the time of production of a mounted board produced in the past, the detection results (measured values) of the sensor 370 at the time of said production, and/or the inspection results of said mounted board by the inspection device 350.

The storage unit 230 is realized, for example, by a hard disk drive (HDD) or flash memory.

[Example images]
Next, a specific example of an image displayed on the display unit 210 will be described.

Figures 2 to 5 each show an image displayed on the display unit 210 according to an embodiment of the present invention.

Figure 2 shows a specific example of an image (also called a collective image) in which the threshold value, the first measurement value, the judgment result, and the first inspection result are displayed together on the display unit 210.

The "Panel No." is, for example, identification information that uniquely identifies each board on which a component is mounted.

"Amount of charge," "Particles," and "Main compression load" are measurement items detected by sensor 370.

"Threshold A0" and "Threshold B0" are specific examples of thresholds.

"A1" and "A2" are specific examples of measurement values.

Information indicating positional deviations, such as "indentation," "indentation contrast," and "positional deviation X," are inspection items inspected by the inspection device 350.

The "OK" and "NG" in the test results indicate the test results obtained by the testing device 350.

In this example, the cells with the inspection result "NG" are hatched when the board is judged to be defective.

In this example, the judgment result is indicated by the presence or absence of hatching in the cell showing the measured value. For example, a hatched "G3" in a cell showing the measured value indicates that the judgment result is abnormal, and an unhatched "A1" in a cell showing the measured value indicates that the judgment result is normal.

The display of the judgment result may be realized in any display manner other than hatching. For example, if the judgment result is abnormal (e.g., if the measurement value from sensor 370 exceeds a threshold value), the cell of the corresponding measurement value may be displayed in red, and if the judgment result is normal (e.g., if the measurement value from sensor 370 is equal to or less than the threshold value), the cell of the corresponding measurement value may be displayed in white.

Also, for example, the user can operate the input unit 220 to select the "select" icon to input changes to the threshold value or changes to the implementation conditions.

Figure 3 is a diagram showing a specific example of an image (also called a threshold change image) that is displayed on the display unit 210 when accepting input for changing the threshold. Specifically, Figure 3 is a diagram showing a specific example of an image that is displayed on the display unit 210 when the user selects "Change" in the cell showing "Threshold G0" in the image shown in Figure 2.

The threshold change image includes, for example, information indicating the current threshold and a reception section that receives input of the changed threshold. In the example shown in FIG. 3, the current threshold is shown in the threshold change image as "Current setting value: XXX (for example, G0)."

For example, the user inputs the changed threshold value by operating the input unit 220. In the example shown in FIG. 3, the changed threshold value is displayed in the threshold change image as "New setting value: XXX". Based on the input, the control unit 120 changes the threshold value stored in the memory unit 230, for example, or sends the changed threshold value to the component mounting device, thereby changing the threshold value used by the component mounting device.

For example, the worker selects a cell in the batch image that indicates the threshold value to be changed. The acquisition unit 110 acquires the selection via the input unit 220, and when the acquisition unit 110 acquires the selection, the control unit 120 displays the threshold change image shown in FIG. 3 on the display unit 210. The worker inputs a new setting value (threshold value) in the threshold change image and selects the decision button. The acquisition unit 110 acquires the new threshold value via the input unit 220, and when the acquisition unit 110 acquires the new threshold value, the control unit 120 changes the threshold value stored in the storage unit 230 to the new threshold value acquired by the acquisition unit 110, for example. In addition, the control unit 120 or the corresponding device in the component mounting equipment 300 redoes the judgment based on the changed threshold value, and when the control unit 120 subsequently displays the batch image on the display unit 210, it updates the batch image based on the new judgment result, that is, based on the new threshold value. As a result, for example, information indicating the judgment result in the batch image (for example, the display mode such as the color of the cell) is changed.

Figure 4 is a diagram showing a specific example of an image (also called a mounting condition change image) displayed on the display unit 210 when accepting input for changing the mounting conditions of the component mounting device. Specifically, Figure 4 is a diagram showing a specific example of an image displayed on the display unit 210 when the user selects "Change" in the cell showing "Main compression bonding device" in the location showing the configuration of the component mounting equipment 300 in the image shown in Figure 2, or "Change" in the cell showing "Main compression bonding load P1-1" or "Main compression bonding load P2-1", etc.

The mounting condition change image includes, for example, information indicating the current mounting conditions and a reception section that receives input of the changed mounting conditions. In the example shown in FIG. 4, specific mounting conditions such as "maximum load," "lowering speed," "ascending speed," and "pressurization time" are shown in the mounting condition change image. In the example shown in FIG. 4, the current mounting conditions are shown in the mounting condition change image under the "current setting value" and next to specific mounting conditions such as "maximum load" and "lowering speed" as "xxx."

For example, the user inputs the changed mounting conditions by operating the input unit 220. In the example shown in FIG. 4, the changed mounting conditions are displayed in the mounting condition change image as "XXX". Based on the input, the control unit 120 changes the mounting conditions stored in the storage unit 230, for example, or sends the changed mounting conditions to the component mounting device, thereby changing the mounting conditions of the component mounting device.

For example, the worker selects a cell in the collective image that indicates the device for which the mounting conditions are to be changed. The acquisition unit 110 acquires the selection via the input unit 220, and when the acquisition unit 110 acquires the selection, the control unit 120 causes the display unit 210 to display the mounting condition change image shown in FIG. 4. The worker inputs new setting values (mounting conditions) in the mounting condition change image and selects the decision button. The acquisition unit 110 acquires the new mounting conditions via the input unit 220, and when the acquisition unit 110 acquires the new mounting conditions, the control unit 120 changes the mounting conditions stored in the storage unit 230, for example, to the new mounting conditions acquired by the acquisition unit 110. In addition, the control unit 120 notifies the corresponding device in the component mounting equipment 300, whose mounting conditions have been changed, of the new mounting conditions and changes the mounting conditions to the new mounting conditions. As a result, the device performs processing under the new mounting conditions.

Note that while FIG. 4 describes changing the mounting conditions of the main pressure bonding device 340, the mounting conditions of devices provided in the component mounting equipment 300, such as the ACF attachment device 320 and the temporary pressure bonding device 330, may also be changed in the same way. When a corresponding cell is selected in the collective image, a mounting condition change image for changing the mounting conditions of the device is displayed, and the mounting conditions may be changed.

5 is a diagram showing a specific example of an image (also called an NG comparison image) when the second measurement value and the first measurement value are displayed together on the display unit 210. Specifically, FIG. 5 is a diagram showing a specific example of an image displayed on the display unit 210 when the user selects a cell in the image shown in FIG. 2 in which the indentation of the inspection of panel No. 3 is indicated as "NG" and further selects "display history" in the cell in which the "indentation" is indicated. For example, when the acquisition unit 110 acquires the input, the control unit 120 extracts, from past data such as past measurement values and past inspection results, a board whose indentation in the inspection result was previously NG, that is, a board that the inspection device 350 judged to be defective in the past indentation inspection, and displays data such as the measurement values and inspection results of the extracted board and data such as the measurement values and inspection results of the board corresponding to the cell selected by the user (in this example, the board of panel No. 3) on the display unit 210 all at once. In the example shown in FIG. 5, panel No. The measured values of the substrate in panel 3 are an example of a first measured value, and the measured values of the substrates in panel A and panel B are an example of a second measured value.

In addition, in this example, the cells with the measurement values when the inspection result is "NG", that is, when the board is judged to be defective, are hatched. For example, "105" and "280" hatched in the cells showing the measurement values indicate that the judgment result is abnormal, while "80" and other values not hatched in the cells showing the measurement values indicate that the judgment result is normal.

This allows the user to compare past history with the current inspection result at a glance, making it easier for the user to determine the cause when the inspection result is bad. For example, when the inspection result of the board No. 3 for the "indentation" inspection item is "NG" (i.e., defective), the measured values by the sensor 370 are all within the threshold (i.e., normal). Here, for example, an NG comparison image as shown in FIG. 5 is displayed to display a list of past data in which the inspection result of the "indentation" inspection item is "NG". From the NG comparison image, it is assumed that the measured value trends of the board No. 3 and the board of panel A are similar. In such a case, for example, when the cause of the inspection result of the board of panel A being "NG" is "sensor B", the worker can determine that the cause of the inspection result of the board No. 3 being "NG" is also likely to be sensor B. In this way, when the same inspection item is NG, it can be used as a basis for making a decision, such as replacing related parts or units.

The display mode may be changed based on the magnitude of the difference between the threshold value and the measured value. For example, for a measured value of a board determined to be defective (e.g., a measured value greater than the threshold value), a cell may be displayed in a different manner depending on whether the difference between the threshold value and the measured value is less than 10 or 10 or greater.

This allows the user to easily see at a glance how far a measurement value that is determined to be abnormal is from the threshold.

[Processing Procedure]
Next, a process procedure of the management device 100 according to the embodiment will be described in detail.

Figure 6 is a flowchart showing the processing steps of the management device 100 according to the embodiment.

The acquisition unit 110 acquires (i) a threshold value that serves as a reference for determining whether the state of the component mounting device is normal or abnormal by comparing it with the measurement value of a sensor 370 provided in the component mounting device for mounting components on a board, (ii) a first measurement value that is the measurement value when a component is mounted on the first board, (iii) a judgment result of the state of the component mounting device when a component is mounted on the first board, which is judged based on the threshold value and the first measurement value, and (iv) a first inspection result that is the inspection result of the first board by an inspection device 350 that inspects a board on which a component is mounted by the component mounting device (S10).

Next, the control unit 120 causes the display unit 210 to display the threshold value, the first measurement value, the judgment result, and the first test result acquired by the acquisition unit 110 all at once (S20).

[Effects, etc.]
Below, examples of technologies that can be obtained from the disclosure of this specification will be given, and effects and the like that can be obtained from the exemplified technologies will be described.

Technology 1 is a management device 100 including an acquisition unit 110 that acquires (i) a threshold value that is a reference for judging whether the state of the component mounting device is normal or abnormal by comparing with the measurement value of a sensor 370 provided in the component mounting device for mounting components on a board, (ii) a first measurement value that is a measurement value when a component is mounted on a first board, (iii) a judgment result of the state of the component mounting device when a component is mounted on the first board, which is judged based on the threshold value and the first measurement value, and (iv) a first inspection result that is an inspection result of the first board by an inspection device 350 that inspects a board on which a component is mounted by the component mounting device, and a control unit 120 that causes the display unit 210 to display the threshold value, the first measurement value, the judgment result, and the first inspection result all at once.

The component mounting device is, for example, an ACF attachment device 320, a temporary pressure bonding device 330, and/or a full pressure bonding device 340.

This allows users to easily compare the inspection results and measurement values for each board at a glance, making it easier for users to determine the cause when inspection results are poor.

Technology 2 is the management device 100 described in Technology 1, in which the acquisition unit 110 further acquires an input for changing the threshold, and the control unit 120 changes the threshold based on the input.

This allows the user to reset the threshold to an appropriate value based on the test results.

Technology 3 is the management device 100 described in Technology 1 or 2, in which the acquisition unit 110 acquires input for changing the mounting conditions of components on a board by a component mounting device, and the control unit 120 causes the component mounting device to change the mounting conditions based on the input.

This allows the user to reset the mounting conditions to appropriate values based on the inspection results.

Technology 4 is a management device 100 according to any one of techniques 1 to 3, in which the control unit 120 causes the display unit 210 to display, when the first inspection result is defective, a second measurement value for a second substrate for which the inspection result by the inspection device 350 is defective, together with the first measurement value, when the first inspection result is defective.

The second board is, for example, a board on which components have been mounted and inspected prior to the first board.

This allows the user to compare past history with the current inspection result at a glance, making it easier for the user to determine the cause when the inspection result is defective. For example, even if the inspection result is defective, if the threshold setting of the sensor 370 is too loose, there may be no measured value exceeding the threshold, making it difficult to determine the cause of the defect. Also, for example, even if the inspection result is defective, if the threshold setting is too strict, abnormal measured values exceeding the threshold may be detected by multiple sensors 370, making it difficult to determine the cause of the defect. In such a case, for example, the worker compares the measured value (second measured value) by the sensor 370 when a component is mounted on a board (second board) on which a defect occurred in the past inspection result with the measured value (first measured value) of the current time, and examines whether there is a similar tendency between the two. This makes it possible to determine the cause without relying on the threshold, making it easier to determine the cause. Furthermore, since the threshold setting can be reviewed or changed based on the inspection result, the productivity of mounted boards by the component mounting equipment 300 can be improved while suppressing the occurrence of defective products in the mounted boards.

Technology 5 is a management method executed by a computer such as the management device 100, and includes an acquisition step (S10) of acquiring (i) a threshold value serving as a reference for judging whether the state of the component mounting device is normal or abnormal by comparing with the measurement value of a sensor 370 provided in the component mounting device for mounting components on a board, (ii) a first measurement value that is a measurement value when a component is mounted on a first board, (iii) a judgment result of the state of the component mounting device when a component is mounted on the first board, which is judged based on the threshold value and the first measurement value, and (iv) a first inspection result that is an inspection result of the first board by an inspection device 350 that inspects a board on which a component is mounted by the component mounting device, and a control step (S20) of displaying the threshold value, the first measurement value, the judgment result, and the first inspection result all at once on the display unit 210.

This provides the same effect as the management device 100.

Note that the comprehensive or specific aspects of the present disclosure may be realized in a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a computer-readable CD-ROM, or in any combination of a system, a method, an integrated circuit, a computer program, and a recording medium.

Other Embodiments
Although the management device and the like according to the present embodiment have been described above based on the above embodiment, the present invention is not limited to the above embodiment.

For example, the location and number of inspection devices 350 in the component mounting equipment 300 may be arbitrary. For example, the inspection device 350 may be located in the process next to the unloader 360, or may be located in both the process next to the main pressure bonding device 340 and the process next to the unloader 360.

The management device 100 may also control a mechanism provided in the component mounting equipment 300. In this case, for example, the component mounting device may not need to have a computer for controlling the mechanism.

Furthermore, for example, the management device 100 may determine the state of the component mounting device based on the threshold value and the first measurement value.

For example, the management device 100 may be realized as a single stand-alone computer, or may be realized by a computer that controls equipment such as the component mounting equipment 300. In other words, any device in the component mounting equipment 300 may be realized as the management device 100 by executing the processing performed by the management device 100.

Also, for example, in the above embodiment, all or some of the components of the management device 100 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a HDD or semiconductor memory.

The components of the management device may be composed of one or more electronic circuits. Each of the one or more electronic circuits may be a general-purpose circuit or a dedicated circuit.

The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated into one chip or into multiple chips. Here, we refer to it as an IC or LSI, but depending on the degree of integration, it may be called a system LSI, a VLSI (Very Large Scale Integration), or an ULSI (Ultra Large Scale Integration). Also, a Field Programmable Gate Array (FPGA) that is programmed after the LSI is manufactured can be used for the same purpose.

In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the spirit of the present invention.

The present invention can be used in systems that mount components on a board.

REFERENCE SIGNS LIST 100 Management device 110 Acquisition unit 120 Control unit 200 Management system 210 Display unit 220 Input unit 230 Storage unit 300 Component mounting equipment 310 Loader 320 ACF attachment device 330 Pre-compression bonding device 340 Main compression bonding device 350 Inspection device 360 Unloader 370, 371, 372, 373 Sensor 400 Component mounting system

Claims (5)

an acquisition unit that acquires (i) a threshold value that serves as a reference for determining whether the state of the component mounting device is normal or abnormal by comparing with a measurement value of a sensor provided in the component mounting device for mounting components on a board, (ii) a first measurement value that is the measurement value when the component is mounted on a first board, (iii) a judgment result of the state of the component mounting device when the component is mounted on the first board, which is judged based on the threshold value and the first measurement value, and (iv) a first inspection result that is an inspection result of the first board by an inspection device that inspects the board on which the component is mounted by the component mounting device;
and a control unit that causes the threshold value, the first measurement value, the determination result, and the first inspection result to be displayed collectively on a display unit.
Management device. The acquisition unit further acquires an input for changing the threshold value,
The control unit changes the threshold value based on the input.
The management device according to claim 1 . the acquisition unit acquires an input for changing a mounting condition of the component on the board by the component mounting device,
The control unit causes the component mounting apparatus to change the mounting conditions based on the input.
The management device according to claim 1 . When the first inspection result is a failure, the control unit causes the display unit to display a second measurement value for a second substrate for which the inspection result by the inspection device is a failure, together with the first measurement value.
The management device according to claim 1 . 1. A computer implemented management method, comprising:
an acquisition step of acquiring (i) a threshold value serving as a reference for judging whether the state of the component mounting device is normal or abnormal by comparing with a measurement value of a sensor provided in the component mounting device for mounting components on a board, (ii) a first measurement value which is the measurement value when the component is mounted on a first board, (iii) a judgment result of the state of the component mounting device when the component is mounted on the first board, which is judged based on the threshold value and the first measurement value, and (iv) a first inspection result which is an inspection result of the first board by an inspection device which inspects the board on which the component is mounted by the component mounting device;
and a control step of causing a display unit to collectively display the threshold value, the first measurement value, the determination result, and the first inspection result.
How to manage it.

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