JP2019039035A - Plating solution replenishment apparatus - Google Patents

Abstract

To provide a plating solution replenishment apparatus that can efficiently dissolve copper oxide into plating solution without installing a special dissolution tank for space savings.SOLUTION: A plating solution replenishment apparatus 1 of the present invention comprises a circulation line 2 in which plating solution is sucked up from a plating tank A for copper plating, added with copper oxide, and returned to the plating tank A. The plating solution replenishment apparatus 1 also comprises at least: pumping means 3 and 4, which are placed on the circulation line 2, for sucking up the plating solution from the plating tank A and for circulating the plating solution on the circulation line 2; an ejector 5, which is placed on the circulation line 2, for directly mixing the plating solution with copper oxide powder; and an in-line mixer 9 for accelerating the dissolution of copper oxide powder into the plating solution, being arranged on the downstream side of the ejector 5.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a plating solution replenishing device for replenishing a plating bath for performing a copper plating treatment with a plating solution having a certain concentration.

  Patent Document 1 (Japanese Patent Laid-Open No. 9-137298) improves the solubility of copper oxide, prevents the inflow of ultrafine powder that cannot be instantaneously dissolved into the plating tank, and prevents contamination of the working environment of fine powdered copper oxide. A method for producing a replenisher for electrolytic copper plating, wherein copper oxide powder having a specific particle size is mixed with water, an acid, an alkali solution or an organic solvent, and the copper oxide powder in the mixed solution is mixed with a wet pulverizer. Further disclosed is a production method in which a fine powder is pulverized and a part of the plating solution is added to the fine powder mixed solution to dissolve the copper oxide.

  Patent Document 2 (Japanese Patent Laid-Open No. 2003-166100) is intended to provide the same amount of high dissolving power in an electrolytic solution that is suitable as a copper ion material when electrolytic copper plating is performed. A method of using an insoluble anode as a method of performing a copper plating process on an object to be plated is disclosed. This method uses, for example, a titanium surface coated with a catalyst as an anode, prepares a plating tank and a copper dissolution tank, and a copper plating material such as copper oxide, copper carbonate, metal copper, etc. in the dissolution tank Is dissolved and supplied to the electrolytic solution in the plating tank, and the plating process is performed by energizing between the insoluble anode and the object to be plated forming the cathode. Further, Patent Document 2 discloses that the dissolution tank includes a stirring means, and a predetermined amount of copper powder is supplied from the hopper.

  Patent Document 3 (Japanese Patent Application Laid-Open No. 2004-162078) discloses a method for performing good copper plating by controlling the copper ion concentration of an electrolytic solution with high accuracy when performing copper plating by an electrolytic plating method. The structure which detects the density | concentration of the copper in a tank with a colorimeter, and replenishes copper oxide with the detected value is disclosed. In Patent Document 3, a dissolution tank for dissolving copper oxide in a plating solution for replenishing the plating tank with hot air / liquid is divided into three liquid storage parts by a partition member, and the first liquid storage part is oxidized. The supernatant liquid in which copper oxide is dissolved by adding copper to the electrolytic solution from the plating tank and stirring, and then allowing the copper to overflow from the first liquid reservoir to the second liquid reservoir and the third liquid reservoir sequentially. Is to get.

JP-A-9-137298 JP 2003-166100 A JP 2004-162078 A

  As described above, in copper plating facilities using insoluble anodes, efficiency is being studied as the most labor-intensive work. In order to supply a plating solution of a certain concentration to the plating tank, copper oxide powder is added to the plating solution. In a plating solution replenishing device for dissolving, copper oxide powder is efficiently dissolved in the plating solution, and the above-mentioned patent document discloses that copper oxide is pulverized into fine powder and stirred by a stirrer. Yes. Furthermore, in addition to physical copper oxide dissolution using this stirrer, mechanical dissolution methods such as bubbling using an air blower and liquid circulation stirring using a pump are known. is there.

  As described above, in the conventional plating solution replenishing device, as disclosed in Patent Documents 1 to 3, when copper powder such as copper oxide is added to the mixing tank, the opening / closing provided at the lower part of the hopper Since the mechanism is manually or automatically opened and closed and dropped into the mixing tank, there is a possibility that coagulation prevention measures are required because copper powder or the like may be solidified by absorbing moisture.

  Furthermore, in the plating solution replenishment device disclosed in Patent Document 3, an electrolytic solution in which copper oxide is dissolved is obtained as a supernatant by providing a plurality of liquid storage portions by a partition member in the dissolution tank. There is a possibility that foreign matter is mixed in each liquid reservoir, crystallization of copper may occur, or precipitates may be generated in each liquid reservoir, and it is necessary to remove crystals and precipitates. Arise.

  Therefore, an object of the present invention is to provide a plating solution replenishing device that does not provide a special dissolution tank for space saving and can efficiently dissolve copper oxide in the plating solution.

  The present invention provides a plating solution replenishing apparatus having a circulation line that sucks a plating solution from a plating tank for performing copper plating, adds copper oxide, and returns to the plating tank, and is disposed on the circulation line, and the plating tank A pump means for sucking the plating solution from the circulation line and circulating the plating solution on the circulation line; an ejector disposed on the circulation line; and a copper oxide powder mixed with the plating solution; and disposed downstream of the ejector. And at least an in-line mixer for promoting the dissolution of the copper oxide powder in the plating solution.

  According to the present invention, the copper oxide powder is mixed with the plating solution by the ejector disposed on the circulation line through which the plating solution sucked by the pump means circulates, and further, the copper oxide powder is added to the plating solution by the in-line mixer. Since it is made to melt | dissolve, since it becomes unnecessary to provide a dissolution tank, while being able to achieve space saving, the dissolution efficiency of copper oxide can be improved.

  Further, the ejector has a suction space in which the plating solution is sprayed to reduce pressure, and a suction port for sucking the copper oxide powder into the suction space, and the copper oxide powder sucked into the suction port. It is desirable that the copper oxide powder is sucked together with air and mixed with the plating solution by bubbling in the suction space.

  Thus, by spraying the plating solution into the suction space of the ejector, air is sucked from the suction port together with the copper oxide powder and mixed with the plating solution, and the copper oxide powder is efficiently plated by bubbling of the sucked air. It can be mixed and dissolved in the liquid.

  Furthermore, it is desirable that the pump means is constituted by a push pump disposed on the upstream side of the ejector and the inline mixer, and a pulling pump disposed on the downstream side of the ejector and the inline mixer.

  As described above, the pump means for circulating the plating solution to the circulation line is constituted by the push pump for pushing the plating solution to the ejector and the inline mixer, and the pulling pump for passing the plating solution to the ejector and the inline mixer. Since the pulling pump can generate a pulling pressure in the ejector, the intake function of the ejector can be improved.

  Furthermore, by providing an in-line mixer, 100% liquid agitation can be performed, so that the dissolution of copper oxide powder and the undissolved residue can be eliminated.

  With the above configuration, according to the plating solution replenishing apparatus of the present invention, the dissolution vessel is provided to mix the copper oxide powder and air into the plating solution via the ejector and to promote mixing and dissolution by the in-line mixer. Even without this, the copper oxide powder can be reliably and efficiently dissolved in the plating solution.

It is a schematic block diagram of the plating solution replenishment apparatus which concerns on the Example of this invention. It is the schematic block diagram which showed an example of the ejector of the plating solution replenishment apparatus which concerns on the Example of this invention. It is the schematic block diagram which showed an example of the in-line mixer of the plating solution replenishment apparatus based on the Example of this invention.

  Embodiments of the present invention will be described below with reference to the drawings.

  A plating solution replenishing device 1 according to the present invention is connected to a plating tank A in which a plating solution B is accommodated, for example, as shown in FIG. Is added to the plating tank A, and the concentration of the plating solution B contained in the plating tank A is detected by a control device (not shown). The circulation line 2 is operated so as to maintain the value.

  The plating solution replenishing device 1 includes pump means including a push pump 3 disposed on the upstream side of the circulation line 2 and a pulling pump 4 disposed on the downstream side, and plating is performed from the plating tank A by the pump means. While sucking the liquid B, the plating liquid E in which copper powder is added to the sucked plating liquid C and dissolved therein is returned to the plating tank A.

  Further, an ejector 5 for mixing copper powder into the plating solution C pushed out by the push pump 3 and drawn by the pull pump 4 is disposed on the circulation line 2 downstream of the push pump 3. The ejector 5 is provided with a copper powder quantitative supply machine 6. For example, this copper powder fixed quantity supply machine 6 supplies the ejector 5 with a copper powder amount determined based on the copper ion concentration detected in the plating solution B by a control device (not shown).

  The ejector 5 is, for example, as shown in FIG. 2, and includes a housing 50 that defines a suction space 51 therein, a nozzle portion 52 that sprays the plating solution C sucked into the suction space 51, copper powder P, and air G And a suction port 53 through which the mixture F is sucked. The internal space 54 of the nozzle portion 52 is pressed by the push pump 3 to become high pressure, and the suction space 51 is decompressed by the pulling pump 4, so that the plating solution C is sprayed on the suction space 51 and sucked. Since the space 51 has a negative pressure, the suction port 53 sucks the mixture F of the copper powder P and the air G and mixes it with the plating solution C.

  In FIG. 2, for example, the supplied copper powder P whose predetermined amount is determined from the copper powder quantitative supply machine 6 is supplied to the supply line 61 through the supply nozzle 60 by the suction force of the suction space 51. When drawn into the line 61, it is mixed with the air G to become a mixture F of the copper powder P and the space G. Thus, in the suction space 51, bubbles due to the air G are generated in the plating solution C and the plating solution C is agitated, so that the copper powder P is efficiently and uniformly mixed with the plating solution C, thereby mixing. A plating solution D is obtained.

  In FIG. 1, 7 is a flow meter and 8 is a pressure adjusting regulator. The flow meter 7 is for detecting the flow rate flowing through the circulation line 2 as one of the parameters for controlling the suction / discharge amount by the push pump 3 and the push pump 4, and the pressure adjusting regulator is a circulation line. 2 is provided in order to properly maintain the pressure applied to the plating solution flowing through 2.

  A plurality of in-line mixers 9 (three in this embodiment) are provided in series on the downstream side of the pressure adjusting regulator 8. For example, as shown in FIG. 3, the in-line mixer 9 includes a housing 90 that defines a passage 91. The in-line mixer 9 extends into the passage 91 in a tapered shape, and a plurality of fine passages through which the mixed plating solution D passes. The mixing element 93 having the holes 92 is provided, and when the mixed plating solution D passes through the pores 92 of the mixing element 93, it is compressed and diffused, and further generates turbulent flow. In this embodiment, the same mixing and dissolving action is executed three times by three in-line mixers 9 connected in series, and a plating solution E in which copper powder is dissolved is obtained. .

  The plating solution E thus obtained contains a sufficient amount of copper ions, and is sucked and pushed out by the pulling pump 4 and supplied to the plating tank A.

  As described above, according to the plating solution replenishing device 1 according to the present invention, the piping at the both ends of the circulation line 2 is connected to the plating tank A, and the push pump 3 and the pulling pump 4 are operated. The copper powder P can be efficiently added to the plating solution B accommodated in the plating tank A through the ejector 5, and the bubbling action of the air G sucked together with the copper powder P into the ejector 5 and the in-line mixer 9 enables the copper powder to be effectively dissolved in the plating solution. In addition, since the plating solution E in which the copper powder P thus obtained is dissolved is returned to the plating tank A, it is not necessary to provide a conventional dissolution tank, so that space saving can be achieved.

DESCRIPTION OF SYMBOLS 1 Plating solution replenishment apparatus 2 Circulation line 3 Push pump 4 Pulling pump 5 Ejector 6 Copper powder fixed supply machine 7 Flowmeter 8 Pressure regulator 9 In-line mixer A Plating tank B, C, D, E Plating solution G Air P Copper powder

Claims (3)

In a plating solution replenishing device having a circulation line for sucking a plating solution from a plating tank for performing copper plating, adding copper oxide, and returning to the plating tank,
A pump means disposed on the circulation line, for sucking the plating solution from the plating tank and circulating the plating solution on the circulation line;
An ejector disposed on the circulation line and directly mixing copper oxide powder with the plating solution;
A plating solution replenishing apparatus, comprising at least an in-line mixer disposed downstream of the ejector for promoting dissolution of the copper oxide powder in the plating solution.   The ejector has a suction space in which the plating solution is sprayed to be decompressed, and a suction port for sucking the copper oxide powder into the suction space, and the copper oxide powder sucked into the suction port together with air 2. The plating solution replenishing apparatus according to claim 1, wherein the copper oxide powder is sucked and mixed with the plating solution by bubbling in the suction space. The said pump means is comprised by the push pump arrange | positioned in the upstream of the said ejector and an in-line mixer, and the pulling pump arrange | positioned in the downstream of the said ejector and an in-line mixer, It is characterized by the above-mentioned. The plating solution replenishment apparatus as described.

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