JP2018137325A - Method of manufacturing multilayer electronic component - Google Patents

Abstract

To provide a method for manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, with extremely good formation accuracy of the laminated body and in a simplified process.
A method of manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, including a step of forming a green laminate on a heat-resistant substrate via a coating film. The green laminate forms a green functional portion using a first ink containing functional particles, and a first step of forming a green functional portion using a first ink containing functional particles, and a second ink containing conductive particles. A method for manufacturing a multilayer electronic component, which is formed by repeating the second step.
[Selection] Figure 4

Description

  The present invention relates to a method for manufacturing a multilayer electronic component.

  Many electronic components are mounted on an electronic device for information processing, signal conversion, or the like, or in a power supply circuit or the like. As such an electronic component, a multilayer electronic component having a configuration in which a functional layer that exhibits the performance of the electronic component and an electrode layer that is electrically connected to a terminal are stacked is known.

  In recent years, due to demands for higher performance and downsizing of electronic devices, higher performance and downsizing of electronic parts are also required. As electronic components are further reduced in size, the ratio (yield) at which the manufactured electronic components satisfy a predetermined standard (performance) is drastically reduced. This is because with the miniaturization of electronic components, the formation accuracy of the laminate decreases, greatly affects the characteristics (performance) of the electronic components, and the number of electronic components having characteristics within a predetermined maximum tolerance decreases. It is caused by that.

  As a conventional method for manufacturing a multilayer electronic component, for example, a method using a process called a roll-to-roll process in which a predetermined pattern is formed on a plastic film by using a printing technique to obtain an element is exemplified.

  Specifically, a sheet is formed on a plastic film using a slurry containing a material constituting a functional layer, and an electrode is printed thereon using a paste containing a conductor material constituting an electrode layer. Then, the sheet | seat in which the electrode was formed is laminated | stacked, and the molded object with which the sheet | seat and the electrode were laminated | stacked is obtained. Then, the obtained molded body is cut as necessary, separated into individual pieces, and then heat-treated to produce a multilayer electronic component.

  However, in the method as described above, the position of the electrode is liable to occur during lamination and cutting, and this has been a factor of lowering the formation accuracy of the laminated structure of the functional layer and the electrode layer in the obtained multilayer electronic component.

  In addition, there is a limit to the improvement of the forming accuracy by the conventional roll-to-roll method, and the characteristics (for example, the capacitance of a multilayer ceramic capacitor, the electrical resistance of an NTC thermistor, etc.) of a small-sized multilayer electronic component are predetermined. There is a problem that it is difficult to fit within the standard, and as a result, the yield decreases.

  As a method for improving the formation accuracy, for example, in Patent Document 1, a ceramic slurry and a functional material paste containing a conductor material are ejected by an ink jet method to form a ceramic layer and an electrode layer. A method of manufacturing a multilayer electronic component is described. According to this method, it is described that misalignment can be suppressed and the stacking step and the cutting step can be omitted.

  Patent Document 2 describes an ink suitable for manufacturing a multilayer electronic component by ejecting droplets using an ink jet method.

  However, when a green laminate is directly drawn on a flat medium such as a PET film or a metal plate that has been conventionally used by using the technique of Patent Document 1 or Patent Document 2, ink bleeding or repellency occurs. In some cases, the drawability may be inferior, and the drawn laminate may stick to the medium, making it difficult to form a green laminate in a desired shape.

  Moreover, when peeling a green laminated body from a medium, a green laminated body may be damaged. Therefore, in order to peel the medium while avoiding damage to the green laminated body, it is necessary to separate the green laminated body into individual pieces after forming the green chip, and there is a problem that the process becomes complicated. .

JP-A-9-232174 JP2015-216319A

  The present invention has been made in view of such a situation, and an object thereof is to simplify a multilayer electronic component having an element body in which a functional part and a conductor part are laminated, with extremely good formation accuracy of the laminated body. It is providing the method of manufacturing with the process which carried out.

  As a result of intensive studies to achieve the above object, the present inventors include a step of forming a green laminate on a heat-resistant substrate through a coating film, and the green laminate is a functional particle. The first step of forming the green functional part using the first ink containing, and the second step of forming the green conductor part using the second ink containing the conductive particles are formed repeatedly. Thus, it was found that a multilayer electronic component with high formation accuracy can be obtained while simplifying the process.

The gist of the present invention is as follows.
(1) A method of manufacturing a multilayer electronic component having an element body in which a functional part and a conductor part are laminated,
Including a step of forming a green laminate on a heat resistant substrate via a coating film,
The green laminate is
The first step of forming the green functional portion using the first ink containing functional particles and the second step of forming the green conductor portion using the second ink containing conductive particles are repeated. A method of manufacturing a laminated electronic component formed by

(2) The method for manufacturing a laminated electronic component according to (1), wherein the heat-resistant substrate is a ceramic made of one or more materials selected from the group consisting of alumina, silica, magnesia, and zirconia.

(3) The method for producing a multilayer electronic component according to (1) or (2), wherein the surface roughness Ra of the coating film is 2 μm or less.

(4) The coating film according to any one of (1) to (3), wherein the coating film includes one or more resins selected from the group consisting of epoxy resins, acrylic resins, and butyral resins. Production method.

(5) The method for manufacturing a multilayer electronic component according to any one of (1) to (4), wherein the coating film includes a resin having a shrinkage rate of less than 5%.

(6) The method according to any one of (1) to (5), including a step of forming the coating film on the heat-resistant substrate using any one of screen printing, spin coating, blade method, or dipping method. A method for producing a multilayer electronic component as described in 1.

(7) The multilayer type according to any one of (1) to (6), wherein the green functional portion and the green conductor portion are individual patterns corresponding to the shape and dimensions of the element body after firing. Manufacturing method of electronic components.

(8) including a step of thermally decomposing the coating film by heat-treating the green laminate formed on the heat-resistant substrate via the coating film together with the heat-resistant substrate and the coating film, (1)-(7) any one of the manufacturing methods of a multilayer electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, the method of manufacturing the multilayer electronic component which has the element main body on which the functional part and the conductor part were laminated | stacked with the very favorable formation accuracy of a laminated body, and the simplified process can be provided.

FIG. 1 is a schematic cross-sectional view of a multilayer ceramic capacitor as an example of a multilayer electronic component manufactured by the manufacturing method according to the present embodiment. FIG. 2 is an exploded perspective view showing a multilayer structure of an element body included in a multilayer ceramic capacitor as an example of a multilayer electronic component manufactured by the manufacturing method according to the present embodiment. FIG. 3 is a perspective view for explaining a second step that can be employed in the manufacturing method according to the present embodiment. FIG. 4 is a schematic diagram showing a green laminate, a coating film, and a heat resistant substrate in the present embodiment.

Hereinafter, the present invention will be described in detail in the following order based on embodiments shown in the drawings.
1. 1. Multilayer electronic component Manufacturing method of multilayer electronic component 2.1 Discharge device 2.2 Ink 2.2.1 First ink 2.2.2 Second ink 2.3 Manufacturing process 2.3.1 Cover on heat resistant substrate Step of forming a covering film 2.3.2 First step 23.3 Second step 2.3.4 Step of obtaining a green laminate 2.3.4 Step of obtaining an element body 3. Effects of the embodiment 4. Modified example

(1. Stacked electronic components)
As an example of a multilayer electronic component manufactured by the manufacturing method according to the present embodiment, a multilayer ceramic capacitor is shown in FIG. The multilayer ceramic capacitor 1 has an element main body 10, and as shown in FIGS. 1 and 2, the element main body 10 has a rectangular functional part (ceramic layer 2) and either the short side direction or the long side direction. The rectangular conductor portions (internal electrode layers 3) formed smaller than the functional portions are alternately laminated. At both ends of the element body 10, a pair of terminal electrodes 4 are formed which are electrically connected to the internal electrode layers 3 arranged alternately in the element body 10.

  By applying a voltage to the terminal electrode, the ceramic layer disposed between the electrode layers having different polarities exhibits a predetermined dielectric characteristic, and as a result, functions as a capacitor.

  The shape and dimensions of the multilayer electronic component may be appropriately determined according to the purpose and application, but in this embodiment, the case where the shape is a rectangular parallelepiped shape will be taken up. The dimensions are preferably small. In the case of a multilayer ceramic capacitor, the dimensions are, for example, vertical (0.4 mm or less) × horizontal (0.2 mm or less) × thickness (0.1 to 0.2 mm) or less. Especially effective.

(2. Manufacturing method of multilayer electronic components)
Next, the manufacturing method according to this embodiment will be described. In the manufacturing method according to the present embodiment, the green laminate is formed on a heat resistant substrate via a coating film. The method for forming the green laminate on the heat-resistant substrate through the coating film is not particularly limited as long as it is a method for directly drawing the green laminate on the coating film, but preferably by an inkjet method or a dispenser method. is there. As an inkjet method, a piezoelectric method in which ink droplets are ejected by deforming an ink flow path by vibration of a piezoelectric element, a heating element is provided in the ink flow path, and the heating element is heated to generate bubbles, thereby generating bubbles. And a thermal method in which ink droplets are ejected in accordance with a pressure change in the ink flow path, and an electrostatic suction method in which ink in the ink flow paths is charged and ink droplets are ejected by electrostatic attraction of ink. An example of the dispenser method is a pneumatic method.

  Hereinafter, as an example of the manufacturing method according to the present embodiment, a method for forming a green laminate by discharging ink by an electrostatic suction method will be described in detail. In the electrostatic attraction method, a green function portion that is a functional portion and a green conductor portion that is a conductor portion are printed and formed using an ejection device that uses electrostatic attraction force. First, the discharge device will be described.

(2.1 Discharge device)
The discharge device includes a plurality of nozzles as discharge portions and voltage application means. The ejection device includes at least a first head unit including a plurality of nozzles supplied with the first ink and a second head unit including a plurality of nozzles supplied with the second ink. In the present embodiment, a method of drawing a pattern by ejecting ink onto the coating film 62 formed on the heat resistant substrate 61 will be described in detail.

  In an ejection device that uses an electrostatic attraction force, the ink is charged, and the discharge start and discharge stop of the charged ink are controlled by the electrostatic attraction force. Responds very quickly and accurately. Accordingly, when a voltage is applied, the ink is immediately ejected onto the object to be drawn, and when the voltage application is stopped, the ink ejection is immediately stopped without causing dripping or the like, so that a predetermined pattern can be repeatedly drawn with good reproducibility. .

(2.2 Ink)
In the present embodiment, as the ink used in the above-described ejection device, the first ink for forming the green functional part that constitutes the functional part and the green conductor part that constitutes the conductive part are used. The second ink for forming is used. Hereinafter, the first ink and the second ink will be described.

(2.2.1 First ink)
In the present embodiment, the first ink preferably includes functional particles, a solvent, and a resin. The method for preparing the first ink is not particularly limited. For example, a resin solution may be prepared by dissolving a resin in a solvent, and the resin solution and functional particles may be mixed. In the first ink, the functional particles are dispersed in the resin solution.

The functional particle is not particularly limited as long as it is a particle such as a material constituting the functional part or a compound serving as the material, and is appropriately selected according to the application. For example, when the material constituting the functional part is ceramic, particles made of the ceramic, or particles of carbonate, nitrate, hydroxide, organometallic compound, etc. that become the ceramic by heat treatment or the like are exemplified. Is done. For example, when the material which comprises a functional part is a metal or an alloy, the particle | grains comprised from the said metal or alloy are illustrated. Specifically, when forming a multilayer ceramic capacitor as an electronic component, BaTiO ₃ , CaTiO ₃ , SrTiO ₃ or the like can be used as the functional particles.

  The resin contained in the first ink is not particularly limited, and examples thereof include cellulose resins, butyral resins, acrylic resins, polyvinyl alcohol, epoxy resins, phenol resins, styrene resins, and urethane resins. The solvent contained in the first ink is not particularly limited, and water or an organic solvent is exemplified. Specific examples of the organic solvent include aliphatic hydrocarbons such as decane, tetradecane, and octadecane, ketones such as methyl ethyl ketone and cyclohexanone, aromatic hydrocarbons such as xylene and toluene, methyl cellosolve, butyl cellosolve, methyl carbitol, and butyl. Ethers such as carbitol and triethylene glycol monoethyl ether, esters such as ethyl acetate and butyl carbitol acetate, alcohols such as propanol, ethylene glycol and terpineol, polar such as dimethyl sulfoxide, N-methylpyrrolidone and dimethylacetamide Examples thereof include use of a single solvent or a mixture of a plurality of solvents.

  The first ink may contain a dispersant, a plasticizer, a dielectric, a glass frit, an insulator, a charge remover, and the like as necessary.

(2.2.2 Second ink)
In the present embodiment, the second ink preferably includes conductive particles, a solvent, and a resin. The method for preparing the second ink is not particularly limited, but may be the same as the method for preparing the first ink.

  The conductor particles are not particularly limited as long as they are particles of a material constituting the conductor portion or a compound serving as the material, and are appropriately selected according to compatibility with the material constituting the functional portion, use, and the like. For example, when forming a multilayer ceramic capacitor as an electronic component, Ni, Ni alloy, Pd, AgPd, etc. can be used as the conductor particles.

  In the present embodiment, a third ink may be used in addition to the first ink and the second ink. As the third ink, an ink having the same or different component or composition as the first ink or the second ink can be used. In the case of using the third ink, the ejection device has a third head unit including a plurality of nozzles supplied with the third ink.

(2.3 Manufacturing process)
In the present embodiment, preferably, a coating film is formed on the heat resistant substrate (step of forming the coating film on the heat resistant substrate), and the discharge device is used to form the coating film or the green conductor. A green functional part is printed and formed on the part with the first ink (first step), and a green conductor part is printed and formed on the formed green functional part with the second ink (second step). This is repeated to obtain a green laminated body in which the green functional parts and the green conductor parts are alternately laminated. Further, the green laminate is heat-treated together with the heat resistant substrate and the coating film to obtain an element body. Hereinafter, each step will be described.

(2.3.1 Process for forming a coating film on a heat-resistant substrate)
In this embodiment, as shown in FIG. 4, a coating film 62 is formed on a heat-resistant substrate 61, and a green functional part and a green conductor part are formed on the coating film 62 to form the green laminated body 11. To do.

  As a method for forming the coating film 62 on the heat-resistant substrate 61, for example, a slurry containing a material constituting the coating film 62 is applied to the heat-resistant substrate 61 by screen printing, a spin coating method, a blade method, or a dipping method. The method of apply | coating to is mentioned. By forming the coating film 62 by the above method, the coating film 62 having adhesiveness to the heat resistant substrate 61 can be obtained.

Although it will not specifically limit if it is a material which has a thermal decomposition property and smoothness as a material which comprises a coating film, Preferably resin is included. The resin preferably includes a resin having a small shrinkage ratio during molding, and more preferably includes a non-shrinkable resin. The shrinkage rate at the time of molding is the degree of shrinkage when the molten resin is solidified. Specifically, smoothness is maintained when the resin contains a resin having a shrinkage ratio of preferably less than 5%, more preferably less than 2%. When the coating film contains a resin having a shrinkage rate in the above range, the unevenness on the surface of the heat resistant substrate is hardly reflected on the surface of the coating film, and the smoothness of the surface of the coating film is not impaired. For this reason, a coating film can be formed more smoothly on a heat resistant substrate. On the other hand, when the flatness of the heat-resistant substrate is high (for example, a metal substrate), even when the shrinkage rate of the thickness at the time of film formation and curing is large, specifically when the film is formed by dissolving butyral resin in a solvent However, since the flatness after hardening of a coating film can be kept high, it can be used similarly. The shrinkage ratio of the resin is a ratio from a fluid state to a solidified state.
(Shrinkage ratio) = ((Thickness at the time of coating film formation) − (Thickness after curing)) / (Thickness at the time of coating film formation)

  In the present embodiment, as described above, the coating film preferably includes a resin that is thermally decomposable and has a small shrinkage rate during molding. For example, a UV curable resin, a thermoplastic resin, and a thermosetting resin can be used as a material constituting the coating film. Specifically, an epoxy resin, an acrylic resin, or the like is preferable. Further, the coating film may include a resin used for the green functional portion and the green conductor portion of the green laminate described above. When the coating film is a resin film containing the above material, thermal decomposability and smoothness can be ensured. In addition, the coating film may contain materials and additives other than the resin.

  In the present embodiment, the coating film preferably has smoothness. Specifically, the surface roughness Ra of the coating film is preferably 5 μm or less, more preferably 3 μm or less, further preferably 2 μm or less, particularly preferably 1 μm or less, and most preferably 0.2 μm or less. is there. When the surface roughness Ra of the coating film is in the above range, the ink is less likely to bleed and is excellent in drawing properties, so that the formation accuracy of the green laminate can be further increased.

  In this embodiment, the thickness of a coating film becomes like this. Preferably it is 1-100 micrometers, More preferably, it is 10-50 micrometers. By setting the thickness of the coating film within the above range, it is easy to ensure the smoothness of the coating film.

  In the present embodiment, the heat-resistant substrate is preferably made of a material that has heat resistance and is resistant to thermal shock. More preferably, the heat resistant substrate is made of ceramics or metal. Particularly preferably, the heat-resistant substrate is made of ceramics. As the ceramic, a ceramic made of one or more materials selected from the group consisting of alumina, silica, magnesia, and zirconia can be used. As the metal, a noble metal such as silver, Pd, or platinum can be used.

  The surface roughness Ra of the heat resistant substrate is not particularly limited, and may be appropriately determined so that the surface roughness Ra of the coating film formed thereon is in the above-described range.

  In the present embodiment, the heat-resistant substrate is preferably a planar shape, but may be a curved surface shape, and the shape may be appropriately determined depending on the method for forming the green laminate. For example, when a green laminate is formed by discharging ink by an electrostatic suction method, it is preferable that the heat resistant substrate has a planar shape from the viewpoint of facilitating movement control of the discharge nozzle.

(2.3.2 First step)
In the present embodiment, the green functional unit 12 is formed on the coating film 62. In this step, the discharge device is formed on the heat-resistant substrate 61 by controlling the voltage applied to the plurality of nozzles supplied with the first ink, thereby applying an electrostatic attraction force to the first ink. The first ink is ejected onto the coated film 62 and printed. First, as shown in FIG. 4, a heat resistant substrate 61 and a coating film 62 formed thereon are placed on a table (not shown) of a discharge device. A plurality of figures are drawn on the coating film 62 by moving the table by a predetermined amount while discharging ink, and when the application of voltage is stopped, ink discharge is stopped and drawing is stopped. By repeating these steps, a plurality of green functions 12 (see FIG. 3) having a desired shape, here, a rectangular shape can be formed simultaneously.

(2.3.3 Second step)
In the second step, the table is moved by a predetermined amount in the Y-axis direction so that the nozzle filled with the second ink is positioned on the green function portion formed in the first step. Alternatively, the table may be fixed, and the nozzle may be moved so that the nozzle filled with the second ink is positioned on the green function part formed in the first step.

  After the green functional part formed in the first step is dried, as shown in FIG. 3, a line having a predetermined length is formed on the green functional unit using the second ink, as in the first step. By repeating this, a rectangular region (green conductor portion 13) in which a predetermined number of line segments having a predetermined length are formed is formed. FIG. 3 shows only the tip of the nozzle.

  When the electrostatic attraction method is employed, the line width of the line segment formed using ink in the first step and the second step is about 5 to 50 μm. Then, it is possible to repeatedly form line segments of a predetermined length so as to be parallel and continuous, and form a surface region having one thickness in which line segments are brought into contact with each other and connected.

  As a method for forming a rectangular region, a line segment may be formed in parallel along the short or long direction of the rectangular region to be formed, and the rectangular region may be formed. A rectangular region may be formed by changing the length of a line segment formed in a diagonal direction of the region.

  In the present embodiment, an example is described in which the green function portion and the green conductor portion that determine the outer shape of the element are formed as a rectangle, but if there is a demand for the target electronic component, the outer shape or the green conductor portion is described. The basic shape may be a polygon such as a hexagon or an octagon, or a circle.

(2.3.4 Step of forming a green laminate)
By repeating the first step and the second step, forming a green conductor portion on the green function portion and further forming a green function portion on the green conductor portion, A green laminate in which green conductor portions are alternately laminated can be obtained.

  As described above, when an ejection device using electrostatic attraction force is used, a green functional unit and a green conductor unit having a desired area are formed by connecting a plurality of line segments in parallel and connected to each other. Formed. The thickness of the green functional part and the green conductor part suppresses unevenness of the in-plane thickness by adjusting the line width and the pitch width between the lines. Therefore, the line width is adjusted in accordance with the length in the short direction of the green functional portion and the green conductor portion so that the line width is equal to or less than ½ of the length in the short direction.

  Furthermore, when a discharge device that uses electrostatic attraction force is used, the green function part and the green conductor part are formed and laminated with high accuracy, so that the resulting green laminate is highly accurate. Therefore, when the green laminated body is viewed from the laminating direction, the area where the green conductor portions overlap can be enlarged.

  The method of forming a green laminate by discharging ink by the electrostatic attraction method described above is an example of this embodiment, and is not limited to this. In order to form a green laminate having a smaller size, it is preferable to employ a method of discharging ink by an electrostatic suction method. On the other hand, if a green laminate having a desired size can be obtained, other inkjet methods or A dispenser method may be adopted.

(2.3.5 Step of obtaining element body)
In the present embodiment, the element body 10 included in the multilayer electronic component is manufactured by processing a laminate obtained by heat-treating the green laminate. In the present embodiment, the green laminate is heat treated together with the heat resistant substrate and the coating film.

  In the present embodiment, examples of the heat treatment process include a binder removal process, a baking process, and an annealing process. By heat treatment, the functional particles contained in the green functional part of the green laminate are integrated into a functional part, and the conductive particles contained in the green conductor part are integrated into a conductive part, thereby obtaining a sintered laminate. It is done. What is necessary is just to set suitably the heating temperature and heating time in a heat processing process so that a green laminated body can be sintered.

  In the present embodiment, the coating film is thermally decomposed by a series of heat treatment steps. Preferably, the coating film is thermally decomposed and burned out in the binder removal process and the baking process. More preferably, the coating film is thermally decomposed and burned out in the binder removal process.

  In the present embodiment, a sintered laminate can be obtained by heat treating the green laminate. When the obtained laminated body is used as it is as an element body, a laminated electronic component is manufactured by performing a process such as forming a terminal electrode as necessary.

  In the present embodiment, the green laminate is preferably formed as a green chip corresponding to the shape and dimensions of the element body. That is, the green function part and the green conductor part are formed to have a piece-like pattern corresponding to the shape and dimensions of the element body after firing. Since the green laminated body is formed as a green chip separated from the beginning, the step of cutting the green laminated body into a plurality of separated green chips can be omitted. That is, the element body can be obtained by heat treatment without cutting the green laminate. Since the green chip contracts during heat treatment to become an element body, the size of the green chip is larger than the dimension of the element body.

  In addition, before the heat treatment, a green laminated body formed to have a size larger than that of the green chip may be cut and separated into pieces to obtain a plurality of green chips. Moreover, you may perform a well-known process with respect to a green laminated body other than the process mentioned above.

(3. Effects of the present embodiment)
In the present embodiment, the green laminate 11 is formed on the coating film 62 as shown in FIG. By forming the green laminated body 11 on the coating film 62, it is possible to ensure excellent formation accuracy without causing ink bleed or repellency. On the other hand, if the green laminate 11 is directly formed on the heat resistant substrate 61, the surface roughness is large, so that the ink bleeds and the desired formation accuracy may not be obtained.

  In this embodiment, since the green laminate formed on the heat resistant substrate via the coating film can be heat-treated together with the heat resistant substrate and the coating film, the green laminate is formed on the substrate before the heat treatment step. Therefore, the process can be simplified.

  As shown in the present embodiment, by forming the green functional portion and the green conductor portion so as to be a piece-like pattern corresponding to the shape and dimensions of the element body after firing, the green laminate is Since it is formed as a green chip corresponding to the shape and dimensions of the element body, the step of cutting and dividing the green laminate into a plurality of green chips can be omitted.

(4. Modifications)
In the above-described embodiment, the multilayer ceramic capacitor is exemplified as the multilayer electronic component, but various multilayer electronic components are exemplified according to the material constituting the functional layer. Specifically, a multilayer varistor, a multilayer thermistor, a multilayer piezoelectric element, a multilayer inductor, etc. are illustrated. In the case of a multilayer varistor or multilayer thermistor, the functional layer is composed of a semiconductor ceramic layer. In the case of a multilayer piezoelectric element, the functional layer is composed of a piezoelectric ceramic layer. The layer is composed of a ferrite layer or a soft magnetic metal layer. Moreover, the material which comprises a conductor part is determined according to the material of a function part.

  In the above-described embodiment, the shape and material of each green functional portion and each green conductor portion are the same. For example, when forming a green laminate of a multilayer inductor, the coil conductor is rectangular. By forming a combination of regions of the shape, in each green conductor portion, it may be formed by overprinting those with different shapes, or by overprinting the cross section so as to be spiral, A helical conductor may be formed. Alternatively, when forming a green laminated body of a laminated composite electronic component, it is formed by using two or more types of functional particle material constituting the green functional part and conductive particle material constituting the green conductive part. May be.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to said embodiment at all, You may modify | change in various aspects within the scope of the present invention.

  EXAMPLES Hereinafter, although an invention is demonstrated in detail using an Example, this invention is not limited to these Examples.

Example 1
Formation of coating film A ceramic film (surface roughness Ra: 10 μm) as a heat-resistant substrate was mixed with a predetermined amount of an epoxy resin main agent and a curing agent to form a coating film having a thickness of 20 μm by the blade method. . The surface roughness Ra of the formed coating film was measured.

Preparation of ink A first ink and a second ink were prepared. In the first ink, 5 parts by weight of a butyral resin as a resin and butyl cellosolve as a solvent are mixed to prepare a resin solution, and barium titanate particles as functional particles are dispersed in the resin solution. Produced. The second ink was prepared by mixing a butyral resin as a resin and butyl cellosolve as a solvent to prepare a resin solution, and dispersing nickel particles as conductor particles in the resin solution.

Formation of Green Laminate Using an electrostatic suction type ejection device comprising a plurality of nozzles filled with the first ink and a plurality of nozzles filled with the second ink, on a heat resistant substrate On the formed coating film, a dielectric layer as a green functional portion and an internal electrode layer as a green conductor portion were alternately formed to form a green laminate having 75 internal electrodes. The dimensions of the dielectric layer were 220 μm in the short direction and 460 μm in the long direction. Moreover, the dimension of the internal electrode layer was 140 μm in the short direction.

Evaluation of drawability The drawability when forming a green laminate was evaluated according to the following criteria. The results are shown in Table 1.
(Double-circle): There is no blur and there is no dimension change of a drawing body.
○: No blurring, small dimensional variation of the drawn body.
Δ: Smudge and dimensional variation of the drawing body are both small.
X: No shape reproducibility.

Evaluation of laminate after firing The green laminate formed on the heat-resistant substrate through the coating film is subjected to a binder removal treatment under the conditions of 250 ° C. and 10 hours in the atmosphere together with the heat-resistant substrate and the coating film. Thereafter, firing was performed under conditions of 1200 ° C. and 1 h in a reducing atmosphere. The laminate after firing was evaluated according to the following criteria. The results are shown in Table 1.
A: A sintered body having a sufficient density was obtained, which was satisfactorily separated from the heat-resistant substrate.
X: The density of the sintered body was insufficient, or cracks occurred in the sintered body.

(Example 2)
The drawability and the fired laminate were evaluated in the same manner as in Example 1 except that the epoxy resin was replaced with an acrylic resin. The results are shown in Table 1.

(Example 3)
The drawability and the fired laminate were evaluated in the same manner as in Example 1 except that the ceramic plate was replaced with a platinum plate (surface roughness Ra: 0.05 μm) and the epoxy resin was replaced with a butyral resin. The results are shown in Table 1.

(Comparative Example 1)
The drawability and the laminate after firing were evaluated in the same manner as in Example 3 except that the green laminate was formed directly on the platinum plate without forming a coating film. The results are shown in Table 1.

(Comparative Example 2)
The drawability was evaluated in the same manner as in Example 1 except that the green laminate was directly formed on the ceramic plate without forming the coating film. The results are shown in Table 1.

(Comparative Example 3)
The drawability was evaluated in the same manner as in Example 1 except that the green laminate was formed directly on the silicon single crystal plate without forming a coating film. The results are shown in Table 2.

Example 4
When a coating film was formed by repeating application and drying of a vehicle in which an acrylic resin was dissolved on a ceramic substrate four times, the surface roughness Ra was 2 μm. The drawability was evaluated in the same manner as in Example 1, and the results are shown in Table 2. Note that the fired laminate could be satisfactorily separated from the ceramic plate.

(Example 5)
When a coating film was formed by repeating application and drying of a vehicle in which an acrylic resin was dissolved on a ceramic substrate three times, the surface roughness Ra of the coating film was 2.9 μm. The drawability was evaluated in the same manner as in Example 1, and the results are shown in Table 2.

(Example 6)
When a coating film was formed by repeating application and drying of a vehicle in which an acrylic resin was dissolved on the ceramic substrate twice, the surface roughness Ra of the coating film was 4 μm. The drawability was evaluated in the same manner as in Example 1, and the results are shown in Table 2.

(Example 7)
When a coating film was formed by applying and drying a vehicle in which an acrylic resin was dissolved on a ceramic substrate, the surface roughness Ra of the coating film was 5.8 μm. The drawability was evaluated in the same manner as in Example 1, and the results are shown in Table 2.

  From the results shown in Table 2, it was confirmed that when the green laminate was formed by discharging ink by the electrostatic suction method, the surface roughness Ra of the coating film was 2 μm or more, so that the drawing property was excellent.

DESCRIPTION OF SYMBOLS 1 ... Multilayer ceramic capacitor 10 ... Element main body 2 ... Ceramic layer 3 ... Internal electrode layer 4 ... Terminal electrode 11 ... Green laminated body 12 ... Green functional part 13 ... Green conductor part 51 ... Nozzle 61 ... Heat-resistant board | substrate 62 ... Covering film

Claims (8)

A method of manufacturing a laminated electronic component having an element body in which a functional part and a conductor part are laminated,
Including a step of forming a green laminate on a heat resistant substrate via a coating film,
The green laminate is
The first step of forming the green functional portion using the first ink containing functional particles and the second step of forming the green conductor portion using the second ink containing conductive particles are repeated. A method of manufacturing a laminated electronic component formed by   2. The method for manufacturing a laminated electronic component according to claim 1, wherein the heat resistant substrate is a ceramic made of one or more materials selected from the group consisting of alumina, silica, magnesia, and zirconia.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the coating film has a surface roughness Ra of 2 μm or less.   The said coating film is a manufacturing method of the multilayer electronic component in any one of Claims 1-3 containing 1 or more resin selected from the group which consists of an epoxy resin, an acrylic resin, and a butyral resin.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the coating film includes a resin having a shrinkage rate of less than 5%.   The laminated mold according to any one of claims 1 to 5, comprising a step of forming the coating film on the heat-resistant substrate using any one of screen printing, spin coating, blade method, or dipping method. Manufacturing method of electronic components.   The method for manufacturing a multilayer electronic component according to claim 1, wherein the green functional part and the green conductor part are individual patterns corresponding to the shape and dimensions of the element body after firing. .   The green laminated body formed through the said coating film on the said heat resistant board | substrate is heat-processed with the said heat resistant board | substrate and the said coating film, The process of thermally decomposing the said coating film is included. The manufacturing method of a multilayer electronic component in any one of -7.

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